1356974 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種在印刷基板及液晶用基板上經由 光罩進行曝光處理而形成既定圖案的曝光裝置及曝光方 法0 【先前技術】 一般而言’印刷基板等基板及光罩薄膜會被曝光裝置 的曝光部内的溫度、濕度等環境條件大大地影響其尺寸精 度。根據印刷電路技術便覽第2版所記載的「表2. 5. 3」 各種樹脂的多層板（基板）的特性，代表性的基板之一為Βτ 樹脂’其溫度特性：在XY方向為， 在Z方向為4〜5xl(T5cm/cm厂C。又，在相同的1046頁中， 記載著光罩薄膜的溫度特性為lxl 〇-3%/〇c，濕度特性為j. 4 xl 0 3%/°C。即基板及光罩薄膜具有非常容易受環境影響的 特性。 在使用如此的基板及光罩薄膜所進行的曝光製程中， 在曝光前的整合作業及冑光作#時，#&罩薄膜或基板彼 此的溫度、濕度條件不同時，形成於基板及光罩薄膜上的 定位標記的位置精度及曝光圓案的位置精度等會變化，會 有無法形成高精度圖案的問題。 因此’在習知的曝光裝置中，每次更換具有配合環境 條件之尺寸精度的光罩薄膜，或在曝光裝置以外的處所， 為了整合光罩薄膜與基板而花費長時間使其收敛等，使雙 2036-7854-PF;Chentf 5 1356974 方順應於同—條件而調和總體精度後，操作移至曝光裝置 進行的曝光製程。因此’以曝光裝置操作前的階段或在曝 光裝置内，残整環境的變化，或者是在省去條件的整合 作業時轉寫至基板的圖案形狀產生變化，都會使精度變 差，同時會有生產性無法提高的問題。 因此，在基材表面塗佈有光阻墨液的基板，在加熱光1356974 IX. The present invention relates to an exposure apparatus and an exposure method for forming a predetermined pattern on a printed substrate and a liquid crystal substrate by exposure processing through a photomask. [Prior Art] In other words, the substrate such as a printed circuit board and the photomask film are greatly affected by environmental conditions such as temperature and humidity in the exposure portion of the exposure device. According to the characteristics of the multilayer board (substrate) of various resins described in the second edition of the printed circuit technology, one of the representative substrates is Βτ resin'. Temperature characteristics: in the XY direction, The Z direction is 4~5xl (T5cm/cm Factory C. Also, in the same 1046 pages, the temperature characteristic of the photomask film is 1xl 〇-3%/〇c, and the humidity characteristic is j. 4 xl 0 3% / ° C. That is, the substrate and the photomask film have characteristics that are very susceptible to environmental influences. In the exposure process using such a substrate and a photomask film, in the integration work before exposure and the time of the light, #& When the temperature and humidity conditions of the cover film or the substrate are different, the positional accuracy of the positioning marks formed on the substrate and the photomask film and the positional accuracy of the exposure film may change, and there is a problem that a high-precision pattern cannot be formed. 'In a conventional exposure apparatus, each time a mask film having dimensional accuracy with environmental conditions is replaced, or a space other than the exposure apparatus, it takes a long time to integrate the mask film and the substrate, so that the double 2036-7854-PF; Chentf 5 1356974 The square is compliant with the same conditions to reconcile the overall accuracy, the operation is moved to the exposure process performed by the exposure device. Therefore, 'the stage before the operation of the exposure device or within the exposure device, the change of the residual environment, or is omitted When the condition is integrated, the shape of the pattern transferred to the substrate changes, and the accuracy is deteriorated, and the productivity cannot be improved. Therefore, the substrate coated with the resist ink on the surface of the substrate is heated.
阻墨液並乾燥後’投人曝光裝置中。投人曝光裝置的搬運 製程在將溫度、濕度控制在某種程度的室内進行。又，將 基板曝光的曝光裝置雖然設置於概略溫度為23C，濕度為 ⑽左右的”的環境中，由於在該曝光裝置中，構成機構 元件配備有紫外線燈、光學系、搬運機構、真空吸附機構、 表裡反轉機構等、以及各種熱源，曝光裝置内部的環境特 別是溫度及濕度條件大多非常不穩定。而且在曝光作業 中’為了確認基板的搬運位置、光罩薄膜的安裝狀態以及 表面的清潔度，操作員藉由開閉曝光裝置的監視窗等，曝 光裝置外部的大氣會流入曝光裝置内部，結果使曝光裝置 的内部環境非常不穩定。 一方面，將製作的基板運送至設置曝光裝置的場所 時，其運送通路經過高溫多濕的環境時，由於運送通路的 環境影響可能使基準位置產生變化，有無法簡單地做整合 之虞°特別是持續進行連續的曝光作業時，在追求高生產 性之餘，由於在超過控制曝光部内的環境的能力以上而在 紐時間内給予曝光能量，曝光部内的溫度可能成為高溫、 ^肩的環境，在最終的回路的轉寫產生不良的影響恐怕 6 2036-7854-PF；Chentf 產生停止生產的狀況。 =此’藉由專利文们或者是專利讀2所記載的曝 光裝置’提出一種曝光裝置，在其在曝光部中，基板盘光 罩（玻璃素材）的溫度控制成實質上相^而且，在專利文 獻3 t，基板及光罩薄膜（光罩）的位置偏移量由⑽攝影 機檢測出，從該位置偏移量，在溫度/濕度控制裝置中，使 先罩薄膜伸縮而求得溫度及/或濕度條件，將所求得的溫度 及/或濕度條件藉由空氣調整裝置而設計光罩薄膜的構造。 [專利文獻1]特許第3214494號公報（段落號⑽ 0032) [專利文獻2]特許帛3286994號公報（段落號〇〇ιι〜 0032) [專利文獻3]特開平6_258848號公報（段落號0018〜 0033 ，圖 1) 【發明内容】 [發明所欲解決的問題] *、、：而’專利文獻1或專利文獻2所記載的曝光裝置的 構&係將預校準部的溫度與曝光部的溫度實質上控制成同 1度’由於成為對象物的光罩係進行針對玻璃素材的調 整70王不考慮濕度的問題。因此，在習知的曝光裝置中， 由於預校準。p的濕度與曝光部的濕度不同，曝光部的光罩 薄膜與基板做嚴謹的位置配合是困難的，冑了實施嚴謹的 位置配合’雖然必須等到溫度成為同一條件，但要到濕度 2036-7854-PF；chentf 7 1356974 條件齊備之後，才可進行位置配合作業，因此會有曝光效 率不佳的缺點。即，曝光裝置在使用光罩薄膜的構造中， + I是預校準部與曝光部的溫度，濕度也要控制到同一條 件’否則無法迅速地進行光罩薄膜與基板的位置配合使 其成為阻礙生產性的重要因素。 又’在專利文獻3所記載的曝光裝置的構造中，由於 僅對曝光部的溫度/濕度做控制，調整容易受溫度濕度影響 的光罩薄膜以及與光罩薄膜受到不同溫度濕度影響的基板 需花費時間，而光罩薄膜與基板的位置配合作業仍然需花 費時間。然後，在專利文獻3的構造中，雖然可對應調整 曝光部的濕度及溫度，由於對應於各基板而調整光罩薄 膜，對基板的伸縮狀態或光罩薄膜的伸縮狀態，每次位置 配口時都要做調整，無法避免在每個實施調整作業的單位 中’基板與光罩薄膜的精度不同的問題。 而且，在預校準部的構造中，由於吸附基板做搬運的 處理器（handler·)與預定位機構等的各構造為可動，雖然必 須在適當的位置檢龍度及錢，但在上料文獻中預校 準邛的構造並未全部記.載。而且，在預校準部與曝光部中， 當供給光罩薄膜或基板溫度及濕度時，在各構造可動的位 置上’必須考慮效率及塵料，無法如專利讀丨或專利 文獻2 ’在曝光台以外新設置的位置上進行溫度的調整。 有^於此本發明的目的在於提供一種曝光裝置及曝 光方法，基板與光罩薄膜的精度在每次溫度及濕度的調整 作業均㈣，可對應於輸送通路的影響及曝光裝置内部的 2036-7854-PF;Chentf 8 1356974 環境變化而調整’又，即使在具有預校準部的曝光裝置中 可在適田的位置進行溫度及濕度的提供與檢測。 [解決問題的手段]After the ink is blocked and dried, it is placed in an exposure apparatus. The handling of the exposure and exposure device is carried out in a room where the temperature and humidity are controlled to some extent. Further, in an environment in which the exposure apparatus for exposing the substrate is provided in an environment having a rough temperature of 23 C and a humidity of about (10), in the exposure apparatus, the constituent elements are provided with an ultraviolet lamp, an optical system, a transport mechanism, and a vacuum suction mechanism. In the surface, the reversing mechanism, and various heat sources, the environment inside the exposure device, especially the temperature and humidity conditions, are mostly unstable. In the exposure operation, 'in order to confirm the substrate transfer position, the photomask film mounting state, and the surface Cleanliness, the operator opens and closes the exposure window of the exposure device, etc., and the atmosphere outside the exposure device flows into the interior of the exposure device, with the result that the internal environment of the exposure device is very unstable. On the one hand, the fabricated substrate is transported to the exposure device. When the transportation path passes through a high-temperature and high-humidity environment, the environmental position of the transportation path may change the reference position, and it is impossible to simply integrate it. Especially in the continuous continuous exposure operation, the pursuit of high production is required. In addition to the ability of the environment in the exposure control section Above the force, the exposure energy is given during the New Zealand time, and the temperature in the exposure portion may become a high temperature, a shoulder environment, and the adverse effect of the final circuit transfer may be 6 2036-7854-PF; the Chentf production stop production. = "The exposure apparatus described in the patent document or the patent reading 2" proposes an exposure apparatus in which the temperature of the substrate disk mask (glass material) is controlled to be substantially Patent Document 3 t, the positional shift amount of the substrate and the photomask film (mask) is detected by (10) the camera, and the temperature is shifted from the position, and the temperature of the first cover film is expanded and contracted to obtain the temperature and temperature in the temperature/humidity control device. And the humidity condition, the temperature and/or humidity conditions of the obtained condition are designed by the air conditioning device. [Patent Document 1] Patent No. 3214494 (paragraph No. (10) 0032) [Patent Document 2] [Patent Document 3] Japanese Laid-Open Patent Publication No. Hei 6-258848 (paragraph No. 0018 to 0033, Fig. 1) [Disclosed [Problems to be Solved by the Invention] *, In the configuration of the exposure apparatus described in the patent document 1 or the patent document 2, the temperature of the pre-calibration unit and the temperature of the exposure unit are substantially controlled to be the same degree. The adjustment of the 70 king does not consider the problem of humidity. Therefore, in the conventional exposure apparatus, due to the pre-calibration, the humidity of the p is different from the humidity of the exposure portion, and it is difficult to make a rigorous positional cooperation between the mask film of the exposure portion and the substrate.胄 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' That is, in the structure in which the photomask film is used in the exposure apparatus, + I is the temperature of the pre-calibration section and the exposure section, and the humidity is also controlled to the same condition. Otherwise, the position of the photomask film and the substrate cannot be quickly matched to become An important factor hindering productivity. Further, in the structure of the exposure apparatus described in Patent Document 3, since only the temperature/humidity of the exposure portion is controlled, it is necessary to adjust the mask film which is easily affected by the temperature and humidity and the substrate which is affected by the temperature and humidity of the mask film. It takes time, and the position of the photomask film and the substrate still takes time. Then, in the structure of Patent Document 3, the humidity and temperature of the exposure portion can be adjusted correspondingly, and the mask film is adjusted corresponding to each substrate, and the expansion and contraction state of the substrate or the expansion and contraction state of the mask film is performed at each position. Adjustments must be made at all times, and it is inevitable that the accuracy of the substrate and the mask film is different in each unit in which the adjustment work is performed. Further, in the configuration of the pre-calibration unit, since the configurations of the processor (handler·) and the predetermined position mechanism for transporting the substrate are movable, although it is necessary to check the length and money at an appropriate position, in the loading literature The structure of the pre-calibrated 邛 is not fully recorded. Further, in the pre-calibration portion and the exposure portion, when the photomask film or the substrate temperature and humidity are supplied, the efficiency and the dust must be taken into consideration at the positions where the structures are movable, and cannot be exposed as in Patent Reading or Patent Document 2 ' The temperature is adjusted at a new location outside the station. The object of the present invention is to provide an exposure apparatus and an exposure method. The accuracy of the substrate and the mask film is adjusted every time temperature and humidity (4), and can correspond to the influence of the transport path and the inside of the exposure apparatus 2036- 7854-PF; Chentf 8 1356974 Adjusted for environmental changes' Again, temperature and humidity can be supplied and detected at the location of the field even in an exposure unit with a pre-calibration unit. [Means for solving problems]
為了解決上述的問題，本發明的曝光裝置包括：一曝 光。P對基板做曝光處理，該基板係由設置於面向保持光 罩薄膜的燒框的位置上的曝光台搬運；-預校準部，配置 於該曝光部的正前方，肖由推動上述基板之端面的推動銷 移動部進行預先定位；—溫度調整裝置卜濕度調整裝置； —基板溫度濕度檢測裝置；-光罩溫度濕度檢測裝置；以 及-溫度濕度控㈣置請專利範圍第i項）。 在上述構造的曝光作業甲，當基板投入預校準部時， 經由推動鎖移動部，推動基板的端面而進行預備的定位作 業’同時藉由基板的溫度濕度檢測裝置檢測出對應於基板 表面侧的溫度與濕度，檢測出的值送至溫度濕度控制裝 置。又，在曝光部，光罩薄膜的表面側的溫度及濕度係由 光罩溫度濕度檢測裝置檢測出，檢測出的值送至溫度濕度 控制裝置。然I，在曝光裝置的溫度濕度控制裝置中:、： 制溫度調整裝置與濕度調整裝置，藉由預設的基準溫度： 值與基準濕度的值（在記憶裝置中所記憶基準值）與送至的 溫度與濕度的值，成為#光料光罩薄膜或預校準部的基 板上的基準溫度及基準濕度。因此，基板與光罩薄膜經由 溫度濕度控制裝置，由溫度調整裝置與濕度調整裝置調整 至經常接近於基準溫度及基準濕度。 2036-7854-PF;Chentf 9 1356974 又，在上述曝光裝置中’上述溫度調整裝置包括：一 抵接板，配置於上述預校準部的預先定位的位置以及載置 上述曝光部之上述曝光台的基板的位置，並抵接於基板的 下面，一冷媒配管路，抵接於該抵接板，將該抵接板調整 至所設定的溫度；以及一冷媒溫度調節裝置，調節流通於 該配管路的冷媒的溫度，其中上述預校準部的抵接板係由 升降移動該基板的升降機構所支持，使得對應於將基板搬 入至既定位置的輸送滾子而形成貫穿孔被上述輸送滾子貫 穿，且該抵接板的板表面從上述輸送滾子的上端上升（申請 專利範圍第2項）。 在如此構造的曝光裝置中，基板由預校準部的輸送滾 子輪送至既定位置而停止，升降機構作動而使抵接板從輸 送滾子的上端上升，藉此該抵接板成為從輸送滾子接受並 載置基板的狀態，基板與抵接板成為面接觸的狀態。另一 方面，在曝光部中，當基板由處理器等搬運而載置於曝光 台上時，該載置面作為抵接板與該基板作面接觸。然後， 抵接板藉由以冷媒溫度調節部調節溫度的冷媒在其中流通 的配管路作溫度調節而使基板成為基準溫度。 而且在上述曝光裝置中，上述濕度調整裝置包括：一 濕潤室，與上述預校準部或者是上述曝光部分隔設置，在 空氣中包含設定的濕度；一濕潤室溫度濕度檢測裝置，檢 測該濕濁室的溫度及濕度；一濕满室調節部’根據該濕潤 室溫度濕度檢測裝置所檢測之溫度及濕度，調節上述濕潤 室内的溫度及濕度；-送風裝置，將包含上述濕潤室調節 2036-7854-PF;Ghentf 10 丄 *356974 部所調節之濕度調節空氣做送風；以及一、 送風裝置做送風的上述濕度調節 ’將該 上述曝光部（_請專利範圍第3項、上述預校準部及 .的曝光裝置’在位於與預校準部及曝光 问處所中的濕潤室，由濕润室調節部調節包含所一不In order to solve the above problems, the exposure apparatus of the present invention comprises: an exposure. P is exposed to the substrate, and the substrate is transported by an exposure stage disposed at a position facing the burnt frame holding the photomask film; the pre-aligned portion is disposed directly in front of the exposed portion, and the end surface of the substrate is pushed by The push pin moving portion performs pre-positioning; - the temperature adjusting device b humidity adjusting device; - the substrate temperature and humidity detecting device; - the reticle temperature and humidity detecting device; and - the temperature and humidity control (4), the patent range (i). In the exposure operation A of the above configuration, when the substrate is placed in the pre-alignment portion, the end surface of the substrate is pushed by the push lock moving portion to perform a preliminary positioning operation, and the temperature and humidity detecting device of the substrate detects the surface side corresponding to the substrate. Temperature and humidity, the detected value is sent to the temperature and humidity control device. Further, in the exposure portion, the temperature and humidity on the surface side of the mask film are detected by the mask temperature and humidity detecting means, and the detected value is sent to the temperature and humidity controller. However, in the temperature and humidity control device of the exposure device::: the temperature adjustment device and the humidity adjustment device, by the preset reference temperature: the value and the value of the reference humidity (the reference value stored in the memory device) The value of the temperature and humidity to be the reference temperature and the reference humidity on the substrate of the #光料膜膜 or the pre-calibration section. Therefore, the substrate and the photomask film are adjusted by the temperature adjusting device and the humidity adjusting device to be often close to the reference temperature and the reference humidity via the temperature and humidity control device. Further, in the exposure apparatus described above, the temperature adjustment device includes: a contact plate disposed at a pre-positioned position of the pre-aligned portion; and the exposure stage on which the exposure portion is placed Positioning the substrate and abutting against the lower surface of the substrate, a refrigerant distribution pipe abutting the abutment plate, adjusting the abutment plate to the set temperature; and a refrigerant temperature adjusting device regulating the circulation of the pipe The temperature of the refrigerant, wherein the abutting plate of the pre-alignment portion is supported by a lifting mechanism that moves the substrate up and down, so that a through-hole is formed by the conveying roller corresponding to the conveying roller that moves the substrate to a predetermined position, And the plate surface of the abutting plate rises from the upper end of the above-mentioned conveying roller (the second item of the patent application). In the exposure apparatus configured as described above, the substrate is stopped by the transport roller of the pre-alignment portion to a predetermined position, and the elevating mechanism is actuated to raise the abutment plate from the upper end of the transport roller, whereby the abutment plate becomes transported The roller receives and mounts the substrate, and the substrate and the contact plate are in surface contact. On the other hand, in the exposure unit, when the substrate is transported by a processor or the like and placed on the exposure stage, the mounting surface is in surface contact with the substrate as a contact plate. Then, the abutment plate is temperature-adjusted by a piping in which the refrigerant whose temperature is adjusted by the refrigerant temperature adjusting portion flows, thereby setting the substrate to the reference temperature. Further, in the above exposure apparatus, the humidity adjusting device includes: a humid chamber which is provided apart from the pre-aligned portion or the exposed portion, and includes a set humidity in the air; and a humid chamber temperature and humidity detecting device detects the wetness The temperature and humidity of the chamber; a wet full chamber adjusting portion 'adjusts the temperature and humidity in the humid chamber according to the temperature and humidity detected by the humid chamber temperature and humidity detecting device; - the air blowing device, which includes the humid chamber adjustment 2036-7854 - PF; Ghentf 10 丄 * 356974 The humidity is adjusted by the air to adjust the air for air supply; and one, the air supply device to make the above-mentioned humidity adjustment of the air supply 'the above-mentioned exposure part (_ please patent scope item 3, the above pre-calibration part and. The exposure device is disposed in the humid chamber in the pre-calibration portion and the exposure space, and is adjusted by the humid chamber adjustment portion.
度的空氣…濕度調節空氣。然後，曝::::::: 部或曝光部。 以風通路运風至預校準 、、甚 '門2 裝置更包括—循環流路，設於上述 2潤至與上述預校準部之間以及設於上述制室與上述曝 光部之間；上述循環流路具有從上述濕潤室連通至上述預 校準部及上述曝光部的送風流路、以及從上述預校準部連 通至濕濁室及從上述曝光部連通至濕潤室的回收流路；上 述送風流路在上述曝光部的上述光罩薄膜的上方側設有送 風口，同時在上述預校準部的上述基板的上方側設有送風 口；上述回收流路包括設於上述預校準部的地面側及上述 曝光部的地面側的排氣口、從該排氣口經由一過滤器而循 環至上述濕潤室的循環路、以及從上述排氣口起設於上述 循ί衣路中既定位置的排氣風扇（申請專利範圍第4項）。 在此構造的曝光裝置中，在濕潤室内將調節後的濕度 調節空氣藉由送風裝置經過送風通路從送風口做送風，藉 此’從基板或光罩薄膜的上方側供給，而調整該基板或該 光罩薄膜至少一方的溫度濕度。又，供給至預校準部與曝 光部的濕度調節空氣係從基板或光罩薄膜的上方側供給， 2036-7854-PF;Chentf 11 面側的溫度及濕度，調整預校準部與曝光部的溫度與濕 度’而成為基板與光罩薄膜的基準溫度與基準濕度，因此 在處理單位中不會產生偏差值’而且可在基板上形成高 精度的圖案。而且可提高曝光裝置的運轉率。 曝光裝置’在預校準部與曝光部中，由可由溫度調整 裝置的抵接板與基板作面接觸而調整溫度，基板可迅速地 接近基準溫度。又，由於在預校準部與曝光部設置抵接板， 即使由處理器等搬運裝置作搬運，可抑制已經調整過的基 板的溫度的變化至最小。 曝光裝置’由於在濕潤室中將調節濕度後的濕度調節 空氣經由送風裝置及送風流路供給至預校準部與曝光部， 可在迅速且確實地接近於基板及光罩薄膜的基準濕度及基 準溫度的狀態下’進行曝光處理。 曝光裝置將供給至基板或光罩薄膜的濕度調節空氣從 基板或光罩薄膜的上方做送風，並從地面側的排氣口做排 氣而在濕潤室中循環。因此，曝光裝置在各部内的空氣泵 動是從上向下，可抑制粉塵的影響至最小。又，藉由在預 校準部與濕潤室以及曝光部與濕難中使濕度調節空氣做 循環，可對設置該曝光裝置的無塵室的環境影響降至最低 限度。 曝光裝置由於在接近或抵接於基板及光罩薄膜的位置 上配置感測器而檢測出溫度或濕度，檢測出實質上接近於 基板或光罩薄膜表面側的溫度及濕纟，可調整基準溫度及 基準濕度。因此’曝光裝置可在基板上形成高精度的圖案。 2036-7854-PF;Chentf 14 1356974 曝光方法係根據實際的預校準部與曝光部的溫度或濕 度的差叶算出的值’調整預校準部與曝光部的溫度或濕 度，直到接近於基板及光罩薄膜的基準溫度及基準濕度為 止，因此基板或光罩薄膜基準溫度或基準濕度至少其中之 一在統一的狀態下，可在基板上形成高精度的圖案。 【實施方式】 以下，參照圖式說明實施本發明之曝光裝置及曝光方 法的最佳形態》 第1圖為曝光裝置全體的方塊圖，第2圖為曝光裝置 構造的示意圖，第3圖為將預校準部的一部份切出一缺口 的立體圖，第4圖為從曝光側觀看曝光裝置的預定位機構 的正視圖。第5圖表示曝光裝置的預校準部及曝光部中與 基板做面接觸而由冷媒進行溫度調整的溫度調整裝置，並 同時表示基板溫度濕度檢測裝置以及光罩溫度濕度檢測裝 如第1、2圖所示，曝光裝置1包括預校準部1〇、第 一曝光部20、反轉部30、第二曝光部40、搬出部50、溫 度濕度調整部60以及控制部80。而且，在第2圖中，溫 度濕度調整部60以及控制部80由於方便說明的緣故係記 載成設置於鄰接於曝光裝置1的左端側及右端側，但實際 上是設置於不妨礙將基板W搬入至預校準部10或從搬出部 50將基板W搬出的位置上。又，雖然此處之曝光裝置1為 將基板W的兩面依次曝光的雙面曝光裝置的一例而做說 15 2036-7854-PF;Ghentf 1-356974 明’但是單面曝光裝置的構造亦可。 預校準部10係將基板W搬入而進行預定位作業使基板 W易於在曝光部2〇定位的處理機構。該預校準部如第 2至4圖所示，包括接受基板w的搬入滾子u、將基板张 輸送至既定位置的輸送滾子12、該輸送滾子12的驅動機 構13、從輸送滾子12接受基板#並進行基板w的預定位 作業的預定位機構14、可升降地支持載置基板w的抵接板 14a的升降機構15、檢測對應於基板w之表面側的溫度與 濕度的基板溫度濕度檢測裝置16、供給調節濕度後的濕度 調節空軋的供給部1 7、送風孔18以及排氣口 1 9。 如第3圖所示，輸送滾子12係接受從搬入滾子丨丨搬 入的基板W，並搬運至既定的位置上，由配置於既定間隔 的旋轉軸以既定間隔支持著。而且，輸送滾子12並非由驅 動機構13所驅動’僅是從動地設置著。 驅動機構13將驅動馬達的旋轉經由驅動皮帶而使旋 轉軸旋轉。 預定位機構14為推動基板w的端面，並將基板w做預 疋位的裝置。該預定位機構14具有推動載置基板w的抵接 板14a上的基板W的端面的推動銷移動部丨4b以及從形成 於抵接板14a上的空氣孔14c喷出（吸引）空氣的喷氣機構 14d。然後，形成於抵接板14a上的空氣孔14c朝被載置的 基板W的基板投入方向噴出空氣（參照第7C圖），而形成傾 斜。 如第3、4圖所示，推動銷移動部i 4b在面向基板投入 2036-7854-PF;Chentf 16 1356974 方向的位置上，配置於基板w的端面配合位置以及對應於 土板w的基板投入方向的左右的位置等三個位置上。該推 動銷移動部14b包括推動基板w端面的推動銷14bl、設置 於該推動銷丨4bl的本體部14b2、設於該本體部Hb2的腳 部14b3(驅動皮帶用）、14b4(導桿用）、對應於該腳部 4b3 14b4而連接的導引部14b5(驅動皮帶）、i4b6(導 桿）、以及將該導引部14b5、14b5經由一驅動部ub7由一 個驅動源驅動的驅動部14b8。 又，推動銷移動部14b為配置於基準位置上，移動也 可’不移動也可’將推動銷14Μ配置於基板w的預定位的 基準位置上，同時安裝有基板溫度濕度檢測裝置16。而且， 如第4圖所不，輸送滾子12、推動銷移動部⑽及喷氣機 構Ud、升降機構15等，由校準控制部A1控制而動作。 如第5圖所示’流通後述之溫度調整裝置61A的冷媒 的配管路63在實施預定位的位置上，直接或間接地抵接於 抵接板“a的内部或裡面’而且由升降機構15所支持著。 該抵接板14a具有形成於對應輸送滾子”的位置上的貫穿 孔14al、形成於供推動銷移㈣⑷的推動銷咖貫穿 的位置上的缺陷的長孔14a2、以及上述之空氣孔“c及後 述之配管路63。 抵接板14a藉由與載置基板㈣做面接觸而從溫度調 整裝置61A輸送來的冷媒進行基板的溫度調節，同時接 受並載置來自輪送滾子12的基板在進行預定位作業時 使用，而且’將基板，傳遞至處理器2時使用。而且，抵 2036-7854-PF;Ghentf 17 1356974 而且，光罩溫度濕度檢測裝 24a係設置成對於照射光無直接 置24及光罩溫度檢測裝 影響。 置 由光罩溫度濕度檢測裝置24所檢測出的溫度與渴卢 以及由光罩溫度檢測裝£ 24a所檢測出的溫度係輸出= 述的控制部80(參照第！圖^ 如第2圖所示’供給部25將濕潤請内調節的濕卢 調節空氣經由送風π 26送至曝光部2q内並具有過^Degree of air...humidity regulates the air. Then, expose the ::::::: section or the exposure section. The wind passage is pre-calibrated, and the door 2 device further includes a circulation flow path disposed between the second portion and the pre-calibration portion and between the chamber and the exposure portion; The flow path includes a blowing flow path that communicates from the wet chamber to the pre-alignment unit and the exposure unit, and a recovery flow path that communicates from the pre-alignment unit to the wet-clouding chamber and from the exposure unit to the wet chamber; the air flow The air passage is provided on the upper side of the photomask film of the exposure portion, and a blower is provided on the upper side of the substrate of the pre-alignment portion; the recovery flow path is provided on the ground side of the pre-alignment portion and An exhaust port on the ground side of the exposure unit, a circulation path that is circulated to the humid chamber from the exhaust port via a filter, and an exhaust gas that is provided at a predetermined position in the cycle from the exhaust port Fan (No. 4 in the scope of patent application). In the exposure apparatus of this configuration, the adjusted humidity-conditioning air is blown from the air supply port through the air supply passage in the humid chamber, thereby being supplied from the upper side of the substrate or the photomask film to adjust the substrate or At least one of the temperature and humidity of the photomask film. Further, the humidity-conditioning air supplied to the pre-calibration unit and the exposure unit is supplied from the upper side of the substrate or the mask film, 2036-7854-PF; the temperature and humidity on the side of the Chentf 11, and the temperature of the pre-calibration unit and the exposure unit are adjusted. Since the humidity is the reference temperature and the reference humidity of the substrate and the photomask film, the deviation value is not generated in the processing unit, and a high-precision pattern can be formed on the substrate. Moreover, the operating rate of the exposure device can be increased. In the pre-alignment unit and the exposure unit, the temperature is adjusted by the contact plate of the temperature adjustment device in surface contact with the substrate, and the substrate can quickly approach the reference temperature. Further, since the abutment plate is provided in the pre-alignment portion and the exposure portion, even if the conveyance device is transported by a processor or the like, the temperature change of the adjusted substrate can be suppressed to the minimum. The exposure device "sends the humidity-adjusted air after adjusting the humidity in the humid chamber to the pre-calibration portion and the exposure portion via the air blowing device and the air supply passage, so that the reference humidity and the reference of the substrate and the mask film can be quickly and surely obtained. Exposure processing is performed under temperature conditions. The exposure device blows the humidity-conditioning air supplied to the substrate or the mask film from above the substrate or the mask film, and vents it from the floor side exhaust port to circulate in the humid chamber. Therefore, the air pumping of the exposure device in each unit is from top to bottom, and the influence of dust can be suppressed to a minimum. Further, by circulating the humidity-conditioning air in the pre-calibration portion and the humid chamber and the exposure portion and the wetness, the environmental impact of the clean room in which the exposure device is installed can be minimized. The exposure device detects temperature or humidity by arranging the sensor at a position close to or in contact with the substrate and the mask film, and detects temperature and humidity substantially close to the surface side of the substrate or the mask film, and the reference can be adjusted. Temperature and reference humidity. Therefore, the exposure device can form a highly precise pattern on the substrate. 2036-7854-PF; Chentf 14 1356974 The exposure method adjusts the temperature or humidity of the pre-calibration unit and the exposure unit based on the value calculated by the difference between the actual pre-calibration unit and the temperature or humidity of the exposure unit until it is close to the substrate and the light. Since the reference temperature and the reference humidity of the cover film are at least one of the substrate or the mask film reference temperature or the reference humidity, a high-precision pattern can be formed on the substrate. [Embodiment] Hereinafter, a preferred embodiment of an exposure apparatus and an exposure method according to the present invention will be described with reference to the drawings. Fig. 1 is a block diagram showing the entire exposure apparatus, and Fig. 2 is a schematic diagram showing the structure of an exposure apparatus. A portion of the pre-calibration portion cuts out a notched perspective view, and FIG. 4 is a front view of the pre-positioning mechanism of the exposure device viewed from the exposure side. Fig. 5 is a view showing a temperature adjustment device for performing temperature adjustment by a refrigerant in a pre-alignment portion and an exposure portion of the exposure device, and simultaneously showing a substrate temperature and humidity detecting device and a mask temperature and humidity detecting device as the first and second. As shown in the figure, the exposure apparatus 1 includes a pre-calibration unit 1A, a first exposure unit 20, an inversion unit 30, a second exposure unit 40, a carry-out unit 50, a temperature and humidity adjustment unit 60, and a control unit 80. In addition, in the second drawing, the temperature and humidity adjustment unit 60 and the control unit 80 are described as being disposed adjacent to the left end side and the right end side of the exposure apparatus 1, but are actually provided so as not to hinder the substrate W. It is carried in to the pre-alignment unit 10 or the position where the substrate W is carried out from the carry-out unit 50. Further, although the exposure apparatus 1 herein is an example of a double-sided exposure apparatus which sequentially exposes both surfaces of the substrate W, 15 2036-7854-PF; Ghentf 1-356974 ′′, but the structure of the single-sided exposure apparatus may be employed. The pre-alignment unit 10 is a processing mechanism that carries the substrate W and performs a predetermined position to facilitate positioning of the substrate W in the exposure unit 2〇. As shown in FIGS. 2 to 4, the pre-alignment unit includes a loading roller u that receives the substrate w, a conveying roller 12 that conveys the substrate sheet to a predetermined position, a driving mechanism 13 of the conveying roller 12, and a conveying roller. The pre-positioning mechanism 14 that receives the substrate # and performs the predetermined position of the substrate w, the elevating mechanism 15 that supports the abutting plate 14a of the mounting substrate w, and the substrate that detects the temperature and humidity corresponding to the surface side of the substrate w The temperature and humidity detecting device 16 supplies a supply unit 17 for air conditioning after humidity adjustment, a blow hole 18, and an exhaust port 19. As shown in Fig. 3, the transport roller 12 receives the substrate W loaded from the loaded roller and transports it to a predetermined position, and is supported at a predetermined interval by a rotating shaft disposed at a predetermined interval. Moreover, the transport roller 12 is not driven by the drive mechanism 13 and is merely driven. The drive mechanism 13 rotates the rotary shaft by driving the rotation of the drive motor via the drive belt. The pre-positioning mechanism 14 is a device that pushes the end surface of the substrate w and pre-clamps the substrate w. The pre-positioning mechanism 14 has a push pin moving portion 丨4b that pushes an end surface of the substrate W on the abutting plate 14a on which the substrate w is placed, and a jet that ejects (attracts) air from the air hole 14c formed in the abutting plate 14a. Agency 14d. Then, the air hole 14c formed in the contact plate 14a ejects air toward the substrate loading direction of the substrate W to be placed (see Fig. 7C) to form a tilt. As shown in FIGS. 3 and 4, the push pin moving portion i 4b is disposed at a position facing the substrate 2036-7854-PF; in the direction of the Chentf 16 1356974, at an end face matching position of the substrate w and a substrate input corresponding to the soil plate w The position of the left and right directions is in three positions. The push pin moving portion 14b includes a push pin 14b1 that pushes the end surface of the substrate w, a body portion 14b2 that is provided on the push pin 4b2, and a leg portion 14b3 (for the drive belt) and 14b4 (for the guide rod) that are provided in the body portion Hb2. A guide portion 14b5 (drive belt), i4b6 (guide rod) connected to the leg portions 4b3 to 14b4, and a drive portion 14b8 that drives the guide portions 14b5, 14b5 from one drive unit via a drive portion ub7. Further, the push pin moving portion 14b is disposed at the reference position, and the movement of the push pin 14Μ can be disposed at a predetermined position of the predetermined position of the substrate w while moving, and the substrate temperature and humidity detecting device 16 is mounted. Further, as shown in Fig. 4, the transport roller 12, the push pin moving portion (10), the jet mechanism Ud, the elevating mechanism 15 and the like are controlled by the calibration control unit A1. As shown in Fig. 5, the refrigerant supply line 63 of the temperature adjusting device 61A, which will be described later, directly or indirectly abuts against the inside or the inside of the abutment plate "a" at the position where the predetermined position is performed, and is lifted by the elevating mechanism 15 The abutting plate 14a has a through hole 14a1 formed at a position corresponding to the conveying roller, and a long hole 14a2 formed in a position for pushing the pin to move the pin (4) (4), and the above-mentioned The air hole "c" and the piping 63 to be described later. The abutting plate 14a is subjected to surface contact with the mounting substrate (4), and the refrigerant conveyed from the temperature adjusting device 61A adjusts the temperature of the substrate while receiving and placing the roller. The substrate of the sub- 12 is used when performing a predetermined position, and is used when the substrate is transferred to the processor 2. Further, 2036-7854-PF; Ghentf 17 1356974, and the reticle temperature and humidity detecting device 24a is set to The illumination light is not directly affected by the 24 and the mask temperature detecting device. The temperature and the temperature detected by the mask temperature and humidity detecting device 24 and the temperature detected by the mask temperature detecting device 24a are transmitted. = Control section 80 described later (refer! ^ As shown in FIG. FIG. 2 'wetted Please supply unit 25 within the conditioned air to the wet Lu adjusted via the blower π 26 within the exposure portion and having a through 2q ^
(未圖示）。X，送風口 26係配置於設在燒框22上的=源 部23的侧邊。而且，排出曝光部2〇内空氣的排氣口 π係 設於設置曝光台21等的地面側，經由過遽器(未圖示)及排 氣風扇74將曝光部20内的空氣排出。 如第2圖所示’反轉部3〇為保持接受自處理器2的基 板W，並反轉基板W的表裡的處理機構。若為反轉基板# 的表裡’其構造並無特別的限定。 又，搬出部50係將曝光處理完畢的基板w搬出裝置 外，其構造並無特別的限定。 如第1圖及第2圖所示，溫度濕度調整部6〇為調整預 校準部10及曝光部20、40的溫度及濕度，其包括溫度調 整裝置61A的冷媒溫度調整部61、濕度調整裝置65a的濕 潤室65、檢測濕潤室65内的濕度及溫度的濕潤室濕度溫 度檢測裴置66、根據該濕潤室濕度溫度檢測裝置66所檢 測出的濕度及溫度、而調整濕潤室65内的溫度及濕度的濕 潤室調節部67、以及將包含該濕潤室調節部67所調節的 濕度的濕度調節空氣輸入預校準部i 〇及曝光部2〇、4〇的 2036-7854-PF;Chent f 21 /4 d 出的值係輸出至後述的控制部。 中，：潤室：節部67使水分蒸發而放出水蒸汽至空氣 渴們Ϊ時調即濕潤室65内的溫度。濕潤室調節部67根據 溫度濕度檢測裝置66所檢測出的溫度與濕度，由後 逑的控制部80 > $ 』f 80控制而產生包含既定濕度的既定溫度的空 ;濕度調即空氣），其構造並無特別的限定。 氣輪裝置68將濕潤室調節部67所產生的濕度調節空 扇。’卜預校準部！〇及曝光部2〇、4〇，於此使用送風風 %二第2圖及第6圖所示’濕潤室65的濕度調節空氣以 “流，70輸送至預校準部10或曝光部20、40。 循環流路70包括設於濕潤室65 及濕潤室65與曝光部2〇、 預1〇之間以 設於預校準部間的送風流路7°A、以及 潤室65之門L i 間以及曝光部2°，與濕 至bb之間的回收流路70B。 澄；4^路Μ ^供渥潤室65的送風裝置68輸送的 的送風開°部71、面向該送風開口… 將輸相Μ㈣以分送至各流路的 = 歧部”所分出的送風路73、將 二2、由該分 纲铲咖々 合这風路73所輪送的溼声 » ρ二軋供給至預校準部10的供給部17 又 2〇、40的供給部25 供，.‘口至曝光部 將供給部17供给的以調p 校準部〗。的基“的送風口 18 二' 4°心5送風至曝光部2㈣的光罩薄膜Μ送展口 ^ 46。而且，在分歧部72或 1 w 25、45，設有調 23 2036-7854-PF;Chentf 1356974 送風流量為適當。然 1供給至預校準部 量被設定成可事先知 量調整機構’使送出至各送風路73的 後’當送風裝置68的送風量改變時 或曝光部20、40的漫度調節空氣的流 道。 在以上所述的構造的曝光裝置1中，以相同的製品單 位使精度一致’即使生產群組的單位不同，為了在相。同。的 精度下進行曝光處理，對應於開始做曝光處理的基板" 光罩薄膜Μ Μ準溫度與基準座度而㈣溫度及座度。而 且’若考慮曝光處理的速度，對應於開始做曝光處理的基 板W或光罩薄膜μ的基準溫度與基準渔度而調整溫度及漫 度是適宜的。 接著，針對使用曝光裝置丨的曝光方法做說明。而且， 於此基板W與光罩薄膜μ的基準溫度與基準溼度是以相同 值做說明。 首先，如第1圖所示，在曝光裝置！中，將曝光處理 的基板w的基準溫度與基準溼度及對應於該基板w的光罩 薄膜Μ的基準溫度與基準溼度經由輸入裝置以輸入於控制 部80的記憶裝置83中。 如第3圖與第7a圖所示，曝光裝置j當基板w被投入 預校準部10時，搬入滾子U藉由感測器而作動，將基板 W由輸送滾子12送入，藉由接受基板w的輸送滾子12將 基板W搬運至基準位置。 如第7b圖所示，曝光裝置i當基板界被搬運至基準位 置時，經由升降機構15使抵接板14a的板表面上升，使其 27 2〇36-7854-PF;Chentf 1356974 成為比輸送滾子12的上端位置還上方的位置，基板w從輸 送滚子12由抵接板14a接受。 如第7c圖所不，曝光裝置i使喷氣機構14d、推動銷 移動。卩14b作動，藉由推動基板w的端面而進行預定位的 作業。而且，到預定位作業為止的一連串動作，如第4圖 所示’經由校準控制部A1進行。 當進行該預定位作業時，藉由設置於推動銷移動部14b 鲁 的基板溫度溼度檢測裝置16檢測出對應於基板w的表面側 的溫度及溼度，而輸送至控制部8〇的溫度溼度取得裝置 81° 另一方面’當進行預定位作業時’在曝光部2〇、4〇, 由光罩溫度溼度檢測裝置24及光罩溫度檢測裝置24a檢測 出對應於光罩薄膜Μ的表面側的溫度與溼度，並送至控制 部8 0的溫度溼度取得裝置§ 1。 即，如第8圖所示，檢測出對應於預校準部1〇的基板 _ w的表面側的溫度及溼度以及對應於曝光部2〇、4〇的光罩 溥膜Μ的表面侧的溫度及溼度（步驟S1)而送至控制部8〇。 接著，檢測出的溫度及溼度經由溫度溼度取得裝置8 i 輸送至溫度溼度控制裝置82時，溫度溼度控制裝置82將 預先s己憶於纪憶裝置8 3的基板w的基準溫度及基準溼度以 及光罩薄膜Μ的基準溫度及基準溼度與檢測出的基板的檢 測溫度與檢測溼度連同檢測出的光罩薄膜Μ的檢測溫度與 檢測溼度做差分運算。於此，溫度溼度控制裝置82從基板 W及光罩薄膜Μ的檢測溫度減除基準溫度而求得差值，而 2036-7854-PF;Chentf 28 1356974 將調整溫度後的溼度調整空氣做送風β 在曝光裝置1中，如此藉由調整預校準部1〇及曝光部 20、40的溫度及溼度（步驟S3) ’調整基板w與光罩薄膜μ 的伸縮而整合條件的情況下，對處理器等輸出訊號（步驟 S4)，開始後續的動作，將基板w搬運至曝光部2〇，之後 進行曝光處理（整合作業及曝光作業）而在基板#的一面上 形成光罩薄膜Μ的圖案。而且，曝光部2〇、4〇的曝光台 21 41即使在無基板w的狀態下，由冷媒溫度調節部6五 而調整冷媒的溫度、流速及流量，而調整於基準的溫度。 然後，曝光裝置1在溫度及溼度調整完畢之後，基板 w的一面的曝光處理完畢時，由處理器2將基板w搬運至 反轉邛30，又，在預校準部1〇將預定位後的下一個基板坪 搬運至曝光部20的曝光台21，而進行曝光處理，連續地 對基板W做曝光處理。而且，搬運至反轉部3G的基板$表 裡做反轉，藉由處理器3搬運至第二曝光部（曝光部）4〇, 另一面與該面做同樣的曝光，藉由處理器3從第二曝光部 40搬運至搬出部50，而從曝光裝置i搬出。又，在預校準 部10待機的基板W在其待機時，進行溫度與溼度的調整。 而且，曝光裝置1進行曝光作業，而從光源部2 3照射 包含既定波長之紫外線的光時，曝光部2〇、4〇内的溫度及 溼度的條件與先前所調整的條件不同◦此時，由於藉由光 罩溫度溼度檢測裝置24，44及光罩溫度檢測裝置24a、44a 所檢測出的溫度及溼度會變化，經由控制部8〇的溫度溼度 控制裝置82,控制溼潤室調節部67及送風裝置68而對應 2036-7854-PF;Chentf 30 1356974 * 於變化的狀況進行控制而調整溫度及溼度。 又’進灯曝光作業的"批基板w的作業t，停止操作’ 打開形成於該曝光裝置1的側面等的側面窗（未圖示），對 内部的狀態進行檢查。如此，在預校準部1〇内及曝光部 2〇、40内的溫度及澄度的環境變化的狀態下，藉由從溫度 溼度取付裝置81取得的溫度及溼度，溫度溼度控制裝置 82控㈣潤請節部67、送風裝置68及冷媒溫度調節部 61，經常使溫度及溼度接近基準溫度及基準溼度。 •目此，萬一調整完畢的溫度及溼度由於曝光作業或打 開側面窗而改變其值，曝光裝置！藉由直接控制控制部8〇 而維持於適當的溫度及溼度。而且，設置於曝光部2〇、4〇 之間的反轉部30，藉由調整曝光部2〇、4〇内的溫度及溼 度，由於調整過溫度及溼度的空氣於基板w的搬運通路傳 遞而流通，反轉部30内的溫度及溼度大，與曝光部2〇、 40等相比而無變化。 • 又’在曝光裝置1卜構成光罩薄膜Μ或基板W的材 質的關係上，在短時間内，與光罩薄膜Μ的伸縮調整做比 較’而進行基板W的伸縮調整。因此，曝光裝置丨如果調 整成光罩薄膜Μ及基板W的基準溫度及基準渔度，基板w 的伸縮狀態由供給的溫度及溼度持續調整時，為了對應於 基板W’使光罩薄膜μ的伸縮長度藉由溼度調整空氣的供 給而調整而進行曝光處理。 如此，對應於基板W，在調整光罩薄骐Μ的伸縮狀態 時’當投入製造單位最先的基板w時，針對該基板w及光 2036-7854-PF；Chentf 31 1356974 第5圖表示曝光裝置的預校準部及曝光部中與基板做 面接觸而由冷媒進行溫度調整的溫度調整裝置，並同時表 杀基板溫度濕度檢測裝置及光罩溫度濕度檢測裝置。 第6圖為本發明之曝光裝置的循環流路的示意圖。 第7a〜7d圖表示本發明之曝光裝置中，預校準部的動 作的側視圖。 第8圖為本發明之溫度及溼度的調整作業的流程圖。 【主要元件符號說明】 1〜曝光裝置； 2、 3〜處理器； 10〜預校準部； 11〜搬入滾子； 12〜滾子； 13- /驅動機構； 14〜定位機構； 14a 〜抵接板； 14b〜推動銷移動部； 14c 〜空氣孔； 14d〜喷氣裝置； 15- /升降機構； 15a〜升降驅動部； 15b 〜中介板； 15c〜連接銷； 16a 〜基板溫度檢測裝置； 17〜供給部； 18- '送風口； 19〜排氣口； 20〜 '曝光部； 21、41〜曝光台； 21D 〜CCD攝影機； 21a、41a〜抵接板； 21c 〜整合機構； 21d〜升降移動部； 22〜燒框； 22a〜框體； 22b 〜透光板； 2 3〜光源部； 25、 4 5〜供給部； 2036-7854-PF;Chentf 33 1356974(not shown). X, the air supply port 26 is disposed on the side of the = source portion 23 provided on the burning frame 22. Further, the exhaust port π for discharging the air in the exposure unit 2 is provided on the ground side where the exposure stage 21 or the like is provided, and the air in the exposure unit 20 is discharged through the damper (not shown) and the exhaust fan 74. As shown in Fig. 2, the 'reverse portion 3' is a processing mechanism that holds the substrate W received from the processor 2 and inverts the front and back of the substrate W. The structure of the surface of the substrate # is not particularly limited. Further, the unloading unit 50 carries out the substrate w on which the exposure process has been completed, and the structure thereof is not particularly limited. As shown in FIGS. 1 and 2, the temperature and humidity adjustment unit 6A adjusts the temperature and humidity of the pre-calibration unit 10 and the exposure units 20 and 40, and includes a refrigerant temperature adjustment unit 61 and a humidity adjustment unit of the temperature adjustment device 61A. The humid chamber 65 of 65a, the humid chamber humidity detecting means 66 for detecting the humidity and temperature in the humid chamber 65, and the temperature in the humid chamber 65 are adjusted based on the humidity and temperature detected by the humid chamber humidity detecting means 66. And a humidity chamber adjusting portion 67 and a humidity adjusting air including the humidity adjusted by the humid chamber adjusting portion 67 are input to the pre-calibration portion i 〇 and the exposure portion 2 〇, 4 〇 2036-7854-PF; Chent f 21 The value output in /4 d is output to the control unit described later. Medium: Run room: Section 67 causes water to evaporate and releases water vapor to the air. When it is thirsty, it is the temperature inside the humid chamber 65. The humid chamber adjusting unit 67 controls the temperature and humidity detected by the temperature and humidity detecting device 66 to be controlled by the control unit 80 > 80 80 of the rear cymbal to generate a predetermined temperature including a predetermined humidity; The structure is not particularly limited. The air wheel unit 68 adjusts the humidity generated by the humid chamber adjusting unit 67 to the air. 'Pre-calibration! 〇 and the exposure unit 2〇, 4〇, and the humidity-adjusted air of the humid chamber 65 shown in FIG. 2 and FIG. 6 is sent to the pre-calibration unit 10 or the exposure unit 20 by the flow 70. 40. The circulation flow path 70 includes a supply flow path 7°A provided between the wet chamber 65 and the wet chamber 65 and the exposure unit 2〇, the pre-alignment portion, and the door L i of the operation chamber 65 Between the exposure portion and the exposure portion 2°, and the recovery flow path 70B between the wet and the bb. 澄; 4^路Μ The air supply opening portion 71 for the air blowing device 68 of the sluice chamber 65 faces the air supply opening... The input phase (4) is supplied to the air supply path 73 which is distributed to the "dissection" of each flow path, and the second and second, and the wet sound is supplied by the wind path 73. The supply unit 17 to the pre-calibration unit 10 further supplies the supply unit 25 of the second and the 40, and the supply unit 17 supplies the supply unit 17 with the adjustment unit. The base of the "air supply port 18 two '4 ° heart 5 air supply to the exposure portion 2 (four) of the mask film to send the booth ^ 46. Moreover, in the branching portion 72 or 1 w 25, 45, set 23 2336-7854- PF; Chentf 1356974 The air supply flow rate is appropriate. However, the amount of supply to the pre-calibration unit is set to a predetermined amount of adjustment mechanism 'to send to the rear of each air supply path 73' when the air supply amount of the air blowing device 68 is changed or the exposure unit 20 In the exposure apparatus 1 of the above-described structure, the precision is the same in the same product unit. Even if the units of the production group are different, the precision is performed in the same phase. The exposure processing corresponds to the substrate "exposure film Μ Μ 温度 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 It is preferable to adjust the temperature and the degree of dilution by the reference temperature of the mask film μ and the reference degree of fish. Next, an exposure method using the exposure apparatus 丨 will be described. Further, the reference temperature and reference of the substrate W and the mask film μ are used. Humidity is First, as shown in Fig. 1, in the exposure apparatus!, the reference temperature of the substrate w to be exposed and the reference humidity and the reference temperature and reference humidity of the mask film 对应 corresponding to the substrate w The input device is input to the memory device 83 of the control unit 80. As shown in Figs. 3 and 7a, when the substrate w is loaded into the pre-alignment unit 10, the exposure device j carries the roller U by the sensor. The substrate W is fed by the transport roller 12, and the substrate W is transported to the reference position by the transport roller 12 that receives the substrate w. As shown in Fig. 7b, the exposure device i is transported to the reference position when the substrate boundary is transported. The plate surface of the abutting plate 14a is raised by the elevating mechanism 15 so as to be 27 2 〇 36-7854-PF; the Chentf 1356974 is positioned above the upper end position of the conveying roller 12, and the substrate w is transported from the conveying roller 12 The contact plate 14a is received. As shown in Fig. 7c, the exposure device i moves the air injection mechanism 14d and the push pin. The 卩14b is actuated to advance the end surface of the substrate w to perform a predetermined position. a series of actions, as shown in Figure 4. 'Through the calibration control unit A1. When the predetermined position is performed, the substrate temperature and humidity detecting means 16 provided on the push pin moving portion 14b detects the temperature and humidity corresponding to the surface side of the substrate w, and is transported to The temperature and humidity acquiring device 81 of the control unit 8 is on the other hand 'when the predetermined position is performed', in the exposure units 2, 4, the mask temperature and humidity detecting device 24 and the mask temperature detecting device 24a are detected to correspond to The temperature and humidity on the surface side of the mask film are sent to the temperature and humidity obtaining device § 1 of the control unit 80. That is, as shown in Fig. 8, the substrate_w corresponding to the pre-calibration unit 1 is detected. The temperature and humidity on the surface side and the temperature and humidity on the surface side of the mask enamel 对应 corresponding to the exposure portions 2〇, 4〇 are sent to the control unit 8A. Next, when the detected temperature and humidity are sent to the temperature and humidity control device 82 via the temperature and humidity acquiring device 8 i , the temperature and humidity control device 82 pre-remembers the reference temperature and the reference humidity of the substrate w of the memory device 8 3 and The reference temperature and the reference humidity of the mask film are compared with the detected temperature of the detected substrate and the detected humidity together with the detected temperature of the detected mask film 与 and the detected humidity. Here, the temperature and humidity control device 82 obtains the difference by subtracting the reference temperature from the detected temperatures of the substrate W and the mask film ,, and 2036-7854-PF; and the Chent 28 1356974 adjusts the humidity-adjusted air after the temperature as the air supply β. In the exposure apparatus 1, the temperature and humidity of the pre-calibration unit 1 and the exposure units 20 and 40 are adjusted (step S3) to adjust the expansion and contraction conditions of the substrate w and the mask film μ, and the processor is integrated. After the output signal (step S4), the subsequent operation is started, and the substrate w is transported to the exposure unit 2, and then the exposure processing (integration operation and exposure operation) is performed to form a pattern of the mask film on one side of the substrate #. Further, in the exposure stage 21, 41 of the exposure units 2, 4, the temperature, the flow rate, and the flow rate of the refrigerant are adjusted by the refrigerant temperature adjusting unit 6 in a state where the substrate w is not provided, and the temperature is adjusted to the reference temperature. Then, after the temperature and humidity adjustment is completed, when the exposure processing of one surface of the substrate w is completed, the processor 2 transports the substrate w to the reverse 邛 30, and after the pre-calibration unit 1 预定 is pre-positioned The next substrate is transported to the exposure stage 21 of the exposure unit 20, and exposure processing is performed to continuously expose the substrate W. Then, the substrate $ conveyed to the inversion portion 3G is reversed, and is transported by the processor 3 to the second exposure portion (exposure portion) 4, and the other surface is exposed to the same surface by the processor 3 The second exposure unit 40 is transported to the carry-out unit 50 and carried out from the exposure device i. Further, the substrate W that is in standby by the pre-calibration unit 10 adjusts the temperature and humidity while it is in standby. Further, when the exposure apparatus 1 performs an exposure operation and the light source unit 23 emits light including ultraviolet light of a predetermined wavelength, the conditions of the temperature and humidity in the exposure units 2A and 4〇 are different from the previously adjusted conditions. The temperature and humidity detected by the mask temperature and humidity detecting devices 24 and 44 and the mask temperature detecting devices 24a and 44a are changed, and the humidifying chamber adjusting unit 67 is controlled via the temperature and humidity control device 82 of the control unit 8A. The air blowing device 68 corresponds to 2036-7854-PF; the Chentf 30 1356974 * is controlled under varying conditions to adjust the temperature and humidity. In addition, the operation t of the batch substrate w is stopped, and the side window (not shown) formed on the side surface of the exposure apparatus 1 is opened, and the internal state is inspected. In this manner, the temperature and humidity obtained from the temperature and humidity receiving device 81 are controlled by the temperature and humidity control device 82 in the state in which the temperature and the degree of the temperature in the pre-calibration unit 1 and the exposure units 2A and 40 are changed (4). The cooling unit 67, the air blowing device 68, and the refrigerant temperature adjusting unit 61 constantly bring the temperature and humidity close to the reference temperature and the reference humidity. • In this case, if the adjusted temperature and humidity change their values due to exposure work or opening the side window, the exposure unit! The temperature and humidity are maintained at an appropriate level by directly controlling the control unit 8〇. Further, the inversion portion 30 provided between the exposure portions 2A and 4B adjusts the temperature and humidity in the exposure portions 2A and 4B, and the air whose temperature and humidity have been adjusted is transmitted through the conveyance path of the substrate w. On the other hand, the temperature and humidity in the reversing unit 30 are large, and there is no change in comparison with the exposure units 2A, 40, and the like. Further, in the relationship between the material of the photomask film or the substrate W in the exposure apparatus 1, the telescopic adjustment of the substrate W is performed in a short period of time in comparison with the expansion and contraction adjustment of the mask film ’. Therefore, when the exposure apparatus adjusts the reference temperature and the reference fishing degree of the mask film Μ and the substrate W, and the expansion and contraction state of the substrate w is continuously adjusted by the supplied temperature and humidity, the mask film μ is made corresponding to the substrate W'. The expansion and contraction length is adjusted by the supply of the humidity adjustment air to perform exposure processing. In this way, corresponding to the substrate W, when the telescopic state of the reticle is adjusted, 'when the first substrate w of the manufacturing unit is put in, the substrate w and the light 2036-7854-PF are used; and the fifth figure of the Centt 31 1356974 shows the exposure. In the pre-calibration unit and the exposure unit of the device, a temperature adjustment device that is in surface contact with the substrate and temperature-controlled by the refrigerant, and simultaneously kills the substrate temperature and humidity detecting device and the mask temperature and humidity detecting device. Fig. 6 is a schematic view showing a circulation flow path of the exposure apparatus of the present invention. Figs. 7a to 7d are side views showing the operation of the pre-alignment unit in the exposure apparatus of the present invention. Figure 8 is a flow chart showing the adjustment operation of the temperature and humidity of the present invention. [Main component symbol description] 1~exposure device; 2, 3~ processor; 10~pre-calibration section; 11~loading roller; 12~roller; 13- / drive mechanism; 14~positioning mechanism; 14a~ abutting 14b ~ push pin moving part; 14c ~ air hole; 14d ~ jet device; 15- / lifting mechanism; 15a ~ lifting drive; 15b ~ interposer; 15c ~ connecting pin; 16a ~ substrate temperature detecting device; Supply section; 18-'air supply port; 19~exhaust port; 20~'exposure section; 21,41~exposure stage; 21D~CCD camera; 21a, 41a~ abutment plate; 21c~integration mechanism; 21d~lifting movement 22; burnt frame; 22a~ frame; 22b ~ light transmissive plate; 2 3 ~ light source part; 25, 4 5 ~ supply part; 2036-7854-PF; Chentf 33 1356974
26、46〜送風口； 3 〇〜反轉部； 41a〜抵接板； 〜溫度濕度調整部； 61A〜溫度調整裝置； 62a〜冷媒流量調整閥； 6 5〜濕潤室； 67〜濕潤室調節部； 7 〇〜循環流路； 7 0 B〜回收流路； 7 2〜分歧部； 7 5〜循環路； 76〜循環回收部； 83〜記憶裝置； 84〜輸入裝置； 85〜顯示裝置； Μ〜光罩薄膜； 16〜基板溫度濕度檢測裝 27 、47〜排氣口； 40 〜第二曝光部； 50- 〜搬出部； 61- 〜冷媒溫度調節部； 62' 〜配管； 63 、6 4〜配管路； 65A〜濕度調整裝置； 68- 〜送風裝置（送風風扇 70A〜送風流路； 7L· 〜送風開口部； 73' 〜送風路； 74' 〜排氣裝置（排氣風扇 8 0〜控制部； 8L· 〜溫度濕度取得裝置 82' 〜溫度濕度控制裝置 A1- 〜校準控制部； W〜 基板； 置； 21b、41b〜基板溫度檢測裝置； 24a、44a〜光罩溫度檢測跋置； 66〜濕潤室溫度濕度檢測裝置； 24、44〜光罩溫度濕度檢測裝置 34 2036-7854-PF;Chentf26, 46~ air supply port; 3 〇~reverse part; 41a~ abutment plate; ~ temperature and humidity adjustment part; 61A~ temperature adjustment device; 62a~ refrigerant flow adjustment valve; 6 5~ humid chamber; 67~ humid chamber adjustment Department; 7 〇 ~ circulation flow path; 7 0 B ~ recovery flow path; 7 2 ~ branching section; 7 5 ~ loop road; 76 ~ loop recycling section; 83 ~ memory device; 84 ~ input device; 85 ~ display device; Μ ~ photomask film; 16 ~ substrate temperature and humidity detection device 27, 47 ~ exhaust port; 40 ~ second exposure portion; 50 - ~ carry-out portion; 61 - ~ refrigerant temperature adjustment portion; 62' ~ pipe; 63, 6 4~ distribution line; 65A~ humidity adjustment device; 68-~ air supply device (air supply fan 70A~ air supply flow path; 7L·~ air supply opening part; 73'~ air supply path; 74' ~ exhaust unit (exhaust fan 8 0 ~Control unit; 8L·~temperature and humidity acquisition device 82'~temperature and humidity control device A1-~calibration control unit; W~substrate; set; 21b, 41b~substrate temperature detection device; 24a, 44a~mask temperature detection device ; 66~ wet room temperature and humidity detection device ; 24, 44 ~ mask temperature and humidity detection device 34 2036-7854-PF; Chentf