TWI327105B - Thermal adhesive polyester film, production method of ic card or ic tag using it, and ic card or ic tag - Google Patents
Thermal adhesive polyester film, production method of ic card or ic tag using it, and ic card or ic tag Download PDFInfo
- Publication number
- TWI327105B TWI327105B TW95115282A TW95115282A TWI327105B TW I327105 B TWI327105 B TW I327105B TW 95115282 A TW95115282 A TW 95115282A TW 95115282 A TW95115282 A TW 95115282A TW I327105 B TWI327105 B TW I327105B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- film
- polyester film
- adhesive layer
- adhesive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/455—Associating two or more layers using heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/465—Associating two or more layers using chemicals or adhesives
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24959—Thickness [relative or absolute] of adhesive layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249983—As outermost component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005131376 | 2005-04-28 | ||
JP2005131373 | 2005-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200704513A TW200704513A (en) | 2007-02-01 |
TWI327105B true TWI327105B (en) | 2010-07-11 |
Family
ID=37308049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95115282A TWI327105B (en) | 2005-04-28 | 2006-04-28 | Thermal adhesive polyester film, production method of ic card or ic tag using it, and ic card or ic tag |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090032602A1 (ko) |
KR (1) | KR100925110B1 (ko) |
TW (1) | TWI327105B (ko) |
WO (1) | WO2006118255A1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101596698B1 (ko) | 2008-04-25 | 2016-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치 제조 방법 |
JP2010264749A (ja) * | 2009-04-13 | 2010-11-25 | Toyobo Co Ltd | 硬化性樹脂積層用二軸延伸ポリエステルフィルム |
JP2010247370A (ja) * | 2009-04-13 | 2010-11-04 | Toyobo Co Ltd | 硬化性樹脂積層用光拡散ポリエステルフィルム |
WO2010119751A1 (ja) * | 2009-04-13 | 2010-10-21 | 東洋紡績株式会社 | 硬化性樹脂積層用二軸延伸ポリエステルフィルム |
JP5640417B2 (ja) * | 2009-04-13 | 2014-12-17 | 東洋紡株式会社 | 硬化性樹脂積層用二軸延伸ポリエステルフィルム |
PL2335938T3 (pl) | 2009-12-18 | 2013-07-31 | Agfa Gevaert | Znakowalna laserowo folia zabezpieczająca |
ES2400741T3 (es) | 2009-12-18 | 2013-04-11 | Agfa-Gevaert | Película de seguridad marcable por laser |
JP6225898B2 (ja) * | 2012-12-27 | 2017-11-08 | 東レ株式会社 | 成型用フィルム |
EP3146476A4 (en) | 2014-05-22 | 2017-12-13 | Composecure LLC | Transaction and id cards having selected texture and coloring |
US10229353B2 (en) | 2014-07-31 | 2019-03-12 | 3M Innovative Properties Company | RFID tag on stretchable substrate |
US10496915B2 (en) | 2014-07-31 | 2019-12-03 | 3M Innovative Properties Company | RFID tag on flexible substrate |
US10783422B2 (en) | 2014-11-03 | 2020-09-22 | Composecure, Llc | Ceramic-containing and ceramic composite transaction cards |
US9390363B1 (en) * | 2015-03-05 | 2016-07-12 | Composecure, Llc | Cards with special texture and color |
TWI799369B (zh) | 2015-12-28 | 2023-04-21 | 日商東洋紡股份有限公司 | 積層聚酯膜 |
CN108430772A (zh) | 2015-12-28 | 2018-08-21 | 东洋纺株式会社 | 层叠聚酯膜 |
MX2018011743A (es) * | 2016-03-30 | 2019-05-30 | Toyo Boseki | Pelicula de poliester. |
EP3489283A4 (en) * | 2016-07-20 | 2020-02-19 | Toyo Seikan Group Holdings, Ltd. | TEARABLE NON-STRETCHED RESIN FILM AND LAMINATE FILM FOR PACKAGING MATERIAL USING THE SAME |
CN110382232B (zh) | 2017-03-01 | 2021-09-28 | 东洋纺株式会社 | 具备具有呋喃二甲酸单元的聚酯膜和热密封性树脂层的层叠体以及包装袋 |
KR102425314B1 (ko) | 2017-03-01 | 2022-07-27 | 도요보 가부시키가이샤 | 푸란디카르복실산 유닛을 갖는 폴리에스테르 필름의 제조 방법 |
TWI836276B (zh) * | 2020-10-07 | 2024-03-21 | 美商朋瑟美國公司 | 聚酯系熱收縮膜 |
CN113185950A (zh) * | 2021-03-14 | 2021-07-30 | 杭州锴越新材料有限公司 | 一种超硬低温热熔胶及其制备方法 |
CN114349995B (zh) * | 2022-01-12 | 2023-01-31 | 武汉大学 | 一种天然高分子膜二次成型的方法 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3515626A (en) * | 1965-02-22 | 1970-06-02 | Ici Ltd | Thermoplastic laminates having improved surface properties |
US3958064A (en) * | 1971-06-21 | 1976-05-18 | Minnesota Mining And Manufacturing Company | Magnetic recording tape |
JPS4983767A (ko) * | 1972-12-15 | 1974-08-12 | ||
US4187113A (en) * | 1975-11-05 | 1980-02-05 | Imperial Chemical Industries Limited | Voided films of polyester with polyolefin particles |
JPS5610451A (en) * | 1979-07-05 | 1981-02-02 | Toray Industries | Resin coated metallic plate for vessel |
JPS57123050A (en) * | 1980-12-01 | 1982-07-31 | Toray Industries | Polyester composite film |
US4375494A (en) * | 1980-03-12 | 1983-03-01 | Imperial Chemical Industries Plc | Polyester film composites |
NL191959B (nl) * | 1981-03-24 | 1996-07-01 | Gao Ges Automation Org | Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen. |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
JP2701436B2 (ja) * | 1989-03-16 | 1998-01-21 | ダイアホイルヘキスト株式会社 | ポリエステル積層フィルム |
JPH0373341A (ja) * | 1989-05-09 | 1991-03-28 | Toray Ind Inc | 熱圧着プリントラミネート用フィルム |
JP2730197B2 (ja) * | 1989-07-14 | 1998-03-25 | ダイアホイルヘキスト株式会社 | 易ヒートシール性積層ポリエステルフィルム |
US5171625A (en) * | 1991-01-31 | 1992-12-15 | Ici Americas Inc. | All polyester film composite useful for credit and identification cards |
US5534372A (en) * | 1993-07-28 | 1996-07-09 | Konica Corporation | IC card having image information |
JPH08279150A (ja) * | 1995-02-09 | 1996-10-22 | Shoei Insatsu Kk | 識別カード、この識別カードの製造方法およびこの製造方法に用いる実質的な無配向加熱球晶化ポリエチレンテレフタレート樹脂シート |
JPH0985917A (ja) * | 1995-09-25 | 1997-03-31 | Daicel Chem Ind Ltd | 金属板被覆用フィルム、被覆金属板及びその製造方法 |
WO1999010417A1 (fr) * | 1996-02-23 | 1999-03-04 | Toray Industries, Inc. | Film polyester pour isolation electrique |
US6136420A (en) * | 1996-03-12 | 2000-10-24 | Mitsubishi Polyster Film Corporation | Laminated polyester film |
US7232602B2 (en) * | 1996-04-10 | 2007-06-19 | Dupont Teijin Films U.S. Limited Partnership | Multilayer card |
EP1014302B1 (en) * | 1998-07-08 | 2005-09-21 | Dai Nippon Printing Co., Ltd. | Noncontact ic card and manufacture thereof |
TWI249548B (en) * | 1998-12-08 | 2006-02-21 | Toyo Boseki | Void-containing polyester-based film |
US6581839B1 (en) * | 1999-09-07 | 2003-06-24 | American Express Travel Related Services Company, Inc. | Transaction card |
JP2001180162A (ja) * | 1999-12-27 | 2001-07-03 | Tsutsunaka Plast Ind Co Ltd | カード |
US6663977B2 (en) * | 2000-03-07 | 2003-12-16 | E.I. Du Pont De Numours And Company | Low temperature heat-sealable polyester film and method for producing the same |
WO2002074538A1 (fr) * | 2001-03-16 | 2002-09-26 | Toray Industries, Inc. | Film en polyester stratifie |
GB0110799D0 (en) * | 2001-05-02 | 2001-06-27 | Dupont Teijin Films Us Ltd Par | Multilayer polymeric films |
JP2003142332A (ja) * | 2001-11-07 | 2003-05-16 | Toyobo Co Ltd | コンデンサー用熱接着性ポリエステルフィルムおよびコンデンサー |
JP4032714B2 (ja) * | 2001-11-28 | 2008-01-16 | 凸版印刷株式会社 | カード |
JP2004001888A (ja) * | 2002-04-19 | 2004-01-08 | Ishida Co Ltd | 食品包装用袋 |
JP2004143404A (ja) * | 2002-08-28 | 2004-05-20 | Sekisui Chem Co Ltd | ポリオレフィン系樹脂微粒子 |
US6867168B2 (en) * | 2002-12-20 | 2005-03-15 | Eastman Kodak Company | Microbead and immiscible polymer voided polyester for thermal imaging medias |
US6703193B1 (en) * | 2002-12-20 | 2004-03-09 | Eastman Kodak Company | Microbead and immiscible polymer voided polyester for imaging medias |
US6890884B2 (en) * | 2003-02-26 | 2005-05-10 | Eastman Kodak Company | Thermal dye-transfer receiver element with microvoided layer |
JP2005100371A (ja) * | 2003-08-22 | 2005-04-14 | Toyobo Co Ltd | アンテナシート及びそれを用いたicカードまたはicタグ |
US7261934B2 (en) * | 2003-09-11 | 2007-08-28 | Teijin Dupont Films Japan Limited | Polyester film |
US7544266B2 (en) * | 2004-05-21 | 2009-06-09 | Illinois Tool Works Inc. | Process of making laminated sheet and product made by the process |
-
2006
- 2006-04-28 KR KR1020077027196A patent/KR100925110B1/ko not_active IP Right Cessation
- 2006-04-28 TW TW95115282A patent/TWI327105B/zh not_active IP Right Cessation
- 2006-04-28 US US11/912,810 patent/US20090032602A1/en not_active Abandoned
- 2006-04-28 WO PCT/JP2006/308999 patent/WO2006118255A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW200704513A (en) | 2007-02-01 |
KR100925110B1 (ko) | 2009-11-05 |
KR20080016811A (ko) | 2008-02-22 |
US20090032602A1 (en) | 2009-02-05 |
WO2006118255A1 (ja) | 2006-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |