TWI344396B - Coating apparatus - Google Patents
Coating apparatus Download PDFInfo
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- TWI344396B TWI344396B TW097109502A TW97109502A TWI344396B TW I344396 B TWI344396 B TW I344396B TW 097109502 A TW097109502 A TW 097109502A TW 97109502 A TW97109502 A TW 97109502A TW I344396 B TWI344396 B TW I344396B
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- Prior art keywords
- coating liquid
- supply
- solvent
- liquid
- organic
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1036—Means for supplying a selected one of a plurality of liquids or other fluent materials, or several in selected proportions, to the applying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1026—Valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- Coating Apparatus (AREA)
- Electroluminescent Light Sources (AREA)
Description
九、發明說明： 【發明所屬之技術領域】 本發明係關於於有機EL顯示裝置用玻璃基板、液晶顯示 裝置用玻璃基板、PDP用玻璃基板、半導體晶圓、磁氣/光 碟用玻璃/陶瓷基板等各種基板之表面塗佈塗佈液的塗佈 裝置。 【先前技術】 於基板之製造步驟中，使用有在基板之上面塗佈各種塗 佈液的塗佈裝置。例如，有機EL顯示裝置之製造步驟中， 使用在有機EL顯示裝置用玻璃基板之上面塗佈有機EL液 的塗佈裝置。先别之塗佈裝置，例如專利文獻^ 2所揭 一、匕括用以向基板上面吐出塗佈液的喷嘴，和用以使喷 嘴與基板相對移動的移動機構。塗佈裝置藉由從噴嘴上形 成之細孔以液柱狀吐出塗佈液，一面持續該塗佈液之吐 出’―面使喷嘴與基板相對移動，將藥液塗佈於基板之上 面。 [專利文獻1]日本特開2〇〇6-192435號公報 [專利文獻2]日本專利第3676263號公報 【發明内容】 [發明所欲解決之問題] 上述之塗佈裝置，從噴嘴開 氣泡等滯留在喷嘴之内部或吐 嘴良好地吐出之情形。特別是 塗佈液從細微的吐出孔吐出之 始吐出塗佈液時，有異物或 出孔而使塗佈液不能夠從噴 ’使如有機EL液般之高粘性 情形’由於喷嘴内部之異物 129782.doc 1344396 《氣泡易引起塗佈液之「堵塞」，且因塗佈液之表面張力 . 易使塗佈液擴散於吐出孔周圍’故於噴嘴之下方形成塗佈 液之良好的液柱有其困難。 又，急峻開始從喷嘴吐出塗佈液之情形，喷嘴之下方該 » 塗佈液之液柱的形狀崩壞，易產生所謂之「溶劑震盪 (S〇lVent Sh〇ck)」，尤其在使用吐出孔之口徑為70 μπι以下 的噴嘴時，於噴嘴之下方形成良好的液柱極其困難。 先前，開始從喷嘴吐出塗佈液時，反覆進行喷嘴之清先 • 肖從喷嘴吐出塗佈液，藉此實現從喷嘴良好地吐出塗：液 之狀態，然而，該等方法，直至良好地吐出塗佈液為止需 要較多時間，且，亦使塗佈液之消耗量增大。 本發明係鑒於上述情形而完成者，其目的在於提供一種 不增加塗佈液之消耗量，能夠從喷嘴迅速而良好地開始吐 出塗佈液、且亦不產生溶劑震盪（s〇lvent sh〇ck)之問題的 塗佈裝置。 [解決問題之技術手段] _ 為解決上述問題，請求項1之發明係一種塗佈裝置，其 係於基板表面塗佈包含被塗佈物質與特定有機溶劑之塗佈 液者，其特徵在於包括：向基板表面吐出上述塗佈液之噴 -嘴、連接於上述噴嘴之配管部、向上述配管部供給上述塗 佈液之塗佈液供給機構、向上述配管部供給上述有機溶叫 之溶劑供給機構、及控制上述塗佈液供給機構與上述溶劑 供給機構之控制機構；上述控制機構實行以下動作：於停 止自上述塗佈液供給機構供給上述塗佈液之狀態下進行自 129782.doc 1344396 上述岭劑供給機構供給上述有機溶劑之溶劑供給動作、上 述溶劑供給動作後，使自上述溶劑供給機構之上述有機溶 劑之供給量逐漸降低’同時逐漸增加自上述塗佈液供給機 構之上述塗佈液之供給量之置換動作、及上述置換動作 後，進行自上述塗佈液供給機構供給上述塗佈液之塗佈液 供給動作。 請求項2之發明，如請求項i之塗佈裝置，其中上述控制[Technical Field] The present invention relates to a glass substrate for an organic EL display device, a glass substrate for a liquid crystal display device, a glass substrate for a PDP, a semiconductor wafer, and a glass/ceramic substrate for a magnetic/disc disk. A coating device for applying a coating liquid to the surface of various substrates. [Prior Art] In the manufacturing step of the substrate, a coating device having various coating liquids applied on the substrate is used. For example, in the manufacturing step of the organic EL display device, a coating device for applying an organic EL liquid on the glass substrate for an organic EL display device is used. Further, a coating apparatus, for example, disclosed in Patent Document 2, discloses a nozzle for discharging a coating liquid onto a substrate, and a moving mechanism for moving the nozzle and the substrate relative to each other. The coating device ejects the coating liquid in a liquid column shape from the pores formed in the nozzle, and the nozzle is moved relative to the substrate while continuing the ejection of the coating liquid, and the chemical solution is applied to the upper surface of the substrate. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. It stays inside the nozzle or the spout is spit out well. In particular, when the coating liquid is discharged from the fine discharge hole, the coating liquid is discharged, and foreign matter or pores are formed, so that the coating liquid cannot be sprayed with a high viscosity as in the case of the organic EL liquid. 129782.doc 1344396 "The bubble is liable to cause "clogging" of the coating liquid, and the surface tension of the coating liquid is easy to spread the coating liquid around the discharge hole. Therefore, a good liquid column for forming a coating liquid under the nozzle is formed. There are difficulties. Further, when the coating liquid is suddenly ejected from the nozzle, the shape of the liquid column of the coating liquid below the nozzle collapses, and so-called "solvent oscillation" is generated, especially when spitting is used. When a nozzle having a hole diameter of 70 μm or less is formed, it is extremely difficult to form a good liquid column below the nozzle. When the coating liquid is discharged from the nozzle, the nozzle is repeatedly discharged. • The coating liquid is discharged from the nozzle, thereby discharging the coating liquid from the nozzle. However, these methods are performed until the liquid is discharged satisfactorily. It takes much time until the coating liquid, and the consumption amount of the coating liquid is also increased. The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a coating liquid which can be quickly and satisfactorily started from a nozzle without increasing the consumption of a coating liquid, and which does not cause solvent shock (snapvent) The coating device for the problem. [Technical means for solving the problem] _ In order to solve the above problem, the invention of claim 1 is a coating apparatus which coats a surface of a substrate with a coating liquid containing a coated substance and a specific organic solvent, and is characterized by including a spray nozzle for discharging the coating liquid onto the surface of the substrate, a piping portion connected to the nozzle, a coating liquid supply mechanism for supplying the coating liquid to the piping portion, and a solvent supply for supplying the organic solvent to the piping portion And a control unit that controls the coating liquid supply unit and the solvent supply unit; and the control unit performs the operation of stopping the supply of the coating liquid from the coating liquid supply unit from 129782.doc 1344396 The sorbent supply means supplies the solvent supply operation of the organic solvent, and after the solvent supply operation, the supply amount of the organic solvent from the solvent supply means is gradually decreased, and the coating liquid from the coating liquid supply means is gradually increased. After the replacement operation of the supply amount and the replacement operation, the coating liquid supply mechanism is performed. Supply operation to the coating liquid of the coating liquid. The invention of claim 2, such as the coating device of claim i, wherein the above control
機構係於上述置換動作中’纟自上述溶劑供給機構之上述 有機溶劑之供給量與自上述塗佈液供給機構之上述塗佈液 之供給量大致相等時，停止自上述有機溶劑供給機構供給 上述有機溶劑。In the above-described replacement operation, when the supply amount of the organic solvent from the solvent supply means is substantially equal to the supply amount of the coating liquid from the coating liquid supply means, the supply is stopped from the organic solvent supply means. Organic solvents.
請求項3之發明，如請求項2之塗佈裝置，其中上述塗佈 液供給機構具有塗佈液用配管與設於上述塗佈液用配管上 之塗佈液用質量流量控制器；上述溶劑供給機構具有溶劑 用配管與設於上述溶劑用配管上之溶劑用質量流量控制 器，上述控制機構藉由控制上述塗佈液用質量流量控制器 及上述溶劑用質量流量控制器實行上述置換動作。° ，求項4之發明，如請求項3之塗佈裝置，其中上述塗佈 匕合作為上述被塗佈物質之有機EL材料。 請求項5之發明，如請求項4之塗佈裝置，其中上述喷嘴 經由具有70叩以下之直經的吐出孔吐出上述塗佈液。 :求項6之發明係一種塗佈裝置，其係於 ::被::物質與特定有機溶劑之塗佈液者，其特徵： .向基板表面吐出上述塗佈液之噴嘴、連接於上述噴 129782.doc 1344396 機構二向上述配管部供給上述塗佈液之塗佈液供給 :二=配管部供給上述有機溶劑之溶劑供給機構、 ==液供給機構與上述溶劑供給機構之控制機 機構供ί 實行以下動作··進行自上述塗佈液供給 誇^ >、量的上述塗佈液與自上述溶劑供給機構供給上 2機溶劑的混合液供給動作、上述混合液供給動作後， 自上述溶劑供給機構之上述有機溶劑之供給量逐漸降 民’同時逐漸增加自上述塗佈液供給機構之上述塗佈液之 供給量的置換動作、及上述置換動作後，進行自上述塗佈 液供給機構供給上述塗佈液之塗佈液供給動作。 [發明效果] 根據請求項卜5之發明，塗佈裝置實行以下動作·於停 ^塗佈液供給機構供給塗佈液之狀態下進行自溶劑供給 機構供給有機溶劑之溶劑供給動作、溶劑供給動作後，使 自溶劑供給機構之有機溶劑之供給量逐漸降低，同時逐漸 增加自塗佈液供給機構之塗佈液之供給量的置換動作、及 置換動作後，進行自塗佈液供給機構供給塗佈液之塗佈液 供給動m，可將滯留於噴嘴内部的異物或氣泡與溶 劑一起排出至噴嘴之外部後，從噴嘴吐出塗佈液。又，由 於將自喷嘴吐出之液體由有機溶劑逐漸置換為塗佈液，故 月匕夠防止因噴嘴吐出之液體之急劇的濃度或粘度變化而使 吐出液柱之形狀崩壞，產生所謂之「溶劑震盪（s〇Went shock)」》因此’能夠從噴嘴良好地開始塗佈液之吐出。 且，由於即使不反覆進行噴嘴之清洗與塗佈液之吐出亦能 129782.doc 夠開始塗佈液之吐出，故可不增加塗佈液之消耗量地迅速 地開始塗佈液之0土出。 特別疋，根據請求項2之發明，塗佈裝置係於置換動作 中，在自溶劑供給機構之有機溶劑之供給量與自塗佈液供 給機構之塗佈液之供給量大致相等時，停止自有機溶劑供 -機構之有機溶劑的供給。故，能夠防止塗佈液進入溶劑 供給機構側。 特別疋，根據請求項3之發明，使用質量流量控制器控 制自塗佈液供給機構之塗佈液之供給量與自溶劑供給機構 之办别之供給量。；^，能夠容易且正確地控制塗佈液及溶 劑之供給量。 特別疋根據凊求項4之發明，能夠適當地自噴嘴吐出 含有有機EL材料之高粘性的塗佈液。 特=是，根據請求項5之發明，喷嘴經由具有7〇㈣以下 之直徑的吐出孔吐出塗佈液。具有該微小直徑之吐出孔的 噴嘴欲良好地形成塗佈液之吐出液柱係非常困難，但根據 本發明能夠良好地形成吐出液柱。 —又，根據請求項6之發明，塗佈裝置實行以下動作：進 行自塗佈液供給機構供於 、·口〆里的塗佈液與自溶劑供給機構 供給有機溶劑的混合液供給動作、混合液供給動作後，使 自溶劑供給機構之有機溶劑之供給量逐漸降低，同時逐漸 增加自塗佈液供給機槿 _之塗佈液之供給量的置換動作、及 置換動作後，進行自塗佈液仏 货，、機構供給塗佈液之塗佈液The invention of claim 2, wherein the coating liquid supply means includes a coating liquid pipe and a mass flow controller for a coating liquid provided on the coating liquid pipe; The supply means includes a solvent pipe and a solvent mass flow controller provided in the solvent pipe, and the control means performs the above-described replacement operation by controlling the coating liquid mass flow controller and the solvent mass flow controller. The invention of claim 4, wherein the coating device cooperates with the organic EL material of the coated material. The invention of claim 5, wherein the nozzle discharges the coating liquid through a discharge port having a straight diameter of 70 Å or less. The invention of claim 6 is a coating apparatus which is characterized in that: a coating liquid of a substance and a specific organic solvent, characterized in that: a nozzle for discharging the coating liquid onto the surface of the substrate, and being connected to the spray 129782.doc 1344396 The mechanism 2 supplies the coating liquid supply to the above-mentioned piping liquid to the piping unit: two = a solvent supply mechanism for supplying the organic solvent to the piping portion, a == liquid supply mechanism, and a control mechanism for the solvent supply mechanism. The following operation is performed: the supply liquid is supplied from the coating liquid, and the mixed liquid supply operation of the above-mentioned solvent supply from the solvent supply means and the mixed liquid supply operation are performed, and the solvent is supplied from the solvent. The supply amount of the organic solvent in the supply means is gradually reduced, and the replacement operation of the supply amount of the coating liquid from the coating liquid supply means is gradually increased, and the replacement operation is performed, and the supply is supplied from the coating liquid supply means. The coating liquid of the coating liquid is supplied to the operation. [Effect of the Invention] According to the invention of claim 5, the coating apparatus performs the following operations: a solvent supply operation for supplying an organic solvent from the solvent supply means and a solvent supply operation in a state where the coating liquid supply means supplies the coating liquid. After that, the supply amount of the organic solvent from the solvent supply means is gradually decreased, and the replacement operation and the replacement operation of the supply amount of the coating liquid from the coating liquid supply means are gradually increased, and then the coating liquid supply means is applied. The coating liquid of the cloth liquid is supplied to move m, and the foreign matter or the air bubbles remaining in the nozzle can be discharged to the outside of the nozzle together with the solvent, and then the coating liquid is discharged from the nozzle. Further, since the liquid discharged from the nozzle is gradually replaced with the coating liquid by the organic solvent, it is possible to prevent the shape of the discharge liquid column from collapsing due to a sharp concentration or viscosity change of the liquid discharged from the nozzle, and so-called " Therefore, the solvent swells (s〇Went shock)"" can therefore start the discharge of the coating liquid well from the nozzle. Further, even if the nozzle cleaning and the discharge of the coating liquid are not repeated, the discharge of the coating liquid can be started. Therefore, the 0-out of the coating liquid can be quickly started without increasing the consumption of the coating liquid. In particular, according to the invention of claim 2, the coating apparatus is in the replacement operation, and the supply amount of the organic solvent from the solvent supply means is substantially equal to the supply amount of the coating liquid from the coating liquid supply means, and the self-stopping operation is stopped. Organic solvent supply - supply of organic solvent to the mechanism. Therefore, it is possible to prevent the coating liquid from entering the solvent supply mechanism side. In particular, according to the invention of claim 3, the mass flow controller is used to control the supply amount of the coating liquid from the coating liquid supply mechanism and the supply amount from the solvent supply mechanism. ^, the supply amount of the coating liquid and the solvent can be easily and accurately controlled. In particular, according to the invention of claim 4, it is possible to appropriately eject a highly viscous coating liquid containing an organic EL material from a nozzle. According to the invention of claim 5, the nozzle discharges the coating liquid through a discharge port having a diameter of 7 inches or less. It is extremely difficult for the nozzle having the discharge hole having the minute diameter to form the discharge liquid column of the coating liquid satisfactorily. However, according to the present invention, the discharge liquid column can be favorably formed. Further, according to the invention of claim 6, the coating apparatus performs the operation of supplying and mixing the liquid mixture supplied from the coating liquid supply means and the liquid supply from the solvent supply means to the organic solvent. After the liquid supply operation, the supply amount of the organic solvent from the solvent supply means is gradually decreased, and the replacement operation and the replacement operation of the supply amount of the coating liquid from the coating liquid supply device are gradually increased, and then the self-coating is performed. Liquid sputum, and coating liquid for coating liquid
供、，口動作。故，可將、，黑gg认A I ';噴嘴内部的異物或氣泡與溶劑 129782.doc 起排出至喷嘴之外部後，從噴嘴吐出塗佈液。又，由於 將自噴嘴吐出之液體由有機溶劑逐漸置換為塗佈液，故能 。方止因噴嘴吐出之液體之急劇的濃度或粘度變化而使吐 出液柱之形狀崩壞，產生所謂之「溶劑震盪（solvent h〇Ck)」°因此’能夠從喷嘴良好地開始塗佈液之吐出。 且由於即使不反覆進行喷嘴之清洗與塗佈液之吐出亦能 夠開始塗佈液之吐出’故可不增加塗佈液之消耗量地迅速 開始塗佈液之σ土出。 【實施方式】 以下’對本發明之較佳實施形態一面參照圖式進行說 明。 <:l.塗佈裝置之構成> 圖1係顯示本發明之一實施形態之塗佈裝置1之構成的上 視圖。又’圖2係將塗佈裝置1按圖ΐ2Η_π線切斷之縱剖 面圖。該等各圖中為使裝置内之各部之位置關係或動作方 向明確化’賦與共通之ΧΥΖ直角坐標系。 圖1及圖2所示之塗佈裝置丨係於製造有機el顯示裝置之 步驟中’用以於矩形玻璃基板（以下簡稱「基板」）9之上面 塗佈有機EL材料（被塗佈材料）與特定溶劑混合之有機el液 的裝置。如圖1及圊2所示，塗佈裝置1主要具有基台1〇、 基台移動機構20、噴嘴部30、喷嘴移動機構40、待機容器 50、回收盤60、控制部70。 基台10具有平板狀之外形，係用以於其上面將基板9以 水平姿勢載置並保持之保持部。基台10之上面形成有複數 129782.doc 11 1344396 之吸引孔（圖示省略）。由此，於基台丨0上載置基板9後，藉 由吸引孔之吸引壓使基板9固定保持於基台I 〇之上面。基 台10上載置之基板9之上面，於塗佈有機EL液之位置預先 形成有多條平行的槽9a ^基板9以該等槽9a朝向主掃描方 向（X軸方向）之方式載置於基台1〇上。Supply, mouth action. Therefore, the black gg can be recognized as A I '; the foreign matter or bubbles inside the nozzle and the solvent 129782.doc are discharged to the outside of the nozzle, and the coating liquid is discharged from the nozzle. Further, since the liquid discharged from the nozzle is gradually replaced with the organic solvent to the coating liquid, it can be used. The shape of the discharge liquid column is collapsed due to a sharp concentration or viscosity change of the liquid discharged from the nozzle, and so-called "solvent h〇Ck" is generated. Therefore, the coating liquid can be started well from the nozzle. Spit out. Further, since the discharge of the coating liquid can be started even if the cleaning of the nozzle and the discharge of the coating liquid are not repeated, the σ soil of the coating liquid can be quickly started without increasing the consumption of the coating liquid. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. <:1. Configuration of Coating Apparatus> Fig. 1 is a top view showing the configuration of a coating apparatus 1 according to an embodiment of the present invention. Further, Fig. 2 is a longitudinal sectional view showing the coating apparatus 1 cut along the line Η 2 Η π. In each of these figures, the positional relationship or the direction of the operation of each part in the apparatus is clarified, and the common rectangular coordinate system is assigned. The coating apparatus shown in FIGS. 1 and 2 is used for coating an organic EL material (coated material) on a rectangular glass substrate (hereinafter referred to as "substrate") 9 in the step of manufacturing an organic EL display device. A device for mixing an organic liquid with a specific solvent. As shown in Figs. 1 and 2, the coating apparatus 1 mainly includes a base 1A, a base moving mechanism 20, a nozzle unit 30, a nozzle moving mechanism 40, a standby container 50, a recovery tray 60, and a control unit 70. The base 10 has a flat outer shape and is a holding portion on which the substrate 9 is placed and held in a horizontal posture. A suction hole (not shown) of a plurality of 129782.doc 11 1344396 is formed on the base 10 . Thereby, after the substrate 9 is placed on the base 丨0, the substrate 9 is fixedly held on the upper surface of the base I by the suction pressure of the suction holes. On the upper surface of the substrate 9 placed on the base 10, a plurality of parallel grooves 9a are formed in advance at a position where the organic EL liquid is applied. The substrate 9 is placed in such a manner that the grooves 9a face the main scanning direction (X-axis direction). The abutment is on the top.
又，基台10之上方配置有遮蓋基板9之·χ側及+χ側之側 部的遮罩板11、12。遮罩板U、12係防止後述之自喷嘴部 30吐出之有機EL液塗佈於基板9之+χ側及_\側之側部，具 有規定有關主掃描方向之有機EL液之塗佈範圍的作用。遮 罩板11、12經由特定之連接構件（圖示省略）固定安裝於基 台 10。 土Further, above the base 10, mask plates 11 and 12 which cover the side of the substrate 9 and the side of the +χ side are disposed. The mask sheets U and 12 prevent the organic EL liquid discharged from the nozzle unit 30, which will be described later, from being applied to the side portions of the substrate 9 on the +χ side and the _\ side, and have a coating range for specifying the organic EL liquid in the main scanning direction. The role. The mask plates 11, 12 are fixedly mounted to the base 10 via specific connecting members (not shown). earth
基台移動機構20係用以使基台1〇向副掃描方向軸方 向）移動之機構基台移動機構2 0，例如由電動機與滾珠 螺桿組合之機構或利用線性馬達之機構而構成。於基台W 上載置有基板9之狀態下使基台移動機構2〇動作，基台 1〇、遮罩板11、12以及基板9成—體向副掃描方向移動。 喷嘴部3G係用於向保持於基台1()上之基板9之上面吐出 有機EL液的吐出部。喷嘴部3()具有用以吐出紅色用、綠色 用、-以及藍色用之有機肛液之3個喷嘴31。3個喷嘴Η如圖 1所示’沿主掃描方向以一定間隔（例如數職間距）排列， 且副掃描方向之位置亦略微錯開配置。關於各喷嘴31之副 掃描方向之位置的不同係與處理對象之基板9上面所形成 的槽9a的間距寬相對應。…喷嘴部3〇藉由從3個噴嘴 31同時吐出有機EL液’對於基板9上之鄰接的3個槽％能夠 129782.doc 12 1344396 同時吐出有機EL液。 如此，該塗佈裝置1能夠使用3個喷嘴3 1於基板9上以3列 —組塗佈有機EL·液。由此可以於基板9之上面高效率地塗 佈有機EL液。又’藉由使3個喷嘴31於主掃描方向及副掃 描方向之位置皆不同’無須使各噴嘴3丨本體極端地小型 化’便能夠以狹小之間隔塗佈有機EL液。 圖3係顯示包含於噴嘴部3〇之3個喷嘴3 i中的H固喷嘴 31、及與該噴嘴31連接之送液系統8〇之構成之圖。如圖3 所示，喷嘴31具有喷嘴體3 la、於噴嘴體31a之下端部形成 之微小的（例如其孔徑為1〇 μηι以上、7〇 μ〇ι以下）吐出孔 3lb。又’喷嘴31之内部形成有與吐出孔31b及後述主配管 81連通之送液路（圖示省略）。 噴嘴3 1連接有1根主配管$ 1。且，主配管$ 1經由τ字形混 δ P82與有機el液供給用配管83及主溶劑供給用配管84連 接。有機EL液供給用配管83之上游侧之端部，連接有供給 將有機EL材料與溶劑按一定比例混合之有機EL液的有機 EL液供給源85。且，有機EL液供給用配管83之路徑中 途，介插有質量流量控制器83a與開關閥83b。另一方面，The base moving mechanism 20 is a mechanism base moving mechanism 20 for moving the base 1 in the sub-scanning direction, for example, a mechanism in which a motor and a ball screw are combined, or a mechanism using a linear motor. The base moving mechanism 2 is operated in a state where the substrate 9 is placed on the base W, and the base 1 , the mask plates 11 and 12, and the substrate 9 are moved in the sub-scanning direction. The nozzle portion 3G is a discharge portion for discharging the organic EL liquid onto the substrate 9 held on the base 1 (). The nozzle unit 3 () has three nozzles 31 for discharging organic anal liquid for red, green, and blue. The three nozzles are arranged at regular intervals along the main scanning direction as shown in FIG. The job spacing is arranged, and the position of the sub-scanning direction is also slightly staggered. The difference in the position of the sub-scanning direction of each of the nozzles 31 corresponds to the width of the groove 9a formed on the upper surface of the substrate 9 to be processed. The nozzle portion 3 吐 can simultaneously eject the organic EL liquid from the three nozzles 31. The organic EL liquid can be simultaneously discharged from the adjacent three groove % on the substrate 9 by 129782.doc 12 1344396. As described above, the coating apparatus 1 can apply the organic EL liquid to the substrate 9 in three rows using three nozzles 31. Thereby, the organic EL liquid can be efficiently applied on the upper surface of the substrate 9. Further, by making the positions of the three nozzles 31 different in the main scanning direction and the sub-scanning direction, it is possible to apply the organic EL liquid at a narrow interval without making the nozzles 3 丨 main body extremely small. Fig. 3 is a view showing the configuration of the H-solid nozzle 31 included in the three nozzles 3 i of the nozzle unit 3 and the liquid supply system 8 connected to the nozzle 31. As shown in Fig. 3, the nozzle 31 has a nozzle body 3 la and a minute (for example, a hole diameter of 1 〇 μη or more and 7 〇 μ〇 or less) formed in the lower end portion of the nozzle body 31a. Further, inside the nozzle 31, a liquid supply path (not shown) that communicates with the discharge hole 31b and a main pipe 81 to be described later is formed. The nozzle 31 is connected to one main pipe $1. Further, the main pipe $1 is connected to the organic EL liquid supply pipe 83 and the main solvent supply pipe 84 via the τ-shaped mixed δ P82. An organic EL liquid supply source 85 for supplying an organic EL liquid in which an organic EL material and a solvent are mixed in a predetermined ratio is connected to an end portion on the upstream side of the organic EL liquid supply pipe 83. Further, a mass flow controller 83a and an on-off valve 83b are interposed in the middle of the path of the organic EL supply pipe 83. on the other hand,
主溶劑供給用配管84之上游側之端部，連接有供給有機EL 液之溶劑成分其中一種之主溶劑的主溶劑供給源86。且， 主溶劑供給用配管84之路徑中途，介插有質量流量控制器 84a與開_ 84b。另外，作為主溶劑供給源％所供給之主 溶劑，例如可以使用常溫下具有高揮發性的1，3,5·三曱基 苯、苯曱_等。 129782.doc •13· 1344396 於此送液系統80， 開放開關閥83b，從有機EL液供給 源85經由有機EL液供給用配管83及混合部82向主配管81供 給有機EL液。又，開放開關閥83b之同時對質量流量控制 器83&進行控制，則有機EL液供給源85向主配管81供給之 有機EL液之母單位時間的供給量亦受到控制。 另一方面，上述送液系統8〇中，一開放開關閥84b，從 主溶劑供給源86經由主溶劑供給用配管84及混合部82向主 配管81供給主溶劑。又’開放開關閥^朴之同時對質量流A main solvent supply source 86 that supplies a main solvent of one of the solvent components of the organic EL liquid is connected to the upstream side of the main solvent supply pipe 84. Further, a mass flow controller 84a and an opening_84b are interposed in the middle of the path of the main solvent supply pipe 84. In addition, as the main solvent supplied to the main solvent supply source %, for example, 1,3,5·trimethylbenzene or benzoquinone having high volatility at normal temperature can be used. 129782.doc • 13· 1344396 In the liquid feeding system 80, the opening and closing valve 83b is opened, and the organic EL liquid is supplied from the organic EL liquid supply source 85 to the main pipe 81 via the organic EL liquid supply pipe 83 and the mixing unit 82. When the mass flow controller 83 & is controlled while the on-off valve 83b is opened, the supply amount of the organic EL liquid supplied to the main pipe 81 by the organic EL liquid supply source 85 is also controlled. On the other hand, in the liquid supply system 8A, the main opening/closing valve 84b supplies the main solvent from the main solvent supply source 86 to the main pipe 81 via the main solvent supply pipe 84 and the mixing unit 82. And 'open the switch valve ^ Park's simultaneous mass flow
量控制器84a進行控制，則主溶劑供給源86向主配管81供 給之主溶劑之每單位時間的供給量亦受到控制。 即，本實施形態之送液系統8〇具有用以向主配管81供給 有機EL液之供給系統與用以向主配管8丨供給主溶劑之供給 系統，藉由控制開關閥83b、84b之開關狀態，能夠從該等 供給系統向主配管81選擇性地或同時供給有機EL&及主溶 劑。又，本實施形態之送液系統8〇，藉由將開關閥83b、When the amount controller 84a performs control, the supply amount per unit time of the main solvent supplied from the main solvent supply source 86 to the main pipe 81 is also controlled. That is, the liquid supply system 8A of the present embodiment has a supply system for supplying the organic EL liquid to the main pipe 81 and a supply system for supplying the main solvent to the main pipe 8丨, and the switches of the switching valves 83b and 84b are controlled. In a state, the organic EL& and the main solvent can be selectively or simultaneously supplied to the main pipe 81 from the supply systems. Further, in the liquid supply system 8A of the present embodiment, the on-off valve 83b,
84b同開放之狀態下控制質量流量控制器83a、84a，能 夠在調節有機EL液與主溶劑之比例的同時，將該等混合液 供給至主配管81。 供給至主配管81之有機EL液、主溶劑、或該等混合液從 主配管81導入喷嘴31之内部的送液路，從噴嘴31之下端部 的吐出孔3 lb向下方吐出。依據後述之吐出開始動作開始 有機EL液之吐出時，從喷嘴31之吐出孔31b吐出之有機EL 液於喷嘴31之下方形成液柱！^。另外，圖3係就丨個噴嘴3ι 與其送液系統80進行了說明’但喷嘴部3 〇所包含之其他之 ^29782.doc -14- 同的送液系統80 ^ 噴嘴31亦皆連接有相 ，回至圖1及圖2,繼續塗佈裝置1之說明。 、嘴移動機構4G係用以使喷嘴部3()向主掃描方向移動之 機構如圖1所不，噴嘴移動機構40具有用以支持喷嘴部 立之支持。P41與用以使支持部41向主掃描方向移動之移動 移動β 42 ’例如由電動機與滚珠螺桿組合之機構或 =用線ft馬達之機構而構成。喷嘴移動機構4吼夠於待機 谷器50之上方位置與基台1〇之+又側所配置之回收盤之上 方位置之間的任意位置間，使噴嘴部3〇向主掃描方向移 動0 待機谷器50係於基$1〇2_χ側之側方，用於使噴嘴部3〇 待機之部位。待機容器5〇上形成有用以收容喷嘴部之各 噴嘴3 1之下端部的3個開口部5丨。使喷嘴部3〇待機時，將 噴嘴部30配置於待機容器5〇之上方位置，使待機容器5〇上 升等將各喷嘴31之下端部收容於各開口部51内。於待機容 器50之内部設置有用以回收待機時各喷嘴31吐出之有機el 液、主溶劑、或該等混合液的回收機構。 回收盤60係於基台1〇之+χ侧及_χ側之側方，用以回收 從喷嘴部30吐出之有機El液的容器。回收盤60於基台1〇 之-X側（基台10與待機容器50之間）及基台10之+X側，配置 於喷嘴部30之移動路徑下方的位置。又，回收盤60於主掃 描方向上與上述遮罩板11、12部分重複配置。由此，於基 台10之側方從喷嘴部30吐出之有機EL液藉由遮罩板11、12 及回收盤6〇被連續回收。 129782.doc 15 控制部70係用以動作 下控制塗佈裝置1内之各部之處理 #。圖4係顯示控制部7 丨70與塗佈裝置1内之各部之間的連接 構成的方塊圖。如圖4 所不，控制部70與上述基台移動機 籌2〇、噴嘴移動機構4〇、待機容㈣、質量流量控 :a、84a以及開關間…外電性連接，控制其等之動 控制部70由例如具有cpu及記憶體的電腦等構成，依 照電腦上安裝之程式及用戶之操作輸人使電腦動作，進行 上述各部之動作控制。 <2.塗佈裝置之動作> <2-1.吐出開始時之動作〉 其後，對上述塗佈裝置丨之開始有機£1液之吐出時之動 作’參照圖5之流程圖及圖6之圖表進行說明。圖6之圖表 中，附有□記號之折線表示從有機£1^液供給源85經由有機 EL液用酉己管83向主配管81供給之有機肛液之流量，附有〇 記號之折線表示從主溶劑供給源％經由主溶劑供給用配管 84向主配管8 1供給之主溶劑之流量。另外，以下說明之動 作係如塗佈裝置1之啟動後等開始有機EL液之吐出時，於 將喷嘴部30之各喷嘴3 1收納於待機容器5〇之各開口部5丨之 狀態下使各喷嘴3 1實行之動作。又，以下之吐出開始動作 中，質量流量控制器83a、84a以及開關閥83b、84b按照上 述控制部70之指令動作。 於該塗佈裝置1進行有機EL液之吐出時，首先於關閉開 關閥83b之狀態下開放開關閥84b。藉此，從主溶劑供給源 86經由主溶劑供給用配管84、混合部82、及主配管8 1向喷 129782.doc -16- 1344396 嘴3 1供給主溶劑，從噴嘴3丨之吐出孔3 lb向下方吐出主溶 劑（圖5 :步驟S1 ’圖6:時刻u〜t2)e此時，質量流量控制 器84a預先設定於特定之開度，供給與其開度相應之流量 Fa之主溶劑。 從主溶劑供給源86供給之主溶劑由於未包含有機elm 料，故液體之粘性較低。因此，主溶劑從噴嘴31之吐出孔 31b流暢吐出，於喷嘴31之下方形成液柱又，藉由主溶 劑之吐出，滯留於吐出孔31b或喷嘴31内部的送液路中的 異物或氣泡等與主溶劑一起被排出喷嘴3丨之外部，排除成 為吐出阻力之該等物質。 其後，塗佈裝置1於質量流量控制器83a之設定流量最小 化之狀態下開放開關閥83b。之後，藉由將質量流量控制 器84a之設定流量逐漸降低，同時逐漸增加質量流量控制 器83a之設定流量，使向主配管81供給之混合液中之有機 EL液的比例逐漸增加。即，逐漸降低從主溶劑供給源％供 給之主溶劑的量，同時逐漸增加從有機£]^液供給源85供給 之有機EL液的量（圖5 :步驟S2，圖6 :時刻t2〜t3)。由此， 從喷嘴3丨吐出之混合液t的有機料之濃度逐漸升高， 混合液之粘性亦逐漸升高。 本實施形態之步驟S2中係控制質量流量控制器83a、 84a，使從主溶劑供給源86供給之主溶劑之流量的降低量 與從有機EL液供給源85供給之有機EL液之流量的增加量 經常相等’使該等合計流量經常維持在Fa。因此，從主溶 劑供給源86供給之主溶劑之流量與從有機EL&供給源以供 129782.doc •17- 1344396 給之有機EL液之流量幾乎於時刻t3皆成為Fa/2。如此，藉 由使向主配管8 1供給之主溶劑及有機EL液之合計流量維持 在一定值Fa，主配管81内液體之流壓維持均一。故，於主 配管81内之液體中不會在局部有有機EL材料成塊狀析出。 另外，圖6之時刻t2〜t3 ,分別使主溶劑之供給量與有機 EL液之供給量連續變化（即，使質量流量控制器83a、8飩 之設定流量連續變化）’但亦可分別使主溶劑之供給量與 有機EL液之供給量階段性變化。 • 時刻t3中’從主溶劑供給源86供給之主溶劑之流量與從 有機EL液供給源85供給之有機EL液之流量皆成為以/2時， 塗佈裝置1關閉開關閥84b停止供給主溶劑，同時一 口氣增 加質量流量控制器83a之設定流量至Fa(圖5 :步驟S3，圖 6 :時刻t3)。由此，成為僅有機EL液供給源85供給之流量 Fa之有機EL液於主配管81中流動之狀態。 本實施形態之步驟S3中，係如此於從主溶劑供給源86供 給之主溶劑之流量與從有機EL液供給源8 5供給之有機el • 液之流量大致相等時，使主溶劑之供給停止，同時一口氣 增加有機EL液之流量。其原因為，將開關閥83b、8仆皆開 放之狀態下，由於主溶劑側之流壓較有機£[液側之流壓小 - 時，有從有機EL液用配管83供給之有機EL液進入主溶劑 用配管84内之虞’故為防止該有機el液之進入所故。 又，本實施形態之步驟S3中，停止主溶劑之供給，同時 增加有機EL液之流量至Fa，其係為將向主配管81供給之液 體的流壓維持一定’防止有機EL材料之析出。 129782.doc •18· 1344396 之後’塗佈裝置1使質量流量控制器83a之設定流量缓慢 從Fa降低至最終目標值Fb(圖5 :步驟S4，圖6 :時刻 t4~t5)。例如，若上述步驟S2(t2〜t3)花費5分鐘左右，該步 驟S4 (t4〜t5)將花費其2倍時間之10分鐘左右，使有機£1^液 之流量降低。藉由花費該等時間降低有機EL液之流量，能 夠防止主配管81内急劇之流壓的變動。 根據以上動作’有機EL液從喷嘴31之吐出孔31b形成良 好形狀之液柱L，同時被吐出。 _ 如此’本實施形態之塗佈裝置1，首先，從噴嘴31僅吐 出主〉谷劑’之後’逐漸增加有機El液之比例，同時逐漸降 低主溶劑的比例，最終從喷嘴3丨僅吐出有機E]L液。因此， 能夠於將滯留於喷嘴3 1之内部的異物或氣泡與主溶劑一起 排出至噴嘴31之外部後，進行有機丑1液的吐出。故，能夠 從喷嘴3 1良好地開始吐出有機el液。又，由於即使不反覆 進行喷嘴3 1之清洗與有機el液之吐出亦可以開始有機el 液之吐出’故可不增加有機EL液之消耗量地迅速開始有機 EL液之吐出。 尤其，本實施形態之塗佈裝置1，無需換接與喷嘴31連 接之配管，藉由開關閥83b、84b之開關，即可轉換向喷嘴 ， 3 1之主溶劑之供給與有機EL液之供給。因此，能夠防止噴 嘴3 1之内部有新的異物或氣泡混入。 又’本實施形態之塗佈裝置1藉由逐漸降低主溶劑供給 源86之主溶劑之供給量’逐漸增加有機EL液供給源85之有 機EL液之供給量，將從喷嘴3 1吐出之液體由主溶劑逐漸置 129782.doc -19- 1344396 換成有機EL液。因此，能夠防止由於喷嘴吐出之液體其濃 度或枯度發生急劇變化而損壞吐出液柱L之形狀，產生所 έ胃之「溶劑震盪（s〇ivent shock)」。且，由於使有機EL材料 之濃度緩慢變化，即使有機EL材料由低分子化合物構成之 情形，亦不會由於濃度急劇變化而產生有機EL液凝膠化等 之問題。 <2·2.塗佈處理動作> 其後，對上述塗佈裝置丨中之於基板9上面塗佈有機EL液 時的動作，一面參照圖7的流程圖進行說明。另外，於以 下說明之塗佈處理開始之時點，已完成上述2_丨說明之有 機EL液之吐出開始動作，於待機容器5〇内，從喷嘴部3〇之 各喷嘴31以液柱狀良好地吐出有機el液。 該塗佈裝置I進行基板9之塗佈處理時，首先，於基台1〇 之上面載置基板9(步驟S5)。基板9以其上面形成之複數的 槽9a朝向主掃描方向之方式安裝於基台1〇上。又，基台移 動機構20使基台10移動，以使基板9上最+γ側之3條槽％位 於喷嘴部30之掃描區域之下方之方式調整基板9之位置。 其次，塗佈裝置1將待機容器5〇降下等，使待機容器5〇 從噴嘴31分離，並且，藉由使噴嘴移動機構4〇動作，將喷 嘴部30向+X側移動。噴嘴部3〇’ 一面自各噴嘴31吐出有機 EL液，一面向+X側移動，於基板9上最+γ側之3條槽上 塗佈有機EL液。另外，噴嘴部3〇之移動中途所吐出之有機 EL液之一部分落下至回收盤6〇或遮罩板丨丨、12之上面被回 收0 129782.doc •20· 噴嘴部30移動至+X側之遮罩板12之上面時，其後，塗 佈裝置1藉由使基台移動機構2〇動作，使基台1〇向+γ側移 動3個喷嘴31之塗佈寬度（即槽9&之3行寬度）。之後，繼續 從噴嘴3 1吐出有機EL液，同時使喷嘴部3〇向-X側移動。由 此’於基板9上之下3條槽9a上塗佈有機EL液。 如此’塗佈裝置1 一邊使基板9向副掃描方向移動噴嘴部 30之塗佈寬度分’一邊以一定次數反覆向主掃描方向塗佈 有機EL液，於基板9上之全部槽9a上塗佈有機£[液（步驟 S6) 〇 於基板9上之全部槽9a塗佈有機EL液時，塗佈裝置1使噴 嘴移動機構40進一步動作’使喷嘴部3 〇移動至待機容器5〇 之上方位置。噴嘴部30移動至待機容器5〇之上方位置時， 塗佈裝置1使待機容器50上升等，將各喷嘴31之下端部收 納於待機容器50之各開口部5丨的内部。之後，將塗佈處理 後之基板9從基台1〇搬出（步驟S7)，至此對一個基板9之有 機EL液的塗佈處理完成。 <3.變形例> 以上，對本發明之一實施形態進行說明，但本發明並非 限定於上述所舉之例。例如，上述之例中於塗佈裝置i之 噴嘴部30安裝有3個喷嘴31，然而於噴嘴部31安裝之喷嘴 數可以為1個或2個，亦可以為4個以上◊又，上述塗佈裝 置1為吐出紅色用、綠色用、及藍色用之有機EL液備有3個 喷嘴31，然而本發明之塗佈裝置亦可為從複數之噴嘴η吐 出單色之有機EL液。 129782.doc -21 - 1344396 又，上述之例中為調節有機EL液及主溶劑之供給量，使 用了質量流量控制器83a、84a，然而使用其它的流量調節 機構調節有機EL液及主溶劑之供給量亦可。例如，作為質 量流量控制器83a、84a之代替物，亦可使用無安裝流量感 測器的流調閥。When the 84b is controlled to open, the mass flow controllers 83a and 84a are capable of supplying the mixed liquid to the main pipe 81 while adjusting the ratio of the organic EL liquid to the main solvent. The organic EL liquid, the main solvent, or the mixed liquid supplied to the main pipe 81 is introduced into the liquid supply path inside the nozzle 31 from the main pipe 81, and is discharged downward from the discharge hole 3 lb at the lower end of the nozzle 31. When the discharge of the organic EL liquid is started in accordance with the discharge start operation described later, the organic EL liquid discharged from the discharge hole 31b of the nozzle 31 forms a liquid column below the nozzle 31! ^. In addition, in Fig. 3, the nozzles 3i are described with respect to the liquid supply system 80, but the other liquid supply system 80^ nozzles included in the nozzle unit 3 are also connected to each other. Returning to Figures 1 and 2, the description of the coating apparatus 1 is continued. The nozzle moving mechanism 4G is a mechanism for moving the nozzle portion 3 () in the main scanning direction as shown in Fig. 1. The nozzle moving mechanism 40 has support for supporting the nozzle portion. The movement of P41 and the movement of the support portion 41 in the main scanning direction is performed, for example, by a mechanism in which a motor and a ball screw are combined, or a mechanism in which a wire ft motor is used. The nozzle moving mechanism 4 is moved between the position above the standby valley 50 and the position above the recovery tray disposed on the + side of the base 1 and the nozzle portion 3 is moved to the main scanning direction by 0. The barn 50 is attached to the side of the base $1〇2_χ side, and is used to make the nozzle portion 3 stand by. Three opening portions 5A for accommodating the lower end portions of the nozzles 3 1 of the nozzle portion are formed in the standby container 5A. When the nozzle unit 3 is in standby, the nozzle unit 30 is placed above the standby container 5, and the lower end of each nozzle 31 is housed in each of the openings 51 by raising the standby container 5A. A recovery mechanism for recovering the organic EL liquid, the main solvent, or the mixed liquid discharged from each nozzle 31 during standby is provided inside the standby container 50. The recovery tray 60 is a container for collecting the organic E liquid discharged from the nozzle unit 30 on the side of the base 1 side and the side of the χ side. The recovery tray 60 is disposed on the -X side of the base 1 (between the base 10 and the standby container 50) and the +X side of the base 10, and is disposed at a position below the movement path of the nozzle unit 30. Further, the recovery tray 60 is repeatedly disposed in the main scanning direction with the mask plates 11 and 12 described above. Thereby, the organic EL liquid discharged from the nozzle unit 30 on the side of the base 10 is continuously recovered by the mask sheets 11 and 12 and the recovery tray 6〇. 129782.doc 15 The control unit 70 is used to control the processing of each part in the coating device 1 under operation. Fig. 4 is a block diagram showing the configuration of the connection between the control unit 7 丨 70 and each part in the coating device 1. As shown in Fig. 4, the control unit 70 is electrically connected to the base moving machine, the nozzle moving mechanism 4, the standby capacity (4), the mass flow control: a, 84a, and the switch, and controls the dynamic control thereof. The unit 70 is constituted by, for example, a computer having a CPU and a memory, and operates the computer in accordance with a program installed on the computer and a user's operation, and performs operation control of each of the above units. <2. Operation of Coating Apparatus><2-1. Operation at the Start of Discharge> Thereafter, the operation of discharging the organic liquid at the start of the coating apparatus '" And the graph of Fig. 6 is explained. In the graph of Fig. 6, the broken line with the □ mark indicates the flow rate of the organic anal liquid supplied from the organic solvent supply source 85 to the main pipe 81 via the organic EL liquid 酉 pipe 83, and the broken line with the 〇 mark indicates The flow rate of the main solvent supplied from the main solvent supply source % to the main pipe 81 by the main solvent supply pipe 84. In the following description, when the discharge of the organic EL liquid is started after the start of the coating apparatus 1, the nozzles 31 of the nozzle unit 30 are housed in the respective openings 5 of the standby container 5, The operation of each nozzle 31 is performed. Further, in the following discharge start operation, the mass flow controllers 83a and 84a and the on-off valves 83b and 84b operate in accordance with the command of the control unit 70. When the coating apparatus 1 discharges the organic EL liquid, the on-off valve 84b is first opened in a state where the switching valve 83b is closed. Thereby, the main solvent supply source 86 is supplied with the main solvent from the main solvent supply pipe 84, the mixing unit 82, and the main pipe 8 1 to the nozzle 129782.doc -16 - 1344396, and the discharge port 3 is discharged from the nozzle 3 Lb discharges the main solvent downward (FIG. 5: Step S1 'FIG. 6: Time u to t2) e At this time, the mass flow controller 84a is set in advance to a specific opening degree, and supplies the main solvent of the flow rate Fa corresponding to the opening degree. Since the main solvent supplied from the main solvent supply source 86 does not contain the organic ELm, the viscosity of the liquid is low. Therefore, the main solvent is smoothly discharged from the discharge hole 31b of the nozzle 31, and a liquid column is formed below the nozzle 31, and the main solvent is discharged, and the foreign matter or bubbles accumulated in the liquid supply path inside the discharge hole 31b or the nozzle 31 are discharged. It is discharged to the outside of the nozzle 3 together with the main solvent, and the substances which are the discharge resistance are excluded. Thereafter, the coating device 1 opens the opening and closing valve 83b in a state where the set flow rate of the mass flow controller 83a is minimized. Then, by gradually decreasing the set flow rate of the mass flow controller 84a and gradually increasing the set flow rate of the mass flow controller 83a, the ratio of the organic EL liquid in the mixed liquid supplied to the main pipe 81 is gradually increased. That is, the amount of the main solvent supplied from the main solvent supply source % is gradually decreased while gradually increasing the amount of the organic EL liquid supplied from the organic solvent supply source 85 (FIG. 5: step S2, FIG. 6: time t2 to t3) ). Thereby, the concentration of the organic material of the mixed liquid t discharged from the nozzle 3 is gradually increased, and the viscosity of the mixed liquid is gradually increased. In step S2 of the present embodiment, the mass flow controllers 83a and 84a are controlled to increase the flow rate of the main solvent supplied from the main solvent supply source 86 and the flow rate of the organic EL liquid supplied from the organic EL liquid supply source 85. The quantities are often equal' such that these aggregate flows are often maintained at Fa. Therefore, the flow rate of the main solvent supplied from the main solvent supply source 86 and the flow rate of the organic EL liquid supplied from the organic EL & supply source for 129782.doc • 17-1344396 become Fa/2 at almost the time t3. By maintaining the total flow rate of the main solvent and the organic EL liquid supplied to the main pipe 81 1 at a constant value Fa, the flow pressure of the liquid in the main pipe 81 is maintained uniform. Therefore, the organic EL material is not deposited in a block form in the liquid in the main pipe 81. Further, at time t2 to t3 in Fig. 6, the supply amount of the main solvent and the supply amount of the organic EL liquid are continuously changed (that is, the set flow rates of the mass flow controllers 83a and 8A are continuously changed), but they may be respectively made. The supply amount of the main solvent and the supply amount of the organic EL liquid are changed stepwise. • At time t3, when both the flow rate of the main solvent supplied from the main solvent supply source 86 and the flow rate of the organic EL liquid supplied from the organic EL liquid supply source 85 are /2, the coating device 1 closes the on-off valve 84b and stops supplying the main The solvent is simultaneously increased in the set flow rate of the mass flow controller 83a to Fa (Fig. 5: step S3, Fig. 6: time t3). As a result, the organic EL liquid having the flow rate Fa supplied from the organic EL supply source 85 flows in the main pipe 81. In the step S3 of the present embodiment, when the flow rate of the main solvent supplied from the main solvent supply source 86 is substantially equal to the flow rate of the organic EL liquid supplied from the organic EL liquid supply source 85, the supply of the main solvent is stopped. At the same time, the flow rate of the organic EL liquid is increased in one breath. In the state in which the on-off valves 83b and 8 are all open, the organic EL liquid supplied from the organic EL liquid pipe 83 is provided when the flow pressure on the main solvent side is higher than that of the organic side [the flow pressure on the liquid side is small]. The inside of the main solvent pipe 84 is entered to prevent the entry of the organic liquid. In the step S3 of the present embodiment, the supply of the main solvent is stopped, and the flow rate of the organic EL liquid is increased to Fa, which is to maintain the flow pressure of the liquid supplied to the main pipe 81 to prevent precipitation of the organic EL material. 129782.doc •18· 1344396 After the coating device 1 slows the set flow rate of the mass flow controller 83a from Fa to the final target value Fb (Fig. 5: step S4, Fig. 6: time t4 to t5). For example, if the above step S2 (t2 to t3) takes about 5 minutes, the step S4 (t4 to t5) takes about twice the time of about 10 minutes to lower the flow rate of the organic liquid. By reducing the flow rate of the organic EL liquid by such a time, it is possible to prevent a sudden fluctuation in the flow pressure in the main pipe 81. According to the above operation, the organic EL liquid forms a liquid column L of a good shape from the discharge hole 31b of the nozzle 31, and is discharged at the same time. _ In the coating apparatus 1 of the present embodiment, first, only the main & sizing agent is discharged from the nozzle 31, and the ratio of the organic EL liquid is gradually increased, and the ratio of the main solvent is gradually decreased, and finally only the organic solvent is discharged from the nozzle 3 E] L liquid. Therefore, the foreign matter or the air bubbles remaining in the inside of the nozzle 31 can be discharged to the outside of the nozzle 31 together with the main solvent, and then the organic liquid can be discharged. Therefore, the organic EL liquid can be discharged from the nozzle 31 well. Further, since the discharge of the organic EL liquid can be started even if the cleaning of the nozzle 31 and the discharge of the organic EL liquid are not repeated, the discharge of the organic EL liquid can be quickly started without increasing the consumption of the organic EL liquid. In particular, the coating apparatus 1 of the present embodiment can switch the supply of the main solvent and the supply of the organic EL liquid to the nozzle by switching the switching valves 83b and 84b without switching the piping connected to the nozzle 31. . Therefore, it is possible to prevent new foreign matter or air bubbles from entering inside the nozzle 31. Further, the coating apparatus 1 of the present embodiment gradually increases the supply amount of the organic EL liquid of the organic EL liquid supply source 85 by gradually decreasing the supply amount of the main solvent of the main solvent supply source 86, and discharges the liquid from the nozzle 31. The main solvent was gradually changed to 129782.doc -19- 1344396 and replaced with an organic EL solution. Therefore, it is possible to prevent the liquid discharged from the nozzle from abruptly changing the concentration or the degree of dryness, thereby damaging the shape of the discharge liquid column L, and causing a "solvent shock" of the stomach. Further, since the concentration of the organic EL material is gradually changed, even if the organic EL material is composed of a low molecular compound, there is no problem that the organic EL liquid gel is generated due to a sharp change in concentration. <2·2. Coating treatment operation> Next, the operation when the organic EL liquid is applied to the upper surface of the substrate 9 in the above coating apparatus will be described with reference to the flowchart of Fig. 7 . In addition, at the time of the start of the coating process described below, the discharge start operation of the organic EL liquid described in the above 2_丨 has been completed, and the nozzles 31 of the nozzle unit 3 are in a liquid column shape in the standby container 5A. Discharge the organic el liquid. When the coating apparatus 1 performs the coating process of the substrate 9, first, the substrate 9 is placed on the upper surface of the base 1 (step S5). The substrate 9 is mounted on the base 1 in such a manner that a plurality of grooves 9a formed on the upper surface thereof face the main scanning direction. Further, the base moving mechanism 20 moves the base 10 so that the position of the substrate 9 is adjusted such that the three grooves on the most + γ side of the substrate 9 are positioned below the scanning area of the nozzle portion 30. Then, the coating device 1 lowers the standby container 5〇, separates the standby container 5〇 from the nozzle 31, and moves the nozzle unit 30 to the +X side by operating the nozzle moving mechanism 4〇. The nozzle portion 3'' discharges the organic EL liquid from each of the nozzles 31, and moves toward the +X side, and the organic EL liquid is applied to the three grooves on the most +γ side of the substrate 9. In addition, a part of the organic EL liquid discharged in the middle of the movement of the nozzle portion 3 is dropped onto the recovery tray 6 or the top of the mask sheets 12, 12 is recovered. 0 129782.doc • 20 · The nozzle portion 30 is moved to the +X side When the upper surface of the mask 12 is applied, the coating device 1 moves the base 1 to the +γ side to move the coating width of the three nozzles 31 by the operation of the base moving mechanism 2 (i.e., the groove 9 & 3 lines width). Thereafter, the organic EL liquid is continuously discharged from the nozzle 31, and the nozzle portion 3 is moved toward the -X side. Thus, the organic EL liquid was applied onto the lower three grooves 9a of the substrate 9. When the coating apparatus 1 moves the substrate 9 to the coating width of the nozzle unit 30 in the sub-scanning direction, the organic EL liquid is applied to the main scanning direction over a predetermined number of times, and is coated on all the grooves 9a of the substrate 9. Organic ([Step S6] When the organic EL liquid is applied to all the grooves 9a on the substrate 9, the coating device 1 further moves the nozzle moving mechanism 40 to move the nozzle portion 3 至 to the position above the standby container 5 . When the nozzle unit 30 is moved to the position above the standby container 5, the coating device 1 raises the standby container 50, and the lower end portion of each nozzle 31 is accommodated inside the respective opening portions 5 of the standby container 50. Thereafter, the substrate 9 after the coating treatment is carried out from the substrate 1 (step S7), and the coating treatment of the organic EL liquid of one substrate 9 is completed. <3. Modifications> Although an embodiment of the present invention has been described above, the present invention is not limited to the above-described examples. For example, in the above example, three nozzles 31 are attached to the nozzle unit 30 of the coating device i. However, the number of nozzles to be attached to the nozzle unit 31 may be one or two, or four or more nozzles may be used. The cloth apparatus 1 is provided with three nozzles 31 for discharging an organic EL liquid for red, green, and blue. However, the coating apparatus of the present invention may be a single-color organic EL liquid discharged from a plurality of nozzles η. 129782.doc -21 - 1344396 Further, in the above example, the mass flow controllers 83a and 84a are used to adjust the supply amount of the organic EL liquid and the main solvent, but the other flow regulating mechanism is used to adjust the organic EL liquid and the main solvent. The amount of supply is also available. For example, as a substitute for the mass flow controllers 83a, 84a, a flow regulating valve without a flow sensor can be used.
又’上述吐出開始動作之步驟S2中’使主溶劑之流量線 形（將變化率固降低’使有機EL液之流量線形（將變化 率固定）增加，然而主溶劑及有機EL液之流量變化亦可不 為該線形變化（變化率一定之變化）。例如’如圖8所示，可 將主溶劑之流量以其變化率逐漸降低(變化率之絕對值逐 漸增加）之方式降低，將有機EL液之流量以其變化率逐漸 增加之方式增加。據此，能夠防止在開始有機el&之供給 之時刻t2有急劇的濃度變化。 又，上述止出開始動作之步驟s丨中，係於停止有機 液之供給狀態下開始主溶劑之供給，然而亦可從最初供給Further, in the step S2 of the above-described discharge start operation, 'the flow rate of the main solvent is linearly shaped (the rate of change is lowered) to increase the flow rate of the organic EL liquid (fixing the rate of change), but the flow rate of the main solvent and the organic EL liquid also changes. It is not necessary for the linear shape to change (the rate of change is constant). For example, as shown in Fig. 8, the flow rate of the main solvent can be lowered in such a manner that the rate of change gradually decreases (the absolute value of the rate of change gradually increases), and the organic EL liquid is used. The flow rate is increased in such a manner that the rate of change gradually increases. Accordingly, it is possible to prevent a sharp change in concentration at the time t2 at which the supply of the organic el& is started. Further, in the step s of the start of the stop operation, the organic phase is stopped. The supply of the main solvent is started in the supply state of the liquid, but it may be supplied from the initial supply.
少量的有機EL液。即，可以首先從喷嘴31吐出包含少量之 有機EL液與夕里之主溶劑的混合液，其後，逐漸增加有機 EL液之比例，同時逐漸降低主溶劑之比例，最後從喷嘴h 僅吐出有機EL液。 又’上述之塗佈裝置1係將含有作為被塗佈材料之有機 EL材料的有機液塗佈於基板9之上面者，然而本發明之 置 係將含有抗反射膜材料或光致抗钮劑材料 等其它被塗佈材料之塗佈液塗佈於基板9之上面者。又， 本毛明之塗佈裝置亦可係將水性之被塗佈材料與水性之溶 129782.doc -22· 丄 344396 劑混合之塗佈液塗佈於基板9之上面者。且，上述之塗佈 裝置1係將有機EL顯示裝置用玻璃基板9作為處理對象，然 而本發明之塗佈裝置亦可將液晶顯示裝置用玻璃基板、 PDP用玻璃基板、|導體晶圓、磁氣/光碟用玻璃/陶究基 板等其它基板作為處理對象。 【圖式簡單說明】 圖1係本發明之一實施形態之塗佈裝置的上視圖。 圖2係將塗佈裝置1按圖1之II-II線切斷之縱剖面圖。A small amount of organic EL solution. That is, it is possible to first discharge a mixed liquid containing a small amount of the organic EL liquid and the main solvent of Xiji from the nozzle 31, and then gradually increase the ratio of the organic EL liquid while gradually decreasing the ratio of the main solvent, and finally discharge only the organic EL from the nozzle h. liquid. Further, the coating apparatus 1 described above applies an organic liquid containing an organic EL material as a material to be coated onto the substrate 9, but the apparatus of the present invention will contain an antireflection film material or a photo-resistance agent. A coating liquid of another material to be coated such as a material is applied to the upper surface of the substrate 9. Further, the coating device of the present invention may be one in which a coating liquid in which an aqueous coating material and an aqueous solution of 129782.doc-22· 344 396 are mixed is applied onto the substrate 9. In the coating apparatus 1 described above, the glass substrate 9 for an organic EL display device is used as a processing target. However, the coating device of the present invention may be a glass substrate for a liquid crystal display device, a glass substrate for a PDP, a conductive wafer, or a magnetic material. Other substrates such as glass/ceramic substrates for gas/disc are used as processing targets. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top plan view of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing the coating apparatus 1 cut along the line II-II of Fig. 1.
圖3係噴嘴與送液系統之構成圖。 圖4係顯示塗佈裝置内之各部與控制部的連接構成的方 塊圖。 圓5係顯示開始有機EL液之吐出時之動作流程的流程 。係顯示有機EL液及主溶劑之供給量變動的圖表。 圖7係顯示於基板i面塗佈有機EL液時之動作流程的 程圖。Figure 3 is a block diagram of a nozzle and a liquid supply system. Fig. 4 is a block diagram showing the structure of connection between each part in the coating apparatus and the control unit. The circle 5 series shows the flow of the operation flow when the discharge of the organic EL liquid is started. A graph showing changes in the supply amount of the organic EL liquid and the main solvent. Fig. 7 is a view showing the flow of the operation when the organic EL liquid is applied to the surface of the substrate i.
® 8係顯示變形例之有機職及主溶劑之供給量變動的 【主要元件符號說明】 1 塗佈裝置 9 基板 20 基台移動機構 30 噴嘴部 31 噴嘴 129782.doc -23· 1344396 31b 吐出孔 40 喷嘴移動機構 50 待機容器 51 開口部 60 回收盤 70 控制部 80 送液系統 81 主配管® 8 shows the change in the supply amount of the organic and main solvents in the modified example. [Main component symbol description] 1 Coating device 9 Substrate 20 Abutment moving mechanism 30 Nozzle portion 31 Nozzle 129782.doc -23· 1344396 31b Discharge hole 40 Nozzle moving mechanism 50 standby container 51 opening portion 60 recovery tray 70 control portion 80 liquid supply system 81 main piping
82 混合部 83 有機EL液供給用配管 83a 質量流量控制器 83b 開關閥 84 主溶劑供給用配管 84a 質量流量控制器 84b 開關閥 85 有機EL液供給源82 Mixing unit 83 Organic EL liquid supply piping 83a Mass flow controller 83b On-off valve 84 Main solvent supply piping 84a Mass flow controller 84b On-off valve 85 Organic EL liquid supply source
86 主溶劑供給源 L 液柱 -24- 129782.doc86 main solvent supply source L liquid column -24- 129782.doc
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2007131279 | 2007-05-17 | ||
| JP2007330285A JP5069550B2 (en) | 2007-05-17 | 2007-12-21 | Coating device |
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| TW200904548A TW200904548A (en) | 2009-02-01 |
| TWI344396B true TWI344396B (en) | 2011-07-01 |
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| KR (1) | KR100966214B1 (en) |
| TW (1) | TWI344396B (en) |
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| JP5346656B2 (en) | 2009-04-01 | 2013-11-20 | 大日本スクリーン製造株式会社 | Coating device |
| JP5381414B2 (en) * | 2009-07-01 | 2014-01-08 | カシオ計算機株式会社 | Light emitting panel manufacturing method and light emitting panel manufacturing apparatus |
| JP2012206020A (en) * | 2011-03-30 | 2012-10-25 | Dainippon Screen Mfg Co Ltd | Method and device for applying application liquid |
| JP5759323B2 (en) * | 2011-09-21 | 2015-08-05 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
| JP6106937B2 (en) * | 2012-03-28 | 2017-04-05 | 凸版印刷株式会社 | Coating film forming apparatus and coating film forming method |
| JP6035090B2 (en) * | 2012-09-19 | 2016-11-30 | 株式会社Ｓｃｒｅｅｎホールディングス | Coating device and method of operating coating device |
| JP6367487B1 (en) * | 2017-01-06 | 2018-08-01 | 株式会社ジャムコ | Insulation coating method for sealing carbon fiber exposed end of composite material part using dispenser device |
| CN107297306A (en) * | 2017-08-04 | 2017-10-27 | 河南富拓光电科技有限公司 | A kind of on-line mixing feeding system |
| CN111921800B (en) * | 2020-10-15 | 2021-01-26 | 上海辛帕智能科技股份有限公司 | Control circuit of two-component glue mixer, control method and device of two-component glue mixer |
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| JP3442934B2 (en) | 1996-08-20 | 2003-09-02 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP3333121B2 (en) * | 1996-12-25 | 2002-10-07 | 東京エレクトロン株式会社 | Coating device |
| JP3559144B2 (en) | 1997-05-23 | 2004-08-25 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP3676263B2 (en) * | 2001-06-06 | 2005-07-27 | 東京エレクトロン株式会社 | Coating film forming apparatus and coating film forming method |
| JP3792144B2 (en) * | 2001-07-11 | 2006-07-05 | 東京エレクトロン株式会社 | Liquid processing equipment |
| JP4910272B2 (en) * | 2004-09-08 | 2012-04-04 | 凸版印刷株式会社 | Coating apparatus having cleaning mechanism and cleaning method |
| JP4603322B2 (en) * | 2004-09-08 | 2010-12-22 | リスパック株式会社 | Food containers |
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| KR20080101670A (en) | 2008-11-21 |
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| KR100966214B1 (en) | 2010-06-25 |
| JP2008307523A (en) | 2008-12-25 |
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