TWI369765B - Package and semiconductor device - Google Patents

Package and semiconductor device

Info

Publication number
TWI369765B
TWI369765B TW097130230A TW97130230A TWI369765B TW I369765 B TWI369765 B TW I369765B TW 097130230 A TW097130230 A TW 097130230A TW 97130230 A TW97130230 A TW 97130230A TW I369765 B TWI369765 B TW I369765B
Authority
TW
Taiwan
Prior art keywords
package
semiconductor device
semiconductor
Prior art date
Application number
TW097130230A
Other languages
English (en)
Chinese (zh)
Other versions
TW200939419A (en
Inventor
Inui Tsuyoshi
Kado Hideo
Kawamoto Yoshinobu
Original Assignee
Panasonic Electric Works Sunx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Sunx filed Critical Panasonic Electric Works Sunx
Publication of TW200939419A publication Critical patent/TW200939419A/zh
Application granted granted Critical
Publication of TWI369765B publication Critical patent/TWI369765B/zh

Links

TW097130230A 2007-08-10 2008-08-08 Package and semiconductor device TWI369765B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007210064 2007-08-10
JP2008185349A JP4479839B2 (ja) 2007-08-10 2008-07-16 パッケージおよび半導体装置

Publications (2)

Publication Number Publication Date
TW200939419A TW200939419A (en) 2009-09-16
TWI369765B true TWI369765B (en) 2012-08-01

Family

ID=40390853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130230A TWI369765B (en) 2007-08-10 2008-08-08 Package and semiconductor device

Country Status (3)

Country Link
JP (2) JP4479839B2 (ja)
CN (1) CN101364580B (ja)
TW (1) TWI369765B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102906497B (zh) * 2010-01-27 2016-08-17 熔合Uv***公司 微通道冷却的高热负荷发光装置
CN102741608B (zh) * 2010-02-02 2014-10-29 夏普株式会社 照明装置、显示装置以及电视接收装置
JP2012074423A (ja) * 2010-09-27 2012-04-12 Panasonic Electric Works Sunx Co Ltd Ｌｅｄモジュール
CN102537697A (zh) * 2010-12-21 2012-07-04 格拉维顿莱特有限公司 照明装置和装配方法
EP2756221B1 (en) * 2011-09-16 2016-08-10 Air Motion Systems, Inc. Assembly and interconnection method for high-power led devices
JP5949262B2 (ja) * 2011-11-18 2016-07-06 岩崎電気株式会社 発光素子モジュール、及び照明器具
JP6208563B2 (ja) * 2013-11-28 2017-10-04 国立大学法人 東京大学 紫外線照射装置
US9664371B2 (en) * 2015-01-15 2017-05-30 Heraeus Noblelight America Llc Lamp head assemblies and methods of assembling the same
JP6411572B1 (ja) * 2017-03-29 2018-10-24 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 発光装置および当該発光装置を含む光照射装置
DE102019200478A1 (de) * 2019-01-16 2020-07-16 Heraeus Noblelight Gmbh Lichtquelle mit mindestens einem ersten lichtemittierenden halbleiterbauelement, einem ersten trägerelement und einem verteilerelement
CN111293205B (zh) * 2020-02-24 2021-07-13 东南大学 一种可拆卸式光源基片的制作方法

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Publication number Priority date Publication date Assignee Title
CA1021047A (en) * 1973-06-25 1977-11-15 Niels J. Hansen Light emitting diode assembly
JPS54159B2 (ja) * 1974-08-23 1979-01-06
JPS51101481A (ja) * 1975-03-05 1976-09-07 Hitachi Ltd
JPS51101482A (ja) * 1975-03-05 1976-09-07 Hitachi Ltd
JPS51101479A (ja) * 1975-03-05 1976-09-07 Hitachi Ltd
JPS58114056U (ja) * 1982-01-27 1983-08-04 和泉電気株式会社 発光ダイオ−ド
JPH02134260A (ja) * 1988-11-15 1990-05-23 Seiko Epson Corp 光プリンタヘッド
JPH03145774A (ja) * 1989-10-31 1991-06-20 Kyocera Corp 画像形成装置
JPH0997923A (ja) * 1995-09-28 1997-04-08 Sanyo Electric Co Ltd 回路ユニット
DE10061265A1 (de) * 2000-12-06 2002-06-27 Jenoptik Jena Gmbh Diodenlaseranordnung
CN100547282C (zh) * 2002-04-25 2009-10-07 林原 可挠性发光体装置及其制造方法
JP2004140098A (ja) * 2002-10-16 2004-05-13 Hamamatsu Photonics Kk 半導体レーザバーの固定方法
US7204615B2 (en) * 2003-03-31 2007-04-17 Lumination Llc LED light with active cooling
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4676335B2 (ja) * 2003-09-19 2011-04-27 パナソニック株式会社 照明装置
JP4934954B2 (ja) * 2003-10-15 2012-05-23 日亜化学工業株式会社 ヒートシンク及びヒートシンクを備えた半導体装置
EP1681728B1 (en) * 2003-10-15 2018-11-21 Nichia Corporation Light-emitting device
JP2007019265A (ja) * 2005-07-07 2007-01-25 Sony Corp 発光装置
JP4492486B2 (ja) * 2005-08-24 2010-06-30 パナソニック電工株式会社 Ｌｅｄを用いた照明器具
JP4623730B2 (ja) * 2005-10-11 2011-02-02 シチズン電子株式会社 発光ダイオード光源ユニットを用いた発光ダイオード光源
JP2007109879A (ja) * 2005-10-13 2007-04-26 Toyoda Gosei Co Ltd Ｌｅｄモジュール及びｌｅｄ発光装置
EP1780804A1 (en) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
JP2007134376A (ja) * 2005-11-08 2007-05-31 Akita Denshi Systems:Kk 発光ダイオード装置及びその製造方法
JP2009064986A (ja) * 2007-09-06 2009-03-26 Panasonic Electric Works Co Ltd 光源装置

Also Published As

Publication number Publication date
TW200939419A (en) 2009-09-16
JP2009065127A (ja) 2009-03-26
JP4479839B2 (ja) 2010-06-09
CN101364580B (zh) 2011-07-13
JP2009296021A (ja) 2009-12-17
JP4670985B2 (ja) 2011-04-13
CN101364580A (zh) 2009-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees