CN109616802B

CN109616802B - Semiconductor device and method for manufacturing terminal component for plug

Info

Publication number: CN109616802B
Application number: CN201811378808.8A
Authority: CN
Inventors: 渡辺章雄; 山口量平; 土肥雅之; 西山拓
Original assignee: Toshiba Memory Corp
Current assignee: Kioxia Corp
Priority date: 2015-03-16
Filing date: 2016-03-11
Publication date: 2020-11-27
Anticipated expiration: 2036-03-11
Also published as: CN105990725B; CN105990725A; JP2016173910A; CN109616802A

Abstract

Embodiments of the invention provide a method for manufacturing a terminal component for a plug and a semiconductor device capable of suppressing occurrence of connection failure when an information device is connected to a peripheral device by a USB. The semiconductor device according to an embodiment is a semiconductor device that can perform data transmission by USB by connecting to a socket, and includes: a circuit board having a wiring board having a plurality of connection pads, and a semiconductor component mounted on the wiring board; and a terminal portion provided on the circuit board. The terminal portion includes: a terminal member having a 1 st connecting portion connectable to the socket, a tail portion provided at an end portion, and a connecting portion connecting the 1 st connecting portion and the tail portion; and an insulating member that holds at least a part of the connection portion. The connection portion has a 2 nd connection portion, which is exposed from the insulating member toward the circuit board side and is electrically connected to at least one of the plurality of connection pads.

Description

Semiconductor device and method for manufacturing terminal component for plug

Related information of divisional application

The scheme is a divisional application. The parent application of this division is an invention patent application having the filing date of 2016, 3 and 11, and the filing number of 201610141749.7, entitled "method for manufacturing a semiconductor device and a terminal component for a plug".

[ related applications ]

This application has priority to basic application of Japanese patent application No. 2015-52711 (application date: 2015 3-16). The present application incorporates the entire contents of the base application by reference thereto.

Technical Field

Embodiments of the present invention relate to a method for manufacturing a semiconductor device and a terminal component for a plug.

Background

As one connection standard for connecting information devices such as computers and peripheral devices, USB (Universal Serial Bus) is known. For example, by connecting an information device to a peripheral device using a USB connector of a male connector (also referred to as a plug) and a female connector (also referred to as a socket), it is possible to obtain not only data transmission but also, for example, a power supply necessary for an operation from the information device to the peripheral device, or to connect a plurality of devices via a USB hub.

USB3.0, which is one of the USB standards, can perform high-speed transmission having a transmission speed 10 times or more higher than that of USB2.0 while maintaining compatibility with USB 2.0. The USB connector of USB3.0 requires 5 connection terminals in addition to 4 connection terminals provided in the USB connector of USB 2.0. With regard to the USB connector of USB3.0, it is difficult to secure a space for forming a connection terminal in a wiring board itself in a semiconductor device provided with a plug, for example.

In a semiconductor device provided with a USB3.0 plug, for example, a terminal component having a terminal member functioning as a connection terminal may be mounted on a wiring board. The terminal member is protected by an insulating member, and has a socket connection portion capable of connecting with a socket, a tail portion provided at an end portion, and a connecting portion connecting the socket connection portion and the tail portion. The terminal member and the wiring board can be electrically connected by connecting the connection pad of the wiring board to the tail portion of the terminal member.

However, when the tail portion of the terminal member is connected to the connection pad of the wiring board, a useless load may be applied to the tail portion, and a connection failure may be caused. As described above, in a semiconductor device capable of data transmission by USB, it is required to suppress occurrence of a connection failure.

Disclosure of Invention

Embodiments of the invention provide a semiconductor device and a method for manufacturing a terminal part for a plug, which can suppress the occurrence of poor connection between a connection terminal and a circuit board, which can be connected to an external device by using a USB.

The semiconductor device according to an embodiment is a semiconductor device that can perform data transmission by USB by connecting to a socket, and includes: a circuit board having a wiring board having a plurality of connection pads, and a semiconductor component mounted on the wiring board; and a terminal portion provided on the circuit board. The terminal portion includes: a terminal member having a 1 st connecting portion connectable to the socket, a tail portion provided at an end portion, and a connecting portion connecting the 1 st connecting portion and the tail portion; and an insulating member that holds at least a part of the connection portion. The connection portion has a 2 nd connection portion, which is exposed from the insulating member toward the circuit board side and is electrically connected to at least one of the plurality of connection pads.

Drawings

Fig. 1 is a schematic cross-sectional view showing a structural example of a semiconductor device.

Fig. 2 is a schematic plan view showing a structural example of the semiconductor device.

Fig. 3 is an external view schematically showing the front surface of the terminal portion.

Fig. 4 is an external view schematically showing a part of the rear surface of the terminal portion.

Fig. 5 is an enlarged view of the terminal portion.

Fig. 6 is a schematic cross-sectional view showing another configuration example of the terminal portion.

Fig. 7 is a schematic cross-sectional view showing another configuration example of the terminal portion.

Fig. 8 is a schematic cross-sectional view showing another configuration example of the terminal portion.

Fig. 9 is a schematic plan view of the terminal portion shown in fig. 8.

Fig. 10 is a schematic plan view for explaining an example of a method for manufacturing the terminal portion.

Fig. 11 is a schematic plan view for explaining an example of a method for manufacturing the terminal portion.

Fig. 12 is a schematic cross-sectional view showing another structural example of the semiconductor device.

Detailed Description

Hereinafter, embodiments will be described with reference to the drawings. The drawings are schematic and may differ from actual ones in, for example, the relationship between the thickness and the planar size, the ratio of the thicknesses of the respective layers, and the like. In the embodiment, substantially the same components are denoted by the same reference numerals, and description thereof is omitted.

Fig. 1 and 2 are schematic views showing a configuration example of a semiconductor device capable of data transmission by USB3.0 by being connected to a socket, fig. 1 is a schematic cross-sectional view, and fig. 2 is a schematic plan view. Fig. 1 and 2 illustrate a semiconductor device including a circuit board, which is a SiP (System in a Package), as an example.

The semiconductor device 10 shown in fig. 1 and 2 includes a case 1, a circuit board 2, and a terminal portion 3. The housing 1 includes an opening 11 as a non-through hole. The housing 1 has insulation properties and is made of, for example, synthetic resin such as polyvinyl chloride. For example, the case 1 having the opening 11 may be formed by bonding a pair of case members having a groove portion and molded using a synthetic resin so that the groove portions are adjacent to each other. The shape of the housing 1 is not limited to the shape shown in fig. 1. For example, the case 1 may be provided so as to overlap the entire circuit board 2, or a case having a function of a cover for protecting a portion of the circuit board 2 protruding from the case 1 may be provided in addition to the case 1.

The circuit board 2 is disposed in the opening 11, for example. The circuit board 2 is preferably fixed by the housing 1. Further, the circuit board 2 includes: a wiring board 21 having a 1 st surface and a 2 nd surface opposite to the 1 st surface; semiconductor components such as a memory chip 22 and a controller chip 23 mounted on the 1 st surface of the wiring board 21; and a resin layer 24 sealing the semiconductor component. The memory chip 22 and the controller chip 23 are not limited to these, and other semiconductor components may be used. In addition, the positions of the memory chip 22 and the controller chip 23 may be reversed.

The 1 st surface of the wiring board 21 corresponds to the lower surface of the wiring board 21 in fig. 1, and the 2 nd surface corresponds to the upper surface of the wiring board 21 in fig. 1. The wiring board 21 has a plurality of connection pads including at least a connection pad 211a and a connection pad 211b provided on the 1 st surface. The wiring board 21 has a plurality of connection pads including at least a connection pad 212a and a connection pad 212b provided on the 2 nd surface. The connection pads of the 1 st surface are electrically connected to the

connection pads

212a and 212b of the 2 nd surface via, for example, through holes penetrating the wiring board 21. As the wiring board 21, for example, a resin board such as glass epoxy having a wiring layer provided with a connection pad provided on the front surface can be used.

The

connection pads

211a and 211b are connection pads for electrically connecting the semiconductor component and the wiring board 21. The connection pad 212b functions as a connection terminal that can be connected to a socket. The connection terminals include, for example, connection terminals necessary for data transmission using USB2.0 or USB3.0, such as a power supply terminal (VBUS), signal terminals (D +, D-) for normal transmission data signals as differential signals, and a ground terminal (GND). In fig. 1, the connection pad 212b is provided so as to protrude from the case 1 (the opening 11), but the present invention is not limited thereto, and the connection pad 212b (the circuit board 2) may be provided so as to be accommodated in the opening 11.

The memory chip 22 is electrically connected to the bonding pad 211 a. The memory chip 22 has, for example, a stack of a plurality of semiconductor chips, and the plurality of semiconductor chips are adhered to each other with an adhesive layer interposed therebetween so as to partially overlap each other. The plurality of semiconductor chips are electrically connected to each other by connecting electrode pads provided on the respective semiconductor chips to each other by wire bonding. As the semiconductor chip, for example, a memory chip or the like having a memory element such as a NAND (Not-AND) flash memory can be used. In this case, the semiconductor chip may include a decoder in addition to the memory cell.

The controller chip 23 is electrically connected to the connection pad 211 b. The controller chip 23 controls operations such as data writing and data reading to and from the memory chip 22. The controller chip 23 includes a semiconductor chip, and is electrically connected to the wiring board 21 by connecting electrode pads provided on the semiconductor chip to the connection pads 211b provided on the wiring board 21 by wire bonding, for example.

The method of connecting the memory chip 22, the controller chip 23, and the wiring board 21 is not limited to wire bonding, and wireless bonding such as flip chip bonding or Tape automated bonding (Tape automated bonding) may be used. A three-dimensional package structure such as a TSV (Through Silicon Via) method in which the memory chip 22 and the controller chip 23 are stacked on the 1 st surface of the wiring board 21 may be used.

The resin layer 24 is provided to seal the memory chip 22 and the controller chip 23. The resin layer 24 contains, for example, an inorganic filler (e.g., SiO)₂). The resin layer 24 is formed by a molding method such as transfer molding, compression molding, or injection molding using a sealing resin obtained by mixing the inorganic filler and an organic resin.

The terminal portion 3 is provided on the circuit board 2. For example, the terminal portion 3 is held by the housing 1. Here, a structural example of the terminal portion 3 will be described with reference to fig. 3 and 4. Fig. 3 and 4 are schematic views showing structural examples of the terminal portion, fig. 3 is an external view showing a front surface of the terminal portion, and fig. 4 is an external view showing a part of a rear surface of the terminal portion. The terminal portion 3 is not limited to the case where the terminal portion 3 is used for the semiconductor device 10, and the terminal portion 3 may be used as one terminal component which can be applied to a semiconductor device having another structure. In addition, if the standard is, for example, a standard using the same signal, the terminal unit 3 may be provided in a semiconductor device capable of data transmission using another USB standard.

As shown in fig. 4, the terminal portion 3 includes a terminal member 31 and an insulating member 32. In fig. 3, 5 terminal members 31 are shown, but the number of terminal members 31 is not particularly limited. In fig. 3, the shape of the terminal member 31 on the side continuous to the socket is not limited to this.

The terminal member 31 functions as a connection terminal connectable to a socket, for example. Examples of the connection terminal include connection terminals necessary for high-speed transmission using USB3.0, such as a ground terminal (GND), signal terminals (SSTX +, SSTX-) for high-speed transmission of differential signals, and signal terminals (SSRX +, SSRX-) for high-speed transmission of differential signals.

Fig. 5 is an enlarged view of the terminal portion 3. As shown in fig. 5, terminal member 31 has a connection portion 31a, a tail portion 31b, and a connection portion 31 c.

The connection portion 31a is a portion that can be connected to a socket when the semiconductor device 10 is inserted into the socket, for example. In this case, the connection portion 31a is also referred to as a receptacle connection portion. The connecting portion 31a includes a contact portion 31 d. The contact portion 31d is provided on, for example, the 1 st surface of the connection portion 31 a. In fig. 5, the connection portion 31a protrudes from the insulating member 32.

The contact portion 31d preferably has a curved surface with an upper side being convex. This facilitates electrical connection between the contact portion 31d and the receptacle. The connection portion 31a preferably has elasticity. Since the terminal member 31 is connected to the socket on the upper side of the terminal member 31, the terminal member 31 is pushed downward when the semiconductor device 10 is inserted into the socket, and a force to return to its original shape by elasticity is applied to the connection terminal of the socket, so that the contact strength with the socket can be improved.

The tail portion 31b is provided at, for example, an end of the terminal member 31. One end of the tail portion 31b has a cut surface when the terminal portion 3 is formed. One end of the tail portion 31b has a planar shape, for example. In fig. 5, the tail portion 31b protrudes from the insulating member 32 and is spaced apart from the circuit board 2. That is, by providing the structure in which the tail portion 31b is not in contact with the circuit board 2, it is possible to suppress the load applied to the tail portion 31b and suppress the deformation of the terminal member 31.

The connecting portion 31c is provided to connect the connecting portion 31a and the tail portion 31 b. The connecting portion 31c preferably has a curved shape in which the lower side is convex in fig. 5, for example. The connection portion 31c has a connection portion 311, and the connection portion 311 is exposed from the insulating member 32 to the circuit board 2 side and electrically connected to at least one of the plurality of connection pads (here, the connection pad 212 a). By holding the periphery of the connection portion 311 with the insulating member 32, it is possible to suppress a connection failure between the terminal portion 3 and the circuit board 2 due to a foreign substance.

In fig. 5, the connection portion 31c is electrically continuous with the connection pad 212 a. In this case, the connection portion 311 is also referred to as a board connection portion. The connection portion 31c may be joined to the connection pad 212a by, for example, crimping, welding, or the like. In addition, terminal portion 3 can be made smaller by making tail portion 31b shorter than connecting portion 311 in the extending direction of terminal member 31.

As the terminal member 31, a material that can impart elasticity, such as a copper alloy (e.g., beryllium copper, phosphor bronze, or cobalt copper) or a nickel alloy (e.g., beryllium nickel), can be used.

The insulating member 32 holds at least a part of the connecting portion 31 c. In fig. 1 to 5, the connection portion 31a and the tail portion 31b protrude from the insulating member 32. As the insulating member 32, for example, resin or the like can be used. Further, by providing the connection portion 311 with a surface continuous with one surface (the lower surface of the insulating member 32 in fig. 5) of the insulating member 32 positioned between the connection pad 212a and the connection portion 31c, the step between the insulating member 32 and the connection portion 311 is reduced, and therefore, a connection failure between the connection portion 311 and the connection pad 212a can be suppressed.

The structure of the terminal portion 3 is not limited to the structure shown in fig. 1 to 5. Fig. 6 to 7 are schematic cross-sectional views showing other structural examples of the terminal portion 3.

Terminal portion 3 shown in fig. 6 differs from terminal portion 3 shown in fig. 5 in that it has at least connecting portion 311 provided so as to protrude from insulating member 32. In fig. 6, the connection portion 311 is provided so as to protrude from the insulating member 32 toward the circuit board 2 side. In this case, it is preferable that an adhesive layer 4 is provided between the terminal portion 3 and the circuit board 2 (wiring board 21), and the terminal portion 3 and the circuit board 2 (wiring board 21) are adhered by the adhesive layer 4. As the adhesive layer 4, for example, an acrylic adhesive or an epoxy adhesive can be used. In addition, an anisotropic conductive resin can be used for the adhesive layer 4. In addition, the adhesive layer 4 may not be provided.

By setting the structure of terminal portion 3 to the structure shown in fig. 6, the area of connecting portion 31c exposed from insulating member 32 among connecting portions 31c is large, and therefore, the area of connecting portion 311 is easily made larger than terminal portion 3 shown in fig. 5. By increasing the area of the connection portion 311, the connection resistance between the terminal member 31 and the circuit board 2 can be reduced, and a connection failure is less likely to occur.

The terminal portion 3 shown in fig. 7 is different from the terminal portion 3 shown in fig. 5 in that it has at least a connection portion 311 provided so as to recede into the insulating member 32, in other words, in that it has an insulating member 32 having an opening portion 320 for exposing the connection portion 311. In fig. 7, an opening 320 is provided on the circuit board 2 side of the insulating member 32. In this case, it is preferable that the conductive layer 5 is provided between the terminal portion 3 and the circuit board 2 (wiring board 21), and the terminal portion 3 and the circuit board 2 (wiring board 21) are connected by the conductive layer 5. In addition, by providing the opening 320 for each terminal member 31 and providing the conductive layer 5 for each opening 320, the plurality of terminal members 31 are electrically separated from each other.

By configuring the structure of terminal portion 3 as shown in fig. 7, it is possible to suppress a connection failure between terminal member 31 and connection pad 212a due to, for example, a foreign substance.

As the conductive layer 5, a metal material such as copper or a conductive material such as solder can be used. In addition, an adhesive material containing a material having conductivity (conductive filler or the like) may be used in addition to the material that can be applied to the adhesive layer 4 shown in fig. 6. This allows the terminal member 31 and the circuit board 2 (wiring board 21) to be electrically connected to each other through the conductive layer 5 in the opening 320.

The terminal portion 3 shown in fig. 5 to 7 is manufactured by forming the insulating member 32 using, for example, a mold having a desired shape. In addition, the insulating member 32 may be formed to cover a part of the terminal member 31 by the above-described method, and then a part of the insulating member 32 may be removed to expose the connection portion 311.

In the terminal portion 3 shown in fig. 8, at least the structure of the insulating member 32 is different from the structure having the connection pad 33 electrically connected to the semiconductor component, as compared with the terminal portion 3 shown in fig. 5. The connection pad 33 has a connection portion 33a and a connection portion 33b which can be connected to the receptacle. When the plug is connected to the socket, the connection pad 212b is not directly connected to the socket, but the connection portion 33a is connected to the socket.

The insulating member 32 has a region 32a holding at least a part of the connecting portion 31c and a region 32b holding at least a part of the connection pad 33.

In the terminal portion 3 shown in fig. 8, the connection pad 33 has a connection portion 33a connectable to the socket and a connection portion 33b exposed from the insulating member 32 and electrically connected to the connection pad 212 b. The connection pad 33 is formed using, for example, a material that can be applied to the terminal member 31. The connection pad 33 is not limited to this, and may be formed of a material different from that of the terminal member 31.

By setting the structure of the terminal portion 3 to the structure shown in fig. 8, the area of the connection pad 212b in the wiring board 21 can be reduced. This can improve the degree of freedom in wiring layout in the wiring board 21.

Fig. 9 is a plan view of the terminal portion 3 shown in fig. 8. As shown in fig. 9, the connecting portion 33b may have a structure not overlapping with the connecting portion 33a when viewed from above. Further, the connection pad 33 is not limited to the region 32b, and may be provided between the terminal members 31 in the region 32a when viewed from above. In this case, the region 32b may not be provided.

The connection pad 33 has a function as a connection terminal, for example. The connection terminals include, for example, connection terminals necessary for data transmission using USB2.0 or USB3.0, such as a power supply terminal (VBUS), signal terminals (D +, D-) for normal transmission data signals as differential signals, and a ground terminal (GND).

Fig. 10 and 11 are schematic diagrams for explaining an example of a method for manufacturing the terminal portion 3. As shown in fig. 10, first, the terminal member 30 is prepared. The terminal member 30 has a comb-tooth shape including a plurality of teeth which become a plurality of terminal members 31 later.

Next, the insulating member 32 is provided by insert molding or the like so as to hold a part of each tooth of the terminal member 30, thereby exposing the connection portion 311 and holding the connection portion 31 c. Insert molding is a molding method in which a resin is injected around a metal part inserted into a mold to integrate the metal and the resin.

Next, as shown in fig. 11, the terminal member 30 is cut with reference to the line segment X-Y to separate the plurality of teeth, thereby forming a plurality of terminal members 31. The cut surface at this time becomes a part of the tail portion 31 b. As described above, the terminal portion 3 can be formed.

As described above, in the present embodiment, the connection portion with the circuit board in the terminal portion is provided in the connection portion rather than the tail portion, whereby connection failure or the like due to external force can be suppressed. The tail portion may be deformed by an external force applied thereto when cutting or the like. In addition, when the connection portion is provided at the tail portion, the exposed portion including the tail portion exposed from the insulating member must be made long. Therefore, there are cases where: short-circuiting and poor connection between the plurality of terminal members and the circuit board occur in the exposed portion. In contrast, by providing a connection portion with the circuit board in the connection portion, the periphery of the connection portion can be covered with the insulating member, and the exposed portion including the tail portion can be shortened, thereby suppressing connection failure. In addition, the terminal portion can be miniaturized.

The structure of the circuit board 2 is not limited to fig. 1. Fig. 12 shows another example of the structure of the semiconductor device. Fig. 12 shows a semiconductor device including a Circuit Board 2, which is a PCBA (Printed Circuit Board Assembly), as an example. The semiconductor device shown in fig. 12 is different from the semiconductor device 10 shown in fig. 1 in at least the following respects: the upper surface of the wiring board 21 is the 1 st surface, and the semiconductor device includes connection pads 212a to 212c provided on the 1 st surface of the wiring board 21, and a semiconductor package 27 mounted on the 1 st surface of the wiring board 21 in place of the memory chip 22 and the controller chip 23. In fig. 12, the same components as those of the semiconductor device 10 shown in fig. 1 will be referred to as appropriate in the description of fig. 1.

The lead frame of the semiconductor package 27 is electrically connected to the connection pad 212c provided on the 1 st surface of the wiring board 21. Semiconductor components such as a memory chip and a controller chip may be provided in the semiconductor package 27. As shown in fig. 12, a semiconductor package having a lead frame may be used as the semiconductor component, and a sealing resin layer may be formed on the semiconductor package. In addition, a memory chip and a controller chip may not be provided.

The terminal portion having the above-described structure is not limited to the structure shown in fig. 12, and may be used, for example, for a plug of a plug-type semiconductor device. For example, the plug includes, for example, a 1 st wiring board using the wiring board 21, a 2 nd wiring board different from the 1 st wiring board, a terminal portion provided on the 2 nd wiring board, and a housing such as a metal material covering the 2 nd wiring board and the terminal portion. At this time, the terminal portion is electrically connected to the 2 nd wiring board, and the 2 nd wiring board is electrically connected to the 1 st wiring board through a connection terminal or the like. In the semiconductor device having the above-described structure, the plug and the socket are connected to each other, whereby data transmission by USB can be performed between the semiconductor device and an information device having the socket.

The embodiments are presented as examples, and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

[ description of symbols ]

1 casing

2 Circuit Board

3 terminal part

4 adhesive layer

5 conductive layer

10 semiconductor device

11 opening part

21 wiring board

211a connection pad

211b connection pad

212a connection pad

212b connection pad

22 memory chip

23 controller chip

24 resin layer

27 semiconductor package

30 terminal component

31 terminal member

31a connection part

31b tail part

31c connecting part

31d contact part

32 insulating member

Region 32a

Region 32b

33 connecting pad

33a connection part

33b connection part

311 connecting part

320 opening part

Claims

1. A terminal fitting, characterized by comprising:

an insulating member having an upper surface, a lower surface opposed to the upper surface, and a side surface connecting the upper surface and the lower surface;

a terminal member having a 1 st connection portion protruding from a side surface of the insulating member, a tail portion protruding from a side surface of the insulating member opposite to the 1 st connection portion, and a connection portion provided in the insulating member and connecting the 1 st connection portion and the tail portion;

the connecting portion has a 2 nd connection portion, and the 2 nd connection portion is exposed from a lower surface of the insulating member.

2. The terminal fitting according to claim 1, wherein:

the tail portion is located between the lower surface and the upper surface of the insulating member.

3. The terminal fitting according to claim 2, wherein:

the protruding length of the tail portion is shorter than the length of the 2 nd connecting portion.

4. A terminal part according to any one of claims 1 to 3, characterized in that:

the 2 nd connecting portion has a surface continuous with a lower surface of the insulating member.

5. The terminal fitting according to claim 4, wherein:

the connecting portion has a curved shape with a lower side being convex.

6. The terminal fitting according to claim 4, wherein:

the 1 st continuous part has a curved shape with a convex upper side.

7. The terminal fitting according to claim 4, wherein:

the terminal member is composed of a copper alloy or a nickel alloy.

8. A terminal part according to any one of claims 1 to 3, characterized in that:

the 2 nd connecting portion protrudes from a lower surface of the insulating member.

9. The terminal fitting according to claim 8, wherein:

the connecting portion has a curved shape with a lower side being convex.

10. The terminal fitting according to claim 8, wherein:

the 1 st continuous part has a curved shape with a convex upper side.

11. The terminal fitting according to claim 8, wherein:

the terminal member is composed of a copper alloy or a nickel alloy.

12. A terminal part according to any one of claims 1 to 3, characterized in that:

the 2 nd connecting portion is provided so as to recede into the insulating member.

13. The terminal fitting according to claim 12, wherein:

the connecting portion has a curved shape with a lower side being convex.

14. The terminal fitting according to claim 12, wherein:

the 1 st continuous part has a curved shape with a convex upper side.

15. The terminal fitting according to claim 12, wherein:

the terminal member is composed of a copper alloy or a nickel alloy.

16. A terminal part according to any one of claims 1 to 3, characterized in that:

also comprises a 3 rd continuous pad which is provided with a connecting pad,

the insulating member has a 1 st region holding at least a part of the connecting portion and a 2 nd region holding at least a part of the 3 rd connection pad,

the 3 rd connection pad has a 3 rd connection portion and a 4 th connection portion exposed from a lower surface of the insulating member.

17. The terminal fitting of claim 16, wherein:

the connecting portion has a curved shape with a lower side being convex.

18. The terminal fitting of claim 16, wherein:

the 1 st continuous part has a curved shape with a convex upper side.

19. The terminal fitting of claim 16, wherein:

the terminal member is composed of a copper alloy or a nickel alloy.

20. A method of manufacturing a terminal part, characterized by:

the terminal fitting includes:

a plurality of terminal members each having a 1 st connecting portion, a tail portion, and a connecting portion for connecting the 1 st connecting portion and the tail portion; and

an insulating member that holds at least a part of the connection portion; and is

The manufacturing method comprises the following steps:

disposing a metal part in a mold, the metal part having a plurality of terminal member portions to be the terminal members and a connecting portion to connect the plurality of terminal member portions to each other;

forming an insulating member that projects the 1 st connection portion from a side surface, exposes the 2 nd connection portion, which is a part of the connection portion, from a lower surface, and projects the tail portion and the connection portion from a side surface opposite to the 1 st connection portion to hold the connection portion; and

the joining portion is cut off from the tail portion.

21. The method of manufacturing a terminal fitting according to claim 20, wherein:

the insulating member is formed using an insert molding method,

the integrated metal fitting is separated into a plurality of terminal members by cutting the connecting portion from the tail portion.