TWI364086B - - Google Patents

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Publication number
TWI364086B
TWI364086B TW97136450A TW97136450A TWI364086B TW I364086 B TWI364086 B TW I364086B TW 97136450 A TW97136450 A TW 97136450A TW 97136450 A TW97136450 A TW 97136450A TW I364086 B TWI364086 B TW I364086B
Authority
TW
Taiwan
Prior art keywords
wafer
unit
tested
flexible
bearing surface
Prior art date
Application number
TW97136450A
Other languages
English (en)
Chinese (zh)
Other versions
TW201013803A (en
Inventor
I Shih Tseng
Cheng Huiung Chen
Original Assignee
Chroma Ate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chroma Ate Inc filed Critical Chroma Ate Inc
Priority to TW97136450A priority Critical patent/TW201013803A/zh
Publication of TW201013803A publication Critical patent/TW201013803A/zh
Application granted granted Critical
Publication of TWI364086B publication Critical patent/TWI364086B/zh

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW97136450A 2008-09-23 2008-09-23 A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method TW201013803A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97136450A TW201013803A (en) 2008-09-23 2008-09-23 A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97136450A TW201013803A (en) 2008-09-23 2008-09-23 A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method

Publications (2)

Publication Number Publication Date
TW201013803A TW201013803A (en) 2010-04-01
TWI364086B true TWI364086B (ja) 2012-05-11

Family

ID=44829474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97136450A TW201013803A (en) 2008-09-23 2008-09-23 A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method

Country Status (1)

Country Link
TW (1) TW201013803A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581904B (zh) * 2014-11-18 2017-05-11 漢民科技股份有限公司 工件處理裝置與方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012112904A (ja) * 2010-11-26 2012-06-14 Micronics Japan Co Ltd プローブカード並びに半導体検査装置及び半導体検査方法
CN113251976B (zh) * 2021-06-30 2021-09-24 苏师大半导体材料与设备研究院(邳州)有限公司 硅片外形尺寸检测工具及检测方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581904B (zh) * 2014-11-18 2017-05-11 漢民科技股份有限公司 工件處理裝置與方法

Also Published As

Publication number Publication date
TW201013803A (en) 2010-04-01

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees