TWI375965B - - Google Patents
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- Publication number
- TWI375965B TWI375965B TW095111580A TW95111580A TWI375965B TW I375965 B TWI375965 B TW I375965B TW 095111580 A TW095111580 A TW 095111580A TW 95111580 A TW95111580 A TW 95111580A TW I375965 B TWI375965 B TW I375965B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive paste
- paste composition
- conductive
- bump
- resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103996A JP4841159B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
JP2005103872A JP4841157B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
JP2005104034A JP4841160B2 (ja) | 2005-03-31 | 2005-03-31 | 導電性ペースト組成物およびプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200703372A TW200703372A (en) | 2007-01-16 |
TWI375965B true TWI375965B (ja) | 2012-11-01 |
Family
ID=37073406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095111580A TW200703372A (en) | 2005-03-31 | 2006-03-31 | Conductive paste composition and printed wiring board |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100985141B1 (ja) |
TW (1) | TW200703372A (ja) |
WO (1) | WO2006106850A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6705046B1 (ja) * | 2019-12-12 | 2020-06-03 | 株式会社ノリタケカンパニーリミテド | 低温成形用導電性組成物および導電膜付き基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3726627B2 (ja) * | 2000-03-15 | 2005-12-14 | 株式会社村田製作所 | 感光性導体ペーストならびに電子部品、電子装置 |
JP2001264954A (ja) | 2000-03-22 | 2001-09-28 | Konica Corp | 熱現像感光材料の処理方法及び処理装置 |
JP4365053B2 (ja) | 2001-09-04 | 2009-11-18 | 大日本印刷株式会社 | 導電性ペースト組成物及びプリント配線板 |
JP4493995B2 (ja) * | 2003-11-11 | 2010-06-30 | トッパン・フォームズ株式会社 | 導電性ペースト、導電機能部材、印刷回路部材 |
-
2006
- 2006-03-30 KR KR1020077025032A patent/KR100985141B1/ko not_active IP Right Cessation
- 2006-03-30 WO PCT/JP2006/306710 patent/WO2006106850A1/ja active Application Filing
- 2006-03-31 TW TW095111580A patent/TW200703372A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20070116674A (ko) | 2007-12-10 |
KR100985141B1 (ko) | 2010-10-05 |
WO2006106850A1 (ja) | 2006-10-12 |
TW200703372A (en) | 2007-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |