TW201133681A - Substrate processing apparatus, changing method and transferring method - Google Patents

Substrate processing apparatus, changing method and transferring method Download PDF

Info

Publication number
TW201133681A
TW201133681A TW099130903A TW99130903A TW201133681A TW 201133681 A TW201133681 A TW 201133681A TW 099130903 A TW099130903 A TW 099130903A TW 99130903 A TW99130903 A TW 99130903A TW 201133681 A TW201133681 A TW 201133681A
Authority
TW
Taiwan
Prior art keywords
substrate
roller
processing apparatus
transport
transfer
Prior art date
Application number
TW099130903A
Other languages
Chinese (zh)
Other versions
TWI462215B (en
Inventor
Yoshinori Takagi
Masao Tsuji
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010074370A external-priority patent/JP5254269B2/en
Priority claimed from JP2010074259A external-priority patent/JP5165718B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW201133681A publication Critical patent/TW201133681A/en
Application granted granted Critical
Publication of TWI462215B publication Critical patent/TWI462215B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a substrate processing apparatus having a changing part to change the supporting way of the substrate. The changing part can suppress the length in the transporting direction of the suspended portion supporting the substrate, and can avoid the drop rollers from contacting with other members easily. The changing part 20 of the substrate processing apparatus 1 comprises plural drop rollers 21, plural free rollers 24, and an entrance suspension stage 25; when the supporting way of the substrate 9 is changed, one portion on the upstream side in the transporting direction of the substrate 9 transfers from the plural drop rollers 21 toward the plural free rollers 24. Therefore, it can suppress the length in the transporting direction of the entrance suspension stage 25 and change the supporting way of the substrate 9. The free rollers 24 can support the substrate 9 reliably with a simple structure, and can be allocated within a narrow and small area. Therefore, plural free rollers 24 can be easily allocated at the position not contacting with the plural drop rollers 21.

Description

201133681 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有搬送基板之機構之基板處理老 置、轉換基板之支持方式之轉換方法、及轉移基板之轉移 方法。 【先前技術】 於液晶顯示裝置用玻璃基板、半導體晶圓、薄膜液晶用 可撓性基板、光罩用基板、彩色濾光片用基板、太陽電池 用基板、電子紙用基板等精密電子裝置用基板之製造步驟 中’使用具有搬送基板之機構之各種基板處理裝置。成為 此種基板處理裝置之處理對象之基板之尺寸隨著時代發展 而趨於大型化。近年來，為了水平穩定地搬送大型之基 板，而提出有使基板一面於平台上浮起一面搬送之搬迸機 構。 於使基板一面於平台上浮起一面搬送之基板處理裳置 中，而要將基板之支持方式自其他支持方式轉換為浮起支 持方式的機構。作為轉換基板之支持方式之技術，於專利 文獻1中揭示有具有自與浮起搬送不同之搬送機構轉移為 浮起搬送之機構之基板搬送裝置。於專利文獻丨中，藉由 使支持基板之輥下降，而使輥上之基板浮起保持於配置成 柵格狀之浮起用板上。 又，於一面使基板於平台上浮起一面保持基板之端緣部 進行搬运之基板處理裝置中，需要由特定之保持部來保持 藉由其他搬送機構搬送而來之基板之端緣部之機構。作為 150753.doc 201133681 保持基板之端緣部之機構，於專利文獻2中揭示有藉由墊 致動器使以真空吸附力吸附於基板下表面之吸附墊上升而 接近於基板之機構。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2008-166348號公報 [專利文獻2]曰本專利特開2009-117571號公報 【發明内容】 [發明所欲解決之問題] (1) 第1目的 專利文獻1之基板搬送裝置中，在轉換基板之支持方式 之部位上，需要與基板之搬送方向之尺寸相同或其以上之 長度之浮起用板。又’於專利文獻1之基板搬送裝置中， 於配置成柵格狀之浮起用板之間隙内配置有可升降之輥。 如此，以相互不接觸之方式交替配置浮起用板與輥及使輥 升降之機構將伴有設計上之困難。 因此，本發明之第1目的在於提供一種於轉換基板之支 持方式之轉換部中可抑制浮起支持基板之部分之搬送方向 之長度，且可容易地避免升降輥與其他構件之接觸之基板 處理裝置。 (2) 第2目的 專利文獻2之基板處理裝置中，使吸附墊接近於靜止之 基板之下表面。因此，需要用以使吸附墊升降移動之墊致 動器。其結果，包含墊致動器之搬送部之結構變得複雜。 I50753.doc 201133681 又，於專利文獻2之基板處理I置中，為了精密地規定 搬送時之基板之高度，而對塾致動器要求較高之定位精 度。又，亦可預測到由於長期使用而使得塾致動器之定位 ·· 之再現性降低。若欲長期維持墊致動器之定位之再現性， . m要與墊致動器不同之監控吸附塾之高度位置之機 構0 因此’本發明之第2目的在於提供_種不使保持部升降 移動，且既可抑制基板之位置偏移又可自下表面侧保持基 板之技術。 [解決問題之技術手段] 為了達成上述第！目的，本申請案之第】發明係一種基板 處理裝置’其係包括搬送基板之機構者，其包括：第工搬 送部，其將基板搬送至搬送路徑上之特定位置；^搬送 部，其使基板一面於平台上浮起一面自上述特定位置向搬 送方向下游側搬送；轉換部，其於上述第U般送部與上述 第2搬送部之間轉換基板之支持方式；以及控制部，其控 制上述轉換部；且上述轉換部包括：升降輕，其—面接觸 支持基板’-面主動地旋轉，且可於標準位置 之間升降移動；活輕，其一面於標準位置之上述升降幸昆之 上端部與下降位置之上述升降輥之上端部之間的高度位置 接射持基板’ 一面根據基板之移動而從動地旋轉·’以及 入口沣起台’其配置於上述活輥之搬送方向下游側，一面 使隸浮起至低於標準位置之上述升降輕對基板之 度的南度一面支持具杯·日^ 支持基板，且上述控制部係以如下方式控制 150753.doc 201133681 上述轉換部，即於橫跨標準位置之上述升降親與上述入口 浮起平台而配置基板之後，使上述升降輥向上述下降位置 下降且使基板之搬送方向_L游側之一部分向±述活觀轉 移。 本申請案之第2發明係如第!發明之基板處理裝置，直中 上述入口浮起台之搬送方向之長度短於基板之搬送方：之 長度。 本申請案之第3發明係如第i發明或第2發明之基板處理 裝置，其中配置有上述升降輥及上述活幸昆之區域之搬送方 向之長度短於基板之搬送方向之長度。 本申請案之第4發明係如第丄發明或第2發明之基板處理 裝置:其中上述活輥包括：複數個下游側活輕，其沿上述 入口浮起台之搬送方向上游側之側緣部排列；以及複數個 上游側活輥，其排列於較上述複數個下游側活輕更靠搬送 方向上游側之位置，且上述複數個上游側活報係以低於上 述複數個下游側活輥之密度配置。 本申請案之第5發明係如第1發明或第2發明之基板處理 裝置，其中上述轉換部更包括定位機構，其於橫跨標準位 置之上述升降親與上述入口浮起台而配置基板之狀態下， 規定基板之水平方向之位置。 本申請案之第6發明係如第旧明或第2發明之基板處理 、置其中上述升降輥及上述活輥與上述人口浮^台由不 同之支持台支持，且相互不連結。 耷案之第7發明係如第！發明或第2發明之基板處理 150753.doc 201133681 裝置其中上述活輥係直徑較上述升降輥小之輥。 又為了達成上述第i目的，本申請案之第8發明係一種 轉換n其係於第i搬送部與第2搬送部之間轉換基板之 支持方式者，上述第1搬送部將基板搬送至搬送路徑上之 特疋位置，上述第2搬送部一面使基板於平台上浮起，一 面自上述特疋位置向搬送方向下游側搬送基板’該轉換方 法利用.升降報，其—面接觸支持基板，—面主動地旋 轉，且可於標準位置與下降位置之間升降移動；活親，其 一面使基板接觸支持於標準位置之上述升降輥之上端部與 下降位置之上述升降輥之上端部之間的高度位置，一面根 據基板之移動而從動地旋轉；以及入口浮起台其配置於 述錢之搬送方向τ游側，—面使基板浮起至低於標準 位置之^述升降輥對基板之支持高度之高度—面支持基 板且。亥轉換方法包括以下步驟：a)橫跨標準位置之上述 升降親與上述入口浮起台而配置基板；以及b)於上述步驟 a")之後’使上述升降輥向上述下降位置下降，使基板之搬 送方向上游側之一部分向上述活輥轉移。 又，為了達成上述第2目的，本申請案之第9發明係一種 基板處理裝置’其係包括搬送基板之機構者，其包括：第 送卩其將基板自搬送方向上游側搬送至特定位置. 第2搬送部，其自上述特定位置向㈣^ K立置’ 置向搬达方向下游側搬送基 板’·以及轉移部，其於上述特定位置，自上述第i搬送部 向上述第2搬送部轉移基板；且上述轉移部包括一面維持 以水平姿勢接觸支持基板之一部分之狀態，一面上推基板 I50753.doc 201133681 上述第2搬送部包括一面自下表[Technical Field] The present invention relates to a substrate processing method for a mechanism for transporting a substrate, a conversion method for supporting a conversion substrate, and a transfer method for transferring a substrate. [Prior Art] For use in precision electronic devices such as glass substrates for liquid crystal display devices, semiconductor wafers, flexible substrates for thin film liquid crystals, substrates for photomasks, substrates for color filters, substrates for solar cells, and substrates for electronic paper. In the manufacturing process of the substrate, various substrate processing apparatuses having a mechanism for transporting the substrate are used. The size of the substrate to be processed by such a substrate processing apparatus tends to increase in size as the times progress. In recent years, in order to convey a large-sized substrate in a horizontally stable manner, there has been proposed a moving mechanism that transports a substrate while floating on a platform. The substrate is transported while the substrate is being floated on the platform, and the support mode of the substrate is converted from the other support mode to the floating support mode. As a technique for supporting a conversion substrate, Patent Document 1 discloses a substrate transfer device having a mechanism for transferring a transfer mechanism different from floating transfer to a floating transfer. In the patent document, the substrate on the roll is floated and held on a floating plate arranged in a grid shape by lowering the roll of the support substrate. Further, in the substrate processing apparatus which transports the substrate while floating on the stage while holding the edge portion of the substrate, it is necessary to hold the edge portion of the substrate which is transported by the other transfer mechanism by the specific holding portion. As a mechanism for holding the edge portion of the substrate, Patent Document 2 discloses a mechanism in which a pad actuator is used to raise a suction pad that is adsorbed to a lower surface of a substrate by a vacuum suction force to approach a substrate. [Prior Art Document] [Patent Document 1] [Patent Document 1] JP-A-2008-166348 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2009-117571 (Summary of the Invention) [Problem to be Solved by the Invention] (1) In the substrate transfer apparatus of the first object of the first aspect, a floating plate having a length equal to or larger than the size of the transfer direction of the substrate is required in the portion where the substrate is supported. Further, in the substrate transfer apparatus of Patent Document 1, a roll that can be lifted and lowered is disposed in a gap between the floating plates arranged in a grid shape. Thus, it is a design difficulty to alternately arrange the floating plate and the roller in a manner that does not contact each other and to raise and lower the roller. In view of the above, it is a first object of the present invention to provide a substrate in which a transfer direction of a portion where a support substrate is floated can be suppressed in a conversion portion of a conversion substrate, and substrate processing in which contact between the lift roller and other members can be easily avoided Device. (2) Second object In the substrate processing apparatus of Patent Document 2, the adsorption pad is brought close to the lower surface of the stationary substrate. Therefore, a pad actuator for moving the adsorption pad up and down is required. As a result, the structure of the conveying portion including the pad actuator becomes complicated. Further, in the substrate processing I of Patent Document 2, in order to precisely specify the height of the substrate during transportation, the positioning accuracy of the 塾 actuator is required to be high. Further, it is also predicted that the reproducibility of the 塾 actuator is lowered due to long-term use. If it is desired to maintain the reproducibility of the position of the pad actuator for a long period of time, the mechanism for monitoring the height position of the suction port is different from that of the pad actuator. Therefore, the second object of the present invention is to provide a type in which the holding portion is not lifted or lowered. A technique of moving and suppressing the positional displacement of the substrate and holding the substrate from the lower surface side. [Technical means to solve the problem] In order to achieve the above! According to a third aspect of the present invention, a substrate processing apparatus includes a mechanism for transporting a substrate, and includes: a first transporting unit that transports the substrate to a specific position on the transport path; and a transport unit that enables The substrate is transported from the specific position to the downstream side in the transport direction while floating on the platform; the conversion unit supports the substrate between the U-shaped transport unit and the second transport unit; and the control unit controls the above a conversion portion; and the conversion portion includes: lifting light, the surface contact support substrate '-surface actively rotates, and can move up and down between standard positions; live light, one side of the standard position of the above-mentioned lifting and lowering The substrate is attached to the upper surface of the upper surface of the lowering roller at the lower position, and the substrate is rotatably driven by the movement of the substrate, and the inlet and the erecting table are disposed on the downstream side of the conveying roller. Supporting a cup/day support substrate on the south side of the degree of lifting and lowering to a lower level than the standard position, and the control unit Controlling the conversion unit 150753.doc 201133681 by arranging the substrate after the lifting and lowering of the standard position and the inlet floating platform, and then lowering the lifting roller to the lowering position and moving the substrate to the direction _L One part of the swimming side shifts to the living point. According to a second aspect of the invention, in the substrate processing apparatus of the invention, the length of the transfer direction of the inlet floating table is shorter than the length of the substrate. According to a third aspect of the invention, in the substrate processing apparatus of the first aspect or the second aspect of the invention, the length of the conveying direction in which the elevating roller and the living zone are disposed is shorter than the length of the substrate. According to a fourth aspect of the invention, the substrate processing apparatus of the second aspect of the invention, wherein the movable roller includes: a plurality of downstream side live light, and a side edge portion on an upstream side in a conveying direction of the inlet floating table And a plurality of upstream side live rollers arranged at a position closer to an upstream side of the transport direction than the plurality of downstream side live lights, and the plurality of upstream side live reports are lower than the plurality of downstream side live rollers Density configuration. According to a fifth aspect of the invention, in the substrate processing apparatus of the first aspect or the second aspect of the invention, the conversion unit further includes a positioning mechanism that disposes the substrate at the elevating position that spans the standard position and the inlet floating table In the state, the position of the substrate in the horizontal direction is specified. According to a sixth aspect of the invention, in the substrate processing of the first or second invention, the lifting roller and the movable roller and the population floating table are supported by different support tables, and are not connected to each other. The seventh invention of the case is as follows! The substrate treatment of the invention or the second invention 150753.doc 201133681 The apparatus wherein the movable roller has a smaller diameter than the lifting roller. In addition, in the eighth aspect of the present invention, the first aspect of the present invention is to transfer a substrate to a transfer substrate between the i-th transfer unit and the second transfer unit, and the first transfer unit transports the substrate to the transfer. In the special position on the path, the second transport unit transports the substrate from the above-mentioned special position to the downstream side in the transport direction while the substrate is floating on the platform. The conversion method uses a lift report, and the surface contacts the support substrate. The surface is actively rotated, and can be moved up and down between the standard position and the lowered position; the living contact has a side between the upper end of the lifting roller supported at a standard position and the upper end of the lifting roller supported at the lowering position The height position is driven to rotate in accordance with the movement of the substrate; and the inlet floating table is disposed in the transport direction τ of the money, and the surface is raised to a lower than the standard position. Support height height - surface support substrate and. The conversion method includes the steps of: a) arranging the substrate across the standard position and the inlet floating platform; and b) after the step a"), lowering the lifting roller toward the lowering position to cause the substrate One of the upstream sides of the conveying direction is transferred to the above-mentioned movable roller. According to a ninth aspect of the present invention, a substrate processing apparatus includes a mechanism for transporting a substrate, and includes: a first feeding unit that transports the substrate to a specific position from an upstream side in a conveying direction. In the second transport unit, the second transfer unit is transported from the i-th transfer unit to the second transfer unit at the specific position from the specific position to the downstream side of the transfer direction (the transfer substrate) and the transfer unit. And transferring the substrate; and the transfer portion includes a state in which one of the support substrates is held in a horizontal posture, and the substrate is pushed up on the substrate I50753.doc 201133681

明案之第10發明係如第9發明之基板處理裝置，其 中上述轉移部更包括^位機構’其進行基板之水平方向之 之其他部分之上推機構， 面側保持基板一面向搬译 定位，上述控制部係以於上述定位機構定位基板之後，藉 由上述上推機構而上推基板之方式控制上述定位機構及上 述上推機構。 本申叫案之第11發明係如第丨〇發明之基板處理裝置，其 中上述定位機構包括抵接於基板之端緣部之定位構件，上 述控制部係以如下方式控制上述上推機構及上述定位機 構，即於上述定位機構之定位之後，使抵接於基板之上述 其他部分之上述定位構件自基板撤回，其後，藉由上述上 推機構而上推基板。 本申請案之第12發明係如第9發明至第11發明中任一發 明之基板處理裝置，其中上述保持部包括：保持面，其於 保持時規定基板之下表面之高度位置；以及彈性吸附體， 其可向上下方向伸縮並且吸附於基板之下表面；且在吸附 於基板之前’上述彈性吸附體之上端部位於上述保持面之 上方，在吸附於基板時，上述彈性吸附體之上端部位於與 上述保持面相同之高度。 150753.doc 201133681 本申請案之第13發明係如第9發明至㈣發明中任一發 二月之基板處理裝置，其中上述上推機構將與基板之搬送方 向正父之方向之兩端部附近上推。 述保持部保持基板 又’為了達成上述第2目的’本申請案之第14發明係一 種轉移方法’其係將基板自^搬送部向第2搬送部轉移 者’其包括以下步驟：a)一面維持以水平姿勢接觸支持基 板之-部分之狀態’一面將基板之其他部分上推；b)於上 述步驟a)之| ’使保持料入基板之被上推之部分之下 方；c)於上述步驟b)之後，解除基板之上推藉此使上 之轉移方法，其中更 ’進行基板之水平方 本申請案之第15發明係如第14發明 包括以下步驟：d)於上述步驟a)之前 向之定位。 本申請案之第16發明係如第15發明之轉移方法，其中於 上述步驟d)中，使定位構件抵接於基板之端緣部，且更包 括以下步驟：e)於上述步驟d)與上述步驟a)之間使抵接 於基板之上述其他部分之上述定位構件自基板撤回。 [發明之效果] 根據本申凊案之第1發明〜第8發明，於轉換部，基板之 搬送方向上游側之一部分自升降輥向活輥轉移。藉此，可 面抑制入口浮起台之搬送方向之長度，一面轉換基板之 支持方式。活輥可以簡易之結構可靠地支持基板，並且可 配置於狹小之區域中。因此，可容易地將活輥配置於不與 升降輥接觸之位置。 150753.doc 201133681 根據本申請案之第3發明，可抑制配 及活輥之區域之搬送方向之長度。 牛视 尤其，根據本巾請案之第4發明，既可抑制人口浮起△ 之搬送方向上游側之端緣部與基板 ： 制活輥之個數。 XT[體上抑 尤其’根據本中請案之第5發明，基板係以接觸支持於 降輕之狀態進行定位。因此，藉由升降輥與基板之摩 擦可抑制定位後之基板之水平方向之移動。 尤其’根據本中請案之第6發明，可抑制升降輥及活觀 之機械振動傳遞至入口浮起台。 尤其，根據本申請案之第7發明，可更容易地將活輥配 置於不與升降輥接觸之位置。 根據本申請案之第9發明〜第16發明，藉由將基板部分性 上推可使保持部進入至基板之下方而不會升降移動。 :此’既可固定保持部之高度位置，又可自下表面側保持 基板又，於將基板上推時，以水平姿勢接觸支持基板之 #刀。因此，可抑制上推時之基板之位置偏移。 尤其，根據本申請案之第1〇發明或第15發明，保持部可 保持基板之下表面之更正確之位置。 尤其，根據本申請案之第11發明或第16發明，可防止上 推基板時疋位構件與基板滑動接觸。 八’根據本申請案之第12發明，藉由彈性吸附體吸附 於美祐夕 ' 下表面並收縮，可將基板之下表面牽引至保持 面。 150753.doc 201133681 尤其，根據本申請案之第13發明，於上推基板時，搬送 方向之力難以作用於基板。因此，於上推基板時可抑制 基板之搬送方向之位置偏移。 【實施方式】 以下，一面參照圖式一面說明本發明之實施形態。 < 1.第1實施形態> <1-1.基板處理裝置之構成> 圖1係本發明之第1實施形態之基板處理裝置1之頂視 圖。該基板處理裝置1係於對液晶顯示裝置用之矩形之玻 璃基板9(以下僅稱作「基板9」）進行蝕刻之光微影步驟 中’用於對基板9之上表面塗佈抗姓液（光阻劑）之裝置。美 板處理裝置1包括將基板9一面以水平姿勢支持一面搬送之 機構。以下’將搬送基板9之方向稱為「搬送方向」，將與 搬送方向正交之水平方向稱為「寬度方向」。於本申請案 之各圖中’搬送方向及寬度方向係以箭頭表示。 如圖1所示，基板處理裝置丨包括：第1搬送部1〇、轉換 部20、第2搬送部30、抗蝕劑塗佈機構4〇、搬出部5〇、及 控制部60。圖2係第1搬送部1〇及轉換部2〇附近之頂視圖。 圖3係第1搬送部1〇及轉換部2〇附近之側視圖。又，圖4及 圖5係自圖1中之A-A位置觀察升降輥21、升降驅動機構 23、活輥24、及夾頭機構32之圖。以下，參照圖i，並且 亦參照圖2〜圖5。 第1搬送部10係將自前步驟之裝置2搬出之基板9沿搬送 路控搬送至轉換部20之部位。第1搬送部丨〇包括以向寬度 150753.doc 201133681 方向延伸之旋轉軸1 la為中心旋轉之複數個輸送輥丨丨。於 本實施形態中’於等間隔排列於長度方向之複數個旋轉軸 1 la上分別在寬度方向上等間隔地安裝有4個輸送輥丨丨。複 數個輸送輥11係配置於單一固定之高度位置。 於輸送輥11之旋轉軸11 a上連接有圖2中概念性表示之旋 轉驅動機構12。旋轉驅動機構12作為例如將成為驅動源之 馬達與傳遞驅動力之正時皮帶組合之機構而實現。若使旋 轉驅動機構12動作’則複數個輸送報丨丨向相同方向主動旋 轉。藉此，輸送輥11上所接觸支持之基板9向搬送方向下 游側搬送。 轉換部20係用以在第1搬送部1 〇與第2搬送部3〇之間轉換 基板9之支持方式之部位。如圖1~圖5所示，轉換部20包 括：複數個升降輥2 1、旋轉驅動機構22、升降驅動機構 23、複數個活輥24、入口浮起台25、4個導引輥26、定位 機構27、及複數個提昇銷28。 複數個升降輥21係以向寬度方向延伸之旋轉軸21a為中 心旋轉，且為設置成可上下升降移動之輥。於本實施形態 中’於排列於長度方向之2個旋轉軸2 la上分別在寬度方向 上等間隔地安裝有4個升降輥21。 於旋轉軸21a上連接有圖2中概念性表示之旋轉驅動機構 22。旋轉驅動機構22作為例如將成為驅動源之馬達與傳遞 驅動力之正時皮帶組合之機構而實現。若使旋轉驅動機構 22動作，則複數個升降輥21向相同方向主動旋轉。藉此， 升降輥21上所接觸支持之基板9向搬送方向下游側搬送。 150753.doc -12- 201133681 如圖4及圖5所示，於升降輥21之旋轉軸21a上連接有升 降驅動機構23。升降驅動機構23包括：經由軸承而支持旋 轉轴213之支臂23&、及使支臂23&升降移動之氣缸2313。若 使氣缸23b動作’則複數個升降輥以會於圖4所示之標準位 置與圖5所不之下降位置之間升降移動。再者，升降驅動 機構23亦可為利用氣缸以外之驅動機構（例如馬達）者。 配置於標準位置之升降輥21之上端部（與基板9之下表面 接觸之部位）之高度位置與輸送輥丨丨之上端部之高度位置 大致一致。又，配置於下降位置之升降輥21之上端部之高 度位置較活報24之上端部之高度位置更靠下方。 複數個活輥24係用以在升降輥2 1下降時代替升降輥2 1來 支持基板9之搬送方向上游側之一部分之輥。複數個活輥 24相對於設置於每個輥上之固有之旋轉軸而自由旋轉。若 在活輥24上支持有基板9之一部分之狀態下，基板9向下游 側移動，則複數個活輥24對應基板9之移動而從動地旋 轉。 複數個活輥24係配置於單一固定之高度位置。活輥24之 上端部之高度位置較配置於標準位置之升降輥21之上端部 南度位置更罪下方，且較配置於下降位置之升降報21之 上端部之高度位置更靠上方。又，活輥24之上端部之高度 位置成為與支持於入口浮起台25上之基板9之下表面及下 述失頭機構32之上端部大致相同之高度位置。 又如圖1及圖2所示，俯視下，各活報24係配置於不與 複數個升降軺(2 1及升降親2 1之旋轉軸21 a重合之位置。因 150753.doc -13· 201133681 此，複數個升降輥21及升降輥21之旋轉軸2u可升降移動 而不會與複數個活輥24接觸。 如圖2所示，複數個活輥24包括：複數個下游側活輥 24a'及複數個上游側活輥鳩。複數個下游側活觀^在 寬度方向上排列於配置在最靠㈣方向下游側之升降_ :入口浮起台25之間…複數個下游侧活親％沿入口 浮起台25之搬送方向上游側之端緣部排列。另一方面複 數個上游側活輥24b排列於較下游側活輥24a更靠搬送方向 上游側之位置。 鄰接之下游側活輥24a彼此之寬度方向之間隔窄於鄰接 之上游側活輥24b彼此之寬度方向之間隔。因此下游側 活輥24a之間之向基板9下方之撓曲變得小於上游側活輥 24b之間之向基板9下方之撓曲。藉此，可抑制人口浮起台 25之搬送方向上游側之端緣部與基板9之接觸。又，以低 於下游側活輥24a之密度配置上游側活輥2仆，藉此，可減 少作為整體之活輥24之個數。 又於本實施形態中，使用有較升降輕2 i直徑小之活親 24。因此，既可確保升降輥21升降移動之空間，又可容易 地將複數個活輥24配置於不與升降輥21接觸之位置。活親 可為自驅動機構疋全分離者’但若為可解除來自驅動機 構之動力傳遞者，則亦可連接於任意驅動機構。然而，於 活輥24上未連接有驅動機構者在可更容易地確保升降輥21 升降之空間方面較佳。 如圖3所不，複數個輸送輥丨丨、複數個升降輥21、及複 150753.doc 14 201133681 數個活親24由共用之幸昆支持台71所支持。另—方面，入口 浮起台25、下述塗佈平台31 '及下述出口浮起台51由獨立 於輥支持台71而設置之平台支持台72所支持。 即，於本實施形態中，藉由輥而接觸支持基板9之部位 〃在平台上浮起支持基板9之部位由不同之支持台所支 持，且相互不連結。藉此，可抑制來自輸送心、升降觀 21、及活輥24之機械振動傳遞至入口浮起台25、塗佈平台 3 1、及出口浮起台5 1。 入口浮起台25係配置於複數個活輥24之搬送方向下游 側。入口浮起台25支持升降輥21、活輥24、或下述之塗佈 平台31，並且支持基板9。於入口浮起台25之上表面設置 有用於喷出壓縮空氣之複數個噴出孔25&。 於搬送基板9時，自未圖示之供給源供給之壓縮空氣自 稷數個喷出孔25a向上方喷出。基板9係藉由自複數個喷出 孔25a噴出之壓縮空氣’以自入口浮起台25之上表面浮起 之狀態被支持著…入口浮起台25支持基板9而不與基 板9之下表面接觸。 4個導引輥26係轉換部20中用於將基板9向搬送方嚮導引 之機構。4個導引輥26係配置於基板9之搬送路徑之兩側 部。各導引輥26可以向上下延伸之旋轉軸為中心旋轉。若 基板9遠離搬送路徑，則導引輥26 一面接觸基板9之端緣部 一面旋轉。藉此，修正基板9之向，基板9向正確之搬送方 向搬送。 4個導引輥26可藉由未圖示之驅動機構而升降移動。於 150753.doc -15- 201133681 搬送基板9時，轉換部20之4個導引輥26成為向基板9之搬 送路徑之兩側部上升之狀態。另一方面，於下述之夾頭機 構32進入至基板9之下方時，4個導引輥26成為向不與夾頭 機構32接觸之高度位置下降之狀態。 疋位機構27係轉換部20中用於定位基板9之機構。定位 機構27包括向上下延伸之複數個定位銷27&。複數個定位 銷27a係配置於包圍轉換部2〇上所配置之基板9之位置。各 定位銷27a可藉由未圖示之驅動機構，而於抵接於基板9之 端緣部之位置、與自基板9之端緣部隔開之位置之間移 動。 若横跨標準位置之升降報21與人口浮起台25而配置基板 9，則複數個定位銷27a與基板9之端緣部抵接。藉此，規 定基板9之水平方向之位置及姿勢。另一方面，於搬送基 板9時、或於夾頭機構32進入至基板9之下方時，複數個定 位銷27a撤回至不與基板9或夾頭機構32接觸之位置。 複數個提昇銷28係轉換部20中用以在轉換基板9之支持 方式時暫時提昇基板9之寬度方向之兩端部之機構。複數 個提昇銷28係配置於在藉由定位機構”定位基板9之狀態 下自基板9之寬度方向《兩端部稍偏向寬度方向内側之位 置。又，複數個提昇銷28可藉由未圖示之驅動機構而一體 地升降移動。右使複數個提昇銷28上升，則提昇銷28與基 板9之下表面抵接’基板9之寬度方向之兩端部可藉由提昇 銷28而提昇。 於本實施形態中，複數個提昇銷28係配置於較入口浮起 150753.doc 201133681 台25之寬度方向之兩端部更靠寬度方向内你卜因此，下述 夾頭機構32可進人至人口浮起台25之寬度方向外側之位置 而不會與複數個提昇銷28接觸。X，基板9中，至少吸附 於夾頭機構32之部分露出於入口浮起台25之寬度方向外側 即可目企匕可抑制基板9自入口浮起台2 5之露出量。 如圖2所示，轉換部2〇之搬送方向之長度li設定為可配 置1個基板9左右之長度（即，較基板9之搬送方向之長㈣ 長之程度）。轉換部2〇中，配置有升降輥21及活輥Μ之區 域之搬送方向之長度L2、與入口浮起台乃之搬送方向之長 度L3均設定得短於基板9之搬送方向之長度。藉此卩 制轉換部20之搬送方向之長度。 士入浮起d25般浮起支持基板9之平台，於噴出孔25a 之形成等中需要高度之加工技術，製造成本亦較高。於本 實施形態中，可抑制此種入口浮起台25之搬送方向之長 度。藉此，基板處理裝置丨之製造變得容易，亦可抑制製 &成本又，供給至入口浮起台25之壓縮空氣之量亦可受 到抑制。 & 第2搬送部30係於對基板9之上表面塗佈抗蝕液時將基板 9向搬送方向下游側搬送之部位。如圖i所示，第2搬送部 30包括塗佈平台31及一對夾頭機構32。 塗佈平台3 1係配置於入口浮起台25之搬送方向下游側。 於塗佈平台31之上表面設置有用以嗔出壓縮空氣之複數個 噴出孔、及用以抽吸塗佈平台31上之空氣之複數個抽吸 孔。於塗佈平台31上搬送基板9時…複數個喷出孔噴 150753.doc 201133681 出壓鈿空氣而產生之向上方之壓力、與由對複數個抽吸孔 吸氣而產生之向下方之壓力係作用於基板9。藉此，基板9 以自塗佈平台31之上表㈣料之狀態被穩定地支持。 失頭機構32係於塗佈平台31之寬度方向外側配置為左右 一對。於各夾頭機構32上向搬送方向設置有一對吸附於基 板9之寬度方向之端部之下表面之吸附部32a。又，各夾頭 機構32可沿形成於平台支持台72之上表面之導轨32b，藉 由線性馬達等之驅動機構而向搬送方向移動。如圖i所 示導轨32b從/舌輥24之寬度方向外側之位置起向搬送方 向延伸至下述出口浮起台5丨之寬度方向外側之位置。一對 夾頭機構32可一面吸附保持基板9，一面將基板9自轉換部 20搬送至搬出部5〇。 抗蝕劑塗佈機構40係用以對一面支持於塗佈平台31一面 搬送之基板9之上表面塗佈抗餘液之機構。於圖丨中，為了 明確表示塗佈平台31及夾頭機構32，❿用虛線表示抗姓劑 塗佈機構40。抗蝕劑塗佈機構4〇包括：於塗佈平台3丨之上 方在寬度方向架設之橋接部41、及安裝於橋接部41上之狹 縫喷嘴42。狹縫喷嘴42將自未圖示之抗蝕液供給源供給之 抗蝕液經由向寬度方向延伸之狭縫狀之喷出口而喷出至基 板9之上表面。 搬出部50係用以自基板處理裝置i搬出塗佈有抗蝕液之 基板9之部位。如圖j所示，搬出部5〇包括出口浮起台η及 複數個搬出用銷52。 出口浮起台5 1係配置於塗佈平台3丨之搬送方向下游側。 150753.doc •18- 201133681 於出口浮起台51之上表面設置有用以喷出壓縮空氣之複數 個喷出孔。於出口浮起台51上支持基板9時，自未圖示之 供給源所供給之壓縮空氣，係自複數個喷出孔向上方噴 出。基板9以藉由自複數個喷出孔喷出之壓縮空氣而自出 口浮起台5 1之上表面浮起之狀態被支持著。即，出口浮起 台51支持基板9而不與基板9之下表面接觸。 複數個搬出用銷52係於出口浮起台5 1之面内向搬送方向 及寬度方向等間隔地排列。複數個搬出用銷5 2係於其等之 上知郤接觸支持基板9。又，複數個搬出用銷5 2可藉由未 圖示之驅動機構而一體地升降移動。因此，複數個搬出用 銷52可一面支持基板9一面使基板9上下移動。 於將基板9自塗佈平台31搬送至出口浮起台51時，複數 個搬出用銷52為了避免與基板9接觸而成為撤回至較出口 浮起台之上表面更靠下方之狀態。又，於自出口浮起台 5 1搬出基板9時，複數個搬出用銷52向較出口浮起台5 1之 上表面更上方突出。藉此，基板9被提昇至出口浮起台Η 之上方。複數個搬出用銷52上所支持之基板9，係藉:配 置於出口浮起台51之搬送方向下游側之轉移機械手3而被 搬送至後步驟之裝置4。 控制部60係由包括CPU(Central〜咖㈣灿，中央處 理器）及記憶體之電腦所構成。圖6係表示控制部Μ與基: 處理裝置!之各部分電性連接構成之方塊圖。如圖6所示， 控制部60與旋轉驅動機構12 ' 22及氣缸23b連接。又，控 制部60亦與圖i〜圖5中省略圖示之其他驅動機構、壓縮： 150753.doc 19 201133681 氣之供給機構、排氣機構、感測器等連接。控制部的係依 照預先設定之程式或資料，電性控制該等各部分之動作。 藉此，進行基板處理裝置丨中之基板9之處理。 <1-2.基板處理裝置之動作> 繼而，說明基板處理農置！之動作。圖7係表示基板處理： 裝置1之動作之流程的流程圖。 . 於基板處理裝置丨中處理基板9時，首先，藉由第丨搬送 部10搬送自前步驟之裝置2搬出之基板9(步驟S1)。基板9 接觸支持於輸送輥m，並藉由輸送親^旋轉而搬送至 搬送方向下游側。此時，升降輥21係配置於標準位置，向 與輸送輥11相同之方向旋轉。因此，基板9係由輸送親U 與升降親21連續地搬送至轉換部2〇。 又，此時，4個導引輥26成為向基板9之搬送路徑之兩側 邓上升之狀態。由該等導引輥26導引，基板9正確地向搬 送方向下游側搬送。 若基板9到達轉換部2〇，則升降輥21停止旋轉。藉此， 基板9以橫跨升降輥21與入口浮起台乃之狀態停止（步驟 S2) 〇 圖8係橫跨升降輥21與入口浮起台25而配置基板9時之轉 : 換部20附近之側視圖。基板9之搬送方向上游側之一部分 接觸支持於標準位置之升降輥21上。另一方面，基板9之 搬送方向下游側之一部分浮起支持於入口浮起台25上。基 板9申支持於入口浮起台25上之部分之高度位置變得低於 支持於升降輥21上之部分之高度位置。 150753.doc -20- 201133681 其次，複數個定位銷27a抵接於基板9之搬送方向上游 側、搬，方向下游側、及寬度方向兩側之各端緣部。藉 此規疋基板9之水平方向之位置及姿勢（步驟S3)。 若基板9之定位結束，則4個導引輥26下降向特定之撤 回位置撤回。又’複數個定位銷27a中抵接於基板9之寬 度方向之兩端緣部之定位銷27a亦自基板9隔開，向特定之 撤回位置撤回。定位銷27a撤回之後，基板9之搬送方向上 游側之一部分亦被升降輥21接觸支持。因此，藉由基板9 與升降輕21之靜態摩擦，可防止基板9之寬度方向之位置 偏移。 繼而，使複數個提昇銷28上升（步驟S4)。提昇銷28抵接 於基板9之下表面’提昇基板9之寬度方向之兩端部。圖9 係使複數個提昇銷28上升時之轉換部2〇附近之側視圖。如 圖9，複數個提昇銷28之上端部上升至較標準位置之升降 親21之上端部更上方之位置。 再者，本實施形態之基板9較為大型且具有可撓性。因 此，於步驟S4中，基板9中僅寬度方向之兩端部附近被提 昇。基板9之寬度方向之中央部分維持著支持於升降輥^ 及入口浮起台25之狀態。因此，藉由基板9與升降輥^之 靜態摩擦，可防止基板9之寬度方向之位置偏移。 又，於本實施形態中，使與基板9之寬度方向之兩端緣 部抵接之定位銷27a撤回之後，使複數個提昇鎖28上升。 因此，於使提昇銷28上升時，基板9之寬度方向之端緣部 與定位銷27a不會滑動接觸。藉此，可防止由基板9與定位 150753.doc •21 · 201133681 銷27a滑動接觸而引起產生微粒。 其後，使升降輥21自標準位置向下降位置下降（步驟 S5)。圖1〇係使升降輥21下降時之轉換部2〇附近之側視 圖。升降輥21之上端部之高度位置係較活輥以之上端部之 高度位置更靠下方。此時’基板9之寬度方向之兩端部附 近由提昇銷28支持，但於寬度方向之中央附近，複數個活 輥24代替複數個升降輥2丨而支持基板9之一部分。 繼而，如圖11，使夾頭機構32向搬送方向上游側移動。 藉此，於基板9之寬度方向之兩端部之下側配置夾頭機構 32。而且，於開始吸附部32a之抽吸動作之後，如圖η , 使複數個提昇銷28下降。藉此，使基板9之寬度方向之兩 端部吸附於夾頭機構32之吸附部32a(步驟S6)。基板9成為 如下狀態：搬送方向上游側之一部分接觸支持於活輥Μ 上，並且搬送方向下游側之一部分浮起支持於入口浮起台 2 5上此外，寬度方向之兩端部吸附保持於夾頭機構3 2。 於轉換部20中之步驟S3〜S6之動作期間，於基板9之搬送 方向上游側及搬送方向下游側之端緣部抵接有定位銷 27a。因此，可防止基板9之搬送方向之位置偏移。又步 驟S3〜S6期間，基板9藉由升降輥2丨或活輥24而繼續被接觸 支持。因此，可藉由升降輥21或活輥24與基板9之靜態摩 擦，而防止向基板9之寬度方向之位置偏移。 又，於本實施形態中，利用複數個提昇銷28暫且提昇基 板9之寬度方向之兩端部附近，藉由使該提昇銷28下降， 而使基板9之下表面接近夾頭機構32。因此，不必使夾頭 150753.doc •22· 201133681 可簡化夾頭機構32 機構32之吸附部32a上下移動。因此 之結構。 若基板9保持於一對夹頭機構以，則與基板9之搬送方 if游側及搬送方向下游側之端緣部抵接之定位銷⑺向 、疋之撤回位置撤回。而且，夾頭機構32沿導軌饥向搬 运方向下游側移動’藉此，基板9係向搬送方向下游側搬 送。 基板9-面浮起支持於各平台上—面自人口浮起台加 由塗佈平台31而搬送至出口浮起台51。狹縫噴嘴42向於涂 佈平台31上搬送之基板9之上表面喷出抗㈣。藉此，量; 基板9之上表面塗佈抗姓液（步驟S7)。 再者，於本實施形態中，於基板9之搬送方向下游側之 端部靠近狹縫喷嘴42之下方&置之前，基板9之搬送方向 上游側之端部係支持於入口浮起台25上。即，於對基板\ 之上表面塗佈抗蝕液之時間點，基板9整體浮起支持於 口浮起台25及塗佈平台31上。因此，可抑制活輥24之機2 振動傳遞至抗蝕液塗佈過程中之基板9。藉此，可抑制美 板9之上表面之抗蝕液之塗佈不良。 塗佈有抗蝕液之基板9搬送至出口浮起台5丨上而声止 其後，複數個搬出用銷52自出口浮起台51之上表面突出 藉此’向出口浮起台51之上方提昇基板9。其後，轉移機 械手3接受複數個搬出用銷52所支持之基板9，自轉移機械 手3向後步驟之裝置4轉移基板9。 如上所述’於本實施形態之基板處理裝置1中，轉換部 150753.doc -23- 201133681 土板9之搬送方向上游側之一部分自複數個升 21向複數個活輥24轉移。因&，可-面抑制入口浮起二25 之搬送方向之長度’-面轉換基板9之支持方式。又，活 輥24可以簡易之結構可靠地支持基板9,並且可配置於狹 小之區域中。因此’可容易地將複數個活親24配置於不與 複數個升降輥2 1接觸之位置。 <1-3.變形例> 以上，說明了本發明之第崤施形態，但本發明並不限 定於上述實施形態。 於上述貫施形態中，夹頭機構32之吸附部3以係固定於 固定之高度位置，但亦可使吸附部32a能夠上下升降移 動。若使吸附部32a可升降移動，則可使吸附部32a接近基 板9之下表面。因此，可省略提昇銷28對基板9之支持。 又，於上述貫施形態中，夾頭機構3 2係配置於基板9之 下表面側，但夾頭機構亦可配置於基板9之上表面側。 又’夾頭機構32亦可為上下夾持而保持基板9者。又，上 述實施形態之夾頭機構32於搬送方向上包括2個吸附部 32a ’但吸附部32a之個數可為1個，亦可為3個以上。 又’於上述實施形態中’表示有輸送輥1丨、升降輥2 i、 及活輥24之一例，但該等輥之大小、個數、及排列亦可根 據與成為處理對象之基板之類型及周圍之結構的關係而適 當地變更。 又’上述實施形態之第1搬送部10係以複數個輸送輥U 搬送基板9者，但本發明之第1搬送部亦可為以其他機構搬 150753.doc -24- 201133681 9“—板：持::9’亦可為-面於複數個活輥上支持基板 側搬送者。：，亦度方向之兩端部，向搬送方向下游 該務勒播杜 ' 為於某些移動構件上載置基板9且與 ^ —同向搬送方向下游側搬送基板9者。 本^月之丰專換部」為在空間或時間之意義上於第 ㈠般送部與第2搬送部之間轉換基板之支持方式者 如右在第！搬送部之搬送與第2搬送部之搬送之間之時間 上轉換基板之支持方式，則第1搬送部、㈣部、㈣⑽ ，部亦可作為空間配置而包括相互重複之部分。又，轉換 P亦可在卫間上自第丨搬送部或第2搬送部隔開。 又，上述基板處理裝置對基板9之上表面塗佈抗触液 之裝置’但本發明之基板處理裝置亦可為對基板塗佈抗钱 液以外之處理液之裝置。又’本發明之基板處理裝置亦可 為進行塗佈處理以外之處理（例如熱處理或曝光處理）之裝 置。 ’ 又，上述基板處理裝置1係以液晶顯示裝置用之玻璃基 板9為處理對象，但本發明之基板處理裝置亦可為以半導 體晶圓、薄膜液晶用可撓性基板、光罩用基板、彩色濾光 片用基板、太陽電池用基板、電子紙用基板等之其他基板 為處理對象者。 < 2.第2實施形態> <2-1.基板處理裝置之構成> 圖13係本發明之第2實施形態之基板處理裝置ι〇1之頂視 圖。該基板處理裝置101係於對液晶顯示裝置用之矩形之 150753.doc •25· 201133681 玻璃基板109(以下僅稱作「基板1〇9」）進行蝕刻之光微譽 步驟中，用以對基板109之上表面塗佈抗蝕液（光阻劑）之裝 置。基板處理裝置101包括將基板109 —面以水平姿勢支持 一面搬送之機構。以下，將搬送基板109之方向稱為「搬 送方向」’將與搬送方向正交之水平方向稱為「寬度方 向」。於本申請案之各圖中，搬送方向及寬度方向係以箭 頭表示。 如圖13所示，基板處理裝置1〇1包括：第丨搬送部ιι〇、 轉移部120、第2搬送部130、抗蝕劑塗佈機構丨4〇、搬出部 150、及控制部160。圖14係第i搬送部11〇及轉移部附 近之頂視圖。圖1 5係第1搬送部！丨0及轉移部丨2〇附近之側 視圖。以下，參照圖13 ,並且亦參照圖14及圖Μ。 第1搬送部110係將自搬送方向上游側之裝置1〇2搬出之 基板109沿搬送路徑搬送至轉移部12〇之部位。第丨搬送部 no包括以向寬度方向延伸之旋轉軸111&為中心旋轉之複 數個輸送輥。於本實施形態中，於等間隔排列於長度 方向之複數個旋轉軸llla上分別在寬度方向上等間隔地安 裝f 4個輸送輥^卜複數個輸送輥U1係配置於單一固定 之高度位置。 於輸送輥m之旋轉軸Ula上連接有圖14中概念性表示 :旋轉驅動機構112。旋轉驅動機構112作為例如將成為驅 源之馬達與傳遞驅動力之正時皮帶組合之機構而實現。 = <吏旋轉職機構112動作，則複數個輸送輥m向相同方 。主動旋轉。藉此，輸送輥lu上所接觸支持之基板1〇9向 150753.doc -26 - 201133681 搬送方向下游側搬送。 轉移部120係用以將基板109自第1搬送部110轉移至第2 搬送部1 3 0之部位。如圖丨3〜圖丨5所示，轉移部丨2〇包括： 複數個升降親1 2 1 '複數個活報丨24、入口浮起台125、4個 導引輥1 26、定位機構127、及上推機構128。 複數個升降輥121係以向寬度方向延伸之旋轉軸121&為 中心旋轉’且為設置成可上下升降移動之輥。於本實施形 態中’於排列於長度方向之2個旋轉軸121a上分別在寬度 方向上等間隔地安裝有4個升降輥1 2 1。 於旋轉軸12la上連接有圖14中概念性表示之旋轉驅動機 構1 22。旋轉驅動機構1 22作為例如將成為驅動源之馬達與 傳遞驅動力之正時皮帶組合之機構而實現。若使旋轉驅動 機構122動作，則複數個升降輥121向相同方向主動旋轉。 藉此’升降輥121上所接觸支持之基板109向搬送方向下游 側搬送。 圖21、圖23、圖25、圖27、及圖29係自圖13中之B-B位 置觀察轉移部1 20附近之結構之圖。如該等圖所示，於升 降輥121之旋轉軸12 la上連接有升降驅動機構123。升降驅 動機構12 3包括：經由軸承而支持旋轉軸121 a之支臂 123a、及使支臂123a升降移動之氣缸123b。若使氣缸123b 動作’則複數個升降輥121會於圖2 1及圖23所示之標準位 置與圖25、圖27、及圖29所示之下降位置之間升降移動。 再者，升降驅動機構123亦可為利用氣缸以外之驅動機構 (例如馬達）者。 150753.doc -27· 201133681 配置於標準位置之升降輥i 2 i之上端部（與基板1 〇9之下 表面接觸之部位）之高度位置與輸送輥111之上端部之高度 位置大致一致。又，配置於下降位置之升降輥121之上端 部之南度位置較活輥124之上端部之高度位置更靠下方。 複數個活輥124係用以在升降輥121下降時代替升降輥 121來支持基板1〇9之搬送方向上游側之一部分之輥。複數 個活輥124相對於設置於每個輥上之固有之旋轉軸而自由 旋轉。若在活輥124支持基板1〇9之一部分之狀態下，基板 109向下游側移動’則複數個活輥124對應基板1〇9之移動 而從動地旋轉。 複數個活輥124係配置於單一固定之高度位置。活輥124 之上端部之高度位置較配置於標準位置之升降輕l2i之上 端部之高度位置更靠下方，且較配置於下降位置之升降輥 121之上端部之高度位置更靠上方。又，活輥124之上端部 之高度位置成為與支持於入口浮起台i 25上之基板1〇9之下 表面及下述夾頭機構132之上端部大致相同之高度位置。 又，如圖13及圖14所示，俯視下，各活輥124係配置於 不與複數個升降輥121及升降輥121之旋轉軸121&重合之位 置。因此，複數個升降輥121及升降輥121之旋轉軸121&可 升降移動而不會與複數個活輥124接觸。 如圖14所示’複數個活輥124包括：複數個下游側活親 124a、及複數個上游側活輥124b。複數個下游側活觀丨24a 向寬度方向排列於配置於最搬送方向下游側之升降輕121 與入口浮起台125之間。即，複數個下游側活輥丨沿入 150753.doc -28· 201133681 口浮起台⑵之搬送方向上游側之端緣部排 二複數個上游側活_非列於較下游側活輥二: 搬送方向上游側之位置。 罪 啡接之下游側活輥丨24a彼此 一八々w <间隔窄於齟蛀 之上游側活輥124b彼此之寬度方向 、 ... 间丨网。因此，下游伽 活輥124a之間之向基板1〇9下方 ± _ 銳曲變得小於上游側活 輥124b之間之向基板1〇9下方 4如厶，n 猊曲。猎此，可抑制入口 25之搬送方向上游側之端緣部與基板⑽之接觸。 又’以低於下游側活輥12钻之密度配置上游側活親⑽， 藉此，可減少作為整體之活輥124之個數。 又’於本實施形態中’使用有較升降㈣丨直徑更小之 活輥124。因此，可—面確保升降船21升降移動之空間， -面容易地將複數個活親124配置於不與升降親⑵接觸之 位置。活輥124可為自驅動機構完全分離者，但若為可解 除來自驅動機構之動力傳遞者，則亦可連接於任意驅動機 構。然而，於活輥124上未連接有驅動機構者在可更容易 地確保升降輥121升降之空間方面較佳。 如圖15所示，複數個輸送輥m、複數個升降輥i2i、及 複數個活輥124由共用之輥支持台171所支持。另一方面， 入口浮起台125、下述塗佈平台131、及下述出口浮起台 1 5 1由獨立於親支持台} 71而設置之平台支持台1 π所支 持。 即’於本實施形態中，藉由輥而接觸支持基板1〇9之部 位與在平台上浮起支持基板109之部位由不同之支持台支 150753.doc •29· 201133681 持，且相互不連結。藉此，可抑制來自輸送輥i丨丨、升降 輥121、及活親124之機械振動傳遞至入口浮起台125、塗 佈平台131、及出口浮起台151。 入口浮起台125係配置於複數個活輥124之搬送方向下游 側。入口浮起台125支持升降輥121、活輥丨24、或下述塗 佈平台131，並且支持基板丨〇9。於入口浮起台125之上表 面設置有用以喷出壓縮空氣之複數個喷出孔125a。 於搬送基板1 09時，自未圖示之供給源供給之壓縮空氣 自複數個喷出孔125a向上方喷出。基板1〇9係藉由自複數 個噴出孔125a喷出之壓縮空氣，以自入口浮起台125之上 表面浮起之狀態被支持著。即，入口浮起台125支持基板 109而不與基板1〇9之下表面接觸。 4個導引輥126係轉移部120中用以將基板1〇9向搬送方嚮 導引之機構。4個導引輥126係配置於基板1〇9之搬送路徑 之兩側部。各導引輥126可以向上下延伸之旋轉軸為中心 旋轉。若基板109遠離搬送路徑，則導引輥126一面接觸基 板109之端緣部一面旋轉。藉此，修正基板1〇9之方向而使 基板109向正確之搬送方向搬送。 4個導引輥126可藉由未圖示之驅動機構而升降移動。於 轉移部120中搬送基板109時，4個導引輥126成為向基板 109之搬送路徑之兩側部上升之狀態。另一方面，於下述 夾頭機構132進入至基板109之下方時’ 4個導引報126成為 向不與夾頭機構132接觸之高度位置下降之狀態。 定位機構丨27係轉移部120中用以定位基板1〇9之機構。 150753.doc -30· 201133681 定位機構127包括向上下延伸之複數個定位銷ΐ27”定位 銷—係本發明中之「定位構件」之一例。複數個定位銷 127“糸配置於包圍轉移部12〇上所配置之基板⑽之位置。 ·· ^銷127a可藉由未®示之驅動機構’而於抵接於基板 1G9之端緣部之位置、與自基板1()9之端緣部隔開之位置之 '間移動。 若橫跨標準位置之升降親121與入口浮起台125而配置基 板9則複數個疋位銷127a與基板1 〇9之端緣部抵接。藉 此，.規定基板1〇9之水平方向之位置及姿勢。另一方面， 於搬送基板109時、或於夾頭機構132進入至基板1〇9之下 方時，複數個定位銷]27a撤回至不與基板1〇9或夹頭機構 13 2接觸之位置。 上推機構128係在轉移部12〇轉移基板1〇9時用以將基板 之寬度方向之兩端部暫時上推之機構。上推機構⑶包 括向上下延伸之複數個S昇銷128a。複數個提昇銷128a係 2長度方向排列於在基板1〇9藉由定位機構127而定位之狀 恶下，自基板109之寬度方向之兩端部稍偏向寬度方向内 側之位置。又，複數個提昇銷1283可藉由未圖示之驅動機 構而體地升降移動。若使複數個提昇銷〗28a上升，則提 幵銷128a與基板1〇9之下表面抵接，基板1〇9之寬度方向之 兩端部附近可藉由提昇銷128而上推。 圖23、圖25、及圖27表示藉由上推機構128將基板1〇9之 兩鳊σ卩附近上推之狀態。如該等圖所示，於使複數個提昇 銷128a上升時，藉由基板1〇9撓曲，而僅將基板1〇9之寬度 150753.doc -31 · 201133681 方向之兩端部附近上推。基板109之寬度方向之中央部分 維持以水平姿勢接觸支持於升降報121或⑼124上 態。 又，如圖13及圖14所示，複數個提昇銷1283係配置於較 入口子起台125之寬度方向之兩端部更靠寬度方向内側。 因此，於使複數個提昇銷128a上升時，下述夾頭機構132 °進入至入口浮起台125之寬度方向外側之位置而不會與 複數個提昇銷128a接觸。又’基板1〇9中，至少吸附於： 碩機構132之部分露出於人σ浮起台125之寬度方向外側即 可。因此，可抑制基板109自入口浮起台125之露出量。 如圖14所示，轉移部12〇之搬送方向之長度匕丨設定為可 配置1個基板109左右之長度（即，稍長於基板109之搬送方 向之長度左右）。轉移部120中，配置有升降輥121及活輥 124之區域之搬送方向之長度L2、與入口浮起台125之搬送 方向之長度L3均設定得短於基板1〇9之搬送方向之長度。 藉此’可抑制轉移部120之搬送方向之長度。 如入口浮起台125般浮起支持基板1〇9之平台，於噴出孔 125a之形成等中需要高度之加工技術，製造成本亦較高。 於本實施形態中，可抑制此種入口浮起台125之搬送方向 之長度。藉此，基板處理裝置1〇丨之製造變得容易，亦可 抑制製造成本。又，供給至入口浮起台125之壓縮空氣之 量亦可受到抑制。 第2搬送部130係於對基板1〇9之上表面塗佈抗蝕液時將 基板109向搬送方向下游側搬送之部位。如圖丨3所示，第2 150753.doc •32- 201133681 搬送部130包括塗佈平台131及一對夹頭機構132。 塗佈平台13 1係配置於入口浮起台1 25之搬送方向下游 側。於塗佈平台1 3 1之上表面設置有用以喷出壓縮空氣之 複數個喷出孔、及用以抽吸塗佈平台131上之空氣之複數 個抽吸孔。於塗佈平台1 3 1上搬送基板1 〇9時，由自複數個 噴出孔喷出壓縮空氣而產生之向上方之壓力、與由對複數 個抽吸孔吸氣而產生之向下方之壓力作用於基板1〇9。藉 此’基板109以自塗佈平台131之上表面稍浮起之狀態，被 穩定地支持。 夾頭機構1 3 2係於塗佈平台13 1之寬度方向外側配置為左 右一對。於各夾頭機構132上向搬送方向設置有一對自下 表面侧吸附保持基板109之寬度方向之端部之吸附保持部 132a。又，各夾頭機構132可沿形成於平台支持台172之上 表面之導轨132b，藉由線性馬達等之驅動機構而向搬送方 向移動。如圖13所示，導軌132b從活輥124之寬度方向外 側之位置起向搬送方向延伸至下述出口浮起台〖Η之寬度 方向外側之位置。一對夾頭機構132可一面吸附保持基板 109 ’ 一面將基板109自轉移部12〇搬送至搬出部15〇。 圖16及圖17係吸附保持部132a之上表面附近之部分放大 縱剖面圖。如圖16及圖17所示，吸附保持部132&包括與基 板109之下表面接觸之保持面321。基板1〇9中保持於吸附 保持部132a之部分之下表面之高度位置係藉由保持面321 而規定。又，於吸附保持部132&形成有自保持面321向下 方凹陷之槽322、及於槽322之底部開口之抽吸孔323。 150753.doc 201133681 於槽322之内部配置有可向上下方向伸縮並且吸附於基 板109之下表面之彈性吸附體324。彈性吸附體324形成為 具有蛇腹狀之側面之大致圓筒形。彈性吸附體324之下側 之開口部與抽吸孔323連通。又，彈性吸附體324之上側之 開口部向上方開放。 抽吸孔323連接於未圖示之吸氣泵。若使吸氣泵動作， 則於抽吸孔323及彈性吸附體324之内部產生負壓。藉此， 吸附保持部132a之上方之空氣如圖16中箭頭所示，經由彈 性吸附體324而被抽吸至抽吸孔323。 如圖16所示，於吸附至基板109之前，彈性吸附體324之 上端部較保持面321向上方突出。若一面進行上述抽吸， 一面使基板109接近吸附保持部i32a之上表面，則彈性吸 附體324吸附於基板1〇9之下表面並且收縮。而且，如圖17 所示’於吸附時，彈性吸附體324之上端部位於與保.持面 321相同之高度。藉此，基板1〇9之下表面接觸保持於保持 面 321。 如此，於本實施形態中，藉由彈性吸附體324吸附於基 板109之下表面並且收縮，而將基板1〇9之下表面牽引至保 持面321。因此，例如，即便基板109之端緣部附近藉由上 推提昇銷128a而稍微傾斜，亦可以較高之可靠性使芙才 109之下表面保持於吸附保持部132a。 關於夾頭機構132 ’較理想的是於1個吸附保持部具 有複數個彈性吸附體324。若如此，則可抑制 八 叫剌由弹性吸附 體324之吸附本身所產生之基板1〇9之翹曲。 此，可以更 150753.doc -34- 201133681 尚之可靠性使基板109保持於吸附保持部丨32a。 又’如圖13所示，於吸附保持部132&設置有檢測基板 109之位置偏移之位置偏移感測器325。位置偏移感測器 325係於基板1〇9自所需位置偏移而保持於吸附保持部U2a 時，檢測超出保持面321之基板1 〇9。控制部1 6〇若自位置 偏移感測器325接收到檢測信號，則使夾頭機構132之移動 停止等，防止對基板1〇9之塗佈不良。 抗蝕劑塗佈機構140係用以對一面支持於塗佈平台131 一 面搬送之基板109之上表面塗佈抗蝕液之機構。於圖13 中，為了明確表示塗佈平台131及夾頭機構132，而以虛線 表示抗蚀Η,丨塗佈機構14 0。抗敍劑塗佈機構14 〇包括：於塗 佈平台131之上方在寬度方向架設之橋接部141、及安裝於 橋接部141上之狹縫喷嘴142。狹縫喷嘴142將自未圖示之 抗蝕液供給源供給之抗蝕液經由向寬度方向延伸之狹縫狀 之喷出口而喷出至基板109之上表面。 搬出部150係用於自基板處理裝置1〇1搬出塗佈有抗蝕液 之基板109之部位。如圖13所示’搬出部15〇包括出口浮起 台1 5 1及複數個搬出用銷丨52。 出口浮起台151係配置於塗佈平台131之搬送方向下游 側於出口浮起台！ 5 i之上表面設置有用以喷出壓縮空氣 之複數個噴出孔。於出口浮起台151上支持基板1〇9時，自 未圖示之供給源供給之壓縮空氣自複數個喷出孔向上方噴 出。基板109以藉由自複數個噴出孔噴出之壓縮空氣而自 出口洋起台151之上表面浮起之狀態被支持著。即，出口 150753.doc •35- 201133681 浮起台151支持基板109而不與基板109之下表面接觸。 複數個搬出用銷1 5 2係於出口浮起台15 1之面内向搬送方 向及寬度方向等間隔地排列。複數個搬出用銷1 52係於其 專之上端部接觸支持基板109。又，複數個搬出用銷152可 藉由未圖示之驅動機構而一體地升降移動。因此，複數個 搬出用銷152可一面以水平姿勢支持基板109 ’ 一面向出口 浮起台151之上方提昇基板109。 於將基板109自塗佈平台131搬送至出口浮起台ι51時， 複數個搬出用銷152為了避免與基板109接觸而成為撤回至 較出口浮起台151之上表面更靠下方之狀態。又，於自出 口浮起台151搬出基板109時，複數個搬出用銷152向較出 口浮起台151之上表面更上方突出。藉此，基板丨〇9被提昇 至出口浮起台151之上方。複數個搬出用銷152上所支持之 基板109係藉由配置於出口浮起台151之搬送方向下游側之 轉移機械手1 03而被搬送至後步驟之裝置丨〇4。 控制部160係藉由包括cpu及記憶體之電腦而構成。圖 18係表示控制部160與基板處理裝置1〇1之各部分電性連接 構成之方塊圖。如圖18所示，控制部16〇與第ι搬送部 110、轉移部12〇、第2搬送部130、抗姓劑塗佈機構刚、 及搬出。卩15G連接。更具體而言，控制部i6Q與設置於該等 之各部分之各種驅動機構、感測器、麼縮空氣之供給機 構、排氣機構等連接。例如，控制部16〇與用以使定位機 構127之複數個疋位銷⑵“多動之驅動機構、用以使上推 機構128之複數個提昇銷伽升降移動之驅動機構、及用 150753.doc * 36 - 201133681 以使夾頭機構132移動之線性馬㈣連接。控制部i6〇係依 照預先設定之程式或資料，電性控制該等各部分之動作。 藉此，進行基板處理裝置101中之基板1〇9之處理。 <2_2.基板處理裴置之動作> . 繼而’說明基板處理農置1G1之動作。圖19係表示基板 • 處理裝置101之動作之流程的流程圖。圖20、圖22、圖 24、圖26、及圖28係步驟Sl〇2〜Sl〇8中之轉移部12〇附近之 側視圖。又，如上所述，圖21、圖23、圖25、圖27、及圖 29係自圖13中之B-B位置觀察轉移部12〇附近之結構之圖。 圖21 '圖23、圖25 '圖27、及圖29分別表示與圖2〇、圖 22、圖24、圖26、及圖28相同時間點之狀態。 於基板處理裝置1〇1中處理基板1〇9時，首先，藉由第1 搬送部110搬送自前步驟之裝置1〇2搬出之基板1〇9(步驟 • S101)。基板109接觸支持於輸送輥U1上，藉由輸送輥 之旋轉而搬送至搬送方向下游側。此時，升降輥121係配 置於標準位置，向與輸送輥丨丨丨相同之方向旋轉。因此， 基板109係由輸送輥ill與升降輥121連續地搬送至轉移部 120為止。 又，此時，4個導引輥126成為向基板1〇9之搬送路徑之 - 兩側部上升之狀態。受該等導引輥126導引，基板109正確 地向搬送方向下游側搬送。 若基板109到達轉移部12〇，則升降輥121停止旋轉。藉 此’基板109以橫跨升降輥m與入口浮起台125之狀態停 止（步驟S102，圖20及圖21之狀態）。如圖20所示，基板 150753.doc -37· 201133681 109之搬送方向上游側之一部分接觸支持於標準位置之升 牛輥121上。另一方面，基板〗〇9之搬送方向下游側之一部 刀浮（支持於入口浮起台125上。基板1〇9中支持於入口浮 起台1 2 5上之部分之高度位置變得低於支持於升降輥12〗上 之部分之高度位置。 其次，複數個定位銷12乃抵接於基板1〇9之搬送方向上 游側、搬送方向下游側、及寬度方向兩側之各端緣部。藉 此，規定基板109之水平方向之位置及姿勢（步驟sl〇3)。 如此，藉由進行基板1〇9之定位，可於下述步驟31〇8中， 使基板109之下表面之更正確之位置保持於吸附保持部 1 32a ° 若基板109之定位結束，則4個導引輥126下降，向特定 之撤回位置撤回。又，複數個定位銷127a中，抵接於基板 1 〇9之寬度方向之兩端緣部之定位銷丨27a亦自基板i〇9隔 開，向特定之撤回位置撤回（步驟S104)。定位銷127a撤回 之後，基板109之搬送方向上游側之一部分亦被升降輥121 接觸支持。因此’藉由基板109與升降輥121之靜態摩擦， 可防止基板109之寬度方向之位置偏移。 繼而’使複數個提昇銷丨28a上升（步驟S 1 05，圖22及圖 23之狀態）。提昇銷128a抵接於基板1〇9之下表面，將基板 109之寬度方向之兩端部附近上推。如圖22及圖23所示， 複數個提昇銷128a之上端部上升至較標準位置之升降輥 121之上端部更上方之位置。 本實施形態之基板109較為大型且具有可撓性。因此， 150753.doc •38· 201133681 於步驟SI 05中，基板109中僅寬 分性蚰！. 龙度方向之兩端部附近被部 性地上推。基板109之寬度 12 1 » 、邛为維持被升降 輥121及入口浮起台125支持之狀鲅。 ώ： ^ ^ 尤其，基板109之寬 度万向之中央部分中搬送 〇上斿側之一部分依然被升降 車是12 1接觸支持。因此，蕪ώ 9 土板109與升降輥121之靜態 摩U，可防止基板109之寬度方向之位置偏移。 又，於本實施形態中，使與基板1〇9之寬度方向之兩端 緣部抵接之定位銷127a撤回之後’使複數個提昇銷_上 升。因此’於使提昇銷128a上升時，基㈣9之寬度方向 之端緣部與定位銷127a不會滑動接觸。藉此，可防止由基 板1〇9與定位銷12乃滑動接觸而引起之微粒之產生。土 其後，使升降輥121自標準位置向下降位置下降（步驟 S106，圖24及圖25之狀態）。若使升降輥121下降，則升降 輥121之上端部之高度位置係較活輥124之上端部之高度位 置更靠下方。因此，複數個活輥124代替複數個升降輥12工 而支持基板109之寬度方向之中央部分中搬送方向上游側 之一部分。基板109之寬度方向之兩端部附近維持被複數 個提昇銷128a支持之狀態。 繼而’使一對夾頭機構13 2向搬送方向上游側移動。藉 此，使吸附保持部132a進入至基板1〇9之被上推之部分之 下方（步驟S107 ’圖26及圖27之狀態）。而且，於開始吸附 保持部132a之抽吸動作之後，使複數個提昇銷i 28a下降。 即’解除上推機構128對基板109之上推。藉此，使基板 109之寬度方向之兩端部接近夾頭機構132之吸附保持部 150753.doc -39- 201133681 132a。 吸附保持部132a之彈性吸附體324吸附於基板1〇9之下表 面，其後，藉由負壓而收縮。藉此，基板1〇9之下表面被 牽引至吸附保持部1323之保持面321。其結果，基板1〇9之 寬度方向之端部吸附保持於吸附保持部132&(步驟Μ⑽， 圖28及圖29之狀態）。基板1〇9成為下述狀態：搬送方向上 游側之一部分接觸支持於活輥124上，並且搬送方向下游 側之一部分浮起支持於入口浮起台125上，此外，寬度方 向之兩端部吸附保持於夾頭機構132。 於本實施形態中，於轉移部12〇中之步驟sl〇3〜sl〇8之動 作期間，於基板109之搬送方向上游側及搬送方向下游側 之端緣部抵接有定位銷12乃❶藉此，可防止基板1〇9之搬 送方向之位置偏移。再者，當如本實施形態般將基板1〇9 之寬度方向之兩端部附近上推時，搬送方向之力原本就難 以作用於基板109。因此，即便上推時不與定位銷127&抵 接，基板109之搬送方向之位置偏移亦難以產生。 又，步驟S103〜S108之期間，基板1〇9藉由升降輥121或 活輥124而繼續被接觸支持。因此，可藉由升降輥i2i或活 輥124與基板1〇9之靜態摩擦，而防止向基板1〇9之寬度方 向之位置偏移。 又，於本實施形態中’利用複數個提昇銷128&暫且將基 板1〇9之寬度方向之兩端部附近上推’藉由使該提昇銷 128a下降’而使基板1Q9之下表面接近夹頭機構132之吸附 保持部132a。藉此，一面固定吸附保持部132&之高度位 150753.doc 201133681 置，一面使基板1〇9之下表面保持於吸附保持部咖。因 此，可排除用以使吸附保持部132晴降移動之機構而使爽 頭機構132為簡易之結構。 若基板109保持於一對夾頭機構132上則與基板⑽之 搬送方向上游側及搬送方向下游側之端緣部抵接之定位銷 127a向特疋之撤回位置撤回。而且，夾頭機構⑴沿導軌 U2b向搬送方向下游側移動’藉此，基板109係向搬送方 向下游側搬送。 基板109 -面浮起支持於各平台上一面自入口浮起台125 經由塗佈平台⑶而搬送至出口浮起台。卜狹縫喷嘴142 :於塗佈平台131上搬送之基板1〇9之上表面喷出抗蝕液。 藉此，對基板109之上表面塗佈抗蝕液（步驟w〇9)。 再者，於本實施形態中，於基板109之搬送方向下游側 之端部靠近狹縫喷嘴142之下方位置之前，基板1〇9之搬送 方向上游側之端部係支持於入口浮起台125上。即，於對 基板109之上表面塗佈抗蝕液之時間點，基板1〇9整體浮起 支持於入口浮起台125及塗佈平台131上。因此，可抑制活 輥124之機械振動傳遞至抗蝕液塗佈過程中之基板。藉 此，可抑制基板1 〇9之上表面之抗蝕液之塗佈不良。 塗佈有抗蝕液之基板109搬送至出口浮起台151上為止而 仔止。而且，夹頭機構132之吸附保持部Η。藉由使抽吸 動作彳T止而解除基板109之吸附。於解除吸附之後，於基 板109與彈性吸附體324之間亦作用有靜態摩擦，因此可抑 制基板109之偏移。 150753.doc 41 201133681 若爽頭機構132對基板109之吸附解除，則複數個搬出用 銷152自出口浮起台151之上表面突出。藉此，向出口浮起 台151之上方提昇基板109。其後，轉移機械手1〇3接受複 數個搬出用銷152所支持之基板1〇9 ’自轉移機械手1〇3向 後步驟之裝置104轉移基板1〇9。 <2-3.變形例> 以上，說明了本發明之第2實施形態，但本發明並不限 定於上述實施形態。 上述實施形態之第丨搬送部110係以複數個輸送輥iu搬 送基板109者，但本發明之「第丨搬送部」亦可為以其他機 構搬送基板109者。例如’亦可為—面於複數個活親上支 持基板109，—面藉由其他方法將向搬送方向下游側之推 進力提供給基板1〇9，向搬送方向下游側搬送者。又，亦 可為-面於某些移動構件上保持基板⑽，_面與該移動 構件一同向下游側搬送基板1〇9者。 又，於上述實施形態中，於轉移部12〇中利用升降輥Hi 或與人口浮起台125支持基板⑽之寬度方向之中 N 但基板109之寬度方向之中央部分亦可以其他支 持形態來支持。例如，基板1G9之寬度方向之 可僅被輥所支持。 刀丌 又，上述實施形態之上推機構128將基板1〇9之寬度方向 之兩端部附近上推，但本發明之「上推機構」亦可美 :1。9之其他部位上推者。例如，亦可將基板1〇9之搬送二 °之兩端部附近上推’_機構132進入至該兩端部附 150753.doc •42. 201133681 近之下方。 又，於上述實施形態中，作為本發明中之「定位構件」 之例，列舉有定位銷127a。然而，本發明之「定位構 件」若為抵接於基板1〇9而進行定位者，則亦可為具有板 狀等之其他形狀者。 又，上述基板處理裝置1〇1係對基板1〇9之上表面塗佈抗 蝕液之裝置，但本發明之基板處理裝置亦可為對基板塗佈 抗蝕液以外之處理液之裝置。又，本發明之基板處理裝置 亦可為進行塗佈處理以外之處理（清潔處理、乾燥處理、 熱處理、曝光處理、顯影處理等）之裝置。 又，上述基板處理裝置101將液晶顯示裝置用之玻璃基 板1 〇9作為處理對象，但本發明之基板處理裝置亦可將半 導體晶圓、薄膜液晶用可撓性基板、光罩用基板、彩色濾 光片用基板、太陽電池用基板、電子紙用基板等之其他基 板作為處理對象。 【圖式簡單說明】 圖1係基板處理裝置之頂視圖。 圖2係第1搬送部及轉換部附近之頂視圖。 圖3係第1搬送部及轉換部附近之側視圖。 升降驅動機構、 圖4係自圖1中之A-A位置觀察升降輥、 活輥、及夾頭機構之圖。 圖5係自圖1中之A-A位置觀察升降輥、 W丨令馬6動機構 活輥、及夾頭機構之圖。 圖6係表不控制部與基板處理裝置之各部之電性連接構 150753.doc .43- 201133681 成的方塊圖。 圖7係表示基板處理裝置之動作之流程的流程圖。 圖8係橫跨升降輥與入口浮起台而配置基板時之轉換部 附近之側視圖。 圖9係使複數個提昇銷上升時之轉換部附近之側視圖。 圖1 〇係使升降輥下降時之轉換部附近之側視圖。 圖11係於基板之寬度方向之兩端部之下侧配置夾頭機構 時之轉換部附近之側視圖。 圖12係使基板之寬度方向之兩端部吸附於夾頭機構時之 轉換部附近之側視圖。 圖13係基板處理裝置之頂視圖。 圖14係第1搬送部及轉移部附近之頂視圖。 圖15係第1搬送部及轉移部附近之側視圖。According to a tenth aspect of the invention, in the substrate processing apparatus of the ninth aspect, the transfer unit further includes a position mechanism that performs a push-up mechanism of the other portion in the horizontal direction of the substrate, and the surface-side holding substrate faces the translation. The control unit controls the positioning mechanism and the push-up mechanism such that the substrate is pushed up by the push-up mechanism after the positioning mechanism is positioned. The invention of claim 11, wherein the positioning mechanism includes a positioning member abutting against an edge portion of the substrate, and the control portion controls the push-up mechanism and the The positioning mechanism, that is, after positioning the positioning mechanism, the positioning member that abuts the other portion of the substrate is withdrawn from the substrate, and then the substrate is pushed up by the push-up mechanism. The substrate processing apparatus according to any one of the ninth to eleventh invention, wherein the holding portion includes: a holding surface that defines a height position of a lower surface of the substrate when held; and elastic adsorption a body that is stretchable in the up-down direction and adsorbed on the lower surface of the substrate; and before the adsorption on the substrate, the upper end portion of the elastic adsorbing body is located above the holding surface, and the upper end portion of the elastic adsorbing body is adsorbed on the substrate Located at the same height as the above-mentioned holding surface. The substrate processing apparatus according to any one of the ninth to (four)th invention, wherein the push-up mechanism is adjacent to both ends of the direction in which the substrate is conveyed in the direction of the parent Push up. In the fourth aspect of the present invention, the fourth aspect of the present invention is a transfer method of transferring a substrate from a transfer unit to a second transfer unit, which includes the following steps: a) Maintaining the state of the portion of the support substrate in a horizontal posture, pushing up the other portions of the substrate; b) in the above step a), 'keeping the material into the lower portion of the substrate pushed up; c) After the step b), the method of transferring the substrate is pushed up, and the method of transferring the substrate is further performed. The method of the present invention is as follows: The 14th invention includes the following steps: d) before the above step a) Position it. According to a sixteenth aspect of the present invention, in the first aspect of the present invention, in the step d), the positioning member is brought into contact with the edge portion of the substrate, and further includes the following steps: e) in the above step d) The positioning member abutting on the other portion of the substrate is withdrawn from the substrate between the above steps a). [Effects of the Invention] According to the first invention to the eighth aspect of the present invention, in the conversion unit, a part of the upstream side in the transport direction of the substrate is transferred from the lift roller to the movable roller. Thereby, the support mode of the substrate can be switched while suppressing the length of the transfer direction of the inlet floating table. The live roller can reliably support the substrate in a simple structure and can be disposed in a narrow area. Therefore, the movable roller can be easily disposed at a position not in contact with the elevating roller. According to the third invention of the present application, the length of the conveying direction of the region in which the movable roller is disposed can be suppressed. In particular, according to the fourth invention of the present invention, it is possible to suppress the number of the edge portions on the upstream side and the substrate: the number of the production rollers in the transport direction of the population floating Δ. XT [in particular, in particular] According to the fifth invention of the present application, the substrate is positioned in a state in which contact is supported to reduce lightness. Therefore, the horizontal movement of the substrate after positioning can be suppressed by the friction of the lift roller and the substrate. In particular, according to the sixth invention of the present application, it is possible to suppress the transmission of the lifting roller and the vibrating mechanical vibration to the inlet floating table. In particular, according to the seventh invention of the present application, the movable roller can be more easily placed at a position not in contact with the elevating roller. According to the ninth invention to the sixteenth aspect of the present invention, the holding portion can be moved to the lower side of the substrate without pushing up and down by pushing the substrate partially. This can fix the height position of the holding portion, and can hold the substrate from the lower surface side, and contact the support substrate in a horizontal posture when the substrate is pushed up. Therefore, the positional shift of the substrate during the push-up can be suppressed. In particular, according to the first invention or the fifteenth invention of the present application, the holding portion can maintain a more correct position of the lower surface of the substrate. In particular, according to the eleventh invention or the sixteenth aspect of the present invention, it is possible to prevent the aligning member from slidingly contacting the substrate when the substrate is pushed up. According to the twelfth invention of the present application, the lower surface of the substrate can be pulled to the holding surface by the elastic adsorbing body adsorbed on the lower surface of the Meiyouxi and contracted. In particular, according to the thirteenth invention of the present application, when the substrate is pushed up, the force in the transport direction is hard to act on the substrate. Therefore, the positional shift of the substrate in the transport direction can be suppressed when the substrate is pushed up. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. <1. First embodiment><1-1. Configuration of Substrate Processing Apparatus> Fig. 1 is a top plan view of a substrate processing apparatus 1 according to the first embodiment of the present invention. The substrate processing apparatus 1 is used to apply an anti-surname liquid to the upper surface of the substrate 9 in a photolithography step of etching a rectangular glass substrate 9 (hereinafter simply referred to as "substrate 9") for a liquid crystal display device. (Light resist) device. The sheet processing apparatus 1 includes a mechanism for transporting one side of the substrate 9 in a horizontal posture. Hereinafter, the direction in which the substrate 9 is transported is referred to as "transport direction", and the horizontal direction orthogonal to the transport direction is referred to as "width direction". In the respective drawings of the present application, the conveying direction and the width direction are indicated by arrows. As shown in Fig. 1, the substrate processing apparatus 丨 includes a first transport unit 1A, a conversion unit 20, a second transport unit 30, a resist application unit 4A, a carry-out unit 5A, and a control unit 60. Fig. 2 is a top view of the vicinity of the first conveying unit 1〇 and the converting unit 2〇. Fig. 3 is a side view showing the vicinity of the first conveying unit 1〇 and the converting unit 2〇. 4 and 5 are views of the lift roller 21, the lift drive mechanism 23, the idle roller 24, and the chuck mechanism 32 as viewed from the A-A position in Fig. 1. Hereinafter, reference is made to Fig. i and also to Figs. 2 to 5 . The first transport unit 10 transports the substrate 9 carried out from the apparatus 2 of the previous step to the portion of the conversion unit 20 along the transport path. The first conveying unit 丨〇 includes a plurality of conveying rollers that rotate around a rotating shaft 1 la extending in a direction of a width of 150753.doc 201133681. In the present embodiment, four transport rollers are attached to the plurality of rotation axes 1 la arranged at equal intervals in the longitudinal direction at equal intervals in the width direction. A plurality of conveying rollers 11 are disposed at a single fixed height position. A rotary drive mechanism 12 conceptually shown in Fig. 2 is attached to the rotary shaft 11a of the transport roller 11. The rotary drive mechanism 12 is realized as, for example, a mechanism that combines a motor that is a drive source with a timing belt that transmits a drive force. When the rotation drive mechanism 12 is actuated, a plurality of conveyance reports are actively rotated in the same direction. Thereby, the substrate 9 that is supported by the transport roller 11 is transported to the downstream side in the transport direction. The conversion unit 20 is a portion for switching the support mode of the substrate 9 between the first transfer unit 1A and the second transfer unit 3A. As shown in FIG. 1 to FIG. 5, the conversion unit 20 includes a plurality of lifting rollers 21, a rotation driving mechanism 22, a lifting drive mechanism 23, a plurality of movable rollers 24, an inlet floating table 25, and four guiding rollers 26, The positioning mechanism 27 and the plurality of lifting pins 28 are provided. The plurality of lifting rollers 21 are rotated about the center of rotation 21a extending in the width direction, and are provided so as to be movable up and down. In the present embodiment, four lifting rollers 21 are attached to the two rotating shafts 2 la arranged in the longitudinal direction at equal intervals in the width direction. A rotary drive mechanism 22 conceptually shown in Fig. 2 is coupled to the rotary shaft 21a. The rotary drive mechanism 22 is realized as, for example, a mechanism that combines a motor that is a drive source with a timing belt that transmits a driving force. When the rotary drive mechanism 22 is operated, the plurality of lift rollers 21 actively rotate in the same direction. Thereby, the substrate 9 that is supported by the lift roller 21 is transported to the downstream side in the transport direction. 150753.doc -12- 201133681 As shown in Figs. 4 and 5, a lift drive mechanism 23 is connected to the rotary shaft 21a of the lift roller 21. The lift drive mechanism 23 includes an arm 23& which supports the rotary shaft 213 via a bearing, and a cylinder 2313 which moves the arm 23& When the cylinder 23b is actuated, a plurality of lifting rollers are moved up and down between the standard position shown in Fig. 4 and the lowered position shown in Fig. 5. Further, the elevation drive mechanism 23 may be a drive mechanism (e.g., a motor) other than the cylinder. The height position of the upper end portion (the portion in contact with the lower surface of the substrate 9) of the elevating roller 21 disposed at the standard position substantially coincides with the height position of the upper end portion of the transport roller. Further, the height position of the upper end portion of the elevating roller 21 disposed at the lowering position is lower than the height position of the upper end portion of the flap 24. A plurality of the movable rollers 24 are used to support the roller of one of the upstream sides of the conveying direction of the substrate 9 in place of the lifting roller 2 1 when the lifting roller 21 is lowered. A plurality of flaps 24 are free to rotate with respect to the inherent axis of rotation provided on each of the rollers. When the substrate 9 is moved to the downstream side in a state where one of the substrates 9 is supported on the movable roller 24, the plurality of the movable rollers 24 are driven to rotate in response to the movement of the substrate 9. A plurality of live rollers 24 are disposed at a single fixed height position. The height position of the upper end portion of the movable roller 24 is lower than the upper position of the upper end portion of the elevation roller 21 disposed at the standard position, and is higher than the height position of the upper end portion of the lifter 21 disposed at the lowered position. Further, the height position of the upper end portion of the movable roller 24 is substantially the same height position as the lower surface of the substrate 9 supported on the inlet floating table 25 and the upper end portion of the above-described head loss mechanism 32. Further, as shown in Fig. 1 and Fig. 2, in the plan view, each of the living sheets 24 is disposed at a position that does not overlap with the plurality of lifting shovel (2 1 and the rotating shaft 21 a of the lifting pro 2 1 ). Since 150753.doc -13· 201133681 Thus, the plurality of lifting rollers 21 and the rotating shaft 2u of the lifting roller 21 can be moved up and down without coming into contact with a plurality of the movable rollers 24. As shown in Fig. 2, the plurality of the movable rollers 24 include: a plurality of downstream side living rollers 24a 'and a plurality of upstream side live rollers 鸠. A plurality of downstream side live views are arranged in the width direction on the downstream side arranged in the most (four) direction _: between the inlet floating stages 25... a plurality of downstream side living relatives The upstream side flaps 24b are arranged at the upstream side of the downstream side movable roller 24a in the transport direction. The interval between the width directions of the 24a is narrower than the interval between the adjacent upstream side movable rollers 24b in the width direction. Therefore, the deflection between the downstream side movable rollers 24a toward the lower side of the substrate 9 becomes smaller than that between the upstream side movable rollers 24b. Deflection below the substrate 9. Thereby, the population floating table 25 can be suppressed The edge portion on the upstream side in the transport direction is in contact with the substrate 9. Further, the upstream side live roller 2 is disposed at a lower density than the downstream side movable roller 24a, whereby the number of the live rollers 24 as a whole can be reduced. In the present embodiment, the living parent 24 having a smaller diameter than the lifting light 2i is used. Therefore, the space for lifting and lowering the lifting roller 21 can be secured, and the plurality of the movable rollers 24 can be easily disposed without the lifting roller 21. The location of the contact. The live parent can be a self-driven mechanism, but if it is a power transmitter that can release the drive mechanism, it can be connected to any drive mechanism. However, the drive mechanism is not connected to the live roller 24. In order to more easily ensure the space for lifting and lowering of the lifting roller 21, as shown in Fig. 3, a plurality of conveying rollers 丨丨, a plurality of lifting rollers 21, and a plurality of 150753.doc 14 201133681 In addition, the inlet floating table 25, the following coating platform 31' and the following outlet floating table 51 are supported by a platform support 72 provided independently of the roller support 71. That is, in the present embodiment, by means of a roller The portions that contact the support substrate 9 and the floating support substrate 9 on the platform are supported by different support stages and are not connected to each other. Thereby, the mechanical vibration transmission from the transport center, the lift view 21, and the live roller 24 can be suppressed. The inlet floating table 25, the coating platform 31, and the outlet floating table 51. The inlet floating table 25 is disposed on the downstream side in the conveying direction of the plurality of movable rollers 24. The inlet floating table 25 supports the lifting roller 21, and the living The roller 24, or the coating platform 31 described below, supports the substrate 9. The upper surface of the inlet floating table 25 is provided with a plurality of ejection holes 25& for discharging compressed air. The compressed air supplied from the supply source is discharged upward from the plurality of discharge holes 25a. The substrate 9 is supported by the compressed air 'ejected from the plurality of ejection holes 25a' in a state of floating from the upper surface of the inlet floating table 25. The inlet floating table 25 supports the substrate 9 without being under the substrate 9. Surface contact. The four guide rollers 26 are means for guiding the substrate 9 in the conveyance direction in the conversion portion 20. The four guide rollers 26 are disposed on both sides of the transport path of the substrate 9. Each of the guide rollers 26 is rotatable about a rotation axis extending upward and downward. When the substrate 9 is away from the transport path, the guide roller 26 rotates while contacting the end edge portion of the substrate 9. Thereby, the direction of the substrate 9 is corrected, and the substrate 9 is transported in the correct transport direction. The four guide rollers 26 can be moved up and down by a drive mechanism (not shown). When the substrate 9 is transported, the four guide rollers 26 of the conversion unit 20 are in a state of being raised toward both side portions of the transport path of the substrate 9 at 150753.doc -15-201133681. On the other hand, when the chuck mechanism 32 described below enters below the substrate 9, the four guide rollers 26 are lowered to a position where they do not come into contact with the chuck mechanism 32. The clamping mechanism 27 is a mechanism for positioning the substrate 9 in the conversion unit 20. The positioning mechanism 27 includes a plurality of positioning pins 27 & A plurality of positioning pins 27a are disposed at positions surrounding the substrate 9 disposed on the conversion unit 2A. Each of the positioning pins 27a is movable between a position abutting on the edge portion of the substrate 9 and a position spaced apart from the edge portion of the substrate 9 by a driving mechanism (not shown). When the substrate 9 is placed across the standard position of the lift report 21 and the population floating table 25, the plurality of positioning pins 27a abut against the edge portion of the substrate 9. Thereby, the position and posture of the substrate 9 in the horizontal direction are specified. On the other hand, when the substrate 9 is transported or when the chuck mechanism 32 enters below the substrate 9, the plurality of positioning pins 27a are withdrawn to a position where they do not come into contact with the substrate 9 or the chuck mechanism 32. The plurality of lift pins 28 are means for temporarily raising both end portions of the substrate 9 in the width direction when the support pattern of the conversion substrate 9 is switched. The plurality of lift pins 28 are disposed at a position slightly offset from the width direction of the substrate 9 toward the inner side in the width direction from the width direction of the substrate 9 by the positioning mechanism. Further, the plurality of lift pins 28 can be omitted. The drive mechanism is integrally moved up and down. When the plurality of lift pins 28 are raised to the right, the lift pins 28 abut against the lower surface of the substrate 9 and both ends in the width direction of the substrate 9 can be lifted by the lift pins 28. In the present embodiment, the plurality of lifting pins 28 are disposed in the width direction of both ends of the width direction of the inlet 25150.doc 201133681. Therefore, the following chuck mechanism 32 can be accessed. The position of the outer side of the population floating table 25 in the width direction is not in contact with the plurality of lifting pins 28. In the substrate 9, at least the portion of the substrate 9 that is adsorbed to the chuck mechanism 32 is exposed outside the width direction of the inlet floating table 25. The amount of exposure of the substrate 9 from the inlet floating table 25 can be suppressed. As shown in Fig. 2, the length li of the transfer direction of the conversion unit 2 is set to a length of one substrate 9 (i.e., a substrate). Length of 9 (4) long In the conversion unit 2, the length L2 of the transport direction in which the elevating roller 21 and the movable roller are disposed, and the length L3 of the transport direction of the inlet floating table are set shorter than the transport direction of the substrate 9. In this way, the length of the transfer direction of the transfer unit 20 is increased. The platform on which the support substrate 9 is floated in the floating d25 is required to have a high processing technique in the formation of the discharge holes 25a, and the manufacturing cost is also high. In the present embodiment, the length of the transfer direction of the inlet floating table 25 can be suppressed. Thereby, the substrate processing apparatus can be easily manufactured, and the production and the cost can be suppressed and supplied to the inlet floating table 25. The amount of the compressed air is also suppressed. The second transport unit 30 is a portion that transports the substrate 9 to the downstream side in the transport direction when the resist liquid is applied to the upper surface of the substrate 9. As shown in FIG. The conveying unit 30 includes a coating platform 31 and a pair of chuck mechanisms 32. The coating platform 31 is disposed on the downstream side in the conveying direction of the inlet floating table 25. The upper surface of the coating platform 31 is provided to extract compressed air. a plurality of ejection holes, and for pumping A plurality of suction holes for sucking air on the coating platform 31. When the substrate 9 is transported on the coating platform 31, a plurality of ejection holes are sprayed 150753.doc 201133681 The upward pressure is generated by the pressure of the air. The downward pressure generated by inhaling a plurality of suction holes acts on the substrate 9. Thereby, the substrate 9 is stably supported in the state of the top (four) material from the coating stage 31. The head loss mechanism 32 is attached to The outer side of the coating stage 31 in the width direction is disposed in a pair of left and right. A pair of adsorption portions 32a that are adsorbed on the lower surface of the end portion in the width direction of the substrate 9 are provided in the respective transport mechanism 32 in the transport direction. The mechanism 32 is movable in the transport direction by a drive mechanism such as a linear motor along the guide rail 32b formed on the upper surface of the stage support base 72. As shown in Fig. 1, the guide rail 32b extends from the position on the outer side in the width direction of the tongue roller 24 to the conveyance direction to the outer side in the width direction of the outlet float table 5'. The pair of chuck mechanisms 32 can transfer the substrate 9 from the conversion unit 20 to the carry-out unit 5 while adsorbing and holding the substrate 9. The resist coating mechanism 40 is a mechanism for applying an anti-remaining liquid to the upper surface of the substrate 9 which is supported on one side of the coating stage 31. In the figure, in order to clearly show the coating stage 31 and the chuck mechanism 32, the anti-surname application mechanism 40 is indicated by a broken line. The resist coating mechanism 4 includes a bridge portion 41 that is stretched in the width direction above the coating stage 3A, and a slit nozzle 42 that is attached to the bridge portion 41. The slit nozzle 42 ejects the resist liquid supplied from the resist liquid supply source (not shown) to the upper surface of the substrate 9 via the slit-shaped discharge port extending in the width direction. The carry-out unit 50 is a portion for carrying out the substrate 9 on which the resist liquid is applied from the substrate processing apparatus i. As shown in Fig. J, the carry-out portion 5 includes an exit floating table η and a plurality of carry-out pins 52. The outlet floating table 51 is disposed on the downstream side in the conveying direction of the coating platform 3丨. 150753.doc •18- 201133681 A plurality of ejection holes for discharging compressed air are provided on the upper surface of the outlet floating table 51. When the substrate 9 is supported on the outlet floating table 51, the compressed air supplied from a supply source (not shown) is discharged upward from a plurality of discharge holes. The substrate 9 is supported by a state in which the upper surface of the floating table 5 1 floats up from the compressed air ejected from the plurality of ejection holes. That is, the exit floating table 51 supports the substrate 9 without coming into contact with the lower surface of the substrate 9. The plurality of carry-out pins 52 are arranged at equal intervals in the transport direction and the width direction in the plane of the exit floating table 51. A plurality of carry-out pins 5 2 are attached to the support substrate 9 in order to be known. Further, the plurality of carry-out pins 5 2 can be integrally moved up and down by a drive mechanism (not shown). Therefore, the plurality of carry-out pins 52 can move the substrate 9 up and down while supporting the substrate 9. When the substrate 9 is transferred from the coating stage 31 to the outlet floating table 51, the plurality of carry-out pins 52 are retracted to a lower state than the upper surface of the outlet floating table in order to avoid contact with the substrate 9. Further, when the substrate 9 is carried out from the exit floating table 51, the plurality of carry-out pins 52 protrude upward from the upper surface of the outlet floating table 51. Thereby, the substrate 9 is lifted above the exit floating table. The substrate 9 supported by the plurality of carry-out pins 52 is transported to the apparatus 4 of the subsequent step by the transfer robot 3 disposed on the downstream side in the transport direction of the exit floating table 51. The control unit 60 is composed of a computer including a CPU (Central to Coffee, a central processing unit) and a memory. Fig. 6 is a block diagram showing the electrical connection between the control unit and the base: processing unit! As shown in Fig. 6, the control unit 60 is connected to the rotation drive mechanism 12'22 and the cylinder 23b. Further, the control unit 60 is also connected to other drive mechanisms (Fig. i to Fig. 5), which are not shown, and are compressed: 150753.doc 19 201133681 gas supply mechanism, exhaust mechanism, sensor, and the like. The control unit electrically controls the actions of the various parts in accordance with pre-set programs or data. Thereby, the processing of the substrate 9 in the substrate processing apparatus 进行 is performed. <1-2. Operation of Substrate Processing Apparatus> Next, the substrate processing will be described! The action. Fig. 7 is a flow chart showing the flow of the substrate processing: the operation of the apparatus 1. When the substrate 9 is processed in the substrate processing apparatus ,, first, the substrate 9 carried out from the apparatus 2 of the previous step is transported by the second transport unit 10 (step S1). The substrate 9 is contact-supported by the transport roller m, and is transported to the downstream side in the transport direction by the transport rotation. At this time, the elevating roller 21 is disposed at a standard position and rotates in the same direction as the conveying roller 11. Therefore, the substrate 9 is continuously conveyed to the conversion unit 2 by the transporting parent and the elevating parent 21. At this time, the four guide rollers 26 are in a state of rising toward both sides of the transport path of the substrate 9. Guided by the guide rollers 26, the substrate 9 is accurately conveyed to the downstream side in the transport direction. When the substrate 9 reaches the conversion unit 2〇, the elevation roller 21 stops rotating. Thereby, the substrate 9 is stopped in a state of straddle the elevation roller 21 and the inlet floating table (step S2). FIG. 8 is a transition when the substrate 9 is placed across the elevation roller 21 and the inlet floating table 25: the change portion 20 Side view nearby. One of the upstream sides of the substrate 9 in the transport direction contacts the lift roller 21 supported at the standard position. On the other hand, a portion of the substrate 9 on the downstream side in the transport direction is supported by the inlet floating table 25. The height position of the portion of the substrate 9 supported on the inlet floating table 25 becomes lower than the height position of the portion supported on the elevating roller 21. 150753.doc -20-201133681 Next, a plurality of positioning pins 27a are in contact with the upstream side of the substrate 9 in the transport direction, the downstream side in the transport direction, and the respective edge portions on both sides in the width direction. Thereby, the position and posture of the substrate 9 in the horizontal direction are regulated (step S3). If the positioning of the substrate 9 is completed, the four guide rollers 26 are lowered and withdrawn to a specific retracted position. Further, the positioning pins 27a of the plurality of positioning pins 27a that abut against both end edges of the substrate 9 in the width direction are also separated from the substrate 9 and are withdrawn to a specific retracted position. After the positioning pin 27a is withdrawn, a portion of the upper side of the substrate 9 in the transport direction is also contact-supported by the elevating roller 21. Therefore, the positional deviation of the substrate 9 in the width direction can be prevented by the static friction between the substrate 9 and the lifting light 21. Then, a plurality of lift pins 28 are raised (step S4). The lift pins 28 abut against the lower surface of the substrate 9 to raise both end portions of the substrate 9 in the width direction. Fig. 9 is a side view showing the vicinity of the converting portion 2〇 when a plurality of lifting pins 28 are raised. As shown in Fig. 9, the upper end portions of the plurality of lift pins 28 are raised to a position higher than the upper end portion of the lifter 21 of the standard position. Further, the substrate 9 of the present embodiment is relatively large and flexible. Therefore, in step S4, only the vicinity of both end portions in the width direction of the substrate 9 is lifted. The central portion of the substrate 9 in the width direction is maintained in a state of being supported by the lift roller and the inlet floating table 25. Therefore, the positional deviation of the substrate 9 in the width direction can be prevented by the static friction between the substrate 9 and the elevating roller. Further, in the present embodiment, after the positioning pin 27a abutting on both end edges of the substrate 9 in the width direction is withdrawn, the plurality of lift locks 28 are raised. Therefore, when the lift pin 28 is raised, the edge portion of the substrate 9 in the width direction does not come into sliding contact with the positioning pin 27a. Thereby, it is possible to prevent the generation of particles by the sliding contact of the substrate 9 with the pin 150a of the positioning 150753.doc • 21 · 201133681. Thereafter, the elevating roller 21 is lowered from the standard position to the lowered position (step S5). Fig. 1 is a side elevational view showing the vicinity of the converting portion 2 when the elevating roller 21 is lowered. The height position of the upper end portion of the elevating roller 21 is lower than the height position of the upper end portion of the movable roller. At this time, the both ends of the substrate 9 in the width direction are supported by the lift pins 28, but in the vicinity of the center in the width direction, a plurality of the movable rolls 24 support a part of the substrate 9 instead of the plurality of lift rolls 2'. Then, as shown in Fig. 11, the chuck mechanism 32 is moved to the upstream side in the transport direction. Thereby, the chuck mechanism 32 is disposed below the both end portions in the width direction of the substrate 9. Further, after the suction operation of the adsorption portion 32a is started, as shown in Fig. η, the plurality of lift pins 28 are lowered. Thereby, both end portions in the width direction of the substrate 9 are attracted to the adsorption portion 32a of the chuck mechanism 32 (step S6). The substrate 9 is in a state in which one of the upstream sides of the conveyance direction is in contact with the movable roller ,, and one of the downstream sides of the conveyance direction is floated and supported by the inlet floating table 25, and both ends in the width direction are held by the clamp. Head mechanism 3 2. During the operation of steps S3 to S6 in the conversion unit 20, the positioning pin 27a is in contact with the edge portion on the upstream side in the transport direction of the substrate 9 and the downstream side in the transport direction. Therefore, the positional shift of the substrate 9 in the transport direction can be prevented. During the further steps S3 to S6, the substrate 9 is continuously contact-supported by the lift roller 2 or the movable roller 24. Therefore, the positional deviation in the width direction of the substrate 9 can be prevented by the static friction of the lift roller 21 or the movable roller 24 and the substrate 9. Further, in the present embodiment, the vicinity of both end portions in the width direction of the substrate 9 is temporarily raised by the plurality of lift pins 28, and the lower surface of the substrate 9 is brought closer to the chuck mechanism 32 by lowering the lift pins 28. Therefore, it is not necessary to cause the chuck 150753.doc • 22· 201133681 to simplify the upward movement of the adsorption portion 32a of the chuck mechanism 32 mechanism 32. Therefore the structure. When the substrate 9 is held by the pair of chuck mechanisms, the positioning pin (7) abutting on the edge of the substrate 9 and the downstream side of the transport direction is withdrawn to the retracted position. Further, the chuck mechanism 32 moves along the downstream side of the guide rail in the transport direction. Thus, the substrate 9 is transported to the downstream side in the transport direction. The substrate 9-surface floating support is supported on each of the stages - the surface is transferred from the population floating stage to the exit floating stage 51 by the coating stage 31. The slit nozzle 42 ejects an anti-four (4) to the upper surface of the substrate 9 conveyed on the coating stage 31. Thereby, the surface of the substrate 9 is coated with an anti-surname liquid (step S7). In the present embodiment, the end portion on the downstream side in the transport direction of the substrate 9 is placed near the lower portion of the slit nozzle 42 and the end portion on the upstream side in the transport direction of the substrate 9 is supported by the inlet floating table 25 . on. That is, at the time when the resist liquid is applied to the upper surface of the substrate, the substrate 9 as a whole is floated and supported on the floating table 25 and the coating stage 31. Therefore, the vibration of the machine 2 of the green roller 24 can be suppressed from being transmitted to the substrate 9 in the resist liquid coating process. Thereby, the coating failure of the resist liquid on the upper surface of the sheet 9 can be suppressed. The substrate 9 coated with the resist liquid is transferred to the exit floating table 5, and the sound is stopped. Then, the plurality of carry-out pins 52 protrude from the upper surface of the exit floating table 51. The substrate 9 is lifted above. Thereafter, the transfer robot 3 receives the substrate 9 supported by the plurality of carry-out pins 52, and transfers the substrate 9 from the transfer robot 3 to the device 4 in the subsequent step. As described above, in the substrate processing apparatus 1 of the present embodiment, the conversion unit 150753.doc -23- 201133681 one portion of the upstream side of the transport direction of the earth plate 9 is transferred from the plurality of lifts 21 to the plurality of feed rollers 24. The length of the transfer direction of the entrance floating float 25 is suppressed by the &' Further, the movable roller 24 can reliably support the substrate 9 in a simple structure and can be disposed in a narrow area. Therefore, a plurality of living members 24 can be easily disposed at positions that are not in contact with the plurality of lifting rollers 2 1 . <1-3. Modifications> The third embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. In the above-described embodiment, the suction portion 3 of the chuck mechanism 32 is fixed at a fixed height position, but the adsorption portion 32a can be moved up and down. When the adsorption portion 32a can be moved up and down, the adsorption portion 32a can be brought close to the lower surface of the substrate 9. Therefore, the support of the lift pins 28 to the substrate 9 can be omitted. Further, in the above-described embodiment, the chuck mechanism 32 is disposed on the lower surface side of the substrate 9, but the chuck mechanism may be disposed on the upper surface side of the substrate 9. Further, the chuck mechanism 32 may be held by the upper and lower sides to hold the substrate 9. Further, the chuck mechanism 32 of the above embodiment includes two adsorption portions 32a' in the transport direction, but the number of the adsorption portions 32a may be one or three or more. Further, 'in the above embodiment', there is shown an example of the conveying roller 1丨, the lifting roller 2 i, and the movable roller 24, but the size, the number, and the arrangement of the rollers may be based on the type of the substrate to be processed. It is appropriately changed in relation to the surrounding structure. In the first transfer unit 10 of the above-described embodiment, the substrate 9 is transported by a plurality of transport rollers U. However, the first transport unit of the present invention may be transported by another mechanism. 150753.doc -24-201133681 9-- Hold::9' can also be used to support the substrate side transporter on a plurality of live rollers.:, at both ends of the direction, to the downstream of the transport direction, the service is placed on some mobile components. The substrate 9 is transported to the substrate on the downstream side in the same direction of transport. The present invention is for converting the substrate between the first transfer portion and the second transfer portion in the sense of space or time. The support method is right in the first! The time between the transfer of the transport unit and the transport of the second transport unit The first transport unit, the (four) unit, and the (four) (10) unit may be arranged in a spatial arrangement including the overlapping portions. Further, the transition P may be separated from the second transport unit or the second transport unit in the booth. Further, the substrate processing apparatus applies a device for resisting liquid contact to the upper surface of the substrate 9. However, the substrate processing apparatus of the present invention may be a device for applying a treatment liquid other than the anti-money liquid to the substrate. Further, the substrate processing apparatus of the present invention may be a device that performs processes other than the coating process (e.g., heat treatment or exposure treatment). In addition, the substrate processing apparatus 1 is a glass substrate 9 for a liquid crystal display device, and the substrate processing apparatus of the present invention may be a semiconductor wafer, a flexible substrate for a thin film liquid crystal, or a substrate for a photomask. Other substrates such as a color filter substrate, a solar cell substrate, and an electronic paper substrate are processed. < 2. Second Embodiment><2-1. Configuration of Substrate Processing Apparatus> Fig. 13 is a top plan view of the substrate processing apparatus 〇1 according to the second embodiment of the present invention. The substrate processing apparatus 101 is used in a light microfabrication step of etching a rectangular 150753.doc •25·201133681 glass substrate 109 (hereinafter simply referred to as “substrate 1〇9”) for a liquid crystal display device. A device for applying a resist liquid (photoresist) to the upper surface of 109. The substrate processing apparatus 101 includes a mechanism for transporting the surface of the substrate 109 in a horizontal posture. Hereinafter, the direction in which the substrate 109 is transported is referred to as "transport direction", and the horizontal direction orthogonal to the transport direction is referred to as "width direction". In each of the drawings of the present application, the conveying direction and the width direction are indicated by arrows. As shown in FIG. 13, the substrate processing apparatus 1A includes a second transport unit ιι, a transfer unit 120, a second transfer unit 130, a resist application unit 〇4, a carry-out unit 150, and a control unit 160. Fig. 14 is a top plan view of the i-th conveying unit 11 and the vicinity of the transfer unit. Figure 1 5 is the first transfer unit!丨0 and the side view near the transfer unit 丨2〇. Hereinafter, reference is made to FIG. 13 and also to FIG. 14 and FIG. The first transport unit 110 transports the substrate 109 carried out from the apparatus 1〇2 on the upstream side in the transport direction along the transport path to the portion of the transfer unit 12〇. The second conveying unit no includes a plurality of conveying rollers that rotate around the rotating shaft 111 & extending in the width direction. In the present embodiment, a plurality of transport rollers U1 are disposed at equal intervals in the width direction at a plurality of rotation axes 111a arranged at equal intervals in the longitudinal direction. The plurality of transport rollers U1 are disposed at a single fixed height position. A conceptual representation of the rotary drive mechanism 112 is shown in FIG. 14 connected to the rotation axis U1a of the conveying roller m. The rotary drive mechanism 112 is realized as, for example, a mechanism that combines a motor that is a drive source with a timing belt that transmits a drive force. = < When the revolving mechanism 112 operates, the plurality of conveying rollers m are aligned. Active rotation. Thereby, the substrate 1〇9 supported by the transport roller lu is transported to the downstream side in the transport direction of 150753.doc -26 - 201133681. The transfer unit 120 is configured to transfer the substrate 109 from the first transfer unit 110 to the second transfer unit 130. As shown in FIG. 3 to FIG. 5, the transfer unit 丨2〇 includes: a plurality of lifting pro 1 2 1 'plural number 活 24, an inlet floating table 125, 4 guiding rollers 1 26, and a positioning mechanism 127 And push-up mechanism 128. The plurality of lifting rollers 121 are rotated centrally by a rotating shaft 121 & extending in the width direction, and are rollers which are arranged to be movable up and down. In the present embodiment, four lifting rollers 1 21 are attached to the two rotating shafts 121a arranged in the longitudinal direction at equal intervals in the width direction. A rotary drive mechanism 1 22 conceptually shown in Fig. 14 is coupled to the rotary shaft 12la. The rotary drive mechanism 1 22 is realized as, for example, a mechanism that combines a motor that is a drive source with a timing belt that transmits a driving force. When the rotary drive mechanism 122 is operated, the plurality of lift rollers 121 actively rotate in the same direction. Thereby, the substrate 109 supported by the elevating roller 121 is transported to the downstream side in the transport direction. 21, 23, 25, 27, and 29 are views showing the structure in the vicinity of the transition portion 1 20 from the position B-B in Fig. 13. As shown in the figures, a lifting drive mechanism 123 is coupled to the rotating shaft 12 la of the lifting roller 121. The lift driving mechanism 12 3 includes an arm 123a that supports the rotating shaft 121a via a bearing, and a cylinder 123b that moves the arm 123a up and down. When the cylinder 123b is actuated, a plurality of lifting rollers 121 are moved up and down between the standard positions shown in Figs. 21 and 23 and the lowered positions shown in Figs. 25, 27, and 29. Further, the elevation drive mechanism 123 may be a drive mechanism (e.g., a motor) other than the cylinder. 150753.doc -27· 201133681 The height position of the upper end portion (the portion in contact with the lower surface of the substrate 1 〇9) of the elevation roller i 2 i disposed at the standard position substantially coincides with the height position of the upper end portion of the conveying roller 111. Further, the southward position of the upper end portion of the lift roller 121 disposed at the lowering position is lower than the height position of the upper end portion of the movable roller 124. A plurality of the movable rollers 124 are used to support the roller of one of the upstream sides of the transport direction of the substrate 1 to 9 in place of the lift roller 121 when the lift roller 121 is lowered. A plurality of flaps 124 are free to rotate with respect to the inherent axis of rotation provided on each of the rollers. When the substrate 109 is moved to the downstream side in a state where the movable roller 124 supports one of the substrates 1 to 9, a plurality of the movable rollers 124 are driven to rotate in response to the movement of the substrate 1〇9. A plurality of live rollers 124 are disposed at a single fixed height position. The height position of the upper end portion of the movable roller 124 is lower than the height position of the upper end portion of the elevation light l2i disposed at the standard position, and is higher than the height position of the upper end portion of the elevation roller 121 disposed at the lowering position. Further, the height position of the upper end portion of the movable roller 124 is substantially the same height position as the lower surface of the substrate 1 〇 9 supported on the inlet floating table i 25 and the upper end portion of the chuck mechanism 132 described below. Further, as shown in Fig. 13 and Fig. 14, each of the movable rolls 124 is disposed at a position that does not overlap with the plurality of rotating rolls 121 and the rotating shafts 121 & Therefore, the plurality of lifting rollers 121 and the rotating shafts 121 & of the lifting roller 121 can be moved up and down without coming into contact with the plurality of the movable rollers 124. As shown in Fig. 14, the plurality of movable rolls 124 include a plurality of downstream side living members 124a and a plurality of upstream side living rolls 124b. The plurality of downstream side living ridges 24a are arranged in the width direction between the elevation light 121 disposed on the downstream side in the most conveyance direction and the inlet floating table 125. That is, a plurality of downstream side live rollers 丨 are inserted into the end edge portion of the upstream side of the transport direction of the 150753.doc -28·201133681 floating platform (2), and a plurality of upstream sides are stored _ not listed on the downstream side of the live roller 2: The position on the upstream side of the transport direction. The downstream side of the sin is connected to the live roller 丨24a one by one. <The spacing is narrower than the width direction of the upstream side live rollers 124b of the crucible, and the web. Therefore, the distance between the downstream gambling rollers 124a to the lower side of the substrate 1 〇 9 becomes smaller than the distance between the upstream side active rollers 124b toward the lower side of the substrate 1 〇 9 such as 厶, n is distorted. By hunting this, it is possible to suppress contact between the edge portion on the upstream side in the conveying direction of the inlet 25 and the substrate (10). Further, the upstream side living parent (10) is disposed at a lower density than the downstream side movable roller 12, whereby the number of the living rollers 124 as a whole can be reduced. Further, in the present embodiment, a live roller 124 having a smaller diameter than the lift (four) has been used. Therefore, the space can be secured to the space where the elevating ship 21 moves up and down, and the plurality of living prodies 124 can be easily placed at a position that does not come into contact with the elevating parent (2). The idler roller 124 may be completely separated from the drive mechanism, but may be connected to any drive mechanism if it is a power transmitter that can be removed from the drive mechanism. However, it is preferable that the drive mechanism is not connected to the movable roller 124 in the space where the lifting roller 121 can be more easily secured. As shown in Fig. 15, a plurality of conveying rollers m, a plurality of lifting rollers i2i, and a plurality of movable rollers 124 are supported by a common roller supporting table 171. On the other hand, the inlet floating table 125, the coating platform 131 described below, and the following outlet floating table 151 are supported by the platform support table 1 π provided independently of the pro-support table 71. That is, in the present embodiment, the portion where the support substrate 1〇9 is contacted by the roller and the portion where the support substrate 109 is floated on the platform are held by different support branches 150753.doc •29·201133681, and are not connected to each other. Thereby, mechanical vibrations from the conveying roller i, the lifting roller 121, and the living limb 124 can be suppressed from being transmitted to the inlet floating table 125, the coating stage 131, and the outlet floating table 151. The inlet floating table 125 is disposed on the downstream side of the conveying direction of the plurality of movable rolls 124. The inlet floating table 125 supports the lifting roller 121, the movable roller 24, or the coating platform 131 described below, and supports the substrate stack 9. A plurality of ejection holes 125a for ejecting compressed air are provided on the upper surface of the inlet floating table 125. At the time of transporting the substrate 119, the compressed air supplied from a supply source (not shown) is discharged upward from the plurality of discharge holes 125a. The substrate 1〇9 is supported by the compressed air ejected from the plurality of ejection holes 125a in a state of being floated from the upper surface of the inlet floating table 125. That is, the inlet floating stage 125 supports the substrate 109 without coming into contact with the lower surface of the substrate 1〇9. The four guide rollers 126 are mechanisms for guiding the substrate 1 to 9 in the transport direction in the transfer portion 120. The four guide rollers 126 are disposed on both side portions of the transport path of the substrate 1〇9. Each of the guide rollers 126 is rotatable about a rotation axis extending upward and downward. When the substrate 109 is away from the transport path, the guide roller 126 rotates while contacting the end edge portion of the substrate 109. Thereby, the direction of the substrate 1〇9 is corrected, and the substrate 109 is transported in the correct transport direction. The four guide rollers 126 can be moved up and down by a drive mechanism (not shown). When the substrate 109 is transferred to the transfer unit 120, the four guide rolls 126 are in a state of rising toward both side portions of the transfer path of the substrate 109. On the other hand, when the following chuck mechanism 132 enters below the substrate 109, the four guides 126 are in a state of being lowered to a height position where they are not in contact with the chuck mechanism 132. The positioning mechanism 丨 27 is a mechanism for positioning the substrate 1 〇 9 in the transfer portion 120. 150753.doc -30· 201133681 The positioning mechanism 127 includes a plurality of positioning pins ΐ 27" positioning pins extending upward and downward - an example of the "positioning member" in the present invention. A plurality of positioning pins 127 are disposed at positions surrounding the substrate (10) disposed on the transfer portion 12A. The pin 127a can be abutted on the edge portion of the substrate 1G9 by a drive mechanism not shown. The position is moved between the positions separated from the edge portions of the substrate 1 () 9 . If the substrate 9 is disposed across the standard position of the lifter 121 and the inlet floating table 125, the plurality of pin pins 127a and the substrate are disposed. The end edge portion of the cymbal 9 abuts. Thereby, the position and posture of the substrate 1 〇 9 in the horizontal direction are defined. On the other hand, when the substrate 109 is transported, or the chuck mechanism 132 enters the substrate 1 〇 9 In the lower portion, the plurality of positioning pins 27a are withdrawn to a position that is not in contact with the substrate 1〇9 or the chuck mechanism 13 2. The push-up mechanism 128 is used to transfer the substrate 1 to 9 when the transfer portion 12 is transferred. The push-up mechanism (3) includes a plurality of S-up pins 128a extending upward and downward. The plurality of lift pins 128a are arranged in the longitudinal direction on the substrate 1〇9 by the positioning mechanism 127. In the case of the shape, the both ends of the width direction of the substrate 109 are slightly shifted to the inner side in the width direction. Further, the plurality of lift pins 1283 can be moved up and down by a drive mechanism (not shown). When the plurality of lift pins 28a are raised, the lift pins 128a abut against the lower surface of the substrate 1〇9. The vicinity of both end portions in the width direction of the substrate 1〇9 can be pushed up by the lift pin 128. Fig. 23, Fig. 25, and Fig. 27 show the vicinity of the two 鳊σ卩 of the substrate 1〇9 by the push-up mechanism 128. In the state of the push, as shown in the figures, when the plurality of lift pins 128a are raised, the substrate 1〇9 is deflected, and only the width of the substrate 1〇9 is 150753.doc -31 · 201133681 The vicinity of the portion is pushed up. The central portion of the substrate 109 in the width direction is maintained in a horizontal posture to support the state of the lift report 121 or (9) 124. Further, as shown in Figs. 13 and 14, a plurality of lift pins 1283 are disposed at the entrance. Both end portions in the width direction of the starting portion 125 are further inward in the width direction. Therefore, when the plurality of lifting pins 128a are raised, the following chuck mechanism 132° enters the position outside the width direction of the inlet floating table 125 without Will be in contact with a plurality of lifting pins 128a. Also 'substrate 1〇9, at least Attached to: The portion of the master mechanism 132 is exposed to the outside of the width direction of the human sigma floating table 125. Therefore, the amount of exposure of the substrate 109 from the inlet floating table 125 can be suppressed. As shown in Fig. 14, the transfer portion 12 is The length of the transport direction is set such that the length of one substrate 109 can be arranged (that is, the length of the substrate 109 is slightly longer than the length of the transport direction of the substrate 109). The transfer unit 120 is disposed with the area of the lift roller 121 and the live roller 124. The length L2 of the direction and the length L3 of the transport direction of the inlet floating table 125 are set shorter than the length of the transport direction of the substrate 1〇9. Thereby, the length of the transfer direction of the transfer unit 120 can be suppressed. The platform for supporting the substrate 1〇9 is floated like the inlet floating table 125, and a high processing technique is required in the formation of the ejection holes 125a, etc., and the manufacturing cost is also high. In the present embodiment, the length of the conveyance direction of the inlet floating table 125 can be suppressed. Thereby, the substrate processing apparatus 1 can be easily manufactured, and the manufacturing cost can be suppressed. Further, the amount of compressed air supplied to the inlet floating stage 125 can also be suppressed. The second transport unit 130 is a portion that transports the substrate 109 to the downstream side in the transport direction when the resist liquid is applied to the upper surface of the substrate 1〇9. As shown in FIG. 3, the second 150753.doc • 32-201133681 conveying unit 130 includes a coating platform 131 and a pair of chuck mechanisms 132. The coating stage 13 1 is disposed on the downstream side in the conveying direction of the inlet floating stage 152. A plurality of discharge holes for discharging compressed air and a plurality of suction holes for sucking air on the coating stage 131 are disposed on the upper surface of the coating platform 131. When the substrate 1 〇 9 is transported on the coating stage 133, the upward pressure generated by the compressed air ejected from the plurality of ejection holes and the downward pressure generated by the suction of the plurality of suction holes Acting on the substrate 1〇9. By this, the substrate 109 is stably supported in a state where it is slightly floated from the upper surface of the coating stage 131. The chuck mechanism 133 is disposed on the outer side in the width direction of the coating stage 13 1 as a pair of left and right. In each of the chuck mechanisms 132, a pair of adsorption holding portions 132a for sucking and holding the end portions of the substrate 109 in the width direction from the lower surface side are provided in the transport direction. Further, each of the chuck mechanisms 132 can be moved in the transport direction by a drive mechanism such as a linear motor along the guide rails 132b formed on the upper surface of the platform support table 172. As shown in Fig. 13, the guide rail 132b extends from the position on the outer side in the width direction of the movable roller 124 to the conveyance direction to the position on the outer side in the width direction of the following outlet floating table. The pair of chuck mechanisms 132 can transport the substrate 109 from the transfer portion 12 to the carry-out portion 15 while adsorbing and holding the substrate 109'. Fig. 16 and Fig. 17 are partially enlarged longitudinal sectional views showing the vicinity of the upper surface of the adsorption holding portion 132a. As shown in Figs. 16 and 17, the adsorption holding portion 132 & includes a holding surface 321 which is in contact with the lower surface of the substrate 109. The height position of the lower surface of the portion of the substrate 1 to 9 held by the adsorption holding portion 132a is defined by the holding surface 321. Further, the adsorption holding portion 132 & is formed with a groove 322 which is recessed downward from the holding surface 321 and a suction hole 323 which is opened at the bottom of the groove 322. 150753.doc 201133681 The inside of the groove 322 is provided with an elastic absorbing body 324 which can be expanded and contracted in the up-down direction and adsorbed on the lower surface of the substrate 109. The elastic adsorbing body 324 is formed in a substantially cylindrical shape having a bellows-like side surface. The opening portion on the lower side of the elastic adsorbing body 324 communicates with the suction hole 323. Further, the opening on the upper side of the elastic adsorbing body 324 is opened upward. The suction hole 323 is connected to an intake pump (not shown). When the air suction pump is operated, a negative pressure is generated inside the suction hole 323 and the elastic adsorption body 324. Thereby, the air above the adsorption holding portion 132a is sucked into the suction hole 323 via the elastic adsorbing body 324 as indicated by an arrow in Fig. 16 . As shown in Fig. 16, the upper end portion of the elastic adsorbing body 324 protrudes upward from the holding surface 321 before being adsorbed to the substrate 109. When the suction is performed while the substrate 109 is brought close to the upper surface of the adsorption holding portion i32a, the elastic absorbent body 324 is attracted to the lower surface of the substrate 1〇9 and contracted. Further, as shown in Fig. 17, the upper end portion of the elastic adsorbing body 324 is located at the same height as the holding surface 321 at the time of adsorption. Thereby, the lower surface of the substrate 1 〇 9 is held in contact with the holding surface 321 . Thus, in the present embodiment, the lower surface of the substrate 1〇9 is pulled to the holding surface 321 by the elastic adsorbing body 324 being adsorbed on the lower surface of the substrate 109 and contracted. Therefore, for example, even if the vicinity of the edge portion of the substrate 109 is slightly inclined by pushing up the lift pin 128a, the lower surface of the wafer 109 can be held by the adsorption holding portion 132a with high reliability. It is preferable that the chuck mechanism 132' has a plurality of elastic adsorbing bodies 324 in one adsorption holding portion. If so, the warpage of the substrate 1〇9 generated by the adsorption itself of the elastic adsorbing body 324 can be suppressed. Therefore, the substrate 109 can be held in the adsorption holding portion 丨 32a by the reliability of 150753.doc -34- 201133681. Further, as shown in Fig. 13, a position shift sensor 325 for detecting a positional shift of the substrate 109 is provided in the adsorption holding portion 132 & The positional displacement sensor 325 detects the substrate 1 〇 9 beyond the holding surface 321 when the substrate 1 is displaced from the desired position and held by the adsorption holding portion U2a. When the control unit 16 receives the detection signal from the positional deviation sensor 325, the movement of the chuck mechanism 132 is stopped, and the coating failure of the substrate 1 to 9 is prevented. The resist coating mechanism 140 is a mechanism for applying a resist liquid to the upper surface of the substrate 109 which is supported on one side of the coating stage 131. In Fig. 13, in order to clearly show the coating stage 131 and the chuck mechanism 132, the resist Η and the 丨 coating mechanism 140 are indicated by broken lines. The anti-sludge coating mechanism 14 includes a bridge portion 141 that is stretched in the width direction above the coating stage 131, and a slit nozzle 142 that is attached to the bridge portion 141. The slit nozzle 142 ejects the resist liquid supplied from the resist liquid supply source (not shown) to the upper surface of the substrate 109 via the slit-shaped discharge port extending in the width direction. The carry-out unit 150 is a portion for carrying out the substrate 109 coated with the resist liquid from the substrate processing apparatus 1〇1. As shown in Fig. 13, the carrying-out portion 15 includes an exit floating table 151 and a plurality of carry-out pins 52. The outlet floating table 151 is disposed on the downstream side of the conveying direction of the coating stage 131 to the outlet floating table! The upper surface of the 5 i is provided with a plurality of ejection holes for discharging compressed air. When the substrate 1〇9 is supported on the outlet floating table 151, the compressed air supplied from a supply source (not shown) is discharged upward from the plurality of discharge holes. The substrate 109 is supported in a state of being floated from the upper surface of the outlet riser 151 by the compressed air ejected from the plurality of ejection holes. That is, the outlet 150753.doc • 35 - 201133681 The floating stage 151 supports the substrate 109 without coming into contact with the lower surface of the substrate 109. A plurality of carry-out pins 152 are arranged in the plane of the exit floating table 15 1 at equal intervals in the transport direction and the width direction. A plurality of carry-out pins 1 52 are attached to the support substrate 109 at their upper end portions. Further, the plurality of carry-out pins 152 can be integrally moved up and down by a drive mechanism (not shown). Therefore, the plurality of carry-out pins 152 can support the substrate 109' in a horizontal posture and lift the substrate 109 above the exit floating table 151. When the substrate 109 is transferred from the coating stage 131 to the outlet floating table ι51, the plurality of carry-out pins 152 are retracted to a lower state than the upper surface of the outlet floating table 151 in order to avoid contact with the substrate 109. Further, when the substrate 109 is carried out from the exit floating table 151, the plurality of carry-out pins 152 protrude upward from the upper surface of the upper floating table 151. Thereby, the substrate stack 9 is lifted above the exit floating table 151. The substrate 109 supported by the plurality of carry-out pins 152 is transported to the apparatus 丨〇4 of the subsequent step by the transfer robot 103 disposed on the downstream side in the transport direction of the outlet floating table 151. The control unit 160 is configured by a computer including a CPU and a memory. Fig. 18 is a block diagram showing a configuration in which the control unit 160 and each portion of the substrate processing apparatus 1A are electrically connected. As shown in Fig. 18, the control unit 16A and the first transfer unit 110, the transfer unit 12A, the second transfer unit 130, the anti-surname application mechanism, and the like are carried out.卩 15G connection. More specifically, the control unit i6Q is connected to various drive mechanisms, sensors, air supply mechanisms, exhaust mechanisms, and the like provided in the respective sections. For example, the control unit 16〇 and the plurality of clamping pins (2) for the positioning mechanism 127 are “hyper-moving driving mechanism, driving mechanism for lifting and lowering the plurality of lifting pins of the pushing mechanism 128, and 150753. Doc * 36 - 201133681 The linear horse (four) is connected to move the chuck mechanism 132. The control unit i6 electrically controls the operations of the respective parts in accordance with a preset program or data. Thereby, the substrate processing apparatus 101 is performed. The processing of the substrate 1〇9. <2_2. Operation of substrate processing apparatus>. Next, the operation of the substrate processing agricultural 1G1 will be described. Fig. 19 is a flow chart showing the flow of the operation of the substrate/processing apparatus 101. 20, 22, 24, 26, and 28 are side views of the vicinity of the transfer portion 12A in steps S1 to S10. Further, as described above, Fig. 21, Fig. 23, Fig. 25, Fig. 27, and Fig. 29 are views showing the configuration of the vicinity of the transition portion 12A from the position B-B in Fig. 13. Fig. 21 'Fig. 23 and Fig. 25' Fig. 27 and Fig. 29 show states at the same time points as Fig. 2, Fig. 22, Fig. 24, Fig. 26, and Fig. 28, respectively. When the substrate 1〇9 is processed in the substrate processing apparatus 1〇1, first, the substrate 1〇9 carried out from the apparatus 1〇2 of the previous step is transported by the first transport unit 110 (step S101). The substrate 109 is contact-supported on the transport roller U1, and is transported to the downstream side in the transport direction by the rotation of the transport roller. At this time, the lift roller 121 is placed at a standard position and rotated in the same direction as the transport roller 。. Therefore, the substrate 109 is continuously conveyed to the transfer unit 120 by the transport roller ill and the lift roller 121. At this time, the four guide rollers 126 are in a state in which the both sides of the transport path to the substrate 1〇9 are raised. Guided by the guide rollers 126, the substrate 109 is correctly conveyed to the downstream side in the transport direction. When the substrate 109 reaches the transfer portion 12A, the lift roller 121 stops rotating. By this, the substrate 109 is stopped in a state of crossing the lift roller m and the inlet floating table 125 (step S102, the state of Figs. 20 and 21). As shown in Fig. 20, one of the upstream sides of the substrate 150753.doc - 37 · 201133681 109 in the transport direction is contacted by the booster roller 121 supported at the standard position. On the other hand, one of the downstream sides of the transfer direction of the substrate 〇 9 is floated (supported on the inlet floating stage 125. The height position of the portion of the substrate 1 支持 9 supported on the inlet floating stage 1 2 5 becomes It is lower than the height position of the portion supported on the lift roller 12. Next, the plurality of positioning pins 12 abut on the upstream side in the transport direction of the substrate 1〇9, the downstream side in the transport direction, and the respective edges on both sides in the width direction. Thereby, the position and posture of the substrate 109 in the horizontal direction are defined (step sl3). Thus, by positioning the substrate 1〇9, the lower surface of the substrate 109 can be made in the following step 31〇8. The more accurate position is maintained in the adsorption holding portion 1 32a °. When the positioning of the substrate 109 is completed, the four guide rollers 126 are lowered and retracted to the specific retracted position. Further, the plurality of positioning pins 127a abut against the substrate 1 The positioning pin 27a at both end edges of the width direction of the crucible 9 is also separated from the substrate i〇9, and is withdrawn to a specific retracted position (step S104). After the positioning pin 127a is withdrawn, a part of the upstream side of the substrate 109 is conveyed. Also supported by the lifting roller 121. By the static friction between the substrate 109 and the lift roller 121, the positional deviation of the substrate 109 in the width direction can be prevented. Then, the plurality of lift pins 28a are raised (step S105, the state of Figs. 22 and 23). The lift pin 128a abuts against the lower surface of the substrate 1〇9 and pushes up the vicinity of both end portions of the substrate 109 in the width direction. As shown in FIGS. 22 and 23, the upper ends of the plurality of lift pins 128a rise to a more standard position. The position of the upper end portion of the lift roller 121 is higher. The substrate 109 of the present embodiment is relatively large and flexible. Therefore, in the step S105, the substrate 109 is only wide-spread! The vicinity of both end portions of the direction of the dragon is pushed up partially. The width 12 1 » of the substrate 109 is maintained in a state of being supported by the lifting roller 121 and the inlet floating table 125. ώ: ^ ^ In particular, the substrate 109 In the central portion of the width direction, one of the upper side of the transport upper side is still supported by the lifter 12 1 . Therefore, the static friction of the 土 9 soil plate 109 and the lift roller 121 prevents the position of the substrate 109 in the width direction. Offset. Also, in this embodiment In the case where the positioning pin 127a abutting on both end edges of the substrate 1〇9 in the width direction is withdrawn, the plurality of lift pins _ are raised. Therefore, when the lift pin 128a is raised, the width direction end of the base (four) 9 is increased. The edge portion and the positioning pin 127a are not in sliding contact. Thereby, the generation of particles caused by the sliding contact between the substrate 1〇9 and the positioning pin 12 can be prevented. After that, the lifting roller 121 is lowered from the standard position to the lowered position. (Step S106, the state of Fig. 24 and Fig. 25.) When the elevation roller 121 is lowered, the height position of the upper end portion of the elevation roller 121 is lower than the height position of the upper end portion of the movable roller 124. Therefore, a plurality of the movable rollers 124 support a part of the upstream side in the transport direction in the central portion in the width direction of the substrate 109 instead of the plurality of lift rollers 12. The vicinity of both end portions in the width direction of the substrate 109 is maintained in a state of being supported by a plurality of lift pins 128a. Then, the pair of chuck mechanisms 13 2 are moved to the upstream side in the transport direction. Thereby, the adsorption holding portion 132a is made to enter below the pushed up portion of the substrate 1〇9 (the state of Figs. S107' and Figs. 26 and 27). Further, after the suction operation of the adsorption holding portion 132a is started, the plurality of lift pins i 28a are lowered. That is, the lift-up pushing mechanism 128 pushes up the substrate 109. Thereby, both end portions in the width direction of the substrate 109 are brought close to the adsorption holding portion 150753.doc -39-201133681 132a of the chuck mechanism 132. The elastic adsorbing body 324 of the adsorption holding portion 132a is adsorbed on the lower surface of the substrate 1〇9, and thereafter contracted by the negative pressure. Thereby, the lower surface of the substrate 1〇9 is pulled to the holding surface 321 of the adsorption holding portion 1323. As a result, the end portions of the substrate 1 宽度 9 in the width direction are adsorbed and held by the adsorption holding portions 132 & (step Μ (10), Figs. 28 and 29). The substrate 1〇9 is in a state in which one of the upstream sides of the conveyance direction is contact-supported on the movable roller 124, and one of the downstream sides of the conveyance direction is supported by the inlet floating table 125, and the both ends of the width direction are adsorbed. It is held by the chuck mechanism 132. In the present embodiment, during the operation of the steps s1〇3 to sl8 in the transfer unit 12, the positioning pin 12 is abutted on the edge portion of the upstream side of the substrate 109 in the transport direction and the downstream side of the transport direction. Thereby, the positional shift of the substrate 1〇9 in the conveyance direction can be prevented. Further, when the vicinity of both end portions in the width direction of the substrate 1〇9 is pushed up as in the present embodiment, the force in the transport direction is hard to act on the substrate 109. Therefore, even if the push-up is not in contact with the positioning pins 127 & the positional deviation of the conveyance direction of the substrate 109 is hard to occur. Further, during the period from S103 to S108, the substrate 1〇9 is continuously contact-supported by the lift roller 121 or the movable roller 124. Therefore, the positional deviation in the width direction of the substrate 1〇9 can be prevented by the static friction of the lifting roller i2i or the movable roller 124 and the substrate 1〇9. Further, in the present embodiment, the upper surface of the substrate 1Q9 is brought close to the clip by pushing up the vicinity of the both end portions in the width direction of the substrate 1 to 9 by the plurality of lift pins 128 & The adsorption holding portion 132a of the head mechanism 132. Thereby, the lower surface of the substrate 1〇9 is held by the adsorption holding unit while the height of the adsorption holding portion 132 & 132753.doc 201133681 is fixed. Therefore, the mechanism for moving the adsorption holding portion 132 to a clear movement can be eliminated, and the cooling mechanism 132 can be simplified. When the substrate 109 is held by the pair of chuck mechanisms 132, the positioning pin 127a abutting on the upstream edge side of the substrate (10) in the transport direction and the downstream side in the transport direction is withdrawn to the withdrawal position of the feature. Further, the chuck mechanism (1) moves toward the downstream side in the transport direction along the guide rail U2b. Thereby, the substrate 109 is transported to the downstream side in the transport direction. The substrate 109 - surface floating support is carried on each of the stages from the inlet floating stage 125 to the outlet floating stage via the coating platform (3). The slit nozzle 142: a resist liquid is sprayed on the upper surface of the substrate 1〇9 conveyed on the coating stage 131. Thereby, a resist liquid is applied to the upper surface of the substrate 109 (step w〇9). In the present embodiment, the end portion on the upstream side in the transport direction of the substrate 1 to 9 is supported by the inlet floating stage 125 before the end portion on the downstream side in the transport direction of the substrate 109 is positioned below the slit nozzle 142. on. That is, at the time when the resist liquid is applied to the upper surface of the substrate 109, the substrate 1 is entirely floated and supported on the inlet floating stage 125 and the coating stage 131. Therefore, the mechanical vibration of the green roller 124 can be suppressed from being transmitted to the substrate in the resist liquid coating process. Thereby, the coating failure of the resist liquid on the upper surface of the substrate 1 〇 9 can be suppressed. The substrate 109 coated with the resist liquid is transported to the exit floating stage 151 until it is stopped. Further, the adsorption holding portion 夹 of the chuck mechanism 132. The adsorption of the substrate 109 is released by stopping the suction operation 彳T. After the adsorption is released, static friction acts also between the substrate 109 and the elastic adsorbing body 324, so that the offset of the substrate 109 can be suppressed. 150753.doc 41 201133681 When the suction of the substrate 109 by the cooling head mechanism 132 is released, a plurality of carry-out pins 152 protrude from the upper surface of the exit floating table 151. Thereby, the substrate 109 is lifted above the exit floating table 151. Thereafter, the transfer robot 1〇3 receives the substrate 1〇9' supported by the plurality of carry-out pins 152, and transfers the substrate 1〇9 from the transfer device 1〇3 to the device 104 in the subsequent step. <2-3. Modifications> The second embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. In the first transport unit 110 of the above-described embodiment, the substrate 109 is transported by a plurality of transport rollers iu. However, the "second transport unit" of the present invention may be a substrate 109 that is transported by another mechanism. For example, the substrate 109 may be supported on a plurality of living members, and the pushing force on the downstream side in the transport direction may be supplied to the substrate 1 to 9 by another method, and may be transported to the downstream side in the transport direction. Further, the substrate (10) may be held on some of the moving members, and the substrate may be conveyed to the downstream side together with the moving member. Further, in the above embodiment, the transfer portion 12A supports the substrate in the width direction of the substrate (10) by the lift roller Hi or the population floating table 125, but the central portion of the width direction of the substrate 109 can be supported by other support forms. . For example, the width direction of the substrate 1G9 may be supported only by the rollers. Further, in the above-described embodiment, the push-up mechanism 128 pushes up the vicinity of both end portions in the width direction of the substrate 1〇9, but the "push-up mechanism" of the present invention can also be used for the other parts of the 1. . For example, it is also possible to push the substrate 1〇9 to the vicinity of both end portions of the transfer unit to the upper end portion of the substrate 132 to enter the end portion 150753.doc • 42. 201133681. Further, in the above embodiment, the positioning pin 127a is exemplified as an example of the "positioning member" in the present invention. However, if the "positioning member" of the present invention is positioned to abut against the substrate 1〇9, it may be of other shapes such as a plate shape. Further, the substrate processing apparatus 1〇1 is a device for applying an anti-corrosion liquid to the upper surface of the substrate 1〇9. However, the substrate processing apparatus of the present invention may be a device for applying a processing liquid other than the resist liquid to the substrate. Further, the substrate processing apparatus of the present invention may be a device that performs processes other than the coating process (cleaning process, drying process, heat treatment, exposure process, development process, etc.). In the substrate processing apparatus 101, the glass substrate 1 〇 9 for a liquid crystal display device is used as a processing target. However, the substrate processing apparatus of the present invention may be a semiconductor wafer, a flexible substrate for a thin film liquid crystal, a substrate for a photomask, and color. Other substrates such as a filter substrate, a solar cell substrate, and an electronic paper substrate are used as processing targets. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top view of a substrate processing apparatus. Fig. 2 is a top view of the vicinity of the first conveying unit and the converting unit. Fig. 3 is a side view showing the vicinity of the first conveying unit and the converting unit. The lifting drive mechanism and Fig. 4 are views of the lifting roller, the movable roller, and the chuck mechanism as viewed from the A-A position in Fig. 1. Fig. 5 is a view showing the lift roller, the W-spinning horse 6 moving mechanism, the movable roller, and the chuck mechanism from the A-A position in Fig. 1. Fig. 6 is a block diagram showing the electrical connection between the control unit and each part of the substrate processing apparatus 150753.doc.43-201133681. Fig. 7 is a flow chart showing the flow of the operation of the substrate processing apparatus. Fig. 8 is a side view showing the vicinity of the converter when the substrate is placed across the lift roller and the inlet floating table. Fig. 9 is a side view showing the vicinity of the conversion portion when a plurality of lift pins are raised. Fig. 1 is a side view of the vicinity of the conversion portion when the elevating roller is lowered. Fig. 11 is a side view showing the vicinity of the conversion portion when the chuck mechanism is disposed below the both end portions in the width direction of the substrate. Fig. 12 is a side view showing the vicinity of the switching portion when both end portions in the width direction of the substrate are attracted to the chuck mechanism. Figure 13 is a top plan view of the substrate processing apparatus. Fig. 14 is a top view of the vicinity of the first conveying unit and the transfer unit. Fig. 15 is a side view showing the vicinity of the first conveying unit and the transfer unit.

面圖。 面圖。 之電性連接構 成的方塊圖。Surface map. Surface map. A block diagram of the electrical connections.

圖2 0係轉移部附近之侧視圖。Figure 20 is a side view of the vicinity of the transfer portion.

附近之結構之 圖22係轉移部附近之側視圖。Fig. 22 is a side view of the vicinity of the transfer portion.

附近之結構之 150753.doc -44 - 201133681 圖24係轉移部附近之側視圖。 結構之 圖25係自圖13中之B-B位置觀察轉移部附近之 圖。 圖26係轉移部附近之側視圖。 結構之 圖27係自圖13中之B-B位置觀察轉移部附近之 圖。 圖28係轉移部附近之側視圖。Nearby structure 150753.doc -44 - 201133681 Figure 24 is a side view of the vicinity of the transfer section. Fig. 25 is a view showing the vicinity of the transfer portion from the position B-B in Fig. 13. Figure 26 is a side view of the vicinity of the transfer portion. Fig. 27 is a view showing the vicinity of the transfer portion from the position B-B in Fig. 13. Figure 28 is a side view of the vicinity of the transfer portion.

圖29係自圖13中之B 圖。 【主要元件符號說明】 1、101 2 ' 4 ' 102 、 104 3 ' 103 9 ' 109 10 ' 110 11 ' 111 11a 、 111a 12 ' 112 20 > 120 21 、 121 21a 、 121a 22 、 122 23 、 123 23a 、 123a B位置觀察轉移部附近之 基板處理裝置 裝置 轉移機械手 基板 第1搬送部 輸送輥 旋轉軸 旋轉驅動機構 轉換部 升降輥 旋轉軸 旋轉驅動機構 升降驅動機構 支臂 結構之 150753.doc -45 - 201133681 23b > 123b 24 ' 124 24a 、 124a 24b ' 124b 25 、 125 25a 、 125a 26 ' 126 27 ' 127 27a,' 127a 28 ' 128a 30 、 130 31 ' 131 32 、 132 32a 32b 、 132b 40 、 140 41 、 141 42 、 142 50 ' 150 51 、 151 52 、 152 60 、 160 71 、 171 72 、 172 氣缸 活親 下游側活輥 上游側活輥 入口浮起台 喷出孔 導引輥 定位機構 定位銷 提昇銷 第2搬送部 塗佈平台 夾頭機構 吸附部 導軌 抗钮劑塗佈機構 橋接部 狹縫喷嘴 搬出部 出口浮起台 搬出用銷 控制部 輥支持台 平台支持台 150753.doc -46- 201133681 128 上推機構 132a 吸附保持部 321 保持面 322 槽 323 抽吸孔 324 彈性吸附體 325 位置偏移感測器 LI 、 L2 、 L3 長度 47 · 150753.docFigure 29 is a diagram from line B in Figure 13. [Description of main component symbols] 1, 101 2 ' 4 ' 102 , 104 3 ' 103 9 ' 109 10 ' 110 11 ' 111 11a , 111a 12 ' 112 20 > 120 21 , 121 21a , 121a 22 , 122 23 , 123 23a, 123a B Position observation Substrate processing device in the vicinity of the transfer unit Transfer robot substrate First transfer unit Transport roller Rotary axis Rotation drive mechanism Conversion unit Lifting roller Rotary axis Rotary drive mechanism Lifting drive mechanism Arm structure 150753.doc -45 - 201133681 23b > 123b 24 ' 124 24a , 124a 24b ' 124b 25 , 125 25a , 125a 26 ' 126 27 ' 127 27a, ' 127a 28 ' 128a 30 , 130 31 ' 131 32 , 132 32a 32b , 132b 40 , 140 41, 141 42 , 142 50 ' 150 51 , 151 52 , 152 60 , 160 71 , 171 72 , 172 cylinder live parent downstream side live roller upstream side live roller inlet float table spray hole guide roller positioning mechanism positioning pin lifting Pin second conveying unit coating platform chuck mechanism suction portion rail resisting agent coating mechanism bridge portion slit nozzle loading portion outlet floating table loading and unloading pin control portion roller support platform support table 150753.doc -46- 20 1133681 128 Push-up mechanism 132a Adsorption holding part 321 Holding surface 322 Groove 323 Suction hole 324 Elastic adsorption body 325 Position offset sensor LI, L2, L3 Length 47 · 150753.doc

Claims (1)

201133681 七1. 括 申請專利範圍： 種基板處理裝置’其係包括搬送基板之機構者，其包 第1搬送部，其將基板搬送至搬送路徑上之特定位 置； 面自 第2搬送部，其使基板一面於平台上浮起 述特定位置向搬送方向下游側搬送； 轉換部，其於上述第1搬送部與上述第2搬送部之間 換基板之支持方式·，以及 控制部，其控制上述轉換部；且 上述轉換部包括： 升降輥，其-面接觸支持基板，一面主動地旋轉，且 可於標準位置與下降位置之間升降移動； 活親，其-面於標準位置之上述升降較之上端部與下 降位置之上述升降報之上端部之間的高度位置接觸支持 基板，一面對應基板之移動而從動 、 入口浮起台，其配置於上述活親之二二游側， 使基板洋起並支持在低於標準位置之上述升降輥對基板 之支持高度的高度；且 於橫跨標準位置之上述升降輕與上述入口浮起台而配 置基板之後’上述控制部係以使上料降輥向上述下降 位置下降而使基板之搬送方向上游側之—部分向上述活 輥轉移之方式控制上述轉換部。 2·如請求項1之基板處理裝置’其中上述入口浮起台之搬 I50753.doc 201133681 送方向之長度短於基板之搬送方向之長度。 3.如請求項1或2之基板處理裝置，其中配置有上述升降幸昆 及上述活輥之區域之搬送方向之長度短於基板之搬送方 向之長度。 4_如請求項1或2之基板處理裝置，其中上述活輥包括： 複數個下游側活輥’其沿上述入口浮起台之搬送方向 上游側之側緣部而排列；以及 複數個上游側活輥’其排列於較上述複數個下游側活 輥更靠搬送方向上游側之位置；且 上述複數個上游側活輥係以低於上述複數個下游側活 輥之密度配置。 5.如請求項1或2之基板處理裝置，其中上述轉換部更包括 定位機構，其於橫跨標準位置之上述升降輥與上述入口 浮起台而配置基板之狀態下，規定基板之水平方向之位 置。 6·如請求項1或2之基板處理裝置，其中上述升降輥及上述 活輥與上述入口浮起台由不同之支持台支持，且相互不 連結。 7·如請求項！或2之基板處理裝置，其中上述活輥為直徑較 上述升降輥之直徑小之輥。 8· 一種轉換方法，其係於第〗搬送部與第2搬送部之間轉換 基板之支持方式者，上述第丨搬送部將基板搬送至搬送 路徑上之特定位置，上述第2搬送部使基板一面於平台 上浮起，一面自上述特定位置向搬送方向下游側搬送， 150753.doc 201133681 該轉換方法利用： 升降輥，.其一面接觸支持基板，_面主動地旋轉，且 可於標準位置與下降位置之間升降移動； 活輕，其-面於標準位置之上述升降輕之上端部與下 降位置之上述升降輥之上端部之間的高度位置接觸支持 基板，—面對應基板之移動而從動地旋轉；以及 入口浮起台，其配置於上述活輥之搬送方向下游側， 一面使基板浮起並支持在低於標準位置之上述升降報對 基板之支持高度的高度；且該 得谀万法包括以下步驟： a)検跨標準位置之上述 置基板;以及 升降觀與上〜洋起台而配 W於上述步驟a)之後’使上述升降觀向上述下降位置 下降，使基板之搬送方向上游側 移。 j t °卩分向上述活輥轉 9. 一種基板處理裝置，其係知括 .. 匕括搬送基板之機構者，其包 ίο · 位^搬送部，其將基板自搬送方向上㈣搬送至特定 卩’其自上述特定位置向搬送方向下游 送基板，以及 轉移部，其於上述特定 + ^ 疋位置，自上述第丨搬送部向上 述第2搬送部轉移基板；且 上述轉移部包括上推機禮，甘 ^ , /、一面維持以水平姿勢接 觸支持基板之一部分之妝能 <狀態，一面將基板之其他部分上 150753.doc 201133681 推， 上述第2搬送部包括保持部，其一面自下表面側保持 基板一面使基板向搬送方向移動， 該基板處理裝置更包括控制部，其以藉由上述上推機 構部分性地將基板上推，使上述保持部進人至基板之被 ·· 上推之部分下方後’解除上述上推機構之上推，藉此使 · 基板保持於上述保持部之方式控制上述上推機構及上述 保持部。 10·如明求項9之基板處理裝置，其中上述轉移部更包括定 位機構，其進行基板之水平方向之定位， 上述控制部係以於上述定位機構定位基板之後，藉由 上述上推機構進行基板之上推之方式控制上述定位機構 及上述上推機構。 11. 如請求項H)之基板處理裝置，其中上述定位機構包括定 位構件’其抵接於基板之端緣部， 上述控制部係以於上述定位機構之定位之後，使抵接 於基板之上述其他部分之上述定位構件自基板撤回其 後，藉由上述上推機構進行基板之上推之方式控制上述 上推機構及上述定位機構。 - 12. 如清求項9至1 i中任一項之基板處理裝置，其中上述保. 持部包括： 保持面’其於保持時規定基板之下表面之高度位置； 以及 彈丨生吸附體，其可向上下方向伸縮並且吸附於基板之 150753.doc • 4 · 201133681 下表面；且 在吸附於基板之前，上述彈性吸附體之上端部位於較 上述保持面更上方， 在吸附於基板時，上述彈性吸附體之上端部位於與上 述保持面相同之高度。 13.如請求項9至11中任一項之基板處理裝置，其中上述上 推機構將與基板之搬送方向正交之方向之兩端部附近上 推。 14. 一種轉移方法，其係將基板自第1搬送部向第2搬送部轉 移者，其包括以下步驟·· a) —面維持以水平姿勢接觸支持基板之一部分之狀 態，一面將基板之其他部分上推； b) 於上述步驟a)之後，#伴杜 交便保持部進入至基板之被上推 之部分下方；及 ，藉此使基板 上述步驟a)之 c)於上述步驟b)之後，解除基板之上推 保持於上述保持部。 15.如請求項丨4之轉移方法，其中更包括幻於 前，進行基板之水平方向之定位之步驟。 1 6.如請求項1 5之轉移方法， 構件抵接於基板之端緣部 其中於上述步驟d)中 ，且 使定位 更包括以下步 板撤回。 .e)於上述步驟d)與上述步驟約之 使抵接於基板之上述其他部分之±述心構件自基 150753.doc201133681 VII. Patent application scope: The substrate processing apparatus includes a mechanism for transporting a substrate, and includes a first transport unit that transports the substrate to a specific position on the transport path; and a surface from the second transport unit. The substrate is transported to the downstream side in the transport direction by floating at a specific position on the platform; the conversion unit supports the substrate between the first transport unit and the second transport unit, and the control unit controls the conversion. And the conversion portion includes: a lifting roller that is in contact with the support substrate, is actively rotated, and is movable up and down between a standard position and a lowered position; the living parent has a face-to-face comparison with the standard position. The height position between the upper end portion and the upper end portion of the lowering and lowering portion of the lowering position contacts the supporting substrate, and the driven and the inlet floating table are arranged corresponding to the movement of the substrate, and are disposed on the second and second swimming sides of the living parent to make the substrate And support the height of the lifting height of the lifting roller to the substrate below the standard position; and the above-mentioned lifting and lowering across the standard position After floating the inlet station and said counter substrate with 'the above-described system control unit so that the feeding roller is lowered down to the lowered position of the substrate conveying direction upstream side of - converting part of the control unit to the above-described embodiment of the live transfer roller. 2. The substrate processing apparatus of claim 1, wherein the length of the feeding direction of the inlet floating stage is shorter than the length of the substrate conveying direction I50753.doc 201133681. 3. The substrate processing apparatus according to claim 1 or 2, wherein a length of the transport direction in which the area of the lifter and the movable roller is disposed is shorter than a length of the transport direction of the substrate. The substrate processing apparatus of claim 1 or 2, wherein the movable roller comprises: a plurality of downstream side movable rollers arranging along a side edge portion on an upstream side in a conveying direction of the inlet floating table; and a plurality of upstream sides The movable roller 'is arranged at a position closer to the upstream side in the conveying direction than the plurality of downstream side movable rollers; and the plurality of upstream side movable rollers are disposed at a lower density than the plurality of downstream side movable rollers. 5. The substrate processing apparatus according to claim 1 or 2, wherein the conversion unit further includes a positioning mechanism that defines a horizontal direction of the substrate in a state in which the substrate is disposed between the lifting roller and the inlet floating table at a standard position. The location. The substrate processing apparatus according to claim 1 or 2, wherein the elevating roller and the movable roller and the inlet floating table are supported by different support tables and are not connected to each other. 7. If requested! Or the substrate processing apparatus of 2, wherein the movable roller is a roller having a diameter smaller than a diameter of the lifting roller. 8. The conversion method of the substrate transfer method between the first transfer unit and the second transfer unit, wherein the second transfer unit transports the substrate to a specific position on the transfer path, and the second transfer unit makes the substrate Floating on the platform, and transporting from the specific position to the downstream side in the transport direction, 150753.doc 201133681 The conversion method utilizes: a lifting roller, one side of which contacts the support substrate, the _ surface actively rotates, and can be lowered in a standard position Moving up and down between positions; living lightly, the height position between the upper end portion of the lifting light and the upper end portion of the lifting roller at the lowering position of the standard position contact the supporting substrate, and the surface is driven by the movement of the substrate a ground rotation; and an inlet floating table disposed on a downstream side of the conveying roller in the conveying direction to float the substrate and support a height of the lifting height of the substrate below the standard position; and The method comprises the following steps: a) arranging the above-mentioned substrate across the standard position; and lifting the view with the upper and the outer starting block with the W in the above step a) After the 'View lowered so that the lift to the lowered position, the substrate of the upstream side of the conveying direction shifted. Jt ° 卩 分 分 分 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9 9卩 'the substrate is conveyed downstream from the specific position in the transport direction, and the transfer portion transfers the substrate from the second transport portion to the second transport portion at the specific + ^ 疋 position; and the transfer portion includes the push-up unit礼,甘^, /, while maintaining the makeup in one of the support substrates in a horizontal posture, pushing the other portion of the substrate 150753.doc 201133681, the second transfer portion including the holding portion, one side of the bottom The substrate processing device further includes a control unit that partially pushes the substrate by the push-up mechanism to bring the holding portion into the substrate. After pushing the lower portion, the above-mentioned push-up mechanism is pushed up, thereby controlling the push-up mechanism and the above-mentioned protection in such a manner that the substrate is held by the holding portion. Hold the department. The substrate processing apparatus of claim 9, wherein the transfer unit further comprises a positioning mechanism for positioning the substrate in a horizontal direction, wherein the control unit is configured by the push-up mechanism after the positioning mechanism positions the substrate The positioning mechanism and the push-up mechanism are controlled by pushing the substrate upward. 11. The substrate processing apparatus of claim H), wherein the positioning mechanism includes a positioning member that abuts an end edge portion of the substrate, and the control portion is configured to abut the substrate after the positioning of the positioning mechanism After the other portion of the positioning member is withdrawn from the substrate, the push-up mechanism and the positioning mechanism are controlled by pushing up the substrate by the push-up mechanism. The substrate processing apparatus according to any one of the items 9 to 1 wherein the holding portion includes: a holding surface that defines a height position of a lower surface of the substrate when held; and an elastic adsorption body The upper surface of the elastic adsorbing body is located above the holding surface before being adsorbed on the substrate, and is adsorbed on the substrate, before being adsorbed on the substrate, and is adsorbed on the lower surface of the substrate 150853.doc • 4 · 201133681; The upper end portion of the elastic adsorbing body is located at the same height as the above-mentioned holding surface. The substrate processing apparatus according to any one of claims 9 to 11, wherein the push-up mechanism pushes up the vicinity of both end portions in a direction orthogonal to a conveyance direction of the substrate. 14. A transfer method for transferring a substrate from a first transfer unit to a second transfer unit, comprising the steps of: a) maintaining a state in which one of the support substrates is in a horizontal posture while maintaining the other state of the substrate a part of the push-up; b) after the above step a), the #配杜便便部 portion enters below the pushed-up portion of the substrate; and, thereby, the substrate c) after the step b) The substrate is pushed up and held by the holding portion. 15. The method of claim 4, further comprising the step of locating the horizontal direction of the substrate before the illusion. 1 6. According to the transfer method of claim 15, the member abuts on the edge portion of the substrate, which is in the above step d), and the positioning further includes the following step of withdrawing. .e) in the above step d) and the above steps about abutting the other parts of the substrate from the reference portion from the base 150753.doc
TW099130903A 2010-03-29 2010-09-13 Substrate processing apparatus, changing method and transferring method TWI462215B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010074370A JP5254269B2 (en) 2010-03-29 2010-03-29 Substrate processing apparatus and transfer method
JP2010074259A JP5165718B2 (en) 2010-03-29 2010-03-29 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW201133681A true TW201133681A (en) 2011-10-01
TWI462215B TWI462215B (en) 2014-11-21

Family

ID=44695021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099130903A TWI462215B (en) 2010-03-29 2010-09-13 Substrate processing apparatus, changing method and transferring method

Country Status (3)

Country Link
KR (1) KR101226784B1 (en)
CN (2) CN102205911B (en)
TW (1) TWI462215B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106548965A (en) * 2015-09-18 2017-03-29 株式会社思可林集团 Substrate board treatment and substrate processing method using same
TWI630059B (en) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101365049B1 (en) * 2012-08-02 2014-02-20 한국미쯔보시다이아몬드공업(주) Rolling break apparatus for brittle material substrate
KR101794875B1 (en) * 2015-01-30 2017-11-07 가부시키가이샤 하리즈 Inspection apparatus for transparent plate, and inspection system including the same
KR102347409B1 (en) * 2015-05-27 2022-01-05 세메스 주식회사 Inkjet Printer
TWI800584B (en) * 2018-01-11 2023-05-01 日商日本碍子股份有限公司 Heat treatment furnace and manufacturing method thereof
CN114313431A (en) * 2021-12-07 2022-04-12 深圳创视智能视觉技术股份有限公司 Feed divider and intelligent bag arranging robot

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3070006B2 (en) * 1997-02-07 2000-07-24 株式会社オーク製作所 How to transport thin work
JP2000277587A (en) * 1999-03-29 2000-10-06 Kokusai Electric Co Ltd Substrate carrying system
JP3682396B2 (en) 2000-02-24 2005-08-10 東レエンジニアリング株式会社 Fixed point conveying device for thin plate materials
TW569288B (en) * 2001-06-19 2004-01-01 Tokyo Electron Ltd Substrate processing apparatus, liquid processing apparatus and liquid processing method
JP3926593B2 (en) * 2001-09-14 2007-06-06 大日本スクリーン製造株式会社 Substrate processing equipment
JP4563191B2 (en) * 2005-01-17 2010-10-13 大日本スクリーン製造株式会社 Substrate processing equipment
JP4554397B2 (en) * 2005-02-23 2010-09-29 東京エレクトロン株式会社 Stage device and coating treatment device
JP4895518B2 (en) * 2005-03-22 2012-03-14 オリンパス株式会社 Substrate holding device and substrate holding method
KR100618918B1 (en) * 2005-04-12 2006-09-01 주식회사 디엠에스 Apparatus for transfering works
JP4745040B2 (en) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 Substrate transport apparatus and substrate processing apparatus
JP4853204B2 (en) * 2006-09-28 2012-01-11 大日本印刷株式会社 Plate-like material conveying method and plate-like material conveying device
JP2008159644A (en) * 2006-12-21 2008-07-10 Shinkawa Ltd Bonding apparatus, and method of suction for circuit board in bonding apparatus
JP2008166348A (en) * 2006-12-27 2008-07-17 Olympus Corp Substrate transfer apparatus
JP2009049232A (en) * 2007-08-21 2009-03-05 Dainippon Screen Mfg Co Ltd Substrate processing equipment
JP2009094184A (en) * 2007-10-05 2009-04-30 Toray Ind Inc Substrate treatment apparatus and treating method
JP2009176858A (en) * 2008-01-23 2009-08-06 Toppan Printing Co Ltd Substrate delivery apparatus
JP5300288B2 (en) * 2008-03-12 2013-09-25 大日本スクリーン製造株式会社 Substrate transfer apparatus and substrate processing apparatus
JP4755233B2 (en) * 2008-09-11 2011-08-24 東京エレクトロン株式会社 Substrate processing equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106548965A (en) * 2015-09-18 2017-03-29 株式会社思可林集团 Substrate board treatment and substrate processing method using same
TWI623476B (en) * 2015-09-18 2018-05-11 思可林集團股份有限公司 Substrate processing apparatus and substrate processing method
CN106548965B (en) * 2015-09-18 2019-12-24 株式会社思可林集团 Substrate processing apparatus and substrate processing method
TWI630059B (en) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench

Also Published As

Publication number Publication date
CN102205911B (en) 2013-10-30
KR101226784B1 (en) 2013-01-25
CN103177991B (en) 2017-07-14
TWI462215B (en) 2014-11-21
KR20110109784A (en) 2011-10-06
CN103177991A (en) 2013-06-26
CN102205911A (en) 2011-10-05

Similar Documents

Publication Publication Date Title
JP6780732B2 (en) Conveyor device, exposure device, and device manufacturing method
TW201133681A (en) Substrate processing apparatus, changing method and transferring method
JP4495752B2 (en) Substrate processing apparatus and coating apparatus
JP4896236B2 (en) Substrate transport apparatus and substrate transport method
KR101561308B1 (en) Substrate transfer apparatus and substrate transfer method
CN113238461B (en) Exposure apparatus, method for manufacturing flat panel display, method for manufacturing device, and exposure method
JP2005223119A (en) Apparatus and method for forming coating film
WO2006090619A1 (en) Stage apparatus and coating treatment device
KR101286283B1 (en) Substrate transfer apparatus and substrate transfer method
JP2008166348A (en) Substrate transfer apparatus
JP2008066675A (en) Substrate conveying apparatus, and substrate conveying method
TWI596018B (en) Removing method, removing apparatus and printing system
TWI693663B (en) Substrate transport device, exposure device, flat panel display manufacturing method, element manufacturing method, substrate transport method, and exposure method
JP2005247516A (en) Levitated substrate conveying treatment device
JP2011207539A (en) Substrate processing device
JP5254269B2 (en) Substrate processing apparatus and transfer method
JP7355174B2 (en) Substrate transport device, exposure device, flat panel display manufacturing method, device manufacturing method, substrate transport method, and exposure method
WO2019064576A1 (en) Substrate handing device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method
WO2019064577A1 (en) Substrate handling device, exposure device, method for producing flat panel display, device production method, substrate handling method, and exposure method
TWI692053B (en) Substrate transfer device, exposure device, flat panel display manufacturing method, element manufacturing method, substrate transfer method, and exposure method
JP2007324169A (en) Carrying arm, substrate carrier, and substrate inspection apparatus
JP2013084798A (en) Substrate inspection device and substrate carrying method