TWI369371B - - Google Patents

Info

Publication number
TWI369371B
TWI369371B TW097101484A TW97101484A TWI369371B TW I369371 B TWI369371 B TW I369371B TW 097101484 A TW097101484 A TW 097101484A TW 97101484 A TW97101484 A TW 97101484A TW I369371 B TWI369371 B TW I369371B
Authority
TW
Taiwan
Application number
TW097101484A
Other versions
TW200846384A (en
Inventor
Katsuhiko Komuro
Masahiko Ito
Daisuke Masuko
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200846384A publication Critical patent/TW200846384A/zh
Application granted granted Critical
Publication of TWI369371B publication Critical patent/TWI369371B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW097101484A 2007-01-24 2008-01-15 Latent curing agent TW200846384A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014187 2007-01-24
PCT/JP2007/075136 WO2008090719A1 (ja) 2007-01-24 2007-12-27 潜在性硬化剤

Publications (2)

Publication Number Publication Date
TW200846384A TW200846384A (en) 2008-12-01
TWI369371B true TWI369371B (zh) 2012-08-01

Family

ID=39644294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097101484A TW200846384A (en) 2007-01-24 2008-01-15 Latent curing agent

Country Status (6)

Country Link
US (1) US8147720B2 (zh)
JP (1) JPWO2008090719A1 (zh)
KR (1) KR101039546B1 (zh)
CN (1) CN101595152B (zh)
TW (1) TW200846384A (zh)
WO (1) WO2008090719A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5298431B2 (ja) * 2007-01-24 2013-09-25 デクセリアルズ株式会社 潜在性硬化剤
JP5707662B2 (ja) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物
JP5382846B2 (ja) * 2008-06-10 2014-01-08 日本化薬株式会社 感光性化合物、それを含む組成物及びその硬化物
JP5365811B2 (ja) * 2010-06-28 2013-12-11 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤
JP5704256B2 (ja) * 2011-12-26 2015-04-22 東亞合成株式会社 絶縁膜用組成物及び絶縁膜
JP6460097B2 (ja) * 2014-04-01 2019-01-30 Ａｇｃ株式会社 防曇剤組成物並びに防曇性物品及びその製造方法
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
WO2016153294A1 (ko) * 2015-03-24 2016-09-29 주식회사 엘지화학 접착제 조성물
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
JP7275469B2 (ja) * 2018-01-12 2023-05-18 味の素株式会社 被覆粒子
KR102236549B1 (ko) * 2019-11-26 2021-04-07 한국과학기술연구원 건식 표면 처리 공정을 통해 보존 안정성이 향상된 잠재성 경화제, 이를 포함하는 일액형 에폭시 접착제 및 이의 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817537B2 (ja) 1979-06-25 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JPS5817536B2 (ja) * 1979-06-21 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JP2001137690A (ja) 1999-11-16 2001-05-22 Nitto Denko Corp 粉末状マイクロカプセルの製造方法およびそれにより得られる粉末状マイクロカプセル
JP3802373B2 (ja) 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3565797B2 (ja) 2001-06-06 2004-09-15 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3875859B2 (ja) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
US20060128835A1 (en) * 2002-10-25 2006-06-15 Taketoshi Usui Capsule type hardener and composition
JP2006131848A (ja) 2004-11-09 2006-05-25 Toagosei Co Ltd ポリオルガノシロキサン及びその製造方法、並びにポリオルガノシロキサンを含有する硬化性組成物
JP2006131849A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd 二液型硬化性組成物
KR100938523B1 (ko) 2005-02-23 2010-01-25 아사히 가세이 케미칼즈 가부시키가이샤 에폭시 수지용 잠재성 경화제 및 에폭시 수지 조성물
JP5057011B2 (ja) 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
US7557230B2 (en) * 2005-06-06 2009-07-07 Sony Corporation Latent curing agent
JP5267757B2 (ja) 2006-02-07 2013-08-21 デクセリアルズ株式会社 潜在性硬化剤

Also Published As

Publication number Publication date
WO2008090719A1 (ja) 2008-07-31
KR101039546B1 (ko) 2011-06-09
US8147720B2 (en) 2012-04-03
KR20090033182A (ko) 2009-04-01
CN101595152A (zh) 2009-12-02
CN101595152B (zh) 2012-06-27
JPWO2008090719A1 (ja) 2010-05-13
TW200846384A (en) 2008-12-01
US20090152504A1 (en) 2009-06-18

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