1344889 九、發明說明： 【發明所屬之技術領域】 本發明係有關晶圓劈裂機構，尤其關於一種擊錘力量 傳導裝置。 【先前技術】 一般傳統晶體的切割方式有鑽石刀切割、雷射切割與 劈刀切割等方式，其中鑽石刀切割會因為所應用到的晶圓 片的硬度，W於造成洲騎石刀的傷#，而使製造成 本增加；另外，也容易在晶圓片上產生碎屑，使得需要增 力口清洗的流程。而雷射切割的方式’是以高能量的雷射^ 束對晶圓片進行切割，使切割處的材料被融化甚至蒸發， 但也易於在切割後的晶圓片上留 的晶圓片的使㈣。 黑層，而影響切割後 而關於劈刀切割製程，請參閱「圖i、 習知技術的正視示意圖與側視示意圖，其包対一:動， 凡3、一傳導單元6、一擊錘 — m動早 晶圓基座1;該滑動單元m 淋—劈裂單元8與一 5，該滑座5連結設置於該傳導單：二上:四個滑座 元6藉由該滑座5而與該滑執4對=，該傳導單 單元7與該劈裂單元8設置於該傳導單元而該擊錘 該晶圓基座丨設置於該劈裂單元8 的相對側’且 的劈刀切割裝置的作動方式方’而關於此習知 基座1上時’該滑動單元:禮:圓片2置於該晶圓 單元δ接近該晶圓片2，再由該擊早706以供該劈裂 擎錘早凡7對該劈裂單元 5 1344889 - 8實施撞擊，使該劈裂單元8對該晶圓基座1上的該晶圓 片2實施劈裂的動作。 •高科技產業技術進步帶動晶圓片的薄型化發展，而習 , 知技術中單純由該滑動單元3與該傳導單元6提供該劈裂 單元8接近該晶圓片2，再把撞擊力經該劈裂單元8傳達 給薄型化的該晶圓片2，其撞擊力會被該傳導單元6吸收 掉，以此方式產生的該晶圓片2相當容易呈現出鋸齒狀斷 面，甚至沿鋸齒狀斷面在切割後的該晶圓片2更產生出其 ® 他的細微裂紋，這樣的鋸齒狀斷面與細微裂紋對於該晶圓 片2在應用時，具有相當不良的影響，不僅使產品的不良 率升高，更會影響其他電子產業應用時的輸出功率。 4 【發明内容】 _ 爰是，本發明目的在於使切割後的晶圓片不易產生鋸 齒狀斷面，並提高產品良率的一種擊錘力量傳導裝置。 基於上述目的本發明為一種擊錘力量傳導裝置，其供 φ —劈裂單元連結設置，以對置放於一晶圓基座上的一晶圓 片實施劈裂動作，該擊錘力量傳導裝置包含有：一傳導單 元、至少一傳動螺絲與至少一復位單元；該傳導單元包含 有：至少一滑執與至少一滑座，該滑座供該劈裂單元連結 設置，該劈裂單元藉由該滑座在該滑軌上的相對位移而對 該晶圓片實施劈裂動作，該傳動螺絲一端為一螺鎖端並與 ' 該劈裂單元連結設置，而另一端為一限制端，該復位單元 • 與該限制端連結設置，以供該劈裂單元於實施劈裂動作後 的復位動作。 6 1344889 - 藉由上述技術方案，本發明為一種擊錘力量傳導裝 置，其具有下列優點： - 一、本發明為藉由該傳導單元的該滑執與該滑座、該 . 傳動螺絲與該復位單元的結合設置，得以使該劈裂單元在 實施劈裂動作時，形成一個向下的動作幅度，此設計目的 是為經由這樣的設計，使劈裂動作的力量能傳遞集中貫穿 該晶圓片，一方面使該晶圓片的斷裂面能更為平整而非呈 現習知技術產生的鋸齒狀斷面，另一方面是為減少該晶圓 ® 片吸收劈裂動作所產生的震動，而破壞到未切割區域，據 此，更能保護經切割後晶片的完整性。 二、實施本發明實施劈裂動作的同時，更藉由該連接 • 柱與該復位單元配合，以達到控制與調整該劈裂單元的下 , 降幅度，此即能進一步把劈裂動作與相對性的復位動作量 化，以確實精確掌控對其他不同材質晶圓片的實施效果， 減少一再以試誤的作業方式來完成工作任務。 ^ 【實施方式】 茲有關本發明的詳細内容及技術說明，現以實施例來 作進一步說明，但應瞭解的是，該等實施例僅為例示說明 之用，而不應被解釋為本發明實施之限制。 請參閱「圖3-1、3-2、4」所示，為本發明之正視 示意圖、正視局部放大示意圖與側視示意圖，本發明為一 * 種擊錘力量傳導裝置，其供一劈裂單元10連結設置，以對 ， 置放於一晶圓基座20上的一晶圓片30實施劈裂動作，該擊 錘力量傳導裝置包含有：一傳導單元40、至少一傳動螺絲 7 1344889 - 50與至少一復位單元60 ;該傳導單元40包含有：至少一滑 軌41與至少一滑座42，該滑座42供該劈裂單元1〇連結設 Λ 置’該劈裂早元10猎由該滑座42在該滑軌41上的相對位移 .而得以對該晶圓片30實施劈裂動作，該傳導單元40的該滑 座42連結設置於一傳導座70 ’該傳導座7〇上設有至少一擊 錘單元80。 而該傳動螺絲50 —端為一螺鎖端51，另一端為一限制 端52，該限制端52具一膨大的施力部53，該螺鎖端51與該 劈裂早·7〇 10連結設置’由於該设位單元6 〇包含有至少一止 擔部62、至少一彈性元件61與至少一擋塊63，且該擋塊63 上设有該止擋部62與該彈性元件61，該止擋部62為瓶蓋狀 • 且内具一容置空間621，並在該止擋部62上開設一限位孔 ' 622，該止擋部62下設有一開口 623，所以該限位孔622 與該彈性元件61供該傳動螺絲50穿設後，使該止擋部62因 該施力部53的擋設固設於該限制端52，而該彈性元件61經 φ 套設後容設於該容置空間621内’該彈性元件61係為彈 簧。 ‘、 另，該擒塊63連結§又置於該傳導單元4〇，且該擔塊63 貝穿開s又有一穿孔631 ’該穿孔631並供該傳動螺絲穿 設；且該彈性元件61在未實施劈裂動作前的高度高於該止 擒部62’因此該止擔部62在該擒塊63上具有一動作高产 Η，據此，使本發明於實施劈裂動作後，該復位單藉 該傳動螺絲50的傳動’使該彈性單元與該止擋部62在該擔 . 塊63上能夠產生復位動作。1344889 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a wafer splitting mechanism, and more particularly to a hammer strength conducting device. [Prior Art] Generally, the cutting methods of traditional crystals include diamond knife cutting, laser cutting and file cutting. Among them, the diamond knife cutting will cause the injury of the continent riding stone knife because of the hardness of the applied wafer. In addition, the manufacturing cost is increased; in addition, it is easy to generate debris on the wafer, which requires a process of increasing the port cleaning. The laser cutting method is to cut the wafer with a high-energy laser beam, so that the material at the cutting surface is melted or even evaporated, but it is also easy to leave the wafer on the cut wafer. (4). The black layer, which affects the cutting process after the cutting, please refer to "Figure i, the schematic diagram of the conventional technology and the side view, the package of one: move, where 3, a conduction unit 6, a hammer - The first wafer base 1 is connected to the slide unit Pair with the slider 4, the conductive unit 7 and the splitting unit 8 are disposed on the conductive unit and the hammer base is disposed on the opposite side of the splitting unit 8 and the cutting of the file The operation mode of the device is 'on the conventional base 1'. The sliding unit: the wafer 2 is placed on the wafer unit δ close to the wafer 2, and then the early 706 is used for the splitting engine The hammer 7 impacts the splitting unit 5 1344889-8, causing the splitting unit 8 to perform the splitting action on the wafer 2 on the wafer base 1. • The technological advancement of the high-tech industry drives the crystal The thinning of the wafer is developed, and in the prior art, the slit unit 3 and the conductive unit 6 are provided by the sliding unit 3 to approach the wafer 2 The impact force is transmitted to the thinned wafer 2 through the splitting unit 8, and the impact force is absorbed by the conducting unit 6. The wafer 2 produced in this manner is relatively easy to appear jagged. The cross-section, even along the sawtooth section, produces a fine crack in the wafer 2 after cutting, such a serrated section and fine cracks are quite bad for the wafer 2 when applied. The impact of the product not only increases the defect rate of the product, but also affects the output power of other electronic industries. 4 [Invention] The purpose of the present invention is to make the wafer after cutting difficult to produce a sawtooth section. And a hammer power transmission device for improving product yield. Based on the above object, the present invention is a hammer force transmission device for φ-cracking unit connection to be placed on a wafer base The wafer is subjected to a splitting action, and the hammer power transmission device comprises: a conducting unit, at least one driving screw and at least one resetting unit; the conducting unit comprises: at least one sliding handle and at least one sliding seat, The splitting unit is connected to the splitting unit, and the splitting unit performs a splitting action on the wafer by the relative displacement of the sliding seat on the sliding rail, and the driving screw has a screw end at one end and The splitting unit is connected and the other end is a limiting end, and the resetting unit is connected to the limiting end for the resetting action of the splitting unit after the splitting operation. 6 1344889 - With the above technical solution, The present invention is a hammer power transmission device, which has the following advantages: 1. The present invention is configured by the sliding handle of the conductive unit and the sliding seat, the transmission screw and the reset unit. The splitting unit forms a downward action amplitude when performing the splitting action, and the design purpose is to enable the force transmission of the splitting action to pass through the wafer through the design, and the wafer is made on the one hand The fracture surface can be flatter rather than presenting a serrated section produced by conventional techniques, and on the other hand, to reduce the vibration generated by the absorption of the wafer® by the wafer, and destroy the uncut area. Here, the better protection of the integrity of the wafer after dicing. 2. Implementing the splitting action of the present invention, and further, the connecting column and the resetting unit cooperate to control and adjust the lowering and descending amplitude of the splitting unit, thereby further performing the splitting action and the relative Scaling the reset action to accurately control the implementation of other different material wafers, and reduce the number of trial and error operations to complete the task. The embodiments and the technical description of the present invention are further described by way of examples, but it should be understood that the embodiments are for illustrative purposes only and should not be construed as Implementation restrictions. Please refer to FIG. 3-1, 3-2, 4 for a front view, a partial enlarged view and a side view of the present invention. The present invention is a hammer power transmission device for a splitting. The unit 10 is coupled to perform a splitting operation on a wafer 30 disposed on a wafer base 20, the hammer power transmission device comprising: a conducting unit 40, at least one drive screw 7 1344889 - 50 and at least one reset unit 60; the conductive unit 40 includes: at least one slide rail 41 and at least one slide 42 for the splitting unit 1 to be connected to the splitting unit The wafer 30 is cleaved by the relative displacement of the slider 42 on the slide rail 41. The slider 42 of the conductive unit 40 is coupled to a conductive seat 70'. At least one hammer unit 80 is provided thereon. The other end of the transmission screw 50 is a screw end 51, and the other end is a limiting end 52. The limiting end 52 has an enlarged urging portion 53. The screw end 51 is connected to the cleavage. The setting unit 6 includes the at least one stop portion 62, the at least one elastic member 61 and the at least one stopper 63, and the stopper 63 is provided with the stopper portion 62 and the elastic member 61. The stopper portion 62 is in the shape of a bottle cap and has an accommodating space 621 therein, and a limiting hole 622 is defined in the stopping portion 62. The opening portion 623 is provided with an opening 623. 622 and the elastic member 61 are disposed through the transmission screw 50, and the stopper portion 62 is fixed to the limiting end 52 by the urging portion 53, and the elastic member 61 is accommodated by the φ sleeve. In the accommodating space 621, the elastic member 61 is a spring. ', in addition, the block 63 is connected to the conductive unit 4〇, and the load block 63 is opened and has a through hole 631 'the through hole 631 for the transmission screw; and the elastic member 61 is The height before the splitting operation is performed is higher than the stop portion 62'. Therefore, the stop portion 62 has an action high yield on the block 63, thereby making the reset sheet of the present invention after the splitting operation is performed. The transmission of the drive screw 50 causes the elastic unit and the stop 62 to generate a reset action on the support block 63.
SS
iJ44889 •N 其中’該劈裂單元10開設有至少一傳動孔11與一緊迫 孔12 ’該傳動孔11連通該緊迫孔12，其中該傳動孔u供該 螺鎖端51進行螺鎖調整，而該緊迫孔12供一止付螺絲13螺 鎖設置’並由該緊迫孔12的該止付螺絲13對在該傳動孔u 的該傳動螺絲50進行螺鎖緊迫，以藉此對該傳動螺絲5〇進 行固定’且該止付螺絲13與該傳動螺絲5〇間夾設有一制動 元件14。 再請一併參閱「圖2、5」所示，為習知技術側面示 意圖與本發明之實施方式示意圖，由於該傳導座7〇連結設 置於習知技術「圖1」中的一滑動單元3，所以本發明實 施時，使用者將該晶圓片30置放於該晶圓基座2〇後，由該 滑動單元3下降該傳導座70以供該劈裂單元1〇接近該晶圓 片30，再經由該擊錘單元的作動，產生對該劈裂單元⑺ 的撞擊動作，此撞擊動作傳動該傳導單元40，另由於該劈 裂單元10與該滑座42連結，而該滑座42對該滑執41產生相 對位移，因此該劈裂單元10對該晶圓片3〇產生劈裂動作。 由於該傳動螺絲50對該劈裂單元10與該復位單元6〇產生連 結傳動，當該劈裂單元10實施劈裂動作時，會帶動該傳動 螺絲50的該螺鎖端51，進而使該復位單元6〇下降且壓縮該 動作鬲度Η，由於該擋塊63連結設於該傳導單元4〇 ,所以 ^為該復位單元6Q的施力點，故，當劈裂動作使該止撞部 接觸到該擋塊63時，該劈裂單元1〇的劈裂動作便會停 5止0偯然後，再由該彈性元件61的彈性，並藉由該傳動螺絲 傳動锋位動作，使該劈裂單元10得以產生復位動作。 9 且，本發明於實施劈裂動作時的該動作高度H，是由 該螺鎖端51與該傳動孔11的嫘鎖調整該動作高度jj，並經 螺鎖調整後的該傳動螺絲5〇，再以該止付螺絲13經該制動 元件14而在該緊迫孔12中對該螺鎖端51進行緊迫動作，藉 此達到固定該傳動螺絲50的姝果。 據此，本發明藉由該傳導單元40的該滑執41與該滑座 42的設置，使本發明實施時，以其相對位移，而可直接傳 導敲擊力量，減少對該晶圓片30實施劈裂動作的不必要的 破壞，使得本發明產生的撞擊與劈裂動作能達到縮小化與 精確化的目的；另外，該傳導單兀40再藉由該傳動螺絲5〇 與該復位單元6〇的配合設裏，使該劈裂單元10於實施劈裂 動作時，能進一步控制、裯綮該劈裂單元10的下降幅度， 不再單純只是產生劈裂動作’而是能夠把劈裂動作與相對 性的復位動作量化並控制，讓使用者精確掌控對該晶圓片 30的實施效果。 現今高科技產業的經濟妹盈南’而其高度的經濟效益 是來自於各個製造流程具有的两度技術性，其中該晶圓片 30的切割是處於晶圓製造流移的後期階段，所以更加引起 本發明的注意與詳加研究，目的是為避免劈裂動作對該晶 圓片30產生不必要的裂紋戒破壞，而使前期階段的製造生 產流程功齡一簣，並造成製造成本的升高，故，本發明人 就習知切割技術中可茲改良之處，進行研發改良，所以本 發明於實糾，可提供劈料作無位動作的精確控制虚 調整，以達_化製造流•成本降低等效益，更利於產 ^44889 業的技術提升。 惟上述僅為本發明之較佳實施例而已，並非用來限定 本發明實施之範圍。即凡依本發明申請專利範圍所做的均 等變化與修飾，皆為本發明專利範圍所涵蓋。 【圖式簡單說明】 圖1係習知技術的正視示意圖。 圖2係習知技術的側視示意圖。 圖3-1係本發明之一種擊錘力量傳導裝置的正視示意圖。 圖3-2係本發明之一種擊錘力量傳導裝置的正視局部放大 示意圖。 圖4係本發明之一種擊錘力量傳導裝置的側視示意圖。 圖5係本發明之一種擊錘力量傳導裝置的實施方式示意 【主要元件符號說明】 習知：iJ44889 • N wherein the splitting unit 10 is provided with at least one transmission hole 11 and a pressing hole 12 ′, the transmission hole 11 is connected to the pressing hole 12, wherein the transmission hole u is screw-adjusted by the screw end 51, and The pressing hole 12 is screwed to a stop screw 13 and is screwed by the stop screw 13 of the pressing hole 12 to the transmission screw 50 of the transmission hole u, thereby urging the transmission screw 5 The crucible is fixed and a brake element 14 is interposed between the stop screw 13 and the drive screw 5 . Please refer to the schematic diagram of the prior art and the schematic diagram of the embodiment of the present invention. The conductive seat 7 is connected to a sliding unit 3 provided in the prior art "FIG. 1". Therefore, in the implementation of the present invention, after the user places the wafer 30 on the wafer base 2, the sliding unit 3 lowers the conductive seat 70 for the splitting unit 1 to approach the wafer. 30, through the action of the hammer unit, an impact action on the splitting unit (7) is generated, the impact action drives the conductive unit 40, and the chute unit 10 is coupled to the slide 42 and the slide 42 The slide 41 is relatively displaced, so the splitting unit 10 generates a splitting motion on the wafer 3 . Since the transmission screw 50 generates a coupling transmission between the splitting unit 10 and the resetting unit 6〇, when the splitting unit 10 performs the splitting action, the screw end 51 of the transmission screw 50 is driven to further the resetting The unit 6 〇 is lowered and the action 鬲 is compressed. Since the stop 63 is coupled to the conductive unit 4 所以, it is the point of application of the reset unit 6Q, so when the splitting action causes the stop to contact When the block 63 is reached, the splitting action of the splitting unit 1〇 stops for 5 偯 and then, by the elasticity of the elastic member 61, and the drive screw drives the front position to make the split Unit 10 is capable of generating a reset action. 9 , the movement height H of the present invention when the splitting action is performed is the transmission screw 5 that is adjusted by the lock of the screw end 51 and the transmission hole 11 and is adjusted by the screw lock. Then, the stop screw 13 is pressed against the screw end 51 through the brake element 14 in the pressing hole 12, thereby achieving the result of fixing the transmission screw 50. Accordingly, the present invention, by the arrangement of the sliding 41 and the sliding seat 42 of the conducting unit 40, allows the direct displacement of the tapping force and the reduction of the wafer 30 by the relative displacement of the present invention. The unnecessary damage of the cleaving action is performed, so that the impact and splitting action generated by the present invention can be reduced and refined; in addition, the conductive unit 40 is further coupled to the reset unit 6 by the transmission screw 5 When the splitting unit 10 performs the splitting action, the splitting unit 10 can further control and reduce the falling range of the splitting unit 10, and no longer simply generate the splitting action, but can perform the splitting action. The relative reset action is quantized and controlled to give the user precise control over the implementation of the wafer 30. Today's high-tech industry's economic sister Yingnan' and its high economic benefits come from the two technical aspects of each manufacturing process, in which the wafer 30 is cut in the later stage of the wafer manufacturing flow, so more The attention and detailed study of the present invention are directed to avoid unnecessary cracking or damage to the wafer 30 by the splitting action, so that the manufacturing process in the early stage is of a working age and causes a rise in manufacturing cost. Therefore, the present inventors have made research and development improvements in the conventional cutting technology, and therefore the present invention is practically corrected, and can provide a precise control virtual adjustment of the material for the positionless movement to achieve the manufacturing flow. • Benefits such as cost reduction are more conducive to the technical improvement of the production of 4444889. The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing a conventional technique. Figure 2 is a side elevational view of a prior art technique. Figure 3-1 is a front elevational view of a hammer power transmission device of the present invention. Fig. 3-2 is a front elevational, partially enlarged view of a hammer power transmission device of the present invention. Figure 4 is a side elevational view of a hammer power transmission device of the present invention. Figure 5 is a schematic view of an embodiment of a hammer power transmission device of the present invention. [Explanation of main component symbols] Conventional:
1 :晶圓基座 2 :晶圓片 3:滑動單元 4 :滑執 5 :滑座 6 :傳導單元 7:擊錘單元 8 :劈裂單元 本發明： 1344889 10:劈裂單元 1 1 :傳動孔 1 2 :緊迫孔 1 3 :止付螺絲 14:制動元件 2 0 :晶圓基座 3 0 :晶圓片1 : Wafer base 2 : Wafer 3 : Sliding unit 4 : Slipper 5 : Sliding seat 6 : Conducting unit 7 : Hammer unit 8 : Splitting unit The present invention: 1344889 10: Splitting unit 1 1 : Transmission Hole 1 2 : Tight hole 1 3 : Stop screw 14: Brake element 2 0 : Wafer base 3 0 : Wafer
4 0 :傳導單元 4 1 :滑執 4 2 :滑座 5 0 :傳動螺絲 51:螺鎖端 5 2 :限制端 5 3 :施力部4 0 : Conducting unit 4 1 : Slipper 4 2 : Sliding seat 5 0 : Drive screw 51: Screw lock end 5 2 : Limit end 5 3 : Force unit
6 0 :復位單元 6 1 :彈性元件 6 2 :止擋部 6 2 1 :容置空間 6 2 2 :限位孔 6 2 3 :開口 6 3 ·.擋塊 6 3 1 :穿孔 Η:動作高度 7 0 :傳導座 12 1344889 8 Ο :擊錘單元6 0 : Reset unit 6 1 : Elastic element 6 2 : Stop 6 2 1 : accommodating space 6 2 2 : Limit hole 6 2 3 : Opening 6 3 · Stop 6 3 1 : Perforation Η: Action height 7 0 : Conductor seat 12 1344889 8 Ο : hammer unit