TWI339552B - Flexible circuit board - Google Patents

Description

27801twf.doc/d 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種可撓性電路板，且特別是有關於 一種具有特殊結構以減緩其機械應力之可撓性電路板。 【先前技術】 隨著封裝科技的發展，覆晶薄膜（chip on film, COF) 熱壓焊科技已成為先進的封裝科技之一。一般來說，覆晶 薄膜熱壓焊科技應用的範圍很廣泛，舉例來說，液晶面板 與驅動積體電路（integrated circuit，1C)之間的電性連接就 是COF熱壓焊科技的其中一種應用。 參照圖1與圖2。圖1為電子裝置4之橫切面圖，圖 2為另一電子裝置6之橫切面圖。舉例來說，每個電子裝 置4及6可以是薄膜電晶體液晶顯示器（恤版t麵⑽ liquid Crystal display，TFT_LCD)、電漿顯示器有機發光 ( organic light-emitting diode display OLED) 等顯示II。每個電子裝置4及6具有顯示面板l印刷電 路板 10 (printed circuit board，PCB)、驅動 Ic 12 以 ，性電路板14。PCB 1G具有内建的時間控制器，以產生 號而去控制驅動IC 12之運作。可撓性電路板14可 ^曲。精此，PCB1G可以置於電子裝置4的上方（如圖 H不）’或置於顯示面板8的背面（如圖2所示）。驅 動1C 12形成在可撓性電路板14上，且根據内建於pcB 1〇 2780ltwf,d〇c/cl 2780ltwf,d〇c/cl 之運27801 twf.doc/d IX. Description of the Invention: [Technical Field] The present invention relates to a flexible circuit board, and more particularly to a flexible circuit board having a special structure to slow down its mechanical stress. [Prior Art] With the development of packaging technology, chip on film (COF) thermocompression bonding technology has become one of the advanced packaging technologies. In general, the application of flip-chip thin film thermo-welding technology is very wide. For example, the electrical connection between the liquid crystal panel and the integrated circuit (1C) is one of the applications of COF thermo-compression welding technology. . 1 and 2 are referred to. 1 is a cross-sectional view of the electronic device 4, and FIG. 2 is a cross-sectional view of another electronic device 6. For example, each of the electronic devices 4 and 6 may be a display II such as a thin film transistor liquid crystal display (TFT), or an organic light-emitting diode display OLED. Each of the electronic devices 4 and 6 has a display panel 1 printed circuit board (PCB), a drive IC 12, and a circuit board 14. The PCB 1G has a built-in time controller to generate the number to control the operation of the driver IC 12. The flexible circuit board 14 can be bent. In this case, the PCB 1G can be placed above the electronic device 4 (as shown in Figure H) or placed on the back of the display panel 8 (as shown in Figure 2). Drive 1C 12 is formed on flexible circuit board 14 and is built according to pcB 1〇 2780ltwf, d〇c/cl 2780ltwf, d〇c/cl

之時間控制器所接收到的時間信號，進行驅動ICTime signal received by the controller to drive the IC

作。 丄Z 參照圖3，圖3為顯示面板8、PCB 1〇、驅叙 以及可撓性電路板14之示意圖。驅動Ic 12 板14上形成，且經由多條導線比與咖i ^路 以及經由多條導線18與顯示面板8電性連接 始 16具有外弓丨腳la、内引腳lb以及連接部lc。連接] =外引腳la與内引腳lb。如圖3所示,腳^ c 度大於内引腳lb的寬度，而導線16鱗曲的並具= 的轉角。然而，當可撓性電路板14被彎曲時，由於 1 轉角所造成的高應力密度，外引腳la與連接部^捲^ 内引腳lb與連接部lc之接合部就报容易斷裂^ 而¥致在PCB 10與_ IC 12之_信號傳輸失敗。 命τίΐ本第HU/345839號的已公開專利申請案中，揭 :了種可撓性電路板。參照圖4與圖5，圖4為上述曰 本已公開專利巾請細揭露之可撓性電路板的*意圖，而 圖5為圖4中可撓性電路板的導線之放大圖。如圖4所示， 可撓性電路板之兩條導線分別形成對應的凹口 2。每個凹 口 2為内側的圓凹區，以減緩外引腳la之接合部在内緣 2a及連接部lc的機械應力。然而，内引腳比之接合部孔 $及連接部lc都為銳利的轉角，因此都會受高應力集中的 影響，而增加接合部2b在施力下斷裂的機率。 【發明内容】 1339552 2780Uwf.doc/d 本發明提供-種可撓性電路板，可減少外引腳之接合 部及連接部在施力下斷裂的機率。 本發明提供-種可撓性電路板，可減少内引腳之接合 部及連接部在施力下斷裂的機率。 於是’本發明提出一種可撓性電路板。可挽性電路板 包括可撓性薄臈、多條内引腳、多條外引腳以及多個連接 4。内引腳在可撓性薄膜上形成，且每條内引腳具有第— 鲁 寬，。外引腳在可撓性薄膜上形成，且每條外引腳具有大 於第-寬度之第二寬度。每個連接部連接其對應的—條内 引腳與其對應的—條外引腳。上述多個連接部中的至少— 個連接。卩具有内邊緣與外邊緣。外邊緣具有第一圓凹區、 • 第二圓凹區以及位於第—圓凹區與第二圓凹區之間的第— ·· ®凸區。内邊緣具有第二圓凸區、第三圓&區以及位於第 二圓凸區與第三圓凸區之間的第三圓凹區。 在本發明之一實施例中，第一圓凸區之曲率半徑大於 第三圓凹區之曲率半徑。 、 雛纟本發明之-實施财，外邊緣更包括位於第一圓凸 S·與第一圓凹區之間的第四圓凸區。 在本發明之一實施例中’内邊緣更包括位於第三圓凹 區與第三圓凸區之間的第四圓凹區。 在本發明之-實施例中’内邊緣與外邊緣彼此相對。 在本發明之一實施例中，其俾連接部的每個内邊緣具 有至少-圓凹區及至少-圓凸區，而其他連接部的每個^ 邊緣具有至少一圓凹區及至少一圓凸區。 27801twf.doc/cl 27801twf.doc/cl 點能更明顯易懂，下文特 ，作詳細說明如下。 為讓本發明之上述特徵和優 舉較佳實施例’並配合所附圖式 【實施方式】 參照圖6，圖6為本發明第—實施例之可撓性電路板 2〇的不意圖。可撓性電路板W具有多條内引腳36、多個 連接部38以及多條外引腳4〇。每個連接部％連接其對應 的ir、内引腳36與其對應的—條外引腳4〇。如圖6所示， 連接邛38之群組32位於内弓丨腳36之群組3〇與外引腳4〇 之群組34之間。每條㈣腳36具有第—寬度wi，且每 條外引腳40具有第二寬度W2。第〔寬度W2A於第一寬 ，。根據本發明其他較佳之實施例，第二寬度對 第覓度W1之比值大於或等於3。然而，本發明並不以 此為限。内引腳36或外引腳40為平行且等距間隔。換言 之’ ^於兩條相鄰力内引腳36之間存在著沿著第一座標軸 =的第一間距D1 ’而介於兩條相鄰的外引腳4〇之間存在 著沿著第一座標軸χ的第二間距D2。此外，内引腳弘及 外引腳40沿著第二座標軸γ延伸。值得注意的是，本發 月中的内引腳36或外引腳40相鄰引線的間距並不限於任 何特疋間距。舉例來說，内引腳36或外引腳可以各樣 的間隔作為間距。 叫參照圖7與圖8。圖7為可撓性電路板2〇沿著圖6 之Α-Α線段之橫切面圖，圖8為可撓性電路板沿著圖6 之Β-Β’線段之橫切面圖。可撓性電路板20更具有可撓性 1339552 2780ltwf.doc/d 薄膜22及銲錫電阻（S〇lderresisi，SR)層Μ。本實 撓性薄膜22之材質為聚醒亞胺且具有38咖之厚卢 腳36及外引腳40都在可撓性薄膜22上形成，且^錫電 阻層24所復盍。此外，本實施例中，内引腳％、連 以及外引腳40之材質為銅金屬且具有介於5職〜獅/之厚 度。然而’須注意的是，上述本發明之實施例為 明並不以此為限。Work.丄Z Referring to FIG. 3, FIG. 3 is a schematic view of the display panel 8, the PCB 1A, the drive, and the flexible circuit board 14. The driving Ic 12 board 14 is formed on the board 14 and electrically connected to the display panel 8 via a plurality of wires and via the plurality of wires 18, and has an outer bow foot la, an inner pin lb, and a connecting portion lc. Connection] = outer pin la and inner pin lb. As shown in FIG. 3, the foot degree is greater than the width of the inner pin lb, and the wire 16 is scaled and has a corner of =. However, when the flexible circuit board 14 is bent, due to the high stress density caused by the 1 turn angle, the joint between the outer lead la and the connecting portion lb and the connecting portion lc is easily broken. ¥ The signal transmission on the PCB 10 and _ IC 12 failed. A flexible circuit board is disclosed in the laid-open patent application No. HU/345839. Referring to Figures 4 and 5, Figure 4 is an illustration of the flexible circuit board of the above-mentioned disclosed patent document, and Figure 5 is an enlarged view of the wire of the flexible circuit board of Figure 4. As shown in Fig. 4, the two wires of the flexible circuit board respectively form corresponding notches 2. Each of the recesses 2 is an inner concave portion to relieve the mechanical stress of the inner edge 2a and the joint portion lc of the joint portion of the outer lead la. However, the inner lead is sharper than the joint hole $ and the connecting portion lc, and therefore is affected by high stress concentration, and increases the probability of the joint 2b breaking under the applied force. SUMMARY OF THE INVENTION 1339552 2780 Uwf.doc/d The present invention provides a flexible circuit board which can reduce the probability of breakage of the joint portion of the outer lead and the joint portion under the force applied. The present invention provides a flexible circuit board which reduces the probability of breakage of the joint portion of the inner lead and the joint portion under the force applied. Thus, the present invention proposes a flexible circuit board. The flexible circuit board includes a flexible thin package, a plurality of inner leads, a plurality of outer leads, and a plurality of connections 4. The inner leads are formed on the flexible film and each inner pin has a first-thick width. The outer leads are formed on the flexible film and each outer lead has a second width greater than the first width. Each connection is connected to its corresponding - inner pin and its corresponding outer pin. At least one of the plurality of connecting portions is connected.卩 has an inner edge and an outer edge. The outer edge has a first rounded area, a second rounded area, and a first-------------------- The inner edge has a second circular convex region, a third circular & region, and a third circular concave region between the second circular convex portion and the third circular convex portion. In an embodiment of the invention, the radius of curvature of the first circular convex region is greater than the radius of curvature of the third circular concave region. In the present invention, the outer edge further includes a fourth circular convex region between the first circular convex S· and the first circular concave region. In an embodiment of the invention, the inner edge further includes a fourth circular recess located between the third circular recess and the third circular convex region. In the embodiment of the invention, the inner edge and the outer edge are opposed to each other. In an embodiment of the invention, each inner edge of the meandering connection portion has at least a concave area and at least a round convex area, and each of the other connecting portions has at least one concave area and at least one circular convex area. . 27801twf.doc/cl 27801twf.doc/cl Points can be more obvious and easy to understand, as detailed below, as detailed below. The above features and preferred embodiments of the present invention have been made in accordance with the accompanying drawings. [Embodiment] Referring to Fig. 6, Fig. 6 is a schematic view of a flexible circuit board according to a first embodiment of the present invention. The flexible circuit board W has a plurality of inner leads 36, a plurality of connecting portions 38, and a plurality of outer leads 4A. Each of the connections is connected to its corresponding ir, inner pin 36 and its corresponding outer pin 4'. As shown in Figure 6, the group 32 of ports 38 is located between the group 3 of the inner leg 36 and the group 34 of the outer pins 4A. Each (four) leg 36 has a first width wi and each outer pin 40 has a second width W2. The first [width W2A is at the first width. According to a further preferred embodiment of the invention, the ratio of the second width to the second degree W1 is greater than or equal to three. However, the invention is not limited thereto. The inner lead 36 or the outer lead 40 are parallel and equidistantly spaced. In other words, there is a first spacing D1 along the first coordinate axis = between two adjacent force inner pins 36 and there is a first along the two adjacent outer pins 4 The second pitch D2 of the coordinate axis. In addition, the inner pin and the outer pin 40 extend along the second coordinate axis γ. It is worth noting that the pitch of the adjacent leads 36 of the inner lead 36 or the outer lead 40 in this month is not limited to any special spacing. For example, the inner pin 36 or the outer pin can be spaced apart at various intervals. Refer to Figure 7 and Figure 8. Figure 7 is a cross-sectional view of the flexible circuit board 2 〇 along the Α-Α line segment of Figure 6, and Figure 8 is a cross-sectional view of the flexible circuit board along the Β-Β' line of Figure 6. The flexible circuit board 20 is more flexible 1339552 2780ltwf.doc/d film 22 and solder resistor (S〇lderresisi, SR) layer. The material of the flexible film 22 is a polyamidide and has a thick leg 36 and an outer lead 40 which are formed on the flexible film 22, and the tin resist layer 24 is reapplied. In addition, in this embodiment, the inner pin %, the connection and the outer pin 40 are made of copper metal and have a thickness of 5 to lion. However, it should be noted that the above-described embodiments of the present invention are not limited thereto.

再爹照圖6，連接部38之群組32當中的連接部38,連接 至内引腳36之群組30當中的内引腳36,以及外引腳牝之 ，34當中的料腳4〇’。沿第一座標軸χ來看，内引腳％，在 座標軸X上的位置範圍，部份或全部地與外引腳4〇在第 一座標軸X上的位置範圍重疊。然而，沿第二座標軸γ來看， 連接部38’將内引腳36，和外引腳4〇，分隔開。 ,參照圖9，圖9為連接部38,附近區域之放大圖。連接部 %具有内邊緣42及外邊緣44。内邊緣42及外邊緣44彼此Referring again to Figure 6, the connection portion 38 of the group 32 of the connection portions 38 is connected to the inner lead 36 of the group 30 of the inner leads 36, and the outer pins ,, 34 of the legs 4 '. Along the first coordinate axis, the inner pin %, the position range on the coordinate axis X, partially or entirely overlaps the position range of the outer pin 4 〇 on the first standard axis X. However, as seen along the second coordinate axis γ, the connecting portion 38' separates the inner lead 36 from the outer lead 4'. Referring to Fig. 9, Fig. 9 is an enlarged view of the vicinity of the connecting portion 38. The connecting portion % has an inner edge 42 and an outer edge 44. Inner edge 42 and outer edge 44 are mutually

相對。内邊緣42與内引腳36,之右側及外引腳40’之右側連 接’外邊緣44與内引腳36,之左側及外引腳4〇，之左側連接。 夕。卜邊緣44具有第一圓凹區5〇、第一圓凸區52以及第二圓凹 區54。第一圓凸區η位於第_圓凹區5〇與第二圓凹區“之 間。内邊緣42具有第二圓凸區56、第三圓凹區58以及第三 圓凸區60弟二圓凹區58位於第二圓凸區56與第三圓凸區 60之間。 土參照圖ίο，圖10為第—圓凸區52及第三圓凹區58之 不意圖。第一圓凸區52具有曲率半徑R1，第三圓凹區如具 1339552 27801twf.doc/d 有曲率半徑R2，其中曲率半徑R1大於曲率半徑R2。 參照圖11’圖11為根據本發明第二實施例之内引腳36，、 連接部38,及外引腳40’的示意圖。本實施例中，内邊緣42與 内引腳36,之左側及外引腳40’之左側連接，外邊緣44與内引 腳36’之右側及外引腳40’之右側連接。relatively. The inner edge 42 is connected to the inner side of the inner lead 36 and the right side of the outer lead 40'. The outer edge 44 and the inner lead 36 are connected to the left side of the left and outer pins 4'. Xi. The edge 44 has a first circular recess 5, a first circular convex portion 52, and a second circular concave portion 54. The first circular convex region η is located between the first concave area 5〇 and the second circular concave area. The inner edge 42 has a second circular convex portion 56, a third circular concave portion 58 and a third circular convex portion 60 The concave area 58 is located between the second circular convex portion 56 and the third circular convex portion 60. Referring to Fig. 10, Fig. 10 is a schematic view of the first circular convex portion 52 and the third circular concave portion 58. The first circular convex portion The region 52 has a radius of curvature R1, and the third circular region has a radius of curvature R2, such as having a radius of curvature R2, wherein the radius of curvature R1 is greater than the radius of curvature R2. Referring to FIG. 11', FIG. 11 is within the second embodiment of the present invention. A schematic diagram of the pin 36, the connecting portion 38, and the outer pin 40'. In this embodiment, the inner edge 42 is connected to the left side of the inner lead 36, the left side of the outer lead 40', and the outer edge 44 and the inner lead The right side of the leg 36' and the right side of the outer pin 40' are connected.

參照圖12’圖12為根據本發明弟三實施例之内引腳％，、 連接部38,及外引腳40’的示意圖。本實施例中，内邊緣幻與 内引腳36’之右侧及外引腳40’之右侧連接，外邊緣料與内^ 腳36’之左侧及外引腳40’之左側連接。此外，外邊緣料'另具 有位於第一圓凸區52與第二圓凹區54之間的第四圓凸^ 53。本實施例中’連接第一圓凸區52與第四圓凸區幻之品 區55為一直線。然而，須注意的是，本發明並不以此 ] 舉例來說，中間區55可為另一圓凸區。 參照圖13 ’圖13為根據本發明第四實施例之内弓丨 ， 連接部38’及外引腳40’的示意圖。本實施例中 36、 只015ΊΤ鬥邊緣42血Referring to Fig. 12', Fig. 12 is a schematic view showing the inner pin %, the connecting portion 38, and the outer pin 40' according to the third embodiment of the present invention. In this embodiment, the inner edge is connected to the right side of the inner pin 36' and the right side of the outer pin 40', and the outer edge is connected to the left side of the inner leg 36' and the left side of the outer pin 40'. In addition, the outer edge material 'has a fourth circular projection 53 between the first circular convex portion 52 and the second circular concave portion 54. In the present embodiment, the connecting first circular convex portion 52 and the fourth circular convex portion magic product region 55 are in a straight line. However, it should be noted that the present invention is not by way of example. For example, the intermediate portion 55 may be another circular convex region. Referring to Figure 13, there is shown a schematic view of an inner bow, a connecting portion 38' and an outer lead 40' in accordance with a fourth embodiment of the present invention. In this embodiment, 36, only 015 bucket edge 42 blood

内弓丨腳36,之左側及外引腳40,之左侧連接，外邊緣如 -腳36,之右側及外引腳40,之右侧連接。此外，外邊緣料、内弓丨 有第四圓凸區53及中間區55。第四圓凸區53位於 也具 區52與第二圓凹區54之間。 圓凸 參照圖14’圖14為根據本發明第五實施例之内 連接部38,及外引腳4〇,的示意圖。本實施例中，内=36’、 内引腳36,之右側及外引腳40,之右側連接，外邊緣料緣42與The inner bow foot 36, the left and outer pins 40, are connected to the left side, and the outer edges are connected to the right side such as the foot 36, the right side and the outer side pin 40. Further, the outer edge material, the inner bow has a fourth circular convex portion 53 and an intermediate portion 55. The fourth circular convex portion 53 is located between the region 52 and the second concave portion 54. Round convexity Referring to Fig. 14', Fig. 14 is a view showing the inner connecting portion 38 and the outer lead 4'' according to the fifth embodiment of the present invention. In this embodiment, the inner=36', the inner lead 36, the right side and the outer lead 40 are connected to the right side, and the outer edge material edge 42 is

腳36,之左側及外引腳40,之左側連接。此外，内 與内弓I 有位於第三圓凹區58與第三圓凸區6〇之間笛2另具 J禾四圓凹區 10 2780ltwf.doc/d 一 η π’,久丄，當可撓性電路板被彎曲時， 引腳及外引腳接合的轉角附近的機械應力得= 減緩。因此，不σ pjq g I .击Α 小〃、内引腳與連接部之接合部因外 降:且外引腳與連接部之接合部因外=The left side of the leg 36, the outer pin 40, is connected to the left side. In addition, the inner and inner bows I are located between the third circular recessed area 58 and the third circular convex area 6〇, and have a J-four circular recessed area 10 2780ltwf.doc/d a η π', long time, when When the flexible circuit board is bent, the mechanical stress near the corner where the pin and the outer pin are joined is slowed down. Therefore, not σ pjq g I. Α Α 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 〃 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合 接合

部於可撓性電路板上 雖然本發明已以較佳實施例揭露如上，然其並 限定本發明’任何所屬義職巾财通常知識者，在不 脫離本發明之精神和範_，#可作些許之线與潤飾， 因此本發明之倾範圍當觀社ΐ料娜_界定者 為進。 【圖式簡單說明】 圖1是習知之一種電子装置的橫切面示意圖。 圖2是習知之另一種電子裝置的橫切面示意圖。 圖3是圖1或圖2中電子裝置之顯示面板、PCb、驅 動1C及可撓性電路板的示意圖。 圖4是日本公開專利應用所揭露之可撓性電路板的示 意圖。 圖5是圖4中可撓性電路板之導線的放大圖。 圖6是本發明第一實施例之可撓性電路板的示意圖。 圖7是圖6中沿著切線Α_Α’之可撓性電路板的橫切面 示意圖。 圖8是圖6中沿著切線Β-Β，之可撓性電路板的橫切面 示意圖。 [S1 12 1339552 27801twf.doc/d 圖9是圖6所示連接部附近之放大圖。 圖10是圖9所示第一圓凸區與第三圓凹區之示意圖。 圖Π是根據本發明第二實施例之内引腳、連接部及外 引腳的示意圖。 圖12是根據本發明第三實施例之内引腳、連接部及外 引腳的示意圖。 圖13是根據本發明第四實施例之内引腳、連接部及外 引腳的示意圖。 ® 圖14是根據本發明第五實施例之内引腳、連接部及外 引腳的示意圖。 圖15是根據本發明第六實施例之内引腳、連接部及外 ' 引腳的示意圖。 • 圖16與圖17是圖6所示其餘内引腳、連接部及外引腳 的示意圖 【主要元件符號說明】 • la、4〇、4〇,：外引腳 lb、 36、36’ ：内引腳 lc、 38、38’ ：連接部 2 :凹口 2a :内緣 2b :接合部 4、6 :電子裝置 8 :顯示面板Although the present invention has been disclosed in the preferred embodiments as above, and the invention is not limited to the spirit and scope of the present invention, without departing from the spirit and scope of the present invention. A few lines and retouching, so the scope of the invention is as determined by the viewer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a conventional electronic device. 2 is a schematic cross-sectional view of another conventional electronic device. Figure 3 is a schematic illustration of the display panel, PCb, drive 1C, and flexible circuit board of the electronic device of Figure 1 or Figure 2. Fig. 4 is a schematic view of a flexible circuit board disclosed in Japanese Laid-Open Patent Application. Figure 5 is an enlarged view of the wires of the flexible circuit board of Figure 4. Figure 6 is a schematic view of a flexible circuit board in accordance with a first embodiment of the present invention. Figure 7 is a cross-sectional view of the flexible circuit board taken along line Α_Α' in Figure 6. Figure 8 is a cross-sectional view of the flexible circuit board taken along line Β-Β in Figure 6. [S1 12 1339552 27801twf.doc/d Fig. 9 is an enlarged view of the vicinity of the connecting portion shown in Fig. 6. Figure 10 is a schematic view of the first circular convex portion and the third circular concave portion shown in Figure 9. Figure 2 is a schematic view of an inner pin, a connecting portion and an outer pin according to a second embodiment of the present invention. Figure 12 is a schematic illustration of inner pins, connecting portions and outer pins in accordance with a third embodiment of the present invention. Fig. 13 is a view showing the inner lead, the connecting portion and the outer lead according to the fourth embodiment of the present invention. Figure 14 is a schematic illustration of internal pins, connections and outer leads in accordance with a fifth embodiment of the present invention. Figure 15 is a schematic illustration of an inner pin, a connecting portion and an outer 'pin according to a sixth embodiment of the present invention. • Figure 16 and Figure 17 are schematic diagrams of the remaining inner leads, connections, and outer leads shown in Figure 6. [Key Symbols] • la, 4〇, 4〇,: External pins lb, 36, 36': Inner pins lc, 38, 38': connection portion 2: notch 2a: inner edge 2b: joint portion 4, 6: electronic device 8: display panel

m J 13 1339552 27801lwf.doc/d 10 :印刷電路板 12 :驅動IC 14、20 :可撓性電路板 16、18 :導線 22 :可撓性薄膜 24 :銲錫電阻層 30、32、34 :群組 42、42’ ：内邊緣 • 44、44’ ：外邊緣 50 :第一圓凹區 52 :第一圓凸區 53 :第四圓凸區 . 54 :第二圓凹區 55、57 :中間區 56 :第二圓凸區 58 :第三圓凹區 • 59 :第四圓凹區 60 :第三圓凸區 62、64 :第一邊緣 66、68 :第二邊緣 Wl、W2 :寬度 Dl、D2 :間隔 IU、R2 :曲率半徑 [S] 14m J 13 1339552 27801lwf.doc/d 10 : printed circuit board 12 : driver IC 14 , 20 : flexible circuit board 16 , 18 : wire 22 : flexible film 24 : solder resistance layer 30 , 32 , 34 : group Group 42, 42': inner edge • 44, 44': outer edge 50: first rounded area 52: first rounded area 53: fourth rounded area. 54: second rounded area 55, 57: middle Zone 56: second rounded area 58: third rounded area • 59: fourth rounded area 60: third rounded area 62, 64: first edge 66, 68: second edge W1, W2: width Dl , D2 : Interval IU, R2: radius of curvature [S] 14

Claims (1)

27801twf.doc/d 十、申請專利範園： 1.一種可撓性電路板，包括： 一可撓性薄膜； 多條内引腳，配置於該可撓性薄膜上，且每條内引腳 具有一第一寬度； ★多條外引腳，配置於該可撓性薄膜上，每條外引腳具 有第-寬度’且該第二寬度大於該第一寬度；以及 多個連接部，每個連接部連接其對應的一條内引腳盘 對應的一條外引腳，且該多個連接部中的至少一個連接部 具有-内邊緣與-外邊緣，其中該外邊緣具有—第一圓凹 區、-第二圓凹區以及位於該第—圓凹區與該第二圓凹區 之間的一第―圓凸區，該内邊緣具有-第二圓凸區、一第 :圓=及位於該第二圓凸區與該第三圓凸區之間的— 第二圓凹區。 2.如申請專鄕圍第丨項所述之可撓 钟徑大於—第三圓凹區之曲Ϊ半徑 ^如申μ專利範圍第丨項所述之可撓性電路板，直中 二=括位於該第一圓崎該第二圓凹區之間的 4. 5.如申請專概圍第丨摘述 該内邊緣更包括位於該第三圓凹區與該第之;:27801twf.doc/d X. Application for Patent Park: 1. A flexible circuit board comprising: a flexible film; a plurality of inner leads disposed on the flexible film and each inner pin Having a first width; a plurality of outer pins disposed on the flexible film, each outer pin having a first width ′ and the second width being greater than the first width; and a plurality of connecting portions, each The connecting portion is connected to an outer pin corresponding to a corresponding one of the inner lead plates, and at least one of the plurality of connecting portions has an inner edge and an outer edge, wherein the outer edge has a first circular concave a second concave region and a first circular convex region between the first concave portion and the second concave portion, the inner edge having a second circular convex region, a first: circle = and a second concave region between the second circular convex region and the third circular convex region. 2. If the flexible clock diameter as described in the application for the 丨 丨 大于 大于 大于 大于 大于 第三 ^ ^ ^ ^ ^ ^ ^ ^ ^ 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可Included in the first rounded area of the first rounded area is as follows. 5. 5. If the application is described in detail, the inner edge further includes the third concave area and the first;