TWI310949B

TWI310949B - A process for making a resistor component with metal foil

Info

Publication number: TWI310949B
Application number: TW95122340A
Authority: TW
Inventors: mu yuan Chen; Ting Chun Wang; Shen Chih Wu; Chin Yuan Tseng; Kao Po Chien
Original assignee: Yageo Corp
Priority date: 2006-06-21
Filing date: 2006-06-21
Publication date: 2009-06-11
Also published as: TW200802426A

Description

1310949 九、發明說明：【發明所屬之技術領域】本發明是有關於-種被動元件的製造方法，特別是指 -種具有微殴姆（micro-Q)等級之金屬羯電阻元件的製: 方法。【先前技術】金屬落電阻元件是屬電子裝置中的被動電路元件或承1310949 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a passive component, and more particularly to a method for manufacturing a metal-on-resistance component having a micro-Q rating: . [Prior Art] A metal drop resistive element is a passive circuit component or a bearing in an electronic device.

載電路兀件，例如電流感測器以金屬_提供微殴姆電阻值之相關電路運用。隨著電子裝置愈趨精密，被動元件也必須具有更為精確製程的改善以製備出具有高精界致力的方向之一。此等用於電子裝置中的各式的精準度，因此，如何藉由確度的被動元件，也成為業Loaded circuit components, such as current sensors, are used in metal-related circuits that provide micro-ohm resistance values. As electronic devices become more sophisticated, passive components must also have a more precise process improvement to produce one of the directions with high precision. These are used for the accuracy of various types in electronic devices, and therefore, how to become a reality by using passive components.

先前，發明人曾以中華民國第〇93讀〇號「表面黏 &金屬箱晶片電阻器之製造方法」專利案，提出金屬羯電阻兀件的製造方法’以製得具有高精確度的金屬箱電阻元蒼閲圖1，該方法主要是先疋无以步驟101 ’在一絕緣基板上表面形成複數縱橫交錯而成棋盤狀的溝槽，並由該等溝槽定義出複數成形區間。職進行步驟⑽，利__將具有預㈣金屬箱對應連接在該每—成形區間中而構成複數金屬箱電阻塊。接著依序進行步驟 103、104、105，以非光蝕刻方式， 1310949 複數呈預定圖像而使該對應之金屬落電阻塊部分表面裸露的隔離罩，·再接著以化學#刻方式自該複數金W電阻塊未被該複數隔離罩遮覆的部分裸露表面向下移除對應的金屬箱電阻塊體，而使留存之金屬落電阻塊體成該複數金屬箱電阻；㈣再清洗移除該複數隔離I，而對應製得該複數金屬箔電阻。然後進行步驟106,以導電材料並應用非光蝕刻方式，例如網版印刷，在該基板上表面形成複㈣應該複數下電極的彼此相間隔地平行的長條型上電極，且該每一上電極遮覆該-對應的溝槽及該兩相鄰側邊之金屬箱電阻的部分邊緣區域β 接著以步驟1G7,利用高能量射束，例如鐳射、聚焦電 :束等切割該每-預定形狀的金屬_，藉由此等高能量射束可進行數微米的高精度切割，而可得到具有精確電阻值的金屬箔電阻。然後進行步驟⑽，以非導體材料及以非光㈣方式，例如網版印刷形成複數對應遮覆金屬㉙電阻預定區域的保 2 ’以包封保護該等金屬電阻，❿完成金屬箱電阻元件半成品的製備。 "再接著以步驟1()9在該基板下表面以導電材料及以非 :例如網版印刷’並對應於該複數溝槽形成複 4 &目s隔地平行且成長條態樣的下電極。接著進行步驟11〇,進行金屬结電阻元離的過程，此牛跑丁干成《口早體分步驟是沿著該等溝槽以物理破裂方式 1310949 f ’先製得多數成長條形包含有多數金屬il電阻元件半成 ::的條狀基板後’再破裂此些條狀基板而製得複數個金屬羯電阻元件半成品的單體。取後疋進仃步驟11卜分別在製得的每—金屬箔電阻元件半成品單體的相對兩側邊進行多數道製程而形成可導電的銲接引腳單元，即製得該金屬箔電阻元件。由於此等金屬羯電阻元件所呈現的應用電阻值主要是 • 基於金屬馆電阻的幾何形狀、尺寸而決定；因此，發明人確實於製程中，以步驟1G8 #次以高能量射束切割調變該， 4-金屬_的幾何形狀與尺寸，進而製得精度達數微， +之精確面積的金屬箱電阻’確實可以製作出具有精確電阻值的金屬箔電阻元件。然而，發明人也在實際量產製程中發現，由於受限於在此㈣108以鐘射進行切割時，必須同步以探針進行該金屬箔電阻的阻值量測’以時時調變鐳射切割的狀態，由靡⑤鐳射作用時產生的熱會影響到探針所量得的阻值，進而使得後續切割產生誤差，進而導致金屬箔電阻元件阻值未 * 符合需求。同時，發明人也發現，此等金屬電阻元件的精確電阻值’除了主要是由金屬箔電阻本身的幾何形狀與尺寸決定之外，同時，也會因為金屬箱電阻外露於外界的幾何面積尺寸而有微幅的變化；當然，對大尺寸金屬箱電阻元件而言’由於金屬笛電阻外露於外界的幾何面積尺寸相對極小，因此對整體電阻值的精確度影響並不大，但對於小尺 7 1310949 寸的金綱阻元件來說’此等金屬箱電阻外露於外界的幾何面積尺寸亦會影響到整體電阻值的精確度。、介的然而，由於以非光触刻方式（例如網^刷成包封保護金屬结電阻預定區域的保護層時緣會因擴散效應而使得遮覆包封金屬箱電阻預定區域產i =差’而使得金屬羯電阻預定裸露出的面積產生不可預期 ^變，而影響到成品電阻值的精確度，特別 = 寸的金Μ電阻元件而言，此—影響特別顯著而嚴重，因，目前金屬箱電阻元件的製造方法仍需加以改盖，以提南成品的良率與精確度，進而增加業者的利潤所得。【發明内容】因此，本發明之目的，即在提供—種可以製造具有更和確電阻值之金屬箱電阻元件的製造方法。、、於是，本發明-種金屬箱電阻元件的製造方法，包含以下步驟。麝首先在-絕緣基板的上表面形成複數溝槽，並由該等屢槽定義出複數成形區間。然後將具有預定電阻職的金Μ對應連接貼合在該 '也區間構成複數金屬箔電阻塊。再以化學蝕刻技術圖案化該複數金屬電阻複數金屬箔電阻。 —接著以導電材料在該基板上表面形成複數對應遮覆該硬數溝槽及該複數金屬箱電阻部分邊緣區域的上電極。然後以非導體材料形成複數對應遮覆金屬箔電阻預定 8 1310949 區域的保護層。該複數個屬箔電阻特別的是，再以-高能量射束精確切割調變保護層的幾何形狀，以精確調變對應之該複數金保§蔓層的區域面積。接著對應該複數溝槽在該基板下表面以導電材料形成複數彼此相間隔的下電極。之後再沿該等溝槽以物理破裂方式破裂經過上述步驟所製得的半成品’ it而製得多數個金屬箱電阻元件半的單體結構。 w 取设刀乃』隹琢母—金屬结電阻元件半成品破裂的側邊形成可㈣⑽接㈣單元，即製得該金屬Μ阻元件 *本發明的功效在於更進一步以高能量射束精確切割調變保護層以精確調變對應之金屬箔電阻保護層的幾何尺寸 ’進而製得具有更高精度之電阻值的微小化金屬電^ 件。 711 【實施方式】有關本發明之前述及其他技術内容、特點與功效，在以下配合參考圖式之一個較佳實施例的詳細說明中，將可清楚的呈現。在本發明被詳細描述之前，要注意的是，在以下的說明内容中，類似的元件是以相同的編號來表示。本發明一種金屬箔電阻元件的一較佳實施例，是可製備出如圖22所示具有更精確電阻值之金屬箔電阻元件2, 1310949 以供例如電流感測器等電子裝置的相關電路運用。參閱圖2、圖3 ’類似地，本例的第一個步驟同樣是在一絕緣基板31上表面形成複數縱橫交錯而成棋盤狀的溝槽 3 2 ’並由5亥等溝槽3 2疋義出複數成形區間311 ;該絕緣基板31可以是例如玻璃基板、陶瓷基板，或是以環氧樹酯為材料所構成的基板，較佳地，該等溝槽32的深度設定在數微米之内，而可於後續的製程中以物理方式破裂取得預定的半成品。參閱圖4、圖5,再將接著劑均勻塗佈在每一成形區間 311的表面成一接著劑層34。參閱圖6、® 7,然後將具有預定電阻係數的金屬羯與該等接著劑層34對應連接貼合在該每一成形區間311中，而構成複數金屬電阻& 52;在本例中，該金屬箱是選用 :如鎳鉻合金、錳銅合金、鎳銅合金等電阻材料所構成，當然，其他具有預定電阻係數的材料也都可以應用，由於此等材料種類眾多，在此不詳加一一舉例說明。參閱圖8、_ 9，再以非絲刻方式，例如網版印刷方 :’在該複數金屬箱電阻塊52表面對應形成複數呈預定圖像而使該對應之金制電阻塊52部分表面裸露㈣離罩Μ 〇〜，閱β U)、圖U，接著以化學蝕刻方式自該複數金屬 2阻塊52未㈣複數隔料51遮㈣部分裸露表面向體呈I:!的金屬笛電阻塊體’而使留存之金屬落電阻塊呈現預疋圖像而成該複數金屬箔電阻％。 10 1310949 然後再清洗移除該複數隔離罩5丨複數金屬箔電阻35。即對應成型製得該丨2、圖13’然後以導電材料並應料光蚀刻方式（本例中是以網版印刷方式進行）在該基板3 成複數彼此相間隔且平行的長條型上電極％，且絲二電極36遮覆該一對應的溝槽32及該兩相鄰側邊::屬= 電阻35的部分邊緣區域。 ’Previously, the inventor of the Republic of China (National Republic of China) read the nickname "Surface Adhesive & Metal Box Chip Resistors Manufacturing Method" Patent Case, and proposed a method for manufacturing metal tantalum resistors to produce highly accurate metals. The box resistance element is as shown in Fig. 1. The method mainly comprises the steps of forming a plurality of criss-crossing grooves on a surface of an insulating substrate to form a checkerboard-shaped groove, and defining a plurality of forming sections by the grooves. In step (10), the __ has a pre-(four) metal box correspondingly connected in the each-forming section to form a plurality of metal box resistance blocks. Then, steps 103, 104, and 105 are sequentially performed in a non-photolithographic manner, and 1310949 is a plurality of spacers that are in a predetermined image so that the surface of the corresponding metal drop resistor block is exposed, and then the chemistry is engraved from the plurality The gold W resistor block is not removed by the corresponding exposed surface of the plurality of spacers to remove the corresponding metal box resistor block, and the retained metal falling resistor block is formed into the plurality of metal box resistors; (4) the cleaning is removed The plurality of isolations I, and the corresponding plurality of metal foil resistors are correspondingly produced. Then proceeding to step 106, using a conductive material and applying a non-photolithographic method, such as screen printing, forming a plurality of upper-type upper electrodes on the upper surface of the substrate which are parallel to each other and parallel to each other, and each of the upper electrodes The electrode covers the corresponding groove and the partial edge region β of the metal box resistance of the two adjacent sides. Next, in step 1G7, the per-predetermined shape is cut by a high energy beam such as laser, focusing electricity: beam or the like. The metal _, by which the high-energy beam can be cut with a high precision of several micrometers, can obtain a metal foil resistor with a precise resistance value. Then, step (10) is performed to form a plurality of non-conducting materials and non-light (four) manners, for example, screen printing to form a predetermined area corresponding to the predetermined area of the covering metal 29 to protect the metal resistors, and to complete the metal box resistive element semi-finished products. Preparation. " and then step 1 () 9 on the lower surface of the substrate with a conductive material and non-: for example, screen printing 'and corresponding to the complex groove to form a complex 4 & electrode. Then, in step 11〇, the metal junction resistance element is separated, and the bovine run-up is "the early step of the mouth is to physically rupture along the grooves 1310949 f' to make the majority of the growth strips containing most of the metal. The il resistor element is semi-finished:: the strip substrate is then 'breaking the strip substrates to produce a plurality of monomers of the metal tantalum resistor element semi-finished product. The step of step 11 is performed on each of the opposite sides of each of the semi-finished products of the metal foil resistor element to form an electrically conductive soldering lead unit, that is, the metal foil resistor element is obtained. Since the applied resistance values exhibited by these metal tantalum resistor elements are mainly determined based on the geometry and size of the metal museum resistors; therefore, the inventors did in the process, step 1G8 # times with high energy beam cutting modulation The 4-metal_ geometry and size, and thus the accuracy of the micro-scale, + the precise area of the metal box resistance 'can indeed produce a metal foil resistor element with a precise resistance value. However, the inventors have also found in the actual mass production process that since it is limited to the cutting of the clock in this (four) 108, it is necessary to synchronously measure the resistance of the metal foil resistor with the probe 'to change the laser cutting from time to time. The state, the heat generated by the 靡5 laser will affect the resistance of the probe, which will cause errors in subsequent cutting, which will cause the resistance of the metal foil resistor to meet the demand. At the same time, the inventors have also found that the precise resistance value of these metal resistive elements is determined not only by the geometry and size of the metal foil resistor itself, but also by the metal box resistance exposed to the external geometric area. There are slight changes; of course, for large-size metal box resistive components, the geometrical area exposed to the outside due to the metal flute resistance is relatively small, so the accuracy of the overall resistance value is not significant, but for small size 7 For the 1310949 inch gold element resistance component, the geometrical area size of these metal box resistors exposed to the outside world will also affect the accuracy of the overall resistance value. However, since the protective layer of the predetermined area of the metal junction resistance is protected by a non-photo-touching method (for example, the net is brushed to enclose the predetermined area of the metal-clad resistance due to the diffusion effect, i = poor 'There is an unpredictable change in the area exposed by the metal tantalum resistor, which affects the accuracy of the resistance value of the finished product. In particular, the thickness of the gold-ring resistive element is particularly significant and serious because of the current metal. The manufacturing method of the box resistance element still needs to be modified to improve the yield and precision of the finished product, thereby increasing the profit of the industry. [Invention] Therefore, the object of the present invention is to provide a kind of And a method of manufacturing a metal box resistance element having a positive resistance value. Then, the method for manufacturing a metal box resistance element according to the present invention includes the following steps: First, a plurality of grooves are formed on an upper surface of the insulating substrate, and The repeating groove defines a complex forming interval. Then, a metal Μ corresponding connection having a predetermined resistance is attached to the 'also forming a plurality of metal foil resistor blocks. The chemical etching technique patterns the plurality of metal resistors and the plurality of metal foil resistors. - then forming a plurality of upper electrodes on the upper surface of the substrate with a conductive material corresponding to the hard-numbered trenches and the edge regions of the resistance portion of the plurality of metal boxes. The conductor material forms a plurality of protective layers corresponding to the predetermined 8 1310949 region of the metal foil resistor. The plurality of foil resistors, in particular, precisely cuts the geometry of the modulation layer with a high energy beam to accurately modulate the corresponding The plurality of regions of the nucleus layer are embossed. Then, the plurality of trenches are formed on the lower surface of the substrate by a conductive material to form a plurality of lower electrodes spaced apart from each other. Then, the trenches are physically ruptured along the trenches and passed through the above steps. The obtained semi-finished product 'it produces a single metal structure of a plurality of metal box resistance elements. w. The side of the semi-finished product of the metal-junction resistance element is formed into a (4) (10) connection (four) unit, which is obtained. The metal bismuth resistance element* has the effect of further cutting the modulation protection layer with high energy beam to precisely adjust The geometrical dimensions of the corresponding metal foil resistive protective layer' further produce a miniaturized metal component having a higher precision resistance value. 711 [Embodiment] The foregoing and other technical contents, features and effects of the present invention are as follows. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENTS Before the present invention is described in detail, it is noted that in the following description, like elements are A preferred embodiment of a metal foil resistor component of the present invention is a metal foil resistor component 2, 1310949 having a more accurate resistance value as shown in FIG. 22 for use in an electronic device such as a current sensor. Referring to Fig. 2 and Fig. 3 'similarly, the first step of this example is also to form a plurality of grooves 3 2 ' in a checkerboard shape on the upper surface of an insulating substrate 31 and to be grooved by 5 The insulating substrate 31 may be, for example, a glass substrate, a ceramic substrate, or a substrate made of epoxy resin. Preferably, the substrate is formed. Groove depth 32 is set within a few microns, and may be in a subsequent process to obtain a predetermined rupture physically semifinished product. Referring to Figures 4 and 5, an adhesive is evenly applied to the surface of each forming section 311 to form an adhesive layer 34. Referring to FIG. 6 and FIG. 7, a metal crucible having a predetermined resistivity is then connected to the adhesive layer 34 in a corresponding connection between each of the forming sections 311 to form a plurality of metal resistors &52; in this example, The metal box is made of a resistive material such as nickel-chromium alloy, manganese-copper alloy, nickel-copper alloy, etc. Of course, other materials having a predetermined resistivity can also be applied. Due to the variety of such materials, it is not detailed here. An example. Referring to FIG. 8, _9, and then in a non-silent manner, such as screen printing: 'the surface of the plurality of metal box resistor blocks 52 correspondingly forms a plurality of predetermined images to expose the surface of the corresponding gold resistor block 52. (4) From the cover Μ 〇 ~, read β U), Figure U, and then chemically etched from the complex metal 2 block 52 not (four) multiple spacers 51 cover (four) part of the exposed surface to the body I:! The body 'and the remaining metal falling resistor block exhibits a pre-image to form the complex metal foil resistor %. 10 1310949 Then, the plurality of metal foil resistors 35 are removed by cleaning and removing the plurality of spacers. That is, the crucible 2, FIG. 13' is formed by corresponding molding, and then the conductive material is applied and photolithographically etched (in this example, by screen printing) on the substrate 3 in a plurality of strips spaced apart from each other and parallel. The electrode %, and the wire electrode 36 covers the corresponding groove 32 and the two adjacent sides: genus = partial edge region of the resistor 35. ’

X參閱圖14、圖15，接著利用高能量射束，例如錯射、聚焦電子束等切割該每一金屬箱電阻35成預定形狀，藉由此等高能量射束進行數微米的高精度切割，而可得到‘有精確幾何形狀、尺寸的金屬羯電Β 35，進而達到以精確切割調變金_阻35的面積尺寸第一次精調金_阻35 的電阻值。參閱圖16、圖17,然後以非導體材料及以非光钮刻方式（本例同樣地是以網版印刷方式進行）形成複數對應遮覆金屬箱電阻35預定區域的保護層37,以包封保護該等金屬箱電阻35，而完成金屬帛電阻元件半成⑤的製備；此步驟所用的非導體材料是環氧樹酯或氨基曱酸酯或是矽苯樹酯，其他絕緣並可與此等可導電的材料緊密結合而可防止水氣滲入的高分子材料也都可以應用。由於該等保護層37是以非光蝕刻方式形成，因此會在形成的過程中因為擴散效應的影響而使鄰近上電極36的兩側緣371成斜角柱態樣（如圖所示）抑或是類似郵票邊緣態樣（圖未示），而遮覆金屬箔電阻35預定區域以外的面 11 1310949 :’進而改變了經過鐳射切割精調後金屬荡電阻35的電阻保護層37因擴散效應形成斜角柱態樣（或是 ⑧ 緣態樣）的兩側、緣371精確切割移除，而獲得精確幾: 尺寸、形狀的對應金屬電阻35預㈣域，進可金屬落電阻35的電阻值；在此要特別說明的是，雖：：驟僅以精確切割移除保護層37 ·、，、' ’乂 :或是類似郵*邊緣態樣)_二應==樣7 、矩形塊體，進而獲得精確幾何尺寸、形箱電阻35裸露區域為例說明，然而在實際應用上：： :將保護層37切割呈現預定的圖像，進而調變對庫金二: 電阻35*職區域、獲得預定阻值的金屬箱電阻％，而不僅限於此等簡單或極細小部分的切割移除。X, referring to FIG. 14, FIG. 15, and then cutting each of the metal box resistors 35 into a predetermined shape by using a high-energy beam, such as a misalignment, a focused electron beam, or the like, thereby performing high-precision cutting of several micrometers by the equal-energy beam. , and the metal 羯 Β 35 with precise geometry and size can be obtained, and the resistance value of the first fine adjustment gold _ resistance 35 can be achieved by precisely cutting the area size of the modulation gold _ resistance 35. Referring to FIG. 16 and FIG. 17, the protective layer 37 corresponding to the predetermined area of the covering metal box resistor 35 is formed by a non-conductor material and a non-light-knocking method (this example is also performed by screen printing). Sealing and protecting the metal box resistors 35, and completing the preparation of the metal tantalum resistive element half 5; the non-conductor material used in this step is epoxy resin or amino phthalate or benzene resin, other insulation and Polymer materials in which these electrically conductive materials are tightly bonded to prevent moisture from infiltrating can also be applied. Since the protective layers 37 are formed by non-photolithography, the side edges 371 adjacent to the upper electrodes 36 are obliquely aligned (as shown) due to the effect of the diffusion effect during the formation process. Similar to the edge pattern of the stamp (not shown), and covering the surface of the metal foil resistor 35 outside the predetermined area 11 1310949: 'and thus the resistance of the resistive protective layer 37 after the laser cutting fine adjustment of the metal resistance 35 is formed by the diffusion effect The sides and edges 371 of the corner-like state (or the 8-edge state) are precisely cut and removed, and the precise number is obtained: the corresponding metal resistance 35 of the size and shape, the pre-fourth domain, and the resistance value of the metal drop resistor 35; It should be specially stated that, although:: the protective layer 37 is removed only by precise cutting, ·,, ' '乂: or similar to the edge of the mail *) _ two should == sample 7, rectangular block, and then Obtaining the precise geometric size and the bare area of the box resistance 35 as an example, but in practical application:: The protective layer 37 is cut to present a predetermined image, and then the modulation is applied to the Kujin II: resistance 35* occupation area, and the reservation is obtained. Resistance of the metal box resistance%, These simply are not limited to removing or cutting very small parts.

參閱圖2〇、圖21，接著以導電材料及以非光钱刻方式上^網版印刷方式，在該基板31下表面並對應於該複數 ^ %處形成複數彼此相間隔地平行且成純態樣冤極3 3。至此’已完成金屬箱電阻元件半成品的製備，接著是進灯分離以獲得複數金屬箱電阻元件半成品單體的步驟；類似地，^程是沿著該等溝槽32以物理破裂方式直接破裂：先製侍多數條狀基板後，再破裂製得複數個金屬箔電阻元件半成品的粒狀單體。 # 1圖2 _ 23 ’最後分別在製得的每—金屬箱電阻 12 1310949 几件半成品單體的相對兩側邊進邀… 電的鮮接引腳單元38後，即製得該金屬成可導於此過程已為業界所週知，且盥件2，·由大關聯’故在此不再詳加說明。U的創作重點較無重 =此等金屬羯電阻元件2的精 :疋由金物阻35本身的幾何二主也會因為金物阻35外露於外界的幾J積::：’ ^的變化;特別是對小尺寸金屬箱電阻元 2 金屬箔電阻35外露於外界的幾 °此4 值的精確度有著重大的影響。，更對於成品電阻所以，由上述說明可知，本發明主要是先以調變每一金屬箱電阻35的幾何形狀與尺寸，^而第屬落電阻35的幾何面積，從而獲得阻值的金屬鶴電阻35,接著，再類似地以高能量 =割移除母—保護層37因擴散效應而形成的而確調變金屬箱電阻35裸露出面積的幾何形狀與尺寸’進= 弟-次精調金衫電阻35的電阻值，從而獲得具有精破電阻值的金屬箔電阻元件2。 "另外要加以補充說明的是，在進行分離製得複數金屬泊電阻讀半成品單體之前，—般會在該複數保護層η表面印刷形成供辨識用的字碼’以供出貨辨識之用（圖未示出）；另外，參閱® 24,基於產品別的不同，也可以在進行，離製得複數金屬箱電阻元件半成品單體之前，另行對應每-金屬電阻S件半成品，在基板31下表面以非導體材 13 1310949 每一金屬«阻元件半成品，在基板31下表面以非導體材料及以非絲財式（例如㈣㈣以）形成複數下保邊層39,自基板31下表面包封保護金屬箱電阻元件2,告 ^也同樣地可以在該等下保護層39上印刷形成供辨識：的子碼，以供出貨辨識之用；由於此等基於產品別的差里而作的因應改變種類激容，Α τ $ 炎裡頰承夕’在此不再――舉例說明。綜上所述，本發明主要是以中華民國第〇93100263號「表面黏合金屬荡晶片電阻器之製造方法」專利案為基礎 ’亚以南能量射束精確㈣移除每—保護層37因擴散效應而形成的區域，從而精確調變金屬羯電阻預定面積的幾何形狀與尺寸，進而精調金屬箱電阻35的電阻值’從而提高所製得金屬II電阻元件2呈現之電阻值的精確度，確實達到本發明的創作目的。惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發㈣請專利範圍及發明說明内容所作之簡單的等效變化與㈣，皆仍屬本發明專利涵蓋之範圍内。【圖式簡單說明】圖1是-流程圖’說明習知製備一種金屬箱電阻元件的過程；，圖2疋一立體圖，說明本發明一種金屬箔電阻元件的製造方法之-較佳實施例中，於_絕緣基板上形成多數溝槽之態樣；圖3疋一側視圖，用以辅助說明圖2之絕緣基板上形 14 1310949 成多數溝槽之態樣；圖4是一立體圖，說 „ , _ 明本發明一種金屬箔電阻元件的製造方法之一較佳實施例胃白也阻兀件的之態樣. 杰該絕緣基板上塗佈黏著劑 Μ稠助說明Referring to FIG. 2A and FIG. 21, the lower surface of the substrate 31 and corresponding to the complex number are parallel and pure to each other at a lower surface of the substrate 31 by means of a conductive material and a non-light-printing method. The state is bungee jumping 3 3. So far, the preparation of the semi-finished product of the metal box resistance element has been completed, followed by the step of separating the lamps to obtain the semi-finished monomer of the plurality of metal box resistance elements; similarly, the process is directly broken along the grooves 32 by physical rupture: After processing a plurality of strip substrates, the pellets of a plurality of semi-finished metal foil resistor elements are ruptured. # 1图2 _ 23 'At the end of each of the obtained metal box resistance 12 1310949 several pieces of semi-finished products on the opposite sides of the side invites ... electric fresh lead unit 38, the metal can be made This process has been well known in the industry, and the components 2, · by the big association 'will not be explained in detail here. U's creative focus is less weightless = the precision of these metal 羯 resistance elements 2: 几何 by the gold material resistance 35 itself, the geometry of the main body will also be due to the gold material resistance 35 exposed to the outside world J::: '^ change; special It is a significant influence on the accuracy of the small value of the small-sized metal box resistor element 2 metal foil resistor 35 exposed to the outside world. Therefore, it is known from the above description that the present invention mainly first modulates the geometry and size of each metal box resistor 35, and the geometric area of the first falling resistor 35, thereby obtaining a metal crane with a resistance value. The resistor 35, and then similarly removes the geometry and size of the exposed area of the metal box resistor 35 by the high energy = cut removal of the mother-protective layer 37 due to the diffusion effect. The resistance value of the gold plate resistor 35 is such that a metal foil resistor element 2 having a fine resistance value is obtained. " In addition, it should be added that before the separation of the plurality of metal mooring resistors to read the semi-finished monomer, the surface of the complex protective layer η is generally printed to form a character for identification for shipment identification. (not shown); in addition, refer to ® 24, depending on the product, it can also be carried out separately from the semi-finished product of each metal-resistance S component before the preparation of the semi-finished monomer of the metal box resistance element. The lower surface is made of a non-conductor material 13 1310949, each metal «resistive element semi-finished product, a non-conductor material is formed on the lower surface of the substrate 31, and a plurality of lower edge-preserving layers 39 are formed on the lower surface of the substrate 31 (for example, (four) (four)). The protective metal box resistive element 2 is sealed, and the subcodes for identification can be printed on the lower protective layer 39 for the purpose of identification for shipment; for these products are based on the difference of the products. In response to changing the type of enthusiasm, Α τ $ 炎里颊 ' ' 'here no longer - for example. In summary, the present invention is mainly based on the patent of the "Method for Manufacturing Surface Bonded Metal Wafer Resistors" of the Republic of China No. 93100263, 'Sub-South Energy Beam Accurate (4) Removes Each of the Protective Layers 37 Due to Diffusion The region formed by the effect, thereby precisely adjusting the geometry and size of the predetermined area of the metal tantalum resistor, thereby finely adjusting the resistance value of the metal box resistor 35, thereby improving the accuracy of the resistance value of the metal II resistive element 2 produced. The creative purpose of the present invention is indeed achieved. However, the above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent change of the patent scope and the description of the invention according to the present invention (4) All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart 'illustrating a process for preparing a metal box resistive element; FIG. 2 is a perspective view showing a method of manufacturing a metal foil resistive element of the present invention - in a preferred embodiment FIG. 3 is a side view for assisting the description of the shape of a plurality of grooves on the insulating substrate of FIG. 2; FIG. 4 is a perspective view, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _

^ W'J -PL 该絕緣基板上盡佈黏著劑之態樣；圖6是一立體圖，却过月本發明一種金屬箔電阻元件的 “方法之—較佳實施例中，以該絕緣基板之塗佈的黏著劑連接複數金屬落而成金屬箱電阻塊之態樣； “圖、7是-側視圖’用以輔助說明囷6之該絕緣基板以黏者劑連接複數金屬落而成金屬_電阻塊之態樣；圖、8疋-立體圖’說明本發明—種金屬_電阻元件的製造方法之-較佳實施例中，於該金屬羯電阻塊上形成且有圖像之隔離罩之態樣；〃圖9是一側視圖，用以辅助說明圖8之於該金屬箱電阻塊上形成具有圖像之隔離罩之態樣；圖10是一立體圖，說明本發明一種金屬箱電阻元件的製造方法之-較佳實施例中，偏,丨移除金Μ電阻塊未被隔離罩遮覆之區域而成型出預定圖像的態樣；圖U是一侧視圖，用以輔助說明圖10蝕刻移除金屬猪電阻塊未被隔離罩遮覆之區域而成型出金屬箔電阻的態樣圖12是一立體圖，說明本發明一種金屬箔電阻元件的製造方法之一較佳實施例中，於該基板上表面成型上電極 15 1310949 之態樣；圖13是一側視圖，用以輔助說明圖12之於該基板上表面成型上電極之態樣；圖14是一立體圖，說明本發明一種金屬箔電阻元件的製造方法之一較佳實施例中，以鐳***確切割該成型之金屬箔電阻之態樣；^W'J-PL is a state in which the adhesive is applied to the insulating substrate; FIG. 6 is a perspective view of the metal foil resistive element of the present invention. In the preferred embodiment, the insulating substrate is The coated adhesive connects a plurality of metal to form a metal box resistor block; "Fig. 7, is a side view" to help illustrate that the insulating substrate of the crucible 6 is connected to a plurality of metals by a binder to form a metal. The state of the resistor block; FIG. 8 is a perspective view showing the state of the present invention - a method for manufacturing a metal-resistive element - in a preferred embodiment, a state in which an image is formed on the metal tantalum resistor block and has an image Figure 9 is a side view for assisting in explaining the formation of an insulating cover having an image on the metal block resistor block of Figure 8; Figure 10 is a perspective view showing a metal case resistive element of the present invention In a preferred embodiment, the ytterbium, yttrium removes the region in which the ruthenium resistor block is not covered by the spacer to form a predetermined image; FIG. U is a side view for assistance in explaining FIG. Etching removes the area where the metal pig resistor block is not covered by the spacer FIG. 12 is a perspective view showing a state in which the upper electrode 15 1310949 is formed on the upper surface of the substrate in a preferred embodiment of the method for manufacturing the metal foil resistive element of the present invention; FIG. 14 is a perspective view showing a preferred embodiment of the method for manufacturing the metal foil resistor element of the present invention. Laser precisely cuts the shape of the formed metal foil resistor;

>圖15是一側視圖，用以輔助說明圖14以鐳***確切割該成型之金屬箔電阻之態樣； ,圖16疋立體圖，§兒明本發明一種金屬箔電阻元件的製造方法之-較佳實施例中，於該成型之金屬_電阻上形成保護層之態樣；圖丨7是一側視圖，用以辅助說明圖16於該成型之金屬箔電阻上形成保護層之態樣；制、皮18疋—立體圖’說明本發明-種金屬箔電阻元件的 I is·方法之一輕接普a 例中’以鐳***確切修成型之保護電阻預定的面積尺寸；終19疋—側視圖’用以輔助說明圖18明***確切 4 =之保制崎確機金屬Μ阻預定的面積尺寸；圖 20 θ i 製造方、去之疋體圖’ s兒明本發明-種金屬箔電阻元件的極之態樣之車乂佳實施例中’於該絕緣基板形成多數下電圖21是一側視圖成多數下電椏之態樣; 圖22是—立體圖用以辅助說明圖20之絕緣基板形說明本發明一種金屬箔電阻元件的 16 1310949 製造方法之一較佳實施例中，製得之金屬结電阻元件之態樣，圖23是一側視圖，用以輔助說明圖22之製得的金屬箔電阻元件；及圖24是一立體圖，說明可以本發明一種金屬箔電阻元件的製造方法，製得之另一態樣的金屬箔電阻元件。> Fig. 15 is a side view for assisting the explanation of Fig. 14 for precisely cutting the formed metal foil resistor by laser; Fig. 16 is a perspective view showing a method for manufacturing a metal foil resistive element of the present invention - In a preferred embodiment, a protective layer is formed on the formed metal_resistor; FIG. 7 is a side view for assisting the description of FIG. 16 to form a protective layer on the formed metal foil resistor; 、皮皮立体立体立体 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The view 'to help explain Figure 18 shows the precise area cut 4 = the predetermined area size of the protective oscillating metal Μ resistance; Figure 20 θ i manufacturing side, the 疋图 ' ' 本本本本本本本 - - 种种种In the preferred embodiment of the component, in the preferred embodiment, the majority of the lower portion of the insulating substrate 21 is a side view of a plurality of lower electrodes; FIG. 22 is a perspective view for assisting in explaining the insulation of FIG. Substrate shape illustrating a metal foil resistor of the present invention Figure 16 is a side view of a preferred embodiment of the method for manufacturing a metal junction resistive element, and Figure 23 is a side view for assisting in explaining the metal foil resistive element of Figure 22; and Figure 24 It is a perspective view showing another method of manufacturing a metal foil resistor element according to the present invention, and a metal foil resistor element of another aspect.

17 1310949 【主要元件符號說明】 2 · · •金屬箔電阻元件 37· · •保護層 31 · •基板 371 · •側緣 311 · • 成形區間 38.. •銲接引腳單元 32· · •溝槽 39· · 下保護層 33· · • 下電極 51 .. • 隔離罩 34· · •接著劑層 52·. • 金屬箔電阻塊 35.. • 金屬箔電阻 36· · • 上電極 1817 1310949 [Description of main component symbols] 2 · · • Metal foil resistor element 37 · · • Protective layer 31 · • Substrate 371 · • Side edge 311 · • Forming section 38.. • Soldering lead unit 32 · · • Trench 39· · Lower protective layer 33 · · • Lower electrode 51 .. • Isolation cover 34 · · • Adhesive layer 52 ·. • Metal foil resistor block 35.. • Metal foil resistor 36 · · • Upper electrode 18

Claims

1310949 申請專利範圍：種金屬箔電阻元件的製造方法，包含： a)在—絕緣基板的上表面形成複數溝槽’並由該等溝槽定義出複數成形區間； )將具有預定電阻係數的金屬箔對應連接在該成形區間構成複數金屬箔電阻塊；1310949 Patent application scope: A method for manufacturing a metal foil resistor element, comprising: a) forming a plurality of trenches on an upper surface of an insulating substrate and defining a plurality of forming sections by the trenches; ) a metal having a predetermined resistivity a foil correspondingly connected to the forming section to form a plurality of metal foil resistor blocks;

°圖案化該複數金屬箔電阻塊而成複數金屬箔電阻 X導電材料在該基板上表面形成複數對應遮覆該複數溝槽及3亥複數金屬落電阻部分邊緣區域的上電極；以非導體材料形成複數對應遮覆金屬羯電阻預定區域的保護層； Ο (g) C h) 何开I夏射束精確切割調變該複數保護層的幾二的以精確調變對應之該複數金屬箱電阻預疋的區域面積；對應該複數溝槽在該基板成複數彼此相間隔的τ電極；、以導電材料形沿該等溝槽以物理破 )所製得的半成、•式裂經過該步驟（g 成品;及而製得複數金屬笛電阻元件半分別在該每一金屬箔電阻形成可導電的銲接弓丨_ '成品破裂的側邊元件。早疋’製得該金屬笛電阻 19 1310949 2.依據申請專利範圍第1項所述之金屬箔電阻元件的製造方法’其中，該步驟（a)所形成的溝槽是呈彼此縱橫交錯態樣。 3 ·依據申晴專利範圍第丨項所述之金屬箔電阻元件的製造方法，其中，該步驟（c)具有以下次步驟： (cl )以非光蝕刻方式在該複數金屬箔電阻塊表面對應形成複數呈預定圖像而使該對應之金屬箔電阻塊部分表面裸露的隔離罩； (c2 )以蝕刻方式自該複數金屬箔電阻塊部分裸露表面向下移除對應的金屬箔電阻塊體，而使留存之金屬箔電阻塊體成該複數金屬箔電阻；及 (c3 )移除該隔離罩，製得該複數金屬箔電阻。 4 ·依據申凊專利範圍第丨或3項所述之金屬箔電阻元件的製造方法，t包含一步驟（j)m@能量射束切割凋變成型出之金屬箔電阻以獲得具有預定精確幾何形狀的金屬箔電阻。 5. 依據申請專利範圍第丨項所述之金屬箔電阻元件的製造方法，其中，該步驟（d )是以非光蝕刻方式成型該複數上電極。 6. 依據申明專利範圍第丨項所述之金屬箔電阻元件的製造方法’其中，該步驟（e)之非導體材料是選自由下列所構成的群組：環氧樹酯、氨基甲酸酯、矽苯樹酯。 7. 依據申請專利範圍第丨項所述之金屬箔電阻元件的製造方法’其中’該步驟（f)之高能量射束是鐳射。 20 a^1〇949 •依據申請專利節該步驟（g)是以非光蝕刻方式成型該複方法，其中，項所述之金屬箔電阻元件的製造數下電極。依據申請專利範方法，JL Φ 項所述之金屬箔電阻元件的製造 Z ’該金屬箔是選自由下列所構成的群組形成 •鈕、鉻、鎳、鋁、錳、銅 1〇 ^ ^ ^ ^ 及此寺之組合。依據申凊專利範圍笛員所述之金屬箔電阻元件的製造万法，更包含—步骅r , ^ ^ ( k )，是在該複數保護層表面對應形成複數供辨識之字碼。 11 ·依據申請專利範圍第〗& 、員所述之金屬箔電阻元件的製造方法，更包含一步驄α ()’疋以非導體材料在該基板下表面對應§亥每一金屬铭雪Rn 离電阻π件半成品形成複數下保護層。 12.依據申請專利範圍第11箱& 1 ^ 項所述之金屬箔電阻元件的製造方法，更包含一步驟（m、，β ^ 、m )’是在該複數下保護層表面對應形成複數供辨識之字竭。 21° patterning the plurality of metal foil resistor blocks to form a plurality of metal foil resistors X conductive material on the upper surface of the substrate to form a plurality of upper electrodes corresponding to the edge regions of the plurality of trenches and the 3 ridges of metal falling resistance; Forming a plurality of protective layers corresponding to a predetermined area of the metal-clad resistor; Ο (g) C h) where the summer beam is accurately cut and modulated, and the plurality of the plurality of protective layers are precisely modulated to correspond to the plurality of metal box resistors The area of the pre-twisted area; the τ electrode corresponding to the plurality of grooves on the substrate being plurally spaced from each other; and the semi-formed crack formed by physically breaking along the grooves in the shape of the conductive material) (g finished product; and a plurality of metal squirrel resistor elements are separately formed in each of the metal foil resistors to form an electrically conductive soldering bow _ 'finished ruptured side elements. The early 疋' made the metal horn resistor 19 1310949 2 The method for manufacturing a metal foil resistive element according to claim 1, wherein the grooves formed in the step (a) are in a crisscross pattern with each other. The method for manufacturing a metal foil resistive element according to the item, wherein the step (c) has the following steps: (cl) forming a plurality of predetermined patterns on the surface of the plurality of metal foil resistor blocks in a non-photolithographic manner. a spacer for causing the surface of the corresponding metal foil resistor block to be exposed; (c2) removing the corresponding metal foil resistor block downward from the exposed surface of the plurality of metal foil resistor block portions by etching, thereby leaving the retained metal a foil resistor block is formed into the plurality of metal foil resistors; and (c3) removing the spacer to obtain the plurality of metal foil resistors. 4 - manufacturing of the metal foil resistor component according to claim 3 or 3 The method, t comprises a step (j) m@ energy beam cutting to transform the metal foil resistor into a metal foil resistor having a predetermined precise geometry. 5. The metal foil resistor according to the scope of claim The manufacturing method of the component, wherein the step (d) is to form the plurality of upper electrodes by non-photolithography. 6. The metal foil resistor component according to the scope of claim The method wherein the non-conducting material of the step (e) is selected from the group consisting of epoxy resin, urethane, and fluorene. 7. According to the scope of the patent application The manufacturing method of the metal foil resistive element 'where the high energy beam of the step (f) is laser. 20 a^1〇949 • According to the patent application section, the step (g) is to form the complex method by non-photolithography. Wherein, the metal foil resistive element described in the section is manufactured with a lower electrode. According to the patent application method, the manufacture of the metal foil resistive element described in JL Φ Z' is formed from a group consisting of the following: Button, chrome, nickel, aluminum, manganese, copper 1〇^ ^ ^ ^ and the combination of this temple. According to the manufacturing method of the metal foil resistor element described in the patent application scope, the method further includes a step r, ^^(k), which is a code for forming a complex number for identification on the surface of the complex protection layer. 11 · According to the manufacturing method of the metal foil resistance element described in the patent application scope &quot;, the method further includes a step 骢α ()' 疋 a non-conductor material on the lower surface of the substrate corresponding to § hai each metal Ming Xue Rn A plurality of lower protective layers are formed from the semi-finished product of the resistor π. 12. The method for manufacturing a metal foil resistive element according to the 11th box & 1 ^ of the patent application, further comprising a step (m,, β ^ , m )' in which the surface of the protective layer is formed correspondingly to the plural For the sake of identification. twenty one