TWI346048B - - Google Patents
Info
- Publication number
- TWI346048B TWI346048B TW096108550A TW96108550A TWI346048B TW I346048 B TWI346048 B TW I346048B TW 096108550 A TW096108550 A TW 096108550A TW 96108550 A TW96108550 A TW 96108550A TW I346048 B TWI346048 B TW I346048B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0342—Observing magnetic fields related to the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0344—Observing the speed of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
- B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/41—Marking using electromagnetic radiation
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0602209A FR2898528B1 (en) | 2006-03-14 | 2006-03-14 | HIGH CADENCE LASER MARKING MACHINE |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200800631A TW200800631A (en) | 2008-01-01 |
TWI346048B true TWI346048B (en) | 2011-08-01 |
Family
ID=37428601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096108550A TW200800631A (en) | 2006-03-14 | 2007-03-13 | Machine de marquage laser a haute cadence |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1996366A2 (en) |
FR (1) | FR2898528B1 (en) |
TW (1) | TW200800631A (en) |
WO (1) | WO2007104854A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607814B (en) * | 2015-10-28 | 2017-12-11 | 新代科技股份有限公司 | Flying Laser Marking System with Real-time 3D Modeling and Method Thereof |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103260895B (en) * | 2010-07-23 | 2015-11-25 | 咨询卡有限公司 | Be applicable to the method and apparatus of personalized a series of portable object |
US8786650B1 (en) | 2012-03-07 | 2014-07-22 | Express Scripts, Inc. | Systems and methods for pharmacy messaging |
CN103121326B (en) * | 2013-01-21 | 2014-12-10 | 深圳市大族激光科技股份有限公司 | Motion marking device and method for positioning articles by using industrial camera |
CN105447531A (en) * | 2014-09-09 | 2016-03-30 | 北京爱创科技股份有限公司 | Laser identifier positioning device, method and product |
CN106346139B (en) * | 2016-10-11 | 2018-08-31 | 深圳市通发激光设备有限公司 | A kind of unordered vision positioning marking system |
CN107570883A (en) * | 2017-10-17 | 2018-01-12 | 深圳华创兆业科技股份有限公司 | Laser Grinder |
CN108890142A (en) * | 2018-09-12 | 2018-11-27 | 苏州新火花机床有限公司 | A kind of network control laser mark printing device |
DE102019205872A1 (en) * | 2019-04-24 | 2020-10-29 | Mühlbauer Gmbh & Co. Kg | DEVICE AND METHOD FOR PERSONALIZING DOCUMENTS |
CN112828444A (en) * | 2019-11-22 | 2021-05-25 | 大族激光科技产业集团股份有限公司 | Online test tube laser marking device and method |
FR3103404B1 (en) * | 2019-11-26 | 2024-02-23 | Antonio Alves | Device for processing several object faces, and corresponding processing method |
EP4279292A1 (en) * | 2022-05-19 | 2023-11-22 | MB Automation GmbH & Co. KG | Document processing apparatus |
DE102022128658A1 (en) | 2022-10-28 | 2024-05-08 | Sommer Gmbh | Laser-markable film, laser marking process and labels made therewith |
CN116944691B (en) * | 2023-09-20 | 2023-11-28 | 北京紫英轩文化传播有限公司 | Laser marking device for electronic product |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5937270A (en) * | 1996-01-24 | 1999-08-10 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
US6262388B1 (en) * | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
US6359253B1 (en) * | 2000-07-12 | 2002-03-19 | Advanced Micro Devices, Inc. | Unit-in-tray pocket checker |
FR2883503B1 (en) * | 2005-03-23 | 2020-11-06 | Datacard Corp | HIGH RATE LASER MARKING MACHINE |
-
2006
- 2006-03-14 FR FR0602209A patent/FR2898528B1/en not_active Expired - Fee Related
-
2007
- 2007-03-09 EP EP07731120A patent/EP1996366A2/en not_active Withdrawn
- 2007-03-09 WO PCT/FR2007/000423 patent/WO2007104854A2/en active Application Filing
- 2007-03-13 TW TW096108550A patent/TW200800631A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607814B (en) * | 2015-10-28 | 2017-12-11 | 新代科技股份有限公司 | Flying Laser Marking System with Real-time 3D Modeling and Method Thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2007104854A2 (en) | 2007-09-20 |
TW200800631A (en) | 2008-01-01 |
FR2898528A1 (en) | 2007-09-21 |
FR2898528B1 (en) | 2008-05-30 |
EP1996366A2 (en) | 2008-12-03 |
WO2007104854A3 (en) | 2007-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |