TWI364086B - - Google Patents
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- Publication number
- TWI364086B TWI364086B TW97136450A TW97136450A TWI364086B TW I364086 B TWI364086 B TW I364086B TW 97136450 A TW97136450 A TW 97136450A TW 97136450 A TW97136450 A TW 97136450A TW I364086 B TWI364086 B TW I364086B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- unit
- tested
- flexible
- bearing surface
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201013803A TW201013803A (en) | 2010-04-01 |
TWI364086B true TWI364086B (ja) | 2012-05-11 |
Family
ID=44829474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97136450A TW201013803A (en) | 2008-09-23 | 2008-09-23 | A fixation/release auxiliary device for a wafer testing equipment, the testing machine and the method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201013803A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI581904B (zh) * | 2014-11-18 | 2017-05-11 | 漢民科技股份有限公司 | 工件處理裝置與方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012112904A (ja) * | 2010-11-26 | 2012-06-14 | Micronics Japan Co Ltd | プローブカード並びに半導体検査装置及び半導体検査方法 |
CN113251976B (zh) * | 2021-06-30 | 2021-09-24 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 硅片外形尺寸检测工具及检测方法 |
-
2008
- 2008-09-23 TW TW97136450A patent/TW201013803A/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI581904B (zh) * | 2014-11-18 | 2017-05-11 | 漢民科技股份有限公司 | 工件處理裝置與方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201013803A (en) | 2010-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |