TWI319126B - Lithographic apparatus and device manufacturing method - Google Patents
Lithographic apparatus and device manufacturing methodInfo
- Publication number
- TWI319126B TWI319126B TW094134808A TW94134808A TWI319126B TW I319126 B TWI319126 B TW I319126B TW 094134808 A TW094134808 A TW 094134808A TW 94134808 A TW94134808 A TW 94134808A TW I319126 B TWI319126 B TW I319126B
- Authority
- TW
- Taiwan
- Prior art keywords
- device manufacturing
- lithographic apparatus
- lithographic
- manufacturing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/966,111 US7119876B2 (en) | 2004-10-18 | 2004-10-18 | Lithographic apparatus and device manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200617619A TW200617619A (en) | 2006-06-01 |
TWI319126B true TWI319126B (en) | 2010-01-01 |
Family
ID=35506529
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098122468A TWI400578B (zh) | 2004-10-18 | 2005-10-05 | 微影裝置及元件製造方法 |
TW094134808A TWI319126B (en) | 2004-10-18 | 2005-10-05 | Lithographic apparatus and device manufacturing method |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098122468A TWI400578B (zh) | 2004-10-18 | 2005-10-05 | 微影裝置及元件製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7119876B2 (zh) |
EP (1) | EP1647865B1 (zh) |
JP (3) | JP4318685B2 (zh) |
KR (1) | KR100737509B1 (zh) |
CN (3) | CN101487980B (zh) |
SG (2) | SG121968A1 (zh) |
TW (2) | TWI400578B (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101861493B1 (ko) | 2003-04-11 | 2018-05-28 | 가부시키가이샤 니콘 | 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법 |
KR101686762B1 (ko) | 2003-06-19 | 2016-12-28 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조방법 |
US7589822B2 (en) | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
US7486381B2 (en) * | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4488006B2 (ja) * | 2004-10-15 | 2010-06-23 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
SG157357A1 (en) * | 2004-11-01 | 2009-12-29 | Nikon Corp | Exposure apparatus and device fabricating method |
JP4517354B2 (ja) * | 2004-11-08 | 2010-08-04 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
US7583357B2 (en) * | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI393170B (zh) * | 2004-11-18 | 2013-04-11 | 尼康股份有限公司 | A position measuring method, a position control method, a measuring method, a loading method, an exposure method, an exposure apparatus, and a device manufacturing method |
JP4544303B2 (ja) * | 2005-03-30 | 2010-09-15 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7286205B2 (en) | 2005-04-25 | 2007-10-23 | Infineon Technologies Ag | Closing disk for immersion head |
EP1918983A4 (en) * | 2005-08-05 | 2010-03-31 | Nikon Corp | STAGE EQUIPMENT AND EXPOSURE DEVICE |
KR101388345B1 (ko) * | 2005-09-09 | 2014-04-22 | 가부시키가이샤 니콘 | 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법 |
US7760324B2 (en) * | 2006-03-20 | 2010-07-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN100456138C (zh) * | 2006-06-13 | 2009-01-28 | 上海微电子装备有限公司 | 浸没式光刻机浸液流场维持*** |
US7872730B2 (en) * | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
US7973910B2 (en) * | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
US20080138631A1 (en) * | 2006-12-06 | 2008-06-12 | International Business Machines Corporation | Method to reduce mechanical wear of immersion lithography apparatus |
US7728952B2 (en) * | 2007-01-25 | 2010-06-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for closing plate take-over in immersion lithography |
KR100843709B1 (ko) * | 2007-02-05 | 2008-07-04 | 삼성전자주식회사 | 액체 실링 유니트 및 이를 갖는 이멀젼 포토리소그래피장치 |
US8237911B2 (en) | 2007-03-15 | 2012-08-07 | Nikon Corporation | Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine |
JP5097166B2 (ja) | 2008-05-28 | 2012-12-12 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及び装置の動作方法 |
US8760629B2 (en) * | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
NZ595694A (en) * | 2009-05-04 | 2013-09-27 | Abbvie Biotechnology Ltd | Stable high protein concentration formulations of human anti-tnf-alpha-antibodies |
NL2004547A (en) * | 2009-05-14 | 2010-11-18 | Asml Netherlands Bv | An immersion lithographic apparatus and a device manufacturing method. |
NL2005528A (en) * | 2009-12-02 | 2011-06-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
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SG121818A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
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SG131766A1 (en) * | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
TWI255971B (en) | 2002-11-29 | 2006-06-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
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JP4179283B2 (ja) | 2002-12-10 | 2008-11-12 | 株式会社ニコン | 光学素子及びその光学素子を用いた投影露光装置 |
JP4232449B2 (ja) | 2002-12-10 | 2009-03-04 | 株式会社ニコン | 露光方法、露光装置、及びデバイス製造方法 |
AU2003289272A1 (en) | 2002-12-10 | 2004-06-30 | Nikon Corporation | Surface position detection apparatus, exposure method, and device porducing method |
JP4352874B2 (ja) | 2002-12-10 | 2009-10-28 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
KR101101737B1 (ko) | 2002-12-10 | 2012-01-05 | 가부시키가이샤 니콘 | 노광장치 및 노광방법, 디바이스 제조방법 |
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WO2004053954A1 (ja) | 2002-12-10 | 2004-06-24 | Nikon Corporation | 露光装置及びデバイス製造方法 |
EP1571694A4 (en) | 2002-12-10 | 2008-10-15 | Nikon Corp | EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE |
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CN100370533C (zh) | 2002-12-13 | 2008-02-20 | 皇家飞利浦电子股份有限公司 | 用于照射层的方法和用于将辐射导向层的装置 |
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JP4364806B2 (ja) | 2002-12-19 | 2009-11-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 層上にスポットを照射する方法及び装置 |
US6781670B2 (en) | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
KR101861493B1 (ko) | 2003-04-11 | 2018-05-28 | 가부시키가이샤 니콘 | 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법 |
US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
JP3862678B2 (ja) | 2003-06-27 | 2006-12-27 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
JPWO2005057635A1 (ja) * | 2003-12-15 | 2007-07-05 | 株式会社ニコン | 投影露光装置及びステージ装置、並びに露光方法 |
US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
CN100552879C (zh) * | 2004-02-02 | 2009-10-21 | 尼康股份有限公司 | 载台驱动方法及载台装置、曝光装置、及元件制造方法 |
US7295283B2 (en) * | 2004-04-02 | 2007-11-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7898642B2 (en) | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7486381B2 (en) * | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7057702B2 (en) * | 2004-06-23 | 2006-06-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2006007111A2 (en) * | 2004-07-01 | 2006-01-19 | Nikon Corporation | A dynamic fluid control system for immersion lithography |
WO2006040890A1 (ja) * | 2004-10-08 | 2006-04-20 | Nikon Corporation | 露光装置及びデバイス製造方法 |
JP4488006B2 (ja) * | 2004-10-15 | 2010-06-23 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
-
2004
- 2004-10-18 US US10/966,111 patent/US7119876B2/en active Active
-
2005
- 2005-10-05 TW TW098122468A patent/TWI400578B/zh not_active IP Right Cessation
- 2005-10-05 TW TW094134808A patent/TWI319126B/zh active
- 2005-10-13 SG SG200506522A patent/SG121968A1/en unknown
- 2005-10-13 SG SG200802974-6A patent/SG142311A1/en unknown
- 2005-10-17 EP EP05256431A patent/EP1647865B1/en not_active Not-in-force
- 2005-10-17 JP JP2005301576A patent/JP4318685B2/ja active Active
- 2005-10-18 KR KR1020050098162A patent/KR100737509B1/ko active IP Right Grant
- 2005-10-18 CN CN2009100058730A patent/CN101487980B/zh active Active
- 2005-10-18 CN CN201110314135.1A patent/CN102323727B/zh active Active
- 2005-10-18 CN CNB2005101141366A patent/CN100476593C/zh active Active
-
2008
- 2008-12-25 JP JP2008330458A patent/JP4898775B2/ja active Active
-
2010
- 2010-05-13 JP JP2010111091A patent/JP5194050B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5194050B2 (ja) | 2013-05-08 |
SG121968A1 (en) | 2006-05-26 |
JP4898775B2 (ja) | 2012-03-21 |
TWI400578B (zh) | 2013-07-01 |
EP1647865A1 (en) | 2006-04-19 |
TW200942995A (en) | 2009-10-16 |
CN100476593C (zh) | 2009-04-08 |
CN101487980B (zh) | 2012-04-04 |
JP4318685B2 (ja) | 2009-08-26 |
JP2006121077A (ja) | 2006-05-11 |
EP1647865B1 (en) | 2012-09-26 |
US7119876B2 (en) | 2006-10-10 |
SG142311A1 (en) | 2008-05-28 |
TW200617619A (en) | 2006-06-01 |
CN101487980A (zh) | 2009-07-22 |
KR100737509B1 (ko) | 2007-07-09 |
CN102323727A (zh) | 2012-01-18 |
US20060082741A1 (en) | 2006-04-20 |
CN102323727B (zh) | 2014-01-15 |
JP2009065223A (ja) | 2009-03-26 |
KR20060054083A (ko) | 2006-05-22 |
CN1763636A (zh) | 2006-04-26 |
JP2010219545A (ja) | 2010-09-30 |
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