1363396 九、發明說明： 【發明所屬之技術領域】 且特別是有 本發明是有關於一種平面顯示器的製程 關於一種應用於製造平面顯示器的軟烤方法 【先前技術】 在液晶顯示器中，配向膜是控制顯示品質的關鍵元件 之-。配向膜-般是畫素電極上，用以控制液晶分子的排 列方向，並提供所需液晶分子之預傾角（pmmangie)。 傳統配向膜之製造係採用滚輪印刷技術，所謂滾輪印 刷技術就是利用滾輪來將配向液塗佈於玻璃基板上然後 再烤乾配向液中的㈣，㈣化形成配向膜。但這種滚輪 印刷技術有著滾輪維修不易、配向液耗費過多等問題，因 此有關產業已漸漸以喷墨印刷技術來取代傳統的滾輪印刷 技術。 喷墨印刷技術就是利用噴墨頭及噴嘴將配向液喷灑至 玻璃基板上，再加熱乾燥形成配向臈。然而，噴墨印刷技 術所使用的配向液黏度較低，因此常常會在加熱乾燥後產 生厚度不均的現象。這種現象的主要成因為：製造者在加 熱乾燥時所施加的溫度不均勻，使得部分區域的配向液已 乾燥成配向膜，但其它部分卻仍是液態的情況。由於這些 液態的配向液會自發性地流動補充那些已經乾涸的區域， 因此往往讓高溫區域的配向膜在乾燥後過厚。由於這種厚 度不均的現象會嚴重損及液晶顯示器的顯示品質，因此有 關產業的製造者莫 不致力於解決這個 問題。 赞明円容】 執基=Γ 一方面就是在提供一種軟烤方法，其在加 :板的同時，頂針支標基板的位置會有所改變，以避免 基板上產生局部溫度過高的現象。 根據本發明一實施例，一種軟烤方法包含下列步驟： 以加熱板加熱基板。其中，上述之加熱板具有至少一頂針 支#基板此外’在加熱基板的同時’頂針支樓基板的位 置會有所改變。 【實施方式】 一般軟烤方法大多是以加熱板來加熱基板，並藉此乾 燥固化基板上的濕膜。而為了在加熱過程中固定基板的位 置，一般加熱板上大多需設有多個頂針來支撐基板。然而， 由於这些頂針會將加熱板所產生的熱量直接傳導至基板 上，因此基板與頂針接觸的位置往往會較其它區域具有更 高的溫度。由上述之先前技術可知，這種溫度不均的現象 將導致乾燥後產生膜厚不均的問題。因此，本發明下述實 施例將揭露一種軟烤方法，其在加熱基板的同時，頂針支 樓基板的位置會有所改變’以避免基板上產生局部溫度過 南的現象。 本發明之一實施態樣為一種軟烤方法，其包含下列步 1363396 ⑴以加熱板加熱基板，#中加熱板具有至少一頂針支 撑基板。 (2)在加熱基板的同時，改變頂針支撐基板的位置。 以下將舉二實施例說明如何具體實施上述之步驟⑺。 在以下三實施射’基板例如可為塗佈有配向液的玻璃基 板、塗佈有光阻的半導體基材、或其他塗佈有濕膜需加熱 乾燥的基板。以下說明係以塗佈有配向液12〇的玻璃基板 110(如第1A-3D圖所示）為例，以清楚說明本發明之實施例。 實施例一 第1A-1D圖繪示依照本發明一實施例之軟烤方法的示 思圖。如圖所示，使用者可先將配向液12〇塗佈於玻璃基 板110上，然後再將此玻璃基板11〇置放於加熱板之頂針 130上，並利用加熱板加熱玻璃基板11〇(如第ία圖所繪 不）’使得玻璃基板11〇上的配向液12〇乾燥固化成配向 膜。在加熱玻璃基板110時，使用者可適時改變頂針13〇 支撐玻璃基板110的位置（點P)，以避免點P上的配向液 乾燥過快，導致乾燥後的配向膜厚度不均。 具體而言，使用者可在加熱玻璃基板110的同時，先 利用抬升機構14〇將玻璃基板110抬離頂針130(如第16圖 所繪示）。接著，改變玻璃基板110與頂針130的相對位置 (如第1C圖所繪示），然後再將玻璃基板11〇放回頂針^0 上（如第1D圖所繪示由第1D圖可以看出，此時頂針13〇 支樓玻璃基板110的位置已經改變，不再是原本的點p。 1363396 雖然在第1B圖及第1C圖十，使用者係固定頂針i3〇 的位置，並同時依箭頭A的方向移動玻璃基板11〇，但此 並不限制本發明，使用者亦可選擇固定玻璃基板的位置， 並同時移動頂針，只要兩者間的相對位置產生改變即可。 實施例二 第2A-2C圖繪示依照本發明另一實施例之軟烤方法的 示意圖。同樣地，使用者可先將配向液12〇塗佈於破璃基 板110上，然後再將此玻璃基板11〇置放於加熱板之頂針 130上，並利用加熱板加熱玻璃基板ιι〇(如第圖所繪 不），使得玻璃基板110上的配向液12〇乾燥固化成配向 膜。此一實施例與上一實施例的不同點在於：由於本實施 例之頂針13G的剖面雜呈現類似z字形之結構（也就是 說，頂針130之根部與頂部係位在不同之垂直軸上），因此 使用者可藉由轉動頂針13G的方式，改變頂針支撐玻 璃基板11 0的位置。 具體而言，使用者可在加熱玻璃基板110的同時，先 利用抬升機構140將玻璃基板11〇抬離頂針13〇(如第圖 所繪示）。接著，固定玻璃基板11〇的位置，並同時轉動^ 針130’使得兩者間的相對位置產生改變（如第％圖所緣 示）。然後，將玻璃基板110放回頂針13〇上。由第2C圓 可以看出’由於頂針13〇與玻璃基板11〇的相對位置已經 產生變化’因此頂冑13G支撑玻璃基板m的位置將會有 所改變，而不會再是原本的點P。 θ 1363396 者就會改變頂針130支撐玻璃基板110的位置，以避免玻 离基板110與頂針丨3〇接觸的區域產生溫度過高的現象。 應瞭解到，以上所舉之時間參數均僅為例示，並非用以限 制本發明，習知此項技藝者應視當時需要彈性選擇其實施 方式。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明’任何熟f此技㈣，在不脫離本發明之精神和範 圍内，當可作各種之更動與_，因此本發明之保護範圍 s視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第 1A-1D 意圖。 實施例之軟烤方法的示 第2A-2C圖繪示依照本發明另一實施例之軟 示意圖。 方法的 不意圖 第3A-3D圖繪示依照本發明再—實施例之軟拷方法的 【主要元件符號說明】 110 :玻璃基板 120 :配向液 130 :頂针 140 :抬升機構 A :箭頭 P :點 101363396 IX. Description of the Invention: [Technical Field of the Invention] In particular, the present invention relates to a process for a flat panel display. A soft baking method for manufacturing a flat panel display. [Prior Art] In a liquid crystal display, an alignment film is Control the key components of display quality -. The alignment film is generally a pixel electrode for controlling the alignment of liquid crystal molecules and providing a pre-tilt angle of the desired liquid crystal molecules. The traditional alignment film is manufactured by roller printing technology. The so-called roller printing technology uses a roller to apply an alignment liquid onto a glass substrate and then dry the alignment liquid (4), and (4) form an alignment film. However, this roller printing technology has problems such as difficulty in repairing the rollers and excessive consumption of the alignment liquid. Therefore, the related industry has gradually replaced the traditional roller printing technology with inkjet printing technology. The inkjet printing technology uses an inkjet head and a nozzle to spray the alignment liquid onto the glass substrate, and then heats and dries to form a alignment crucible. However, the alignment liquid used in ink jet printing technology has a low viscosity, so that uneven thickness is often caused after heat drying. The main cause of this phenomenon is that the temperature applied by the manufacturer during heating and drying is not uniform, so that the alignment liquid in a part of the area has dried to form an alignment film, but the other parts are still in a liquid state. Since these liquid alignment fluids spontaneously replenish those areas that have dried up, the alignment film in the high temperature region tends to be too thick after drying. Since this uneven thickness phenomenon seriously impairs the display quality of the liquid crystal display, the manufacturers of the industry are not committed to solving this problem. Appreciation 】 执 Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ 一方面 一方面 一方面 一方面 一方面According to an embodiment of the invention, a soft bake method comprises the steps of: heating a substrate with a heating plate. Wherein, the above-mentioned heating plate has at least one ejector pin # substrate, and the position of the thimble sub-base substrate is changed while the substrate is being heated. [Embodiment] In general, the soft baking method mostly uses a heating plate to heat the substrate, and thereby dry and solidify the wet film on the substrate. In order to fix the position of the substrate during the heating process, it is generally necessary to provide a plurality of thimbles on the heating plate to support the substrate. However, since these thimbles conduct the heat generated by the heating plate directly to the substrate, the position at which the substrate contacts the thimble tends to have a higher temperature than other regions. As is apparent from the above prior art, such a phenomenon of temperature unevenness causes a problem of uneven film thickness after drying. Accordingly, the following embodiments of the present invention disclose a soft bake method in which the position of the ejector base substrate is changed while the substrate is being heated to avoid the occurrence of local temperature overshoot on the substrate. One embodiment of the present invention is a soft bake method comprising the following steps 1363396 (1) heating the substrate with a heating plate having at least one thimble supporting substrate. (2) While heating the substrate, the position of the thimble supporting substrate is changed. The following will explain how to implement the above step (7) in detail. The substrate can be, for example, a glass substrate coated with an alignment liquid, a semiconductor substrate coated with a photoresist, or another substrate coated with a wet film to be dried by heating. The following description is made by taking a glass substrate 110 coated with an alignment liquid 12 (as shown in Figs. 1A-3D) as an example to clearly illustrate an embodiment of the present invention. Embodiment 1 FIGS. 1A-1D are diagrams showing a soft baking method according to an embodiment of the present invention. As shown in the figure, the user can first apply the alignment liquid 12 于 on the glass substrate 110, and then place the glass substrate 11 on the thimble 130 of the heating plate, and heat the glass substrate 11 by using a heating plate ( As shown in Fig. 3, the alignment liquid 12 on the glass substrate 11 is dried and solidified into an alignment film. When the glass substrate 110 is heated, the user can change the position (point P) of the thimble 13 支撑 supporting the glass substrate 110 in time to prevent the alignment liquid on the spot P from drying too fast, resulting in uneven thickness of the alignment film after drying. Specifically, the user can lift the glass substrate 110 away from the ejector pin 130 by using the lifting mechanism 14 while heating the glass substrate 110 (as shown in FIG. 16). Next, the relative position of the glass substrate 110 and the ejector pin 130 is changed (as shown in FIG. 1C), and then the glass substrate 11〇 is placed back on the ejector pin ^0 (as shown in FIG. 1D, it can be seen from FIG. 1D) At this time, the position of the ejector pin 13 of the glass substrate 110 has changed, and is no longer the original point p. 1363396 Although in FIG. 1B and FIG. 1C, the user fixes the position of the thimble i3〇, and at the same time, according to the arrow The direction of A moves the glass substrate 11A, but this does not limit the present invention, and the user can also select the position of the fixed glass substrate and move the thimble at the same time as long as the relative position between the two changes. 2nd Embodiment 2A 2C is a schematic view showing a soft baking method according to another embodiment of the present invention. Similarly, the user may first apply the alignment liquid 12〇 to the glass substrate 110, and then place the glass substrate 11 thereon. On the thimble 130 of the heating plate, and heating the glass substrate by using a heating plate (as shown in the figure), the alignment liquid 12 on the glass substrate 110 is dried and solidified into an alignment film. This embodiment and the previous embodiment The difference between the examples is: The cross section of the ejector pin 13G of the embodiment exhibits a zigzag-like structure (that is, the root of the ejector pin 130 and the top portion are on different vertical axes), so that the user can change the thimble by rotating the ejector pin 13G. The position of the glass substrate 110 is supported. Specifically, the user can lift the glass substrate 11 from the ejector pin 13 (as shown in the figure) by using the lifting mechanism 140 while heating the glass substrate 110. Then, fixing The position of the glass substrate 11〇 and the rotation of the pin 130' at the same time causes a change in the relative position between the two (as shown in the figure 5%). Then, the glass substrate 110 is placed back on the ejector pin 13 by the 2C circle. It can be seen that 'because the relative position of the ejector pin 13 〇 and the glass substrate 11 已经 has changed', the position of the top cymbal 13G supporting the glass substrate m will be changed, and will not be the original point P. θ 1363396 The position of the thimble 130 supporting the glass substrate 110 is changed to avoid the phenomenon that the temperature of the glass substrate 110 is in contact with the thimble 丨3〇. It is understood that the above time parameters are only examples. It is not intended to limit the present invention, and those skilled in the art should be able to select the embodiment of the present invention as needed. Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. The scope of protection of the present invention is defined by the scope of the appended claims, without departing from the spirit and scope of the invention. [FIG. 1A-1D] 2A-2C of the soft baking method of the embodiment shows a soft schematic diagram according to another embodiment of the present invention. The method is not intended to be a 3A-3D diagram showing a soft copy method according to another embodiment of the present invention. [Main component symbol description] 110: Glass substrate 120: Alignment liquid 130: Thimble 140: Lifting mechanism A: Arrow P: Point 10