1312655 九、發明說明： 【發明所屬之技術領域】 種用於電子元件 本發明涉及一種散熱裝置，特別係— 的散熱裝置。 【先前技術】 尤器(CPU)等電子元件運行時産生大量熱能， 愈的處？工作能力的不斷提升以及體積的 " ，、早位發熱1越來越A ’為此業界紛紛採用轨 =為政熱器的元件’熱管傳熱速度快、距離長，通過执 :將散熱器的各個部位熱傳導性連接，可將電子元件的熱 :快逮均句的擴散至散熱器各個部位而將熱量快速向外散 發，因此使散熱器的散熱性能有效得到提升。 通常’熱管係由一密封的殼體（圓管狀或多邊形管狀 1)内設^細結構並於殼體内部注人易揮發之適量工作 "質熱g與散熱器結合時’通常散熱器上對應熱管設置 溝槽或穿孔等結構供熱管容置並通料接或鉚合等方式牢 固結合。其中’為了將熱量藉由熱f傳遞至散熱器的較遠 端多個部位’使熱管f折成U字形、L字形或V字形等形 狀與散熱器結合。然而’熱管f折時對殼體内的毛細結構 有”每彎折一次熱管的傳熱能力降低一定程度， 並且熱笞與散熱器之間由於結合而產生介面熱阻，亦景多響 了散熱裝置之整體散熱性能。 【發明内容】 1312655 ^有必要提供一種散熱效率較好之散熱裝置。 ，導孰置’其包括一體加工成型的-導熱底座、 =底座間隔延伸出的至少二導熱翼部及該導熱翼部表 卜延伸的複數間隔排列的散熱片，所述導熱底座與導 •熱翼部内設有連通的槽道，該槽道密封有適量工作液體’ ，道具有兩個開口端’該開口端設有緊密配合的密封構 件。 純於習知技術，該槽道與散㈣置—體形成而無相 接合產生介面熱阻，克服了傳統熱管彎折以及斑散孰片接 合帶來之介面熱阻等不利影響，熱量可更加快速向散熱器 週邊傳遞並散發，因此具有較高的散熱性能。 【實施方式】 以下參照圖式，對本發明散熱裝置予以進一步說明。 請參閱圖1至圖3，本發明第一實施例之散熱裝置包括 銘擠型的散熱器10’該散熱器1〇包括一矩形導熱底座U， 該導熱底座11底面形成一平面（未標示）供電子元件貼合， 該導熱底座11頂面中部按一定間距向上垂直延伸有二導熱 翼部12。該導熱翼部12具一定厚度而呈板狀，其二側面侧 向垂直延伸有複數平行間隔的散熱片13。每一導熱翼部 與其連接的導熱底座11内一同設有橫截面略呈L字形之槽 道14，即槽道14包括一位於導熱翼部12内之垂直段142、一 位於底座11上之水平段144 ’該二槽道14的水平段144相向 延伸，每一槽道14兩側具有敞開之開口端146。 1312655 . 該散熱器10鋁擠成型後，其槽道14的内壁面上設置毛 細結構…其實，本發明散熱農置的槽道内可沒有毛細結 構亦能夠達成傳熱以及散熱的目的，但是設置毛細結構對 ，散熱裝置的散熱性能具有積極效果。本發明散熱裝置的毛 .細結構15可直接與散熱器1〇一體紹擠成型為溝槽式毛細姓 構’或通過各種業界現有使用的方法形成，本實施例中以 蜂巢式毛細結構或絲網式毛細結構等與散熱器1〇分離的毛 細=吉構15為例，由於毛細結構的結構並非本發明重點，故 本說明書中未詳細揭露其結構。 上述槽道14的每一開口端146設有密封墊“及密封圈 17’密封墊16封住開口端146，而密封圈17在密封㈣盘槽 道14内壁面之間緊密配合。該密封塾㈣長度方向的形^ 與槽道14橫截面形狀相應，即呈L字形，其具有相對的較寬 f部162及較窄頂部164，從而其橫截面呈錐形。該較寬底 口M62面向開口端146而面積大於開口端146的大小，從而能 ，封住開口端146 ’並且該槽道14的開口端146周圍設有與 山封墊16的較見底部162的面積相當的凹槽⑷，該凹槽⑽ =罙度與㈣封㈣厚度相#。該密封圈17的長度方向的 /大亦為L子形’其環臂172厚度向一端逐漸變薄而其内面 it應密封墊16的錐形面，從而由厚度較薄的端緣*** 與槽道14内壁面之間，使槽道14的開口端146得到 嚴欲的密封。每一導熱翼部12的頂部和對應的毛細結構15 上:^該槽道14連通的注入孔122及152，該注入孔122、 上叹有庄入嘴18,通過該注入嘴18將該槽道⑷由（氣體） 1312655 至一定真空度後注入適量的工作液體（圖未示），再將該 '注入嘴18進行封口。最終，散熱器1〇内部形成橫截面呈l字 形的二分離的腔體’該腔體具有與熱管相同的超導熱性能。 請參閱圖4 ’係本發明散熱裝置第二實施例的截面圖。 .第一實施例的散熱裝置與第一實施例的主要區別在於：由 第一實施例的兩個L字形槽道變為一個u字形槽道14a，即槽 道14a位於導熱底座11a内的水平段144a為連通的；為了將槽 道14a底部的上内壁面的回流工作液體順利流至下内壁面 上及加強槽道14a的強度，而該上下内壁面之間設有連接塊 19 ’該連接塊19可以由毛細結構I5a—體製成（本實施例以 與毛細結構15a —體為例），亦可以單獨設置，只要不影響 水平段144a内的工作介質的順利流通即可，並且該連接塊 19的數量可根據需求適當的增加。另外，由於槽道14&是整 體連通的，故只設有一個注入孔以及注入嘴。 請參閱圖5，係本發明散熱裝置第三實施例的截面圖。 第二實施例與第二實施例的主要區別是，該散熱器包括三 個導熱翼部12b，而相應的其槽道14b的形狀呈“山，，字形。 、可以理解地，上述各實施例中的密封塾、密封圈及槽 道開口端的凹槽等的形狀隨著槽道的橫截面形狀的改變而 改變’形成了完整的密封構件。 ^從上述各實施例可知，本發明散熱裝置的散熱器内部 藉由鋁擠方式一體形成槽道，並其内設置毛細結構並進行 雄封，最終獲得與熱管相同的超導熱腔體，鋁擠成型不僅 1312655 降低散熱裝置的製造成本，簡 腔體與散熱器之間的介…、’且大幅降低 ::片之間結合（焊接等）而産生的介面熱阻，且不必 技财歸經料後與散熱#結合等有損於熱管傳 …性此之動作，從而提升散熱I置的散熱效率。 :上所述，本發明符合發明專利要件，爰依法提出專 糸凊。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發㈣神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例散熱裝置之立體分解圖。 圖2係圖1之立體組裝圖。 圖3係圖2中πΐ-ΙΙΙ方向之截面圖。 圖4係本發明第二實施例散熱裝置之截面圖。 圖5係本發明第三實施例散熱裝置之截面圖。 【主要元件符號說明】 散熱器 10 底座 11、 11a 導熱翼部 12、12b 注入孑L 122 散熱片 13 槽道 14、14a、14b 垂直段 142 水平段 144、144a 開口端 146 凹槽 148 毛細結構 15、15a 密封墊 16 較寬底部 162 較窄頂部 164 1312655 密封圈 注入嘴 17 環壁 172 18 連接塊 19 111312655 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, particularly a heat dissipating device. [Prior Art] When electronic components such as the CPU (CPU) generate a large amount of heat energy, what is the more? The continuous improvement of work ability and volume ", early fever 1 more and more A 'for this industry have adopted the track = the elements of the political heat device 'heat pipe heat transfer speed, long distance, through the implementation: the radiator The heat conduction connection of each part can spread the heat of the electronic component to the various parts of the heat sink and dissipate the heat quickly, so that the heat dissipation performance of the heat sink is effectively improved. Usually, the 'heat pipe is made of a sealed casing (circular tubular or polygonal tubular 1) with a fine structure and a suitable amount of work inside the casing." When the heat is combined with the radiator, it is usually on the radiator. Corresponding to the heat pipe, the structure such as the groove or the perforation is provided for the heat pipe to be accommodated and firmly connected by means of material connection or riveting. The heat pipe f is folded into a U-shape, an L-shape or a V-shape in order to transfer heat to a plurality of locations at the distal end of the heat sink by heat f to be combined with the heat sink. However, when the heat pipe f is folded, the heat transfer capacity of the heat pipe is reduced to a certain extent, and the thermal resistance between the heat sink and the heat sink is combined due to the interface, and the heat is dissipated. The overall heat dissipation performance of the device. [Summary of the Invention] 1312655 ^ It is necessary to provide a heat dissipation device with better heat dissipation efficiency. The guide device includes a heat-conducting base integrally formed, and at least two heat-conducting wings extending from the base. And the plurality of heat dissipating fins extending in the heat conducting wing portion, wherein the heat conducting base and the heat guiding portion are provided with a communicating channel, the channel is sealed with an appropriate amount of working liquid ', and the channel has two open ends' The open end is provided with a tightly fitting sealing member. Purely according to the prior art, the channel is formed by the dispersive (four) body and is not joined to each other to generate an interface thermal resistance, which overcomes the traditional heat pipe bending and the splicing of the plaque. Unfavorable effects such as thermal resistance of the interface, heat can be transferred to the periphery of the heat sink more quickly, and therefore have higher heat dissipation performance. [Embodiment] Referring to the drawings below, The heat dissipating device of the first embodiment of the present invention includes a heat sink 10' of the indented type, and the heat sink 1 includes a rectangular heat conducting base U, and the bottom surface of the heat conducting base 11 Forming a plane (not shown) for the electronic component to be attached, the middle portion of the top surface of the heat-conducting base 11 extends vertically upward at a certain interval with two heat-conducting wings 12. The heat-conducting wing portion 12 has a certain thickness and is plate-shaped, and the two side faces thereof A plurality of parallel spaced fins 13 extend vertically. Each of the heat conducting fins is provided with a channel L having a substantially L-shaped cross section together with the thermally conductive base 11 connected thereto, that is, the channel 14 includes a heat conducting wing portion 12 The vertical section 142, a horizontal section 144 on the base 11, the horizontal sections 144 of the two channels 14 extend toward each other, and each of the channels 14 has an open open end 146 on both sides. 1312655 . After that, the capillary wall 14 is provided with a capillary structure on the inner wall surface of the channel 14 (in fact, the heat-dissipating channel of the present invention can achieve heat transfer and heat dissipation without a capillary structure, but a capillary structure pair is provided to dissipate heat. The heat dissipation performance of the device has a positive effect. The capillary structure 15 of the heat dissipation device of the present invention can be directly formed into a grooved capillary structure with the heat sink 1 或 or formed by various methods currently used in the industry. In the example, the capillary structure of the heat sink 1 such as a honeycomb type capillary structure or a mesh type capillary structure is exemplified, and since the structure of the capillary structure is not the focus of the present invention, the structure is not disclosed in detail in the present specification. Each open end 146 of the channel 14 is provided with a gasket "and seal 17" seal 16 sealing the open end 146, while the seal 17 is tightly fitted between the inner walls of the seal (four) disk channel 14. The shape of the sealing jaw (four) in the longitudinal direction corresponds to the cross-sectional shape of the channel 14, i.e., has an L-shape, and has a relatively wide f portion 162 and a narrower top portion 164 such that the cross section thereof is tapered. The wider base M62 faces the open end 146 and has an area greater than the size of the open end 146 so that the open end 146' can be sealed and the open end 146 of the channel 14 is provided with a bottom 162 of the mountain seal 16 The area is equivalent to the groove (4), the groove (10) = twist and (four) seal (four) thickness phase #. The length/large of the length of the seal ring 17 is also L-shaped. The thickness of the ring arm 172 is gradually thinner toward one end and the inner surface thereof is the tapered surface of the gasket 16, so that the thin edge is inserted into the groove. Between the inner wall surfaces of the channel 14, the open end 146 of the channel 14 is sealed tightly. The top of each of the heat conducting wings 12 and the corresponding capillary structure 15 are: the injection holes 122 and 152 communicating with the channel 14, the injection hole 122, the upper mouth 18 is slid, and the groove is passed through the injection nozzle 18. The channel (4) is filled with a suitable amount of working liquid (not shown) from (gas) 1312655 to a certain degree of vacuum, and then the 'injecting nozzle 18' is sealed. Finally, the interior of the heat sink 1 is formed into two separate cavities having a 1-shaped cross section. The cavity has the same superconducting thermal conductivity as the heat pipe. Please refer to FIG. 4, which is a cross-sectional view showing a second embodiment of the heat sink of the present invention. The main difference between the heat dissipating device of the first embodiment and the first embodiment is that the two L-shaped channels of the first embodiment are changed into a U-shaped channel 14a, that is, the level of the channel 14a in the thermally conductive base 11a. The segment 144a is in communication; in order to smoothly flow the return working liquid of the upper inner wall surface at the bottom of the channel 14a to the lower inner wall surface and to strengthen the strength of the channel 14a, a connection block 19' is provided between the upper and lower inner wall faces. The block 19 may be made of a capillary structure I5a (this embodiment is taken as an example with the capillary structure 15a), or may be separately provided as long as it does not affect the smooth circulation of the working medium in the horizontal section 144a, and the connection is The number of blocks 19 can be appropriately increased as needed. Further, since the channels 14 & are integrally connected, only one injection hole and the injection nozzle are provided. Referring to Figure 5, there is shown a cross-sectional view of a third embodiment of the heat sink of the present invention. The main difference between the second embodiment and the second embodiment is that the heat sink includes three heat conducting wings 12b, and the corresponding channel 14b has a shape of "mountain,". It is understood that the above embodiments The shape of the sealing jaw, the sealing ring and the groove at the open end of the channel changes as the cross-sectional shape of the channel changes. A complete sealing member is formed. ^ As can be seen from the above embodiments, the heat dissipating device of the present invention The inside of the radiator is integrally formed into a channel by aluminum extrusion, and a capillary structure is arranged therein and a male seal is obtained, and finally the same superheat-conducting cavity as the heat pipe is obtained, and aluminum extrusion molding not only reduces the manufacturing cost of the heat sink, but also reduces the manufacturing cost of the heat sink. The interface between the heat sink and the heat sink is greatly reduced: the thermal resistance of the interface is generated by the bonding between the soldering plates (welding, etc.), and it is not necessary to combine the heat and the heat with the heat sink to damage the heat pipe. This action enhances the heat dissipation efficiency of the heat sink I. As described above, the present invention complies with the requirements of the invention patents, and is specifically proposed according to law. However, the above is only a preferred embodiment of the present invention. The equivalent modifications or variations made by God in accordance with the present invention should be covered by the following patents. [Simplified Schematic] FIG. 1 is a heat dissipating device according to a first embodiment of the present invention. Fig. 2 is a perspective view of the πΐ-ΙΙΙ direction of Fig. 2. Fig. 4 is a cross-sectional view of a heat sink according to a second embodiment of the present invention. Fig. 5 is a third embodiment of the present invention. Cross-sectional view of the heat sink of the embodiment. [Description of main components] Radiator 10 base 11, 11a heat-conducting wing 12, 12b injection 孑L 122 heat sink 13 channel 14, 14a, 14b vertical section 142 horizontal section 144, 144a opening End 146 Groove 148 Capillary structure 15, 15a Seal 16 Wide bottom 162 Narrow top 164 1312655 Seal inlet nozzle 17 Ring wall 172 18 Connection block 19 11