TWI369254B - Two-fluid jet nozzle for cleaning substrate - Google Patents

Two-fluid jet nozzle for cleaning substrate

Info

Publication number
TWI369254B
TWI369254B TW097132222A TW97132222A TWI369254B TW I369254 B TWI369254 B TW I369254B TW 097132222 A TW097132222 A TW 097132222A TW 97132222 A TW97132222 A TW 97132222A TW I369254 B TWI369254 B TW I369254B
Authority
TW
Taiwan
Prior art keywords
jet nozzle
fluid jet
cleaning substrate
cleaning
substrate
Prior art date
Application number
TW097132222A
Other languages
English (en)
Chinese (zh)
Other versions
TW200916210A (en
Inventor
Suk Joo Kim
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200916210A publication Critical patent/TW200916210A/zh
Application granted granted Critical
Publication of TWI369254B publication Critical patent/TWI369254B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW097132222A 2007-08-23 2008-08-22 Two-fluid jet nozzle for cleaning substrate TWI369254B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070084684A KR100982492B1 (ko) 2007-08-23 2007-08-23 기판 세정용 이류체 분사 노즐

Publications (2)

Publication Number Publication Date
TW200916210A TW200916210A (en) 2009-04-16
TWI369254B true TWI369254B (en) 2012-08-01

Family

ID=40446490

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132222A TWI369254B (en) 2007-08-23 2008-08-22 Two-fluid jet nozzle for cleaning substrate

Country Status (3)

Country Link
KR (1) KR100982492B1 (ko)
CN (1) CN101372001A (ko)
TW (1) TWI369254B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011235279A (ja) * 2010-04-13 2011-11-24 Fuji Kikai Kogyo Kk 塗工装置
CN101850343A (zh) * 2010-06-10 2010-10-06 中国电子科技集团公司第四十五研究所 晶片双流体清洗装置
KR101238923B1 (ko) * 2011-05-11 2013-03-06 주식회사 듀라소닉 이류체 분사를 이용한 태양광 웨이퍼 세척 장치 및 방법
KR101267464B1 (ko) * 2011-10-13 2013-05-31 세메스 주식회사 유체 분사 장치
CN104455545B (zh) 2014-11-28 2016-09-14 合肥鑫晟光电科技有限公司 自切换t型三通接头及卡夹清洗干燥装置
KR102010329B1 (ko) * 2017-08-04 2019-10-15 주식회사 디엠에스 기판처리장치 및 이를 이용한 인라인 기판처리시스템
KR101909984B1 (ko) * 2017-11-30 2018-10-19 주식회사 쓰리디프리욜 기판 세정용 노즐
KR102128861B1 (ko) * 2018-10-31 2020-07-01 주식회사 뉴파워 프라즈마 분사 장치 및 방법
KR20200056045A (ko) 2018-11-14 2020-05-22 드림산업(주) 이류체 분사노즐
US11772058B2 (en) * 2019-10-18 2023-10-03 Taiwan Semiconductor Manufacturing Company Limited Gas mixing system for semiconductor fabrication
KR102621585B1 (ko) * 2023-03-13 2024-01-05 (주)화인테크놀로지 산업용 멀티 노즐 세정 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100616248B1 (ko) * 2005-12-21 2006-08-28 주식회사 케이씨텍 기판세정용 이류체 분사모듈 및 이를 이용한 기판세정장치

Also Published As

Publication number Publication date
KR100982492B1 (ko) 2010-09-15
TW200916210A (en) 2009-04-16
KR20090020171A (ko) 2009-02-26
CN101372001A (zh) 2009-02-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees