1329789 (1) 玖、發㈣說明 4 【發明所屬之技術領域】 本發明，是關於可將繪有電路圖案的光罩和形成有感 光層在表面的的基板進行緊貼配置，藉由將光通過光罩照 射在基板上，使電路圖案轉印在基板上的曝光方法及曝光 裝置。 【先前技術】 響 例如像印刷電路用基板般的基板，其表面未必爲平坦 。爲使光罩上所繪製的電路圖案能夠忠實地轉印在爲如此 不平坦的表面上，就需要將光罩均勻緊貼著基板的整個表 面。因此，使光罩和基板之間的空間成爲負壓空間來緊貼 該兩者的方法及裝置是先前就廣爲人知》 ‘ 第2圖及第3圖，表示以上所述的習知曝光裝置。曝 光裝置，是包括著基板1支撐用的基板支撐台2和被安裝 在基板支撐台2上的環狀密封構件3。 Φ 於基板1的表面形成著感光層。於基板支撐台2，形 成著複數吸引孔4，這些吸引孔4是連接著空氣壓力源（ 未圖示）。由空氣壓力源對吸引孔4施加負壓，使基板1 能被吸貼保持在基板支撐台2上。當、解除該負壓時，就可 將基板1從基板支撐台2上取走。 環狀密封構件3，如第2圖所示，是延續成可包圍著 被置放在基板支撐台2上之基板1的周圍。環狀密封構件 3，如第3圖所示，是由中空的彈性材料所構成。中空之 -4- (2) (2)1329789 密封樓件3的內部’是由管路5連接著未圖示的空氣壓力 源β藉由對來自於該空氣壓力源的供給空氣進行調整，使 密封構件3的內部壓力產生變化。由彈性材料構成的密封 構件3’是藉由其內部壓力和來自於上方所施加的力量， 使其產生高度變化。 於密封構件3上，光罩6是被支撐在可覆蓋著基板】 的位置上。於光罩6上，繪有要轉印至基板1上的電路圖 案。於第3圖的狀態中，光罩6是與基板1之間保有間隙 地被支撐成在密封構件3上。光罩6的周圍邊緣部份，因 是和密封構件3的上側部份成密封狀態地由該密封構件3 支撐著，所以由基板支撐台2和置放在基板支撐台2上的 基板1及環狀密封構件3和光罩6，形成著封閉的空間。 將該空間稱爲第1空間7。相對於此，將中空的密封構件 3之封閉的內部空間稱爲第2空間8。第1空間7，是由 管路9連接著未圖示的空氣壓力源。 藉由對管路9及管路5所分別連接之來自於空氣壓力 源的供給壓力値進行調整，就可使第1空間7及第2空間 8內的壓力產生變化。於進行曝光時，藉由將第1空間7 內的壓力爲負壓，並且，將第2空間8內的壓力爲大氣壓 或正壓，就可使被支撐在密封構件3上的光罩6下降緊貼 著基板1的表面。 【發明內容】 〔發明欲解決之課題〕 -5- 1329789 ⑶ 然而’就上述的方法而言，是無法保證可將光罩6確 實緊貼在基板1上。這是因爲難以平衡第1空間7內的壓 力和第2空間8內的壓力，再加上，在基板1的尺寸（長 度、寬度、厚度）變更時，在每次變更時都必須進行艱難 的壓力調節。 第4圖，是表示第2空間8內的正壓因相對性太低而 無法充分維持光罩6周圍邊緣部份的高度，使第1空間7 內的負壓作用造成光罩6往上方彎曲成凸形的例子。一旦 成爲該狀態時，基板1和光罩6之間會殘留空氣，使光罩 6難以緊貼著基板1的整個表面。 第5圖’是表示第2空間8內的正壓因相對性太高而 無法充分下降光罩6周圍邊緣部份，使第1空間7內的負 壓作用造成光罩6往上方彎曲成凹形的例子。於該狀態中 ，基板1的周圍邊緣區域並不緊貼著光罩6。從該狀態將 第2空間8內的壓力徐徐的往下降時，當該壓力成爲某壓 力値時，基板1和光罩6之間就不會有空氣，可使光罩6 緊貼著基板I的整個表面。然而，因此而要做適當壓力値 之決定的微妙作業是難以用手動來執行，再加上若要對每 個不同尺寸的基板都執行該作業實屬繁雜。 因此就想到了在基板周圍配置具有與基板相同厚度的 襯墊。藉由該襯墊，可防止基板的大彎曲。也可防止基板 支撐台強度爲低時所產生的基板支撐台彎曲。 但是，於使用尺寸（長度、寬度、厚度）不同之基板時 ，就需要替換成適合於該當基板尺寸的襯墊。這是繁雜的 -6- (4) (4)1329789 作業.β此外’若襯墊的選擇爲不適當時，或襯墊的安裝爲 不確實時’就無法使光罩和基板確實緊貼，這將成爲曝光 處理中之產生瑕疵品的原因。 因此，本發明之課題是提供一種於曝光時可不使用襯 墊’並且能以簡單操作將光罩均勻緊貼著基板的整個表面 的曝光方法及曝光裝置。 〔用以解決課題之手段〕 根據本發明時，可提供一種曝光方法，其爲可將繪有 電路圖案的光罩和形成有感光層在表面的的基板進行緊貼 配置，藉由將光通過光罩照射在基板上，使電路圖案轉印 在基板上的曝光方法，其具備：對「基板支撐用的基板支 撐台」和「成爲被安裝在該基板支撐台上的環狀密封構件 即由延續成可包圍著置放在該基板支撐台上之基板周圍的 中空構造彈性材料所形成的密封構件」進行準備的步驟； 將事先已知尺寸的基板於上述環狀密封構件所包圍的區域 內，使其置放在上述基板支撐台上的步驟；將繪有電路圖 案的光罩於覆蓋上述基板的位置，使其支撐在上述環狀密 封構件上的步驟；及，對「由上述基板支撐台和被置放在 上述基板支撐台上的上述基板及上述環狀密封構件以及被 置放在上述環狀密封構件上的上述光罩所圍成的第1空間 」和「構成爲上述密封構件之中空構造彈性材料內部的第 2空間」分別進行壓力供給的步驟；分別要供給至上述第 1空間及上述第2空間的壓力，其要使上述光罩可均勻緊 (5) (5)1329789 貼著本述事先已知尺寸之基板整個表面的適當値是事先已 知的壓力値。 此外，根據本發明時，可提供一種曝光方法，其爲可 將繪有電路圖案的光罩和形成有感光層在表面的的基板進 行緊貼配置，藉由將光通過光罩照射在基板上，使電路圖 案轉印在基板上的曝光方法，其具備：對「基板支撐用的 基板支撐台」和「成爲被安裝在該基板支撐台上的環狀密 封構件即由延續成可包圍著置放在該基板支撐台上之基板 周圍的中空構造彈性材料所形成的密封構件」進行準備的 步驟；將事先已知尺寸的基板於上述環狀密封構件所包圍 的區域內，使其置放在上述基板支撐台上的步驟；將繪有 電路圖案的光罩於覆蓋上述基板的位置，使其支撐在上述 環狀密封構件上的步驟；及，對「由上述基板支撐台和被 置放在上述基板支撐台上的上述基板及上述環狀密封構件 以及被置放在上述環狀密封構件上的上述光罩所圍成的第 1空間」和「構成爲上述密封構件之中空構造彈性材料內 部的第2空間」之分別的壓力可進行控制的壓力控制手段 中輸入上述基板的尺寸相關資訊的步驟；根據輸入在上述 壓力控制手段中之上述基板的尺寸相關資訊，該壓力控制 手段會決定出上述光罩可均勻緊貼著上述基板整個表面之 第1空間及第2空間的適當壓力，將該決定的壓力分別供 給至第1空間及第2空間。 也可於第2項所述之曝光方法中’對上述壓力控制手 段除了輸入上述基板的尺寸相關資訊外’又輸入表示著該 -8- (6) (6)1329789 基板_面狀態的資訊，在決定上述適當壓力値時亦採用表 示著該基板表面狀態的資訊。 再者，根據本發明時，可提供一種曝光裝置，其爲可 將繪有電路圖案的光罩和形成有感光層在表面的的基板進 行緊貼配置，藉由將光通過光罩照射在基板上，使電路圖 案轉印在基板上的曝光裝置，其具備：基板支撐用的基板 支撐台：成爲被安裝在該基板支撐台上的環狀密封構件， 是由延續成可包圍著置放在該基板支撐台上之基板周圍的 中空構造彈性材料所形成，其爲可支撐著繪有電路圖案之 光罩周圍邊緣部份的密封構件；及，成爲對「由上述基板 支撐台和被置放在上述基板支撐台上的上述基板及上述環 狀密封構件和被置放在上述環狀密封構件上的上述光罩所 圍成的第1空間」和「構成爲上述密封構件之中空構造彈 性材料內部的第2空間」之分別的壓力可進行控制的壓力 控制手段，其是藉由上述基板之尺寸相關資訊的輸入，使 其根據該所輸入之基板的尺寸相關資訊，決定出上述光罩 可均勻緊貼著上述基板整個表面之第1空間及第2空間的 適當壓力，使該決定的壓力分別可供給至第1空間及第2 空間內的壓力控制手段》 於該曝光裝置中，上述壓力控制手段，可構成爲具備 :壓力源；要連接該壓力源和上述第1空間的第1管路； 要連接上述壓力源和上述第2空間的第2管路；成爲分別 設置在上述第1及第2管路上的第1及第2壓力調節器， 是將分別所調節的壓力可供給至對上述第1及第2空間內 -9- (7) (7)1329789 的第，1及第2壓力調節器；及，根據上述所輸入之基板的 尺寸相關資訊來控制著上述第1及第2壓力調節器的控制 裝置。 再者，又可將上述控制裝置構成爲具備數據處理裝置 ’該數據處理裝置，是根據上述所輸入之基板的尺寸相關 資訊，計算出上述光罩可均勻緊貼著上述基板整個表面之 第1空間及第2空間內的適當壓力，將根據該結果進行的 輸出送往上述第1及第2壓力調節器。 【實施方式】 〔發明之實施形態〕 根據本發明之曝光裝置的一例槪略圖是圖示在第1圖 中。曝光裝置，包括：表面形成有感光層之基板11支撐 用的基板支撐台12;被安裝在基板支撐台12上的環狀密 封構件1 3 ;及，壓力控制手段。壓力控制手段，具備： 壓力源14及15;從這些壓力源14、15延伸出來的管路 16、17' 18及19;分別設置在管路16及17上的壓力調 節器20及21;這些壓力調節器20及21控用的控制裝置 22。壓力控制手段，也可又具備有分別設置在管路]6及 17上的三通閥23及24。基板支撐台12及環狀密封構件 13的構成’是與第2圖及第3圖所示的基板支撐台2及 環狀密封構件3相同。 在對從上一個製程搬運過來的基板1]進行支持的基 板支撑台12上，於其上面形成著開口的複數吸引孔25。 -10- (8) (8)1329789 這些吸引孔25連接於空氣壓力源（未圖示）。將基板π 置放在基板支撐台12上的指定位置上後，藉由空氣壓力 源對吸引孔25施加負壓，可吸緊保持著基板n。曝光結 束後’釋放吸引孔25的負壓，就可將基板I〗從基板支撐 · 台12拿起搬運至下一個製程。 環狀密封構件13，是延續成可包圍著基板11周圍的 . 無端構造。密封構件1 3，是以橫剖面形狀爲垂直軸比水 平軸端的扁平圓中空彈性材料製造。繪有電路圖案要轉印 · 在基板11上的光罩26是以可覆蓋著基板11的位置被支 撐在密封構件13上。彈性密封構件13的高度，是由其中 空內部的壓力和中介著光罩26所施加向下的力來決定。 於第1圖中，由：基板支撐台12;置放在基板支撐 ^ 台12上的基板11:被安裝在基板支撐台12上環狀密封 · 構件1 3 ;及，以密封狀態被支撐在環狀密封構件1 3上光 罩26，形成著封閉空間。將該空間和第3圖的狀況相同 ，稱爲第1空間2 7。同樣地’將中空的密封構件1 3之中 · 空內部的空間稱爲第2空間2 8。第1空間2 7，是由第1 管路16連接著第1壓力源14。另一方面，第2空間28， 是由第2管路17連接著第2壓力源15。第1及第2壓力 . 源14、15，均可做爲空氣壓力源。可將第1壓力源14爲 負壓源’第2壓力源15爲正壓源。 從第1壓力源及第2壓力源15要分別供給至第1 空間27及第2空間28之壓力的壓力値’是由設在第1管 路16上的第1壓力調節器20及設在第2管路17上的第 -11 - (9) (9)1329789 2壓;^調節器21來進行調節。由第1及第2壓力調節器 、21所要調節的壓力値，是由控制裝置22來決定。接 收著來自於控制裝置22之電訊號的壓力調節器20、21， 是將要供給至第1空間2 7及第2空間2 8的壓力調節成指 定値。 爲了要使成爲負壓的第1空間27內的壓力上昇恢復 成大氣壓，可利用是正壓源的第2壓力源15，此外，爲 了要使成爲正壓的第2空間28內的壓力減弱而恢復成大 氣壓，也可利用是負壓源的第1壓力源14。因此，也可 設有：中介著設在第1管路16上的第1三通閥23將第2 壓力源15和第1空間27連接的第3管路18;及，中介 著設在第2管路17上的第21三通閥24將第1壓力源14 和第2空間28連接的第4管路19。三通閥23、24的起 動，是可用來自於控制裝置22的電訊號來對其進行控制 〇 控制裝置22，具備數據處理裝置29。該數據處理裝 置29，是按照其得知的基板〗1的尺寸即長度、寬度、厚 度相關資訊，計算並決定光罩26可均勻緊貼在該基板11 整個表面上之適當的第1及第2空間27、28內的壓力。 基板11的尺寸相關資訊，可採用基板11的尺寸値，或基 板11爲具有數種指定尺寸之規格品時，也可採用表示著 其各個規格的編號或符號。爲後者之狀況時，數據處理裝 置29，是根據所輸入的編號或符號，而可得知該基板的 全部尺寸。數據處理裝置29，最好是在計算光罩26可均 •12- (10) (10)1329789 勻緊粘在該基板11整個表面上之第1及第2空間27、28 內的適當壓力時所需要資訊中，具有除了基板11的尺寸 相關資訊以外的其他全部資訊。 數據處理裝置29決定了光罩26可均勻緊貼在該基板 11整個表面上之第1及第2空間27、28內的適當壓力後 ，就會將根據其結果進行的輸出中介著控制裝置22送往 第1及第2壓力調節器20、21。壓力調節器20、21，是 接收來自於控制裝置22的輸出，將來自於壓力源14、15 的壓力調節成上述決定値然後供給至第1空間及第2空間 〇 做爲要輸入在數據處理裝置29內的資訊，也可追加 表示著基板11表面狀態的資訊。在之第1及第2空間27 、28內的適當壓力決定當前，藉由對基板n的尺寸相關 資訊又追加表示著基板11表面狀態的資訊，可更確實地 使光罩26均勻緊貼在該基板u整個表面上。 接著’說明作用。形成有感光層在其表面上的基板 11 ’是從上一個製程搬運過來，在環狀密封構件13上所 圍繞的區域內置放在基板支撐台12上。於吸引孔25作用 著負壓’基板11是被吸緊固定在基板支撐台]2上。繪有 電路圖案的光罩26，是於要覆蓋基板11的位置上以配合 著該基板位置的狀態被支撐在密封構件13上。對數據處 理裝置29輸入基板n的尺寸相關資訊《控制裝置22， 會根據基板11的尺寸相關資訊，計算並決定光罩26可均 勻緊貼在該基板11整個表面上之第丨及第2空間27、28 -13- (11) (11)1329789 內的轉當壓力。 數據處理裝置29’是中介著控制裝置22，將根據著 上述所決定之壓力的輸出送往第1及第2壓力調節器20 、21»第1及第2壓力調節器20、21，會將來自於第I 及第2壓力源14、15的壓力調節成上述所決定的壓力， 然後供給至第1及第2空間27、28。此時，第1三通閥 23，是形成爲使負壓源的第1壓力源14連接於第1空間 27’第2三通閥24是形成爲使是正壓源的第2壓力源15 連接於第2空間28。根據本發明時，藉由對第1空間27 及第2空間供給適當壓力値的壓力，可使光罩26的周圍 邊緣部份在最終的狀態並不會往下垂（第4圖的狀態），反 之亦不會使其往上舉（第5圖的狀態），可使光罩26均勻 緊貼在基板11的整個表面上。 藉由將光30通過光罩26照射在基板11上，可使繪 製在光罩26上的電路圖案轉印在基板11上。然後，爲了 將基板11搬運至下一個製程，必須使其和光罩26分離。 所以切換第1三通閥23連接第1空間27和是正壓源的第 2壓力源15，將已成爲負壓的第1空間27上昇壓力的同 時，切換第2三通閥24連接第2空間28和是正壓源的第 1壓力源14，藉由減弱已是正壓的第2空間28的壓力， 使光罩26不被施有使其變形的力，而可迅速離開基板11 成爲第1圖的狀態。然後，取走光罩26，停止對吸引孔 25的負壓作用，使基板11從基板支撐台12被搬運至下 一個製程。 -14- (12) (12)1329789 爲了使光罩2 6和基板11之間確實沒有殘留空氣地使 兩者互相緊貼在一起，也可將光罩26的周圍邊緣部份採 用如第5圖所示般從被舉起的狀態徐徐的往下降的方法。 爲該狀況時，是於最初，將第1空間27內的壓力形成爲 負壓的同時，將第2空間28內的壓力形成爲較高的正壓 値。如此一來，光罩26，就會如第5圖所示般因其周圍 邊緣部份被舉起使其形成爲向上凹的形狀。此時，只有基 板Π的中央區域是緊貼著光罩2 6。從該狀態將密封構件 13內的第2空間28的壓力徐徐的逐漸往下降時，光罩26 就會逐漸成爲平坦的形狀，隨著該變化，基板11和光罩 26的接觸部份，也會逐漸從基板11的中央區域擴大至周 邊區域，於最終可使光罩26均勻緊貼著基板11的整個表 面。 以上雖示有藉由自動控制對第1空間2 7及第2空間 28進行適當壓力値的壓力供給方法，但也可藉由手控操 作8進行適當壓力値的壓力供給。於該狀況時，對於所使 用的每個基板的尺寸，都必須於事先得知對第1及第2空 間所要供給的適當壓力値。即，對於某尺寸的基板，爲要 使光罩可均勻緊貼著該尺寸之基板的整個表面而需於事先 調查對第1及第2空間是要供給多少値的壓力爲佳。分別 針對所要使用之基板的複數尺寸模式，若能於事先得知對 第1及第2空間所要供給之適當的壓力値模式時，就能以 手控操作進行適當的壓力調整。壓力調整，也可將第1及 第2壓力調整器20、21直接經由手控操作來執行，也可 -15- (13) (13)1329789 將控制裝置22用手控操作來控制第1及第2壓力調整器 20 ' 21。 當環狀密封構件所形成的矩形縱橫尺寸比和基板的縱 橫尺寸比有明顯不同的狀況時，要將光罩緊貼著基板的整 個表面就會變得比較困難。例如環狀密封構件所形成的矩 形爲近似正方形，另一方面，基板是形成爲細長的矩形狀 時，基板的邊緣和環狀密封構件之間的距離，在左右方向 和前後方向都不會相同。因此，光罩的撓度沿著其周圍也 會形成不一樣。於該狀況下對第1及第2空間分別供給壓 力時，當要在基板的長邊側使光罩緊貼時，於基板的短邊 側光罩就會上浮。其結果，光罩是無法完全緊貼著基板的 整個表面。此外，若基板的尺寸比環狀密封構件所形成的 矩形尺寸明顯爲小時，因基板的邊緣和環狀密封構件之間 的距離會變大，所以光罩的撓度也會變大。因此，需施加 在光罩上的力量光靠環狀密封構件內的壓力是不夠。 於第6圖及第7圖中，表示著爲要解決上述問題點之 根據本發明的曝光裝置另一實施例。於該另一實施例中， 在基板支撐台12上安裝著分別平形於基板一邊由細長中 空構成彈性材料所形成的輔助構件51、52、53及54。於 圖示實施例中，雖是於沿著基板的四邊分別設有四個 輔助構件51至54，但也可因應所要使用之基板的尺寸及 形狀，設有一個以上之任意數量的輔助構件。此外，於圖 示實施例中，輔助構件51至54雖是被配置在環狀密封構 件1 3的內側，但也可配置在其外側。輔助構件5 1至5 4 -16- (14) (14)1329789 的剖®形狀，也可和環狀密封構件1 3相同’或者，也可 改變其形狀或大小。將輔助構件51至54的中空內部空間 稱爲第3空間5 5。輔助構件5 1至5 4之各別的第3空間 55，是由各別的管路（於第7圖中僅圖示連接著輔助構件 51及53的管路51a及53a)，中介著壓力調節器（未圖示） 連接於壓力源（未圖示）。可控制成互不相同的壓力。輔 助構件51至54之各別的第3空間55內的壓力，是由控 制裝置22來控制。當基板1 1的尺寸及表示著其表面狀態 的資訊被輸入在數據處理裝置29時，控制裝置22會根據 這些資訊，在計算並決定出光罩26可均勻緊貼著基板11 的整個表面之第1、第2及第3空間27'28、55內的適 當壓力後，將所決定的壓力供給至這些空間27、28、55 。第3空間的壓力可分別於輔助構件5 1至54中，進行個 別決定且供給。 於該實施例中，即使因基板的形狀或尺寸的關係使光 罩的各邊撓度互爲不同或太大時，但因輔助構件51至54 內的壓力所產的個別力量會以輔助著環狀密封構件13內 壓力所產生的一致力量來作用於光罩，所以能夠將可因應 撓度量的適當力量作用在光罩的各邊。 〔發明效果〕 根據本發明時，因於曝光時可不使用襯墊，所以不會 產生因襯墊的選擇及安裝的失敗所造成的曝光瑕疵。安裝 襯墊等麻煩的作業也可省略。 -17- (15) (15)1329789 典外，只要將基板的尺寸相關資訊輸入在壓力控制手 段等簡單的作業，就可使光罩均勻緊貼著基板整個表面。 因此，本發明對曝光時之作業性的提昇及瑕疵率的降 低貢獻不小。 【圖式簡單說明】 第1圖爲本發明之曝光裝置的一實施例槪略剖面圖。 第2圖爲習知曝光裝置的平面圖。 第3圖爲習知曝光裝置的剖面圖。 第4圖爲表示習知曝光裝置中光罩和基板的緊貼爲不 確實之一例剖面圖。 第5圖爲表示習知曝光裝置中光罩和基板的緊貼爲不 確實之另一例剖面圖。 第6圖爲本發明之曝光裝置之另一實施例槪略平面圖 〇 第7圖爲本發明之曝光裝置之另一實施例槪略剖面圖 〇 【圖號說明】 1 :基板 2 :基板支撐台 3 :密封構件 4 :吸引孔 5 :管路 6 :光罩 18- (16) (16)1329789 7 :第1空間 8 :第2空間 9 :管路 1 1 :基板 1 2 :基板支撑台 1 3 :密封構件 14 :第1壓力源（負壓源） 15 :第2壓力源（正壓源） 16 :第1管路 1 7 :第2管路 1 8 :第3管路 19 :第4管路 20 :第1壓力調整器 21 :第2壓力調整器 2 2 :控制裝置 23 :第1三通閥 2 4 :第2三通閥 2 5 ·吸引孔 26 :光罩 27 :第1空間 2 8 :第2空間 29 :數據處理裝置 30 :光 51 、 52 、 53 、 54 :輔助構件 -19- 13297891329789 (1) 玖, hair (4) Description 4 [Technical Field of the Invention] The present invention relates to a photomask having a circuit pattern and a substrate on which a photosensitive layer is formed on a surface, by arranging light An exposure method and an exposure apparatus that irradiate a substrate onto a substrate by a photomask to transfer the circuit pattern onto the substrate. [Prior Art] For example, a substrate such as a substrate for a printed circuit is not necessarily flat. In order for the circuit pattern drawn on the reticle to be faithfully transferred onto such a non-flat surface, it is necessary to uniformly close the reticle to the entire surface of the substrate. Therefore, a method and apparatus for making a space between a reticle and a substrate a negative pressure space to closely adhere to the two are known in the prior art, and the second and third figures show the above-mentioned conventional exposure apparatus. . The exposure device includes a substrate supporting table 2 for supporting the substrate 1 and an annular sealing member 3 mounted on the substrate supporting table 2. Φ A photosensitive layer is formed on the surface of the substrate 1. On the substrate supporting table 2, a plurality of suction holes 4 are formed, and these suction holes 4 are connected to an air pressure source (not shown). A negative pressure is applied to the suction hole 4 by the air pressure source, so that the substrate 1 can be sucked and held on the substrate support table 2. When the negative pressure is released, the substrate 1 can be removed from the substrate support table 2. The annular seal member 3, as shown in Fig. 2, continues to surround the substrate 1 placed on the substrate support table 2. The annular seal member 3, as shown in Fig. 3, is composed of a hollow elastic material. Hollow -4- (2) (2) 1329789 The inside of the seal floor 3 is connected to an air pressure source β (not shown) by a pipe 5 by adjusting the supply air from the air pressure source. The internal pressure of the sealing member 3 changes. The sealing member 3' composed of an elastic material is caused to have a height change by its internal pressure and the force applied from above. On the sealing member 3, the reticle 6 is supported at a position that can cover the substrate. On the photomask 6, a circuit pattern to be transferred onto the substrate 1 is drawn. In the state of Fig. 3, the photomask 6 is supported on the sealing member 3 with a gap therebetween. The peripheral edge portion of the photomask 6 is supported by the sealing member 3 in a sealed state with the upper portion of the sealing member 3, so that the substrate supporting table 2 and the substrate 1 placed on the substrate supporting table 2 and The annular sealing member 3 and the reticle 6 form a closed space. This space is referred to as a first space 7. On the other hand, the closed internal space of the hollow sealing member 3 is referred to as a second space 8. In the first space 7, an air pressure source (not shown) is connected to the pipe 9. By adjusting the supply pressure 来自 from the air pressure source to which the line 9 and the line 5 are connected, the pressure in the first space 7 and the second space 8 can be changed. When the exposure is performed, the pressure in the first space 7 is a negative pressure, and the pressure in the second space 8 is atmospheric pressure or positive pressure, so that the mask 6 supported on the sealing member 3 can be lowered. Adheres to the surface of the substrate 1. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] -5 - 1329789 (3) However, in the above method, there is no guarantee that the photomask 6 can be firmly adhered to the substrate 1. This is because it is difficult to balance the pressure in the first space 7 and the pressure in the second space 8. Further, when the size (length, width, and thickness) of the substrate 1 is changed, it is difficult to perform each change. Pressure regulation. 4 is a view showing that the positive pressure in the second space 8 is too low to sufficiently maintain the height of the peripheral edge portion of the mask 6, and the negative pressure in the first space 7 causes the mask 6 to bend upward. An example of a convex shape. When this state is reached, air remains between the substrate 1 and the reticle 6, and it is difficult for the reticle 6 to closely contact the entire surface of the substrate 1. Fig. 5' is a view showing that the positive pressure in the second space 8 is too high to sufficiently lower the peripheral edge portion of the mask 6, and the negative pressure in the first space 7 causes the mask 6 to be bent upward to be concave. An example of a shape. In this state, the peripheral edge region of the substrate 1 does not abut against the mask 6. When the pressure in the second space 8 is gradually lowered from this state, when the pressure becomes a certain pressure ,, there is no air between the substrate 1 and the reticle 6, and the reticle 6 can be brought close to the substrate I. The entire surface. However, the subtle work of making the appropriate pressure 决定 decision is difficult to perform manually, and it is cumbersome to perform the job on each of the different sized substrates. Therefore, it is conceivable to arrange a spacer having the same thickness as the substrate around the substrate. With this spacer, large bending of the substrate can be prevented. It is also possible to prevent the substrate support table from being bent when the strength of the substrate support table is low. However, when a substrate having a different size (length, width, thickness) is used, it is necessary to replace it with a spacer suitable for the size of the substrate. This is a complicated -6- (4) (4) 1329789 operation. β In addition, if the choice of the liner is not appropriate, or when the installation of the liner is not correct, the reticle and the substrate cannot be brought into close contact. It will be the cause of the defective products in the exposure process. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an exposure method and an exposure apparatus which can be used without exposure to a substrate and can be uniformly adhered to the entire surface of a substrate with a simple operation. [Means for Solving the Problem] According to the present invention, it is possible to provide an exposure method in which a photomask having a circuit pattern and a substrate on which a photosensitive layer is formed are placed in close contact with each other by passing light An exposure method in which a photomask is irradiated onto a substrate to transfer a circuit pattern onto a substrate, and includes: a substrate support table for supporting the substrate; and an annular sealing member to be mounted on the substrate support table a step of preparing a sealing member formed by a hollow structural elastic material surrounding a substrate placed on the substrate supporting table; and a substrate of a previously known size in a region surrounded by the annular sealing member a step of placing the photomask on the substrate support table; a step of covering the substrate with the circuit pattern to cover the substrate, and supporting the substrate on the annular sealing member; and And the substrate and the annular sealing member placed on the substrate supporting table and the photomask placed on the annular sealing member The first space ” and the “second space inside the hollow structural elastic material constituting the sealing member” are respectively supplied with pressure, and the pressures to be supplied to the first space and the second space are respectively made The reticle can be evenly tight (5) (5) 1329789 The appropriate 値 attached to the entire surface of the substrate of the previously known size is a previously known pressure 値. In addition, according to the present invention, an exposure method can be provided in which a photomask having a circuit pattern and a substrate on which a photosensitive layer is formed are disposed in close contact with each other by irradiating light onto the substrate through the photomask. An exposure method for transferring a circuit pattern onto a substrate, comprising: continuing to be surrounded by the substrate support table for supporting the substrate and the annular sealing member to be mounted on the substrate support table a step of preparing a sealing member formed of a hollow structural elastic material placed on a substrate on the substrate supporting table; placing a substrate of a previously known size in a region surrounded by the annular sealing member a step of the substrate supporting table; a step of covering the substrate at a position covering the substrate to support the annular sealing member; and "sitting and placing the substrate by the substrate The substrate and the annular sealing member on the substrate supporting table and the first space surrounded by the photomask placed on the annular sealing member a step of inputting size-related information of the substrate into a pressure control device capable of controlling a pressure of each of the second space in the hollow structural elastic material of the sealing member; and the size of the substrate according to the pressure control means input According to the related information, the pressure control means determines that the reticle can uniformly adhere to the first space and the second space of the entire surface of the substrate, and supplies the determined pressure to the first space and the second space. In the exposure method described in the second aspect, the pressure control means may input information indicating the state of the -8-(6) (6) 1329789 substrate in addition to the size-related information of the substrate. Information indicating the surface state of the substrate is also used when determining the appropriate pressure 上述. Furthermore, according to the present invention, an exposure apparatus can be provided which can closely align a photomask having a circuit pattern and a substrate on which a photosensitive layer is formed, by irradiating light through the reticle to the substrate. An exposure apparatus for transferring a circuit pattern onto a substrate, comprising: a substrate supporting table for supporting the substrate: an annular sealing member attached to the substrate supporting table, which is extended to be placed around the substrate Formed by a hollow structural elastic material around the substrate on the substrate support table, which is a sealing member capable of supporting a peripheral edge portion of the photomask with the circuit pattern; and is placed on the substrate support table and placed The substrate and the annular sealing member on the substrate supporting table and the first space surrounded by the photomask placed on the annular sealing member and the hollow structural elastic material constituting the sealing member The pressure control means for controlling the respective pressures of the internal second space" is based on the input of the size information of the substrate, so that the input is based on the input The size information of the substrate determines that the mask can uniformly adhere to the first space and the second space of the entire surface of the substrate, and the determined pressure can be supplied to the first space and the second space. In the exposure apparatus, the pressure control means may include: a pressure source; a first line to which the pressure source and the first space are to be connected; and a pressure source and the second space to be connected a second conduit; the first and second pressure regulators respectively provided on the first and second conduits, wherein the respective adjusted pressures are supplied to the first and second spaces -9- ( 7) (7) 1329789, the first and second pressure regulators; and controlling the first and second pressure regulators based on the size information of the input substrate. Furthermore, the control device may be configured to include a data processing device. The data processing device calculates the first uniformity of the photomask that can be uniformly adhered to the entire surface of the substrate based on the size information of the input substrate. The space and the appropriate pressure in the second space are sent to the first and second pressure regulators based on the result. [Embodiment] [Embodiment of the Invention] An outline of an exposure apparatus according to the present invention is shown in Fig. 1 . The exposure apparatus includes: a substrate supporting table 12 for supporting the substrate 11 on which the photosensitive layer is formed; an annular sealing member 13 attached to the substrate supporting table 12; and a pressure control means. The pressure control means comprises: pressure sources 14 and 15; lines 16, 17' 18 and 19 extending from the pressure sources 14, 15; pressure regulators 20 and 21 respectively disposed on the lines 16 and 17; The pressure regulators 20 and 21 control the control device 22. The pressure control means may also be provided with three-way valves 23 and 24 which are respectively disposed on the pipes 6 and 17. The configuration of the substrate supporting table 12 and the annular sealing member 13 is the same as that of the substrate supporting table 2 and the annular sealing member 3 shown in Figs. 2 and 3 . On the substrate supporting table 12 which supports the substrate 1] conveyed from the previous process, an opening plurality of suction holes 25 are formed thereon. -10- (8) (8) 1329789 These suction holes 25 are connected to an air pressure source (not shown). After the substrate π is placed at a predetermined position on the substrate supporting table 12, a negative pressure is applied to the suction hole 25 by the air pressure source, whereby the substrate n can be held by suction. After the exposure is completed, the negative pressure of the suction hole 25 is released, and the substrate I can be picked up from the substrate support table 12 and transported to the next process. The annular sealing member 13 is continuous to surround the periphery of the substrate 11. The endless structure. The sealing member 13 is made of a flat circular hollow elastic material whose cross-sectional shape is a vertical axis and a horizontal axis end. A circuit pattern is drawn to be transferred. The photomask 26 on the substrate 11 is supported on the sealing member 13 at a position where the substrate 11 can be covered. The height of the elastic sealing member 13 is determined by the pressure inside the hollow and the downward force exerted by the reticle 26. In Fig. 1, a substrate supporting table 12 is disposed; a substrate 11 placed on the substrate supporting table 12 is mounted on the substrate supporting table 12 with an annular seal member 1 3; and is supported in a sealed state. The annular sealing member 13 is attached to the mask 26 to form a closed space. This space is the same as the condition of Fig. 3 and is referred to as a first space 27. Similarly, the space inside the hollow sealing member 13 is referred to as a second space 28. The first space 27 is connected to the first pressure source 14 by the first line 16. On the other hand, in the second space 28, the second pressure source 15 is connected to the second conduit 17. First and second pressures. Sources 14, 15 can be used as air pressure sources. The first pressure source 14 can be a negative pressure source. The second pressure source 15 is a positive pressure source. The pressure 値' to be supplied to the pressures of the first space 27 and the second space 28 from the first pressure source and the second pressure source 15 is provided by the first pressure regulator 20 provided in the first line 16 and The -11 - (9) (9) 1329789 2 pressure on the second line 17 is adjusted by the regulator 21. The pressure 要 to be adjusted by the first and second pressure regulators 21 is determined by the control unit 22. The pressure regulators 20 and 21 that receive the electric signals from the control unit 22 adjust the pressure to be supplied to the first space 27 and the second space 28 to a predetermined value. In order to restore the pressure rise in the first space 27 that becomes the negative pressure to the atmospheric pressure, the second pressure source 15 that is the positive pressure source can be used, and the pressure in the second space 28 that is the positive pressure is weakened. It is also possible to use the first pressure source 14 which is a source of negative pressure when it is returned to atmospheric pressure. Therefore, a third conduit 18 that connects the second pressure source 15 and the first space 27 via the first three-way valve 23 provided in the first conduit 16 may be provided; The 21st three-way valve 24 in the line 17 connects the first pressure source 14 and the fourth line 19 connected to the second space 28. The three-way valves 23, 24 are activated by an electrical signal from the control unit 22, and the control unit 22 is provided with a data processing unit 29. The data processing device 29 calculates and determines the appropriate first and second portions of the mask 26 that can be uniformly adhered to the entire surface of the substrate 11 in accordance with the length, width, and thickness related information of the substrate size 1 known. 2 The pressure in the space 27, 28. For the size-related information of the substrate 11, the size of the substrate 11 can be used, or when the substrate 11 is a specification having a plurality of specified sizes, a number or a symbol indicating each of the specifications can be used. In the latter case, the data processing device 29 knows the entire size of the substrate based on the number or symbol input. Preferably, the data processing device 29 is configured to calculate the appropriate pressure in the first and second spaces 27, 28 of the entire surface of the substrate 11 when the reticle 26 can be uniformly 12-(10) (10) 1329789 The required information has all the information except the size related information of the substrate 11. The data processing device 29 determines that the photomask 26 can uniformly adhere to the appropriate pressures in the first and second spaces 27 and 28 on the entire surface of the substrate 11, and then outputs the control device 22 based on the result. It is sent to the first and second pressure regulators 20 and 21. The pressure regulators 20, 21 receive the output from the control device 22, adjust the pressure from the pressure sources 14, 15 to the above-described determination, and then supply them to the first space and the second space as input to be processed in the data processing. Information indicating the surface state of the substrate 11 may be added to the information in the device 29. The appropriate pressure in the first and second spaces 27 and 28 is determined. By adding information indicating the surface state of the substrate 11 to the size-related information of the substrate n, the mask 26 can be more reliably adhered to the mask 26. The substrate u is on the entire surface. Next, the effect is explained. The substrate 11' on which the photosensitive layer is formed on the surface thereof is transported from the previous process, and the area surrounded by the annular sealing member 13 is built-in on the substrate supporting table 12. The negative pressure is applied to the suction hole 25. The substrate 11 is suction-fixed to the substrate support table 2 . The photomask 26 on which the circuit pattern is drawn is supported on the sealing member 13 in a state where the substrate 11 is to be covered to match the position of the substrate. The data processing device 29 inputs the size-related information of the substrate n. The control device 22 calculates and determines the second and second spaces in which the mask 26 can be uniformly adhered to the entire surface of the substrate 11 based on the size-related information of the substrate 11. 27, 28 -13- (11) (11) The pressure in the 1329789. The data processing device 29' is an intermediate control device 22 that sends the output according to the determined pressure to the first and second pressure regulators 20, 21» the first and second pressure regulators 20, 21, and will The pressure from the first and second pressure sources 14 and 15 is adjusted to the above-described determined pressure, and then supplied to the first and second spaces 27 and 28. At this time, the first three-way valve 23 is formed such that the first pressure source 14 of the negative pressure source is connected to the first space 27'. The second three-way valve 24 is formed so that the second pressure source 15 is a positive pressure source. Connected to the second space 28. According to the present invention, by supplying a pressure of an appropriate pressure 对 to the first space 27 and the second space, the peripheral edge portion of the reticle 26 can be sagged in the final state (the state of Fig. 4). Conversely, it is not lifted up (state of Fig. 5), and the photomask 26 can be uniformly attached to the entire surface of the substrate 11. The circuit pattern drawn on the photomask 26 can be transferred onto the substrate 11 by irradiating the light 30 through the mask 26 onto the substrate 11. Then, in order to carry the substrate 11 to the next process, it must be separated from the reticle 26. Therefore, the first three-way valve 23 is connected to the first space 27 and the second pressure source 15 that is the positive pressure source, and the first space 27 that has become the negative pressure is raised, and the second three-way valve 24 is switched to the second. The space 28 and the first pressure source 14 which is a positive pressure source can quickly move away from the substrate 11 by weakening the pressure of the second space 28 which is already positive pressure, so that the mask 26 is not subjected to the force for deforming it. The state of Figure 1. Then, the mask 26 is removed, the negative pressure on the suction holes 25 is stopped, and the substrate 11 is transported from the substrate support table 12 to the next process. -14- (12) (12) 1329789 In order to make the two of the reticle 26 and the substrate 11 do not have residual air, the peripheral edge portion of the reticle 26 can be used as the fifth. The method of descending from the state of being lifted as shown in the figure. In this case, the pressure in the first space 27 is initially set to a negative pressure, and the pressure in the second space 28 is formed to a high positive pressure 値. As a result, the photomask 26 is lifted into a concave shape by the peripheral edge portion as shown in Fig. 5. At this time, only the central portion of the substrate 紧 is in close contact with the reticle 26. When the pressure of the second space 28 in the sealing member 13 gradually decreases from this state, the mask 26 gradually becomes a flat shape, and the contact portion between the substrate 11 and the mask 26 also changes with this change. Gradually expanding from the central region of the substrate 11 to the peripheral region, the photomask 26 is finally brought into close contact with the entire surface of the substrate 11. Although the pressure supply method for appropriately pressing the first space 27 and the second space 28 by automatic control has been described above, the pressure supply of the appropriate pressure 也 can be performed by the manual operation 8. In this case, it is necessary to know in advance the appropriate pressure 要 to be supplied to the first and second spaces for each of the substrates to be used. In other words, in order to make the mask uniformly adhere to the entire surface of the substrate of a certain size, it is necessary to investigate in advance how much pressure is to be supplied to the first and second spaces. For the complex size mode of the substrate to be used, if the appropriate pressure 値 mode to be supplied to the first and second spaces is known in advance, appropriate pressure adjustment can be performed by manual operation. Pressure adjustment, the first and second pressure regulators 20, 21 can also be directly operated by manual operation, or -15- (13) (13) 1329789 control device 22 can be manually operated to control the first and The second pressure regulator 20 '21. When the rectangular cross-sectional dimension ratio formed by the annular sealing member is significantly different from the aspect ratio of the substrate, it becomes difficult to adhere the reticle to the entire surface of the substrate. For example, when the rectangular sealing member has a rectangular shape which is approximately square, and the substrate is formed into an elongated rectangular shape, the distance between the edge of the substrate and the annular sealing member is not the same in the left-right direction and the front-rear direction. . Therefore, the deflection of the reticle will be different along its circumference. When pressure is applied to each of the first and second spaces in this state, when the mask is to be brought into close contact with the long side of the substrate, the mask is lifted on the short side of the substrate. As a result, the photomask cannot completely contact the entire surface of the substrate. Further, if the size of the substrate is significantly smaller than the rectangular size formed by the annular sealing member, the distance between the edge of the substrate and the annular sealing member becomes large, so that the deflection of the mask is also increased. Therefore, it is not enough that the force to be applied to the reticle is caused by the pressure in the annular sealing member. In Figs. 6 and 7, there is shown another embodiment of the exposure apparatus according to the present invention which is to solve the above problems. In the other embodiment, the substrate supporting table 12 is provided with auxiliary members 51, 52, 53 and 54 which are formed by forming an elastic material from the elongated hollow space, respectively, on the side of the substrate. In the illustrated embodiment, although four auxiliary members 51 to 54 are provided along four sides of the substrate, one or more auxiliary members may be provided in accordance with the size and shape of the substrate to be used. Further, in the illustrated embodiment, the auxiliary members 51 to 54 are disposed on the inner side of the annular sealing member 13, but may be disposed on the outer side thereof. The cross-sectional shape of the auxiliary members 5 1 to 5 4 -16- (14) (14) 1329789 may be the same as that of the annular sealing member 13 or may be changed in shape or size. The hollow inner space of the auxiliary members 51 to 54 is referred to as a third space 55. The respective third spaces 55 of the auxiliary members 5 1 to 5 4 are separated by respective pipes (only the pipes 51a and 53a to which the auxiliary members 51 and 53 are connected are illustrated in Fig. 7). A regulator (not shown) is connected to a pressure source (not shown). Can be controlled to different pressures. The pressure in each of the third spaces 55 of the auxiliary members 51 to 54 is controlled by the control device 22. When the size of the substrate 11 and the information indicating the surface state thereof are input to the data processing device 29, the control device 22 calculates and determines that the photomask 26 can be uniformly adhered to the entire surface of the substrate 11 based on the information. 1. After the appropriate pressure in the second and third spaces 27'28, 55, the determined pressure is supplied to the spaces 27, 28, 55. The pressure in the third space can be individually determined and supplied to the auxiliary members 51 to 54 respectively. In this embodiment, even if the deflections of the sides of the reticle are different or too large due to the shape or size of the substrate, the individual forces generated by the pressure in the auxiliary members 51 to 54 assist the ring. The uniform force generated by the pressure in the sealing member 13 acts on the reticle, so that an appropriate force against the metric can be applied to each side of the reticle. [Effect of the Invention] According to the present invention, since the spacer is not used at the time of exposure, exposure defects caused by the selection of the spacer and the failure of mounting are not caused. Troublesome tasks such as installing a gasket can also be omitted. -17- (15) (15) 1329789 In addition, simply input the size information of the substrate into a simple operation such as pressure control, and make the mask evenly adhere to the entire surface of the substrate. Therefore, the present invention contributes to an improvement in workability at the time of exposure and a decrease in the defect rate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an embodiment of an exposure apparatus of the present invention. Figure 2 is a plan view of a conventional exposure apparatus. Figure 3 is a cross-sectional view of a conventional exposure apparatus. Fig. 4 is a cross-sectional view showing an example in which the photomask and the substrate are in close contact with each other in the conventional exposure apparatus. Fig. 5 is a cross-sectional view showing another example in which the photomask and the substrate are in close contact with each other in the conventional exposure apparatus. Figure 6 is a schematic plan view of another embodiment of the exposure apparatus of the present invention. Figure 7 is a schematic cross-sectional view showing another embodiment of the exposure apparatus of the present invention. [Illustration of the figure] 1 : Substrate 2: Substrate support table 3 : sealing member 4 : suction hole 5 : pipe 6 : reticle 18 - (16) (16) 1329789 7 : first space 8 : second space 9 : pipe 1 1 : substrate 1 2 : substrate support table 1 3 : Sealing member 14 : First pressure source (negative pressure source) 15 : Second pressure source (positive pressure source) 16 : First line 1 7 : Second line 1 8 : Third line 19 : 4th Pipe 20 : First pressure regulator 21 : Second pressure regulator 2 2 : Control device 23 : First three-way valve 2 4 : Second three-way valve 2 5 · Suction hole 26 : Photomask 27 : First space 2 8 : second space 29 : data processing device 30 : light 51 , 52 , 53 , 54 : auxiliary member -19- 1329789