TWI345063B

TWI345063B -

Info

Publication number: TWI345063B
Application number: TW096132855A
Authority: TW
Inventors: Sagawa Makoto
Original assignee: Advantest Corp
Priority date: 2006-10-04
Filing date: 2007-09-04
Publication date: 2011-07-11
Also published as: JPWO2008041334A1; KR20100017827A; WO2008041334A1; KR100942527B1; CN101258415A; TW200821599A; CN101258415B; KR20080057206A

Description

1345063 * 九、發明說明：【發明所屬之技術領域】本發明係有關於令半導體積體電路元件等之各種電子 70件（以下亦代表性地稱為IC組件）以電氣式接觸測試頭之接觸部’並測試IC組件的電子元件測試裝置，尤其有關於可處理尺寸極小之IC組件的電子元件測試裝置。【先前技術】在1C組件等之電子元件的製程，為了測試在已封褒之狀態的1C組件之性能或功能而使用電子元件測試裝置。在構成電子7G件測試裝置之處理器（handler)，從用以收容測試前的1C組件或測試完了之Ic組件之托盤（以下稱為訂製托盤），將複數1C組件換裝於在電子元件測試裝置内循環的托盤（以下稱為測試用托盤），並將該測試用托盤搬至處理器内，在被收容於測試用托盤之狀態令IC組件以電氣式接觸測試頭之接觸部，並令電子元件測試裝置本體 (以下亦稱為測試器）進行測試。然後，完成測試時，從測試頭搬出已裝載各1C組件的測試用托盤，並換裝於因應於測試結果的訂製托盤，藉此分類成良品或不良品之種類。如此，在電子元件測試裝置，雖然在測試前後在訂製托盤和測試用托盤之間進行IC組件的移動，但是Ic組件之小型化進展至例如邊長為約5〜2Οππη時，發生如下的問題。首先，因為隨著1C組件之小型化而Ic組件本身變輕， 2247-9068-PF;Ahddub 5 收容件係用以收容測試前之被測試電子元件的測試用托盤；該測試用托盤包括：收容部，係可收容該被測試電子凡件；及夾緊機構，係固定/放開該收容部内的該被測試電子疋件；該零件搬運手段具有用以操作該夾緊機構之固定/ 放開：夾緊操作手段；在將該被測試電子元件收容於該第收奋件B夺，該保持頭將該被測試電子元件放開於該收容部二内，並藉由該夾緊操作手段之操作而該夾緊機構將該被式電子元件固定於該收容部後，該保持頭脫離該收容部。因而’在保持頭脫離收容部時’可防止應放開之尺寸極小的被測試電子元件和保持頭一起上昇。為了達成該目的，若依據本發明’提供一種電子元件測試裝置’其係令被測試電子元件以電氣式接觸測試頭的接觸部’並測試該被測試電子元件的電子元件測試裝置，包括零件搬運手段，其將該被測試電子元件從位於第J位置=第1收容件移至位於第2位置㈣2收容件；該第i 收容件係已收容測試完了之該被測試電子元件的測試用托盤；該測試用托盤包括：收容部’係可收容該被測試電子元件；及夾緊機構’係固定/放開該收容部内的該被測試電子件’該零件搬運手段包括：複數該保持頭；及失緊操作手段，係用以操作該夾緊機構之固定/放開；在從該第工收容件保持該被測試電子元件時，全部之該保持頭各自接近該收容部，該複數保持頭之中的至少一個保持該被測試電子元件並脫離該收容部，藉由該夾緊操作手段之操作而該夾緊機構固定該收容部内所收容的該被測試電子元件 2247-9〇68-PF;Ahddub 14 ** 後剩下之該保持頭脫離該收容部。 ,因而，在複數保持頭之中的至少一個保持被測試電子件時，可防止被收容於其他的收容部之被測試電子元件因撞擊等而發生位置偏差。為了達成該目的，若依據本發明，提供一種電子元件、、方法，其係將零件搬運手段所保持之該被測試電子 =件收谷於測試用托盤，而該測試用托盤包括可收容該被 φ 測忒電子70件收容部、及固定/放開該收容部内之該被測試元件的夾緊機構，該收容方法包括：放開步驟，係將零件搬運手段所保持之該被測試電子元件放開於該收容部内，固定步騾，係該夾緊機構將該收容部内所收容之該被 ^試電子元件固定；以及脫離步驟，該零件搬運手段脫離該收容部。因而，在保持頭脫離收容部時，可防止應放開之尺寸極小的被測試電子元件和保持頭一起上昇。 •為了達成該目的，若依據本發明，提供一種電子元件 • 的保持方法，其係具有複數可保持該被測試電子元件之保持頭的零件搬運手段從測試用托盤保持該被測試電子元件，而該測試用托盤包括可收容該被測試電子元件的收容 P及固疋/放開該收容部内之該被測試電子元件的夾緊機構該保持方法包括：接近步驟，係該複數保持頭各自接近該收容部；保持步驟，係該複數保持頭之中的至少一個保持該被測試電子元件並脫離該收容部；該第1脫離步驟’固疋步驟’係該夾緊機構將該收容部内所收容的該被 2247-9〇68-PF;Ahddub 15 1345063 測試電子元件固定脫離該收容部。以及第 2脫離步驟，剩下之該保持頭至夕、個保持被測試電子收容部之被測試電子元件因而，在複數保持頭之中的元件時’可防止被收容於其他的因撞擊等而發生位置偏差。【實施方式】以下，根據圖面說明本發明之實施形態。第1圖係表示本發明之實施形態的電子元件測試裝置之不意剖面圖，第2圖係表示本發明之實施形態的電子元件測試裝置之立體圖，第3圖传 _糸表不在本發明之實施形離的電子元件測試裝置之托盤的處理之示意圖。 …、此外’第3圖係用以理解在本發明之實施形態的電子兀件測試裝置所使用之托盤的處理方法之圖，實際上亦有在平面圖上表示配置成朝向上下方向排列之構件的部分。因此，參照第2圖說明其機械式（三維）構造。本發明之實施形態的電子元件測試裝置係在# ic組件施加尚溫或低溫之溫度應力的狀態測試(檢查” c組件是否適當地動作，並根據該測試結果將κ組件分類的裝置，由處理器1、測試頭5以及測試器6構成。藉此電子元件測試裝置之Η：組件的測試，係從裝載複數成為測試對象之 ic組件的訂製托盤800(參照第5圖），將ic組件換裝於被搬至處理器1内之測試用托盤7 〇〇 (參照第丨5圖）並實施。此外’ 1C組件在圖中以符號Ic表示。 16 2247-9068-PF;Ahddub 1345063 在本實施形態的處理器1，如第丨圖〜第3圖所示，由以下之構件構成：儲存部200,係儲存今後要測試的1(:組件’又將測試完了之IC組件分類並儲存；裝載部300,係將從儲存部200所供給之IC組件送入室部1〇〇;室部1〇〇, 係包含有測試頭5;以及卸載部4〇〇，係將在室部1〇〇已進行測試之測試完了的1C組件分類並取出。設置於測試頭5的插^ 5ϋ、經由第】圖所示之電瘦了和測試器6連接，並將和插座5()以電氣式連接的1(：組件瘦 =電境7和測試器6連接’再根據來自該測試器6之測試 ^號測試IC組件。此外，如第1圖所示，將空間設置於處理盗i之下部的—部分’並在此空間可交換地配置測試頭 5’經由在處理器！之裝置基座所形成的貫穿孔，可使π 測試頭5上之插座5G以電氣式接觸。在更換π組件之種類時，更換成具有適合該種 , 腳數的插座之其他的測試頭。 ”且t形狀、接以下，說明處理器〗之各部。〈儲存部200> 第4圖係表示在本發明置所使用之If餘h <實施形態的電子元件測試裝用之1C儲存器的分解立體圖，第明之實施形態的電子元件 ,、丁解立體圖。式裝置所使用之訂製托盤的分判包括：測試前ic健存器加，係儲存 H：㈣；及測試完了 IC儲存應於測試結果所分類之ic組件。° 2 ’係儲存因 17 2247-9068-PF；Ahddub 1345063 這些儲存器201、2〇2,如第4圖所示，包括：框形之托盤支持框203;及昇降機204，從此托盤支持框2〇3之下邛進入並在上部昇降。在托盤支持才医2〇3，支隹疊複數訂製托盤800’並利用昇降機2〇4僅上下地移動此堆疊的訂製托盤800。此外，在本實施形態之訂製托盤_如第$圖所示，將收容ic組件之收容部801排成14列><13行。又，在本實施形態，如第5圖所示，缓衝件2〇6位於鲁#降機204和該昇降機2。4所支持的訂製托盤8〇〇之間。 -作為構成此緩衝件206的材料，例如可列舉由橡膠或合成樹脂材料等所構成之海綿等。藉由使緩衝件206位於訂製托盤8〇〇和昇降機2〇4之間，而可抑制在昇降機204上下動時產生之振動傳至訂製托盤800。1345063 * IX. OBJECTS OF THE INVENTION: 1. Field of the Invention The present invention relates to electrically contacting a test head with 70 pieces of various electronic components (hereinafter also referred to as IC components) of semiconductor integrated circuit components and the like. Department's electronic component testing device for testing IC components, especially for electronic component testing devices that can handle extremely small IC components. [Prior Art] In the manufacturing process of an electronic component such as a 1C component, an electronic component testing device is used in order to test the performance or function of the 1C component in the sealed state. The processor constituting the electronic 7G test device is adapted from the 1C component before the test or the tested Ic component tray (hereinafter referred to as a custom pallet) to the plurality of 1C components to the electronic component. a tray that is circulated in the test device (hereinafter referred to as a test tray), and the test tray is moved into the processor, and the IC component is electrically contacted with the contact portion of the test head while being contained in the test tray, and The electronic component test device body (hereinafter also referred to as a tester) is tested. Then, when the test is completed, the test tray on which each 1C component has been loaded is carried out from the test head, and replaced with a custom tray corresponding to the test result, thereby classifying into a good or defective product. As described above, in the electronic component testing apparatus, although the movement of the IC component is performed between the custom tray and the test tray before and after the test, the miniaturization of the Ic component progresses to, for example, a side length of about 5 to 2 Οππη, and the following problem occurs. . First, because the Ic component itself becomes lighter as the 1C component is miniaturized, the 2247-9068-PF; Ahddub 5 housing is used to receive the test tray of the tested electronic component before the test; the test tray includes: And the clamping mechanism fixes/releases the tested electronic component in the receiving portion; the component handling means has a fixing/release for operating the clamping mechanism a clamping operation means for accommodating the electronic component to be tested in the first receiving member B, the holding head releasing the electronic component to be tested in the receiving portion 2, and by the clamping operation means After the clamping mechanism fixes the electronic component to the receiving portion, the holding head is separated from the receiving portion. Therefore, when the holding head is separated from the accommodating portion, it is possible to prevent the size of the electronic component to be tested and the holding head from rising together. In order to achieve the object, according to the present invention, an electronic component testing device is provided which electrically contacts the contact portion of the test head with the electronic component to be tested and tests the electronic component testing device of the tested electronic component, including part handling Means, the test electronic component is moved from the J position = the first receiving member to the second position (four) 2 receiving member; the i-th receiving member has received the tested test tray of the tested electronic component; The test tray includes: a receiving portion that can receive the electronic component to be tested; and a clamping mechanism that fixes/releases the tested electronic component in the receiving portion. The component handling means includes: a plurality of the holding heads; The unstrained operation means is for operating the fixing/release of the clamping mechanism; when the electronic component to be tested is held from the first receiving member, all of the holding heads are respectively close to the receiving portion, and the plurality of holding heads are At least one of the holding electronic component is removed from the receiving portion, and the clamping mechanism fixes the receiving portion by the operation of the clamping operation means The test is accommodated electronic component 2247-9〇68-PF; Ahddub 14 ** remaining after the holding head from the receiving portion. Therefore, when at least one of the plurality of holding heads holds the electronic component to be tested, it is possible to prevent the electronic component to be tested accommodated in the other housing portion from being displaced due to an impact or the like. In order to achieve the object, according to the present invention, there is provided an electronic component and method for collecting the tested electronic component held by the component handling means in a test tray, wherein the test tray includes a accommodating the quilt Φ 70 忒 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 The fixing unit is fixed in the accommodating portion, and the clamping mechanism fixes the electronic component to be tested in the accommodating portion; and the detaching step, the component conveying means is separated from the accommodating portion. Therefore, when the holding head is separated from the accommodating portion, it is possible to prevent the electronic component to be tested which is to be released from being pushed up and the holding head from rising together. In order to achieve the object, according to the present invention, there is provided a method of holding an electronic component, which has a plurality of component handling means for holding a holding head of the electronic component to be tested, and holding the electronic component to be tested from the test tray, The test tray includes a receiving P for receiving the electronic component to be tested and a clamping mechanism for fixing/opening the tested electronic component in the receiving portion. The holding method includes: an approaching step, wherein the plurality of holding heads are respectively close to the The accommodating portion is configured to hold at least one of the plurality of holding heads to hold the electronic component to be tested and to be detached from the accommodating portion; the first detaching step 'solidifying step' is performed by the clamping mechanism in the accommodating portion The test component is fixed off the housing by the 2247-9〇68-PF; Ahddub 15 1345063 test electronics. And the second detachment step, the remaining of the holding heads and the electronic components to be tested for holding the electronic accommodating portion to be tested, thereby preventing the inclusion of other components due to impact or the like while holding the components in the plurality of holding heads A positional deviation occurred. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. 1 is a cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention, and FIG. 3 is not in the practice of the present invention. Schematic diagram of the processing of the tray of the isolated electronic component testing device. In addition, FIG. 3 is a view for explaining a processing method of a tray used in the electronic component testing device according to the embodiment of the present invention, and actually includes a member arranged in a plan view to be arranged in the up and down direction. section. Therefore, the mechanical (three-dimensional) structure will be described with reference to Fig. 2 . The electronic component testing apparatus according to the embodiment of the present invention tests the state in which the temperature component of the temperature or the low temperature is applied to the #ic component (checks whether the c component is properly operated, and the device that classifies the κ component according to the test result is processed. The test unit 5, the test head 5, and the tester 6. The electronic component test device: the test of the component is a custom tray 800 (refer to Fig. 5) from which the ic component of the test object is loaded (refer to Fig. 5), the ic component It is replaced by a test tray 7 〇〇 (refer to Figure 5) that is moved into the processor 1. Further, the '1C component is indicated by the symbol Ic in the figure. 16 2247-9068-PF; Ahddub 1345063 The processor 1 of the embodiment, as shown in FIG. 3 to FIG. 3, is composed of the following components: the storage unit 200 stores the 1 to be tested in the future (the component 'is further classified and stored the tested IC components; The loading unit 300 feeds the IC unit supplied from the storage unit 200 into the chamber unit 1; the chamber unit 1 includes the test head 5; and the unloading unit 4〇〇, which is in the chamber unit 1分类Classified 1C components that have been tested and taken The plug that is set in the test head 5 is connected to the tester 6 via the electric power shown in the figure, and is electrically connected to the socket 5 () (: component thin = electric 7 and The tester 6 is connected to 'retest the IC component according to the test number from the tester 6. Further, as shown in Fig. 1, the space is set to the portion of the lower part of the processing thief i and is interchangeably arranged in this space The test head 5' can be electrically connected to the socket 5G on the π test head 5 via a through hole formed in the base of the processor device. When the type of the π component is replaced, it is replaced with a suitable one. The other test heads of the sockets are the same as those of the processor. "The storage unit 200" is shown in Fig. 4, which shows the use of the present invention. An exploded perspective view of a 1C memory for component testing, an electronic component of the first embodiment, and a stereoscopic view of the preferred embodiment. The sub-segment of the customized tray used in the device includes: pre-test ic-storage plus, storage H: (4); and after testing the IC storage should be in the test results Classified ic components. ° 2 'system storage factor 17 2247-9068-PF; Ahddub 1345063 These reservoirs 201, 2〇2, as shown in Fig. 4, include: a frame-shaped tray support frame 203; and a lift 204, From the tray support frame 2〇3, the 邛 enters and rises and falls in the upper part. In the tray support doctor 2〇3, the lap stacks the custom-made tray 800' and uses the lift 2〇4 to move the stacked custom tray only up and down In addition, in the custom pallet of the present embodiment, as shown in Fig. $, the accommodating portions 801 accommodating the ic unit are arranged in 14 rows >< 13 rows. Further, in the present embodiment, as shown in Fig. 5, the cushioning member 2〇6 is located between the Lu #降机204 and the custom pallet 8〇〇 supported by the elevator 2. - The material constituting the cushioning member 206 is, for example, a sponge made of rubber or a synthetic resin material or the like. By having the cushioning member 206 between the custom tray 8'' and the elevator 2'', it is possible to suppress the vibration generated when the lifter 204 moves up and down to the custom tray 800.

此外，在本實施形態之儲存器2〇1、2〇2相當於在申請專利範圍的儲存手段之-例，而在本實施形態之昇降機2〇4 相當於在申請專利範圍的昇降手段之一例，在本實施形賤之緩衝件206相當於在申請專利範圍的緩衝手段之一例。因為測試前1C儲存器2G1和測試完了 IC儲存器m之構造相同，所以可因應於需要適當地設定測試前K儲存器 201和測試完了 1C儲存器2〇2之各自的個數。在本實施形態，如第2圖及筮qn , 闽及弟d圖所不，將2個儲存器STK — B設置於測試前ic缺；〇ηι . ^ 』比儲存态201，在其旁邊設置2 個空托盤儲存器STK — E。各個命払船妙十。。… 合個空托盤儲存器STK—E堆疊被送入奸載部400之空的訂製托盤RST。 2247-9068-PF;Ahddub 18 1345063 在空托盤儲存器STK—E之旁邊，將8個儲存器STK — 1、STK— 2、…、Stk— 8設置於測試完了 1C儲存器2〇2，以因應於測試結果分類成最多8種並儲存的方式構成。即’除了良品、不良品之區別以外’即使在良品中亦可分類成動作速度係高速的、中速的、低速的，或者即使不良品之中亦可分類成需要再測試的等。〈裝載部30〇> 第6圖係表示在本發明之實施形態的電子元件測試裝置之裝載部所設置的組件搬運裝置之保持頭的侧視圖，第 7圖係表不在第6圖所示之保持頭的前端所設置之吸附喷嘴的立體圖，第8圖係表示在本發明之實施形態的電子元件測試裝置之裝載部所設置的組件搬運裝置之間距變換機構的立體圖。利用設置於儲存部200和裝置基座101之間的托盤移送濛205將上述之訂製托盤800從儲存部2〇〇搬至昇降工 ♦作台207(參照第1〇B圖）。此昇降工作台m分別設置於 .裝載部300之2處窗部370的下部，可在支持訂製托盤_ 之狀態沿著z軸方向移動。利用昇降工作台2〇7將訂製托盤800從裝置基座1〇1之下侧搬至窗部37〇。接著，在此裝載部組件搬運裝置31〇將被裝入訂製托盤_之 1C組件一度移至校正器(preciser)36〇，在此修幻。袓件彼此之位置關係。然後，組件搬運裝置310再將此校正器 360所保持之IC組件換裝於停在裝㈣__試用 700 〇 2247-9068-PF;Ahddub 19 ^45063 裝載部300包括組件搬運裝置310，其將ic組件從訂製托盤KST移至並換裝於測試用托盤TST。組件搬運裴置 310如第2圖所示，由以下之構件構成，2支軌道311，係架設於裝置基座101上；可動臂312，係可利用此2支軌道311在訂製托盤8〇〇和測試用托盤7〇〇之間往復移動（將此方向設為Y方向）；以及可動頭32〇，係利用該可動臂3ι2 支持’並可沿著可動臂312朝向X轴方向移動。如第6圖所示，在此組件搬運裝置31〇之可動頭32〇，安裝前端具有吸附喷嘴341的保持頭34〇。又，在吸附噴嘴341的旁邊，設置止動器344，其用以和設置於後述之校正器360的軸363或設置於測試用托盤7〇〇之突起部721 抵接。此保持頭340可利用線性導件322及氣壓缸321朝向Z軸方向（上下方向）移動。又在測忒用托盤700之***件71 〇(後述）放開ic組件時，將用以固定IC組件之夾緊機構75〇開閉的夾緊操作頭350和保持頭340分開地設置。此夾緊操作頭35〇和保持頭340可獨立地朝向z軸方向（上下方向）移動。 ’、在本實施形態之吸附喷嘴341如第7圓所示，包括：平坦的前端面342，在二τρα-μ 係了和IC組件之上面密接；及吸附口 43係在該别端面342開口，並和吸附源（未圓示）連通，未包括由合成樹脂材料等所構成並具有柔軟性之襯墊。此山在吸附噴嘴341吸附並保持Ic組件時，藉由以平坦的 '&面342和ic組件之上面接觸’而可在正確的位置保持 1C組件，不會彳丨起位置偏差。 2247-9068-PF;Ahddub 20 1345063 又丄經由襯塾保持IC組件時，即使停止吸附亦有π ’且件附者於襯墊的情況，但是在本發明替代襯墊，藉甴以堅硬且平坦的前端面Tri / 和ι c件接觸，而在停止吸附後可易於取下1C組件。此外朝向第6圖所示的χ方向設置8套由具有吸附喷嘴341之保持頭340、線性導件322以及㈣缸321所構成的零件保持單开。& η ^ 而且’利用第8圖所示之間距變換機構330,可變更8套零件保持單元之X方向的間距。此間距變換機構330具有：連桿機構331，係安裝各零件保持單元；氣壓紅334，係使該連桿機構331之兩端 32 333各自著χ轴方向移動；以及線性導件，係於連杯機構331之中央部的連桿連結，並僅沿著γ抽方向動作。而，使氣Μ叙334動作時，雖然連桿機構331 之兩端咖、333沿著U方向開閉，但^為此時利用線性導件335使連桿機構331之中央的連桿僅沿著Υ軸方向動作，所以將零件保持單元之間距的誤差抑制為小。第9圖係表不在本發明之實施形態的裝載部之窗部周圍的平面圖’帛1 〇Α圖係在本發明之實施形態的調整機構之平面圖，係在第9圖之ΧΑ部的放大圖，第⑽圖係在本發明之實施形態的調整機構之剖面圖，係沿著在第ι〇α圓之Χβ—Χβ線的圖’第10C圖係沿著在第10Α圖之XC—κ 線的剖面圖，f m圖係表示在裝載部從訂製托盤吸附並保持1C組件之狀況的示意剖面圖。在本實施形態，如第9圖所示’在形成於裝置基座101 21 2247-9068-PF;Ahddub 1345063 之各自的固部370之周® ’設置用以包圍該窗部370之周邊的框形之機架39〇。此外，在此窗部請，設置用以調整。丁製托盤80。對組件搬運裝置31〇之相對高度的調整 380 ° 調整機構380如第l〇A圖及帛10B圖所示，由以下之構件構成，螺栓383 ;轉盤381，係可支持螺检聊之頭部 384 ’螺巾目384，係可和螺检383之陽螺紋部娜螺合；貫穿孔391 ’係形成於機架390 ;以及第卜第7段部 392a 392g係形成於貫穿孔391之上部。轉盤如具有突出成沿著徑向相向# 2個突起部382。第1〇C圖所示，段部392a〜392g以包圍貫穿孔391 之上#的方式形成階梯狀。相鄰之段部392a~392g彼此之深度的差例如係約〇. 15mm。在本實施形態，在將轉盤381之突起部382對準適合 ic組件之種類的段部392a〜392g(在如第心圖及第則圖所丁之例子為第2段部392b)之狀態，將螺检挪***貫穿孔391，並使螺帽386和陽螺紋部385螺合。此時，在比螺帽386更下方，下方因應於段部392a~392g，螺拴383突出既定量。因而’藉由將轉盤381之突起部如對準任一段部392a〜392g，.而可任意地改變機架39〇的高度，機架⑽利用未特別圖示之螺栓等固定於裝置基座如第⑽圖所示，利用昇降工作台m所上托盤_和機架_的内側周邊抵接，藉此決定訂製托盤 _對裝置基座101之相對高度。因製托盤 u叩例如如第10A圖 2247-9068-PF;Ahddub 22 1345063 及第10B圖所示’在將轉盤381之突起部如設定於第2 段部392b的情況，和將轉盤381設定於第丄段部392a的情況相比，位於窗冑370之訂製托盤8〇〇的高度相對地變高’和將轉盤381設定於第3~第7段部咖〜⑽的情況相比’位於窗部370之訂製托盤_的高度相對地變低。Further, the storage devices 2〇1 and 2〇2 of the present embodiment correspond to an example of a storage means in the scope of the patent application, and the elevator 2〇4 of the present embodiment corresponds to an example of the lifting means in the patent application range. The cushioning member 206 in the present embodiment corresponds to an example of a buffering means in the scope of the patent application. Since the configuration of the 1C memory 2G1 and the tested IC memory m are the same before the test, the number of each of the pre-test K memory 201 and the tested 1C memory 2〇2 can be appropriately set in accordance with the need. In the present embodiment, as shown in Fig. 2 and 筮qn, the two memories STK-B are set before the test, and 〇ηι. ^" is set next to the storage state 201. 2 empty tray storage STK — E. Each life boat is wonderful. . ... The empty tray storage STK-E stack is fed into the empty custom tray RST of the smuggling section 400. 2247-9068-PF; Ahddub 18 1345063 Next to the empty tray storage STK-E, set 8 reservoirs STK-1, STK-2,..., Stk-8 to the 1C storage 2〇2 after testing It is constructed in such a way that the test results are classified into up to eight types and stored. In other words, the product can be classified into a high-speed, medium-speed, or low-speed operation speed, or it can be classified into a re-test, even if it is a defective product. <Loading Unit 30〇> Fig. 6 is a side view showing a holding head of the component conveying device provided in the loading unit of the electronic component testing device according to the embodiment of the present invention, and Fig. 7 is not shown in Fig. 6. FIG. 8 is a perspective view showing a distance-changing mechanism between the component transporting devices provided in the loading unit of the electronic component testing device according to the embodiment of the present invention. The above-described customized tray 800 is transported from the storage unit 2 to the elevating work table 207 by the tray transfer 205 provided between the storage unit 200 and the device base 101 (see Fig. 1B). The elevating table m is respectively disposed at a lower portion of the window portion 370 of the loading unit 300, and is movable in the z-axis direction while supporting the customized tray_. The customized tray 800 is moved from the lower side of the apparatus base 1〇1 to the window portion 37〇 by the elevating table 2〇7. Next, at this loading unit assembly conveying device 31, the 1C assembly loaded into the customized tray is once moved to a corrector 36, where it is falsified. The positional relationship between each other. Then, the component handling device 310 reloads the IC component held by the corrector 360 to the parking device (4)__ trial 700 〇 2247-9068-PF; Ahddub 19 ^ 45063 loading portion 300 includes component handling device 310, which will ic The assembly is moved from the custom tray KST and replaced with the test tray TST. As shown in Fig. 2, the component transporting device 310 is composed of the following members, and two rails 311 are mounted on the apparatus base 101; and the movable arm 312 can be used in the custom pallet 8 by using the two rails 311. The crucible and the test tray 7 are reciprocated (this direction is set to the Y direction); and the movable head 32 is supported by the movable arm 3ι2 and is movable along the movable arm 312 in the X-axis direction. As shown in Fig. 6, in the movable head 32'' of the unit conveying device 31, a holding head 34'' having a suction nozzle 341 is attached to the front end. Further, a stopper 344 is provided beside the adsorption nozzle 341 for abutting against a shaft 363 provided in a corrector 360 to be described later or a projection 721 provided on the test tray 7A. The holding head 340 is movable in the Z-axis direction (up-and-down direction) by the linear guide 322 and the pneumatic cylinder 321. Further, when the ic component is released by the insert 71 (described later) of the test tray 700, the clamp head 350 and the holding head 340 for opening and closing the clamp mechanism 75 for fixing the IC unit are separately provided. The clamp operating head 35A and the holding head 340 are independently movable toward the z-axis direction (up and down direction). As shown in the seventh circle, the adsorption nozzle 341 of the present embodiment includes: a flat front end surface 342 which is in close contact with the upper surface of the IC unit, and a suction port 43 which is open at the other end surface 342. And connected to the adsorption source (not shown), and does not include a cushion composed of a synthetic resin material or the like and having flexibility. When the adsorption nozzle 341 adsorbs and holds the Ic assembly, the 1C assembly can be held at the correct position by the flat '& face 342 and the upper surface of the ic member', without causing positional deviation. 2247-9068-PF; Ahddub 20 1345063 Further, when the IC component is held by the lining, even if the absorbing is stopped, there is a case of π' and the component is attached to the pad. However, in the present invention, the pad is replaced by a hard and flat The front face Tri / and ι c are in contact, and the 1C component can be easily removed after the adsorption is stopped. Further, eight sets of the components constituted by the holding head 340 having the adsorption nozzle 341, the linear guide 322, and the (four) cylinder 321 are provided to be opened in the χ direction shown in Fig. 6 . & η ^ Further, by using the pitch conversion mechanism 330 shown in Fig. 8, the pitch of the eight sets of the component holding units in the X direction can be changed. The pitch changing mechanism 330 has a link mechanism 331 for mounting each component holding unit, and a gas pressure red 334 for moving the two ends 32 333 of the link mechanism 331 in the axial direction; and a linear guide member The link of the center portion of the cup mechanism 331 is coupled and operates only in the γ pumping direction. However, when the gas 334 is operated, although the both ends of the link mechanism 331 are opened and closed in the U direction, the linear guide 335 is used to cause the link of the center of the link mechanism 331 to follow only Since the movement in the x-axis direction is performed, the error in the distance between the component holding units is suppressed to be small. Fig. 9 is a plan view showing a vicinity of a window portion of a loading portion according to an embodiment of the present invention. Fig. 1 is a plan view showing an adjustment mechanism according to an embodiment of the present invention, and is an enlarged view of a portion of the ninth drawing. Figure 10 is a cross-sectional view of the adjustment mechanism of the embodiment of the present invention, taken along the line '10C of the Χβ-Χβ line of the ι〇α circle along the XC-κ line at the 10th Α The cross-sectional view, fm diagram, is a schematic cross-sectional view showing the state in which the loading portion sucks and holds the 1C assembly from the custom tray. In the present embodiment, as shown in Fig. 9, 'the circumference of the respective solid portions 370 formed on the apparatus base 101 21 2247-9068-PF; Ahddub 1345063' is provided to surround the periphery of the window portion 370. The frame of the shape is 39〇. In addition, please set it in this window to adjust. Ding tray 80. Adjustment of the relative height of the component handling device 31 380 ° The adjustment mechanism 380 is composed of the following components, as shown in Figures 1A and 10B, and the bolt 383; the turntable 381 is capable of supporting the head of the screw check. The 384' screw head 384 is screwed into the male thread portion of the screw 383; the through hole 391' is formed in the frame 390; and the seventh seventh portion 392a 392g is formed on the upper portion of the through hole 391. The turntable has protrusions 382 protruding toward the radial direction. As shown in FIG. 1C, the segment portions 392a to 392g are formed in a stepped shape so as to surround the through hole 391. The difference in depth between adjacent segments 392a to 392g is, for example, about 15 mm. In the present embodiment, the projections 382 of the turntable 381 are aligned with the segments 392a to 392g of the type suitable for the ic component (the second segment 392b is exemplified in the first and second figures). The screw is inserted into the through hole 391, and the nut 386 and the male screw portion 385 are screwed together. At this time, the screw 383 protrudes more than the nut 386, and the lower portion corresponds to the segments 392a to 392g. Therefore, the height of the frame 39〇 can be arbitrarily changed by aligning the projections of the turntable 381 with any of the segments 392a to 392g, and the frame (10) is fixed to the device base by bolts or the like not specifically shown. As shown in the figure (10), the relative height of the custom tray_ to the apparatus base 101 is determined by the abutment of the upper tray _ and the inner periphery of the rack _. For example, as shown in FIG. 10A FIG. 2247-9068-PF; Ahddub 22 1345063 and FIG. 10B, 'when the protrusion of the turntable 381 is set to the second stage portion 392b, and the turntable 381 is set to In the case of the second segment portion 392a, the height of the custom tray 8A located in the window 370 is relatively higher than that in the case where the turntable 381 is set to the third to seventh segments (10). The height of the custom tray_ of the window portion 370 is relatively low.

在此狀態，若組件搬運裝置31〇之保持頭34〇接近ic 組件，在保持頭340下降至最低點時，如冑UA圖所示，在吸附喷嘴341之前端和Ic組件的上面之間形成既定間隔〇。然後，吸附喷嘴341從此狀態開始吸附，如第nB圖所不’將1C組件拉近、吸附並保持。因而，因為在保持頭 340和1C組件接觸時產生之撞擊不會傳至訂製托盤，所以即使係處s尺寸極小< IC組件的情&，亦可防止保持 ic組件時因撞擊而其他的IC組件從訂製托盤彈起。此外，被裝入訂製托盤8 〇〇之全部的I c組件，被換裝於位於裝載部3〇〇的測試用托盤700時，昇降工作台2〇7 使該空的訂製托盤800下降，並將此空托盤交給托盤移送臂 205 〇第12A圖〜第12C圖係表示第6圖所示之保持頭從校正器保持1C組件的狀況之示意剖面圖。在"丁製托盤800由組件搬運裝置31〇之保持頭340所保持的1C組件，^ 了修正Ic組件之彼此的位置關係，被一度移至校正器360。校正器360如第12A圖所示，具有比較深的凹部Μ】，而此凹部361之周邊被傾斜面包圍。因此，在將從訂製托 23 2247-9068-PF；Ahddub 1345063 盤800換裝於測試用托盤700的1C組件放置於測試用托盤 700之前，藉由一度掉入此校正器36〇,而正確地決定8個 ic組件之彼此的位置關係，而可將該各Ic組件高精度地換裝於測試用托盤TST。职圃所不，在校正器36〇之各此外，在本實施形凹部361的周圍，各自設置向上方突出的轴362。因而，組件搬運裝置310接近校正器360之凹部361所收容的ic 組件時（參照第12A圖）’保持頭340之止動器344和軸362 抵接，而在吸附喷嘴341之前端和IC組件的上面之間形成既定間隔ο的狀態限制保持頭34〇對校正器36〇之接近（參照第12B圖），從此狀態吸附喷嘴341開始吸附，將κ組件拉近、吸附並保持（參照第丨2C圖）。軸362利用螺絲固定等之手法可拆裝地安裝於校正器 360。因而’在本實施形態，藉由選擇適合π組件之種類的軸362’而在保持頭34〇下降至最低點時，可在吸附喷嘴⑷之前端和1(：組件的上面之間形成既定間隔藉 '、寺頭340和ic組件為非接觸且這些間隔為最小之可將K組件收容於凹部361内。因而，即使係處理、玉小之1C組件的情況，亦可抑制因Ic 傾斜等而發生之IC組件的位置偏差。谷成變換方；^系表不在本發明之實施形態的裝載部之間距變換方法的示意平面圖，第14A圖係形態的裝載邻夕„ 掛 π伞知明之貫施第UB圖…機構的變換動作之示意平面圖， '、不在裝載部之以往的間距變換動作的示意側 2247-9〇68-pF;Ahddub 視圖。，如第13圖所示，因為訂製托盤8〇〇所收容之ic組件彼此的間距pl(例如1〇 8mra)和測試用托盤7〇〇所收容之a 組件彼此的間距p2(例如25mm)相異所以利用組件搬運裝置310將1C組件從訂製托盤_移至校正器編時利用上述之間距變換機構變㈣以保持1C組件之保持頭 340彼此間的間距。一般，如第13圖之虛線箭號及第UB圖所示，以在從訂製托盤8GG保持1(：組件時，將保持頭34()間之間距對準訂裏托盤800上的間距Ρι，而在從訂製托盤_移至校正器360時，對準測試用托盤7〇〇之間距P2的方式，利距變換機構330擴大保持頭34〇間之間距。而，在本實施形態，Μ 13圖之實線箭號及第"A圖所示，以在從訂製托盤800保持IC組件時，將保持頭34〇間之間距設為訂製托盤_上的間距k 2倍（在本例為 2UHH10,而在從訂製托盤刚之收容部8()1每隔—個保持 ic組件’並從訂製托盤_移至校正器36〇之間，利用間距變換機構330將保持頭340間之間距擴大成pz。如^在本實施形態，在將心组件從訂製托盤800移至校正器360時，將保持頭34()間之間距進行間距變換，使得從P】x2(係'訂製托盤綱上之間ρι的整數倍，得最接近測試用托盤700上之間P2的間距)變成測試用托盤 700上之間距p”因而’和以往的情況相比，因為間距變換量減少，所以可將在間距轡拖拉變換時發生之連桿機構的累積 2247-9068-PF；Ahddub 25 1345063 誤差抑制為小。在處理尺寸極小之IC組件的情況係有效，因為間距變換而發生之累積誤差，而有引起保持頭34〇之吸附/放置失誤的情況。第15圖係表示在本發明之實施形態的電子元件測試裝置所使用之測試用托盤的分解立體圖，第i 6圖係表示在本發明之實施形態的電子元件測試裝置所使用之***件的分解立體圖，第17A圖〜第17c圖係用以說明在本發明之實施形態利用掛鉤機構將導芯安裝於***件本體之步驟的部分剖面圖，第18A圖及第18B圖係用以說明在本發明之實施形態的夾緊機構之動作的***件之剖面圖。用校正器360已修正彼此之位置關係的Ic組件，利用組件搬運裝置310再度保持，並被移至位於裝载部3〇〇的測試用托盤700。測試用托盤700如第15圖所示，將框條7〇2平行且等間隔地設置於方形框701，在這些框條7〇2的兩側及和框條702相對向之方形框7〇1的邊7〇la，各自等間隔地突出形成多片安裝片703。利用這些框條702之間或框條7〇2 和邊701a之間及2片安裝片7〇3構成***件收容部7〇4。在各***件收容部704，各自收容1個***件71〇，此 ***件710使用固定件705以浮動狀態安裝於安裝片7〇3。因而’在***件710之兩端部，形成用以將該***件女裝於女裝片703的安裝孔706。此***件710如第15圖所示’在1個測試用托盤7 〇〇安裝64個，並配置成4列 1 6行。 2247-9068-PF;Ahddub 26 1345063 « : 此外’將各***件710設為同一形狀、同一尺寸各個***件710收容1C組件❶***件710的組件收容^ 761係因應於所收容之1C組件的形狀而決定，在第 1 5 圖所示之例子成為方形的凹部。在本實施形態之***件710如第16圖所示，由***件本體720、導芯760以及桿板770構成。 ***件本體720如第16圖所示，具有本體部73〇、掛 • 鉤機構740以及夾緊機構750。籲在***件本體720之本體部730的約中央，沿著上下方向貫穿地形成在後述之卸載部4〇〇所設置的組件搬運裝置410之吸附喷嘴441可通過的大小之開口部731。在本體部730之上侧，如第1 6圖所示，經由彈簧77i 安裝桿板770 »利用彈簧771將桿板77〇向上方偏壓，承受向下方之推壓力時向下方移動，而解除該推壓力時，利用彈簧771之偏壓力向上方移動。 • 在桿板770的約中央，形成在後述之卸載部400所設 • 置的組件搬運裝置410之吸附噴嘴441可通過的大小之開口部 772。在***件本體720之本體部730的下侧，如第16圖所不’安裝導怒760。導芯760具有：組件收容部761，係由底面及從該底面所立設之側面構成；及凸緣部763，係設置於組件收容部761之侧面的上端周邊部。在組件收容部 761之約中央’設置開口部762，組件收容部761利用開口部762之周邊764可支持1C組件的下面。而，組件收容部 27 2247-9068-PF；Ahddub 1345063 761所收容之1C組件的輸出入端子經由開口部762向插座 50露出。凸緣部763之内周面成為錐狀，可將ic組件確實地引入組件收容部761。在凸緣部763 ’在相對向位置各自形成2個掛鉤進入In this state, if the holding head 34 of the component handling device 31 is close to the ic component, when the holding head 340 is lowered to the lowest point, as shown in the 胄UA diagram, a gap is formed between the front end of the adsorption nozzle 341 and the upper surface of the Ic assembly. The interval is 〇. Then, the adsorption nozzle 341 starts to adsorb from this state, as shown in Fig. nB, the 1C assembly is pulled, adsorbed, and held. Therefore, since the impact generated when the holding heads 340 and 1C are in contact with each other is not transmitted to the custom tray, even if the size of the s is extremely small <the IC component&<;> The IC components bounce from the custom tray. Further, when all of the Ic components loaded into the order tray 8 are replaced with the test tray 700 located at the loading unit 3, the lifting table 2〇7 lowers the empty customized tray 800. And the empty tray is delivered to the tray transfer arm 205. Figs. 12A to 12C are schematic cross-sectional views showing the state in which the holding head holds the 1C assembly from the corrector shown in Fig. 6. In the "single tray 800, the 1C assembly held by the holding head 340 of the unit handling device 31, the positional relationship of the Ic units is corrected, and is once moved to the corrector 360. As shown in Fig. 12A, the corrector 360 has a relatively deep recess, and the periphery of the recess 361 is surrounded by the inclined surface. Therefore, before the 1C component that is replaced by the custom tray 23 2247-9068-PF; Ahddub 1345063 disk 800 on the test tray 700 is placed in the test tray 700, it is correctly dropped by the corrector 36〇. The positional relationship between the eight ic components is determined, and the Ic components can be accurately mounted on the test tray TST. Further, in the position of the corrector 36, a shaft 362 that protrudes upward is provided around the concave portion 361 of the present embodiment. Therefore, when the component handling device 310 approaches the ic component housed in the recess 361 of the corrector 360 (refer to FIG. 12A), the stopper 344 of the holding head 340 abuts against the shaft 362, and the front end of the adsorption nozzle 341 and the IC component. The state in which the predetermined interval ο is formed between the upper surface and the holding head 34 is close to the corrector 36 (refer to FIG. 12B). From this state, the adsorption nozzle 341 starts to adsorb, and the κ component is pulled, adsorbed, and held (refer to the third 2C picture). The shaft 362 is detachably attached to the corrector 360 by means of screwing or the like. Therefore, in the present embodiment, when the holding head 34 is lowered to the lowest point by selecting the shaft 362' suitable for the type of the π-component, a predetermined interval can be formed between the front end of the adsorption nozzle (4) and the upper surface of the assembly (1:: the upper portion of the assembly). By the fact that the temple head 340 and the ic component are non-contact and the intervals are the smallest, the K component can be housed in the recessed portion 361. Therefore, even if the 1C component is processed, the tilt of the Ic can be suppressed. The positional deviation of the generated IC component. The valley-forming transformation method is not shown in the schematic plan of the method for converting the distance between the loading portions according to the embodiment of the present invention, and the loading method of the aspect of the 14A diagram is the loading of the neighbors. Figure UB is a schematic plan view of the transformation operation of the mechanism, ', the schematic side 2247-9〇68-pF of the conventional pitch conversion operation not in the loading section; Ahddub view. As shown in Fig. 13, because the customized tray 8 The distance pl between the ic components accommodated in the ( (for example, 1〇8mra) and the distance p2 (for example, 25mm) of the components contained in the test tray 7〇〇 are different, so the 1C component is ordered by the component handling device 310. Tray_moved to The corrector is programmed to change the distance between the holding heads 340 of the 1C component by using the above-described pitch changing mechanism (4). Generally, as shown by the dotted arrow and the UB drawing of Fig. 13, in keeping from the custom tray 8GG 1 (: component, the distance between the heads 34 () will be aligned with the spacing 订 on the staple tray 800, and when moving from the customized tray _ to the corrector 360, the alignment between the test trays 7 In the manner of P2, the distance conversion mechanism 330 enlarges the distance between the holding heads 34. However, in the present embodiment, the solid arrow and the "A" shown in Fig. 13 are held in the custom tray 800. In the case of the IC package, the distance between the heads 34 is set to be 2 times the pitch k on the custom tray_ (in this case, 2UHH10, and in the case of the housing 8 () 1 from the custom tray. The ic component 'and moves from the customized tray _ to the corrector 36 ,, and the distance between the holding heads 340 is expanded to pz by the pitch changing mechanism 330. As in the present embodiment, the core assembly is taken from the customized tray 800. When moving to the corrector 360, the pitch between the holding heads 34() is shifted, so that the order is from P]x2 The distance between the integers of ρι and the distance P2 between the test trays 700 is changed to become the distance p" between the test trays 700. Therefore, compared with the conventional case, since the amount of pitch conversion is reduced, Accumulate 2247-9068-PF of the link mechanism that occurs when the pitch is drag-and-drop-transformed; Ahddub 25 1345063 error suppression is small. It is effective in handling the case of an extremely small IC component, because of the cumulative error that occurs due to the pitch change, and There is a case where the adsorption/placement error of the holding head 34 is caused. Fig. 15 is an exploded perspective view showing a test tray used in the electronic component testing device according to the embodiment of the present invention, and Fig. 6 is a view showing the decomposition of the insert used in the electronic component testing device according to the embodiment of the present invention. FIG. 17A to FIG. 17C are partial cross-sectional views showing a step of attaching a lead core to an insert body by a hook mechanism in an embodiment of the present invention, and FIGS. 18A and 18B are for explaining A cross-sectional view of an insert of the operation of the clamping mechanism of the embodiment of the invention. The Ic component whose positional relationship has been corrected by the corrector 360 is again held by the component handling device 310 and moved to the test tray 700 located at the loading section 3A. As shown in Fig. 15, the test tray 700 is provided with the frame strips 7〇2 in parallel and at equal intervals in the square frame 701, on both sides of the frame strips 7〇2 and the square frame 7 opposite to the frame strips 702. The sides 7〇1 of 1 are respectively protruded at equal intervals to form a plurality of pieces of mounting pieces 703. The insert accommodating portion 7〇4 is constituted by the frame strips 702 or between the frame strips 7〇2 and 701a and the two mounting pieces 7〇3. Each of the insert accommodating portions 704 accommodates one insert 71A, and the insert 710 is attached to the mounting piece 7〇3 in a floating state by using a fixing member 705. Thus, at both end portions of the insert 710, mounting holes 706 for forming the insert into the women's piece 703 are formed. This insert 710 is mounted as shown in Fig. 15 on a single test tray 7 64 , and is arranged in four rows and 16 rows. 2247-9068-PF; Ahddub 26 1345063 « : In addition, the components 710 that accommodate each of the inserts 710 in the same shape and the same size of each insert 710 to accommodate the 1C component ❶ insert 710 are adapted to the 1C component contained therein. The shape is determined, and the example shown in Fig. 15 is a square recess. The insert 710 of the present embodiment is constituted by the insert main body 720, the guide core 760, and the rod plate 770 as shown in Fig. 16. The insert body 720 has a body portion 73A, a hooking mechanism 740, and a clamping mechanism 750 as shown in Fig. 16. In the center of the main body portion 730 of the insert main body 720, an opening portion 731 of a size through which the adsorption nozzle 441 of the unit transporting device 410 provided in the unloading portion 4 to be described later passes is formed in the vertical direction. On the upper side of the main body portion 730, as shown in Fig. 16, the lever plate 770 is attached via a spring 77i. The lever plate 77 is biased upward by the spring 771, and is moved downward when the downward pressing force is received, and is released. When the pressure is applied, the biasing force of the spring 771 is moved upward. In the center of the lever plate 770, an opening portion 772 of a size through which the suction nozzle 441 of the component transporting device 410 provided in the unloading portion 400 to be described later can pass is formed. On the underside of the body portion 730 of the insert body 720, the guide 760 is mounted as shown in Fig. 16. The guide core 760 has a module accommodating portion 761 which is constituted by a bottom surface and a side surface from which the bottom surface is erected, and a flange portion 763 which is provided at an upper end peripheral portion of the side surface of the module accommodating portion 761. An opening 762 is provided in the center of the component housing portion 761, and the component housing portion 761 supports the lower surface of the 1C module by the periphery 764 of the opening portion 762. The component receiving portion 27 2247-9068-PF; the input/output terminal of the 1C module housed in the Ahddub 1345063 761 is exposed to the socket 50 via the opening portion 762. The inner peripheral surface of the flange portion 763 has a tapered shape, and the ic component can be surely introduced into the module housing portion 761. Two hooks are formed in the flange portions 763' at opposite positions.

孔765。在掛鉤進入孔765，將掛鉤承部766(參照第17A 圖〜第17C圖）設置成和掛鉤進入孔765的内侧面連續，而已進入掛鉤進入孔765之掛鉤741可和掛鉤承部766卡合。在***件本體720之本體部730，在開口部731的兩側，形成沿著上下方向貫穿的掛鉤收容部732。在此掛鉤收容部732，收容由掛鉤741、彈簧742以及掛鉤承部766 所構成之掛鉤機構740。在本實施形態之***件710’藉由設置此掛鉤機構 740，而根據如下之步驟從***件本體72〇拆裝導芯76〇。因而，在係測試對象之1C組件的種類更換時，藉由僅更換成適合該種類的導芯760，而可應付種類更換。即，如第17A圖〜第17C圖所示，雖然在無負載之狀態利用彈簧742的彈力將掛鉤741之掛鉤部741a朝向外方向偏壓（參照第17A圖），但是將治具900之轴9〇1***掛鉤收容部732，並將掛鉤741壓在内側之狀態，使導芯76〇向***件本體從下方接近（參照第17B圖），而在將掛鉤部 741a***導芯760之掛鉤進入孔765後，從掛鉤收容部7犯拔出治具900的轴901，並使掛鉤部741a和導芯760之掛鉤承部766卡合，藉此，將導芯760安裝於***件本體 72〇(參照第17C圖）。 2247-9068-PF;Ahddub 28 1345063 在***件本體720之本體部730，如第16圖所示，設置由夹頭751、彈簧752以及軸753構成的夾緊機構750。失頭751具有作用部751a、夹緊部751b、以及用以連結作用部751a和夾緊部751b的臂部751c。臂部751c由第2臂751e及設置成和第2臂751e之兩端相對向的2支第1臂751 d構成。沿著開口部731之長度方向將第2臂751e收容於該開口部731内時，沿著開口部 731之寬度方向的内侧面將第1臂751(1收容於該開口部 731 内》在相對向之2支第1臂75Id的邊部，將作用部751a 設置成朝向和第2臂75le之延伸方向相反的方向延伸。又，在相對向之2支第1臂751d，形成嵌插轴753的貫穿孔751f。此外，在第2臂751e之約中央，設置朝向内侧下方向突出的夾緊部751b» 在第1臂751d之各貫穿孔751f，嵌插轴753的一端部’軸753之另一端部由***件本體72〇之本體部73〇的軸支持部733支持，藉此，本體部73〇將夾緊部751b支持成可轉動。在***件本體720之本體部73〇 ,如第16圖所示’相對向地設置如此地支持之2個夾緊機構75〇。在將1C組件收容於以上所示之構造的***件n 〇之情況，將位於關閉位置之夾緊部751b(參照第18A圖）按照以下之順序移至張開位置（參照第18B圖）。桿板770移至下方時，桿板770和作用部751a接觸，並將作用部751a向下方推壓。從桿板770承受向下方之推 2247-9068-PF;Ahddub 29 1345063Hole 765. At the hook entry hole 765, the hook receiving portion 766 (refer to FIGS. 17A to 17C) is disposed to be continuous with the inner side surface of the hook entry hole 765, and the hook 741 having entered the hook entry hole 765 can be engaged with the hook receiving portion 766. . In the main body portion 730 of the insert main body 720, hook receiving portions 732 penetrating in the vertical direction are formed on both sides of the opening portion 731. Here, the hook accommodating portion 732 accommodates the hook mechanism 740 constituted by the hook 741, the spring 742, and the hook receiving portion 766. In the insert 710' of the present embodiment, by providing the hook mechanism 740, the guide core 76 is detached from the insert body 72 in accordance with the following procedure. Therefore, when the type of the 1C component of the test object is replaced, the type change can be handled by replacing only the guide core 760 suitable for the type. In other words, as shown in FIGS. 17A to 17C, the hook portion 741a of the hook 741 is biased outward in the unloaded state by the elastic force of the spring 742 (see FIG. 17A), but the axis of the jig 900 is used. 9〇1 is inserted into the hook accommodating portion 732, and the hook 741 is pressed inside, so that the guide core 76 is slid toward the insert body from below (refer to FIG. 17B), and the hook portion 741a is inserted into the hook of the guide 760. After entering the hole 765, the shaft 901 of the jig 900 is pulled out from the hook accommodating portion 7, and the hook portion 741a and the hook receiving portion 766 of the guide core 760 are engaged with each other, whereby the guide core 760 is attached to the insert body 72. 〇 (Refer to Figure 17C). 2247-9068-PF; Ahddub 28 1345063 In the body portion 730 of the insert body 720, as shown in Fig. 16, a clamping mechanism 750 composed of a chuck 751, a spring 752, and a shaft 753 is provided. The head loss 751 has an action portion 751a, a clamp portion 751b, and an arm portion 751c for connecting the action portion 751a and the clamp portion 751b. The arm portion 751c is composed of a second arm 751e and two first arms 751d that are provided to face the both ends of the second arm 751e. When the second arm 751e is accommodated in the opening 731 along the longitudinal direction of the opening 731, the first arm 751 (1 is accommodated in the opening 731) along the inner side surface in the width direction of the opening 731 is opposed to To the side portions of the two first arms 75Id, the acting portion 751a is provided to extend in a direction opposite to the extending direction of the second arm 75le. Further, the insertion shaft 753 is formed in the two first arms 751d. The through hole 751f is provided in the center of the second arm 751e, and the clamp portion 751b» that protrudes inward and downward directions is provided in each of the through holes 751f of the first arm 751d, and the one end portion 753 of the shaft 753 is inserted. The other end portion is supported by the shaft support portion 733 of the body portion 73 of the insert body 72, whereby the body portion 73 supports the clamping portion 751b to be rotatable. At the body portion 73 of the insert body 720, such as As shown in Fig. 16, the two clamping mechanisms 75 are supported so as to be opposed to each other. In the case where the 1C module is housed in the insert n of the above-described configuration, the clamping portion 751b in the closed position is placed. (Refer to Figure 18A) Move to the open position in the following order (refer to Figure 18B) When the lever plate 770 moves downward, the lever plate 770 and a contact action portion 751a, and the action portion 751a is pressed downwardly 2247-9068-PF 770 from receiving the downward push to the lever plate;. Ahddub 29 1345063

的：用部751a’向下方轉動’利用作用部如之轉第2: 75:臂75H轉動，藉由此第1臂75ld的轉動，而後，隨朝向和作用部751&反方向(上方向)轉動。然者第2臂751e之轉動’夹緊部75ib亦朝向上方移。時’夹緊部751b之前端部從本體部73()之開口部 731的大致中央移至外側。在本體部73G之開口部731内設置彈簧阳，此彈菁 752將作用部751a向上方偏壓。因此，桿板川向上方移動，解除因桿板77G而作用部7513所承受之向下方的推壓力時’利用彈簧752將作用部751a向上方推並轉動。利用此動作，夾緊部751b從張開位置轉至關閉位置。第19A圖〜第19C圖係用以說明在本發明之實施形態將 1C組件放置於測試用托盤的狀況之示意剖面圖，帛鳩圖第20D圖係用以說明在本發明之實施形態將I c組件放置於測試用托盤的保持頭之脫離步驟的示意剖面圖。在本實施形態，如第19A圖〜第19C圖所示，在剛要將 ic組件放置於測試用托盤700之前，保持頭34〇的止動器 344和在***件本體720之上面所形成的突起部hi抿接。在本實施形態’可從保持頭3 4 0拆裝此止動器3 4 4，The portion 751a' is rotated downward. The second portion is rotated by the action portion 2: 75: the arm 75H is rotated by the first arm 75ld, and then the direction and the action portion 751 & the opposite direction (upward direction) Turn. However, the rotation 'clamping portion 75ib' of the second arm 751e also moves upward. The front end portion of the clamp portion 751b is moved from the substantially center to the outer side of the opening portion 731 of the main body portion 73 (). A spring is provided in the opening 731 of the main body portion 73G, and the elastic 752 biases the acting portion 751a upward. Therefore, when the lever plate moves upward and the downward pressing force by the acting portion 7513 due to the lever plate 77G is released, the action portion 751a is pushed upward by the spring 752 and rotated. With this action, the clamp portion 751b is turned from the open position to the closed position. 19A to 19C are schematic cross-sectional views for explaining a state in which a 1C module is placed on a test tray in an embodiment of the present invention, and FIG. 20D is a view for explaining an embodiment of the present invention. A schematic cross-sectional view of the disengagement step of the c-assembly placed on the holding head of the test tray. In the present embodiment, as shown in Figs. 19A to 19C, before the ic component is placed on the test tray 700, the stopper 344 holding the head 34 和 and the upper surface of the insert body 720 are formed. The protrusions hi are connected. In the present embodiment, the stopper 3 4 4 can be attached and detached from the holding head 340.

在係測試對象之1C組件的種類更換時，被更換成適合IC 組件之種類的止動器344。因而’在本實施形態，藉由選擇適合1C組件之種類的止動器344，而在保持頭34〇下降至最低點時’可在***件710的底面和I c組件之間形成既疋間隔C3。因而’在保持頭340和IC組件係非接觸且這些 2247-9068-PF;Ahddub 30 1345063 間隔係最小之狀態，可將IC組件收容於***件7ι〇内。因而’即使係處理尺寸極小之IC M件的情況，亦可防止因 ic組件被收容成傾斜等而發生之Ic組件的位置偏差。雖然在第19A圖〜第19C圖未特別圖示，在保持頭34〇將ic組件******件本體72〇之開口部73ι之前，如第 20A圖所不，《緊操作頭35Q下降，並推壓桿板77()，而夾緊機構750張開。而且，在本實施形態，在解除吸附喷嘴341之吸附When the type of the 1C component of the test object is replaced, it is replaced with a stopper 344 suitable for the type of the IC component. Thus, in the present embodiment, by selecting the stopper 344 suitable for the type of the 1C component, the spacer can be formed between the bottom surface of the interposer 710 and the Ic component when the holding head 34 is lowered to the lowest point. C3. Thus, the IC package can be housed in the insert 7 ι in a state where the holding head 340 and the IC component are not in contact and the 2247-9068-PF; Ahddub 30 1345063 is the smallest. Therefore, even in the case of handling an IC M member having a very small size, it is possible to prevent the positional deviation of the Ic component which occurs due to the ic component being accommodated in a tilt or the like. Although not specifically illustrated in FIGS. 19A to 19C, before the holding head 34〇 inserts the ic component into the opening portion 73ι of the insert body 72〇, as shown in FIG. 20A, the “tight operation head 35Q is lowered and pushed. The lever plate 77 () is pressed and the clamping mechanism 750 is opened. Further, in the present embodiment, the adsorption of the adsorption nozzle 341 is released.

並將ic組件放置於測試用托盤700後（參照第2〇β圖），爽緊操作頭350比保持頭340更早上昇，並將失緊機構75〇關閉，而將ic組件固定於導芯760之組件支持部762(參照第20C圖）。接| ’保持頭34〇上昇，並脫離測試用托盤 7〇〇(參照第20D圖）。如此，令夾緊操作頭35〇比保持頭34〇更早上昇，並在保持頭340上昇之前，藉由將夾緊機構？5〇關閉，而在保持頭3 4 0脫離測試用；般7 π π卩主 —T- J八用托盤700時，可防止應已放開之尺寸極小的1C組件和保持頭340 一起上昇。〈室部100> 第21圖係表示在本發明之測試頭的插座龍的分解立體圖，第22圖係表示在本於明之、、目,丨_ _s & 1 π m 你+知阴 < 剧试碩的插座周圍的剖面圖。上述之測試用托盤700’在用裝載部3〇〇裝入ic組件後被送入至。P 1 0 〇 ’並在將！ C組件裝載於測試用托盤7⑽ 之狀態執行IC組件的測試。 2247-9068-PF;Ahddub 31 1345063 室部100由以下之構件構成’浸潰室丨i 0，係對被裝入測試用托盤700的1C組件，施加目標之高溫或低溫的溫度應力；測試室120 ’係使處於在該浸潰室11()已被施加熱應力之狀態的1C組件接觸測試頭5 ;以及非浸潰室13〇，係從在測試室12 0已測試的I c組件除去熱應力。此外，非浸潰室130係與浸潰室11 〇或測試室1 2〇熱絕緣較佳’貫際上對浸潰室1 1 〇和測試室1 2 〇之區域施加既定的熱應力，雖然非浸潰室1 3〇和這些熱絕緣，但是權宜上將這些總稱為室部1 〇〇。汉潰室11 0如第2圖所示，配置成比測試室丨2 〇更向上方突出。而且，如第3圖之示意圖所示，將垂直搬運裝置設置於此浸潰室110的内部，在至測試室12〇變空為止之間，複數測试用托盤700 —面由此垂直搬運裝置支持一面等待。主要在此等待中對IC組件施加高溫或低溫的熱應力。在測試室120，將測試頭5配置於其中央部。在測試頭5之上部’如第21圖及第22圖所示’包括多支接觸端子51之插座50，按照和測試用托盤7〇〇的***件一樣之排列配置。而，在測試室12〇内，如圖所示，在測試時用以將ic·㈣壓在插座5G之多支推桿m被設置成各自和測試頭5上之插座50相對向。又，在各插座5〇之上設置插座導件55，用以將推桿121所推壓之各***件定位於對插座50正確的位置。將測試用托盤7。。從浸潰室11〇搬入測試室12〇内 2247-9068-PF；Ahddub 32 1345063 • 時，在該測試用托盤700被搬至測試頭5上後，各推桿121 各自將1C組件壓在插座5G’並使1C組件之輸出入端子和插座50的接觸端子51以電氣式接觸，藉此實施組件之測試。將此測試結果記憶於例如根據對測試用托盤7 〇〇所附加的識別號碼和在測試用托盤700之内部所指派的IC組件之號碼所決定的位址。應非度潰室13 0亦和浸潰室11 〇一樣’如第2圖所示， _ 配置成比測試室120更向上方突出，如第3圖之示意圖所示，設置垂直搬運裝置。而，在此非浸潰室】3〇，在浸潰室110已施加高溫的情況，利用送風將Ic組件冷卻，而回到室溫。而，在浸潰室110已施加低溫的情況，利用暖風或加熱器等將1C組件加熱至不會發生結露之程度的溫度為止後，將該已除熱的IC組件搬至卸載部400。在浸潰室110之上部，形成用以從裝置基座1〇1搬入 _ 測试用托盤700的入口。一樣地，在非浸潰室130之上部， ‘’亦形成用以將測試用托盤700搬至裝置基座1〇1的出口。在裝置基座1 〇 1，設置用以經由這些入口或出口使測式用托盤700從次潰1 11〇出入的托盤搬運裝f 1〇2。此托盤搬運裝置102例如由轉動滾輪等構成。利用此托盤搬運裝置·102 ’將從非浸潰室13G所搬出之測試用托盤7〇〇，丄由卸載部400及裝载部300送回浸潰室110。 <卸载部400> 第2 3圖係表不在本發明之實施形態的電子元件測試 2247-9〇68-PF;Ahddub 33 1345063 、置之卸載4所sS:置的組件搬運裝置之保持頭的側視圖， Η第24C圖係表示第23圖所示之保持頭從測試用托盤保持1C缸件的狀況之剖面圖。主將已收谷測試完了之1C組件的測試用托盤700從非浸 ’貝至130搬至卸載部400時，2台組件搬運裝置41〇將Ic 、且件從測試用托盤7GG換裝於因應於測試結果的訂製托盤 _叹於卸载部400之組件搬運裝置410如第2圖所不’和設置於裝載部300之組件搬運裝置310 一樣，由以下之構件構成’ 2支軌道411，係架設於裝置基座1〇1上；可動# 412係'可利用此2支軌道411在測試用托盤7⑽ 訂II托盤_之間往復移動；以及可動頭似，係利用 :可動臂412支持，並可沿著可動臂叫月向X轴方向移動0 如第23圖所示’在此組件搬運裝置41G之可動頭42〇, 安裝前端具有吸附喷嘴441的保持頭440。此保持頭44〇 =用線性導件422及氣麼紅421朝向z轴方向（上下方向）吸附測試用托盤700之*** 為了放開1C組件而用以開閉 450和保持頭34〇分開地設頭440可獨立地朝向z軸方又，將在用吸附喷嘴441 件71 0所裝載的I c組件時，夾緊機構750的夾緊操作頭置。此夾緊操作頭450和保持向（上下方向）移動。在本貫施形態之吸附喷嘴 441雖未特別圖示，和設置 34 2247-9068-PF；Ahddub 1345063 於裝载部300之組件搬運裝置31〇的吸附喷嘴341 一樣，包括：平坦的前端面，係可和IC组件之上面密接；及吸附口，係在該前端面開口，並和吸附源連通，未包括由合成樹脂材料等所構成並具有柔軟性之襯墊。在吸附喷嘴441吸附並保持IC組件時，藉由以平坦的前端面和ic組件之上面接觸，而可在正確的位置保持IC 組件，不會引起位置偏差。又，經由襯墊保持I c組件時，即使停止吸附亦有I匸組件附著於襯墊的情況，但是因為在本發明替代襯墊，藉由以堅硬且平坦的前端面和1C組件接觸，所以在停止吸附後可易於取下ic組件。此外，在本實施形態之吸附喷嘴441如第23圖所示，包括可和***件710之導芯760的上面抵接的抵接部744, 此抵接部744從與吸附喷嘴441之前端面442間隔既定距離的位置沿著徑向突出。組件搬運裝置410保持測試用托盤7〇〇所收容之Ic組件時’保持頭440接近***件710，如第24A圖所示，抵接部744和導芯760之上面抵接，在IC組件的上面和吸附喷嘴441之前端面442之間形成既定距離ο的狀態，限制保持頭440的下降。在此狀態，吸附喷嘴441開始吸附，如第24B圖所示，將I c組件拉近、吸附並保持。因而，因為在保持頭440和1C組件接觸時產生之撞擊不會傳至測1 用托盤700，所以即使係處理尺寸極小之1C組件的情況，亦可防止保持I c組件時因撞擊而其他的I c組件從測1用 2247-9068-PF;Ahddub 35 1345063 托盤700彈起。在吸附喷嘴441吸附並保持ic組件後，如第24C圖所示，保持頭44〇脫離測試用托盤7〇〇。由具有吸附喷嘴441之保持頭44〇、線性導件422以及氣壓缸421所構成的零件保持單元，朝向第^圖所示之 X方向設置8套。而且’利用構造和設置於裝載部3〇〇之間距變換機構33〇(可參考第1〇圖)一樣的間距變換機構，可變更8套零件保持單元之χ方向的間距。第25圖係表示在本發明之實施形態的電子元件測試裝置之卸載部的間距變換方法之示意平面圖，帛26α圖係表示在本發明之實施形態的卸載部之間距變換機構的變換動作之示意側視圖’第26Β圖係表示在卸載部之以往的間距變換動作的示意側視圖。如第25圖所示，因為測試用托盤700所收容之IC組件彼此的間距p2(例如25mm)和訂製托盤議所收容之ic 組件彼此的間距Μ例如10_8mm)相異，所以利用組件搬運裝置41G冑1C組件從測試用托盤移至訂製托盤謂時，利用設置於組件搬運裝s 41()之間距變換機構（未圖示）’變換用以保持Π：組件之保持頭州彼此間的間距。 -般，如帛25圖之虛線箭號及第26β圖所*，以在從測試用㈣700保持Π：組件時，將保持頭44Q間之間距對準測”式用托盤700上的間距p2，而在從測試用托盤7〇〇移至訂製托盤800之間，和訂製托盤8〇〇之間距A 一致的方式，利用間距變換機構縮小保持頭44〇間之間距。而，在本實施形態，如第25圖之實線箭號及第26A圖 2247-9068-PF；Ahddub 1345063After the ic component is placed on the test tray 700 (refer to the second 〇β diagram), the refreshing operation head 350 rises earlier than the holding head 340, and the disabling mechanism 75 〇 is closed, and the ic component is fixed to the guiding core. The component support unit 762 of 760 (refer to Fig. 20C). Then, the holding head 34 is raised and is separated from the test tray 7 (refer to Fig. 20D). Thus, the clamping operation head 35 is raised earlier than the holding head 34, and before the holding head 340 is raised, by the clamping mechanism? 5〇 is closed, and the head 340 is removed from the test; the 7 π π 卩 main-T-J eight-purpose tray 700 prevents the 1C component and the holding head 340 which should be released from being raised together. <Room part 100> Fig. 21 is an exploded perspective view showing the socket dragon of the test head of the present invention, and Fig. 22 is a view showing the original, the head, the 丨__s & 1 π m you + yin < A cross-sectional view of the socket around the master. The test tray 700' described above is fed to the ic unit after being loaded by the loading unit 3. P 1 0 〇 ‘and will be! The C component is loaded in the test tray 7 (10) to perform the test of the IC component. 2247-9068-PF; Ahddub 31 1345063 The chamber portion 100 is composed of the following members: 'Immersion chamber 丨i 0, for the 1C assembly to be loaded into the test tray 700, applying a target high temperature or low temperature stress; test chamber The 120' is brought into contact with the test head 5 in a state in which the thermal stress is applied to the impregnation chamber 11 (); and the non-impregnation chamber 13 is removed from the Ic assembly that has been tested in the test chamber 120. Thermal Stress. In addition, the non-impregnated chamber 130 is thermally insulated from the impregnation chamber 11 or the test chamber 12. Preferably, the predetermined thermal stress is applied to the region of the impregnation chamber 1 1 〇 and the test chamber 1 2 ,, although The non-impregnated chambers are 3 3 〇 and these are thermally insulated, but these are collectively referred to as chambers 1 权. As shown in Fig. 2, the Han chamber 11 is arranged to protrude upward from the test chamber 丨2 〇. Further, as shown in the schematic view of Fig. 3, the vertical conveying device is disposed inside the impregnation chamber 110, and between the test chamber 12 and the test chamber 12, the plurality of test trays 700 are supported by the vertical conveying device. Waiting for one side. Mainly during this waiting, a high or low temperature thermal stress is applied to the IC component. In the test chamber 120, the test head 5 is placed at the center thereof. The socket 50 including the plurality of contact terminals 51 as shown in Fig. 21 and Fig. 22 above the test head 5 is arranged in the same arrangement as the insert of the test tray 7A. Further, in the test chamber 12, as shown in the figure, the plurality of push rods m for pressing the ic (4) to the socket 5G during the test are set to face each other with the socket 50 on the test head 5. Further, a socket guide 55 is provided above each of the sockets 5A for positioning the respective insertion members pressed by the push rod 121 at the correct positions of the sockets 50. The test tray 7 will be used. . From the impregnation chamber 11〇 into the test chamber 12〇 2247-9068-PF; Ahddub 32 1345063 •, after the test tray 700 is moved to the test head 5, each push rod 121 presses the 1C assembly to the socket 5G' and the output of the 1C component into the terminal and the contact terminal 51 of the socket 50 are electrically contacted, thereby performing the test of the component. This test result is memorized, for example, based on the identification number attached to the test tray 7 和 and the address of the IC component assigned inside the test tray 700. The non-splitting chamber 130 is also the same as the impregnation chamber 11 ’. As shown in Fig. 2, _ is disposed to protrude upward from the test chamber 120. As shown in the schematic view of Fig. 3, a vertical transport device is provided. On the other hand, in the non-impregnation chamber, when the high temperature was applied to the impregnation chamber 110, the Ic module was cooled by the air supply and returned to room temperature. On the other hand, when the low temperature is applied to the immersion chamber 110, the 1C module is heated to a temperature at which condensation does not occur by a warm air or a heater, and then the heat-removed IC module is carried to the unloading unit 400. At the upper portion of the impregnation chamber 110, an inlet for carrying the _ test tray 700 from the apparatus base 1〇1 is formed. Similarly, in the upper portion of the non-impregnation chamber 130, ‘' also forms an outlet for transporting the test tray 700 to the apparatus base 1〇1. At the apparatus base 1 〇 1, a tray transporting device f1〇2 for taking in and out of the measuring tray 700 from the secondary break 1 11 is provided via these inlets or outlets. This tray transporting device 102 is constituted by, for example, a rotating roller or the like. The tray 7 is transported from the non-impregnation chamber 13G by the tray transporting device 102, and is returned to the impregnation chamber 110 by the unloading unit 400 and the loading unit 300. <Unloading unit 400> Fig. 2 is a diagram showing the electronic component test 2247-9〇68-PF of the embodiment of the present invention; Ahddub 33 1345063, and the unloading 4 sS: holding head of the component handling device Fig. 24C is a cross-sectional view showing the state in which the holding head holds the 1C cylinder from the test tray, as shown in Fig. 23. When the test tray 700 of the 1C module that has been tested in the valley is moved from the non-immersion to the unloading unit 400, the two component transporting devices 41 换 change the Ic and the components from the test tray 7GG to the corresponding The custom tray of the test result _ sighs that the component transporting device 410 of the unloading unit 400 does not have the same as that of the component transporting device 310 provided in the loading unit 300, and the two members constitute the 'two-track 411, which is erected. The movable base 411 can be reciprocated between the test tray 7 (10) and the tray 27 by using the two rails 411; and the movable head can be supported by the movable arm 412, and The movable arm is moved in the X-axis direction along the movable arm. As shown in Fig. 23, the holding head 440 having the suction nozzle 441 at the front end is attached to the movable head 42A of the component conveying device 41G. The holding head 44〇=the linear guide 422 and the air red 421 are oriented in the z-axis direction (up and down direction). The insertion of the test tray 700 for opening and closing the 1C assembly is used to open and close the 450 and the holding head 34. The 440 can be independently oriented toward the z-axis, and the clamping operation of the clamping mechanism 750 will be placed when the Ic assembly loaded by the suction nozzle 441 member 71 0 is used. This clamping operation head 450 and the holding direction (up and down direction) are moved. The adsorption nozzle 441 of the present embodiment is not particularly illustrated, and is provided with 34 2247-9068-PF; Ahddub 1345063 is the same as the adsorption nozzle 341 of the component handling device 31 of the loading unit 300, and includes a flat front end surface. The liquid is attached to the upper surface of the IC component; and the adsorption port is open to the front end surface and communicates with the adsorption source, and does not include a cushion composed of a synthetic resin material or the like and having flexibility. When the adsorption nozzle 441 adsorbs and holds the IC package, the IC component can be held at the correct position by the flat front end surface and the upper surface of the ic component without causing positional deviation. Moreover, when the Ic component is held by the spacer, even if the adsorption is stopped, the I匸 component is attached to the spacer. However, since the spacer is replaced by the hard and flat front end surface and the 1C component in the present invention, The ic component can be easily removed after the adsorption is stopped. Further, as shown in Fig. 23, the adsorption nozzle 441 of the present embodiment includes an abutting portion 744 which can abut against the upper surface of the lead wire 760 of the insert 710, and the abutting portion 744 comes from the front end surface 442 with the adsorption nozzle 441. The positions spaced apart by a predetermined distance protrude in the radial direction. When the component handling device 410 holds the Ic component accommodated in the test tray 7〇〇, the holding head 440 approaches the insert 710. As shown in FIG. 24A, the abutting portion 744 abuts against the upper surface of the guiding core 760, in the IC assembly. A state in which a predetermined distance ο is formed between the upper surface and the front end surface 442 of the adsorption nozzle 441 restricts the lowering of the holding head 440. In this state, the adsorption nozzle 441 starts to adsorb, and as shown in Fig. 24B, the Ic assembly is pulled, adsorbed, and held. Therefore, since the impact generated when the holding heads 440 and 1C are in contact with each other is not transmitted to the measuring tray 700, even if the size of the 1C component is extremely small, it is possible to prevent the Ic component from being struck by the collision. The I c component is bouncing from the test 1 with 2247-9068-PF; Ahddub 35 1345063 tray 700. After the adsorption nozzle 441 adsorbs and holds the ic assembly, as shown in Fig. 24C, the holding head 44 is separated from the test tray 7A. The component holding unit including the holding head 44A having the adsorption nozzle 441, the linear guide 422, and the pneumatic cylinder 421 is provided in eight sets in the X direction shown in Fig. Further, the pitch changing mechanism of the eight sets of the component holding means can be changed by the pitch changing mechanism having the same structure and the pitch changing mechanism 33 (which can be referred to as the first drawing). Fig. 25 is a schematic plan view showing a method of changing the pitch of the unloading unit of the electronic component testing apparatus according to the embodiment of the present invention, and Fig. 26α is a schematic view showing a shifting operation of the shifting mechanism between the unloading sections according to the embodiment of the present invention. The side view '26' is a schematic side view showing the conventional pitch conversion operation in the unloading unit. As shown in FIG. 25, since the pitch p2 (for example, 25 mm) of the IC components accommodated in the test tray 700 and the distance between the ic components accommodated in the custom tray are different, for example, 10_8 mm, the component handling device is used. When the 41G胄1C component is moved from the test tray to the custom tray, it is changed by the distance change mechanism (not shown) provided in the component transporting device s 41 () to maintain the Π: the components are kept between the head states spacing. Generally, as shown in Fig. 25, the dotted arrow and the 26th figure*, in order to maintain the Π: component from the test (four) 700, the distance between the heads 44Q is kept aligned with the pitch p2 on the tray 700. On the other hand, in the manner of moving from the test tray 7 to the custom tray 800 and the distance between the custom trays 8 and A, the pitch changing mechanism reduces the distance between the holding heads 44. Form, such as the solid arrow in Figure 25 and Figure 26A 2247-9068-PF; Ahddub 1345063

所示，以在從測試用托盤700保持Ic組件時，將保持頭 440間之間距對準測試用托盤7〇〇上的間距p2，並保持ic 組件。接著，在從測試用托盤700移至訂製托盤8〇〇之間，利用間距變換機構將ic組件間之間距設為訂製托盤8〇〇上的間距2倍（在本例為21.6mm)，並每隔一個將化組件放置於訂製托盤800的收容部801。如此，在本實施形態，在將IC組件從測試用托盤7〇〇移至訂製托盤800時，將保持頭44〇間之間距進行間距變換，使得從測試用托盤700上之間距Η變成ριχ2(係訂製托盤800上之間距1^的2倍，係最接近測試用托盤7〇〇上之間距Ρ2 &間距）。目而，和以往的情況相比，因為間距變換量減少，所以可將在間距變換時發生之連桿機構的累積誤差抑制為小。在處理尺寸極小之IC組件的情況係有效，因為間距變換而發生之累積誤差，而有引起保持頭44〇之吸附/放置失誤的情況。 • 第2以圖~第27E圖係用以說明在本發明之實施形態從 • 測試用托盤已保持1C組件之保持頭的脫離步驟之示意剖面圖’第27A圖係表示夾緊操作頭打開夹緊機構之狀態的圖，第27B圖係表示保持頭$入***件内之狀態的圖，第 27C圖係表示一個保持頭保持IC組件之狀態的圖，第27d 圖係表示夹緊操作頭關閉夹緊機構之狀態的圓，第27E圖係表示保持頭脫離***件之狀態的圖。在從已收容測試完了之IC組件的測試用托盤7〇〇保持 ic組件的情況，如第27A圖所示，首先夹緊操作頭45〇下 224 7-9068-PF;Ahddub 37 丄:545063 : 降，並將設置於各***件710的夾緊機構750打開，而解除在導芯760之元件支持部762對1C組件的固定，然後，全部之保持頭440下降，並接近組件I c(參照第27B圖）。接著’如第27C圖所示，僅複數保持頭440之中的至夕個（在該圖所示之例子為位於最左的保持頭440 )開始吸附，吸附並保持IC組件，此外，在此步驟成為保持對象之1C組件係根據測試結果，被分類至因應於該測試結果的 Φ 訂製托盤800之1C組件，根據測試結果亦有2個以上之保 - 持頭440同時保持ic組件的情況。接著，如第27D圖所示，未保持IC組件的保持頭44〇依然保持其狀態，而僅已吸附並保持1C組件之保持頭440 上昇，而脫離測試用托盤700，然後，夾緊操作頭45〇上昇，並將各***件71〇之夾緊機構75〇關閉，而將殘留於測忒用托盤700的ic組件固定於導芯76〇之元件支持部 762。接者，依然下降至***件71〇的保持頭44〇上昇，而 • 脫離測試用托盤7〇〇。 • 如此，僅讓已保持1 c組件之保持頭440先上昇，在此期間’使其他的保持頭44〇依然下％，藉此，可抑制在吸附並保持時未成為保持對象< f G組件因撞擊或振動等而發生位置偏差。如第2圖所不’在卸載部400之裝置基座1〇1，形成2 對的®。卩470’其配置成被搬入卸載部4〇〇之訂製托盤800面臨裝置基座101的上面。雖省略圖示’在各個窗部470之下側，設置用以令訂 2247-9068-PF;Ahddub 38 1345063 , 製托盤800昇降的昇降工作台，在此，放置因裝入測試完了之1C組件而變成滿載的訂製托盤800並下降，再將此滿載托盤交給托盤移送臂205 » 此外’以上所說明之實施形態係為了易於理解本發明而記載的，不是用以限定本發明的。因此，在上述之實施形態所揭示的各元件’係亦包含有屬於本發明之技術性範圍的全部之設計變更或相當物的主旨。 • 例如，亦可將設置於裝載部300之校正器360設置於籲卸載部4〇〇。因而，因為修正ic組件彼此的位置關係，所以可在高精度地定位於位在卸載部4〇〇的訂製托盤8〇〇後放置，即使係處理尺寸極小之I c組件的情況，亦可防止放置失誤。As shown, when the Ic assembly is held from the test tray 700, the distance between the heads 440 is aligned with the pitch p2 on the test tray 7 and the ic assembly is held. Next, between the test trays 700 and the custom trays 8A, the pitch between the ic components is set to be twice the pitch on the custom tray 8〇〇 by the pitch changing mechanism (in this example, 21.6 mm). And every other component is placed in the housing portion 801 of the customized tray 800. As described above, in the present embodiment, when the IC package is moved from the test tray 7 to the custom tray 800, the pitch between the holding heads 44 is changed in pitch so that the distance between the test trays 700 becomes ριχ2. (It is twice the distance between 1 and 2 on the custom pallet 800, which is the closest distance between the test tray 7 and the distance Ρ2 & spacing). As a result, since the amount of pitch conversion is reduced as compared with the conventional case, the accumulation error of the link mechanism which occurs at the time of pitch conversion can be suppressed to be small. The case of handling an IC component having a very small size is effective because of a cumulative error occurring by the pitch change, and there is a case where an adsorption/placement error of the holding head 44 is caused. • Fig. 2 to Fig. 27E are diagrams for explaining a detachment step of the holding head of the 1C module from the test tray in the embodiment of the present invention. Fig. 27A shows the clamping operation head opening clamp. Fig. 27B is a view showing a state in which the head is held in the insert, Fig. 27C is a view showing a state in which the holding head holds the IC unit, and Fig. 27d is a view showing the state in which the chucking head is closed. A circle of the state of the clamp mechanism, and Fig. 27E is a view showing a state in which the retaining head is separated from the insert. In the case where the ic component is held from the test tray 7 in which the tested IC component has been housed, as shown in Fig. 27A, the operating head 45 is first clamped 224 7-9068-PF; Ahddub 37 丄: 545063: Lowering, and the clamping mechanism 750 provided in each of the inserts 710 is opened, and the fixing of the 1C component by the component supporting portion 762 of the guiding core 760 is released, and then all the holding heads 440 are lowered and approached to the component Ic (refer to Figure 27B). Then, as shown in FIG. 27C, only the plurality of holding heads 440 (in the example shown in the figure, the leftmost holding head 440) start to adsorb, adsorb and hold the IC components, and further, here. According to the test result, the 1C component that the step becomes the holding object is classified into the 1C component of the Φ custom pallet 800 corresponding to the test result, and there are also more than two guarantees according to the test result - the head 440 holds the ic component at the same time. . Next, as shown in Fig. 27D, the holding head 44 of the IC assembly is not maintained, and the holding head 440 which has adsorbed and held the 1C assembly is lifted, and is separated from the test tray 700, and then the chucking head is held. 45 〇 rises, and the clamping mechanism 75 各 of each of the inserts 71 〇 is closed, and the ic component remaining in the test tray 700 is fixed to the component support portion 762 of the lead 76 . The pick-up is still lowered until the holding head 44 of the insert 71 is raised, and • is released from the test tray 7〇〇. • In this case, only the holding head 440 that has been held for the 1 c component is raised first, during which the other holding heads 44 are still kept down by %, whereby the object that is not held at the time of adsorption and holding can be suppressed. The component is displaced due to impact or vibration. As shown in Fig. 2, at the device base 1〇1 of the unloading unit 400, two pairs of ® are formed. The cassette 470' is disposed such that the order tray 800 loaded into the unloading unit 4 faces the upper surface of the apparatus base 101. Although the illustration is omitted on the lower side of each window portion 470, an elevating table for lifting and lowering the 2247-9068-PF; Ahddub 38 1345063, the tray 800 is provided, and here, the 1C component that has been tested and loaded is placed. The fully loaded custom tray 800 is lowered and the full load tray is delivered to the tray transfer arm 205. Further, the embodiments described above are described for easy understanding of the present invention and are not intended to limit the present invention. Therefore, the various elements disclosed in the above-described embodiments are intended to include all modifications and equivalents of the technical scope of the invention. • For example, the corrector 360 provided in the loading unit 300 may be disposed in the unloading unit 4〇〇. Therefore, since the positional relationship of the ic components is corrected to each other, it can be positioned with high precision after being placed in the unloading portion 4A of the unloading portion 4, even if the size of the Ic component is extremely small. Prevent placement errors.

又’在將校正器設置於卸載部400的情況，亦可作成將轴設置於該校正器之凹部的周圍（參照第12A圖〜第12C 圖），而在下降至保持頭的最低點時，在吸附喷嘴和丨c組 φ 件之間形成既定間隔。【圖式簡單說明】第1圖係表示本發明之實施形態的電子元件測試裝置之示意剖面圖。第2圖係表示本發明之實施形態的電子元件測試裝置之立體圖。第3圖係表示在本發明之實施形態的電子元件測試裝置所使用之托盤的處理之示意圖。 2247-9068-PF;Ahddub 39 第4圖係表示在本發明之實施形態的電子元件測試带置所使用之ic儲存器的分解立體圖。笛 P：圖係表示在本發明之實施形態的電子元件測試褒置所使用之訂製托盤的分解立體圖。第6圖係表示在本發明之實施形態的電子元件測試裝置之裝載部所設置的組件搬運裝置之保持頭的側視圖。第7圖係表示在第6圖所示之保持頭的前端所設吸附喷嘴的立體圖。第8圖係表示在本發明之實施形態的電子元件測試裝置之裝載部所設置的組件搬運裝置之間距變換機構的立體圖。第9圖係表示在本發明之實施形態的裝載部之窗部圍的平面圖。 ° 第10A圖係在本發明之實施形態的調整機構之平面圖，係在第9圖之XA部的放大圖》第10B圖係在本發明之實施形態的調整機構之剖面圖，係沿著在第1 〇A圖之XB _ XB線的圖。第i〇c圖係沿著在第10A圖之xc_xc線的剖面圖。第11A圖係表示在裝載部剛要從訂製托盤吸附並保持 IC組件之前的狀態之示意剖面圖。第ΠΒ圖係表示在裴載部從訂製托盤吸附並保持“組件之狀態的示意剖面圖。第12A圖係表示第6圖所示之保持頭從校正器保持組件的狀況之示意剖面圖，係表示保持頭接近校正器之狀 2247-9068-PF;Ahddub 40 1345063 態的圖。第12B圖係表示第6 組件的狀況之示意剖面圖狀態的圖。圖所示之保持頭從校正器保持1C ，係表示保持頭和第1軸抵接之第12 C圖係表組件的狀況之示意態的圖。 ^第6 ®所示之保持頭從校正||保持IC 』面圖，係表示保持頭吸附Ic組件之狀Further, when the corrector is installed in the unloading unit 400, the shaft may be disposed around the concave portion of the corrector (see FIGS. 12A to 12C), and when descending to the lowest point of the holding head, A predetermined interval is formed between the adsorption nozzle and the φc group φ piece. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention. Fig. 3 is a view showing the processing of a tray used in the electronic component testing apparatus according to the embodiment of the present invention. 2247-9068-PF; Ahddub 39 Fig. 4 is an exploded perspective view showing an ic storage device used in the electronic component test tape according to the embodiment of the present invention. Flute P: The figure shows an exploded perspective view of a custom tray used in the electronic component tester of the embodiment of the present invention. Fig. 6 is a side view showing a holding head of the component conveying device provided in the loading portion of the electronic component testing device according to the embodiment of the present invention. Fig. 7 is a perspective view showing an adsorption nozzle provided at the tip end of the holding head shown in Fig. 6. Fig. 8 is a perspective view showing a distance changing mechanism between the component conveying devices provided in the loading portion of the electronic component testing device according to the embodiment of the present invention. Fig. 9 is a plan view showing a window portion of a loading portion according to an embodiment of the present invention. Fig. 10A is a plan view of an adjustment mechanism according to an embodiment of the present invention, which is an enlarged view of a portion XA of Fig. 9 and Fig. 10B is a cross-sectional view of an adjustment mechanism according to an embodiment of the present invention. Figure 1 of the XB _ XB line of Figure A. The i 〇c diagram is a cross-sectional view taken along line xc_xc of Fig. 10A. Fig. 11A is a schematic cross-sectional view showing a state immediately before the loading portion is sucked and held by the custom tray. The second drawing shows a schematic cross-sectional view of the state in which the component is sucked and held from the custom tray at the load-bearing portion. Fig. 12A is a schematic cross-sectional view showing the state of the holding head from the corrector holding assembly shown in Fig. 6, It is a diagram showing the state of holding the head close to the corrector 2247-9068-PF; Ahddub 40 1345063. Fig. 12B is a diagram showing the state of the schematic sectional view of the condition of the sixth component. The holding head shown in the figure is kept from the corrector 1C is a diagram showing the state of the condition of the 12th C-series module that holds the head and the first axis abutting. ^The retaining head shown in the 6th ® is corrected from the ||holding IC" surface. Head adsorption Ic component

第13 變換方法的圖係表示在本發明之實施形態的裝載部之間距示意平面圖。第HA圖係表示在本發明之實施形態的裝載部之間距變換機構的變換動作之示意平面圖。第14B圖係表示在裝載部之以往的間距變換動作的示意侧視圖。 ’' 第15 Η係、纟示在本發明之實施^態#電子元件測試裝置所使用之測試用托盤的分解立體圖。第16圖係表示在本發明之實施形態的電子元件測試裝置所使用之***件的分解立體圖。第1 7A圖係用以說明在本發明之實施形態利用掛鉤機構將導芯安裝於***件本體之步驟的部分刳面圖（之丨）。第17B圖係用以說明在本發明之實施形態利用掛釣機構將導芯安裝於***件本體之步驟的部分剖面圓（之2)。第17 C圖係用以說明在本發明之實施形態利用掛釣機構將導芯安裝於***件本體之步驟的部分剖面圖（之3)。第18 A圖係用以說明在本發明之實施形態的夾緊機構 2247-9068-PF;Ahddub 41 之動作的沿著插人件之寬度方向的剖面圖，係“夾緊機構位於張開位置之狀態的圖。、第娜圖係用以說明在本發明之實施形態的心之動作的沿著插人件之寬度方向的剖面圖，係表示夫緊機構位於關閉位置之狀態的圖。第19A圖係用以說明在本發明之實施形態將a組件放The figure of the thirteenth conversion method is a schematic plan view showing the distance between the loading portions in the embodiment of the present invention. Fig. HA is a schematic plan view showing a conversion operation of the distance changing mechanism between the loading units according to the embodiment of the present invention. Fig. 14B is a schematic side view showing a conventional pitch conversion operation in the loading unit. The '15th Η 纟纟。。。。。。。。。。。。。。。。。。。。。。。。电子电子电子电子. Fig. 16 is an exploded perspective view showing an insert used in the electronic component testing device according to the embodiment of the present invention. Fig. 17A is a partial plan view showing a step of attaching a lead core to an insert body by a hook mechanism in an embodiment of the present invention. Fig. 17B is a view showing a partial cross-sectional circle (2) of the step of attaching the guide core to the insert body by the hanging fishing mechanism in the embodiment of the present invention. Fig. 17C is a partial cross-sectional view (No. 3) for explaining the step of attaching the lead core to the insert body by the hanging fishing mechanism in the embodiment of the present invention. Figure 18A is a cross-sectional view along the width direction of the insertion member of the clamping mechanism 2247-9068-PF; Ahddub 41 in the embodiment of the present invention, "the clamping mechanism is in the open position" Fig. 19A is a cross-sectional view showing the movement of the heart in the embodiment of the present invention along the width direction of the insertion member, showing a state in which the clasping mechanism is in the closed position. Used to illustrate the placement of a component in an embodiment of the invention

置於測試用托盤的狀況之示意剖面圖，係表示保持頭接近測試用托盤之狀態的圖。第19B圖係用以說明在本發明之實施形態將I c組件放置於測試用托盤的狀況之示意剖面圖，係表示保持頭和第 2轴抵接之狀態的圖。第19C圖係用以說明在本發明之實施形態將丨c組件放置於測試用托盤的狀況之示意剖面圖，係表示保持頭放置 IC組件之狀態的圖。第20A圖係用以說明在本發明之實施形態將丨c組件放 φ 置於測試用托盤的保持頭之脫離步驟的示意剖面圖，係表示保持頭進入***件内之狀態的圖。第20B圖係用以說明在本發明之實施形態將Ic組件放置於測試用托盤的保持頭之脫離步驟的示意剖面圖，係表示解除IC組件之吸附的狀態之圖。第20C圖係用以說明在本發明之實施形態將I c組件放置於測試用托盤的保持頭之脫離步驟的示意剖面圖，係表示將夾頭關閉之狀態的圖。第20D圖係用以說明在本發明之實施形態將1 c組件放 2247-9068-PF;Ahddub 42 置於測試用托盤的保持頭之脫離步驟的示意剖面圖，係表不保持頭脫離***件之狀態的圖。明之測试頭的插座周圍的分解第21圖係表示在本發立體圖。圖第22圖係表示在本發明之測試頭的插座周圍的剖面第23圖係表示在本發明之實施形態的電子元件測試裝置之卸載部所設置的組件搬運裝置之保持頭的側視圖。圖係表示第2 3圖所示之保持頭從測試用托盤保持1C組件的狀況之剖面圖，係表示保持頭之抵接部和插二件的上面抵接之狀態的圖。圖係表示第⑽所示之保持驟測試用托盤保持1C組件的狀況之剖狀態的圖。絲不保持頭吸附1C：組件之第2:C圖係表示第23圖所示之保持頭從測試用托盤保之狀二？狀況之剖面圖，係表示保持頭脫離測試用托盤之狀態的圖。第25圖係表示在本發發月之實施形態的電子元件測試裝置之卸載部的間距變換方法之示意平面圖。第26A圖係表示在本發明之實施形態的卸載部之間距變換機構的變換動作之示意侧視圖。A schematic cross-sectional view showing the state of the test tray is a view showing a state in which the holding head is close to the test tray. Fig. 19B is a schematic cross-sectional view showing a state in which the Ic module is placed on the test tray in the embodiment of the present invention, and is a view showing a state in which the holding head and the second shaft abut. Fig. 19C is a schematic cross-sectional view showing a state in which the 丨c component is placed on the test tray in the embodiment of the present invention, and is a view showing a state in which the IC module is placed in the holding head. Fig. 20A is a schematic cross-sectional view for explaining a step of disengaging the 丨c component φ in the holding head of the test tray in the embodiment of the present invention, showing a state in which the holding head enters the insert. Fig. 20B is a schematic cross-sectional view showing a state in which the Ic module is placed in the holding head of the test tray in the embodiment of the present invention, and shows a state in which the adsorption of the IC module is released. Fig. 20C is a schematic cross-sectional view showing a state in which the Ic module is placed in the holding head of the test tray in the embodiment of the present invention, and shows a state in which the chuck is closed. Figure 20D is a schematic cross-sectional view showing the step of disengaging the 1c assembly 2247-9068-PF; the Ahddub 42 in the holding head of the test tray in the embodiment of the present invention, showing that the head is not removed from the insert The map of the state. Decomposition around the socket of the test head of the present invention Fig. 21 is a perspective view of the present invention. Fig. 22 is a cross-sectional view showing the vicinity of the socket of the test head of the present invention. Fig. 23 is a side view showing the holding head of the component conveying device provided in the unloading portion of the electronic component testing device according to the embodiment of the present invention. The figure is a cross-sectional view showing a state in which the holding head holds the 1C unit from the test tray, and shows a state in which the abutting portion of the holding head abuts against the upper surface of the insertion piece. The figure shows a cross-sectional state of the state in which the 1C module is held by the hold test tray shown in (10). The wire does not hold the head to absorb 1C: the second part of the module: Fig. 2 shows the holding head shown in Fig. 23 from the test tray. The cross-sectional view of the condition is a view showing a state in which the holding head is separated from the test tray. Fig. 25 is a schematic plan view showing a method of changing the pitch of the unloading portion of the electronic component testing device according to the embodiment of the present invention. Fig. 26A is a schematic side view showing a change operation of the distance changing mechanism between the unloading portions in the embodiment of the present invention.

第26B圖係表亍A '卸載。卩之以往的間距變換動作的意側視圖。 y f /丁第27A圖係用以說明力太發月之實施形態從測試用托 2247-9068-PF;Ahddub 43 1345063 盤已保持ic組件之保持頭的脫離步驟之示意剖面圖，係表不夾緊操作頭打開夾緊機構之狀態的圖。第27B圖係用以說明在本發明之實施形態從測試用托盤已保持1C組件之保持頭的脫離步驟之示意剖面圖，係表不保持頭進入***件内之狀態的圖。第27C圖係用以說明在本發明之實施形態從測試用托盤已保持1C組件之歸頭的脫離㈣之示意剖面圖，係表不一個保持頭保持I c組件之狀態的圖。第27D圖係用以說明在本發明之實施形態從測試用托盤已保持1C組件之保持㈣脫離步驟之示意剖面圖，係表示夾緊操作頭關閉夾緊機構之狀態的圖。第27E圖係用以說明在本發明之實施形態從測試用托盤已保持1C組件之保持頭的脫離步驟之示意剖面圖，係表示保持頭脫離***件之狀態的圖。【主要元件符號說明】 1 處理器； 200儲存部； 310 組件搬運裝置； 330間距變換機構； 350 夾緊操作頭； 362 軸； 390 機架； 400 卸載部； 100室部； 300裝載部； 320可動頭； 340 保持頭； 360 校正器； 380調整機構； 392a~392g第1〜第7段部； 410 組件搬運裝置； 2247-9068-PF;Ahddub 44 1345063 440 保持頭； 442 抵接部， 700 測試用托盤； 800 訂製托盤。 2247-9068-PF;Ahddub 45Figure 26B shows the table A 'Unloading. The side view of the previous pitch change action. Yf / Ding 27A is a schematic cross-sectional view of the detachment step of the holding head of the ic component from the test tray 2247-9068-PF; Ahddub 43 1345063 A diagram of the state in which the clamping head opens the clamping mechanism. Fig. 27B is a schematic cross-sectional view for explaining a detaching step of holding the holding head of the 1C module from the test tray in the embodiment of the present invention, showing a state in which the head is not held in the insert. Fig. 27C is a schematic cross-sectional view for explaining the detachment (4) from which the test tray has been held by the test tray in the embodiment of the present invention, and shows a state in which the holding head holds the Ic unit. Fig. 27D is a schematic cross-sectional view for explaining a state in which the holding tray of the test tray has been held (1) from the test tray in the embodiment of the present invention, and shows a state in which the chucking mechanism closes the chucking mechanism. Fig. 27E is a schematic cross-sectional view showing a step of detaching the holding head of the 1C module from the test tray in the embodiment of the present invention, showing a state in which the holding head is separated from the insert. [Description of main component symbols] 1 processor; 200 storage section; 310 component handling device; 330 pitch changing mechanism; 350 clamping operation head; 362 axis; 390 frame; 400 unloading section; 100 compartment; 300 loading section; Movable head; 340 holding head; 360 corrector; 380 adjustment mechanism; 392a~392g 1st to 7th sections; 410 component handling device; 2247-9068-PF; Ahddub 44 1345063 440 holding head; 442 abutment, 700 Test tray; 800 custom tray. 2247-9068-PF; Ahddub 45

Claims

1345063 修正曰期：100.2.24 處理被測試電子元件， • 第96132855號申請專利範圍修正本十、申請專利範圍： 1. 一種電子元件處理裝置其特徵在於：包括零件搬運手段，其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件； 5零件搬運手I又係、具有肖呆持該被測言式電子元件的保持頭；其中該第1收容件係用以收容測試前之該被測試電子元件的訂製托盤；該第1位置係形成於該被測試電子元件之裝置基座的窗部；該電子元件處理裝置包括：昇降工作台，將該訂製托盤移動至該窗部；儲存手段，係錯存已裝制試前之該被測試電子元件的該訂製托盤；托盤移動手段，係令該儲存手段所儲存之該訂製托盤移至該昇降工作台；及調整手段，其可調整位於該窗部之該訂製托盤的高度，· 其中該保持頭將被收容於該第J收容件之該被測試電子X件從非接觸之狀態拉近並保持該被測試電子元件。 2.如申請專利範圍第！項之電子元件處理裝置，其中該儲存手段具有·· 昇降手段，係可上下動地支持該訂製托盤，及緩衝手段，係設置於該訂製托盤和該昇降手段之間。 46 2247-9068-PFl；Ahddub 1345063 第96132855號申請專利範圍修正本 3. -種電子元件處理裝置，處理被測試電子元仵，其特徵在於： ^括零件搬運手段，其將該被測試電子元件從位於第位置之第1收容件移至位於第2位置的第2收容件；該零件搬運手段係具有用以保持該被測試電子元件的保持頭；其中該第2收容件係校正器，其收容測試前之該被測 m件，並修正該被測試電子元件之間的彼關係；該電子元件處理裝置包括第^制手段，其限制該保持頭對該校正器的接近；部；其中該校正器係具有用以收容該被測試電子元件之凹該第1限制手段係軸，其設置於該凹部的周圍，並和該零件搬運手段之該保持頭抵接；其中該保持頭將被收容於該第i收容件之該被測試電子兀件從非接觸之狀態拉近並保持該被測試電子元件。 4·如申請專利範㈣3項之電子元件處理裝置，並中該軸係因應於該被測試電子元件的種類更換，可更換成長度相異之其他的軸。 5. 一種電子元件處理裝置，處理被測試電子元件，其特徵在於：包括零件搬運手段，其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件； 47 2247-9068-PFl；Ahddub 1^45063 修正日期：100.7,94 第96132855號申請專利範圍修正本該零件搬運手段係具有用以保持該被測試電子元件的保持頭；其中該第2收容件係用以收容測試前之該被測試電子元件的測試用托盤；該電子元件處理裝置包括第2限制手段，其限制該保持頭對該測試用托盤的接近；其中該第2限制手段係止動器，其設置於該零件搬運手段之該保持頭，並和該測試用托盤抵接；該止動器係因應於該被測試電子元件的種類更換，可更換成長度相異之其他的止動器；其中該保持頭將被收容於該第丨收容件之該被測試電子元件從非接觸之狀態拉近並保持該被測試電子元件。 6.種電子元件處理裝置，處理被測試電子元件，其特徵在於：包括零件搬運手段，其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件；該零件搬運手段係具有用以保持該被測試電子元件的保持頭；其中該第1收容件係用以收容測試完了之該被測試電子元件的測試用托盤；該電子元件處理裝置包括第3限制手段，其限制該保持頭對該測試用托盤的接近；其中該第3限制手段係抵接部，其設置於該保持頭’ 並和該測試用托盤之上面抵接； 2247-9068-PFl；Ahddub 48 1345063 第96132855號申請專利範圍修正本條正日期：1。。丄？4 其中该保持頭將被收容於該第1收容件之該命琍汰電子兀件從非接觸之狀態拉近並保持該被測試電子元件。 7· 一種電子元件處理裝置，處理被測試電子元件，其特徵在於：包括零件搬運手段，其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件；該零件搬運手段係具有用以保持該被測試電子元件的 φ 保持頭； • 其中該第1收容件係用以收容測試完了之該被測試電子元件的測試用托盤；該第2收容件係校正器，其收容測試完了之該被測試電子元件並修正該被測試電子元件之間的彼此之位置關係；其中該電子元件處理裝置包括第4限制手段，其限制該保持頭對該校正器的接近 • /、中°亥校正态係具有用以收容該被測試電子元件之凹 . 部；該第4限制手段係軸，其設置於該凹部的周圍，並和該零件搬運手段之該保持頭抵接；該軸係因應於該被測試電子元件的種類更換，可更換成長度相異之其他的軸；其中該保持頭將被收容於該第i收容件之該被測試電子元件從非接觸之狀態拉近並保持該被測試電子元件。 8.種電子元件處理裝置，處理被測試電子元件’ 2247-9068-PFl；Ahddub 49 1345063 修正曰期：1345063 Revision period: 100.2.24 Processing of tested electronic components, • Patent No. 96132855 Revision of the patent scope 10. Patent application scope: 1. An electronic component processing apparatus characterized by: comprising a part handling means, which will be tested The electronic component is moved from the first receiving member located at the first position to the second receiving member located at the second position; and the component carrying hand I is further provided with a holding head for holding the electronic component of the detected electronic component; 1 a receiving member for accommodating a customized tray of the tested electronic component before the test; the first position is formed in a window portion of the device base of the tested electronic component; the electronic component processing device comprises: a lifting table Moving the customized tray to the window portion; storing means for misregistering the customized tray of the tested electronic component before the test; the tray moving means for storing the customized storage means Moving the tray to the lifting table; and adjusting means for adjusting the height of the customized tray located in the window portion, wherein the holding head is to be accommodated in the first Member of the electronic test is closer to the member X of the non-contact state and holds the electronic component to be tested. 2. If you apply for a patent scope! The electronic component processing apparatus of the present invention, wherein the storage means has a lifting means for supporting the custom tray up and down, and a buffering means is provided between the custom tray and the lifting means. 46 2247-9068-PFl; Ahddub 1345063 Patent No. 96132855 Patent Application Revision 3. An electronic component processing apparatus for processing an electronic component to be tested, characterized by: a component handling means for the electronic component to be tested Moving from the first receiving member at the first position to the second receiving member at the second position; the component transporting means having a holding head for holding the electronic component to be tested; wherein the second receiving member is a corrector Receiving the tested m pieces before the test and correcting the relationship between the tested electronic components; the electronic component processing device includes a means for limiting the proximity of the holding head to the corrector; The corrector has a recessed first restriction means shaft for receiving the electronic component to be tested, and is disposed around the recess and abuts the holding head of the component transporting means; wherein the retaining head is to be received The tested electronic component of the ith receiving member is pulled from the non-contact state and holds the tested electronic component. 4. If the electronic component processing apparatus of the patent specification (4) is applied, and the shaft is replaced by the type of the electronic component to be tested, the other shafts having different growth degrees can be replaced. An electronic component processing apparatus for processing an electronic component to be tested, comprising: a component transporting means for moving the electronic component to be tested from a first housing member located at a first position to a second housing position at a second position 47 2247-9068-PF1; Ahddub 1^45063 Amendment date: 100.7, 94 Patent No. 96132855. The method of the present invention is to have a holding head for holding the electronic component to be tested; wherein the second housing The device is for supporting a test tray of the tested electronic component before the test; the electronic component processing device includes a second restriction means for limiting the proximity of the holding head to the test tray; wherein the second restriction means The actuator is disposed on the holding head of the component conveying means and abuts against the test tray; the stopper is replaced according to the type of the tested electronic component, and can be replaced with another length different in length Wherein the holding head pulls the tested electronic component housed in the second receiving member from a non-contact state and holds the tested electronic component . 6. An electronic component processing apparatus for processing an electronic component to be tested, comprising: a component transporting means for moving the electronic component to be tested from a first housing member at a first position to a second housing at a second position The part handling means has a holding head for holding the electronic component to be tested; wherein the first receiving part is for receiving a test tray of the tested electronic component; the electronic component processing apparatus includes a limiting means for limiting the proximity of the holding head to the test tray; wherein the third limiting means is an abutting portion disposed on the holding head ' and abutting against the test tray; 2247-9068- PFl; Ahddub 48 1345063 No. 96132855, the scope of application for patent amendments, the date of this article: 1. . Hey? 4 wherein the holding head pulls the electronic component contained in the first receiving member from a non-contact state and holds the electronic component to be tested. An electronic component processing apparatus for processing an electronic component to be tested, comprising: a component transporting means for moving the electronic component to be tested from a first housing member located at a first position to a second housing position at a second position The part handling means has a φ holding head for holding the electronic component to be tested; wherein the first receiving part is for accommodating the test tray of the tested electronic component; the second receiving part a corrector that houses the tested electronic components and corrects the positional relationship between the tested electronic components; wherein the electronic component processing apparatus includes a fourth limiting means that limits the holding head to the corrector The approaching / /, medium-degree correction state has a recess for receiving the electronic component to be tested; the fourth limiting means is a shaft disposed around the recess, and the part handling means Keeping the head abutting; the shaft is replaced by the type of the tested electronic component, and can be replaced with another shaft of different length; wherein the holding head I is accommodated in the first receiving member of the electronic component to be tested to narrow from the non-contact state and holds the electronic component to be tested. 8. Electronic component processing device for processing tested electronic components ' 2247-9068-PFl; Ahddub 49 1345063 Revision period:

第96132855號申請專利範圍修正本其特徵在於：包括零件搬運手&，其㈣被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件；其中該零件搬運手段包括：複數個保持頭，保持該被測試電子元件；及間距變換機構，係將該保持頭彼此間的間距進行變換，該零件搬運手段在將該保持頭彼此間的間距，設為係在該第1收容件之收容部彼此間的第丨間距之整數倍且最接近在該帛2收容件之收容部彼此間的第2間距之間距的狀態，保持被收容於該第1收容件之該被測試電子元件，並在利用該間距變換機構將該保持頭彼此間的間距變換成貝質上和該弟2間距相同後，將該被測試電子元件移至該第2收容件。 .如申請專利範圍第8項之電子元件處理裝置，其中該第1收谷件係用以收容測試前之該被測試電子元件的訂製托盤； ° 該第2收容件係校正器，其收容測試前之該被測試電子元件並修正該被測試電子元件之間的彼此之位置關係。 10. —種電子元件處理裝置，處理被測試電子元件’ 其特徵在於：包括零件搬運手段，其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件；其中該零件搬運手段包括：複數個保持頭’保持該被測試電子元件；及 2247-9068-PFl；Ahddub 1345063 * 第犯32855號申請專利範圍修正本修正日期」㈣丄2卞間距變換機構’係將該保持頭彼此間的間距進行變換，該零件搬運手段在將該保持頭彼此間的間距，設為係在該第1收容件之收容部彼此間的第1間距之狀態，保持被收容於該第1收容件之該被測試電子元件，並在利用該間距變換機構將該保持頭彼此間的間距變換成係在該第2 收容件之收容部彼此間的第2間距之整數倍且最接近在該第1收容件之收容部彼此間的第1間距之間距後，將該被 φ 測試電子元件移至該第2收容件。 * 丨1.如申請專利範圍第10項之電子元件處理裝置，其中該第1收容件係用以收容測試完了之該被測試電子元件的測試用托盤；該第2收容件是用以收容測試完了之該被測試電子元件的訂製托盤，或是收容測試完了之該被測試電子元件，並修正該被測試電子元件之間的彼此之位置關係的校正器。 ® 1 2 · —種電子元件測試裝置，處理被測試電子元件，其特徵在於：包括零件搬運手段，其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件；其中該第2收容件係用以收容測試前之被測試電子元件的測試用托盤；該測試用托盤包括：收容部，係可收容該被測試電子元件；及夾緊機構，係固定/放開該收容部内的該被測試電子元 2247-9068-PFl；Ahddub 51 1345063 第96132855號申請專利範圍修正本修正日期：100.2.24 該零件搬運手段具有：保持頭’保持該被測試電子元件；及用以操作該失緊機構之固定/放開的夾緊操作手段；其中在將該被測試電子元件收容於該第2收容件時，該保持頭將該被測試電子元件放開於該收容部内，並藉由該夹緊操作手段之操作而該失緊機構將該被測試電子元件 • 固定於該收容部後，該保持頭脫離該收容部。 - 1 3· —種電子元件處理裝置，處理被測試電子元件，其特徵在於：包括零件搬運手段’其將該被測試電子元件從位於第 1位置之第1收容件移至位於第2位置的第2收容件；其中該第1收容件係已收容測試完了之該被測試電子元件的測試用托盤； • 該測試用托盤包括：收容部，係可收容該被測試電子元件；及夾緊機構，係固定/放開該收容部内的該被測試電子元件；該零件搬運手段包括：複數個保持頭，保持該被測試電子元件；及夾緊操作手段’係用以操作該失緊機構之固Ο放開；在從該第1收容件保持該被測試電子元件時，該複數呆持頭各自接近該收容部，該複數保持頭之中的至少一個保持該被測試電子元件並脫離該收容部，藉由該夹緊操作 2247-9〇68-PFl；Ahddub 52 13.45063 修正日^ ΠΠ 9 O/f •. 第96132855號f請專利範圍修正本手段之操作而該夹緊機構固定該收容部内所收喀前鹫被測試電子元件後，剩下之該保持頭脫離該收容部。 14·如申請專利範圍第丨至13項中任一項所述之電子元件處理裝置’其中該保持頭具有吸附並保持該被測試電子元件之吸附手段；在該保持頭保持被收容於該第1收容件之該被測試電子7L件時，該吸附手段吸引位於非接觸之狀態的該被測試電子元件並拉近。 15.如申請專利範圍第14項之電子元件處理裝置，其中該保持頭包括吸附噴嘴，其具有：平坦的前端面’係和該被測試電子元件之上面密接；及吸附口，係在該前端部開口。Patent Application No. 96132855 is characterized in that it includes: a part handling hand & (4) the electronic component to be tested is moved from the first receiving member at the first position to the second receiving member at the second position; wherein the part The conveying means includes: a plurality of holding heads for holding the electronic component to be tested; and a pitch changing mechanism for converting a pitch between the holding heads, wherein the component conveying means sets the distance between the holding heads as a system The first receiving member is held in a state in which the second interval between the accommodating portions of the first accommodating members is an integral multiple and is closest to the second pitch between the accommodating portions of the cymbal 2 accommodating members. The electronic component to be tested is converted into a shellfish and the second pitch by the pitch conversion mechanism, and the electronic component to be tested is moved to the second container. The electronic component processing apparatus of claim 8, wherein the first receiving member is for accommodating a customized tray of the electronic component to be tested before the test; ° the second receiving member is a correcting device for receiving The tested electronic components before testing and correcting the positional relationship between the tested electronic components. 10. An electronic component processing apparatus for processing a tested electronic component, characterized by comprising: a component transporting means for moving the electronic component to be tested from a first receiving member located at a first position to a second position located at a second position The receiving part includes: a plurality of holding heads 'maintaining the electronic component to be tested; and 2247-9068-PFl; Ahddub 1345063 * the first patent 32855 patent application scope revision revision date" (4) 丄 2卞 pitch transformation The mechanism is configured to change the pitch between the holding heads, and the distance between the holding heads is set to be at a first pitch between the accommodating portions of the first accommodating members. The electronic component to be tested accommodated in the first accommodating member, and the pitch between the holding heads is converted into an integer of the second pitch between the accommodating portions of the second accommodating member by the pitch changing mechanism The φ test electronic component is moved to the second accommodating member after being closest to the first pitch between the accommodating portions of the first accommodating members. The electronic component processing apparatus of claim 10, wherein the first receiving member is for receiving a test tray of the tested electronic component; the second receiving member is for receiving the test Finishing the customized tray of the tested electronic component, or accommodating the tested electronic component that has been tested, and correcting the positional relationship between the tested electronic components. ® 1 2 · An electronic component testing device for processing a tested electronic component, comprising: a component transporting means for moving the electronic component to be tested from a first receiving member at a first position to a second position The second receiving member is configured to receive a test tray for the tested electronic component before the test; the test tray includes: a receiving portion for receiving the tested electronic component; and a clamping mechanism, Fixing/releasing the tested electronic component 2247-9068-PF1 in the accommodating portion; Ahddub 51 1345063 Patent No. 96132855 Patent Application Revision Amendment Date: 100.2.24 The component handling means has: holding the head 'keep the tested An electronic component; and a clamping operation means for operating the fixing/release of the detent mechanism; wherein the holding head releases the tested electronic component when the electronic component to be tested is received in the second receiving component In the accommodating portion, and by the operation of the clamping operation means, the detent mechanism fixes the electronic component under test to the accommodating portion, and the holding head is detached From the containment department. An electronic component processing apparatus for processing an electronic component to be tested, comprising: a component transporting means for moving the electronic component to be tested from a first receiving member located at a first position to a second position a second receiving member; wherein the first receiving member has received the tested test tray of the tested electronic component; • the test tray includes: a receiving portion for receiving the tested electronic component; and a clamping mechanism Fixing/releasing the tested electronic component in the accommodating portion; the component handling means includes: a plurality of holding heads for holding the electronic component to be tested; and a clamping operation means for operating the fixing mechanism When the electronic component to be tested is held from the first receiving member, the plurality of holding heads respectively approach the receiving portion, and at least one of the plurality of holding heads holds the tested electronic component and is separated from the receiving portion With the clamping operation 2247-9〇68-PFl; Ahddub 52 13.45063 Revision date ^ ΠΠ 9 O/f •. No. 96132855 f Please modify the scope of the patent operation After this clamping mechanism is secured to the receiving part before the closing Cameroon eagle being tested electronic component holding head from the rest of the receiving portion. The electronic component processing apparatus according to any one of the preceding claims, wherein the holding head has an adsorption means for adsorbing and holding the electronic component to be tested; and the holding head is held in the first In the case of the 7L of the tested electronic component, the adsorption means attracts the tested electronic component in a non-contact state and zooms in. 15. The electronic component processing apparatus of claim 14, wherein the holding head comprises an adsorption nozzle having: a flat front end surface portion affixed to an upper surface of the tested electronic component; and an adsorption port at the front end Opening.

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