TWI359859B - Polishing kit for magnetic disk - Google Patents

Polishing kit for magnetic disk Download PDF

Info

Publication number
TWI359859B
TWI359859B TW093124985A TW93124985A TWI359859B TW I359859 B TWI359859 B TW I359859B TW 093124985 A TW093124985 A TW 093124985A TW 93124985 A TW93124985 A TW 93124985A TW I359859 B TWI359859 B TW I359859B
Authority
TW
Taiwan
Prior art keywords
acid
polishing
weight
alumina
disk substrate
Prior art date
Application number
TW093124985A
Other languages
English (en)
Chinese (zh)
Other versions
TW200516133A (en
Inventor
Kiyoteru Osawa
Hiroaki Kitayama
Toshiya Hagihara
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of TW200516133A publication Critical patent/TW200516133A/zh
Application granted granted Critical
Publication of TWI359859B publication Critical patent/TWI359859B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW093124985A 2003-09-09 2004-08-19 Polishing kit for magnetic disk TWI359859B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003317191A JP4336550B2 (ja) 2003-09-09 2003-09-09 磁気ディスク用研磨液キット

Publications (2)

Publication Number Publication Date
TW200516133A TW200516133A (en) 2005-05-16
TWI359859B true TWI359859B (en) 2012-03-11

Family

ID=33095507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124985A TWI359859B (en) 2003-09-09 2004-08-19 Polishing kit for magnetic disk

Country Status (6)

Country Link
US (1) US20050054273A1 (ja)
JP (1) JP4336550B2 (ja)
CN (1) CN1613607B (ja)
GB (1) GB2406098B (ja)
MY (1) MY137560A (ja)
TW (1) TWI359859B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007060869A1 (ja) * 2005-11-24 2007-05-31 Jsr Corporation 化学機械研磨用水系分散体および化学機械研磨方法
US20070122546A1 (en) * 2005-11-25 2007-05-31 Mort Cohen Texturing pads and slurry for magnetic heads
JP5177430B2 (ja) * 2006-07-18 2013-04-03 Ｊｓｒ株式会社 化学機械研磨用水系分散体、その製造方法および化学機械研磨方法
JPWO2008117573A1 (ja) * 2007-03-27 2010-07-15 Jsr株式会社 化学機械研磨用水系分散体、該水系分散体を調製するためのキット、化学機械研磨方法、および半導体装置の製造方法
JP5403922B2 (ja) * 2008-02-26 2014-01-29 富士フイルム株式会社 研磨液および研磨方法
JP5782257B2 (ja) * 2008-05-01 2015-09-24 Jsr株式会社 化学機械研磨用水系分散体および該化学機械研磨用水系分散体を調製するためのキット、ならびに化学機械研磨方法
US20100096584A1 (en) * 2008-10-22 2010-04-22 Fujimi Corporation Polishing Composition and Polishing Method Using the Same
CN103127874B (zh) * 2013-03-01 2014-12-17 上海卫康光学眼镜有限公司 抛光液分散助剂、含有该分散助剂的抛光液及制备方法和应用
JP6366308B2 (ja) * 2014-03-12 2018-08-01 株式会社ディスコ 加工方法
WO2019004161A1 (ja) * 2017-06-26 2019-01-03 花王株式会社 研磨液組成物用シリカスラリー
JP7096714B2 (ja) * 2017-06-26 2022-07-06 花王株式会社 研磨液組成物用シリカスラリー

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* Cited by examiner, † Cited by third party
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US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system
JPH09190626A (ja) * 1995-11-10 1997-07-22 Kao Corp 研磨材組成物、磁気記録媒体用基板及びその製造方法並びに磁気記録媒体
EP1610367B1 (en) * 1996-09-30 2010-03-17 Hitachi Chemical Co., Ltd. Cerium oxide abrasive and method of polishing substrates
US6004193A (en) * 1997-07-17 1999-12-21 Lsi Logic Corporation Dual purpose retaining ring and polishing pad conditioner
US6149696A (en) * 1997-11-06 2000-11-21 Komag, Inc. Colloidal silica slurry for NiP plated disk polishing
JP2000063805A (ja) * 1998-08-18 2000-02-29 Showa Denko Kk 磁気ディスク基板研磨用組成物
US5972124A (en) * 1998-08-31 1999-10-26 Advanced Micro Devices, Inc. Method for cleaning a surface of a dielectric material
CN1626567A (zh) * 1999-08-17 2005-06-15 日立化成工业株式会社 化学机械研磨用研磨剂及基板的研磨法
JP4238951B2 (ja) * 1999-09-28 2009-03-18 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いたメモリーハードディスクの製造方法
JP3841995B2 (ja) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP2001187877A (ja) * 1999-12-28 2001-07-10 Nec Corp 化学的機械的研磨用スラリー
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
WO2001076819A1 (en) * 2000-04-07 2001-10-18 Cabot Microelectronics Corporation Integrated chemical-mechanical polishing
JP3768402B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP4009986B2 (ja) * 2000-11-29 2007-11-21 株式会社フジミインコーポレーテッド 研磨用組成物、およびそれを用いてメモリーハードディスクを研磨する研磨方法
US7029373B2 (en) * 2001-08-14 2006-04-18 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
US20030077983A1 (en) * 2001-10-12 2003-04-24 International Business Machines Corporation Cleaning polish etch composition and process for a superfinished surface of a substrate
JP2003133266A (ja) * 2001-10-22 2003-05-09 Sumitomo Bakelite Co Ltd 研磨用組成物
JP2003197572A (ja) * 2001-12-26 2003-07-11 Sumitomo Bakelite Co Ltd 研磨用組成物
KR100457417B1 (ko) * 2001-12-28 2004-11-18 제일모직주식회사 금속배선 연마용 슬러리 조성물
JP2003218071A (ja) * 2002-01-28 2003-07-31 Sumitomo Bakelite Co Ltd 研磨用組成物
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US6582279B1 (en) * 2002-03-07 2003-06-24 Hitachi Global Storage Technologies Netherlands B.V. Apparatus and method for reclaiming a disk substrate for use in a data storage device
JP4707311B2 (ja) * 2003-08-08 2011-06-22 花王株式会社 磁気ディスク用基板
US20050139119A1 (en) * 2003-12-24 2005-06-30 Rader W. S. Polishing composition
JP4249008B2 (ja) * 2003-12-25 2009-04-02 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法

Also Published As

Publication number Publication date
JP2005081504A (ja) 2005-03-31
GB0418338D0 (en) 2004-09-22
GB2406098A (en) 2005-03-23
CN1613607B (zh) 2012-02-01
US20050054273A1 (en) 2005-03-10
MY137560A (en) 2009-02-27
GB2406098B (en) 2007-09-12
TW200516133A (en) 2005-05-16
JP4336550B2 (ja) 2009-09-30
CN1613607A (zh) 2005-05-11

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