TWI365500B - Control method for bonding machine - Google Patents

Control method for bonding machine

Info

Publication number
TWI365500B
TWI365500B TW097125612A TW97125612A TWI365500B TW I365500 B TWI365500 B TW I365500B TW 097125612 A TW097125612 A TW 097125612A TW 97125612 A TW97125612 A TW 97125612A TW I365500 B TWI365500 B TW I365500B
Authority
TW
Taiwan
Prior art keywords
control method
bonding machine
bonding
machine
control
Prior art date
Application number
TW097125612A
Other languages
English (en)
Other versions
TW200941597A (en
Inventor
Min-Hyung Lee
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200941597A publication Critical patent/TW200941597A/zh
Application granted granted Critical
Publication of TWI365500B publication Critical patent/TWI365500B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097125612A 2008-03-25 2008-07-07 Control method for bonding machine TWI365500B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080027555A KR100844346B1 (ko) 2008-03-25 2008-03-25 본딩 장비의 제어방법

Publications (2)

Publication Number Publication Date
TW200941597A TW200941597A (en) 2009-10-01
TWI365500B true TWI365500B (en) 2012-06-01

Family

ID=39823875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097125612A TWI365500B (en) 2008-03-25 2008-07-07 Control method for bonding machine

Country Status (3)

Country Link
KR (1) KR100844346B1 (zh)
CN (1) CN101546175A (zh)
TW (1) TWI365500B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5941705B2 (ja) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 ２軸駆動機構及びダイボンダ
CN105470173B (zh) * 2015-12-15 2018-08-14 上海微电子装备（集团）股份有限公司 一种芯片接合***及方法
JP7102113B2 (ja) * 2017-09-11 2022-07-19 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3275742B2 (ja) 1996-11-28 2002-04-22 松下電器産業株式会社 チップのボンディング方法
JP2002231768A (ja) * 2001-02-01 2002-08-16 Shinkawa Ltd インナーリードボンディング装置
JP3747054B2 (ja) 2001-12-04 2006-02-22 Ｔｏｗａ株式会社 ボンディング装置及びボンディング方法
KR101132141B1 (ko) * 2006-03-03 2012-03-29 삼성테크윈 주식회사 다이 픽업위치 보정방법

Also Published As

Publication number Publication date
KR100844346B1 (ko) 2008-07-08
TW200941597A (en) 2009-10-01
CN101546175A (zh) 2009-09-30

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