1306221 九、發明說明： 【發明所屬之技術領域】 尤指一種可用以儲 本發明係有關於一種半導體裝置 存數位資料之記憶卡半導體裝置。 【先如技術】 斷推二 3。產品之不斷演進與發展，電子產品不 ==，同時也變得更為輕薄短小…，隨身記憶 二!：：此趨勢發展，該種記憶卡係為-種高容量的快 體電路模組’該電路模經可_至-電子資訊平 台’例如個人電腦、個人數位助理裝置（p⑽nai Digitai1306221 IX. Description of the invention: [Technical field to which the invention pertains] In particular, a memory card semiconductor device in which the present invention relates to a semiconductor device storing digital data. [First as technology] Break two 2 The continuous evolution and development of products, electronic products are not ==, but also become lighter and thinner..., portable memory II!:: This trend is developing, this kind of memory card is a kind of high-capacity fast-body circuit module' The circuit can be _ to - electronic information platform 'for example, personal computer, personal digital assistant device (p (10) nai Digitai
Assistant’PDA)、數位照相機、多媒體劉覽器，以儲存各 種數位型式之多媒體資料，例如數位相片資料、視訊資料、 或音訊資料。 同時由於通用序列匯流排（Universal Serial Bus， USB ) ”面已廣泛應用於各式電子裝置上，因此將該 ^丨面整合至記憶卡，以具備隨插即用、體積小、容量大等 優點，已成為現今儲存資料之重要工具之一。 凊參閱第1圖，係顯示一般之USB記憶卡，其主要係 將記憶體晶片（Mem〇ry Chip)121、控制晶片（c〇ntr〇Uer Chip)122 及被動 tl 件（Passive c〇mp〇nent)13 載接至一如電 路板之晶片承載件（Chip Carrier)ll，之後再將USB接頭 14銲接於晶片承载件u上並包覆一外殼體16，以使晶片 得以透過該USB介面而電性連接至外界裝置，藉以發揮晶 片功能。相關技術係可參見美國專利第6,813,164號及第 5 19364 1306221 6,854,984號所揭示。Assistant's PDA), digital camera, and multimedia browser to store various digital types of multimedia materials, such as digital photo data, video data, or audio data. At the same time, since the Universal Serial Bus (USB) has been widely used in various electronic devices, the integrated surface is integrated into the memory card to have the advantages of plug and play, small size, large capacity, and the like. It has become one of the most important tools for storing data today. 凊 Refer to Figure 1 for a general USB memory card, which mainly uses a memory chip (Mem〇ry Chip) 121 and a control chip (c〇ntr〇Uer Chip). The 122 and the passive tl device (Passive c〇mp〇nent) 13 are attached to a chip carrier ll of the circuit board, and then the USB connector 14 is soldered to the wafer carrier u and covered with a casing. The body 16 is configured to allow the wafer to be electrically connected to the external device through the USB interface, thereby utilizing the function of the wafer. The related art is disclosed in U.S. Patent Nos. 6,813,164 and 5, 196, 362, 621, 6, 854, 984.
惟由於前述之USB記憶卡組裝作業過於繁複，因此， 業界遂發展出一種USB FLASH CARD(UFC)結構，如第2 圖所示，其係提供一電路板21，且該電路板21表面設有 複數個電性端點（terminal)210，並透過板上置晶技術（chip onboard, COB)，以於該電路板21表面接置半導體晶片22 及被動元件23,並包覆一封裝膠體25,以形成一封裝單元 20 ;然後，再將該封裝單元20塞入至一外殼體26中，並 於該外殼體26尾端填入一後蓋27，以將該封裝單元20固 定於該外殼體26中，其中該用以固定封裝單元20之方法 係於該外殼體26内側頂緣預設有前檔塊261及後擋塊 262，同時於該封裝單元20之封裝膠體25上設有前導緣 251以供該封裝單元20抵住該前擋塊261而予以定位，並 將後蓋27填塞於該外殼體26中以頂抵封裝單元20後端， 且使該後蓋27另一端頂抵外殼體26之後擋塊262，以將 該封裝單元20固定於外殼體26中。 然而於前述之USB FLASH CARD(UFC)結構中，當封 裝單元置入該外殼體後，仍必須形成一後蓋作最後組裝， 因此於製作前必須使用二種不同的模具，方可製成不同形 狀的外殼體及後蓋，因此較耗費製程成本；並且該封裝單 元係先置於該外殼體中，最後再以後蓋置於該封裝單元後 端，如此方可組成記憶卡結構，故在組裝動作上較為麻煩 且增加製造工時。 此外，由於記憶卡之殼體係由該外殼體及後蓋所組 6 19364 1306221 成，該外殼體容易受外力撞擊之破壞而導致後蓋鬆落，導 致封裝單元鬆動，而造成該記憶卡之外接裝置（如數位照像 機）之使用上之接觸不良。 另外，由於該UFC結構中，封裝單元之長度尺寸係為 其電性端點i外殼體後擔⑨間之距離戶斤㈣，造成該封裝 單元無法縮小，相對亦提高成本。 、 因此，如何避免習知於組構USB記憶卡時， .所造成製程成本及組裝卫時增加、後蓋鬆脫以及封裝單元 ^法縮小等缺失’ f為此㈣研發領域所迫切待解決之課 題。 【發明内容】 窶於以上所述習知技術之缺點，本發明之 種記憶卡半導體裝置，無須於封裝單元之後端^ 置 置 置 蓋 二=再一目的係在提供-種記憶卡半導體裝 付降低製程及組裝成本。 =1''另：目的係在提供—種記憶卡半導體裝 本發明之又一目 — # 良的情事。 的係在提供—種記憶卡半導體F 仔避免在外殼體使用前、後梓 同時不需在封裝單元之封封裝單元及後 得以縮小封I單元之尺寸及降低f ^开^前導緣，進而 為達成上述及其他目的，本發明之稷;二：。 置’係包括：封裝單元，該月之：憶卡半導體裝 、早兀*包含有承載件、接置 19364 7 1306221 •於承载件上之半導體晶片、形成於該承載件上用以包覆該 半導體晶片之封褒膠體，且該封襄單元表面設有至少—第 釔合部，以及外殼體，該外殼體係用以容置該封裝單元， 其中該外殼體設有至少-與第—結合部相對之第二結合 部，藉由兩者之結合，以將該封裝單元固定於該外殼體令。 該承載件表面設有電性連接部，作為記憶卡半導體裝 置與外界電性輕合之輸入/輸出端，且該承載件係為電路板 籲或導線架.，該半導體晶片得以打線(wire b〇nding)或覆晶接 合（flip chip)方式而電性連接該承载件 。 ^該封裝單元之第一結合部及該外殼體之第二結合部 係可選擇為凸塊及槽孔之其中一者，俾使該封裝單元之第 二結合部藉由與該外殼體之第二結合部結合，以將該封裝 單元固定在該外殼體中，避免習知以後蓋封住該封裳單^ 之後端而導致製程成本及組裝工時增加，及後蓋鬆脱所造 f使用上之接觸不良的缺失。同時，藉由移動該封裝體之 •第-結合部或該外殼體之第二結合部位置，可改變該封裝 單元之尺寸，不再為習知封裝單元之長度尺寸為其電性端 點至外殼體後檔塊間之距離所限制。 再者由於本發明之記憶卡電子裝置結構無須 蓋，因此相對於習知結構以額外的構件用 之後端，將可降低製程作業複雜性、成本，同時^ = 受外力所導致後蓋鬆脫，造成使用上接觸不良之缺失。 【實施方式】 ' 以下之實施係進-步詳細說明本發明之觀點，但並非 19364 8 1306221 :;任，點限制本發明。 i弟一實施例j 請參閱第3囷，係為本發明之卞障士丄 示意圖。 不各月之记憶卡半導體裝置剖面 該冗憶卡半導體萝 置該封裝單元30之外；=括/封裝單元如及用以容 載件3卜接置於承載㈣，：：該封裝單元刻由承 該承載件31上用以勺 之半導體晶片32、及形成於 1所組成。 M包覆該半導體晶片32之封裝谬體35 該承载件31係可例如為 相對之上表面及下表面，於該 ’〜承载㈣具有 之如電性^ . 载牛】之上表面設有複數 ^fi(ter_al)之電性連接部310。 該半導體晶片32係包括有呓恃靜曰 及栌制曰W π…， 有°己L體曰曰片（Memory Chip) p)等，且該半導體晶片”係接 置於該承餘3i下表面，並可透過銲線 載件31。同時㈣承^ 31 ^連接至6亥承 分杜u — 表面上復设置有複數被動 =7; /整體封裝單元電性功能。另，該半導體 曰曰片亦可以復晶方式而電性連接至該承载件。 該封裝勝體35係形成該承載件31下表面上，勺 覆該半導體晶片32及被動元件33,且於該封裝膠體^ 面設有至少一第一結合部3 51。 ，外殼體36係例如為-體成形之空心殼體，以供該 封裝早7L 3G容置於該外殼體36中，同時該外殼體％星" 至少一與該封裝膠體3 5表面之第一結合部3 5丨相對之^二 19364 9 1306221 結合部如，俾藉由兩者之結合，以^ 該外殼體36中。 衣早το 30於 卡及_，係為顯示本發明之記憶 卡+導體裝置之底面不意圖，其中該用以供封 卡固至該外殼體36中，而設於封㈣體3 351與設於該外殼體36之第二結合弟、纟。曰4 如該第-結合部35丨係為凸塊，則第二結合=應關係’ 俾藉由該封裝膠體35所凸狀凸塊嵌合 ^槽^’ ::=rr°固定於該外殼想&二二 第二結合部則為凸塊。 ㈢ ^ 此外，該第-結合部351之凸塊及第二結 槽孔形狀及數量射為—長條狀（如第4A圖所° ^ 複數矩形狀（如第4B圖所示），惟應注意者，該第L及第為 二 應用之形狀及數量不以本圖示為限，而可： 應貝際需求變化使用。 [第二實施例] _ μ參閱第5圖’係為本發明之記憶卡半導體裝置之 ^施^意圖，本實施例之記憶卡半導料置與前述者 目5，主要差異在於本實施例之封裝單元5〇係以電 ^為承載件’同時於該承載件51之上表面上設有複數如電 Β而點（terminaI)之電性連接51〇，以及於該承载件η之 表面上接置並電性連接有半導體晶片52。相較於前述實於 例中承載件之電性連接部與接置其上之半導體晶片係分^ 19364 1306221 _位於該承載件不同側，而本實例巾_ 與接置其上之半導I# a Η总 電性連接部則 :牛¥體曰曰片係位於該承载件之相同側。 另於該承載件51之上表面形成有用 ^片52之封裝膠體55，且該封裝膠體55表^^體 弟一結合部551(如凸塊），同時用以容置 = 外殼體56亦設有至少一對應該第-結合部55f之第51之 部562(如槽孔），俾藉由兩者之結合，以固 ^合 I 50於該外殼體56中。 了瑕早tl [第三實施例] 杏請參閱第6圖，係為本發明之記憶卡半導體裳置 二貝施例不意圖’與前述實施例不同處在於本實 裝單元6G係以導線架作為承載件。該導線架 = 611及複數設於該晶片座周圍之導腳⑴，以供半導 =接置一於該晶片座611並利用銲線而電性連接至該導腳 之一端’同時利用該導腳612之另一端作為承載件之 電性連接部，以供半導體晶片62與外界電性轉合。 另於該封裝單元中形成有用以包覆該半導體晶片62 之封裝膝體65,且該封訪體65表面設有至少一第片一姓 合部651(如凸塊），同時用以容置該封裝單元的之外般體 66亦設有至少一對應該第一結合部651之第二么士人部 662(t槽孔）’俾藉由該第一及第二結合部之結合「以將該 封裝單元60固定於該外殼體66中。 因此，本發明之記憶卡半導體裝置，主要係藉由設於 封裝單元之封裝膠體的第一結合部與外殼體之第二結合部 π 19364 1306221 5 :: s以將該封裝單元固定在該外殼體中，避免習知以 後盍封住，封裝單元之後端而導致製程成本及組裝工時增 加及後蓋fe脫所造成使用上之接觸不良的缺失。同時， 藉由移動該封農體之第一結合部或該外殼體之第二結合部 ^置τ改變該封裝單元之&寸，不再為傳統封裝單元之 長度尺寸係為其電性端點至外殼體後播塊間之距離所限 制。 —再者由於本發明之記憶卡電子裝置結構無須使用後 蓋而得以封裝勝體之第一結合部扣合至外殼體之第二結 合部，因此相對於習知結構以額外的構件用來封住該外殼 體之後端’將可p条低因受外力所導致後蓋鬆脫，造成使用 上接觸不良之缺失。 ^以上所述僅為本發明之較佳實施例而已，並非用以限 疋本毛月之貝貝技術内容的範圍。本發明之實質技術内容 係廣義地定義於下述之申請專利範圍中。若任何他人所完 成之技術實體或方法與下述之申請專利範圍所定義者為完 全相同、或是為一種等效之變更，均將被視為涵蓋於此專 利範圍之中。 【圖式簡單說明】 第1圖係為習知USB記憶卡之剖面示意圖； 第2圖係為習知USB FLASH CARD(UFC)之半導體裝 置剖面示意圖； 第3圖係為本發明之記憶卡半導體裝置之第一實施例 剖面示意圖； 19364 12 1306221 第4A及4B圖係為本發明之記憶卡半導體裝置之底部 不意圖， 第5圖係為本發明之記憶卡半導體裝置之第二實施例 剖面示意圖；以及 第6圖係為本發明之記憶卡半導體裝置之第三實施例 剖面示意圖。 【主要元件符號說明】 11 晶片承載件 121 記憶體晶片 122 控制晶片 13 被動元件 14 USB接頭 16 外殼體 20 封裝單元 21 電路板 210 電性端點 22 半導體晶片 23 被動元件 25 封裝膠體 251 前導緣 26 外殼體 261 前槽塊 262 後擋塊 27 後蓋 13 19364 1306221 30,50,60 封裝單元 31,51 承載件 310,510 電性連接部 32,52,62 半導體晶片 33 被動元件 35,55,65 封裝膠體 351,551,651 第一結合部 36,56,66 外殼體 362,562,652 第二結合部 611 晶片座 612 導腳 14 19364However, due to the cumbersome assembly work of the aforementioned USB memory card, the industry has developed a USB FLASH CARD (UFC) structure. As shown in FIG. 2, a circuit board 21 is provided, and the surface of the circuit board 21 is provided. a plurality of electrical terminals 210 and a chip onboard (COB) for mounting the semiconductor wafer 22 and the passive component 23 on the surface of the circuit board 21 and encapsulating an encapsulant 25 To form a package unit 20; then, the package unit 20 is inserted into an outer casing 26, and a rear cover 27 is filled in the end of the outer casing 26 to fix the package unit 20 to the outer casing. 26, wherein the method for fixing the package unit 20 is provided with a front block 261 and a rear block 262 at the top edge of the outer side of the outer casing 26, and a leading edge is disposed on the encapsulant 25 of the package unit 20. 251 is positioned for the package unit 20 to abut the front stop 261, and the rear cover 27 is stuffed in the outer casing 26 to abut against the rear end of the package unit 20, and the other end of the rear cover 27 is abutted against the outer casing. The body 26 is followed by a stopper 262 to fix the package unit 20 in the outer casing 26However, in the aforementioned USB FLASH CARD (UFC) structure, after the package unit is placed in the outer casing, a back cover must be formed for final assembly, so two different molds must be used before fabrication to make different The shape of the outer casing and the back cover are therefore costly to process; and the package unit is first placed in the outer casing, and then placed at the rear end of the package unit, so as to form a memory card structure, so assembly It is more cumbersome to operate and increases manufacturing hours. In addition, since the housing of the memory card is formed by the outer casing and the rear cover group 6 19364 1306221, the outer casing is easily damaged by the impact of the external force, causing the rear cover to loosen, causing the package unit to loosen, thereby causing the memory card to be externally connected. Poor contact in the use of devices such as digital cameras. In addition, in the UFC structure, the length dimension of the package unit is the distance between the electrical terminals i and the outer casing of the outer casing (four), so that the package unit cannot be reduced, and the cost is relatively increased. Therefore, how to avoid the conventional method of fabricating a USB memory card, the process cost and assembly time increase, the back cover is loose, and the package unit is reduced, etc. Question. SUMMARY OF THE INVENTION In view of the above-mentioned disadvantages of the prior art, the memory card semiconductor device of the present invention does not need to be placed on the rear end of the package unit to provide a cover 2 = another purpose is to provide a memory card semiconductor package reduction Process and assembly costs. =1''Another: The purpose is to provide a kind of memory card semiconductor device. Another object of the invention - #良的事事. The system is provided with a memory card semiconductor F. It is not necessary to reduce the size of the sealing unit and reduce the leading edge of the sealing unit before and after the outer casing is used. To achieve the above and other objects, the present invention; The system includes: a packaging unit, the month: the memory card semiconductor package, the early 兀* includes a carrier, and is connected to the semiconductor wafer on the carrier, and is formed on the carrier to cover the a sealing body of the semiconductor wafer, and the surface of the sealing unit is provided with at least a first nip, and an outer casing, the outer casing is for accommodating the packaging unit, wherein the outer casing is provided with at least a first joint The second bonding portion is coupled to the outer casing by the combination of the two. The surface of the carrier is provided with an electrical connection portion, which serves as an input/output end of the memory card semiconductor device and is electrically connected to the outside, and the carrier is a circuit board or a lead frame. The semiconductor wafer can be wired (wire b) The carrier is electrically connected to the flip chip or flip chip. The first bonding portion of the packaging unit and the second bonding portion of the outer casing may be selected as one of a bump and a slot, so that the second bonding portion of the packaging unit is coupled to the second outer casing The two joint portions are combined to fix the package unit in the outer casing body, so as to avoid the conventional process of sealing the rear end of the cover sheet, resulting in an increase in process cost and assembly man-hour, and the use of the back cover to be used. The lack of contact on the top. At the same time, the size of the package unit can be changed by moving the first joint portion of the package or the second joint portion of the outer casing, and the length of the package unit is no longer the electrical end point of the conventional package unit. The distance between the rear blocks of the outer casing is limited. Furthermore, since the structure of the memory card electronic device of the present invention does not require a cover, the use of the rear end of the additional structure relative to the conventional structure can reduce the complexity and cost of the process, and at the same time, the back cover is loosened by the external force. Causes a lack of contact failure. [Embodiment] The following embodiments are intended to describe the present invention in detail, but are not intended to limit the invention. i, an embodiment j, please refer to the third section, which is a schematic diagram of the invention. The memory card semiconductor device profile of each month is not disposed outside the package unit 30; the inclusion/package unit and the carrier member 3 are placed on the carrier (4), :: the package unit is engraved The semiconductor wafer 32 for scooping the carrier 31 and the semiconductor wafer 32 are formed. The package body 31 covering the semiconductor wafer 32 may be, for example, a relatively upper surface and a lower surface, and the upper surface of the 'bearing (four) has an electrical property. ^fi (ter_al) electrical connection 310. The semiconductor wafer 32 includes a 呓恃 曰 and 栌 , , , 有 有 有 有 有 有 有 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , And through the wire carrier 31. At the same time (4) connected ^ 31 ^ connected to 6 Hai Cheng Duu u - the surface is set with a plurality of passive = 7; / overall package unit electrical function. In addition, the semiconductor chip The package body 35 can be electrically connected to the carrier. The package body 35 is formed on the lower surface of the carrier member 31, and the semiconductor chip 32 and the passive component 33 are scooped off, and at least the package body is provided on the package body. a first joint portion 315. The outer casing 36 is, for example, a body-formed hollow shell for the package to be placed in the outer casing 36 at a time 7L 3G, while the outer casing is at least one star The first bonding portion 35 of the surface of the encapsulant 35 is opposite to the junction of the two 19364 9 1306221, for example, by a combination of the two, in the outer casing 36. The clothing is το 30 in the card and _, Is not intended to show the bottom surface of the memory card + conductor device of the present invention, wherein the cover is used to secure the cover to the outer casing In the body 36, the sealing member (four) body 3 351 and the second bonding body disposed on the outer casing 36, 纟4, if the first coupling portion 35 is a bump, the second bonding = the relationship should be '固定 The convex bump fitting groove of the encapsulant 35 is fixed to the outer casing and the second joint portion is a bump. (3) ^ In addition, the first joint portion The shape and number of the 351 bump and the second junction slot are - long strips (as shown in Fig. 4A ° ^ complex rectangular shape (as shown in Fig. 4B), but it should be noted that the L and the first The shape and number of the two applications are not limited to the present illustration, but may be used in response to changes in demand. [Second embodiment] _ μ Refer to Fig. 5' is a memory card semiconductor device of the present invention. It is intended that the memory card semiconductor of the present embodiment is disposed in the foregoing item 5, and the main difference is that the package unit 5 of the present embodiment is electrically connected to the carrier member and has a plurality of upper surfaces on the upper surface of the carrier member 51. The electrical connection 51 of the termina I and the semiconductor wafer 52 are electrically connected to the surface of the carrier η. In the example, the electrical connection portion of the carrier and the semiconductor wafer attached thereto are located on different sides of the carrier, and the present embodiment is connected to the semi-conducting I# a Η The connecting portion is: the bobbin body sheet is located on the same side of the carrier member. The encapsulating body 55 of the sheet 52 is formed on the upper surface of the carrier member 51, and the encapsulating colloid 55 is combined with the body and body. a portion 551 (such as a bump) for accommodating = the outer casing 56 is also provided with at least a pair of 51th portion 562 (such as a slot) of the first joint portion 55f, by a combination of the two The fixing I 50 is in the outer casing 56.第三 tl tl [Third Embodiment] Apricot, please refer to Fig. 6, which is a memory card semiconductor of the present invention. The second embodiment is not intended to be different from the foregoing embodiment in that the mounting unit 6G is a lead frame. As a carrier. The lead frame = 611 and a plurality of lead pins (1) disposed around the wafer holder for semi-conducting = being connected to the wafer holder 611 and electrically connected to one end of the lead pin by a bonding wire while using the guide The other end of the leg 612 serves as an electrical connection portion of the carrier for electrically switching the semiconductor wafer 62 to the outside. In addition, a package knee body 65 for covering the semiconductor wafer 62 is formed in the package unit, and at least one first piece of the joint portion 651 (such as a bump) is disposed on the surface of the cover body 65 for receiving The outer body 66 of the package unit is also provided with at least one pair of second scorpion portions 662 (t slots) that should be the first joint portion 651, by the combination of the first and second joint portions. The package unit 60 is fixed in the outer casing 66. Therefore, the memory card semiconductor device of the present invention is mainly provided by the second joint portion of the first joint portion and the outer casing of the package body of the package unit π 19364 1306221 5: s to fix the package unit in the outer casing, to avoid the conventional sealing, and the rear end of the packaging unit leads to an increase in process cost and assembly man-hours, and the use of the back cover fe is caused by poor contact. At the same time, by changing the first joint of the agricultural body or the second joint of the outer casing, the size of the package unit is changed, and the length of the conventional package unit is no longer charged. Limit of the distance between the sexual endpoint and the rear broadcast block Further, since the memory card electronic device structure of the present invention does not require the use of the back cover, the first joint portion of the package body is fastened to the second joint portion of the outer casing, and thus is used as an additional member with respect to the conventional structure. Sealing the rear end of the outer casing will reduce the back cover due to external force, resulting in a lack of contact failure. The above is only a preferred embodiment of the present invention, and is not intended to limit The scope of the technical content of the present invention is broadly defined in the following patent claims. If any technical entity or method completed by another person is defined by the following patent application scope The change is identical or equivalent, and will be considered as covering the scope of this patent. [Simplified Schematic] Figure 1 is a schematic cross-sectional view of a conventional USB memory card; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a schematic cross-sectional view showing a first embodiment of a memory card semiconductor device according to the present invention; 19364 12 1306221 FIGS. 4A and 4B are schematic views of a semiconductor device according to a conventional USB FLASH CARD (UFC); The bottom of the memory card semiconductor device of the present invention is not intended to be a bottom view of the second embodiment of the memory card semiconductor device of the present invention; and FIG. 6 is a third embodiment of the memory card semiconductor device of the present invention. Schematic diagram of the main components. [Major component symbol description] 11 wafer carrier 121 memory chip 122 control wafer 13 passive component 14 USB connector 16 outer casing 20 package unit 21 circuit board 210 electrical terminal 22 semiconductor wafer 23 passive component 25 package colloid 251 Leading edge 26 Outer housing 261 Front slot block 262 Rear stop 27 Back cover 13 19364 1306221 30, 50, 60 Package unit 31, 51 Carrier 310, 510 Electrical connection 32, 52, 62 Semiconductor wafer 33 Passive components 35, 55, 65 encapsulant 351, 551, 651 first joint 36, 56, 66 outer casing 362, 562, 652 second joint 611 wafer holder 612 lead 14 19364