TWI327109B - - Google Patents

Download PDF

Info

Publication number
TWI327109B
TWI327109B TW96110888A TW96110888A TWI327109B TW I327109 B TWI327109 B TW I327109B TW 96110888 A TW96110888 A TW 96110888A TW 96110888 A TW96110888 A TW 96110888A TW I327109 B TWI327109 B TW I327109B
Authority
TW
Taiwan
Prior art keywords
solder paste
print head
screen
template
workpiece
Prior art date
Application number
TW96110888A
Other languages
English (en)
Chinese (zh)
Other versions
TW200800612A (en
Inventor
Norio Gouko
Toshihisa Taniguchi
Atsushi Sakaida
Yuji Tuduki
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of TW200800612A publication Critical patent/TW200800612A/zh
Application granted granted Critical
Publication of TWI327109B publication Critical patent/TWI327109B/zh

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
TW96110888A 2006-06-20 2007-03-28 Screen printing apparatus and its printing method TW200800612A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006170488A JP4775133B2 (ja) 2006-06-20 2006-06-20 スクリーン印刷装置及びその印刷方法

Publications (2)

Publication Number Publication Date
TW200800612A TW200800612A (en) 2008-01-01
TWI327109B true TWI327109B (ja) 2010-07-11

Family

ID=39005695

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96110888A TW200800612A (en) 2006-06-20 2007-03-28 Screen printing apparatus and its printing method

Country Status (2)

Country Link
JP (1) JP4775133B2 (ja)
TW (1) TW200800612A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472404B (zh) * 2011-07-15 2015-02-11 Hitachi High Tech Instr Co Ltd 2-axis drive mechanism and wafer bonding machine

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101159101B1 (ko) * 2008-08-13 2012-06-22 주식회사 엘지화학 우수한 결합력을 제공하는 솔더링 방법
US9370923B1 (en) * 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
EP3960459A4 (en) * 2019-04-26 2022-05-11 Fuji Corporation SUPPLY UNIT, PRINTING DEVICE AND PRINTING DEVICE CONTROL METHOD

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10296960A (ja) * 1997-04-30 1998-11-10 Juki Corp クリーム半田印刷機
JP4330720B2 (ja) * 1999-08-27 2009-09-16 ヤマハ発動機株式会社 スクリーン印刷機の印刷剤供給装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472404B (zh) * 2011-07-15 2015-02-11 Hitachi High Tech Instr Co Ltd 2-axis drive mechanism and wafer bonding machine

Also Published As

Publication number Publication date
JP2008000923A (ja) 2008-01-10
JP4775133B2 (ja) 2011-09-21
TW200800612A (en) 2008-01-01

Similar Documents

Publication Publication Date Title
KR100659362B1 (ko) 스크린 인쇄장치 및 그의 인쇄방법
WO2001007255A1 (fr) Dispositif d'impression a soudure en pate et son procede d'impression
TWI527258B (zh) 圖案形成方法及其形成裝置
TWI357381B (ja)
JP5126170B2 (ja) スクリーン印刷装置およびスクリーン印刷方法
JP5408159B2 (ja) スクリーン印刷装置およびスクリーン印刷方法
TWI327110B (ja)
JP6155468B2 (ja) 電子部品実装方法及び電子部品実装システム
TWI327109B (ja)
JP2015109397A (ja) 電子部品実装方法及び電子部品実装システム
KR20120003851A (ko) 스크린 인쇄 장치 및 스크린 인쇄 방법
JP5126172B2 (ja) スクリーン印刷装置およびスクリーン印刷方法
TWI327108B (ja)
TWI332374B (ja)
JP6052995B2 (ja) メタルマスクを用いた印刷方法及びその装置並びにフリップチップ混載実装方法及びその装置
TWI358250B (ja)
JP6748844B2 (ja) スクリーン印刷方法
TWI614147B (zh) 印刷方法及印刷裝置
JP5185806B2 (ja) スクリーン印刷機
JP2001185839A (ja) ペースト供給装置およびペースト供給方法
JP2023088627A (ja) 印刷装置、印刷方法
JP2004335810A (ja) クリームはんだ印刷機
JP2013111847A (ja) スクリーン印刷機
JP2014141028A (ja) スクリーン印刷装置及び印刷方法