1376995 (1) 九、發明說明 【發明所屬之技術領域】 本發明係一種關於具有將多層之零件安裝部彼此間以 可撓性電路基板來連接之構造的混成多層電路基板之製造 方法，特別是關於將導電性塗料以網印手法印刷在橫跨零 件安裝部與可撓性電路基板之段差部分的部位，以形成電 磁干擾（Electro-Magnetic Interference ；以下稱爲 EMI) 之屏蔽層之混成多層電路基板的製造方法。 【先前技術】 對EMI使用導電性塗料於電路基板形成屏蔽層這件事 ’藉由專利文獻1等係爲所知。圖8係表示此種電路基板 之一般性構成，並相當於專利文獻1之第2圖。於圖8中 ，電路圖案52形成於絕緣基板51上，並以防焊漆覆蓋需 要絕緣被覆的地方。此外於其上面，有藉由導電性塗料形 成之屏蔽層54，且以塗敷層55予以被覆。屏蔽層54，例 如係透過穿通孔521而連接於接地圖案522並接地。 作爲形成屏蔽層5 4的導電性塗料，例如係使用專利 文獻2所記載之將銅性油墨或銀、碳、純鐵等導電性材料 與環氧樹脂等之黏結劑予以混合者。於塗敷層5 5係使用 絕緣性樹脂組成物，專利文獻3、專利文獻4指明可撓性 基板等需要彎曲性之部位亦可使用之樹脂組成物。 可是，一般係使用網版印刷來形成屏蔽層4。此印刷 方法，無繁雜之步驟且有泛用性係有用。但是，例如專利 • 4 - (2) 1376995 文獻5所示，於具有將零件安裝部彼此間以可撓性電路基 板來連接之構造的混成多層電路基板，當以網印來印刷導 電性塗料於橫跨零件安裝部與可撓性電路基板之段差部分 的部位時’導電性塗料之印刷於段差部分會有擦痕問題。 一此係因印刷網版無法追隨段差，大致於段差爲l〇〇;/m以 上時·發生。 形成屏蔽層之導電性塗料的印刷若中途擦痕時，則會 產生與接地圖案之導通不良，並失去電磁波屏蔽之功能。 以往，於此種混成多層電路基板，係預先形成兼爲接地圖 案之屏蔽層於零件安裝部的外層，並於連接零件安裝部彼 此間之可撓性電路基板，使用兩面具有電路銅箔之可撓性 電路基板，並預先形成屏蔽圖案於其一面，而無須印刷導 電性塗料亦可屏蔽。 另一方面，近年來於養_記__型電腦、折#式行動電話機 等之具有鉸鏈構造且頻繁神重複開閉的部位，使用混成多 層電路基板的機會已大爲增加。此種情形下，如專利文獻 6，係使連接零件安裝部彼此間之可撓性電路基板，捲成 螺旋狀以收納於鉸鏈部內。此外，如專利文獻7，亦顯示 有對應於複雜之活動的2軸式鉸鏈部構造。因此，連接零 件安裝部彼此間之可撓性電路基板係需尋求更富有彎曲性 者。 通常，可撓性電路基板之彎曲性係僅單面有電路銅箔 者比雙面皆有電路銅箔者較良好。爲此，使用兩片僅單面 有電路銅箔可撓性電路基板的連接構造（專利文獻8)於 -5- (3) 1376995 是被提供。此種方法係對於彎曲性之改善面具有效果，但 • 是由於僅單面有電路銅箔’因此無法形成屏蔽圖案於可撓 性電路基板。 因此’爲了於此情形下來形成屏蔽層，例如如專利文 獻9、專利文獻1 0所示’以橫跨可撓性電路基板與零件安 裝部之方式來黏接導電性屏蔽膜。 〔專利文獻1〕日本實公昭55-29276號公報 ^ 〔專利文獻2〕日本特公平6-82890號公報 〔專利文獻3〕日本特開2000-186248號公報 〔專利文獻4〕日本特開2002-241694號公報 〔專利文獻5〕日本特開昭64-7697號公報 〔專利文獻6〕日本特開平6-311216號公報 〔專利文獻7〕日本特開2003-133764號公報 〔專利文獻8〕日本特開平7-312469號公報 〔專利文獻9〕日本特開2000-269632號公報 • 〔專利文獻1〇〕日本特開2003-298285號公報 【發明內容】 〔發明欲解決之課題〕 對構成混成多層電路基板，從要求如2軸式鉸鏈般能 對應複雜活動之彎曲性之點，適用機器側係需要更柔軟的 導電材質，爲此期望導電性塗料印刷。 但是’如上述因有於零件安裝部與可撓性電路基板之 段差部分會產生印刷擦痕之問題點，因此無法予以採用。 -6 - (5) 1376995 本發明係如以上所述，於多層之零件安裝部 可撓性電路基板來連接之混成多層電路基板，由 安裝部與可撓性電路基板之段差部分形成指定之 並藉由網版印刷將導電性塗料印刷以形成屏蔽層 形成零件安裝部與可撓性電路基板連續地連接之 【實施方式】 φ 以下，參照圖1至圖7以說明本發明之實施 外，表示各實施型態之所有圖，係用來表示以網 印刷導電性塗料前之階段，混成多層電路基板之 部與可撓性電路基板之邊界部分的剖面。 〔實施型態一〕 圖1係以剖面來表示本發明之第一實施型態 第一實施型態，係使用圖2及圖3、以及表1及 # 明。 爲解決上述課題，於本發明如圖1所示，係 , 裝部c與可撓性電路基板d之段差部分的剖面形 /梯狀。此種階梯狀之剖面形成，係於零件安裝部 電路基板之邊界部，在多層基板形成時預先使各 2越內側則延伸越長。此處之各層積材料2，係 著劑，預浸體（prepreg)、內層中心基板等。 接著，使用下述表1及表2、以及圖2及圖 關於印刷導電性塗料時之擦痕的發生狀況。 彼此間.以 於使零件 階梯狀， ，因此可 屏蔽層。 型態。此 印手法來 零件安裝 。關於此 表2來說 使零件安 狀成爲階 與可撓性 層積材料 指層積黏 3以說明 -8- (6) ^/6995 —ill No. L -ίΧ 1 Ύ { β m) J 擦痕 ——^ 75 無 -- 105 ——-^3 110 依印刷條件無擦痕 ——^ _ 135 有 〔表2〕 資料No —— a ( βτη) A ( μτη) b ( βτη) 0 (度） 擦痕 5 35 105 30 50 並 /»、、 6 50 150 25 63 有 7 — - 50 150 50 45 4nf 8 75 225 50 56 有 9 75 225 75 45 無 10 90 270 75 50 無 11 100 300 100 45 输 /»w1376995 (1) EMBODIMENT OF THE INVENTION The present invention relates to a method of manufacturing a hybrid multilayer circuit substrate having a structure in which a plurality of component mounting portions are connected to each other by a flexible circuit substrate, in particular, A hybrid multilayer circuit in which a conductive coating is printed on a portion of a step portion between a component mounting portion and a flexible circuit substrate by a screen printing method to form a shield layer of electromagnetic interference (hereinafter referred to as EMI) A method of manufacturing a substrate. [Prior Art] The use of a conductive paint to form a shield layer on a circuit board for EMI is known from Patent Document 1 and the like. Fig. 8 shows a general configuration of such a circuit board, and corresponds to a second diagram of Patent Document 1. In Fig. 8, a circuit pattern 52 is formed on the insulating substrate 51, and is covered with a solder resist to cover a place where insulation is required. Further, on top of this, there is a shield layer 54 formed of a conductive paint and coated with a coating layer 55. The shield layer 54 is, for example, connected to the ground pattern 522 through the through via 521 and grounded. As the conductive coating material for forming the shield layer 504, for example, a copper ink or a conductive material such as silver, carbon or pure iron and a binder such as an epoxy resin are mixed as described in Patent Document 2. An insulating resin composition is used for the coating layer 5, and Patent Document 3 and Patent Document 4 specify a resin composition which can be used for a portion requiring flexibility such as a flexible substrate. However, screen printing is generally used to form the shield layer 4. This printing method has no complicated steps and is useful for general use. However, as shown in the patent document 4 - (2) 1376995, a hybrid multilayer circuit board having a structure in which the component mounting portions are connected to each other by a flexible circuit board is used to print a conductive paint by screen printing. When the portion of the step between the component mounting portion and the flexible circuit board is traversed, the printing of the conductive paint may have a problem of scratches in the step portion. This is because the printing screen cannot follow the step, which is roughly the same as the step difference; /m occurs above. When the printing of the conductive coating forming the shielding layer is scratched in the middle, the conduction with the ground pattern is poor, and the electromagnetic wave shielding is lost. Conventionally, in such a hybrid multilayer circuit board, a flexible circuit board in which a shield layer which is also a ground pattern is formed in the component mounting portion and which is connected between the component mounting portions is used, and a circuit copper foil is used on both sides. The flexible circuit substrate is formed with a shield pattern on one side thereof, and can be shielded without printing a conductive paint. On the other hand, in recent years, there has been an increase in the chance of using a multi-layer circuit board in a portion having a hinge structure and frequently opening and closing in a hinged structure such as a computer, a cellular phone, or the like. In this case, as disclosed in Patent Document 6, the flexible circuit board connecting the component mounting portions is wound in a spiral shape to be housed in the hinge portion. Further, as disclosed in Patent Document 7, a 2-axis hinge portion configuration corresponding to complicated activities is also shown. Therefore, the flexible circuit board connecting the component mounting portions to each other is required to be more flexible. In general, the flexibility of the flexible circuit board is such that only one side of the circuit copper foil is better than the circuit copper foil on both sides. For this reason, a connection structure using two single-sided circuit copper foil flexible circuit boards (Patent Document 8) is provided at -5-(3) 1376995. This method has an effect on the improved surface of the bendability, but it is because the circuit copper foil is provided on only one side, so that the shield pattern cannot be formed on the flexible circuit board. Therefore, in order to form the shield layer in this case, for example, as disclosed in Patent Document 9 and Patent Document 10, the conductive shielding film is adhered so as to straddle the flexible circuit board and the component mounting portion. [Patent Document 1] Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-269283 (Patent Document 1) Japanese Patent Laid-Open Publication No. 2003-298285 (Summary of the Invention) The substrate is required to have a softer conductive material for the machine side, such as a 2-axis hinge, which is suitable for the flexibility of complex activities. For this purpose, conductive paint printing is desired. However, as described above, there is a problem that printing scratches may occur in the step portion between the component mounting portion and the flexible circuit substrate, and thus cannot be employed. -6 - (5) 1376995 The present invention is a hybrid multilayer circuit board which is connected to a flexible circuit board of a multi-layer component mounting portion as described above, and is defined by a step portion between the mounting portion and the flexible circuit board. The electroconductive paint is printed by screen printing to form a shield layer, and the component mounting portion is continuously connected to the flexible circuit substrate. [Embodiment] φ Hereinafter, the embodiment of the present invention will be described with reference to FIGS. 1 to 7 . Each of the drawings of the respective embodiments is used to indicate a cross section of a boundary portion between a portion of the multilayer circuit substrate and the flexible circuit substrate before the conductive coating is printed on the screen. [Embodiment 1] Fig. 1 is a cross-sectional view showing a first embodiment of the present invention. The first embodiment is shown in Figs. 2 and 3, and Tables 1 and #. In order to solve the above problems, the present invention is a cross-sectional shape/stepped shape of a stepped portion of the mounting portion c and the flexible circuit board d as shown in Fig. 1 . Such a stepped cross-section is formed at the boundary portion of the component mounting portion circuit board, and when the multilayer substrate is formed, the length of each of the two inner sides is increased as long as possible. Here, each of the laminated materials 2, a binder, a prepreg, an inner layer center substrate, and the like. Next, the occurrence of scratches in the case of printing a conductive paint was used in the following Tables 1 and 2, and Fig. 2 and Fig. 2 . Between each other, so that the parts are stepped, so the layer can be shielded. Type. This method is used to install parts. With regard to this Table 2, the shape of the part is made into a layer and the layer of the flexible laminated material is thickened to indicate that -8-(6) ^/6995 — ill No. L - Χ 1 Ύ { β m) J Trace - ^ 75 None - 105 ——-^3 110 No scratches according to printing conditions - ^ _ 135 Yes [Table 2] Data No —— a ( βτη) A ( μτη) b ( βτη ) 0 (degrees ) Scratch 5 35 105 30 50 and /»,, 6 50 150 25 63 There are 7 — — 50 150 50 45 4nf 8 75 225 50 56 There are 9 75 225 75 45 No 10 90 270 75 50 No 11 100 300 100 45 Lose /»w
表1，如圖2所示，係表示當段差爲一段之階梯狀， 並改變各種階梯狀段差之段差高度T，來網印導電性塗料 時之資料。段差厚度T直到105 爲止可不發生擦痕地 來印刷，但是於1 1 〇 μ m依據印刷壓力及塗刷搬送速度等 印刷條件則發生了擦痕，由於條件管理範圍狹窄實用上並 不佳。 又，段差厚度T爲1 05 // m之試料，以剖面觀察段差 頂點部之導電性塗料厚度的結果，小於比爲確保導通信賴 性所需之塗料厚度的5 # m者，於20個樣品中有3個樣品 -9 - (7) (7)1376995 因此，知道當進行導電性塗料之網印時’爲確保導通 信賴性所需之段差的上限係在100#m附近。 表2，如圖3所示’係用來表示使各層積材料2越內 側則延伸越長，以形成三段之階梯狀段差’並以縱軸爲階 梯狀段差a、橫軸爲各層延伸量b ’當分別印刷導電性塗 料時之擦痕狀況。此圖3係表示擴大圖1之階梯狀部D， 且階梯狀段差a、延伸量b係如圖示。此處’以A來表示 將三段之各層積材料2之厚度加總後之厚度。 有關各種樣品印刷導電性塗料後之結果’於具有零件 安裝部之最末端與最突出之階梯狀段差之頂點的連接線與 可撓性電路基板所形成之交叉角度Θ爲50°以內形狀的樣 品，並無任何擦痕發生。 因此，從表1及表2之資料，知道各階梯狀段差al、 a2、a3分別在100 V m以內，且具有各階梯狀段差之長度 爲與段差相同或其以上之尺寸，且零件安裝部之最末端與 最突出之階梯狀段差之頂點的連接線與前述可撓性電路基 板所形成之交叉角度0爲50°以內即可。只要是此形狀， 橫跨零件安裝部c與可撓性電路基板d之段差部分的部位 ，對印刷網版於平行方向及垂直方向皆可追隨，而可不發 生擦痕來印刷導電性塗料。 圖1之情形、係雖表示零件安裝部c之板厚於兩階段 逐漸變薄的構造，但只要滿足各階梯狀段差在lOOym以 內，且具有各階梯狀段差之長度爲與段差相同或其以上之 尺寸’且零件安裝部之最末端與最突出之階梯狀段差之頂 -10- (8) 1376995 ' 點的連接線與前述可撓性電路基板所形成之交叉角度0爲 • 50°以內的條件，亦可採用依據板厚以1〜4階段板厚逐 漸變薄的構造。 此外，當零件安裝部c與可撓性電路基板d之段差超 過450 // m時，對纜線部網版印刷之塗刷追隨性有變差之 情形。由於此種情形，因此希望零件安裝部c與可撓性電 路基板d之段差在450//m以內。 〔實施型態二〕 圖4，係表示本發明之第二實施型態，係以坡度形狀 來替代圖1之段差。此種情形，亦只要是零件安裝部c之 最末端與可撓性電路基板d之交叉角度02爲50°以內之 坡度形狀，即可印刷導電性塗料。 爲形成垂直方向之落差爲100/zm以內之形狀，可於 零件安裝部與可撓性電路基板邊界之段差部的側面，藉由 # 後述之手段塡充樹脂組成物。此處，樹脂組成物係具有絕 緣性’且只要具有不妨礙可撓性電路基板之彎曲性即可。 可舉如專利文獻3、專利文獻4所示之塗敷層用樹脂組成 物或流出量相對較高之絕緣性黏著劑作爲例子。塡充方法 ，係可以網版印刷塗布來進行。 例如’使網罩開口位置從硬質部之最末端往可撓性電 路基板0.2nim ’當樹脂組成物黏度爲35〇〇mPa · δ時，印 刷塗刷壓力設爲0.2MPa之情形，樹脂組成物之塡充量b2 大致爲0.3mm。直接塗布於零件安裝部之上部之情形，只 -11 - (9) 1376995 要垂直方向之落差爲100"m以內之形狀，即可 性塗料，且以此黏度並不會呈現該種形狀。當網 布後，藉由加熱硬化使樹脂組成物硬化，以進行 料之印刷。 〔實施型態三〕 圖5，係表示本發明之第三實施型態。此係於 裝部與可撓性電路基板邊界之段差部的側面，當塡 上樹脂組成物時，樹脂組成物量不足，於坡度形狀 差形狀的狀態。此種情形，亦只要階梯狀段差a4泊 m以內，且零件安裝部之最末端與各階梯狀段差之 連接線與可撓性電路基板交叉角度03爲50°以內 印刷導電性塗料。 〔實施型態四〕 # 圖6’係表示組合第一實施型態與第二實施型 四實施型態。零件安裝部c與可撓性電路基板d之 分的剖面形狀爲階梯狀，於零件安裝部與可撓性電 邊界之段差部分的側面係塡充樹脂組成物。 〔實施型態五〕 圖7’係表示本發明之第五實施型態。只要是 裝部與可撓性電路基板之段差爲〇13mm以內之混 電路基板’使覆蓋零件安裝部之覆蓋層延伸至可撓 刷導電 印刷塗 電性塗 零件安 充或黏 留下段 100 β 頂點的 ，即可 態之第 段差部 路基板 零件安 成多層 性電路 -12- (10) (10)1376995 基板爲止，藉此可緩和邊界之段差部的傾斜而可印刷。 如上述，只要階梯狀段差a5在100/ζηι以內，且零件 安裝部之最末端與覆蓋層前端部之頂點的連接線與可撓性 電路基板交叉角度0 4爲50°以內，即可印刷。爲實現此 ’只要覆蓋層之黏著劑層之厚度爲25//m以上，位於零件 安裝部之最末端部分之覆蓋層的黏著劑，會流入邊界段差 部’而形成小坡度之傾斜，階梯狀段差a5會在1 〇〇 e m以 內。 此外’覆蓋層整體之厚度’爲形成階梯形狀亦使用 1 〇〇 //m以內者。接著，層積材料、覆蓋層之延伸量bl， b4、樹脂組成物之塡充量b2，b3之最大値雖係依可撓性電 路基板彎曲狀態 '彎曲應力來決定，但大致應爲1 〇mm以 內。又’依可撓性電路基板彎曲狀態、彎曲應力來選擇上 述實施形態中之一項。 【圖式簡單說明】 〔圖1〕係表示本發明之第一實施型態之說明圖。 〔圖2〕係表示表1各尺寸之說明圖。 〔圖3〕係表示表2各尺寸之說明圖。 〔圖4〕係表示本發明之第二實施型態之說明圖。 〔圖5〕係表示本發明之第三實施型態之說明圖。 〔圖6〕係表示本發明之第四實施型態之說明圖。 〔圖7〕係表示本發明之第五實施型態之說明圖。 〔圖8〕係表示以往以網印手法來印刷導電性塗料以 •13- (11) (11)1376995 形成EMI屏蔽層之構造的說明圖。 【主要元件符號說明】 1=連接零件安裝部彼此間之可撓性電路基板 2 :層積材料 3 =樹脂組成物 4 :覆蓋層Table 1, as shown in Fig. 2, shows the data when the stepwise difference is a step and the step height T of the stepped step is changed to screen the conductive paint. The step thickness T can be printed without scratches up to 105. However, scratches occur depending on the printing conditions such as the printing pressure and the painting conveyance speed at 1 1 〇 μ m, and the narrow condition management range is not practical. Further, the sample having a step thickness T of 10.05 // m is observed as a result of observing the thickness of the conductive coating at the apex portion of the step, and is less than the ratio of the coating thickness required to ensure the communication dependence, 5 #m, in 20 samples. There are 3 samples in the range - 9 - (7) (7) 1376995 Therefore, it is known that when performing screen printing of conductive paints, the upper limit of the step required to ensure the communication dependence is around 100#m. Table 2, as shown in Fig. 3, is used to indicate that the longer the inner side of each laminated material 2 is, the longer the extension is to form a three-step stepped step, and the vertical axis is a stepwise step a, and the horizontal axis is the amount of each layer. b 'Scratch condition when printing conductive paint separately. FIG. 3 shows an enlarged view of the stepped portion D of FIG. 1, and the stepped step a and the amount of extension b are as shown. Here, the thickness of each of the laminated materials 2 of the three stages is represented by A. The result of printing the conductive coating on various samples is a sample having a shape in which the angle of intersection between the connecting line having the apex of the end portion of the component mounting portion and the most prominent stepped step and the flexible circuit substrate is 50° or less. There are no scratches. Therefore, from the data in Tables 1 and 2, it is known that the stepped steps a, a2, and a3 are within 100 V m, respectively, and the length of each stepped step is the same or larger than the step, and the component mounting portion The angle of intersection of the connecting line between the end of the most extreme step and the most prominent stepped step and the flexible circuit board may be within 50°. According to this shape, the printing screen can be followed in the parallel direction and the vertical direction across the portion of the step between the component mounting portion c and the flexible circuit board d, and the conductive paint can be printed without scratches. In the case of FIG. 1, the thickness of the component mounting portion c is gradually thinned in two stages, but the length of each stepped step is within 100 μm, and the length of each stepped step is the same as or equal to the step. The size of the 'the end of the part mounting portion and the most prominent stepped step -10- (8) 1376995 'The point of intersection of the point and the flexible circuit board formed by the angle 0 is within 50 ° As the condition, a structure in which the thickness of the sheet is gradually thinned in the range of 1 to 4 stages may be employed. Further, when the step difference between the component mounting portion c and the flexible circuit board d exceeds 450 // m, the followability of the screen printing of the cable portion is deteriorated. Due to such a situation, it is desirable that the difference between the component mounting portion c and the flexible circuit substrate d is within 450 / / m. [Embodiment 2] Fig. 4 is a view showing a second embodiment of the present invention, in which the step of Fig. 1 is replaced by a slope shape. In this case, the conductive paint can be printed as long as the intersection angle 02 between the end of the component mounting portion c and the flexible circuit board d is 50° or less. In order to form a shape in which the difference in the vertical direction is 100/zm or less, the resin composition can be filled on the side surface of the stepped portion of the boundary between the component mounting portion and the flexible circuit board by the means described below. Here, the resin composition is insulative' and may have flexibility so as not to impede the flexibility of the flexible circuit board. The resin composition for a coating layer or the insulating adhesive having a relatively high outflow amount as shown in Patent Document 3 and Patent Document 4 can be exemplified. The filling method can be carried out by screen printing. For example, 'the opening position of the mesh cover is 0.2nim from the extreme end of the hard portion to the flexible circuit substrate.' When the viscosity of the resin composition is 35 〇〇 mPa · δ, the printing coating pressure is set to 0.2 MPa, and the resin composition is The charge b2 is approximately 0.3 mm. When it is directly applied to the upper part of the part mounting part, only -11 - (9) 1376995 is required to have a vertical difference of 100" within the shape of m, and the viscosity is not present in this shape. After the mesh, the resin composition is hardened by heat hardening to carry out printing of the material. [Embodiment 3] Fig. 5 shows a third embodiment of the present invention. This is the side surface of the stepped portion of the boundary between the mounting portion and the flexible circuit board. When the resin composition is applied, the amount of the resin composition is insufficient and the shape of the slope is inferior. In this case, as long as the stepped step is a4 m or less, and the connecting line between the end of the component mounting portion and each of the stepped segments is within 50° of the angle of intersection 03 with the flexible circuit board, the conductive paint is printed. [Embodiment 4] # Figure 6' shows a combination of the first embodiment and the second embodiment. The cross-sectional shape of the component mounting portion c and the flexible circuit board d is stepped, and the side surface of the step portion of the component mounting portion and the flexible electrical boundary is filled with a resin composition. [Embodiment 5] Fig. 7' shows a fifth embodiment of the present invention. As long as the step of the mounting portion and the flexible circuit substrate is less than 13 mm, the mixed circuit substrate ' extends the cover layer of the covering component mounting portion to the flexible brush conductive coating material portion to fill or stick the segment 100 β vertex In the first stage, the differential circuit board component is formed into a multilayer circuit -12-(10) (10)1376995 substrate, whereby the inclination of the step portion of the boundary can be relaxed and printed. As described above, printing can be performed as long as the stepped step a5 is within 100/ζη, and the connection line between the end of the component mounting portion and the vertex of the tip end portion of the cover layer and the flexible circuit board are at an angle of 50°. In order to achieve this, as long as the thickness of the adhesive layer of the coating layer is 25/m or more, the adhesive of the coating layer located at the endmost portion of the component mounting portion flows into the boundary portion of the boundary portion to form a slope of a small slope, stepped The step a5 will be within 1 〇〇em. Further, the thickness "the thickness of the entire cover layer" is also used within a range of 1 〇〇 //m to form a step shape. Then, the maximum amount of the laminate material BB, b4, and the amount of charge b2 and b3 of the resin composition is determined by the bending stress of the flexible circuit board, but it should be approximately 1 〇. Within mm. Further, one of the above embodiments is selected depending on the bending state and the bending stress of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view showing a first embodiment of the present invention. Fig. 2 is an explanatory view showing the dimensions of Table 1. Fig. 3 is an explanatory view showing the dimensions of Table 2. Fig. 4 is an explanatory view showing a second embodiment of the present invention. Fig. 5 is an explanatory view showing a third embodiment of the present invention. Fig. 6 is an explanatory view showing a fourth embodiment of the present invention. Fig. 7 is an explanatory view showing a fifth embodiment of the present invention. Fig. 8 is an explanatory view showing a structure in which a conductive paint is conventionally printed by a screen printing method to form an EMI shielding layer by ?13-(11)(11)1376995. [Explanation of main component symbols] 1=Flexible circuit board connecting the component mounting parts to each other 2: Laminated material 3 = Resin composition 4 : Cover layer
52 :圖案 5 2 1 :穿通孔 522 :接地圖案 5 4 :屏蔽層 55 :塗敷層52 : pattern 5 2 1 : through hole 522 : ground pattern 5 4 : shielding layer 55 : coating layer
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