TWI354531B - - Google Patents

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Publication number
TWI354531B
TWI354531B TW97125176A TW97125176A TWI354531B TW I354531 B TWI354531 B TW I354531B TW 97125176 A TW97125176 A TW 97125176A TW 97125176 A TW97125176 A TW 97125176A TW I354531 B TWI354531 B TW I354531B
Authority
TW
Taiwan
Prior art keywords
ceramic substrate
ceramic
recess
solder
solderable metal
Prior art date
Application number
TW97125176A
Other languages
English (en)
Chinese (zh)
Other versions
TW201004546A (en
Inventor
ting wei Lin
Yung Ping Wu
Jen Chien Yao
Original Assignee
Darfon Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Darfon Electronics Corp filed Critical Darfon Electronics Corp
Priority to TW97125176A priority Critical patent/TW201004546A/zh
Publication of TW201004546A publication Critical patent/TW201004546A/zh
Application granted granted Critical
Publication of TWI354531B publication Critical patent/TWI354531B/zh

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
TW97125176A 2008-07-04 2008-07-04 Ceramic substrate structure and method thereof with heat dissipation function TW201004546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97125176A TW201004546A (en) 2008-07-04 2008-07-04 Ceramic substrate structure and method thereof with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97125176A TW201004546A (en) 2008-07-04 2008-07-04 Ceramic substrate structure and method thereof with heat dissipation function

Publications (2)

Publication Number Publication Date
TW201004546A TW201004546A (en) 2010-01-16
TWI354531B true TWI354531B (ja) 2011-12-11

Family

ID=44825910

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97125176A TW201004546A (en) 2008-07-04 2008-07-04 Ceramic substrate structure and method thereof with heat dissipation function

Country Status (1)

Country Link
TW (1) TW201004546A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398596B (zh) * 2010-11-08 2013-06-11 Jia-Shing Wong LED lamp module of the process

Also Published As

Publication number Publication date
TW201004546A (en) 2010-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees