TWI335866B - - Google Patents
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- Publication number
- TWI335866B TWI335866B TW97139883A TW97139883A TWI335866B TW I335866 B TWI335866 B TW I335866B TW 97139883 A TW97139883 A TW 97139883A TW 97139883 A TW97139883 A TW 97139883A TW I335866 B TWI335866 B TW I335866B
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- substrate
- metal
- layer
- group
- Prior art date
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97139883A TW201016464A (en) | 2008-10-17 | 2008-10-17 | Metal substrate press-bonded assembly of non-steel board intermediate and method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97139883A TW201016464A (en) | 2008-10-17 | 2008-10-17 | Metal substrate press-bonded assembly of non-steel board intermediate and method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201016464A TW201016464A (en) | 2010-05-01 |
TWI335866B true TWI335866B (ja) | 2011-01-11 |
Family
ID=44830458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97139883A TW201016464A (en) | 2008-10-17 | 2008-10-17 | Metal substrate press-bonded assembly of non-steel board intermediate and method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201016464A (ja) |
-
2008
- 2008-10-17 TW TW97139883A patent/TW201016464A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201016464A (en) | 2010-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |