TWI358384B - Methods and apparatus for loading and unloading su - Google Patents

Methods and apparatus for loading and unloading su Download PDF

Info

Publication number
TWI358384B
TWI358384B TW96137321A TW96137321A TWI358384B TW I358384 B TWI358384 B TW I358384B TW 96137321 A TW96137321 A TW 96137321A TW 96137321 A TW96137321 A TW 96137321A TW I358384 B TWI358384 B TW I358384B
Authority
TW
Taiwan
Prior art keywords
carrier
substrate
substrate carrier
end effector
loading
Prior art date
Application number
TW96137321A
Other languages
Chinese (zh)
Other versions
TW200833585A (en
Inventor
Michael R Rice
Eric A Englhardt
Jeffrey C Hudgens
Kirk Van Katwyk
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200833585A publication Critical patent/TW200833585A/en
Application granted granted Critical
Publication of TWI358384B publication Critical patent/TWI358384B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Control Of Conveyors (AREA)

Description

1358384 九、發明說明： 【發明所屬之技術領域】1358384 IX. Description of the invention: [Technical field to which the invention pertains]

本發明大體上是關於半導體裝置 關於晶_承載件在製造設施内的輪送 【先前技術】 製造半導體裝置一般涉及對諸如功β 了蒂如妙基材、玻璃板等基BACKGROUND OF THE INVENTION 1. Field of the Invention This invention generally relates to semiconductor devices in relation to the transfer of a crystal carrier in a manufacturing facility. [Prior Art] The fabrication of a semiconductor device generally involves the use of a substrate such as a workbench, a glass substrate, or the like.

材執行一連串步驟。此類基材也可指Ρ面A I J &已圖案化或未圖案化 的晶圓。這些步驟可包括研磨、沉籍 ^ π堪'儿積、蝕刻、光微影、熱The material performs a series of steps. Such substrates may also refer to wafers that have been patterned or unpatterned. These steps can include grinding, sinking, π, etch, light lithography, heat

處理等。-些不同的製程步驟通常可在包括複數個處理室 的單一處理系統或「工具」中進行。然而，一般情況下， 還需在製造設施内的其他處理位置進行其他…故需於 製造設施内，將基材從一處理位置輸送到另一處理位置。 視欲製造的半導體裝置類型而定，有相當多的製程步驟需 在製造設施内的多個不同處理位置進行。 將基材從一處理位置輸送到諸如密封盒、匣、容器等 基材承載件内的另一處理位置是很常見的。另外也常採用Processing and so on. - A number of different process steps are typically performed in a single processing system or "tool" that includes a plurality of processing chambers. However, in general, other processing locations within the manufacturing facility are required to perform other operations in the manufacturing facility to transport the substrate from one processing location to another. Depending on the type of semiconductor device to be fabricated, there are a number of process steps that need to be performed at multiple different processing locations within the manufacturing facility. It is common to transport the substrate from a processing location to another processing location within a substrate carrier such as a sealed box, crucible, container, or the like. Also often used

製造系統，且特別是 自動化基材承載件傳送裝置，例如自料航車、高架輸送 系統、基材承載件搬運機械裝置等，以在製造設施内各位 置之間移動基材承載件，或傳送基材承載件進入或離開基 材承載件傳送裝置。 就單獨基材而言，從形成或接收原始基材到將完成基 材切割成半導體元件的全部製程可能需歷經數週或數月的 時間》在典型的製造設施中，大量的基材將因此成為特定 間内的半成品（WOrk in pr〇gress ; Wlp)。製造設施中含 5 1358384 有半成品基材意味著投入相當多的流動資本，而 每個基材的製造成本。因此，就製造設施的既哀 而言’期望能夠減少WIP數量。為此，應縮短虑 的耗費總時間。 【發明内容】 在一些態樣中，本發明提出用於裝載與卸弟 件進出輸送系統的系統。該系統包括一基材承 器’用以於停靠站與輸送系統之間傳送基材承弟 承載件搬運器（substrate carrier handler)包括： (end effector)，用以支撐基材承載件；一控制器 至基材承載件搬運器且用來控制基材承載件搬驾 移動基材承載件時，可操作基材承載件搬運器纪 擇嗔合與脫離基材承載件而進出輪送系統；以 器，其耦接至控制器且用來提供訊號給控制器， 材承載件的資訊。若欲於基材承載件搬運器的一 載路程（stroke)内進行調整，則可操作控制器依撼 供的訊號來調整基材承載件搬運器的運作。 在其他一些態樣中，本發明提出裝栽 件進出輪送系統的方法。該方法包括. ""估.感測正在 上輸送且逐漸接近之基材承載件的資冑；判斷逐 基材承載件的基材承載件類型；依據該資訊和基 類型，從至少二個已儲存的移動數據。土 申撰摆山 _表（motion 中選擇出一卸載移動數據圖表；以及 命奴丨*^用所選擇 動數據圖表從輸送系統卸下基材承栽件。在一 可能増加 基材產能 理各基材 •基材承载 載件搬運 ，件；基材 一端效器 ’其耦接 」器，以於 端效器選 及—感測 以指示基 裝载或卸 感測器提 基材承載 輪送系統 漸接近之 材承载件 profiles) 的卸载移 些實施例 6 1358384 中，該 間所感 在 進出輪 的基材 該基材 承載件 載件的 件類型 裝載移 由該輪 本 專利範 方法更 測到的 另一些 送系統 承載件 承載件 支撐件 基材承 ’從至 動數據 送系統 發明之 圍和所 包括依據於基材承載件搬運器之卸載過程期 額外資訊，來調整該卸載移動數據圖表。 態樣中，本發明提出裝載與卸載基材承載件 的方法。肖方法包括：決定輸送系統上可用 支擇件（substrate carrier supp〇rt);感測關於 支撐件資訊；感測關於將裝載至基材 上之基材承載件的sn判斷該基材承 載件類型；依據第-與第二資訊和基材承載 少二個已儲存的移動數據圖表中，選擇出一 圖表；以及利用所選擇之裝載移動數據圖表 來裝載基材承載件。 其他特徵和態樣在參閲以下詳細說明、申請 附圖式後，將變得更清楚易懂。 【實施方式】 位於晶圓裝載站的晶圓承載件 ,.s Λ π戰件搬運器包括一水平導件 垂直移動效I’該水平導件可沿著多個平行的垂直導件做 從=圓端效器可沿著水平導件水平移動。為了 ^ 教戟站的移動輸送裝置（晶 圓艰載件輸送裝置）卸載晶圓承 件蒋叙n 科〒觸效器可沿著水平導 移動且其移動速度實質上配合 銶县眘》 回艰载件的速度’也 ，是實質配合晶圓承載件在水平方 外，娀姑Π上的移動速度。此 效器可保持在鄰近晶圓承載件的位 效器實質上可配合晶圓承載件的位置，:：如此，： N時實質配合晶圓 7 1358384 承載件的速度》同樣地，也可實質上配合輸送裝置的位置 及/或速度。 當端效器實質配合晶圓承載件的速度（及/或位置） 時，端效器會因水平導件沿著垂直導件向上移動而上升， 以致使端效器接觸晶圓承栽件並且使晶圓承載件脫離晶圓 承載件輪送裝置。同樣地，在裝載期Fe，，讓端效器與輪送 裝置的速度（及/或位置）實質上相匹配，可將晶圓承載件裝 載至移動晶圓承載件輸送裝置上。根據本發明，提出數種 設備和方法，以於發生諸如斷電或緊急關閉等意外事件 時將端效器從輸送裝置路徑上移開《這些設備和方法將 參照第9-1 1圖詳述於下。 美國專利申請案10/650,310號、西元2〇03年8月28 曰申請、標題為「用於傳輸基材承载件的系統（System F〇r TranSporting Substrate carriers)J 的申請案（代理人文件編 號6900)揭露了 一種基材承載件輸送系統該系統包括一 基材承載件輸送裝置，當其服務的製造設施運作時，該輸 送裝置將不停地移動。不停移動的輸送裝置將在製造設施 内輪送基材’故可縮短製造設施内各基材的總「滞留」時 間，進而減少WIP以及降低資本與製造成本。為了以此方 弋操作製造設施，需要提出用來在輸送裝置移動時，卸載 輸送裝置上之基材承載件及將基材承载件裝載至輸送裝置 上的方法和設備。 根據本發明至少一態樣，位於基材裝載站的基材承載 件搬運器包括一水平導件以及一端效器，該水平導件讦沿 8 1358384 著多個平行的垂直導杜击 工 直導件垂直移動，並且該端效器可沿著該 水平導件水平移動。為了從僂 仗得送基材承载件並經過基材裝 載站的移動輸送裝Manufacturing systems, and in particular automated substrate carrier transport devices, such as self-propelled aerial vehicles, overhead conveyor systems, substrate carrier handling mechanisms, etc., to move substrate carriers between locations within a manufacturing facility, or to transport The substrate carrier enters or exits the substrate carrier transport. In the case of a single substrate, the entire process from forming or receiving the original substrate to cutting the finished substrate into semiconductor components may take weeks or months. In a typical manufacturing facility, a large number of substrates will Become a semi-finished product in a specific room (WOrk in pr〇gress; Wlp). The manufacturing facility contains 5 1358384. Semi-finished substrates mean a considerable amount of working capital, and the cost of manufacturing each substrate. Therefore, it is expected that the number of WIPs can be reduced in terms of manufacturing facilities. To this end, the total time spent on the considerations should be shortened. SUMMARY OF THE INVENTION In some aspects, the present invention provides a system for loading and unloading a child in and out of a delivery system. The system includes a substrate holder for transferring a substrate carrier carrier between the docking station and the conveyor system, including: an end effector for supporting the substrate carrier; When the substrate carrier carrier is used to control the substrate carrier to move the substrate carrier, the substrate carrier carrier can be manipulated to engage and disengage the substrate carrier to enter and exit the delivery system; And coupled to the controller and used to provide information to the controller, the material carrier. If adjustments are to be made within the stroke of the substrate carrier carrier, the controller can be operated to adjust the operation of the substrate carrier carrier depending on the signal supplied. In other aspects, the present invention provides a method of loading and unloading a plant into a delivery system. The method includes: "" estimating. sensing the material of the substrate carrier being transported and gradually approaching; determining the type of substrate carrier of the substrate-by-substrate carrier; according to the information and base type, from at least two Stored mobile data. The earth proposes to set up a mountain _ table (select an unloading mobile data chart in motion; and the slave slave *^ remove the substrate carrier from the conveyor system with the selected moving data chart. Substrate • Substrate carrying carrier handling, piece; substrate end effector 'coupling' for end effector selection and sensing to indicate base loading or unloading sensor to carry substrate carrier The unloading of the system is closer to the material carrier profile). In the embodiment 6 1358384, the substrate type of the substrate carrier load is sensed in the substrate of the inlet and outlet wheel. Other delivery system carrier carrier support substrate substrates are adapted from the invention to the data transmission system and include additional information based on the unloading process of the substrate carrier carrier to adjust the unloading movement data chart. In one aspect, the present invention provides a method of loading and unloading a substrate carrier. The modal method includes: determining a substrate carrier supp〇rt; sensing information about the support member; sensing the type of the substrate carrier for the sn of the substrate carrier to be loaded onto the substrate Selecting a chart based on the second and second information and substrate loading of two stored moving data charts; and loading the substrate carrier with the selected loading data chart. Other features and aspects will become more apparent from the following detailed description and claims. [Embodiment] A wafer carrier located at a wafer loading station, the .s Λ π warfare carrier includes a horizontal guide vertical movement effect I'. The horizontal guide can be made along a plurality of parallel vertical guides. The round effector can be moved horizontally along the horizontal guide. In order to unload the wafer carrier of the mobile conveyor (wafer carrier transport device) of the teaching station, Jiang Xun, the 〒 〒 〒 〒 可 可 可 可 可 可 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 〒 The speed of the carrier is also the actual moving speed of the wafer carrier on the horizontal side. The effector can maintain the position of the bit effector adjacent to the wafer carrier substantially in cooperation with the wafer carrier:::, when substantially N, the speed of the carrier 7 7358384 carrier is substantially the same as The position and/or speed of the transport device is matched. When the end effector substantially matches the speed (and/or position) of the wafer carrier, the end effector will rise as the horizontal guide moves up the vertical guide such that the end effector contacts the wafer carrier and The wafer carrier is detached from the wafer carrier transfer device. Similarly, during the loading period Fe, the end effector is substantially matched to the speed (and/or position) of the wheeling device, and the wafer carrier can be loaded onto the moving wafer carrier transport device. In accordance with the present invention, several apparatus and methods are presented for removing an end effector from a conveyor path in the event of an accident such as a power outage or an emergency shutdown. "These devices and methods will be described in detail with reference to Figure 9-1. Below. U.S. Patent Application Serial No. 10/650,310, filed on August 28, 2003, entitled "System F〇r TranSporting Substrate carriers J" (Proxy Document Number) 6900) discloses a substrate carrier transport system that includes a substrate carrier transport device that will continuously move as the service facility it serves operates. The transport device that is moving will be at the manufacturing facility By internally feeding the substrate, the total "stagnation" time of each substrate in the manufacturing facility can be shortened, thereby reducing WIP and reducing capital and manufacturing costs. In order to operate the manufacturing facility in this manner, it is desirable to provide a method and apparatus for unloading the substrate carrier on the conveyor and loading the substrate carrier onto the conveyor as the conveyor moves. In accordance with at least one aspect of the present invention, a substrate carrier carrier at a substrate loading station includes a horizontal guide and an end effector, the horizontal guide 讦 along a plurality of parallel vertical guides and direct guides along 8 1358384 The piece moves vertically and the end effector is movable horizontally along the horizontal guide. In order to transport the substrate carrier from the crucible and move it through the substrate loading station

裝置（基材承載件輸送裝置）上卸載基材承 載件’ s利用基材承載件輸送裝置來傳輸基材承載件時， 端效器會沿著水平導件移動並且其速度實質上配合基材承 載件的速度，纟就是實質配合基材承載件在水平方向上的 移動速度…卜，當輸送基材承載㈣，端效器可保持鄰 近基材承載件。如&，端效器可實質配合基材承載件的位 置’同時實質配合基材承載件的速度。同樣地也可實質 配合輸送裝置的位置及/或速度。 當端效器實質配合基材承載件的速度（及/或位置） 時，端效器會因水平導件順著該等垂直導件向上移動而跟 著上升，以致使端效器接觸基材承載件，並且使基材承栽 件脫離基材承載件輸送裝置。同樣地，在裝載期間讓端致 器與輸送裝置的速度（及/或位置）實質上相匹配，則可將基 材承載件裝載至移動的基材承載件輸送裝置上。在本發明 至少一實施例中，端效器與基材承載件輸送裝置之間的基 材承載件遞交動作（handoff) ’是在端效器與基材承載件之 間的速度及/或加速度實質為零的情況下進行。本發明尚提 出許多其他態樣，其將進一步說明於下。 第1圖為傳統裝載與儲放設備111的上視平面圖，用 以在傳統處理工具Π3的鄰近處儲放基材承載件。工作介 面（FI) 115位於該裝載與儲放設備111與處理工具113之 間。裝載與儲放設備111設置在鄰接潔淨室壁面117的第 1358384Unloading the substrate carrier on the device (substrate carrier transport device) When the substrate carrier is transported by the substrate carrier transport device, the end effector moves along the horizontal guide and its velocity substantially matches the substrate The speed of the carrier, that is, the speed of the substrate carrier in the horizontal direction is substantially matched... When the substrate is carried (4), the end effector can be kept adjacent to the substrate carrier. For example, ', the end effector can substantially match the position of the substrate carrier' while substantially matching the speed of the substrate carrier. Similarly, the position and/or speed of the delivery device can be substantially matched. When the end effector substantially matches the speed (and/or position) of the substrate carrier, the end effector will rise as the horizontal guide moves up the vertical guides, causing the end effector to contact the substrate carrier. And disengaging the substrate carrier from the substrate carrier transport device. Similarly, the substrate carrier can be loaded onto the moving substrate carrier transport by substantially matching the speed (and/or position) of the end effector during loading. In at least one embodiment of the invention, the substrate carrier handoff between the end effector and the substrate carrier transport device is the speed and/or acceleration between the end effector and the substrate carrier. It is carried out in the case of substantially zero. The invention has been described in a number of other ways which will be further described below. Figure 1 is a top plan view of a conventional loading and storage device 111 for storing a substrate carrier adjacent to a conventional processing tool. A working interface (FI) 115 is located between the loading and unloading device 111 and the processing tool 113. The loading and storage device 111 is disposed adjacent to the clean room wall 117 at 1358384

一側邊之處，而工作介面115設置成鄰接潔淨室壁面U7 的第二側邊。工作介面包括FI機械手臂丨19，其可沿 著與潔淨室壁面117平行的軌道（未繪示）水平移動，並可 從位於該裝載與儲放設備111中的一或多個基材承載件 120内取出基材（未繪示）。FI機械手臂119可將基材傳送 到處理工具113的裝載鎖固室121。 第1圖的裝載鎖固室121連接至處理工具113的傳送 室123。處理室125和輔助處理室127亦連接傳送室123。 處理室125和輔助處理室127各自可用來進行傳統半導體 裝置製造製程，例如氧化、薄膜沉積、蝕刻、熱處理、除 氣、冷卻等。基材搬運機械手臂〗29設在傳送室123内， 用以於處理室125、127與裝載鎖固室121之間傳送基材（例 如基材131)。 裝載與諸放設備1U包括-或多個基材承載件儲At one side, the working interface 115 is disposed adjacent to the second side of the clean room wall U7. The working interface includes a FI robot arm 19 that is horizontally movable along a track (not shown) parallel to the clean room wall 117 and from one or more substrate carriers located in the loading and unloading device 111 The substrate (not shown) is taken out in 120. The FI robot arm 119 can transport the substrate to the load lock chamber 121 of the processing tool 113. The load lock chamber 121 of Fig. 1 is connected to the transfer chamber 123 of the processing tool 113. The processing chamber 125 and the auxiliary processing chamber 127 are also connected to the transfer chamber 123. The processing chamber 125 and the auxiliary processing chamber 127 are each available for conventional semiconductor device fabrication processes such as oxidation, thin film deposition, etching, heat treatment, degassing, cooling, and the like. A substrate handling robot arm 29 is disposed in the transfer chamber 123 for transferring a substrate (e.g., substrate 131) between the processing chambers 125, 127 and the load lock chamber 121. The loading and unloading device 1U includes - or a plurality of substrate carrier storage

133’以在處理工具113處理基材承載件内的基材之前或之 後，用來儲故基材承載件。裝載與儲放設備⑴還包括一 或多個停靠站，圖中来峥ψ & 丫衣.貧出停罪站，但可例如置於儲放架 133下方。基材承載件可俸贵 料作靠在停靠站，供以機械手臂ηί 自此取回基材。裝載與儲 興储放故備亦包括工作裝載位置 135，諸如自動導航車（agv、竺& 等基材承載件傳送裝置可在此 處卸下或拾起基材承載件。 裝载與儲放設備 用以於工作裝載位置 基材承载件》 111更包括基材承載件搬運器137, 135、儲放架133與停靠站之間移動 10 1358384 如同上述協助在製造設施内輪送基材之目的，期望利 p停移動的基材承載件輸^置來龍基材承載 :如裝載與儲放…u等基材裝載站，以例如縮短停留 間及減/ WIP與製造成本。故根據本發明，提出一種創 新的基材裝載m基材承載件輸送裝置移動時，卸載 基材承載件輸送裝置上的基材承載件，並且將基材承載件 裝載至基材承載件輸送裝置上。 本發明一實施例現將參照第2A_6E圖說明於下。第2a 圖為根據本發明所做之基材裝載站2〇1的正視圖。儘管第 2A圖未繪示，然仍應理解基材裝載站2〇1可結合第^圖所 述的處理工具及/或工作介面。 基材裝載站201可包括一或多個用來放置基材或基材 承栽件的裝載口或類似位置，例如一或多個停靠站2〇3， 藉以傳送基材進入及/或離開處理工具，當然也可採取不使 用停靠站/出塢（docked/undocked)來移動的傳送位置。在第 2A圖的特定實施例中’基材裝載站2〇1共包括八個停靠站 2〇3，其排成兩排205、每排四個停靠站203。也可採取其 他的排數及/或停靠站數量。每一停靠站2〇3用來支撐基材 承載件207及/或讓基材承載件207停靠在停靠站203，並 允許取出位在停靠站203之基材承載件207中的基材（未繪 示）’且例如利用工作介面機械手臂（如第1圖的工作介面 機械手臂119)將基材傳送到處理工具（如第1圖的處理工 具113)。在本發明一實施例中，基材承載件207為單片基 材承載件。「單片基材承載件」是指形狀與尺寸一次只能容 11 1358384 納單片基材的基材承載件。也可採用能容納—個以上之基 材（例如25片或更多）的基材承載件。或者，一或多個停靠 站203可用來直接支撐基材，而不使用基材承載件。停靠 站203的構造可參見例如美國專利申請案6〇/4〇7337號、 西元2002年8月31曰申請、名稱為「具停靠站之停靠握 爪的晶圓裝載站（Wafer Loading Stati〇I1 with D〇cking Grippers at Docking Stations)」的申請案（代理人文件編號 7099) ◊亦可採用其他停靠站構造。133' is used to store the substrate carrier before or after the processing tool 113 processes the substrate within the substrate carrier. The loading and unloading device (1) also includes one or more docking stations, which are located below the storage station, but can be placed, for example, below the storage rack 133. The substrate carrier can be placed against the docking station for the robot arm ηί to retrieve the substrate from here. The loading and storage storage also includes a work loading location 135, such as an automated navigation vehicle (agv, 竺 & substrate carrier transfer device where the substrate carrier can be removed or picked up. Loading and storage) The release device is used in the work loading position. The substrate carrier 111 further includes a substrate carrier carrier 137, 135, a movement between the storage rack 133 and the docking station 10 1358384, as described above, to assist in the transfer of the substrate in the manufacturing facility. It is expected that the substrate carrier of the mobile phone will be transported to the substrate carrier: such as loading and storage, etc., such as loading and unloading, etc., to shorten the stay and reduce / WIP and manufacturing costs, for example, according to the present invention. An innovative substrate loading m substrate carrier transport device is proposed to unload the substrate carrier on the substrate carrier transport device and load the substrate carrier onto the substrate carrier transport device. An embodiment will now be described with reference to Figures 2A-6E. Figure 2a is a front elevational view of a substrate loading station 2〇1 made in accordance with the present invention. Although not shown in Figure 2A, it is understood that the substrate loading station 2〇1 can be combined with the figure Processing tool and/or working interface. The substrate loading station 201 can include one or more load ports or the like for placing a substrate or substrate carrier, such as one or more docking stations 2〇3. The transfer substrate enters and/or exits the processing tool, although it is of course possible to take a transfer position that does not use docked/undocked movement. In the particular embodiment of Figure 2A, the substrate loading station 2〇1 A total of eight docking stations 2〇3 are arranged, which are arranged in two rows 205 and four docking stations 203. Each row number and/or number of docking stations can also be taken. Each docking station 2〇3 is used for supporting bases. The material carrier 207 and/or the substrate carrier 207 is docked at the docking station 203 and allows the substrate (not shown) located in the substrate carrier 207 of the docking station 203 to be removed and utilized, for example, by a working interface robot The working substrate (such as the working interface robot 119 of Figure 1) transports the substrate to a processing tool (such as the processing tool 113 of Figure 1). In one embodiment of the invention, the substrate carrier 207 is a single piece of substrate carrier. "Single-piece substrate carrier" means that the shape and size can only accommodate 11 135838 at a time. 4 Substrate carrier for nano-sheet substrates. Substrate carriers capable of accommodating more than one substrate (for example, 25 sheets or more) may also be used. Alternatively, one or more docking stations 203 may be used for direct support. Substrate, without the use of a substrate carrier. The construction of the docking station 203 can be found, for example, in U.S. Patent Application Serial No. 6/4,7,337, August 31, 2002, entitled "Docking Grip with a Stop" The application for Wafer Loading Stati〇I1 with D〇cking Grippers at Docking Stations (Agent Document No. 7099) ◊ Other docking stations can also be used.

每一停靠站203可包括接口 209，基材通過接口 2〇9 傳送到工作介面’如第1圖的工作介面U5。停靠握爪2Π 鄰接各接口 209 ’用以懸吊起基材承載件207並移動懸予 的基材承載件至停靠位置與出塢位置之間。可移動平台或 其他支撐件（未繪示）或可用來支撐基材承載件207 (例如 從下方或其他方位）及/或使各基材承載件207停靠/出瑪停 靠站203 ^每一接口 209還可包括一基材承載件開啟器 213;在一態樣中’當基材承載件207從出塢位置移到停靠 位置時，基材承載件開啟器2 1 3會利用基材承載件2〇7的 停靠移動來打開基材承載件207，相關内容描述於美國專 利申請案10/650,3 12號、西元2003年8月28曰申請、名 稱為「利用基材承載件移動打開/關閉基材承載件門的方法 及設備（Method and Apparatus for Using Substrate CarrierEach docking station 203 can include an interface 209 through which the substrate is transferred to the working interface ', such as the working interface U5 of Figure 1. The docking gripper 2 is adjacent to each of the interfaces 209' for suspending the substrate carrier 207 and moving the suspended substrate carrier between the docking position and the docking position. A movable platform or other support (not shown) may be used to support the substrate carrier 207 (eg, from below or other orientations) and/or to have each substrate carrier 207 docked/out of the docking station 203 ^ each interface 209 can also include a substrate carrier opener 213; in one aspect, when the substrate carrier 207 is moved from the docking position to the docking position, the substrate carrier opener 213 utilizes the substrate carrier The docking movement of 2〇7 is used to open the substrate carrier 207, and the related content is described in U.S. Patent Application Serial No. 10/650, No. 3, No. 28, 2003, entitled "Using the substrate carrier to move open/ Method and apparatus for using Substrate Carrier

Movement to Actuate Substrate Cattier DoorMovement to Actuate Substrate Cattier Door

Opening/Closing)」的申請案（代理人文件編號6976)。每_ 基材承載件207可能具有例如承載門閂及/或基材炎甜特 12 1358384 徵’此可參見美國專利申請案1 0/650,3 1 1號、西元2〇〇3 年8月28日申請、名稱為「具有門閂與基材夹鉗機構的基 材承載件（Substrate Carrier having Door Latching andApplication for Opening/Closing) (Agent File No. 6976). Each of the substrate carriers 207 may have, for example, a load-bearing latch and/or a substrate sinister 12 1358384. See also U.S. Patent Application Serial No. 10/650, No. 3, No. 2, Aug. 2, 2008 The Japanese application, entitled "Substrate Carrier having Door Latching and

Substrate Clamping Mechanism)」的申請案（代理人文件編 號7156)。也可採用其他基材承載件開啟器、門閃及/或基 材夾鉗結構。 基材裝載站201還包括根據本發明一態樣來運作的基 材承載件搬運器215。在本發明的一或多個實施例中，基 材承載件搬運器215包括一對垂直導件2〗7、219和一水平 導件221’水平導件221設置在垂直導件217、219上而可 進行垂直移動。驅動帶或導螺旋和相連的馬達（未繪示）或 其他適合機構可用來驅動水平導件221順著垂直導件 217、219垂直移動。支標件223設置在水平導件22ι上， 以/〇者水平導件221水平移冑。驅動帶《導螺旋和相連馬 達（未綠示）或其他適合機構可順著水平導件221水年地移 動支撐件223。 在本發明至少一實施例中，垂直導件2i7 2i9可各自 :含-整合式導件/驅動機構，例如可構自B_h公司的零 ::號m。-勝10、⑽毫米的導件/驅動機構。同樣地， :導件221可包含_整合式導件/驅動機構例如亦可構 I動Γ公司的零件編號⑽·崩.1G、㈣毫米的導件/ 動機構。也可採用其他導件/驅動機構系統。 端效器225設置名*祕μ 例 支撐件223上。端效器225的類型 妒1如為水平的平台297 m ’用以支撐基材承載件，例如基材 13 。在至少—實施例中，平台227可具 Pins)或其他運動定位特徵229。雖然 承載件207其中之一 有運動栓（kinematic 第2A圖僅繪示兩個運動定位特徵η、但平台227也可設 有如二個或更多其他數量的運動&或特徵。冑❺定位特徵 229可酉己0基材承載件2〇7底部的凹處或其他形狀之特徵 (第2A圖未繪示），將基材承載件2〇7引導至平台227上的 正確（正向）位置中。在本發明至少一實施例中，端效器225 包含例如能將基材承載件從垂直改成水平或從水平改成垂 直方向的端效器，其描述於美國專利申請案6〇/4〇7,452 號、西702 002年8月31日申請、名稱為「具有重新定位 晶圓承載件之垂直與水平之機構的端效器（End Effect〇rApplication for Substrate Clamping Mechanism) (Proxy Document No. 7156). Other substrate carrier openers, door flash and/or substrate clamp structures can also be utilized. Substrate loading station 201 also includes a substrate carrier carrier 215 that operates in accordance with an aspect of the present invention. In one or more embodiments of the present invention, the substrate carrier carrier 215 includes a pair of vertical guides 2, 219, and a horizontal guide 221'. The horizontal guides 221 are disposed on the vertical guides 217, 219. It can be moved vertically. A drive belt or lead screw and associated motor (not shown) or other suitable mechanism can be used to drive the horizontal guide 221 to move vertically along the vertical guides 217, 219. The support member 223 is disposed on the horizontal guide 22, and is horizontally moved by the horizontal guide 221. The drive belt "guide helix and connected motor (not shown in green) or other suitable mechanism can move the support member 223 along the horizontal guide 221 water year. In at least one embodiment of the invention, the vertical guides 2i7 2i9 may each comprise: an integrated guide/drive mechanism, such as zero:::m from B_h. - Win 10, (10) mm guide / drive mechanism. Similarly, the guide 221 may include an integrated guide/drive mechanism such as a part number (10), a collapsed 1G, and a (four) millimeter guide/moving mechanism. Other guide/drive mechanism systems can also be used. The effector 225 is set up on the support member 223. The type of end effector 225 妒1 is a horizontal platform 297 m ' for supporting a substrate carrier, such as substrate 13. In at least an embodiment, the platform 227 can have Pins or other motion localization features 229. Although one of the carriers 207 has a motion pin (the kinematic Figure 2A shows only two motion positioning features η, the platform 227 can also be provided with two or more other numbers of motions & or features. 229 may be a recess or other shape feature at the bottom of the substrate carrier 2〇7 (not shown in FIG. 2A) to guide the substrate carrier 2〇7 to the correct (forward) position on the platform 227 In at least one embodiment of the present invention, the end effector 225 includes, for example, an end effector that can change the substrate carrier from vertical to horizontal or from horizontal to vertical, as described in U.S. Patent Application Serial No. 6/ Application No. 4,7,452, West 702, 002, August 31, 002, "End Effect〇r with a vertical and horizontal mechanism for repositioning the wafer carrier"

Having Mechanism For Reorienting a Wafer CarrierHaving Mechanism For Reorienting a Wafer Carrier

Between Vertical and Horizontal Orientations)」的申請案 (代理人文件編號7079)。也可使用其他適合的端效器。 一連續式或他種移動輸送裝置231置於基材裝載站 201和基材承載件搬運器215上方。輸送裝置231用來傳 送基材承載件（例如基材承載件20 7)進出基材裝載站 20卜在本發明一實施例中，連續移動輸送裝置231可使用 不鏽鋼或類似材料組成的傳送帶，其描述於美國專利申請 案號10/764,982、西元2004年1月26曰申請、名稱為「輸 送基材承載件的方法及設備（Methods and Apparatus forBetween Vertical and Horizontal Orientations) (Proxy Document No. 7079). Other suitable end effectors can also be used. A continuous or other type of moving conveyor 231 is placed over the substrate loading station 201 and the substrate carrier carrier 215. The conveying device 231 is used to convey the substrate carrier (for example, the substrate carrier 20 7) into and out of the substrate loading station 20. In an embodiment of the invention, the continuous moving conveyor 231 can use a conveyor belt composed of stainless steel or the like. The method and apparatus for transporting a substrate carrier are described in U.S. Patent Application Serial No. 10/764,982, issued Jan. 26, 2004.

Transporting Substrate Carriers)」的申請案（代理人文件編 號7163)。本發明同樣可採用其他類型的連續或其他移動 輸送裝置。 14 1358384 基材裝载站201可包括一或多個感測器233、235,用 以偵測下列幾者的.移動及/或位i :⑴輸送裝置⑺輸送 裝置23 1之组件（例如用來支撐輸送裝置231所傳輸之基材 承載件的組件，此將進—步參照第4A_4E圖、第6a 6e圖、 和第7C-7D圖說明於下）、及/或（3)輸送裝置231所傳輸之 基材承載件的移動及/或位置。例如，感測器233可設在基 材裝載站201上，感测器235則可設在端效器⑵上。任 一適合的感測器（例如穿透型感測器、反射型感測器等）也 可設在其他感測位置上。 第2B圖為基材裝載站2〇1的部分側視圖，其繪示感 測器233的一實施例。參照第2B圖，感測器⑴包含第 一感測器組233a ' 23 3a，，用以偵測輸送裝置231的速度 及/或位置，及/或基材承載件的位置，及/或由輸送裝置 傳輸基材承載件207的速度，其將詳述於下。感測器 還可包括第二感測器組233b、233b’，用以偵測基材承栽 件207是否由輪送裝置231傳輸。例如，第一感測器級 23 3a、23 3 a’可設在輪送裝置231的一高度處，而第二及 欺i剛 器組233b、233b’可設在如第2B周所示輪送裝置231傳輪 基材承載件的高度處（例如經由連接基材裝載站2〇1 骨 架F的托架B、或經由其他適當的架設機構各感測 可包含例如購自Banner公司且型號為M123E2LDQ的光、原 和型號為Q23SN6RMHSQDP的接收器。也可採用其他 、 、 欺I琪 器配置/類型。感測器2 3 5的一實施例將進一步參照第2仁e 圖及第3圖說明於下。 15 1358384 控制器237(第2A圖）可耦接至感測器233、235和基 材承載件搬運器215，以接收來自感測器233 235的輸入 並控制基材承載件搬運器215的運作，此將進一步說明於 後。可使用一個以上或少於二個感測器2 3 3、2 3 5，且感測 器233、235可設置於第2八及2B圖所示位置以外的位置。 控制器237可以是用來控制基材裝載站2〇1所服務之處理 工具運作的控制器，或為獨立的控制器。Application for Transporting Substrate Carriers) (Agent Document No. 7163). Other types of continuous or other moving conveyors are equally contemplated by the present invention. 14 1358384 The substrate loading station 201 can include one or more sensors 233, 235 for detecting movement and/or position i of: (1) conveying device (7) components of the conveying device 23 1 (eg, To support the assembly of the substrate carrier transported by the transport device 231, which will be further described with reference to Figures 4A-4E, 6a6e, and 7C-7D, and/or (3) transport device 231 The movement and/or position of the substrate carrier being transported. For example, sensor 233 can be located on substrate loading station 201 and sensor 235 can be placed on end effector (2). Any suitable sensor (e.g., a transmissive sensor, a reflective sensor, etc.) can also be placed at other sensing locations. 2B is a partial side elevational view of the substrate loading station 201, which illustrates an embodiment of the sensor 233. Referring to FIG. 2B, the sensor (1) includes a first sensor group 233a' 23 3a for detecting the speed and/or position of the transport device 231, and/or the position of the substrate carrier, and/or by The conveyor transports the speed of the substrate carrier 207, which will be described in detail below. The sensor may further include a second sensor group 233b, 233b' for detecting whether the substrate holder 207 is transported by the transfer device 231. For example, the first sensor stages 23 3a, 23 3 a' may be located at a height of the wheeling device 231, and the second and the second group of arms 233b, 233b' may be located at the wheel as shown in the 2nd week. The height of the delivery device 231 of the transfer substrate carrier (eg, via the carrier B that connects the substrate loading station 2〇1 skeleton F, or via other suitable mounting mechanisms, may include, for example, from Banner, and the model number is The optical, original and model of the M123E2LDQ is the receiver of the Q23SN6RMHSQDP. Other configurations can also be used. The embodiment of the sensor 253 will be further described with reference to the second and third figures. 15 1358384 The controller 237 (Fig. 2A) can be coupled to the sensors 233, 235 and the substrate carrier carrier 215 to receive input from the sensor 233 235 and control the substrate carrier carrier The operation of 215, which will be further described later, may use more than one or less than two sensors 2 3 3, 2 3 5, and the sensors 233, 235 may be disposed at the positions shown in Figures 2 and 2B. The controller 237 can be used to control the processing tool transported by the substrate loading station 2〇1. Controller, or as a separate controller.

在本發明至少一實施例中，可直接測量輸送裝置及/ 或由輸送裝置傳輸之基材承載件的速度，而非利用感測器 233間接測量輸送裝置的速度。例如，如第2a圖所示，一 或多個編瑪器240a、240b(此將說明於後）可叙接至輸送裝 置23丨，並直接測量輸送裝置231和其所傳輸之任一基材 承載件的速度，並且提供速度資訊給控制器237。可使用 一個U上或少於二個編碼器。每一編碼器可包括例如美國 數位編碼器（如HDS6正交編碼器）或其他適合的編碼器。In at least one embodiment of the invention, the speed of the delivery device and/or the substrate carrier transported by the delivery device can be directly measured, rather than indirectly measuring the velocity of the delivery device using sensor 233. For example, as shown in FIG. 2a, one or more coderes 240a, 240b (which will be described later) can be coupled to the transport device 23A and directly measure the transport device 231 and any substrate it transports. The speed of the carrier and the speed information is provided to the controller 237. One U or less than two encoders can be used. Each encoder may include, for example, a US digital encoder (e.g., HDS6 quadrature encoder) or other suitable encoder.

線性編碼器、解析器或其他定位裝置亦可用來測量輸送裝 置的速度及/或位置。 3圖為根據本發明之基材裝載站2〇1所執行的製程 實施例流程圖，用以自輸送裝置231卸載晶圓承載件2〇7。 第4A-4E圖為側面示意圖，其顯示帛3圖製程的不同階段。 當執行從輸送裝置231上卸載晶圓承載件2〇7的操作 時，基材承载件搬運器215的水平導件221位於垂直導件 217、219之上端2l7a、219a附近，支撐件223則位於水 平導件221的上游端221a附近，參見第2八圖的左側，但 16 1358384 若輪送裝置231由右向左移動，也可採取從右邊到左邊的 行進模式》Linear encoders, resolvers or other positioning devices can also be used to measure the speed and/or position of the conveyor. 3 is a flow chart of an embodiment of a process performed by a substrate loading station 201 in accordance with the present invention for unloading the wafer carrier 2〇7 from the transport unit 231. Figure 4A-4E is a side schematic view showing the different stages of the 帛3 diagram process. When the operation of unloading the wafer carrier 2〇7 from the conveying device 231 is performed, the horizontal guide 221 of the substrate carrier carrier 215 is located near the upper ends 197a, 219a of the vertical guides 217, 219, and the support member 223 is located Near the upstream end 221a of the horizontal guide 221, see the left side of Figure 2, but 16 1358384. If the transfer device 231 is moved from right to left, the travel mode from right to left can also be adopted.

第3圖製程始於步驟301且繼續進行至步驟3 03。在 步驟303中，控制器237接收例如來自感測器233或235 的訊號’用以指示由輸送裝置231傳輸且由基材裝載站201 自輪送裝置231卸載之基材承載件2〇7是否存在（目標基材 承載件207) »例如參照第2B圖，當目標基材承載件207 阻擋住感測器組233b'233b’的光束l時，感測器組233b、 23 3b’可偵測到目標基材承載件2〇7 ^ 一旦接收感測器的訊 號’控制器237控制基材承載件搬運器215，使支撐件 223(和與之連接的端效器225)順著與輸送裝置231行進方 向相同的方向加速移動，例如往第2A圖的右邊移動，因 而實質配合目標基材承載件207的位置與速度（第3圖的步 驟305)。第4A圖繪示第3圖製程的此階段。The process of Fig. 3 begins at step 301 and proceeds to step 303. In step 303, the controller 237 receives, for example, a signal 'from the sensor 233 or 235' indicating whether the substrate carrier 2〇7 transported by the transport device 231 and unloaded by the substrate loading station 201 from the transfer device 231 is Existence (target substrate carrier 207) » For example, referring to FIG. 2B, sensor group 233b, 23 3b' can be detected when target substrate carrier 207 blocks beam 1 of sensor group 233b' 233b' To the target substrate carrier 2〇7 ^ Once the sensor's signal 'controller' 237 controls the substrate carrier carrier 215, the support member 223 (and the end effector 225 connected thereto) is followed by the delivery device The direction of travel of 231 in the same direction of acceleration is accelerated, for example, to the right of FIG. 2A, thus substantially matching the position and speed of the target substrate carrier 207 (step 305 of FIG. 3). Figure 4A shows this stage of the process of Figure 3.

在本發明至少一實施例中，在加快端效器225速度以 實質配合目標基材承載件207的位置與速度之前（步驟 3〇5)，控制器237先利用感測器233(或一或多個編碼器 240a、240b)來測定輸送裝置231的速度。藉此也可測定出 輸送裝置231的位置》如上述，感測器233可包含第一感 測器組233a、233a’（第2Β圖），用以谓測輸送裝置23ι的 速度，及/或輸送裝置231傳輸基材承载件2〇7的速度，並 且包含第二感測器組233b、233b，，用以俄測基材承載件 207是否正由輸送裝置23丨所傳輸。可在卸載各目 承載件207之前或期間，定期地、連續第或間隔地測定速 17 1358384 度及/或位置。 依據輸送裝置23 1的速度，控制器237可決定端效器 225的移動數據圖表，並根據移動數據圖表引導端效器225 的動作而使端效器225與目標基材承載件2〇7的速度和位 置實質相配合。可「預先決定」移動數據圖表，如此當輸 送裝置231的速度落在預定速度範圍内時（例如依據預定 移動數據圖表加速、移動、及/或放置端效器225時，能確 定端效器225將適當對準目標基材承載件2〇7的範圍），控 制器237只許端效器225開始執行卸載操作（例如開始加 速）；否則，會結束第3圖的製程，即使未測量輸送裝置 23 1的速度，例如假設輸送裝置23丨的速度維持在可確保 當依據預定移動數據圖表加速端效器225時，端效器225 將適當對準目標基材承載件207的預定速度範圍内時，也 可採用此預定的移動數據圖表。 控制器237可利用輸送裝置231的速度決定端效器 225的移動數據圖表，例如使用預定移動數據圖表的査 表、使用演算法計算移動數據圖表等。將可理解到，可經 測量基材承載件速度（而非輸送裝置速度）並且利用它來決 定移動數據圖表，或判斷是否採用端效器225的預定移動 數據圖表。每個移動數據圖表可包括端效器225於卸載操 作期間採行的加速、減逮、升高和降低情形（將描述於下卜 如上述，在本發明至少一實施例中，輸送裝置23丨可 包含一帶狀傳送帶（例如由不鏽鋼或其他適合材料组成” 其描述於美國專利申請案1〇/764 982號、西元2〇〇4年^ 18 1358384 月26曰申請、名稱為「輸送基材承載件的方法及設備 (Methods and Apparatus for Transporting Substrate Carriers)」的申請案（代理人文件編號7163)。在此實施例 中’輸送裝置231可設有多個沿著輸送裝置231以預定間 隔排列的狹缝或其他開口（例如第.2B圖的狹缝23 1 a)，感 測器組233a、233a’（第2B圖）的光束可穿過該些狭缝或開 口，就像感測器组233a、233a，穿越輸送裝置231的狹缝 般。藉由測量感測器組2 3 3 a、2 3 3 a，之光束連續傳過輸送 裝置231(通過輸送裝置的二連續狹缝）的間隔時間以及已 知二連續狹缝的間距’可決定出輸送裝置231的速度》各 基材承載件2 07上方的狹缝231a位置（第2C圖）亦可為控 制器237提供輪送裝置231及/或基材承載件207的位置資 訊。 在本發明一或多個實施例中，編碼器240a、240b(第 2A圖）可用來直接讀取輸送裝置速度。例如，各编碼器 2 40a、2 40b可提供輸送裝置的速度資訊給控制器237，控 制器237則比較來自編碼器24〇a、24〇b的資訊，以當作檢 查錯誤或保障方法（confidence r〇utine)的一部分。可定 期、連續或間隔地監測速度。藉著直接測量輸送裝置速度 (例如利用一或多個編碼器或其他定位裝置），和透過感測 器2 3 3 (例如配合狹縫231&)決定傳送帶位置，當輸送裝置 23 1移動時，可精確地執行在端效器225與輸送裝置231 之間遞交基材；^載件的動作，此將進一步說明於下。 在第4Α圖中’輸送裝S 23 1利用-承載件嚙合構件 19 1358384 4〇1傳輸目標基材承載件207，承載件嚙合構件4〇丨嗜合住 基材承載件2 07的上凸緣402。也可採用其他支樓基材承 載件207的結構’例如一或多個從承載件側邊、底部等處 來支樓基材承載件207的機構。承載件嚙合構件4〇丨的構 造描述於美國專利申請案10/764,820號、西元2004年j 月26日申請、名稱為r用於懸甲基材承載件的高架傳送凸 緣及支撐件（Overhead Transfer Flange and Supp〇rt f〇rIn at least one embodiment of the invention, prior to speeding up the end effector 225 to substantially match the position and velocity of the target substrate carrier 207 (step 3〇5), the controller 237 first utilizes the sensor 233 (or one or The plurality of encoders 240a, 240b) measure the speed of the transport device 231. Thereby, the position of the conveying device 231 can also be determined. As described above, the sensor 233 can include the first sensor group 233a, 233a' (Fig. 2) for weighing the speed of the conveying device 23, and/or The conveyor 231 transports the speed of the substrate carrier 2〇7 and includes a second sensor group 233b, 233b for detecting whether the substrate carrier 207 is being transported by the transport device 23A. The speed 17 1358384 degrees and/or position may be measured periodically, continuously, or at intervals before or during the unloading of each of the mesh carriers 207. Depending on the speed of the transport device 23 1 , the controller 237 can determine the movement data graph of the end effector 225 and direct the end effector 225 to the target substrate carrier 2 〇 7 according to the action of the mobile data chart guide end effector 225 . Speed and position are essentially matched. The mobile data graph can be "predetermined" such that when the speed of the transport device 231 falls within a predetermined speed range (e.g., according to a predetermined mobile data graph, the end effector 225 can be determined when the end effector 225 is accelerated, moved, and/or placed. The controller 237 will only perform the unloading operation (for example, start acceleration); otherwise, the process of FIG. 3 will be ended even if the conveying device 23 1 is not measured. The speed, for example, assumes that the speed of the transport device 23 is maintained to ensure that when the end effector 225 is properly aligned within the predetermined speed range of the target substrate carrier 207 when the end effector 225 is properly accelerated according to the predetermined movement data graph, This predetermined mobile data chart can be used. The controller 237 can use the speed of the transport device 231 to determine a map of the movement data of the effector 225, such as a lookup using a predetermined movement data graph, a calculation of a movement data graph using an algorithm, and the like. It will be appreciated that the substrate carrier speed (rather than the conveyor speed) can be measured and used to determine the movement data chart or to determine whether to use the predetermined movement data chart of the end effector 225. Each of the mobile data graphs may include acceleration, mitigation, elevation, and decrement conditions that the end effector 225 employs during the unloading operation (described above), in at least one embodiment of the present invention, the delivery device 23丨A belt conveyor (for example, made of stainless steel or other suitable material) may be included. It is described in U.S. Patent Application Serial No. 1/764,982, filed at PCT No. Application of Apparatus and Apparatus for Transporting Substrate Carriers (Attorney Docket No. 7163). In this embodiment, the 'conveying device 231 may be provided with a plurality of arranged at predetermined intervals along the conveying device 231. a slit or other opening (such as slit 23 1 a of Fig. 2B) through which the beams of the sensor groups 233a, 233a' (Fig. 2B) can pass, just like a sensor Groups 233a, 233a, traversing the slits of the transport device 231. By measuring the sensor groups 2 3 3 a, 2 3 3 a, the beams are continuously transmitted through the transport device 231 (through the two continuous slits of the transport device) Interval and known two The spacing of the slits 'determines the speed of the conveying device 231 ′′ the position of the slit 231 a above the substrate carrier 207 ( FIG. 2C ) may also provide the controller 237 with the feeding device 231 and/or the substrate carrier. The position information of the piece 207. In one or more embodiments of the invention, the encoders 240a, 240b (Fig. 2A) can be used to directly read the conveyor speed. For example, each encoder 2 40a, 2 40b can provide delivery. The speed information of the device is given to the controller 237, which compares the information from the encoders 24a, 24b as part of a check error or guarantee method. It can be periodically, continuously or intermittently. Speed monitoring. By directly measuring the speed of the conveyor (for example using one or more encoders or other positioning devices), and by means of sensors 2 3 3 (for example with the slits 231 &), the conveyor position is determined, when the conveyor 23 1 When moving, the substrate can be accurately delivered between the end effector 225 and the transport device 231; the action of the carrier, which will be further explained below. In the fourth diagram, the transport device S 23 1 utilizes-bearing Piece engaging member 19 1358 384 4. The transmission target substrate carrier 207, the carrier engaging member 4 is adapted to fit the upper flange 402 of the substrate carrier 206. Other structures of the base substrate carrier 207 may also be employed. Or a plurality of mechanisms for supporting the substrate carrier 207 from the sides, bottoms, etc. of the carrier. The configuration of the carrier engaging member 4 is described in U.S. Patent Application Serial No. 10/764,820, Jan. 26, 2004 Application, name r for overhead conveyor flanges and supports for suspended mesh carriers (Overhead Transfer Flange and Supp〇rt f〇r

Suspending Substrate Carrier)」的申請案（代理人文件編號 8092) 〇 箭頭403指示輸送褒置231的移動方向。基材承載件 搬運器215的端效器225缘示於第4Α圖，其位於目標基 材承載件207下方，並順著與輸送裝£叫相同的方向移 動（如箭頭405所指方向）且其速度實質上配合目標基材承 載件207的速度。因此，端效器225實質上與目標基材承 載件207的速度相配，例如在速度與方向上相配合。另 端效器225實質上與目標其鉍是莸丛。n/7 t ’Application of Suspending Substrate Carrier) (Attorney Docket No. 8092) 箭头 Arrow 403 indicates the moving direction of the transporting device 231. The end effector 225 of the substrate carrier carrier 215 is shown in FIG. 4, which is located below the target substrate carrier 207 and moves in the same direction as the transport device (as indicated by arrow 405) and The speed substantially matches the speed of the target substrate carrier 207. Thus, the end effector 225 substantially matches the speed of the target substrate carrier 207, such as in speed and direction. The other end effector 225 is substantially the same as the target. n/7 t ’

丹曰稞基材承載件207的位置相匹配。 更廣泛地說，端效器225眘皙μ»»人。 〇實質上配合目標基材承載 的移動（速度及/或位置）。右屮张游 直）在此所稱之「實質配合」是 分配合使得基材承栽件可卸巷白^ 卞»卸載自及/或裝载至移動輪 置及/或承載件嚙合構件上，而不 1送裝 材及/或形成可能造成傷害的微粒。 的丞 在第4A圖的實施例中，目 目標基材承載件207隨葚铪 送裝置231移動。故，端效呀著輸 蜎效器225亦實質配合輸送裝 的速度、速率、移動及/哎仿罟 . 1 戈位置。在-些實施例中，輪送裝 20 13^8384 置231以不同於目標基材承載件207的速度移動。例如， 承載件嚙合構件401本身可沿著輸送裝置231移動目標基 材承载件20 7。在後述實施例中，端效器225實質上可 配合輪送裝置231的速度、速度、及/或位置。 ° 在本發明—或多個實施例中，端效器225可能玫置在 與該觸發或啟動感測器（例如第2Β圖的感測器組2m、 3b )不相同的位置處，該感測器係用來偵測輸送裝置Η】 上之目標基材承载件2G7的存在。在此例中，在步驟3〇5 可能需延遲加速端效器225，以補償端效器225和觸發感 ^器的位置差異°「啟動偏移量（launeh offset)」取決於例 如端效器225與觸發感測器之間的距離輸送裝置的 速度等因素。啟動偏移量可獨立建立，或是建入端效器225 的移動數據圖表中。 再次參照第3圖，步驟307乃偵測目標基材承載件2〇7 ，對於端效器2 2 5的位置，例如利用感測器2 3 5提供之訊 號來偵測之(第2A圖)。舉例而言，若感測肖23 5包含諸如 可取自Banner公司且型號為QS3〇之感測器系統等光源/ 偵測器組’感測器23 5可朝向目標基材承载件2〇7發射光 束，並且僅當端效器225相對目標基材承載件2〇7位於適 當位置時.感测器2 3 5才能偵測到光束（例如藉著使基材承 載件207具有適當反射面及/或表面地形，例如具有角凹 口，其僅當端效器225相對目標基材承載件2〇7適當定位 時才能將光線反射到感測器23 5)。第2C圓為端效器225 的局部立體圖，其繪示感測胃235的-實施例，於端效器 21 1358384 225相對於目標基材承載件2〇7適當定位時，感測器235 可偵測從部分目標基材承載件207之凹口 243反射出的光 束241(第2D圖）。第2D圖為第20圖的局部放大立體圖。 如第2C-2D圖所示，感測器235可經由適當托架或其他支 榜結構247核接至端效器225。其他構造也可採用β 在本發明之至少一實施例中，若端效器225未相對於 目標基材承載件207做適當定位，則會結束第3圖製程。 或者’在本發明另一實施例中’可依需求調整端效器225 相對目標基材承載件207的位置（步驟309)。例如，控制 器237可加快及/或減慢端效器225速度，直到感測器23 5 接收到適當對準訊號，以確保運動栓229(第4Α圖）適當地 置於目標基材承載件207的對準特徵下方，例如凹面或其 他形狀之特徵407。將可理解步驟307和步驟3〇9是在目 標基材承載件207和端效器22 5移動的時候進行，並使端 效器225位於目標基材承載件2〇7下方，同時實質配合二 速度如此^目標基材承載件207移動時，端效器225 仍在鄰接目標基材承載件2〇 7的下方移動。 將可理解’目標基材承載件207和端效器225的相對 位置可能經多次（或持續地）偵測及調整，且回饋控制迴路 (例如’第2Α圖所示感測器233、235及/或編碼器24〇a、 24〇b提供訊號且傳送給耦接至控制基材承載件搬運器21 5 之端效器225速度與位置的控制器237)可用來確保端效器 225的速度及/或位置實質上仍與目標基材承載件相 配在本發明又一實施例中，可省略步驟3〇7和步驟 22 1358384 和端效器225啟動時間/ 在此實施例中，可省略 例如，當採用與輸送裝置23 1速度 位置相關的預定移動數據圖表時。 感測器235 。 取代感測器23 5或除了感測器 Z 4 5以外，可使用編堪 盗240a及/或240b來監測卸載/装恭从知 戰裝載刼作期間的輪送裝置 速度。控制器237可回應卸载/裝載摔 勒诔作期間的輸送裝置速 度總偏差(gross ―)而中止卸載/裝載㈣， 用另-種能破保端效器225不會干擾輸送裝置231或旦正 在傳輸之基材承載件的移動數據圖表。總偏差可包括：種 差異’其中目標基材承載件2〇7/承載件嗔合構件如 效器225之間的速度差異太大，而無法 热古在基材承載件搬運 器215的「一次路程（stroke)」（例如端效器225的水平 動範圍）内進行調整。換言之，假如目標基材承載件加 行進太快’以致目標基材承載件2G7經過基材承載件搬運 器215時，端效器225不能配合目標基材承載件的速度， 則控制器237可藉由不提高端效器225來放棄卸載操作。 或者，當無輪送裝置速度總偏差時，控制器237可調 整端效器的位置（例如利用加速或減速），以確定卸載（或裝 載）操作適當進行β因此，儘管輸送裝置速度有偏差，勺括 端效器225、感測器233、編碼器24〇a及/或'及/或 控制器237的封閉迴路回饋系統還是可確保卸載（或裝 操作適當進行。 在一些實施例中，可使用封閉迴路回饋系統與開放迴 路回饋系統的組合。在採用開放迴路回饋系統的實施例 23 中，基材承載件搬運器215的控制器237可接收來自一或 ^個感測器233、235及/或編碼器240a、240b的訊號，並 I依捸訊號來啟動端效器225的預定移動數據圖表。在一 —實施例中，預定移動數據圖表可選自儲存於控制器237 中的移動數據圖表資料庫。所選出的數據圖表最符合承載 207的尺寸及/或類型，及/或符合恰在基材承載件2〇7/承 載件嚙合構件401抵達基材承載件搬運器215 於輪送裝置231上所測得的輪送裝置231速度。在(=) 施例中，承載207的類型可指出承載件形狀承載件大小、 載件尺寸、承載件的特徵、承載件重量、承載件可支樓 最大基材數量、承載狀態（例如裝滿程度）、嚙合類型、 及/或運動特徵等。 採用封閉迴路回饋系統的實施例中，基材承載件搬 運器215的控制器237接收來自—或多個感測器233、235 及/或編瑪器240a、24OV»沾切站 过，上 4〇b的訊唬，並依據訊號持續且動態 地調整端效器225的移動數據圖表。端效器225上（或與端 效器225同步移動)的感測器2”可在整個$效器225的移 動路程中’連續（或多次）偵測基材承載件207/承載件唾合 構件401的類型、位置及/戋速声，光、至山次 且久,：¾迷度，並送出資訊給控制器 237,如此控制器237可動態調整端效器225的速度及/或 位置，以配合基材承載# 2Q7/承載件唾合構件術。同樣 地，編瑪器24Ga、2杨可在端效器出移動路程中，連續 (或多次）提供基材承載伴 刊不戰件207/承载件嚙合構件4〇1的位置 及/或速度，並送出資訊认姑在丨獎 贝貝巩m控制器237 ,如此控制器237可 24 1358384 動態調整端效器225的速度及/或位置，以配合基材承栽件 2〇7/承載件嚙合構件4〇1。 在結合封閉迴路回饋系統與開放迴路回饋系統的組合 系統中，先依據設置於輸送裝置231路徑上之基材承載件 搬運器215位置前（或位於端效器移動路程之起點）的感測 器23 3所提供的訊號選擇及啟動一移動數據圖表，接 田 基材承載件207 /承載件嚙合構件401移動通過整個端效器 移動路程時，可依據來自感測器23 3、235及/或編碼器 240a、240b的訊號動態調整所挑選的移動數據圖表。在— 些實施例中，端效器225上及/或基材承載件2〇7上的附加 感測器（未繪示）可偵測其他條件，並且控制器2 3 7可根據 這些其他條件動態調整移動數據圖表。例如，基材承載件 207上的衝擊感測器（如換能器）可用來偵測端效器225施 加於基材承載件207上超過可接受臨界值的力量大小。感 測器可耦接至用來發送訊號給控制器237的無線發射器， 以指示應調整端效器225位置來減低施加力量，或應中止 傳送。 假設端效器225乃相對於目標基材承載件2〇7適當定 位’則接著第3圖製程之步驟307及/或步驟309之後進行 步驟311。在步驟311中，控制器237控制基材承載件搬 運器215來升高端效器225，例如水平導件221在垂直導 件217、2 19上升高以抬起端效器225，同時持續使端效器 225的水平移動速度（及/或即時位置）實質匹配目標基材承 載件的速度及/或即時位置》升高的端效器225可使其運動 25 1358384 鎖229嗜合目標基材承載件207底部的凹面特徵4〇7。因 此端效器225移動到輸送裝置231傳輪基材承載件2〇7的 高度。如此一來，端效器225會接觸目標基材承載件2〇7 底部（如第4B圖所示）。在本發明一或多個實施例中，端效 器225較佳以實質為零的速度及/或加速度接觸目標基材 承載件207’此將進一步參照第8A_D圖說明於後。當端效 器225持續被提高，同時端效器繼續使其水平移動速度及/ 或位置實質配合目標基材承載件207時，目標基材承載件 2〇7(尤其是其上凸緣402)會被抬高而脫離輸送裝置231的 承載件嚙合構件401，如第4C圖所示》 接著在第3圖的步驟313中，控制器237控制基材承 載件搬運器215’以稍微減慢端效器225的水平移動速度， 進而減慢目標基材承載件207速度。減速程度仍可讓目標 基材承載件207繼續沿著箭頭4〇3所指方向移動，但速度 比輸送袭置231慢。如第4D圖所示，承載件嚙合構件 4〇1(其已嚙合目標基材承載件2〇7的凸緣4〇2)藉此可移到 凸緣402前面。承載件嚙合構件4〇1 一旦移離凸緣4〇2下 方（如第4D圖所示），端效器225可再次加速，使得端效器 22 5和其支撐之目標基材承載件2〇7的水平移動速度再度 實質配合輸送裝置23 1的水平移動速度，以免輸送裝置231 傳輸的另一基材承載件（例如第4D圖中的基材承載件4〇9) 撞到目標基材承載件207» 第3圖的步驟3 15為降低端效器225，例如順著垂直 導件217'219降低水平導件221，以降低目標基材承載件 26 207而離開輸送裝置咕 件9n<7 。第4E圖繪示降低目標基材承載 ζυ7的情形。已 接裟”上 茅目標基材承載件207的端效器225 接著可減速至停止, θThe position of the tannin substrate carrier 207 is matched. More broadly, the end effector 225 carefully 皙μ»» people. 〇 Substantially matches the movement (speed and/or position) carried by the target substrate.屮 屮 游 ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) ) Instead of sending the material and/or forming particles that may cause damage. In the embodiment of Fig. 4A, the target substrate carrier 207 is moved with the feeding device 231. Therefore, the end effect is to lose the effector 225 is also in line with the speed, speed, movement and / / imitation of the transport equipment. 1 Ge position. In some embodiments, the wheel set 20 231 is moved at a different speed than the target substrate carrier 207. For example, the carrier engaging member 401 itself can move the target substrate carrier 20 7 along the transport device 231. In the embodiments described below, the end effector 225 can substantially match the speed, speed, and/or position of the transfer device 231. ° In the present invention - or in various embodiments, the end effector 225 may be placed at a different location than the trigger or activation sensor (eg, the sensor set 2m, 3b of FIG. 2) The detector is used to detect the presence of the target substrate carrier 2G7 on the conveyor. In this example, the acceleration end effector 225 may need to be delayed in step 3〇5 to compensate for the position difference of the end effector 225 and the trigger sensor. “Launeh offset” depends on, for example, the effector. 225 and the distance between the trigger sensor and the speed of the conveyor. The startup offset can be established independently or built into the mobile data graph of the end effector 225. Referring again to FIG. 3, step 307 detects the target substrate carrier 2〇7, and detects the position of the end effector 2 25, for example, by using the signal provided by the sensor 253 (FIG. 2A). . For example, if the sensing mode 23 5 includes a light source/detector group sensor 25 such as a sensor system that can be taken from Banner and model QS3, the sensor 23 5 can face the target substrate carrier 2〇7 The beam is emitted, and only when the effector 225 is in position relative to the target substrate carrier 2〇7, the sensor 235 can detect the beam (eg, by having the substrate carrier 207 have an appropriate reflective surface and / or surface topography, for example with angular notches, which can only reflect light to the sensor 23 5 when the end effector 225 is properly positioned relative to the target substrate carrier 2〇7. The 2C circle is a partial perspective view of the end effector 225, which illustrates an embodiment of sensing the stomach 235. When the end effector 21 1358384 225 is properly positioned relative to the target substrate carrier 2〇7, the sensor 235 can The light beam 241 reflected from the notch 243 of the partial target substrate carrier 207 is detected (Fig. 2D). Fig. 2D is a partially enlarged perspective view of Fig. 20. As shown in Figures 2C-2D, sensor 235 can be interfaced to end effector 225 via a suitable carrier or other support structure 247. Other configurations may also employ β. In at least one embodiment of the present invention, if the end effector 225 is not properly positioned relative to the target substrate carrier 207, then the process of Figure 3 is terminated. Alternatively, in another embodiment of the invention, the position of the end effector 225 relative to the target substrate carrier 207 can be adjusted as desired (step 309). For example, the controller 237 can speed up and/or slow down the end effector 225 until the sensor 23 5 receives the appropriate alignment signal to ensure that the motion pin 229 (Fig. 4) is properly placed on the target substrate carrier. Below the alignment feature of 207, for example, a concave or other shaped feature 407. It will be understood that step 307 and step 3〇9 are performed while the target substrate carrier 207 and the end effector 22 5 are moved, and the end effector 225 is positioned below the target substrate carrier 2〇7, while substantially matching the two When the speed of the target substrate carrier 207 is moved, the end effector 225 is still moving below the target substrate carrier 2〇7. It will be understood that the relative positions of the target substrate carrier 207 and the end effector 225 may be detected and adjusted multiple times (or continuously), and the feedback control loop (eg, the sensor 233, 235 shown in FIG. 2) And/or the encoders 24a, 24〇b provide signals and transmit to the controller 237) coupled to the end effector 225 speed and position of the control substrate carrier carrier 21 5 to ensure the effectiveness of the end effector 225 The speed and/or position is still substantially matched to the target substrate carrier. In yet another embodiment of the invention, step 3〇7 and step 22 1358384 and the end effector 225 startup time may be omitted/in this embodiment, may be omitted For example, when a predetermined movement data chart relating to the speed position of the conveyor 23 1 is employed. Sensor 235. Instead of the sensor 23 5 or in addition to the sensor Z 4 5, the hacker 240a and/or 240b can be used to monitor the speed of the unloading/loading device during the loading operation. The controller 237 can suspend the unloading/loading (four) in response to the total deviation of the conveyor speed during the unloading/loading operation (gross ―), and the other end can prevent the delivery device 231 from interfering with the conveying device 231 or A mobile data chart of the substrate carrier being transported. The total deviation may include: a kind of difference 'where the speed difference between the target substrate carrier 2〇7/carrier coupling member 225 is too large, and cannot be heatd up once in the substrate carrier carrier 215 The adjustment is made within the stroke (eg, the horizontal range of the effector 225). In other words, if the target substrate carrier is traveling too fast 'so that the target substrate carrier 2G7 passes through the substrate carrier carrier 215, the end effector 225 cannot match the speed of the target substrate carrier, the controller 237 can borrow The unloading operation is abandoned by not raising the end effector 225. Alternatively, when there is no total deviation of the wheeling device speed, the controller 237 can adjust the position of the end effector (eg, using acceleration or deceleration) to determine that the unloading (or loading) operation is properly performed. Therefore, despite the deviation of the conveyor speed, The closed loop feedback system of the effector 225, the sensor 233, the encoder 24A and/or the 'and/or the controller 237 can still ensure unloading (or the loading operation is properly performed. In some embodiments, Using a combination of a closed loop feedback system and an open loop feedback system. In an embodiment 23 employing an open loop feedback system, the controller 237 of the substrate carrier carrier 215 can receive from one or more sensors 233, 235 and / or the signals of the encoders 240a, 240b, and I rely on the signal to initiate the predetermined movement data graph of the effector 225. In an embodiment, the predetermined movement data graph may be selected from the mobile data stored in the controller 237. Chart database. The selected data chart best fits the size and/or type of the load bearing 207, and/or conforms to the substrate carrier 2〇7/carrier engagement member 401 reaching the substrate carrier. The speed of the transfer device 231 measured on the transfer device 231. In the (=) embodiment, the type of the load bearing 207 may indicate the size of the carrier shape carrier, the size of the carrier, the characteristics of the carrier, and the carrier. Weight, the maximum number of substrates that the support can support, the state of load (eg, fullness), the type of engagement, and/or the motion characteristics, etc. In the embodiment employing a closed loop feedback system, the control of the substrate carrier carrier 215 The 237 receives the signal from the - or the plurality of sensors 233, 235 and/or the coder 240a, 24OV», and the upper 4 〇b, and continuously and dynamically adjusts the effector 225 according to the signal. Moving the data chart. The sensor 2" on the effector 225 (or moving synchronously with the end effector 225) can 'continuously (or repeatedly) detect the substrate carrier 207 throughout the path of the effector 225. /The type, position and/or idle speed of the carrier salvage member 401, light, to the mountain and for a long time: 3⁄4, and send information to the controller 237, so that the controller 237 can dynamically adjust the effector 225 Speed and / or position to match the substrate bearing # 2Q7 / carrier salvage member Similarly, the coder 24Ga, 2 yang can continuously (or repeatedly) provide the position of the substrate carrying the non-competitive member 207 / carrier engaging member 4 〇 1 in the moving path of the end effector and/or Speed, and send the information to the aunt to praise the Bebegong m controller 237, so the controller 237 can 24 1358384 dynamically adjust the speed and / or position of the end effector 225 to match the substrate carrier 2〇7 / bearing The engaging member 4〇1. In the combined system combining the closed loop feedback system and the open loop feedback system, the substrate carrier carrier 215 is disposed in front of the path of the conveying device 231 (or is located at the end effector moving path). The signal provided by the sensor 23 of the starting point selects and activates a moving data chart. When the receiving substrate carrier 207 / carrier engaging member 401 moves through the entire end effector, it can be based on the sensor 23 3 The signals of 235 and/or encoders 240a, 240b dynamically adjust the selected mobile data graph. In some embodiments, additional sensors (not shown) on the end effector 225 and/or on the substrate carrier 2〇7 can detect other conditions, and the controller 273 can be based on these other conditions. Dynamically adjust the mobile data chart. For example, an impact sensor (e.g., transducer) on substrate carrier 207 can be used to detect the amount of force applied by end effector 225 to substrate carrier 207 beyond an acceptable threshold. The sensor can be coupled to a wireless transmitter for transmitting signals to controller 237 to indicate that the end effector 225 should be adjusted to reduce the applied force or to abort the transmission. It is assumed that the end effector 225 is properly positioned with respect to the target substrate carrier 2A, then step 311 is followed by step 307 and/or step 309 of the third process. In step 311, the controller 237 controls the substrate carrier carrier 215 to raise the end effector 225, for example, the horizontal guide 221 is raised on the vertical guides 217, 219 to lift the end effector 225 while continuing to end. The horizontal moving speed (and/or the instantaneous position) of the effector 225 substantially matches the speed and/or the instantaneous position of the target substrate carrier. The raised end effector 225 can move it 25 1358384. The lock 229 is compatible with the target substrate. The concave feature 4 〇 7 at the bottom of the piece 207. Therefore, the end effector 225 is moved to the height of the conveying device 231 conveying substrate carrier 2〇7. As such, the end effector 225 will contact the bottom of the target substrate carrier 2〇7 (as shown in FIG. 4B). In one or more embodiments of the invention, end effector 225 preferably contacts target substrate carrier 207' at substantially zero speed and/or acceleration as will be further described with reference to Figures 8A-D. When the end effector 225 is continuously raised while the end effector continues to have its horizontal moving speed and/or position substantially mated with the target substrate carrier 207, the target substrate carrier 2〇7 (especially its upper flange 402) The carrier engaging member 401, which will be lifted off the conveyor 231, as shown in FIG. 4C. Next, in step 313 of FIG. 3, the controller 237 controls the substrate carrier carrier 215' to slightly slow down the end. The horizontal movement speed of the actuator 225, which in turn slows down the speed of the target substrate carrier 207. The degree of deceleration still allows the target substrate carrier 207 to continue to move in the direction indicated by arrow 4〇3, but at a slower rate than the transport attack 231. As shown in Fig. 4D, the carrier engaging member 401 (which has engaged the flange 4 〇 2 of the target substrate carrier 2 〇 7) can thereby be moved to the front of the flange 402. Once the carrier engaging member 4〇1 is moved under the flange 4〇2 (as shown in FIG. 4D), the end effector 225 can be accelerated again, so that the end effector 22 5 and its supporting target substrate carrier 2〇 The horizontal moving speed of 7 again substantially matches the horizontal moving speed of the conveying device 23 1 so as to prevent another substrate carrier (for example, the substrate carrier 4〇9 in Fig. 4D) transported by the conveying device 231 from hitting the target substrate. Step 207» Step 3 of Figure 3 15 is to lower the end effector 225, for example to lower the horizontal guide 221 along the vertical guide 217'219 to lower the target substrate carrier 26 207 away from the transport device element 9n < . Figure 4E illustrates the reduction of the target substrate carrying ζυ7. The end effector 225 that has been connected to the upper target substrate carrier 207 can then be decelerated to a stop, θ

Ba 5 , (第3圖的步驟317)。如所述，在本發 主少一實施 述端效器出的知/ 25的移動數據圖表可定義上 圖表範例將參昭第8Α、广速、升高和降低情形。移動數據 …'第8A-8D圖說明於後。 在步驟319中，糞从， ^ , &材承載件搬運器215可將端效器22 5Ba 5 , (step 317 of Figure 3). As mentioned, in the present invention, the implementation of the description of the mobile data chart can be defined. The chart example will refer to the eighth, wide speed, rise and fall scenarios. Mobile Data ... '8A-8D is illustrated below. In step 319, the manure from the ^, & material carrier carrier 215 can be used to effect the effector 22 5

所支撐的目標甚 、材承载件207傳送到其中一個停靠站 ζυ3(第2A圖）。弗去 ^ _ 右裝載站201包括一或多個倚放架 或其他儲放位置（·你丨 (J如第2Α圖的儲放架23 9，用以儲放基 材承载件），則其2 & 材承載件搬運器215可將目標基材承載件 207傳送到其φ _加灿 ' 個儲玫位置。其他及/或更多儲放位置也 可採用第3圖製程接著結束於步驟321。The supported target and material carrier 207 is transferred to one of the stops ζυ3 (Fig. 2A).弗去^ _ The right loading station 201 includes one or more yokes or other storage positions (· you 丨 (J, as shown in Figure 2, the storage rack 23 9 for storing the substrate carrier), then The 2 & material carrier carrier 215 can transport the target substrate carrier 207 to its φ _ 灿 ' storage position. Other and / or more storage positions can also use the process of Figure 3 and then end in the steps 321.

假設目標基材承載件207被帶到其中一個停靠站 2〇3貝！基材承載件搬運器215可將目標基材承載件207 遞父給對應停靠站2G3的停靠握爪211。目標基材承載件 207接著停靠在停靠站2〇3，且利用停靠站2们的基材承载 件開啟器213打開目標基材承載# 207，以利用諸如第i 圖之FI機械手f 119等基材搬運器來取出目標基材承載件 2〇7中@目標基材。取出的基材可傳送到連接基材装載站 201的處理工具（例如第i圖的處理工具113)，且處理工具 可進行或多個製程來處理基材。處理工具執行完製程 後，基材可送回位於停靠站2〇3的目標基材承載件， 然後目標基材承載件2〇7可關閉並且離開停靠站。基 27 1358384 材承載件搬運器215接著可將目標基材承載件2〇7傳離停 靠站203’並傳到輸送裝置231正下方的位置，例如假設 基材承載件207將送回輸送裝置231、而非放到諸如儲放 位置239的儲放位置。即，隨著端效器225支撐之基材承 載件207’水平導件221可於垂直導件217、219之上端 217a、219a附近移動’而支撐件223可移到水平導件221 的上游端221a。基材承載件207接著可傳回到輸送裝置 2 3 1 ’此將參照第5 - 6 E圖說明於下。 現將參照第5-6E圖來說明根據本發明將目標基材承 載件207裝載至輸送裝置231上的製程實施例。第5圖為 基材承載件裝載製程的流程圖。第6A-6E圖為側面示意 圖’其顯示第5圖製程的不同階段。 第5圖製程始於步驟5〇1且繼續進行至步驟5〇3。在 步驟503中，控制器237接收例如來自感測器233或 的訊號，用以指示在輸送裝置231中是否存在有空的承載 件嚙合構件401。在步驟5〇5中，控制器237回應此訊號 而控制基材承載件搬運器215，使端效器225(以及其上= 傳送至輪送裝置23丨的目標基材承載件乃沿著水平導件 加速以實質配合空承載件嚙合構件4〇1(及/或輸送裝置 的移動。例如，端效器225實質上可配合空承載；喷 ς彳4〇1水平移動的速度與位置。如前述，在一或多個 實施例中1效器225可能不與觸發感測器（例如第2 的感測器組233b、233b’)設置在相同位置。在此例中，可 能需要在步驟505中延遲加速端效器225,以補償端效器 28 1358384 225和觸發（或啟動）感測器的位置差異。 在本發明至少—實施例中，於加快端效器225速度以 實質配合空承載件噛合構件4〇1的位置與速度之前（步驟 5〇5),控制器23 7利用感測器233或一或多個耦接至輸送 裝置231的編碼器240a、240b來測定輸送裝置231的速 度。藉此也可測定輪送裝置231的位置。依據輸送裝置 的速度，控制器237可決定端效器225的移動數據圖表， 並根該據移動數據圖表來引導端效器225的動作，使端效 器225(和其上之目標基材承載件207)的速度和位置可與 該空承載件嚙合構件4〇1實質相匹配，該目標基材承載件 207將會裝載至空承載件唾合構件術上。可「預先決定」 移動數據圖4,如此只有當輸送裝£231的&纟落在預定 速度範圍内時（例如依據預定移動數據圖表加速端效器 225時能確定端效器225將適當對準空承載件嚙合構件 401的範圍時）’控制器237允許端效器225開始執行裝載 操作（例如開始加速）；否則，結束第5圖製程。 或者控制器237可利用輪送裝置231的速度，例如 使用預疋移動數據圖表的查纟、使用演算法計算移動數捸 圖表等方式，來決定端效器225的移動數據圖纟。將可理 解承載件嚙合構件速度（而非輪送裝置速度）可測量並且 用來決定移動數據圖表、或判斷是否採用端效器225的預 疋移動數據圖表。每個移動數據圖表可包括端效器225於 裝載操作期間採行的加速、減速、升高和降低情形（將描述 於下）。移動數據圖表範例將參照第8A_8D圖說明於後。 29 1358384 第6A圖繪示端效器225以實質配合輸送裝置23ι和 目標基材承載件207之凸緣4〇2的速度移動其中凸緣々Μ 位於承載件嚙合構件401下方且略位於其後方，該承载件 嚙合構件401將裝載上目標基材承载件2〇7。如此可在傳 送目標基材承載件2Q7至輸送裝£ 231期間，抬高目標基 材承載件207,且承載件嗜合構件4〇1不會阻擋住Z緣 4〇2(將說明於下）。目標基材承載件2()7之凸緣如―般可Assume that the target substrate carrier 207 is brought to one of the stops 2〇3! The substrate carrier carrier 215 can hand the target substrate carrier 207 to the docking grip 211 of the corresponding docking station 2G3. The target substrate carrier 207 is then docked at the docking station 2〇3, and the target substrate carrier #207 is opened by the substrate carrier opener 213 of the docking station 2 to utilize the FI robot f 119 such as the i-th image. The substrate carrier removes the @target substrate from the target substrate carrier 2〇7. The removed substrate can be transferred to a processing tool (e.g., processing tool 113 of Figure i) that is coupled to substrate loading station 201, and the processing tool can perform a process or a plurality of processes to process the substrate. After the processing tool has finished the process, the substrate can be returned to the target substrate carrier at the docking station 2〇3, and then the target substrate carrier 2〇7 can be closed and exit the docking station. The base 27 1358384 material carrier carrier 215 can then pass the target substrate carrier 2〇7 away from the docking station 203' and to a position directly below the conveyor 231, for example, assuming that the substrate carrier 207 will be returned to the conveyor 231 Instead of being placed in a storage location such as storage location 239. That is, the substrate carrier 207' horizontal guide 221 supported by the end effector 225 can move near the upper ends 217a, 219a of the vertical guides 217, 219 and the support member 223 can be moved to the upstream end of the horizontal guide 221 221a. The substrate carrier 207 can then be transferred back to the delivery device 2 3 1 ' which will be described below with reference to Figures 5-6E. A process embodiment for loading a target substrate carrier 207 onto a transport device 231 in accordance with the present invention will now be described with reference to Figures 5-6E. Figure 5 is a flow chart of the substrate carrier loading process. Figures 6A-6E are side schematic views showing different stages of the process of Figure 5. The process of Figure 5 begins at step 5〇1 and proceeds to step 5〇3. In step 503, the controller 237 receives, for example, a signal from the sensor 233 or to indicate whether or not there is an empty carrier engaging member 401 in the conveying device 231. In step 5〇5, the controller 237 responds to the signal to control the substrate carrier carrier 215 such that the end effector 225 (and the target substrate carrier on which it is transferred to the transfer device 23丨 is horizontal) The guide is accelerated to substantially cooperate with the empty carrier engaging member 4〇1 (and/or the movement of the delivery device. For example, the end effector 225 can substantially cooperate with the empty load; the velocity and position of the horizontal movement of the sneeze 4〇1. As described above, the one-effect device 225 may not be placed in the same position as the trigger sensor (eg, the second sensor group 233b, 233b') in one or more embodiments. In this example, it may be required at step 505. The medium delays the speed effector 225 to compensate for the difference in position of the end effector 28 1358384 225 and the trigger (or start) sensor. In at least an embodiment of the present invention, the speed of the end effector 225 is accelerated to substantially match the empty load. Before the position and speed of the engaging member 4〇1 (step 5〇5), the controller 23 7 determines the conveying device 231 by using the sensor 233 or one or more encoders 240a, 240b coupled to the conveying device 231. Speed. The position of the transfer device 231 can also be determined by this. The speed of the sending device, the controller 237 can determine the movement data chart of the end effector 225, and guide the action of the end effector 225 according to the moving data chart, so that the end effector 225 (and the target substrate carrier thereon) The speed and position of 207) can be substantially matched with the empty carrier engaging member 〇1, and the target substrate carrier 207 will be loaded onto the empty carrier salvage member. It can be "predetermined" to move the data. Thus, it is only possible to determine that the end effector 225 will properly align with the range of the empty carrier engaging member 401 when the <<>> The controller 237 allows the end effector 225 to begin performing a loading operation (e.g., to begin acceleration); otherwise, it ends the process of Figure 5. Alternatively, the controller 237 can utilize the speed of the routing device 231, such as using a pre-moving mobile data chart. The algorithm is used to calculate the moving data graph of the end effector 225. It can be understood that the speed of the carrier engaging member (rather than the speed of the transport device) can be measured and A pre-emptive movement data chart used to determine the movement data chart, or to determine whether to employ the end effector 225. Each of the movement data charts may include acceleration, deceleration, rise and fall conditions that the end effector 225 employs during the loading operation ( This will be described below. An example of a mobile data chart will be described later with reference to Figures 8A_8D. 29 1358384 Figure 6A illustrates the end effector 225 to substantially engage the delivery device 23i and the flange 4〇2 of the target substrate carrier 207. The speed is moved wherein the flange 々Μ is located below and slightly behind the carrier engaging member 401, and the carrier engaging member 401 will be loaded with the target substrate carrier 2〇7. Thus, during the transfer of the target substrate carrier 2Q7 to the transport device 231, the target substrate carrier 207 is raised, and the carrier fitting member 4〇1 does not block the Z edge 4〇2 (described below) . The flange of the target substrate carrier 2 () 7 is as

設在任意位置處，該任意位.置係容許目標基材承载件2〇7 提高’又不會接觸到即將裝載目標基材承載件2()7之承載 件Μ構件401以及跟隨著待裝載上目標基材承載件207 之承載件嚙合構件401的承載件嚙合構件（及/或其上之基 材承載件）即可。Provided at any position, the arbitrary position allows the target substrate carrier 2〇7 to be increased 'without contacting the carrier member 401 to be loaded with the target substrate carrier 2() 7 and following the loading to be loaded The carrier engaging member (and/or the substrate carrier thereon) of the carrier engaging member 401 of the upper target substrate carrier 207 may be used.

步驟5〇5之後為步冑5〇7，在步称5〇7中可例如利用 第2A圖的感測器235來感測目標基材承载件2〇7與承載 件嚙合構件4〇1的相對水平位置。例如，若感測器235包 含光源/偵測器组，感測器23 5可朝向空承載件嚙合構件 二(或輸送裝£ 231)發射光束’並且僅當端效器225相對 ; 栽件嚙。構件4〇1適當定位時（如先前第2C2D圖 所述般）’感測器23 5才能该測到光束。如上述，可使用各 種封閉和開放迴路回饋配置。 圖為端效器225的局部立體圖，其繪示用來偵 :承載件嚙合構件401之部位249的感測器23 5 ,該部位 49二來將承載件嚙合構# 4〇1耦接至輸送上。 特別疋，承载件嚙合構件401的部位249包含有一凹口 30Step 5〇5 is followed by step 5〇7, in which the sensor substrate 235 of FIG. 2A can be used to sense the target substrate carrier 2〇7 and the carrier engaging member 4〇1, for example. Relative horizontal position. For example, if the sensor 235 includes a light source/detector set, the sensor 23 5 can emit a light beam toward the empty carrier engaging member 2 (or transport 231) and only when the end effector 225 is opposite; . When the member 4〇1 is properly positioned (as previously described in Figure 2C2D), the sensor 23 can measure the beam. As noted above, a variety of closed and open loop feedback configurations are available. The figure is a partial perspective view of the end effector 225, which shows a sensor 23 5 for detecting the location 249 of the carrier engaging member 401, which couples the carrier engagement structure #4〇1 to the transport on. In particular, the portion 249 of the carrier engaging member 401 includes a notch 30

I3583M 251，凹口 25 1具有一自声LV狄壯此 ^ ^ ^ ;裝載插作期間當端效器225 適备定位在承載件嚙合構件 媒私从l 士 卜万時，將感測器235所 發射的光束241反射回感測器23 八他構造也可採用。 或多個編瑪器⑽、鳩或其他直接測量輸送裝 置速：的定位裝置可(例如連續地)提供此資訊給控制器 237,藉此控制器237可 裝置的位置。 裝載(或卸載冶作期間追縱輸送 在本發明至少一實施例中，若端效器225未相對於空 承載件唾合構件4〇1適當定位，則結束第5圖製程。或者， 在本發明另—實施例中，在步驟5〇9 +，可依需求調整目 標基材承載件207和承載件嘴合構件4〇1的相對水平位置 (例如’確保當目標基材承載件2〇7如下述般升高時凸緣 術不會接觸承載件鳴合構件4〇1)。例如，控制器237可 加快及，或減慢端效器225速度，直到接收到來自感測器 235的適當對準訊號為止。在位置調整期間目標基材承 載件207的水平移動速度實質上仍保持與輪送裝置以丨及/ 或承載件唾合構件4〇1的水平移動速度相[酉己。在本發明 又一實施例令，例如當採用與輸送裝置231速度及/或端效 器225啟動時間/位置相應的預定移動數據圖表時可省略 步禅507和步驟509。在此實施例中，可不使用感測器235。 假設端玫器225相對空承載件嚙合構件4〇1適當設 置’則在步驟川及可見於第6B圈中，藉由順著垂直導 件2丨7、219(第2A圖）升高水平導件221可抬高端效器 225,如此目標基材承载件2〇7且特別是其上凸緣4〇2會提 31 1358384 高到承載件合構件401的高度。如第6B圖所示，凸緣 402略位於承載件嚙合構件401上方（例如用以裝載於構件 401上，此將詳述於下）。 接著’如步驟513及第6C圖所示，目標基材承載件 207加速’以將目標基材承載件207之凸緣4〇2帶到輸送 裝置231之承載件响合構件4〇1上方。目標基材承載件2〇7 接著減速’使得目標基材承載件2 07的水平移動速度再次 實質配合輸送裝置23 1的水平移動逮度。然後，如第6d 圖及步雜515所示’端效器225下降且同時繼續實質配合 輸送裝置231的水平移動速度’使目標基材承載件2〇7之 凸緣402嚙合輸送裝置231之承載件嚙合構件4〇1，進而 將目標基材承載件207遞給承載件嚙合構件401 ◊在本發 明一或多個實施例中，目標基材承載件207較佳以實質為 零的速度及/或加速度來接觸承載件嚙合構件4〇1，此將進 一步參照第8A-8B圖說明於後。基材承載件搬運器215在 控制器237的控制下，將持續降低端效器225且例如同時 繼續實質配合輸送裝置23 1的水平移動速度，促使端效器 225的運動銷229脫離目標基材承載件2〇7底部的特徵 4〇7。第6E圖繪示步驟5 1 7的實施結果。 端效器225脫離目標基材承載件2〇7後，在步驟519 中，端效器225減速（例如乃至停止），然後結束第5圖製 程（步騍521)。·同時，藉由輸送裝置231之承載件嚙合構 件4〇1透過目標基材承載件207的凸緣4〇2來支樓目標基 材承栽件207，輸送裝置231將目標基材承載件2〇7傳離 32 1358384 裝載站201。如所述，在本發明至少—實施例中，端效器 22 5的移動數據圖表可定義上述端效器225的加速減速、 升高和降低情形。 因此，根據本發明提供之基材裝載站2〇1和特別是在 控制器237控制下運作的其β , 作的基材承載件搬運器215乃用來將 基材承載件從移動中的輸送裝 疋裝置上卸載下來，以及將基材 承載件裝載至移動中的輸送桊 耵钶廷裝置上。如此，此創新的基材 裝載站和基材承載_件搬運器可站· 益了减少製造設施内的基材停留 時間、WIP和流動資本與製造成本。 根據本發明，控制器237可經程式化來施行第3圖及/ 或第5圖的製_。此外，第3圖與第5圖的製程可内建在 或多個電腦程式產品中。電腦可利用電腦可讀取的媒體 來執行每個電腦程式產品，你丨1 & 飞座 例如載波訊號、軟碟、硬碟、 隨機存取記憶體等。 在本發明至少一實祐你丨φ 貫施*例中’該創新的基材裝載站20 1 可於發生斷電、緊备關胡莖t 豕总關閉等事件時，自動縮回端效器 225(將說明於後）以遠雜給祕肚斯 遢離輸送裝置231。例如，控制器237 可包括端效器縮回當彳， 策式 以因應諸如斷電、緊急關閉等意 外事件而自動從輸送萝罟2飞v ^ ” 疋装置231上縮回端效器225(及/成水 平導件221)再者，可偏移端效器225(及/或水平導件 221)，以於移除基材梦恭吐l 打瑕載站2〇1之電源時，自動縮回端效 器225(及/或水平導件221)。諸如彈簧、重力、氣動汽紅、 滚珠螺桿、導螺旋等任何適合的偏移機構皆可採用。上述 端效器縮回常式例如可實施成—或多個電腦程式產品。 33 x^8384 可能影響基材裝載站201設計的參數例子例如 輪送#署·击# () 的 <裝置速度；（2)基材承載件搬運器215移動端效器225 水平及/或垂直速度：（3)施加到基材承載件搬運 器22 5的水平及/或垂直加速度和減速度；（4)基材 承載件搬運器215之端效器225的水平與垂直移動範圍； 5)輪送裝置231所傳輸之相鄰基材承載件2〇7之間的間 2 : (6)輸送裝置231傳輸基材承載件2〇7的高度；⑺^ 承載件207應抬高以清空用於傳輸基材承載件2〇7之輸 、袭置23 1之承載件喝合構件4〇1的垂直距離 ::件207的高度(例如垂直尺寸);⑺基材承載件二： =件喃合構件401後’必須降低基材承載件2〇7使得 2裝置231所傳輸之基材承载件能通過已放開之基材承 低跑Γ7且不會撞到已放開之基材承載件207所需要的降 ::離；⑽所採用的承載件喝合構件類型；及 他類似參數。 J丹 例如’在本發明至少一會 ,,^ 實施例中，該創新的基材承載 件搬運器215應能约（1)達到 戰 双盗225的最大水平移動速 又，且此速度大於或等於輸送 ⑺抬高端效器225至足以使：：置231的水平移動速度； 主疋以使基材承載件207從輸 裁件喃合構件術上脫離 從輸送裝置承 移除的同度，（3)以二種或多種 水平速度移動’例如以配入給4壯堪土 配。輸送裝置速度的第一水平速度 和用來輸送基材承载件2〇7、*山土 什207進出停靠站203的第二水平速 度來移動；（4)以二種或吝接 載件207脫雜龄浮# 冑直速度移動’例如使基材承 戰件207脫離輸送裝置— β丄 1 231或是使將基材承載件207遞交 34 1^^8384 給輪送裝置231的® & 的第一垂直速度來移動，和以用以輸送基 承載件207進出停靠站203的第二垂直速度來移動：及/ 或（）加^及減慢端效器225所支撐之基材承載件207的速 度(供基材承載件嚙合或脫離輸送裝i 231)，並且不會損 壞基材承載件207内的基材。 同樣地，基材承載件搬運器215應能操作降低其端效 器225至夠飫站古电 约低的问度，以供最低停靠站2〇3使用。若有低 ;最低停罪坫203的儲放架或其他儲放位置，基材承載件 搬運器215則應進-步降低端效器225以供最低儲放架/ 位置使用。水平導件221上之端效器225的水平移動範圍 和用於移動端效器225的機構應賦予端效器225可加速至 實質配合輸送裝置速度的水平速度、使基材承載件2〇7脫 離及/或嚙合輸送裝置231(並避免與其他輪送装置231所 傳輸之基材承載件相撞），以及在水平導件221所提供的可 用水平移動範圍内減慢速度直至停止的能力。 一或多個基材裝載站f施例當可包括冑分s戈所有上述 特徵/參數。 設計基材裝載站201之特定實施例及/或程式化控制 器23 7(第2A圖）所需加以考量的各種因子和參數現將夹照 第7A-7D圖說明於下。第7A及7B圖為類似第2圖之基材 裝載站201的簡化正視圖。第7C_7D圖為類似第Μ α圖 和第6A-6E圓之基材承載件於嚙合及/或脫離輪送裝置a” 期間的簡化側面示意圖》 . 第7A圖繪示基材承載件搬運器215之端效器225的 35 1358384 水平移動範圍。位在端效器225沿著基材承載件搬運器215 之水平導件221移動至最上游極限位置7〇1的端效器225 和支撐件223係以實線表示。位在端效器225沿著水平導 件221移動至最下游極限位置7〇2的端效器225和支撐件 223則以虛線表示。第7A圖的距離Dhr代表端效器225 的最大水平移動範圍。I3583M 251, the notch 25 1 has a self-accurate LV Di Zhuang ^ ^ ^; during the loading and insertion period, when the end effector 225 is properly positioned in the carrier engagement member media from the l sb, the sensor 235 The emitted beam 241 is reflected back to the sensor 23. Eight configurations can also be employed. Or a plurality of coder (10), cymbal or other direct measuring device speed: the positioning device can (e.g., continuously) provide this information to controller 237, whereby controller 237 can be positioned. Loading (or unloading during tracking) In at least one embodiment of the invention, if the end effector 225 is not properly positioned relative to the empty carrier salvage member 4〇1, the process of Figure 5 is terminated. In another embodiment, in step 5〇9+, the relative horizontal position of the target substrate carrier 207 and the carrier nozzle member 4〇1 can be adjusted as needed (eg, 'ensure when the target substrate carrier 2〇7 The flange will not contact the carrier ringing member 4〇1) when raised as follows. For example, the controller 237 can speed up, or slow down, the end effector 225 until it receives the appropriate from the sensor 235. Aligning the signal. The horizontal moving speed of the target substrate carrier 207 during the position adjustment remains substantially the same as the horizontal moving speed of the ball feeding device and/or the carrier salivating member 4〇1. In another embodiment of the present invention, step 507 and step 509 may be omitted, for example, when a predetermined movement data chart corresponding to the speed of the delivery device 231 and/or the activation time/position of the end effector 225 is employed. In this embodiment, Use sensor 235. Assume end of the rose 2 25 relatively empty carrier engaging member 4〇1 is appropriately disposed 'in the step Chuan and can be seen in the 6B circle, by raising the horizontal guide 221 along the vertical guide 2丨7, 219 (Fig. 2A) The high-end effector 225, such that the target substrate carrier 2〇7 and in particular its upper flange 4〇2 will raise 31 1358384 to the height of the carrier member 401. As shown in Figure 6B, the flange 402 is slightly located Above the carrier engaging member 401 (eg, for loading on the member 401, as will be described below). Next, as shown in steps 513 and 6C, the target substrate carrier 207 is accelerated to carry the target substrate. The flange 4〇2 of the piece 207 is brought over the carrier splicing member 4〇1 of the conveying device 231. The target substrate carrier 2〇7 is then decelerated' so that the horizontal moving speed of the target substrate carrier 207 is again substantially matched The horizontal movement of the conveying device 23 1. Then, as shown in Fig. 6d and step 515, 'the end effector 225 descends while continuing to substantially match the horizontal moving speed of the conveying device 231' to the target substrate carrier 2〇7 The flange 402 engages the carrier engaging member 4〇1 of the conveying device 231, and further The target substrate carrier 207 is fed to the carrier engaging member 401. In one or more embodiments of the invention, the target substrate carrier 207 preferably contacts the carrier engaging member 4 at substantially zero speed and/or acceleration. 〇1, which will be further described with reference to Figures 8A-8B. The substrate carrier carrier 215, under the control of the controller 237, will continue to lower the end effector 225 and, for example, simultaneously continue to substantially match the level of the delivery device 23 1 The moving speed causes the moving pin 229 of the end effector 225 to disengage from the feature 4〇7 at the bottom of the target substrate carrier 2〇7. Figure 6E shows the result of the implementation of step 517. After the end effector 225 is disengaged from the target substrate carrier 2〇7, in step 519, the effector 225 is decelerated (e.g., or even stopped), and then the process of Fig. 5 is ended (step 521). At the same time, the target substrate carrier 207 is slid by the carrier engaging member 4〇1 of the conveying device 231 through the flange 4〇2 of the target substrate carrier 207, and the conveying device 231 will target the substrate carrier 2 〇7 passed away from 32 1358384 loading station 201. As noted, in at least one embodiment of the present invention, the motion data graph of the end effector 22 5 can define the accelerated deceleration, rise and fall conditions of the end effector 225 described above. Thus, the substrate carrier station 215 provided in accordance with the present invention and its beta, particularly operated under the control of the controller 237, are used to transport the substrate carrier from the mobile. The mounting device is unloaded and the substrate carrier is loaded onto the moving transport device. As such, this innovative substrate loading station and substrate carrier can help reduce substrate residence time, WIP and liquid capital and manufacturing costs within the manufacturing facility. In accordance with the present invention, controller 237 can be programmed to perform the system of Figure 3 and/or Figure 5. In addition, the processes of Figures 3 and 5 can be built into one or more computer program products. The computer can use the computer-readable media to execute each computer program product, such as a carrier signal, a floppy disk, a hard disk, a random access memory, and the like. In the case of at least one of the present inventions, the innovative substrate loading station 20 1 can automatically retract the end effector in the event of a power outage, an emergency shutdown, and the like. 225 (which will be described later) is sent away from the delivery device 231. For example, the controller 237 can include an end effector retracting mode 225 to automatically retract the end effector 225 from the delivery 罟 2 fly v ^ 疋 device 231 in response to an unexpected event such as a power outage, an emergency shutdown, or the like ( And / or horizontal guide 221) Further, the end effector 225 (and / or horizontal guide 221) can be offset, in order to remove the substrate, the power of the smashing station 2, 1 automatically Retracting the end effector 225 (and/or the horizontal guide 221). Any suitable offset mechanism such as spring, gravity, pneumatic steam red, ball screw, pilot screw, etc. can be employed. The above end effector retracts the routine such as It can be implemented as - or a plurality of computer program products. 33 x^8384 Examples of parameters that may affect the design of the substrate loading station 201, such as <device speed of the turn-on #署·击# (); (2) substrate carrier handling 215 moves the end effector 225 horizontal and/or vertical speed: (3) horizontal and/or vertical acceleration and deceleration applied to the substrate carrier carrier 22 5; (4) end of the substrate carrier carrier 215 The horizontal and vertical movement range of the effector 225; 5) the interval between adjacent substrate carriers 2〇7 transmitted by the transfer device 231 (6) The conveying device 231 transmits the height of the substrate carrier 2〇7; (7) The carrier 207 should be raised to empty the carrier for transporting the substrate carrier 2〇7, and the carrier of the substrate 23 1 The vertical distance of the member 4〇1: the height of the member 207 (for example, the vertical dimension); (7) the substrate carrier 2: = after the member is merging member 401 'the substrate carrier 2〇 must be lowered so that the 2 device 231 transmits The substrate carrier can be lowered by the released substrate to lower the running raft 7 without hitting the lowered substrate carrier 207:: away; (10) the type of carrier member used; He has similar parameters. J Dan, for example, in at least one of the present invention, in the embodiment, the innovative substrate carrier carrier 215 should be capable of achieving the maximum horizontal movement speed of the double thief 225, and This speed is greater than or equal to the transport (7) lifts the high-end effector 225 to a level sufficient to:: 313 the horizontal movement speed; the main 疋 to cause the substrate carrier 207 to be surgically removed from the delivery member merging member from the delivery device Same degree, (3) move at two or more horizontal speeds 'for example, to match the 4 strong soil. The first horizontal speed and the second horizontal speed for transporting the substrate carrier 2〇7, *山土什 207 into and out of the docking station 203; (4) floating in two or splicing carriers 207 #胄直速度移', for example, to disengage the substrate carrier 207 from the conveyor - β丄1 231 or to deliver the substrate carrier 207 to the first vertical of the ® & The speed is moved, and moved at a second vertical speed for transporting the base carrier 207 into and out of the docking station 203: and/or () adding and slowing down the speed of the substrate carrier 207 supported by the end effector 225 ( The substrate carrier engages or disengages the transport assembly 231) and does not damage the substrate within the substrate carrier 207. Similarly, the substrate carrier carrier 215 should be operable to reduce the efficiency of its end effector 225 to a low station cost for use by the lowest stop station 2〇3. If there is a low shelf; minimum stagnation 203 storage rack or other storage location, the substrate carrier carrier 215 should further reduce the end effector 225 for use with the lowest shelf/location. The horizontal range of movement of the end effector 225 on the horizontal guide 221 and the mechanism for moving the end effector 225 should be such that the end effector 225 can be accelerated to a level that substantially matches the speed of the conveyor, causing the substrate carrier 2〇7 The conveyor 231 is disengaged and/or engaged (and avoids colliding with the substrate carrier transported by the other transfer devices 231) and the ability to slow down to a stop within the range of available horizontal movements provided by the horizontal guides 221. One or more substrate loading stations f can include all of the above features/parameters. The various factors and parameters that need to be considered for designing a particular embodiment of the substrate loading station 201 and/or the stylized controller 23 7 (Fig. 2A) will now be described below with reference to Figures 7A-7D. 7A and 7B are simplified front views of the substrate loading station 201 similar to Fig. 2. Figure 7C_7D is a simplified side view of the substrate carrier of the Μα and 6A-6E circles during engagement and/or detachment of the transfer device a". Figure 7A illustrates the substrate carrier carrier 215 35 1358384 horizontal movement range of the end effector 225. The end effector 225 and the support member 223 are moved along the horizontal guide 221 of the substrate carrier carrier 215 to the most upstream limit position 7〇1. The end effector 225 and the support member 223, which are moved to the most downstream limit position 7〇2 along the horizontal guide 221, are indicated by broken lines. The distance Dhr of Fig. 7A represents the end effect. The maximum horizontal movement range of the 225.

除了受到上述設計因子的影響外，水平移動範圍 的選擇也會受停靠站203或儲放架239設置（例如停靠站或 儲放架的數量及/或橫跨距離）、基材裝載站2〇1的預定基 底（footprint)大小、及/或連接基材裝載站2〇1之工作介面 或處理工具的尺寸等影響。 第7B圖繪示端效器225的垂直移動範圍。位在端效 器225垂直移動範圍之最高極限位置7〇3的端效器225、 支撐件223和水平導件221以實線表示。在該位置處，端 效器22 5所處的高度Eh足以移除（清空，clear)輸送裝置In addition to being affected by the above design factors, the selection of the horizontal movement range is also set by the docking station 203 or the storage rack 239 (eg number of docking stations or storage racks and/or spanning distance), substrate loading station 2〇 The size of the predetermined footprint of 1 and/or the size of the working interface or processing tool of the substrate loading station 2-1 is affected. FIG. 7B illustrates the vertical movement range of the effector 225. The end effector 225, the support member 223, and the horizontal guide 221, which are located at the highest limit position 7〇3 of the vertical movement range of the end effector 225, are indicated by solid lines. At this location, the height Eh at which the actuator 22 is located is sufficient to remove the clearing device

231之承載件嚙合構件4〇1上基材承載件2〇7的凸緣 4〇2(參見第4B-4D圖）。 繼續參照第7B圖，位在端效器225垂直移動範圍之 最低極限位置704的端效器225、支撐件223和水平導件 221以虛線表示。在此位置處，端效器225所處的高度 為供基材裝載站201之最低停靠站（或儲放位置）使用所需 的最低高度》第7B圖的距離Dvr代表端效器225的最大 垂直移動範圍（例如，；〇VR = Eh - EL)。其他垂直移動範圍 亦可選用。 36 1358384 影響基材承載件207與輸送裝置231間之嚙合及脫離 操作的參數續·示於第7C-7D圖。第7C圖的距離Ds隔開輪 送裝置231所傳輸的兩相鄰基材承載件2〇7。分隔距離Ds 不但相關且小於承載件嚙合構件401的間距Dcem,其還與 基材承載件2 07的水平尺寸有關。藉由在裝載及卸載操作 期間提供較大的空間及/或時間週期來升高、降低、加速、 及/或減速基材承載件2〇7，可增加距離Ds而有利於裝載 及卸載操作》然而’增加距離Ds通常會減少輸送裝置23 j 可傳輸的基材承載件數量。 如第7D圖所示，在本發明至少一實施例中，為使基 材承載件207脫離輸送裝置231，端效器225抬高運動特 徵229到至少等於基材承載件207底部高度Ecb的高度。 更明確而8 ，運動特徵229被抬起的高度大於或等於高度 ECB加上用來支撐基材承載件2〇7之承載件嚙合構件4〇 i 底座的高度hcem(例如用以清空承載件嚙合構件4〇丨上的 基材承載件207之凸緣4〇2卜在降低已經脫離的基材承載 件207之剛減慢端效器225速度，以容許承载件嚙合構 件4〇1移到基材承載件2〇7前方至總計大於凸緣4〇2長度 LF的距離。其他各種參數也可能影響基材裝載站201和基 材搬運器215的設計p 以上敘述僅為說明本發明之實施例；熟諳此技藝者當 可在本發明之精神與範圍内修改上述設備及方法。例如: 上述基材承載件搬運器可不採用二垂直導件，巾是使用單 垂直導件。另外’基材承載件搬運器可配有沿著水平導 37 1358384 件進行水平 丁秒動的垂直導件 動的水平導件。 而非沿著垂直導件做垂直移 若基材承載件搬運器包括沿著水平導件移動的垂直導 i藉由順著垂直導件升高或降低端效器(而不是相對 进垂直導件組來抬高水平導件），來提高端效器而使基材承 載件脱離輪β ^ 、 或疋降低端效器以將基材承載件遞交The flange of the substrate carrier member 2〇7 on the carrier engaging member 241 of 231 is 4〇2 (see Figs. 4B-4D). Continuing with reference to Figure 7B, the end effector 225, the support member 223 and the horizontal guide 221, which are located at the lowest extreme position 704 of the vertical movement range of the end effector 225, are indicated by dashed lines. At this location, the end effector 225 is at a height that is the minimum height required for use by the lowest stop (or storage location) of the substrate loading station 201. The distance Dvr of Figure 7B represents the maximum of the end effector 225. Vertical movement range (for example, 〇VR = Eh - EL). Other vertical movement ranges are also available. 36 1358384 Parameters affecting the engagement and disengagement between the substrate carrier 207 and the transport device 231 are continued as shown in Figures 7C-7D. The distance Ds of Fig. 7C separates the two adjacent substrate carriers 2〇7 transported by the transfer device 231. The separation distance Ds is not only related but also smaller than the pitch Dcem of the carrier engaging member 401, which is also related to the horizontal dimension of the substrate carrier 206. By providing a larger space and/or time period during loading and unloading operations to raise, lower, accelerate, and/or decelerate the substrate carrier 2〇7, the distance Ds can be increased to facilitate loading and unloading operations. However, increasing the distance Ds generally reduces the number of substrate carriers that the transport device 23j can transport. As shown in FIG. 7D, in at least one embodiment of the present invention, in order to detach the substrate carrier 207 from the transport device 231, the end effector 225 raises the motion feature 229 to a height at least equal to the bottom height Ecb of the substrate carrier 207. . More specifically, 8 , the height at which the motion feature 229 is raised is greater than or equal to the height ECB plus the height hcem of the base of the carrier engaging member 4〇i used to support the substrate carrier 2〇7 (eg, to empty the carrier engagement) The flange 4 of the substrate carrier 207 on the member 4 is lowered in the speed of the just slowing effector 225 of the substrate carrier 207 that has been detached to allow the carrier engaging member 4〇1 to move to the base. The distance from the front of the material carrier 2〇7 to the total length LF of the flange 4〇2. Other various parameters may also affect the design of the substrate loading station 201 and the substrate carrier 215. The above description is merely illustrative of an embodiment of the invention. Those skilled in the art can modify the above apparatus and method within the spirit and scope of the present invention. For example: The above substrate carrier carrier may not use two vertical guides, and the towel uses a single vertical guide. The carrier can be equipped with a horizontal guide that moves horizontally and horizontally along the horizontal guide 37 1358384. Instead of moving vertically along the vertical guide, the substrate carrier carrier includes along the horizontal guide. Vertical guide i by raising or lowering the end effector along the vertical guide (rather than raising the horizontal guide relative to the vertical guide set) to increase the end effector to disengage the substrate carrier from the wheel β ^ , or疋 Lower the end effector to deliver the substrate carrier

^輸送裝置。致動器（例如未繪示之驅動帶或導螺旋）可設 在基材承載件搬運器215的支撐件223上以相對水平導 件221來升问端效器225，而使基材承載件脫離輸送裝置 231’或是朝水平導件221方向降低端效器225以將基材承 載件遞交給輸送裝置231(除此之外或取代順著垂直導件 升高/降低水平導件221)。^ Conveyor. An actuator (such as a drive belt or a guide screw not shown) may be provided on the support 223 of the substrate carrier carrier 215 to ascend the end effector 225 with respect to the horizontal guide 221, and the substrate carrier Disengaging the transport device 231' or lowering the end effector 225 toward the horizontal guide 221 to deliver the substrate carrier to the delivery device 231 (other than or instead of raising or lowering the horizontal guide 221 along the vertical guide) .

本發明可用來卸載及裝載基材承載件進出輸送裝置， 且輸送裝置可垂直傳輸基材承載件。在此例子令，端效器 225可包括能重新定位基材承載件之垂直與水平方向的重 新定位機構’其描述於美國專利申請案6〇/4〇7,452號、西 元2002年8月31日申請、名稱為「具有重新定位晶圓承 載件之垂直與水平方向之機構的端效器（End Effector Having Mechanism For Reorienting a Wafer CarrierThe invention can be used to unload and load the substrate carrier into and out of the conveyor, and the conveyor can vertically transport the substrate carrier. In this example, the end effector 225 can include a vertical and horizontal repositioning mechanism that can reposition the substrate carrier. It is described in U.S. Patent Application Serial No. 6/4,7,452, August 31, 2002. The application name is "End Effector Having Mechanism For Reorienting a Wafer Carrier" with a mechanism for repositioning the vertical and horizontal orientation of the wafer carrier.

Between Vertical and Horizontal Orientations) j 的申請案 (代理人文件編號7079)。 雖然本發明參照單片基材承載件進行說明，但本發明 亦可用於支撐一片以上之基材的基材承載件。 在此所述之特定基材裝載站實施例包括具多個垂直堆 38 1358384 2列的停靠站1上述基材裝載站 垂直堆疊結構、單一停靠站停靠站 U。基材裝載站可包括 罝堆 jk ^ ^ ^ 儲放架及/或一或客彻 非儲放架的基材承載件储放設^ %戈夕個 在所述基材裝載坫實施例中， 用停靠站包括停靠握爪， 用以懸吊基材承載件使其爪 哎去，偟含此直興出瑪位置間移動。 戍者，停靠站可包括停靠樣 件底部或側料處來以下方、基材承載 技“ B 切基材承栽件，並於停靠位置與出 塢位置之間移動基材承載件。 、 較佳地，本發明可庙 …* 應用於基材裝載站中，基材裝載站 匕含連接垂直與水平導件的Between Vertical and Horizontal Orientations) j (Proxy Document No. 7079). Although the invention has been described with reference to a single piece substrate carrier, the invention can also be used to support a substrate carrier of more than one substrate. The particular substrate loading station embodiment described herein includes a docking station having a plurality of vertical stacks 38 1358384 2 columns, the above substrate loading station, a vertical stacking structure, and a single docking station stop U. The substrate loading station may include a stack of jk ^ ^ ^ storage racks and/or a substrate carrier storage unit of the guest or non-reservoir rack, in the embodiment of the substrate loading cassette, The docking station includes a docking gripper for suspending the substrate carrier to cause the jaws to be smashed, and the movement between the positions is included. In addition, the docking station may include the bottom of the sample or the side material to the lower side, the substrate carrying technology "B cuts the substrate carrier, and moves the substrate carrier between the docking position and the docking position. Preferably, the invention can be applied to a substrate loading station, and the substrate loading station includes a vertical and horizontal guide.

Afe ^ ^ ^ ^ Λ 牛的月架（frame) »如此，基材裝載 站最好為模組式且可快 ^ ^ 女裝及校正。當基材裝載站包括 一或多個儲放架（例如筮） 第2A圖的儲放架239)時，各儲放架 也可裝設在骨架上。藉荖π吐壯 朱 冋時裝設基材承載件搬運器和儲 放架於骨架上，基材承載件 堵 戰件搬運器和儲放架彼此間具有預 定的相對位置。如此更右丨从— 史有利於安裝及校正；其為採用模組 式基材裝載站的另一優熱。 ^ 同樣地，其他例如專門用於裝 載及/或卸載基材承栽件推 ^ 科彳千進出向架工作輸送系統的機構最 好裝設在骨架上，例如 J如描述於美國專利申請案號 10/650,3 1 0、西元 2〇〇3 主 0 年8月28日申請、名稱為「用於 傳輸基材承載件的条站，。 斤' 统（System For TransportingAfe ^ ^ ^ ^ Λ The frame of the cow » So, the substrate loading station is preferably modular and can be fastened. When the substrate loading station includes one or more storage racks (e.g., cassettes 239) of Figure 2A, the storage racks can also be mounted to the frame. The substrate carrier carrier and the storage rack are placed on the skeleton, and the substrate carrier and the storage rack have a predetermined relative position with each other. This is more to the right - the history is conducive to installation and calibration; it is another excellent heat with a modular substrate loading station. ^ Similarly, other mechanisms, such as those dedicated to loading and/or unloading substrate support members, are preferably mounted on the skeleton, such as J as described in U.S. Patent Application Serial No. 10/650, 3 1 0, 2, 2, 3, 3, August 28, 2008 Application, the name is “the station used to transport the substrate carrier, System For Transporting”

Substrate Carriers)」的由性也 J甲請案（代理人文件編號6900)。 在一態樣中，骨架可塘aw J裝設在潔淨室壁面或腔室（例如工 作介面室）正面壁面上的預令 J頂疋裝設位置處，例如預鑽螺孔處 39 1358384 等。較佳地，壁面還具有供停靠握爪或停靠平台架置的預 定裳設位[料，壁面可具有供基材承裁件打開機構設 置的預定裝設位置。當骨架、停靠機構和基材承載件打開 機構分別設在同一表面上的多個預定位置時，可預先決定 其彼此之間的相對位置，以利於安裝及校正基材裝載站。The nature of Substrate Carriers) is also called J (Agency Document No. 6900). In one aspect, the skeleton can be installed on the front wall of the clean room wall or on the front wall of the chamber (for example, the working interface chamber), such as the pre-drilled screw hole 39 1358384. Preferably, the wall surface also has a predetermined skirting position for the docking gripper or the docking platform. The wall may have a predetermined mounting position for the substrate receiving member opening mechanism. When the skeleton, the docking mechanism, and the substrate carrier opening mechanism are respectively disposed at a plurality of predetermined positions on the same surface, the relative positions of each other can be determined in advance to facilitate installation and correction of the substrate loading station.

儘管所述輪送裝置已繪示放置在基材裝載站2〇〗上 方’然輸送裝置也可置於基材裝載站的高度處或其下方 或是鄰接基材裝載站的另一位置。 所述基材裝載站可用來將基材供應至處理工具、度量 位置、或其他基材可傳及的位置。 由以上敘述將可理解，該創新的基材裝載站可設置成 與工作介面（FI)相連接，該工作介面（FI)具有 辟 飛械号 貫，用以將基材從基材裝載站之停靠站傳送到處理工具 裝載鎖固室（例如第1圖的系統或者，可省略掉工作^ 面，且裝載鎖固室可包括能直接從基材裝裁站之停靠站詞Although the transfer device has been shown placed above the substrate loading station, the transfer device can be placed at or below the height of the substrate loading station or at another location adjacent to the substrate loading station. The substrate loading station can be used to supply the substrate to a processing tool, a measurement location, or a location that other substrates can pass. As will be understood from the above description, the innovative substrate loading station can be configured to be coupled to a working interface (FI) having a mechanical interface (FI) for transferring the substrate from the substrate loading station. The docking station transfers to the processing tool to load the locking chamber (for example, the system of Fig. 1 or the work surface can be omitted, and the loading lock chamber can include the docking station word directly from the substrate loading station)

送基材的基材搬運器。又或者，處理工具可在大氣壓、所 非真空下運作，因此可省略裝載鎖固室❶ 第8A-8D圖為用於端效器225的移動數據圖表範例 :本發明至少一實施例中’若採用此移動數據圖表，則、 使用感測器233(例如一「啟動」感測器），而例如可 ^感測器235。*照第8A圖，曲線cm顯示端效器於: 、作期間的X轴速度（輸送裝1 231的水平移動方 綠C2顯示端效器於裝截極你 、衮載钿作期間的z軸速度（垂吉 D 。曲線C3顯示端效器@ & 裔妁Z軸位置，而曲線C4顯示 40 1358384 效器於裝載操作期間的x轴位置。第8B圖類似第8八圖， 但放大顯示z轴位置的數據。第8cd圖類似第8ab圖， 但繪示端效器225於釦萤埕从 卻載刼作期間的X轴速度（Cl，）、z轴 速度(C2，)、Z轴位置(C3、χ軸位置(C4，)。需注意第Μ』 圖為顯不基材承載件裝載操作開始時（例如用以補償基材A substrate carrier that feeds the substrate. Alternatively, the processing tool can operate at atmospheric pressure, non-vacuum, so that the load lock chamber can be omitted. Figures 8A-8D are examples of movement data for the end effector 225: in at least one embodiment of the present invention With this mobile data graph, a sensor 233 (e.g., a "boot" sensor) is used, for example, a sensor 235 can be used. * According to Figure 8A, the curve cm shows the end effect of the end effector in the X-axis speed during the process (the horizontal movement of the conveyor 1 231, the green C2 display end effector, the z-axis during the installation of the pole Speed (Changji D. Curve C3 shows the end effector @ & 妁Z axis position, while curve C4 shows the 40 1358384 effect of the x-axis position during the loading operation. Figure 8B is similar to the 8th 8th figure, but enlarged The data of the z-axis position. The 8cd picture is similar to the 8ab picture, but shows the X-axis speed (Cl,), the z-axis speed (C2,), and the Z-axis of the end effector 225 during the load-carrying process. Position (C3, χ axis position (C4,). Note the first Μ 』 The picture shows the beginning of the substrate carrier loading operation (for example, to compensate the substrate)

承載件尺仆較低2轴位置處的z軸位置數據（曲線C 參照第8A-B圖及曲線C1_C4，端效器225於裝載操The z-axis position data at the lower 2-axis position of the carrier ruler (curve C refers to the 8A-B diagram and the curve C1_C4, and the effector 225 is used to perform the loading operation)

作期間可進行類似以上帛5圖所述的升高、降低B速步 辣》例如，參照第5圖及第6A_E圖，接收裝載操作的觸 發訊號後（步驟5〇3)，於時間丁丨與丁]期間加快端效器225 速度以配合輪送裝i23Qx方向上的速度（曲SO，步 驟505及第6A圖）《然後在時間门與τ4期間，升高端效 器225至輸送裝置231的高度（曲線ο,步驟5η及第6β 圖）’·如此，例如可使待裝載至輸送裝置23ι上之基材承載 件207的凸緣402高於即將用來接收基材承載件2〇7的承 載件嚙合構件401。During the operation, it is possible to perform the raising and lowering of the B speed step as described in the above FIG. 5, for example, referring to FIG. 5 and FIG. 6A_E, after receiving the trigger signal of the loading operation (step 5〇3), at the time Ding Wei Speed up the end effector 225 during the period to match the speed in the direction of the wheeled i23Qx (curve SO, steps 505 and 6A). Then, during the time gate and τ4, the end effector 225 is raised to the delivery device 231. Height (curve ο, step 5η and 6β map) '. Thus, for example, the flange 402 of the substrate carrier 207 to be loaded onto the transport device 23 ι can be higher than the flange carrier 2 to be used to receive the substrate carrier 2 〇 7 The carrier engages the member 401.

在時間Τ5與Τ6期間，加速端效器225至超過輸送裝 置231速度（曲線C1)，接著減速成輸送裝置23ι速度，使 得基材承載件207的凸緣402位於承載件嚙合構件4〇1上 方（步驟513及第6C圖）。在時間T7時，基材承載件 之凸緣402置於承載件嚙合構件4〇1上方，端效器225將 下降（曲線C3)且於凸緣402接觸承載件嚙合構件4〇1時停 止（如時間Τ8所示）。接著端效器225繼續降低直至時間 T9為止，且基材承載件207仍保持位在承载件嚙合構件 41 1358384 401上。基材承載件207因此以實質為零的速度及/或加速 度傳遞到輪送裝置231(例如於時間T8時，步驟513與517During time Τ5 and Τ6, the end effector 225 is accelerated to exceed the speed of the conveyor 231 (curve C1) and then decelerated to a speed of the conveyor 23ι such that the flange 402 of the substrate carrier 207 is above the carrier engaging member 4〇1. (Steps 513 and 6C). At time T7, the flange 402 of the substrate carrier is placed over the carrier engaging member 4〇1, the end effector 225 will descend (curve C3) and will stop when the flange 402 contacts the carrier engaging member 4〇1 ( As shown in time Τ8). The end effector 225 then continues to decrease until time T9, and the substrate carrier 207 remains positioned on the carrier engaging member 41 1358384 401. The substrate carrier 207 is thus transferred to the transfer device 231 at substantially zero speed and/or acceleration (e.g., at time T8, steps 513 and 517).

及第6D-E圓）》例如，因當凸緣4〇2嚙合承載件嚙合構件 401時端效器225會停止，故基材承載件2〇7是以z方向 上實質為零的速度與加速度來傳遞（曲線C2)。同樣地，由 於於承載件交換期間，端效器225在？£方向上的速度固定 不變且與輸送裝置231的速度相配合（曲線C1)，因此基材 承載件207以X方向上實質為零的速度與加速度來傳送。 另外在至少-實施例中，基材承載件傳送期間並無丫方向 的移動。因此，基材承載件傳遞是以三方向實質為零的加 速度和至少二方向實f為零的速度來進行。時間T9之後， 端效器225進行減速（步驟519及曲線C1)。 參照第8C-D圖及曲線C1-C4，端效器225於卸載操 作期間可進行類似以上、3圖所述的升高、降❹加^ 驟°例如，參照笫3圖》贫j A c 圖及第4A-E圖，接收到卸載操作的 觸發訊號後（步騍3(m，&And the 6D-E circle), for example, because the end effector 225 stops when the flange 4〇2 engages the carrier engaging member 401, the substrate carrier 2〇7 is substantially zero in the z direction and Acceleration is passed (curve C2). Similarly, due to the carrier exchange, the end effector 225 is in? The speed in the direction of the £ is fixed and matched with the speed of the conveying device 231 (curve C1), so that the substrate carrier 207 is conveyed at a speed and acceleration substantially zero in the X direction. Further in at least the embodiment, there is no movement in the direction of the substrate during transport of the substrate carrier. Therefore, the substrate carrier transfer is performed at an acceleration rate which is substantially zero in three directions and at a speed at which the at least two directions are true f. After time T9, the effector 225 decelerates (step 519 and curve C1). Referring to the 8C-D diagram and the curve C1-C4, the end effector 225 can perform the raising and lowering additions similar to those described above in FIG. 3 during the unloading operation. For example, refer to FIG. Figure and Figure 4A-E, after receiving the trigger signal for the unload operation (step 3 (m, &

. 3〇3)於時間T1與T2期間加快端效器 ，速&配口輸送裝置231在χ方向上的迷度（曲線 步驟3〇5及第4Α圖）。然後在時間Τ3與Τ4期間， 升高端效器2 2 5 (曲蟪r 7，、 線C3 )，使運動特徵229嚙合欲 裝置23 1上卸載之 - 載件207的凹面特徵407(步驟 311及第4Β圖）0在蚌門 4 Τ4時，當運動特徵229嚙合至凹 面特徵407時，端汾装 g* 5停止升高（曲線C2,與C3，）。在 時間T4與T5期鬥，冰， # 8 "'步升高端效器225以抬起基材承 载件207之凸緣4〇2，蚀* 灸其脫離承載件嚙合構件4〇1(步驟 42 1358384 311及第4C圖基材承載件2〇7因而以實質為零的速度 及/或加速度自承載件嚙合構件4〇1上卸載（例如由於將基 材承載件207從承載件嚙合構件401上舉起之前於時間 Τ4時停止ζ軸移動，並且因端效器225配合輪送裝置 的速度之故，所以在x、y及/或2方向上實質為零的速度 及/或加速度）。時間T5之後，端效器225進行減速及再度 加速（步驟313及曲線C1，）’並且下降（步驟315及曲線3〇3) Speed up the effect of the end effector, speed & porting device 231 in the x-direction during time T1 and T2 (curve steps 3〇5 and 4Α). Then, during time Τ3 and Τ4, the end effector 2 2 5 (curve r 7, line C3) is raised to cause the motion feature 229 to engage the concave feature 407 of the carrier 207 unloaded on the device 23 1 (step 311 and Figure 4) At 0 Τ4, when the motion feature 229 is engaged to the concave feature 407, the end clamp g* 5 stops rising (curves C2, and C3,). At time T4 and T5, the ice, #8 "'step-up end effector 225 is used to lift the flange 4〇2 of the substrate carrier 207, and the moxibustion is detached from the carrier engaging member 4〇1 (step 42 1358384 311 and FIG. 4C substrate carrier 2〇7 are thus unloaded from carrier engagement member 4〇1 at substantially zero speed and/or acceleration (eg, due to substrate carrier 207 from carrier engagement member 401). The boring movement is stopped at time Τ4 before lifting, and because the end effector 225 cooperates with the speed of the wheeling device, it is substantially zero speed and/or acceleration in the x, y, and/or 2 directions. After time T5, the end effector 225 performs deceleration and re-acceleration (step 313 and curve C1,) 'and falls (step 315 and curve)

以如則述第8C-D圖所示般清空承載件嚙合構件4〇ιEmpty the carrier engaging member 4〇 as shown in Fig. 8C-D

如此，將基材承載件自移動中的輸送裝置上卸載或將 基材承載件裝載至移動中的輸送裝置上可以—或多個方向 (較佳為二方向，且更佳為所有方向上）實質為零的速度/加 速度來進行。較佳地，垂直方向的速度與加速度實質為零； 更佳地’卸載/裝載期間的速度/加速度為零、而非實質為 零。本文中所使用的用語「零速度」或「零加速度」是指 諸如輸送裝置高度、輸送裝置速度、致動器再現性等特定 系統變數以及諸如控制器解析度、致動器解析度端效器 位置公差範圍等系統限制盡可能地接近零。「實質為零速 度」或「實質為零加速度」是指十分近似零，使得基材承 載件可自移動輸送裝置及/或承載件嚙合構件上卸載，以及 /或裝载至輸送裝置及/或承載件嚙合構件上，而不會損壞 基材承載件内的基材及/或形成可能造成傷害的微粒。例 如’可能以相對較小的速度接觸基材承載件。在一實施例 中了决速垂直提尚端效器，然後在接觸基材承载件前， 以相對較小或實質為零的速度下降。也可採取同樣小（或實 43 1358384 質為零）的加速度。類似的裝 中，以小於約〇_5G的力量垂 另一實施例甲，採取小於約 也可採用。 載操作亦可進行。在一實施例 直接觸基材或基材承載件；在 0.15G的力量。其他接觸力量As such, unloading the substrate carrier from the moving conveyor or loading the substrate carrier onto the moving conveyor can be in multiple directions (preferably two directions, and more preferably in all directions). The speed/acceleration of substantially zero is performed. Preferably, the velocity and acceleration in the vertical direction are substantially zero; more preferably the speed/acceleration during the unloading/loading is zero, rather than being substantially zero. As used herein, the term "zero speed" or "zero acceleration" refers to specific system variables such as conveyor height, conveyor speed, actuator reproducibility, and actuator resolution such as controller resolution, actuator resolution. System limits such as position tolerance ranges are as close as possible to zero. "Substantially zero speed" or "substantially zero acceleration" means very close to zero, such that the substrate carrier can be unloaded from the moving conveyor and/or the carrier engaging member and/or loaded onto the conveyor and/or The carrier engages the member without damaging the substrate within the substrate carrier and/or forming particles that may cause injury. For example, it is possible to contact the substrate carrier at a relatively small speed. In one embodiment, the final speed vertical end effector is then lowered at a relatively small or substantially zero speed prior to contacting the substrate carrier. It is also possible to take the same small (or real 43 1358384 zero) acceleration. In a similar package, another embodiment is used with a force of less than about 〇5G, and less than about may be employed. The loading operation can also be carried out. In one embodiment, the substrate or substrate carrier is directly contacted; at a force of 0.15G. Other contact forces

雖然本發明主要描述將僅能容納單片晶圓的基材承載 件裝載至移動中的輸送裝置上或從移動中的輪送裝置上卸 載下來，但將可理解，同樣可將容納多片基材的基材承載 件裝載至移動中的輸送敦置上或從移動中的輸送裝置卸 載。另外，本發明可應用到同時傳輸單片基材承載件和多 片基材承載件（例如25 „ 片基材承載件之前開式晶圓盒）的 系統。同樣地，本發明可用來將單獨基材(例如，未收在封 載件中的基材）裝載至移動中的輸送裝置上及/或 從移動中的輸送裝置上卸載下來H基材可利用開放 式基材承載件、基材支撐件、基材托盤或其他允許端效器 225或類似物使用類似的端效器移動模式及/或移動數據圖 表來直接將基材放置至輸送裝置之基材傳送裝置或從其上Although the present invention primarily describes loading a substrate carrier that can only hold a single wafer onto or from a moving conveyor, it will be appreciated that multiple substrates can be accommodated as well. The substrate carrier of the material is loaded onto the moving transport or unloaded from the moving conveyor. In addition, the present invention is applicable to a system for simultaneously transferring a single-piece substrate carrier and a plurality of substrate carriers (for example, an open wafer cassette before a 25-piece substrate carrier). As such, the present invention can be used to separate The substrate (eg, the substrate not included in the encapsulant) is loaded onto the moving conveyor and/or unloaded from the moving conveyor. The H substrate can utilize an open substrate carrier, substrate Supports, substrate trays or other allowable end effectors 225 or the like use similar end effector movement patterns and/or movement data charts to directly place or onto the substrate transfer device of the delivery device

移開基材的基材傳送裝置，而經由輸送裝置來傳送基材。 藉此，單獨基材可傳送到停靠站或其他裝載口、或者依需 求直接放入裝載鎖固室及/或處理工具。例如，基材可直接 從端效器225傳送到工作介面及/或處理工具2基材搬運 機械手臂，例如經由「葉片至葉片」的直接傳送或經由 中間傳送位置。多個單獨基材同樣可裝載至移動中的輸送 裝置上，或從移動中的輸送裝置上卸載下來。 如前所述’當沿著晶圓承載件輸送系統之輸送裝置高 44 1358384 速傳輸晶圓承載件時，本發明之晶圓承載件裝載站可與晶 圓承載件互動。例如在移開輸送裝置上選定的晶圓承載件 期間’晶圓承載件搬運器的端效器設定成移動（或「啟動」） 狀態’以配合輸送系統正在傳輸中之選定晶圓承載件的速 度或速率’及配合選定之晶圓承載件所佔據之移動輸送裝 置的相對位置。 當端效器安全地與輸送系統和輸送系統高速正傳輸之 晶圓承載件垂直相隔時，這些功能（即速度配合和位置配合） 均可由裝載站執行。然而，最好同時結合這些功能與裝載 站的第三功能，即改變端效器相對於輸送系統的高度來配 合所選定之晶圓承載件的高度（高度配合），此動作始於裝 載站與輸送系統交會的短暫時期。短暫交會的高度會引起 意外碰撞的風險（端效器與選擇晶圓承載件的特意接觸除 外）。 田丹钳廷系統暫時交會時，裝載站之組件、輸 送系統之組件、選擇之晶圓承載件和多數附近的晶圓承載 件最好全以相當快的逮度行進，>此可能會增加因组件與 晶圓承載件相撞所造成的傷害。 在0圓承載件移除過程中，甚至在端效器接觸選擇之 晶圓承載件前，當端效器的一部分(例如運 與輸送系統傳輸之部分a )開始處於 “故 “曰圓承載件相同的高度載站 與輸送系統將開始短暫交會。緊接在端效 = 送系統之晶圓承載件支撐M 及抬咼輸 科仟支撐構件上的選定晶圓 (輸送系統藉由晶圓承載件i 載件之後 載件支撐構件來支撑所選定的晶圓 45 1358384The substrate transfer device of the substrate is removed and the substrate is transferred via the delivery device. Thereby, the individual substrates can be transferred to a docking station or other load port or placed directly into the load lock chamber and/or processing tool as needed. For example, the substrate can be transferred directly from the end effector 225 to the working interface and/or the processing tool 2 substrate handling robot, such as via a "blade to blade" direct transfer or via an intermediate transfer position. Multiple individual substrates can also be loaded onto the moving conveyor or unloaded from the moving conveyor. The wafer carrier loading station of the present invention can interact with the wafer carrier when the wafer carrier is transported at a speed of 44 1358384 at a high speed along the wafer carrier transport system. For example, during removal of the selected wafer carrier on the transport device, the end effector of the wafer carrier carrier is set to a mobile (or "start" state" to match the selected wafer carrier being transported by the transport system. Speed or rate' and the relative position of the moving conveyor occupied by the selected wafer carrier. These functions (ie, speed fit and position fit) can be performed by the loading station when the end effector is safely separated from the wafer carrier that is being transported at high speed by the conveyor system and the conveyor system. However, it is preferable to combine these functions with the third function of the loading station, ie changing the height of the end effector relative to the delivery system to match the height (height fit) of the selected wafer carrier, starting from the loading station and A short period of time when the conveyor system meets. The height of a short rendezvous can cause an accidental collision (except for the deliberate contact of the end effector with the selected wafer carrier). At the time of the temporary rendezvous of the Tiandan Clamping System, the components of the loading station, the components of the conveyor system, the selected wafer carrier and most of the nearby wafer carriers are all preferably traveling at a fairly fast rate, > this may increase Damage caused by the collision of the component with the wafer carrier. During the 0-round carrier removal process, even before the end effector contacts the selected wafer carrier, a portion of the end effector (eg, part a) transported by the transport system begins to be in the "detailed" round carrier The same height station and conveyor system will begin to meet briefly. Immediately after the wafer carrier support M of the end effect=delivery system and the selected wafer on the support member (the transport system supports the selected support member by the carrier support member after the wafer carrier i carrier) Wafer 45 1358384

承載件），二者仍舊暫時交會。例如在此期間，部分或 端效器可繼續處於與鄰接晶圓承载件和其他由輪 系 輸之附近晶圓承載件（例如在晶圓承載件移除過程_ ^ 選擇移除的晶圓承載件）相同的高度。只有當端效器垂 動足夠範圍以收回位於移動中之輸送裝置及/或其他輪 系統所傳輸之晶圓承载件之高度内的端效器和所選定 圓承載件後，才結束輸送系統與裝載站之間的短暫交會 如此可減低意外碰撞.的風險。雖然裝載站放置選定晶圓 载件至輸送系統上的製程不同於晶圓承載件移除製程， 晶圓承載件玫置製程亦需要類似的輸送系統與裝載坫之 的短暫交會過程。例如，放置製程的短暫交會時期可始 所選疋之晶圓承載件「突破已置於轉動輸送裝置上之晶 承載件的流動平面(或進入其高度)」，並持續進行直到整 蠕效器（現為空的）回傳通過此平面為止。 在裝載站與輸送系統短暫交會期間，需小心控制铲 :之蠕效器與輸送系統之轉動輸送裝置間的相對移動： 數私進u承載件移除製程和放置製程。若端效器與 :輪送裝置間的相對移動在此期間失控，則可能造成至 =不同的故障模式致發生意外碰撞例如⑴端效器 失預疋速度移動，且輸送裝置因旋轉運動突然減少或 度輪導致減速及/或乃至靜止；（2)輪送裝置繼續以預定 復·轉動，且端效II m -t- 運M 直線移動的運動力（例如晶圓承載件 ^ ^ R 提供的移動力）突然減少或消失而導 %迷及/或乃i餘 ’以及（3)輸送裝置和端效器均失去 有 傳 被 移 送 晶 9 承 但 間 於 圓 個 载 以 移 少 繼 消 速 搬 致 各 46 1358384 自部分或全部的運動力而造成不同速度的減速。其他引起 碰撞意外的故障模式也可能發生’例如失去供端效器垂直 移動的運動力（例如由晶圓承載件搬運器之垂直導件所提 供的垂直運動力）。Carrier), the two still temporarily meet. For example, during this time, the partial or end effector can continue to be in the vicinity of the wafer carrier and other wafer carriers that are transported by the train (eg, in the wafer carrier removal process _ ^ selected wafer carrier removed Pieces) the same height. The delivery system is terminated only when the end effector is sag sufficiently to retract the end effector and the selected circular carrier within the height of the wafer carrier being transported by the moving conveyor and/or other wheel system. A brief rendezvous between loading stations can reduce the risk of accidental collisions. Although the process of placing the selected wafer carrier onto the conveyor system at the loading station is different from the wafer carrier removal process, the wafer carrier process also requires a similar intersection of the conveyor system and the loading station. For example, during a brief rendezvous of the placement process, the selected wafer carrier "breaks through the flow plane (or into its height) of the crystal carrier that has been placed on the rotating conveyor" and continues until the entire creator (now empty) back through this plane. During the brief rendezvous of the loading station and the conveyor system, care must be taken to control the shovel: the relative movement between the tamper and the rotating conveyor of the conveyor system: the number of private u-carrier removal processes and placement processes. If the relative movement between the end effector and the transfer device is out of control during this period, it may cause an accidental collision to a different failure mode, such as (1) the end effector loses the pre-twist speed, and the conveying device suddenly decreases due to the rotational motion. Or the wheel causes deceleration and/or even stationary; (2) the wheeling device continues to rotate at a predetermined time, and the end effect II m -t- M moves linearly (for example, the wafer carrier ^ ^ R provides The movement force) suddenly decreases or disappears, and the result is that the transmission device and the end effector lose their transmission and are transferred to the crystal. However, the movement is reduced by a small load. To each of the 46 1358384 decelerations of different speeds due to some or all of the kinetic forces. Other failure modes that cause collisions may also occur, e.g., loss of motion forces for vertical movement of the end effector (e.g., vertical motion forces provided by vertical guides of the wafer carrier carrier).

在正常操作期間，整體系統的各個部件，例如感測器、 高精密度致動器和製程控制器等，可共同合作以小心控制 裝載站的端效器與輸送系統的轉動輪送裝置之間的相對移 動。然而，輸送系統與裝載站短暫交會期間發生意外事件 會損害其合作關係，因而中斷或破壞此控制，而可能會傷 害基材或設備。 意外事件的其中一例子為製造設施内發生斷電情形， 其恐怕會於晶圓承載件放置或移除時，中止輸送系統的功 能或裝載站之晶圓承載件搬運器的功#。尤須關切的功能 包括輸送系統之輸送裝置的旋轉功能、晶圓承載件搬運器 之水平導件的速度配合功能、和晶圓承載件搬運器之垂直 導件的高度配合功能。During normal operation, various components of the overall system, such as sensors, high precision actuators, and process controllers, can work together to carefully control the end effector of the loading station and the rotating wheeling device of the conveyor system Relative movement. However, an accident during the brief rendezvous of the conveyor system and the loading station can damage its partnership, thereby disrupting or destroying the control and possibly damaging the substrate or equipment. One example of an accident is a power outage in a manufacturing facility that would abort the function of the conveyor system or the work of the wafer carrier carrier at the loading station when the wafer carrier is placed or removed. Features that are of particular concern include the rotation function of the conveyor of the conveyor system, the speed-matching function of the horizontal guides of the wafer carrier, and the high fit of the vertical guides of the wafer carrier.

意外事件的另一例子為緊急關閉輸送系統或裝載站本 身、或緊急關閉整個製造設施。緊急關閉可能因應不同原 因（例如主要系統或機構故障）和基於不同理由（例如避免 故障系統附近的人員受傷、或避…晶圓或相鄰系統與 機構遭到破壞）而自動或手動執行。 因此，本發明包含-旦發生意外事件時，特別是發生 諸如斷電或緊急關閉等意外事件時，㈣諸如上述交會情 況的方法及設備n本發明還提“來確保依序中斷 47 1358384 上述輸送***與裝載站間之速度配合、位置配合和高度配 合的方法及設備實施例。 從輸送系統縮回裝載站之端效器的方法及設備實施例 將參照第9A-9B、1〇及U圖說明於下。Another example of an accident is the emergency shutdown of the conveyor system or the loading station itself, or the emergency shutdown of the entire manufacturing facility. Emergency shutdowns may be performed automatically or manually for different reasons (such as major system or institutional failures) and for different reasons (such as avoiding injury to personnel near the faulty system, or avoiding damage to wafers or adjacent systems and mechanisms). Accordingly, the present invention includes, when an accident occurs, particularly in the event of an accident such as a power outage or an emergency shutdown, (iv) methods and apparatus such as the above-described rendezvous situation. The present invention also provides "to ensure sequential interruption 47 1358384" Method and apparatus embodiment for speed matching, position matching and height matching between the system and the loading station. Method and apparatus for retracting the end effector of the loading station from the conveying system will be referred to paragraphs 9A-9B, 1 and U Explain below.

第9 A-9B圖為根據本發明之晶圓承載件裝載站8〇丨的 側視圖，其鄰接晶圓承載件輸送系統805的可旋轉輪送裝 置803。如圖所示，晶圓承載件裝載站801對晶圓承載件 支撐構件808沿著輸送裝置803所攜帶的選定晶圓承載件 807執行根據本發明之部分卸載程序。晶圓承載件裝載站 801包含一偏移裝置8 09。偏移裝置8 09用來儲存足夠的能 量’以在卸載或裝載操作期間失去電源（例如斷電或緊急關 閉）時產生充足的動力推動晶圓承載件裝載站8〇丨的端效 器811離開輸送裝置8〇3。參照第9A_9B圖，晶圓承載件 裝載站801更包含骨架813和由骨架813所支撐並且與骨 架813連接的晶圓承載件搬運器815。晶圓承載件搬運器 815包含端效器811、可動地耦接至端效器8ιι(例如經由 ^撐件819)且順著實質水平之直線路徑（未緣示）引導端效 裔811的水平導件817、和至少—可動地輕接至水平導件 17且順著實質垂直之直線路徑（未繪示）引導水平導件 817的垂直導件821。 在第9A-9B圖的實施例中，晶圓承載件裝載站丨的 偏移裝置m包含推動機構825。推動_ 825較佳包含 =件827、彈力構件829和活塞83卜彈 8 壓縮在封圍件827内；活塞831可操作地轉接至彈力構件 48 1358384 829,以相對於封圍件827進行往復移動。如第9a9b圖 • 所示，活塞831包含末端833,用以連接晶圓承載件搬運 . 器815的水平導件817。在第9A_9B圖的較佳實施例中， ' 為緊密壓實及良好對準，彈力構件829固定地連接至晶圓 承載件搬運器815的垂直導件82卜其他略佳的實施例（未 繪示）包括用於偏移裝置809的不同耦接模式；例如在一特 定實施例中，偏移裝置809固定地連接至晶圓承載件裝載 φ 站801的骨架813。 運作時，晶圓承載件裝載站801的偏移裝置809汲取 所保留的能量以產生及施加運動力至晶圓承載件搬運器 815的水平導件81 7。偏移裝置809產生的動力最好至少在 顯著減少或完全切斷晶圓承載件搬運器815之垂直導件 82丨的電源時起作用。此時，偏移裝置8〇9施加動力至水 平導件8 1 7，迫使水平導件8 1 7往下移動’以對應晶圓承 載件裝載站801與晶圓承載件輸送系統805交會的情況（如 上所述）而推動端效器811離開第一高度835(第9A圖）》 • 較佳地，偏移裝置809促使端效器811從第一高度835移 至J第一向度837(第9Β圖）’此時因晶圓承載件807與繼續 由晶圓承載件輸送系統8〇5傳輸的晶圓承載件841之間確 • 實存有正向垂直空隙839，故上述交會情況不再存在。 * 在—較佳實施例中，偏移裝置809產生的動力夠大， 因此當其結合重力且缺少垂直導件821所產生的向上力量 時總合力量足以讓晶圓承載件搬運器815的水’平導件817 沿著垂直導件821向下移動。另外在一較佳實施例中，在 49 垂直導件821的預定使用壽命期間，偏移震置 動力沒有大到可重複且確實地防止晶圓承栽件搬運 之垂直導件821抬高水平導件817，例如 ^ 弟二咼 1第一高度835，並且不足以具有高精確度及/或 性。在以第9A-10A圖之推動機構825代表偏移裝 的實施例中，熟諳此技藝者將可理解，根據本發明 機構825的彈力構件829可為任何類型，例如線圈 氡動汽缸。 第1〇圖為第9A-9B圖晶圓承載件裝栽站8〇1 承載件搬運器815的背面視圖。如第10圖所示，偏 8〇9分別輕接至晶圓承載件搬運器815的二垂直導 此配置方式將產生的動力大致等分給二遠離的偏 9 以適當且均衡地施加動力至晶圓承載件搬運 的水平導件817上。 第11圖為第9A-9B及10圖晶圓承載件搬運器 背面視圖’其可操作地耦接至控制器843，且控制 更輕接至不斷電電源供應器845，並利用不斷電電 器84 5供應電力來操作晶圓承載件搬運器815，以 發生斷電或緊急關閉等事件時（例如，不斷電電源供 供應電力給控制器843與晶圓承載件搬運器815)， 承載件搬運器815的端效器811自晶圓承載件 801(第9A-9B圖）的輪送裝置8〇3(第9A-9B圖）縮回 11圖所示’第9A-9B及10圖的不位在晶圓承載件 815的垂直導件821β不斷電電源供應器845用來命 產生的 器 815 度837 可控制 置809 之推動 彈簧或 之晶圓 移裝置 η- 821» 移裝置 器 815 815的 器 843 源供應 例如在 應器可 使晶圓 裝載站 。如第 搬運器 令控制 50 U58384 器843,使得晶圓承載件搬運器815從其與晶圓承載件輸 送系統805(第9A-9B圖）交會的位置收回端效器811，並於 失去正常供電時供應緊急電力給控制器843和晶圓承載件 搬運器8 1 5。 運作過程中，當在晶圓承載件移除期間，晶圓承載件 搬運器815會與晶圓承載件輪送系統8〇5(第9a9B圖）短 暫交會時，發生諸如斷電或緊急關閉等意外事件。可於發 生諸如斷電或緊急關閉等意外事件時啟動的不斷電電源供 應器845將會啟動。不斷電電源供應器845供應緊急電力 給控制器843以免控制器843的功能中斷，其並命令控制 器8 4 3操作晶圓承載件搬運器8丨5，以控制晶圓承載件搬 運器8 1 5排除意外事件發生時晶圓承載件搬運器8 1 5與晶 圓承載件輸送系統805(第9A-9B圖）短暫交會的情況。控 制器843較佳會緊接在意外事件發生後，盡快地相應操作 晶圓承載件搬運器815’而排除暫時交會情況。 在一較佳實施例中，控制器843依據預定縮回常式控 制晶圓承載件搬運器815〇在一實施例中，預定縮回常式 包含常駐控制器843的電腦程式β在另一實施例中，預定 縮回常式包含不儲存在控制器843中但在意外事件發生後 可為控制器843使用的電腦程式。 在一實施例中，控制器843用來分配不斷電電源供應 器845供應的緊急電力至晶圓承载件搬運器8丨5 ,如此晶 圓承載件搬運器8 1 5可繼續執行以排除交會情況。在另一 實施例中（未繪示）’不斷電電源供應器845直接供應緊急 51 1358384 電力給晶圓承載件擷運器8I5，而不需控制器843間接分 配電力。在一較佳實施例中，控制器843讓水平導件 . 和垂直導件82丨參予排除交會情況，使水平導件817協同 ，* 晶圓承載件輪送***8〇5(第9A-9B圖）（尤其是協同晶圓承 載件輸送系統805的晶圓承載件支撐構件8〇8，第9a 9b 圖）知:供水平空隙（horizontal clearance)，且使垂直導件pi 依需求提供垂直空隙。在一略佳實施例中，控制器843可 φ 只讓垂直導件82 1參予排除交會情況而提供垂直空隙。 在又一實施例中，每當控制器收到不斷電電源供應器 供應的電力時，控制器可用來使基材承載件搬運器的端效 器從輸送裝置的輸送路徑縮回。 第12圖為另一縮回機構的簡化正視圖，用以將晶圓裝 載站801的端效器8η移離輸送裝置8〇3。參照第12圖， 延伸部1201連接或形成於至少一垂直導件821内。如圖所 示，凸輪面1203形成在延伸部12〇1上。其他凸輪面形狀 也可採用。 • 切換器1205裝設於水平導件817，滾轴1207則連接 切換器1205且沿著延伸部12〇1的凸輪面12〇3滾動。延伸 部1201設置用以當端效器8η進入端效器811(及/或端效 * 器81 1支撐之承栽807)可能與輸送裝置803(及/或輸送裝 置8〇3支撑之承栽807)發生不當交會的區域中時，只讓滚 軸1207接觸延伸部12〇1» 如第12圖所示，氣動汽缸12〇9用來偏移位在水平導 件817上方的端效器811。例如，在晶圓裝載站8〇1正常 52 丄挪384 運作期間，氤動汽缸1209可完全延伸（如圖所示）。 當水平導件817沿著垂直導件82丨升高，滾軸12〇7 . 接觸延伸部1201的凸輪面1203,並朝切換器1 205方向移 • ^而啟動切換器1 205。切換器丨2〇5的啟動可構成電路（未 冷不）’使得端效器811回應斷電或其他意外事件（如前述） 而朝向水平導件8丨7縮回。例如，氣動汽缸丨2〇9可回應斷 電或其他意外事件而縮回。需注意，由於設有延伸部Η。】 • 和切換器1205，只有當端效器811位於端效器811(及/或 端效器811支撐之承載8〇7)可能與輸送裝置8〇3(及/或輸 送裝置803支撐之承載807)發生不當交會的位置時，才會 縮回端效器811。也就是，當斷電或其他意外事件發生時， 如果水平導件817低於延伸部1201，將不會縮回端效器 811。因此，可避免端效器811(及/或承載件8〇7)因端效器 8 11缩回而不小心撞到儲放位置及/或停靠站1 2 11。 雖然主要參照晶圓為例來說明本發明，但將可理解本 發明也可用於諸如矽基材、罩幕、光罩、玻璃板等其他已 # 圖案化或未圖案化的「基材」，及/或用於輸送及/或處理這 類基材的設備。 儘管本發明已以較佳實施例揭露如上，然而應理解在 * 不脫離本發明精神和範圍内，當可涵蓋其他實施例’本發 . 明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖為處理工具和與其相連晶圓承載件裝載與儲放 53 1358384 設備之傳統配置設計的上視圖； 第2A圖為根據本發明之基材裝載站的正視圖； 第2B圖為第2A圖基材裝載站的局部側視圖，其繪示 基材裝載站之第一感測器的示範實施例； 第2C圖為第2A圖之端效器的局部立體圖，其繪示第 2A圖基材裝載站之第二感測器的示範實施例； 第2D圖為第2C圖的局部放大立體圖；9A-9B is a side elevational view of a wafer carrier loading station 8A in accordance with the present invention, which abuts the rotatable wheeling device 803 of the wafer carrier transport system 805. As shown, the wafer carrier loading station 801 performs a partial unloading procedure in accordance with the present invention on the wafer carrier support member 808 along the selected wafer carrier 807 carried by the transport device 803. The wafer carrier loading station 801 includes an offset device 809. The offset device 809 is used to store sufficient energy 'to generate sufficient power to force the wafer carrier loading station 8's end effector 811 to leave when power is lost during an unloading or loading operation (eg, power down or emergency shutdown) Conveying device 8〇3. Referring to Figures 9A-9B, the wafer carrier loading station 801 further includes a skeleton 813 and a wafer carrier carrier 815 supported by the skeleton 813 and coupled to the skeleton 813. The wafer carrier carrier 815 includes an end effector 811, a level movably coupled to the end effector 8 (eg, via the struts 819) and directing the end effect 811 along a substantially horizontal straight path (not shown) The guides 817, and at least, are movably coupled to the horizontal guides 17 and guide the vertical guides 821 of the horizontal guides 817 along a substantially vertical straight path (not shown). In the embodiment of Figures 9A-9B, the offset means m of the wafer carrier loading station includes a pushing mechanism 825. Push _ 825 preferably includes = member 827, spring member 829 and piston 83 buck 8 compressed within enclosure 827; piston 831 is operatively coupled to resilient member 48 1358384 829 for reciprocation relative to enclosure 827 mobile. As shown in Figure 9a9b, the piston 831 includes a tip 833 for connecting the horizontal guide 817 of the wafer carrier handling device 815. In the preferred embodiment of Figures 9A-9B, 'for tight compaction and good alignment, the resilient member 829 is fixedly coupled to the vertical guide 82 of the wafer carrier carrier 815. Other slightly preferred embodiments (not shown) The display includes different coupling modes for the biasing device 809; for example, in a particular embodiment, the biasing device 809 is fixedly coupled to the skeleton 813 of the wafer carrier loading φ station 801. In operation, the offset means 809 of the wafer carrier loading station 801 draws the retained energy to create and apply a moving force to the horizontal guide 81 7 of the wafer carrier carrier 815. Preferably, the power generated by the biasing means 809 acts at least when the power to the vertical guides 82 of the wafer carrier carrier 815 is substantially reduced or completely cut. At this time, the biasing device 8〇9 applies power to the horizontal guides 8117, forcing the horizontal guides 817 to move downwards to correspond to the situation in which the wafer carrier loading station 801 meets the wafer carrier transport system 805. Pushing the end effector 811 away from the first height 835 (as shown in FIG. 9A). Preferably, the offset device 809 causes the end effector 811 to move from the first height 835 to the J first dimension 837 ( Figure 9) At this time, due to the fact that there is a positive vertical gap 839 between the wafer carrier 807 and the wafer carrier 841 that continues to be transported by the wafer carrier transport system 8〇5, the above-mentioned intersection is not Re-exist. * In the preferred embodiment, the biasing device 809 generates sufficient power so that when combined with gravity and lacking the upward force generated by the vertical guide 821, the total force is sufficient to allow the water of the wafer carrier carrier 815 The 'flat guide 817 moves down the vertical guide 821. In addition, in a preferred embodiment, during the predetermined useful life of the 49 vertical guides 821, the offset shock power is not large enough to repeatedly and reliably prevent the wafer guide handling vertical guides 821 from raising the horizontal guide. The piece 817, for example, has a first height 835 and is not sufficient to have high precision and/or sex. In the embodiment in which the push mechanism 825 of Figures 9A-10A represents an offset mount, it will be understood by those skilled in the art that the resilient member 829 of the mechanism 825 in accordance with the present invention can be of any type, such as a coiled cylinder. Figure 1 is a rear view of the wafer carrier loading station 8.1 carrier carrier 815 of Figures 9A-9B. As shown in FIG. 10, the two vertical guides that are lightly connected to the wafer carrier carrier 815 are respectively equally distributed to the two remote biases 9 to apply power to the proper and balanced manner. The wafer carrier is carried on a horizontal guide 817. Figure 11 is a rear view of the wafer carrier carrier of Figures 9A-9B and 10 'which is operatively coupled to the controller 843, and the control is lighter to the uninterruptible power supply 845, and utilizes uninterrupted power The appliance 84 5 supplies power to operate the wafer carrier carrier 815 for events such as a power outage or an emergency shutdown (eg, an uninterruptible power supply to supply power to the controller 843 and the wafer carrier carrier 815), The end effector 811 of the carrier 815 is retracted from the wafer carrier 801 (Fig. 9A-9B) by the transfer device 8〇3 (Fig. 9A-9B) as shown in Fig. 9A-9B and Fig. 10 The vertical guide 821β that is not located on the wafer carrier 815 is used to generate the 815 degree 837 controllable 809 push spring or wafer transfer device η- 821» shift device A 843 815 843 source supply, for example, can be used to enable the wafer loading station. If the first carrier command controls the 50 U58384 843, the wafer carrier carrier 815 retracts the end effector 811 from its position with the wafer carrier transport system 805 (Fig. 9A-9B) and loses normal power supply. Emergency power is supplied to the controller 843 and the wafer carrier carrier 8 15 . During operation, when the wafer carrier carrier 815 temporarily meets with the wafer carrier transfer system 8〇5 (Fig. 9a9B) during wafer carrier removal, such as power failure or emergency shutdown occurs. Unexpected event. An uninterruptible power supply 845 that can be activated when an unexpected event such as a power outage or an emergency shutdown occurs can be initiated. The uninterruptible power supply 845 supplies emergency power to the controller 843 to prevent the function of the controller 843 from being interrupted, and instructs the controller 854 to operate the wafer carrier carrier 8丨5 to control the wafer carrier carrier 8 1 5 Excluding the case where the wafer carrier carrier 815 and the wafer carrier transport system 805 (Fig. 9A-9B) briefly meet when an accident occurs. The controller 843 preferably operates the wafer carrier carrier 815' as soon as possible after the occurrence of an accident to eliminate the temporary intersection. In a preferred embodiment, the controller 843 controls the wafer carrier carrier 815 in accordance with a predetermined retraction routine. In one embodiment, the predetermined retraction routine includes the computer program β of the resident controller 843 in another implementation. In the example, the predetermined retraction routine includes a computer program that is not stored in the controller 843 but can be used by the controller 843 after an unexpected event occurs. In an embodiment, the controller 843 is configured to distribute the emergency power supplied by the uninterruptible power supply 845 to the wafer carrier carrier 8丨5, so that the wafer carrier carrier 815 can continue to execute to exclude the intersection. Happening. In another embodiment (not shown), the uninterruptible power supply 845 directly supplies emergency 51 1358384 power to the wafer carrier conveyor 8I5 without the controller 843 indirectly distributing power. In a preferred embodiment, the controller 843 allows the horizontal guides and the vertical guides 82 to participate in the elimination of the intersection, so that the horizontal guides 817 cooperate, * the wafer carrier transfer system 8〇5 (9A- Figure 9B) (especially the wafer carrier support member 8〇8 of the cooperative wafer carrier transport system 805, Figure 9a 9b): for horizontal clearance, and vertical guide pi is provided vertically as required Void. In a slightly preferred embodiment, controller 843 can provide vertical clearance only for vertical guide 82 1 to participate in the exclusion of the intersection. In yet another embodiment, the controller can be used to retract the end effector of the substrate carrier carrier from the delivery path of the delivery device whenever the controller receives power from the uninterruptible power supply. Figure 12 is a simplified elevational view of another retracting mechanism for moving the end effector 8n of the wafer loading station 801 away from the transport unit 8〇3. Referring to Fig. 12, the extension 1201 is connected or formed in at least one of the vertical guides 821. As shown, a cam surface 1203 is formed on the extension 12〇1. Other cam surface shapes are also available. • The switch 1205 is mounted to the horizontal guide 817, which in turn is coupled to the switch 1205 and rolls along the cam surface 12〇3 of the extension 12〇1. The extension portion 1201 is configured to be used when the end effector 8n enters the end effector 811 (and/or the support 807 supported by the end effector 81 1) and may be supported by the delivery device 803 (and/or the delivery device 8〇3). 807) When the area of the improper intersection occurs, only the roller 1207 is brought into contact with the extension 12〇1». As shown in Fig. 12, the pneumatic cylinder 12〇9 is used to offset the end effector 811 located above the horizontal guide 817. . For example, during wafer loading station 8〇1 normal 52 384 384 operation, the ram cylinder 1209 can be fully extended (as shown). When the horizontal guide 817 is raised along the vertical guide 82, the roller 12〇7 contacts the cam surface 1203 of the extension 1201 and moves toward the switch 1 205 to activate the switch 1 205. The activation of the switch 丨2〇5 can constitute a circuit (not cooled) so that the end effector 811 retracts toward the horizontal guide 8丨7 in response to a power outage or other unexpected event (as described above). For example, the pneumatic cylinder 丨2〇9 can be retracted in response to a power outage or other unexpected event. It should be noted that due to the extension Η. 】 • and switcher 1205, only when the end effector 811 is located in the end effector 811 (and/or the load supported by the end effector 811 8〇7) may be supported by the transport device 8〇3 (and/or the transport device 803) 807) The end effector 811 is retracted when the location of the improper rendezvous occurs. That is, when a power outage or other unexpected event occurs, if the horizontal guide 817 is lower than the extension 1201, the end effector 811 will not be retracted. Therefore, the end effector 811 (and/or the carrier 8〇7) can be prevented from accidentally colliding with the storage position and/or the docking station 1 2 11 due to the retraction of the end effector 8 11 . While the invention has been primarily described with reference to wafers, it will be appreciated that the invention can also be applied to other patterned or unpatterned "substrates" such as tantalum substrates, masks, reticle, glass sheets, and the like. And/or equipment for transporting and/or processing such substrates. Although the present invention has been disclosed in the above preferred embodiments, it is understood that the scope of the invention may be covered by the scope of the appended claims. Prevail. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view of a conventional configuration design of a processing tool and a wafer carrier loading and storage 53 1358384 device therewith; FIG. 2A is a front elevational view of a substrate loading station in accordance with the present invention; 2B is a partial side elevational view of the substrate loading station of FIG. 2A, showing an exemplary embodiment of the first sensor of the substrate loading station; FIG. 2C is a partial perspective view of the end effector of FIG. 2A, An exemplary embodiment of a second sensor of the substrate loading station of FIG. 2A is shown; FIG. 2D is a partially enlarged perspective view of FIG. 2C;

第2E圖為第2A圖中之端效器的局部立體圖，其繪示 用來偵測一部分承載件嚙合構件的第二感測器； 第3圖為根據本發明所實行之製程實施例的流程圖， 用以自移動輸送裝置卸載晶圓承載件； 第4A-4E圖為第3圖製程在不同階段的側面示意圖； 第5圖為根據本發明所實行之製程實施例的流程圖， 用以將晶圓承載件裝載至移動輸送裝置上； 第6A-6E圖顯示第5圖製程在不同階段的側面示意 圖；2E is a partial perspective view of the end effector of FIG. 2A, showing a second sensor for detecting a part of the carrier engaging member; FIG. 3 is a flow chart of a process embodiment according to the present invention. The figure is used to unload the wafer carrier from the moving conveyor; FIG. 4A-4E is a side view of the process of FIG. 3 at different stages; FIG. 5 is a flow chart of the embodiment of the process according to the present invention, Loading the wafer carrier onto the mobile conveyor; Figures 6A-6E show a side view of the process of Figure 5 at various stages;

第7A及7B圖為類似第2圖之晶圓裝載站的簡化正視 TS3 · 圖， 第 7C-7D 圖為簡化側面示意圖，其繪示一類似第 4Α-4Ξ圖和第0Α-0Ξ圖的移動輸送裝置： 第 8A-8D圖為用於本發明端效器的移動數據圖表範 例； 第9A-9B圖為根據本發明之晶圓承載件裝載站的側視 圖，其鄰接晶圓承載件輸送系統的可旋轉輸送裝置，且晶 54 1358384 圓裝載站包含一偏移裝置； 第10圖為第9A-9B圖之晶圓承載件裝載站的晶圓承 載件搬運器背面視圖，該晶圓承載件搬運器包含一偏移裝 置，該偏移裝置耦接至晶圓承載件搬運器的各垂直導件； 第11圖為第9A-9B圖之晶圓承載件裝載站的晶圓承 載件搬運器背面視圖，其可操作地耦接至一控制器，且該 控制器更耦接至一不斷電的電源供應器；以及7A and 7B are simplified front view TS3 of the wafer loading station similar to Fig. 2, and Fig. 7C-7D is a simplified side view showing a movement similar to the 4th-4th and 0th-0th drawings. Conveying device: Figures 8A-8D are examples of moving data charts for the end effector of the present invention; Figures 9A-9B are side views of a wafer carrier loading station in accordance with the present invention, adjacent to the wafer carrier transport system Rotatable conveyor, and the crystal 54 1358384 circular loading station includes an offset device; Figure 10 is a rear view of the wafer carrier carrier of the wafer carrier loading station of Figures 9A-9B, the wafer carrier The carrier includes an offset device coupled to each of the vertical guides of the wafer carrier carrier; Figure 11 is a wafer carrier carrier of the wafer carrier loading station of Figures 9A-9B a rear view view operatively coupled to a controller, the controller being further coupled to an uninterruptible power supply;

第12圖為另一縮回機構的簡化正視圖，該縮回機構用 以將晶圓裝載站的端效器移離輸送裝置。 【主要元件符號說明】Figure 12 is a simplified elevational view of another retracting mechanism for moving the end effector of the wafer loading station away from the delivery device. [Main component symbol description]

111 裝載與儲放設備 113 處理工具 115 工作介面 117 壁面 119 機械手臂 120 承載 121 裝載鎖固室 123 傳送室 125 處理室 127 處理室 129 機械手臂 13 1 基材 133 儲放架 135 工作裝載位置 137 搬運器 201 裝載站 203 停靠站 205 排 207 承載 209 接口 211 握爪 213 開啟器 215 搬運器 217、 219 ' 221 導 217a ' 219a 上端 221a 上游端 223 支撐件 225 端效器 227 平台 229 特徵/運動銷 23 1 輸送裝置 23 1 a 狹缝 55 1358384111 Loading and storage equipment 113 Processing tool 115 Working interface 117 Wall 119 Robot arm 120 Bearing 121 Loading lock chamber 123 Transfer chamber 125 Processing chamber 127 Processing chamber 129 Robot arm 13 1 Substrate 133 Storage rack 135 Working loading position 137 Handling Loader 201 Loading station 203 Stopping station 205 Row 207 Carrying 209 Interface 211 Grip 213 Opener 215 Carrier 217, 219 '221 Guide 217a '219a Upper end 221a Upstream end 223 Support 225 End effector 227 Platform 229 Feature/moving pin 23 1 conveying device 23 1 a slit 55 1358384

233 ' 235 ' 253 感測器 233a、23 3a’、23 3b、233b， 237 控制器 240a 、240b 编碼器 243、 251 凹口 249 部位 301 > 303 、 305 、 307 、 309 321 ' 501 、 503 ' 505 、 507 5 19' 521 步驟 401 嚙合構件 403、 405 箭頭 701 ' 703 實線 801 裝載站 805 輸送系統 808 支撐構件 811 端效器 815 搬運器 819 支撐件 827 封圍件 83 1 活塞 835、 837 高度 843 控制器 1201 延伸部 1 205 切換器 1209 汽缸 感測器組 239 儲放架 241 光束 247 支撐結構 、311、 313、 315、 317、 319、 、509、 511、 513、 515、 517、 402 凸緣 407 特徵 702 > 704 虛線 803 輸送裝置 807 ' 841 承載 809 偏移裝置 813 骨架 817' 821 導件 825 推動機構 829 彈力構件 833 末端 839 空隙 845 電源供應器 1203 凸輪面 1207 滚軸 1211 停靠站 56233 ' 235 ' 253 sensors 233a, 23 3a', 23 3b, 233b, 237 controller 240a, 240b encoder 243, 251 notch 249 portion 301 > 303, 305, 307, 309 321 '501, 503 '505, 507 5 19' 521 Step 401 Engagement members 403, 405 Arrow 701 '703 Solid line 801 Loading station 805 Delivery system 808 Support member 811 End effect 815 Carrier 819 Support 827 Enclosure 83 1 Piston 835, 837 Height 843 Controller 1201 Extension 1 205 Switch 1209 Cylinder Sensor Group 239 Storage Rack 241 Beam 247 Support Structure, 311, 313, 315, 317, 319, 509, 511, 513, 515, 517, 402 Convex Edge 407 feature 702 > 704 dashed line 803 conveyor 807 '841 bearing 809 offset device 813 skeleton 817' 821 guide 825 push mechanism 829 spring member 833 end 839 gap 845 power supply 1203 cam surface 1207 roller 1211 stop station 56

Claims (1)

比8384 Φ 號辦Τ率？易1¾修(更)正本 、申請專利範圍 .-種用於裝載與卸載基材承載件進出一輸送系統的系 統’該系統包含： 之ph材承載件撤運a’其適於在—停靠站與—輸送系統 π :¾基材承載件’該基材承載件搬運器包括一端效 盗，該端效器適於支撐該基材承載件； 一控制器，其起接κ — · 、耦接至該基材承載件搬運器且 制該基材承載件拋锦作地控 柯承載件搬運盗，以於該基材承載件移動時，使該 基材承載件搬運器的該端 ㈣地選擇嚙合與脫離該 基材承載件而進出該輸送系統；以及 感測器’其耦接該控制器且可操作地提# 控制器，藉以在該端…作地…訊號至該 其η… 器的一路程的整個期間内指示與該 基材承載件相關的資_訊.， -- 其中該控制器句；j* - + s， 曰…，、，更多個已儲存的移動數據圖表 且可操作以進行以下步驟： 若可在該基材承載件振運器的-裝載或卸栽路程中進 行調整，則依據來自該感測器的該訊號來動態調整Μ材 承載件搬運器的操作以配合該基材承栽件，以& " 當該基材承載件移動通過該端效器的該路程時’依據來 自該感測器的該訊號修改-所選的移動數據圖表。 2_=請專：範圍第1項所述之系統，其中該鐵測器包括 下列至"：移動谓測器、速度偵剩器、壓力感測器、 57 1358384 衝擊感測器、*載件類型感剩器馬達編碼器以及 存在偵測器。 3·如申請專利範圍第i項所述之系統，其中有關該 載件的該資訊指示至少下列其中一者：承載件的速 載件的位置、蝙碼器類型、承載件的方向、承載件备 基材承载件搬運器的馬達編碼器資訊、輪送系統的 碼器資訊以及該輸送系統的速度。 4. 如申請專利範圍第1項所述之系統，其中該感測 複數個感測器，該等感測器用來提供複數個訊號至 器，藉以指示與該基材承载件和該輸送系統相關的 資訊。 5. 如申請專利範園第4項所述之系統，其中該 據圖表是依據與該基材承载件相關的該資訊所選出 6. 如申請專利範圍第5項所述之系統，其中該移動 表疋義該端效器於一裝載或卸載操作期間的一移動 7. 如申請專利範圍第5項所述之系統，其中該控制 來自該些感測器的該些訊號進_步可操作地修改所 該移動數據圖表。 承载件 基材承 .度、承 3存在、 馬達編 器包括 該控制 複數個 移動數 數據圖 〇 器依據 選出的 58 1358384 固第4項所述之*** 统上的該基材承載件 ’其中當一基材承載 撖運器時，該些感測 统’其中當藉由該基材 基材承載件時，該#感 8 ·如申請專利範 件接近該輸送系 器產生該些訊號 9·如申請專利範圍第4項所述之系 承載件搬運器從該輪送系統移開一 測器產生該些訊號。 項所述之系統，其令當該輸送系 件接近該基材承載件搬運器時， 1〇.如申請專利範固第4 統上的一基材承載件支撐 該些感測器產生該些訊號 11.如申請專利範圍第4項所述之系統，其令當該基材承 載件搬運器將-基材承載件^到該輸送系統上的一基材 承載件支撑件時，該些感測器產生該些訊號。 •如申請專利範圍第4項所述之系統，其中該些感測器 包括至少一設置於該端效器上的感測器。 13.如申請專利範圍第4項所述 会 见之系統’其中該些感測器 包括至少一設置於該基材承載件上的感測器。 59 14.如申請專利範圍第4項所述之系統，其中 包括至少一設置於該輸送系統上的感測器。 15·如申請專利範圍帛4項所述之系統，其中 包括至少-設置在鄰接該輸送系統之處的感測 16.如申請專利範圍第4項所述之系統，其中 包括至少一設置於該基材承載件搬運器上的感 17· —種裝載與卸載基材承載件進出—輪送系 該方法至少包含： 在適於支撐該基材承載件的—端效器的一 期間内感測與正在接近中之基材承載件相關的 該基材承載件正在一輸送系統上輸送； 決定該接近中之基材承載件的基材承載件類 依據該資訊及依據該基材承載件類型，從至 存之移動數據圖表中選出一卸載移動數據圖表 當該基材承載件移動通過一基材承載件搬 效器的一卸載路程時’依據額外資訊動態調整 數據圖表以配合該基材承載件，該額外資訊是 載件搬運器的該端效器的該卸載路程期間所感 及 利用所調整的該卸載移動數據圖表從該輸 該些感測器 該些威測器 器。 該些感測益 則器。 統的方法’ 路程的整個 資訊，其中 型； 少二個已健 I 運器的一端 該卸載移動 在該基材承 測而得；以 送系統卸載 60 1358384 該基村承載件。 18· —種裝載與卸载基材承載件進出一輸送系統的方法， 該方法包含： 決定一輸送系統上可使用的—基材承載件支撐件； 感測與該基材承載件支撐件相關的第—資訊； 在一基材承載件搬運器的一端效器的一路程的整個期 間内感測與一將裝載至該基材承載件支撐件上之基材承載 件相關的第二資訊； 決定該基材承載件的一基材承載件類组； 依據該第一資訊與該第二資邙^ ^ 貝讯以及依據該基材承載件 類型’從至少二個已儲存之移動數壚 砂助数據圖表中選出一裝載移 動數據圖表； 當該基材承載件移動通過一基材承載件搬運器的一端 效器的一裝載路㈣’依據額外資訊動態調整該裝載移動 數據圖表以配合該基材承載件，該 1貫讯疋在該基材承 載件搬運器的該端效器的該裝载路 α 4間所感測而得； 及 义 利用所調整的該裝載移動數據 口衣，將該基材承栽件 載於該輸送系統。 裝 61What is the ratio of the 8384 Φ? Easy 13⁄4 repair (more) original, patent application scope - a system for loading and unloading substrate carrier into and out of a conveyor system 'The system contains: the ph material carrier is shipped a ' it is suitable at the docking station And a transport system π: 3⁄4 substrate carrier 'The substrate carrier carrier includes an end effect thief, the end effector is adapted to support the substrate carrier; a controller, which is connected to κ — ·, coupled Advancing to the substrate carrier carrier and manufacturing the substrate carrier to control the carrier carrier to select the end of the substrate carrier carrier when the substrate carrier moves Engaged and disengaged from the substrate carrier to enter and exit the delivery system; and the sensor 'couples the controller and operatively raises the # controller, thereby at the end of the ... signal to the η... The entire period of a journey indicates the information associated with the substrate carrier. - where the controller sentence; j* - + s, 曰...,,, more saved mobile data charts and Operate to perform the following steps: if the substrate carrier vibrator is available Adjusting in the loading or unloading path, dynamically adjusting the operation of the coffin carrier carrier to match the substrate carrier according to the signal from the sensor, &" When the carrier moves through the path of the effector, 'modified according to the signal from the sensor--the selected mobile data chart. 2_=Please specify: the system described in the first item, wherein the iron detector includes the following to ": mobile predator, speed detector, pressure sensor, 57 1358384 impact sensor, * carrier Type sensory motor encoder and presence detector. 3. The system of claim i, wherein the information about the carrier indicates at least one of: a position of the carrier of the carrier, a type of bat, a direction of the carrier, a carrier The motor encoder information of the substrate carrier carrier, the encoder information of the routing system, and the speed of the conveyor system. 4. The system of claim 1, wherein the plurality of sensors are sensed, the sensors are configured to provide a plurality of signal to the device to indicate the substrate carrier and the delivery system Information. 5. The system of claim 4, wherein the chart is based on the information relating to the substrate carrier. 6. The system of claim 5, wherein the movement A system as claimed in claim 5, wherein the control of the signals from the sensors is operable operatively. Modify the mobile data chart. Carrier substrate bearing degree, bearing 3 presence, motor encoder including the control plurality of moving number data map device according to the selected 58 1358384 solid item 4 of the system of the substrate carrier When a substrate carries a transporter, the sensing system's when the carrier substrate is supported by the substrate, the sensor 8 is close to the conveyor system to generate the signals. The carrier carrier described in claim 4 of the patent application removes a detector from the wheeling system to generate the signals. The system of claim 1, wherein when the transporting member is adjacent to the substrate carrier carrier, a substrate carrier on the patent application system supports the sensors to generate the The system of claim 4, wherein when the substrate carrier carrier is to - a substrate carrier to a substrate carrier support on the conveyor system, the sense The detector generates the signals. The system of claim 4, wherein the sensors comprise at least one sensor disposed on the end effector. 13. A system as disclosed in claim 4, wherein the sensors comprise at least one sensor disposed on the substrate carrier. The system of claim 4, comprising at least one sensor disposed on the delivery system. 15. The system of claim 4, wherein the system includes at least - a sensing disposed adjacent to the delivery system. The system of claim 4, wherein at least one is disposed in the system Sense on the substrate carrier carrier 17 - Loading and unloading the substrate carrier in and out - the wheeling system The method comprises at least: sensing during a period of time suitable for supporting the substrate carrier The substrate carrier associated with the substrate carrier being approached is being transported on a conveyor system; the substrate carrier determining the substrate carrier in the proximity is based on the information and depending on the type of substrate carrier, Selecting an unloading mobile data chart from the moving data chart to the memory when the substrate carrier moves through an unloading path of a substrate carrier effector to dynamically adjust the data chart to match the substrate carrier according to additional information The additional information is sensed during the unloading path of the end effector of the carrier carrier and utilizes the adjusted unloading movement data chart to output the sensors from the sensors.These sensing benefits. The whole method's entire information of the route, the type; the end of the less than two of the I. The unloading movement is measured on the substrate; the system is unloaded by the delivery system 60 1358384. 18. A method of loading and unloading a substrate carrier into and out of a delivery system, the method comprising: determining a substrate carrier support usable on a delivery system; sensing sensing associated with the substrate carrier support First information: sensing a second information relating to a substrate carrier loaded onto the substrate carrier support during a whole period of a path of the end effector of a substrate carrier carrier; a substrate carrier group of the substrate carrier; according to the first information and the second asset, and according to the substrate carrier type 'from at least two stored movements A loading movement data chart is selected in the data chart; when the substrate carrier moves through a loading path of the end effector of a substrate carrier carrier (4), the loading movement data chart is dynamically adjusted according to additional information to match the base The material carrier is sensed between the loading path α 4 of the end effector of the substrate carrier carrier; and the loaded mobile data mask is adjusted The substrate supporting member is contained in the plant delivery system. Packing 61
TW96137321A 2006-10-04 2007-10-04 Methods and apparatus for loading and unloading su TWI358384B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82807006P 2006-10-04 2006-10-04

Publications (2)

Publication Number Publication Date
TW200833585A TW200833585A (en) 2008-08-16
TWI358384B true TWI358384B (en) 2012-02-21

Family

ID=39283398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96137321A TWI358384B (en) 2006-10-04 2007-10-04 Methods and apparatus for loading and unloading su

Country Status (2)

Country Link
TW (1) TWI358384B (en)
WO (1) WO2008045375A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8348973B2 (en) 2006-09-06 2013-01-08 Covidien Lp Bioactive substance in a barbed suture
US9398943B2 (en) 2009-11-30 2016-07-26 Covidien Lp Ventral hernia repair with barbed suture
US8414612B2 (en) 2010-11-08 2013-04-09 Covidien Lp Multifilament barbed suture
CN103089052B (en) * 2013-02-26 2015-02-25 湖北泉都立体车库设备有限公司 Anti-faulty-operation safety control system of automatic solid parking garbage
CN104635523A (en) * 2013-11-14 2015-05-20 沈阳新松机器人自动化股份有限公司 Non-contact power supply type feeding and discharging system
CN105789091B (en) * 2016-03-16 2020-04-24 沈阳拓荆科技有限公司 Load lock chamber and multi-chamber processing system using the same
CN108166822B (en) * 2017-11-28 2018-12-14 特斯联（北京）科技有限公司 A kind of artificial intelligence robot for vehicle service

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068668A (en) * 1997-03-31 2000-05-30 Motorola, Inc. Process for forming a semiconductor device
AT405775B (en) * 1998-01-13 1999-11-25 Thallner Erich Method and apparatus for bringing together wafer-type (slice-type, disk-shaped) semiconductor substrates in an aligned manner
US6460369B2 (en) * 1999-11-03 2002-10-08 Applied Materials, Inc. Consecutive deposition system
US7243003B2 (en) * 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot

Also Published As

Publication number Publication date
WO2008045375A2 (en) 2008-04-17
TW200833585A (en) 2008-08-16
WO2008045375A3 (en) 2008-07-10

Similar Documents

Publication Publication Date Title
TWI358384B (en) Methods and apparatus for loading and unloading su
TWI324582B (en) Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7930061B2 (en) Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
TWI434797B (en) Integrated systems for interfacing with substrate container storage systems
JP5147149B2 (en) Integrated intrabay transport, storage and delivery system
US7527141B2 (en) System for transporting substrate carriers
US7506746B2 (en) System for transporting substrate carriers
KR100932812B1 (en) Method and apparatus for band-to-band transfer module
US7684895B2 (en) Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US9221603B2 (en) Plate-shaped member storage rack, plate-shaped member transfer facility, and plate-shaped member storing method
JP4636379B2 (en) Method and apparatus for receiving and receiving articles in a suspended lift carriage
EP3476772B1 (en) Conveyance system
TW200908195A (en) Inertial wafer centering end effector and transport apparatus
KR101057511B1 (en) Board Carrier Delivery System
TW201133681A (en) Substrate processing apparatus, changing method and transferring method
KR20060043293A (en) Method and apparatus for enhances operation of substrate carrier handlers
JP2008108765A (en) Tool and method for adjusting position, and method of manufacturing electronic equipment
TWI376345B (en) Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
JP2013165177A (en) Stocker device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees