1298609 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種遮蔽蓋設計方法及裝置，且特別 是有關於一種用於行動裝置之電路板遮蔽蓋的設計方法及 裝置。 【先前技術】 3C(Computer，Communications and Consumer)這個名詞 .是隨著半導體技術，尤其是單晶片系統的進步而出現的全 新名詞，被視為後PC時代（Post-PC Era)的主流，而3C產 品的走向將朝著低價格、大量生產、低成本、整合性高， 重視個人化及多樣化的趨勢發展，也就是透過科技技術的 進步，能突破空間與時間的限制，讓消費者可以達到在隨 時、隨地以及任何媒體都能相互溝通，享受資訊帶來舒適 (Comfort)、便利（Convenience)與互通（Connection)的 3C 生 活。 | 隨著3C產業的發展，有越來越多的人會使用行動裝置 (handheld device)作為生活中的輔助工具。舉例而言，常見 的行動裝置包含個人數位助理（personal digital assistant ; PDA)、行動電話（mobile phone)、智慧型手機（smart phone) 等，這些行動裝置之體積輕巧，攜帶方便，因此使用的人 數越來越多，所需之功能亦越來越廣。 行動裝置中需具有印刷電路板（printed circuit board ; PCB)，以維持行動裝置之功能，而由於行動裝置之體積較 為輕巧，因此在電路佈局（layout)上的難度也隨之提升。舉 5 1298609 例而言，在進行電路佈局時，常需要在電路板内部安排一 接地區，以方便佈線，然後，再覆蓋遮蔽蓋（ShieIdingcase) 於電路板上。U，習知技術中多利料床(p㈣hing)的方 式，打出配置於電路板的洋白銅材質之遮蔽蓋框架及所需 的接地區。由於行動裝置之體積較小，若是遇到較為 複雜的接地區外形，則無法利用沖床的方式打出此種接地 區。如此-來，於設計電路板之電路佈局時，需考慮到所 安排之接地區外形不可太過複雜，因此增加了工程師 電路佈局之困難度。 因此，如何解決習知技術中，印刷電路板之電路佈局 受限於接地區外形之情形，便成了重要的課題。 【發明内容】 因此本發明的目的就是在提供一種遮蔽蓋設計方法， 以方便工程師進行電路佈局之設計。 本發明的另-目的是在提供一種遮蔽蓋裝置，可提供 接地結構作為電路板中之接地區，以方便佈線。 /、 -根據本發明之上述目的，提出—種遮蔽蓋設計方法， L S配置遮蔽蓋框架於一行動裝置之一電路板；配置至 接地結構於電路板；以及覆蓋一遮蔽蓋本體於遮蔽蓋 框木。其中，此接地結構可設計為任意形狀，以對應電路 、=路佈局，方便工程師進行佈線。接地結構之材料 可為塑膠’則此方法更包含喷塗-導電漆於接地結構之表 面：：地結構之材料亦可為可藉由壓鑄模成形的金屬，如 鋁口孟或者，接地結構之材料亦可為可導電之塑膠，如 1298609 為摻雜有金屬粉末的塑膠。其中，配置遮蔽蓋框架於電路 板之步驟，係利用一表面接合技術（surface m〇um technique; SMT)，以固定遮蔽蓋框架於電路板。其中，配 置接地結構於電路板上之步驟，包含利用接地結構上之複 數個凸點，與遮蔽蓋框架上之複數個凹槽耦合，且更包含 ^用一黏膠以固定凸點與凹槽。接地結構亦可直接利用粘 著劑黏合於遮蔽蓋框架上。或者，接地結構更可利用一熱 熔膠之固定方式，固.定於遮蔽蓋框架上。其中，覆蓋遮蔽 盖本體於遮蔽蓋框架之步驟，包含使遮蔽蓋本體上之複數 個定位孔，與接地結構上之複數個定位突起耦合，且更包 含使接地結構上之複數個接地部，露出於遮蔽蓋本體之複 數個接地邛開口。其中’遮蔽蓋本體係利用複數個螺絲鎖 固於遮蔽蓋框架。 本發明之另一恶樣係為一種遮蔽蓋裝置，應用於一行 動裝置之-電路板。遮蔽蓋裝置包含一遮蔽蓋框架、至少 一接地結構，以及一遮蔽蓋本體。遮蔽蓋框架與接地結構 係配置於電路板上，且接地結構可設計為任意形狀，以對 應於電路板之-電路佈局，以方便王程師進行佈線。遮蔽 盍本體係覆蓋於遮蔽蓋框架，以遮蔽電路板及接地結構。 其中，接地結構之材料可為塑膠，如為abs樹脂 (acrylomtrile-butadiene-styrene resin ; ABS resin)，且此塑 膠之接地結構上噴塗有_導電漆。此接地結構之材料亦可 為金屬，如鋁合金。或者，接地結構之材料亦可為可導電 之塑膠，如為摻雜有金屬粉末的塑膠。其中，接地結構更 包含複數個接地部’遮蔽蓋本體則包含對應之複數個接地 1298609 ^開口’當遮蔽蓋本體覆蓋於遮蔽蓋框架時，接地部係露 出於接地部開口。接地部面對f路板之_面具有複數個^ 點，遮蔽蓋框架具有對應之複數個凹槽，遮蔽蓋裝置係經 由凹槽與凸點之_合，以时接地結構於遮蔽蓋框架。其 中’遮蔽蓋裝置更包含一黏膠，塗佈於凹槽與凸點之間， 以固定凸點與凹槽。遮蔽蓋裝置可更包含一黏合劑，以直 接黏合接地結構之接地部於遮蔽蓋框架。或者，遮蔽蓋裝 f可更包含一熱熔膠，以利用熱熔膠固定接地結構之接地 部於遮蔽蓋框架。其中，接地結構面對遮蔽蓋本體之一面 具有複數個定位突起，遮蔽蓋本體具有對應之複數個定位 孔，當遮蔽蓋本體覆蓋於遮蔽蓋框架時，定位突起係與定 位孔耦合。遮蔽蓋裝置可更包含複數個螺絲，以鎖固遮蔽 蓋本體於遮蔽蓋框架。 此遮蔽蓋設計方法中，係利用配置之接地結構作為接 地£ 由於接地結構可設計為任意形狀，因此，可實現過 去利用沖床技術無法完成之較為曲折複雜的接地區佈局， 增加了工程師設計電路時的便利性。此遮蔽蓋裝置係由多 個零組件所組合而成，因此，可配合不同之電路佈局更換 對應之接地結構，而具有較佳的設計彈性，並可降低生產 成本。 【實施方式】 以下將以圖式及詳細說明清楚說明本發明之精神，任 何所屬技術領域中具有通常知識者在瞭解本發明之較佳實 施例後’當可由本發明所教示之技術，加以改變及修飾， 8 1298609 其並不脫離本發明之精神與範圍。 —#參妝第1A圖及第1B圖，其係分別繪示本發明之遮蔽 =裝置-較佳實施例的***圖及組裝完成之示意圖。遮蔽 盍裝置係應用於一行動裝置中之電路板1〇〇，以增加工程師 進仃電路板100電路佈局時之便利性（圖中未顯示電路板之 線路的.[^ )。參照第1A圖，遮蔽蓋裝置包含遮蔽蓋框架 110、至少一接地結構12〇，以及至少一遮蔽蓋本體13〇。 其中，遮蔽盍框架110係配置於電路板1〇〇上，接地結構 uo亦配置於電路板】〇〇上，且較佳地係位於遮蔽蓋框架 110内部。接地結構120可設計為任意形狀，以配合電路板 100之電路佈局，以方便工程師進行電路板1〇〇内部線路之 接地。遮蔽盍本體13〇係覆蓋於遮蔽蓋框架丨1 〇，以遮蔽電 路板100與接地結構12〇。 遮蔽蓋框架11〇可利用表面接合技術（surface m〇unt technique; SMT)，將遮蔽蓋框架110直接貼合於電路板1〇〇 上。由於接地結構120之外形可配合電路板丨〇〇中之佈局 進行設計’可設計為配合較曲折複雜之電路佈局，因此， 增加了工程師設計電路佈局時的便利性。接地結構12〇可 為表面噴塗有導電漆之塑膠結構，如為ABS樹脂 (acrylonitrile-butadiene-styrene resin ; ABS resin)。或者， 接地結構120亦可為可使用壓鑄模成型之金屬，如鋁合金。 或者，接地結構120之材料亦可為可導電之塑膠，如為摻 雜有金屬粉末的塑膠。接地結構120更包含複數個接地部 122，而遮蔽蓋本體13〇具有對應之複數個接地部開口 132 ’當遮蔽蓋本體130覆蓋於遮蔽蓋框架11〇時，接地結 1298609 構12 0之接地部12 2會露屮你、奋μ # 出於遮敝盍本體130之接地部開 口 132,以使電路板1〇〇中 ^ 之線路，經由接地結構120之接 地部122完成與外部接地之動作。1298609 IX. Description of the Invention: [Technical Field] The present invention relates to a method and apparatus for designing a cover, and more particularly to a method and apparatus for designing a circuit board cover for a mobile device. [Prior Art] The term 3C (Computer, Communications and Consumer) is a new term that emerged with the advancement of semiconductor technology, especially single-chip systems, and is regarded as the mainstream of the post-PC era (Post-PC Era). The trend of 3C products will be toward low price, mass production, low cost, high integration, and the development of individualization and diversification, that is, through the advancement of technology, it can break through the limitations of space and time, so that consumers can Achieve communication, communication, Convenience and Connection 3C life, anytime, anywhere and any media. With the development of the 3C industry, more and more people will use handheld devices as an aid in life. For example, common mobile devices include personal digital assistants (PDAs), mobile phones, smart phones, etc. These mobile devices are lightweight and easy to carry, so the number of people used More and more, the functions required are becoming more and more extensive. The mobile device needs to have a printed circuit board (PCB) to maintain the function of the mobile device, and since the mobile device is relatively compact, the difficulty in the layout of the circuit is also increased. For example, in the case of circuit layout, it is often necessary to arrange a connection area inside the board to facilitate wiring, and then cover the shield cover (ShieIding case) on the circuit board. U. In the conventional technology, a multi-material bed (p(four)hing) is used to punch the cover frame of the white copper material disposed on the circuit board and the required connection area. Due to the small size of the mobile device, it is not possible to punch the grounding area by means of a punch if it encounters a complicated shape of the connecting area. In this way, when designing the circuit layout of the circuit board, it should be considered that the shape of the connected area is not too complicated, thus increasing the difficulty of the engineer's circuit layout. Therefore, how to solve the conventional technology in which the circuit layout of the printed circuit board is limited to the shape of the area is an important issue. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a mask cover design method to facilitate an engineer to design a circuit layout. Another object of the present invention is to provide a masking device that provides a grounding structure as a connection area in a circuit board to facilitate wiring. According to the above object of the present invention, a cover cover design method is provided, wherein a LS is disposed on a circuit board of a mobile device; a ground structure is disposed on the circuit board; and a cover cover body is covered on the cover frame wood. Among them, the grounding structure can be designed in any shape to correspond to the circuit and = road layout, which is convenient for engineers to carry out wiring. The material of the grounding structure may be plastic'. The method further comprises spraying-conductive paint on the surface of the grounding structure: the material of the ground structure may also be a metal which can be formed by a die-casting mold, such as aluminum mouth or a grounding structure. The material can also be an electrically conductive plastic such as 1298609 which is a plastic doped with metal powder. Wherein, the step of arranging the cover cover frame on the circuit board utilizes a surface m〇um technique (SMT) to fix the cover cover frame to the circuit board. The step of configuring the grounding structure on the circuit board comprises: using a plurality of bumps on the grounding structure to couple with the plurality of grooves on the shielding cover frame, and further comprising: using a glue to fix the bumps and the grooves . The grounding structure can also be directly bonded to the cover frame by an adhesive. Alternatively, the grounding structure can be fixed by a hot melt adhesive and fixed on the cover frame. The step of covering the shielding cover body on the shielding cover frame includes: coupling a plurality of positioning holes on the shielding cover body to the plurality of positioning protrusions on the grounding structure, and further including exposing the plurality of grounding portions on the grounding structure to expose A plurality of grounding openings are formed in the cover body. The 'shadow cover system' is locked to the cover frame by a plurality of screws. Another object of the present invention is a masking device for a circuit board of a row of moving devices. The cover cover device includes a cover cover frame, at least one grounding structure, and a cover cover body. The shielding cover frame and the grounding structure are disposed on the circuit board, and the grounding structure can be designed in any shape to correspond to the circuit board-circuit layout, so that the wiring is convenient for the king. The masking system covers the shield cover frame to shield the circuit board from the grounding structure. The material of the grounding structure may be a plastic, such as an acrylic resin (acrylomtrile-butadiene-styrene resin; ABS resin), and the grounding structure of the plastic is sprayed with a conductive paint. The material of the grounding structure may also be a metal such as an aluminum alloy. Alternatively, the material of the grounding structure may be an electrically conductive plastic such as a plastic doped with metal powder. The grounding structure further includes a plurality of grounding portions. The shielding cover body includes a corresponding plurality of groundings. 1298609^Openings. When the shielding cover body covers the shielding cover frame, the grounding portion is exposed by the grounding portion opening. The grounding portion has a plurality of points facing the f-plane, and the shielding cover frame has a plurality of corresponding grooves, and the shielding cover device is coupled to the convex portion by the groove and the grounding structure to cover the cover frame. The 'shading cover device further includes a glue applied between the groove and the bump to fix the bump and the groove. The masking device may further comprise an adhesive for directly bonding the grounding portion of the grounding structure to the shielding cover frame. Alternatively, the masking cover f may further comprise a hot melt adhesive to fix the grounding portion of the grounding structure to the shielding cover frame by means of a hot melt adhesive. The grounding structure has a plurality of positioning protrusions facing one side of the shielding cover body, and the shielding cover body has a plurality of corresponding positioning holes. When the shielding cover body covers the shielding cover frame, the positioning protrusions are coupled with the positioning holes. The cover cover device may further include a plurality of screws to lock the cover cover body to the cover cover frame. In the design method of the shielding cover, the grounding structure of the configuration is used as the grounding. Since the grounding structure can be designed in any shape, it is possible to realize a more complicated and complicated connection area layout which cannot be completed by the punching technology in the past, and the engineer design circuit is added. Convenience. The shielding cover device is composed of a plurality of components, so that the corresponding grounding structure can be replaced with different circuit layouts, and the design flexibility is better, and the production cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS The spirit of the present invention will be clearly described in the following description and detailed description of the present invention. And modifications, 8 1298609, without departing from the spirit and scope of the invention. - #参妆1A and 1B, respectively, showing the exploded view of the preferred embodiment of the present invention and the assembled view. The shielding device is applied to the circuit board 1 in a mobile device to increase the convenience of the engineer in the circuit layout of the circuit board 100 (the circuit of the circuit board is not shown. [^). Referring to Fig. 1A, the cover cover device includes a cover cover frame 110, at least one grounding structure 12A, and at least one cover cover body 13''. The shielding frame 110 is disposed on the circuit board 1 , and the grounding structure uo is also disposed on the circuit board, and is preferably disposed inside the shielding cover frame 110 . The ground structure 120 can be designed in any shape to match the circuit layout of the circuit board 100 to facilitate the engineer to ground the internal circuit of the circuit board 1 . The shielding body 13 is covered by the shielding cover frame 丨1 〇 to shield the circuit board 100 from the grounding structure 12〇. The cover cover frame 11 can directly attach the cover cover frame 110 to the circuit board 1 by surface mount technology (SMT). Since the shape of the ground structure 120 can be designed in accordance with the layout in the circuit board, it can be designed to match the complicated circuit layout, thereby increasing the convenience of the engineer in designing the circuit layout. The grounding structure 12〇 can be a plastic structure with a conductive paint on the surface, such as acrylonitrile-butadiene-styrene resin (ABS resin). Alternatively, the ground structure 120 may be a metal that can be molded using a die-casting mold, such as an aluminum alloy. Alternatively, the material of the grounding structure 120 may be an electrically conductive plastic such as a plastic doped with metal powder. The grounding structure 120 further includes a plurality of grounding portions 122, and the shielding cover body 13 has a corresponding plurality of grounding openings 132'. When the shielding cover body 130 covers the shielding cover frame 11〇, the grounding junction 1298609 is configured to have a grounding portion. 12 2 will expose you, and you will use the grounding opening 132 of the concealing body 130 to complete the external grounding operation through the grounding portion 122 of the grounding structure 120.
妾也Ρ 122面對包路才反1〇〇之一面具有複數個凸點 而遮蔽蓋框架110具有對應之複數個凹槽112,遮蔽 盍裝置可藉由凹槽112與凸，點124之耦合，以固定接地結 構12〇於遮蔽蓋框架110。其中，遮蔽蓋裝置可更包含一黏 膠’塗佈於凹槽112與凸點124之間，以藉由黏膠進一步 地固定遮蔽蓋框架110之凹# 112與接地結構12〇之凸點 124此遮蔽盍裝置可更包含一黏合劑，接地結構以〇之接 地邛122可利用黏合劑直接黏合於遮蔽蓋框架^ 1 〇。或者， 遮蔽蓋裝置可更包含一熱熔膠，接地結構12〇之接地部122 可利用熱溶膠黏合於遮蔽蓋框架丨1〇。 接地結構120面對遮蔽蓋本體130之一面可具有複數 個定位突起126,遮蔽蓋本體130可具有對應之複數個定位 孔134,當遮蔽蓋本體130覆蓋於遮蔽蓋框架11〇時，定位 突起126可與定位孔134耦合，以定位接地結構uo。遮蔽 蓋裝置可更包含複數個螺絲，螺絲可穿過遮蔽蓋本體13〇 與遮蔽蓋框架11〇上之複數個螺絲孔142,以鎖固遮蔽蓋本 體130於遮蔽蓋框架110。組裝完成之遮蔽蓋裝置係如第 1B圖中所示。 參照第1A圖及第2圖，第2圖係繪示本發明之遮蔽蓋 設計方法一較佳實施例之流程圖。遮蔽蓋設計方法2〇〇中， 包含配置遮蔽蓋框架11〇於電路板1〇〇之步驟210。接著， 步驟230係為配置接地結構120於電路板1〇〇。最後，步驟 10 1298609 240係為覆盍遮蔽蓋本體13〇於遮蔽蓋框架。步驟2⑺ 較佳地係利用表面接合技術，將遮蔽蓋框架11〇固定於電 路板100。接地結構12〇之材料如為塑膠，則方法2〇〇需更 包含喷塗導電漆於接地結構120表面之步驟22〇。接地2構 120之材料如為金屬或為可導電之塑膠，則步驟22〇可被省 略0妾 Ρ 面对 面对 面对 面对 面对 面对 面对 面对 面对 面对 面对 面对 Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ Ρ The fixed ground structure 12 is attached to the shielding cover frame 110. The masking device may further include a glue applied between the groove 112 and the bump 124 to further fix the concave surface 112 of the cover frame 110 and the bump 124 of the ground structure 12 by the adhesive. The shielding device can further comprise an adhesive, and the grounding structure can be directly bonded to the shielding cover frame by using the adhesive. Alternatively, the masking device may further comprise a hot melt adhesive, and the grounding portion 122 of the grounding structure 12 may be bonded to the shielding cover frame by a hot melt. The grounding structure 120 may have a plurality of positioning protrusions 126 facing the shielding cover body 130. The shielding cover body 130 may have a plurality of positioning holes 134. When the shielding cover body 130 covers the shielding cover frame 11 , the positioning protrusions 126 . It can be coupled with the positioning hole 134 to position the grounding structure uo. The cover cover device may further include a plurality of screws, and the screws may pass through the cover cover body 13 and the plurality of screw holes 142 of the cover cover frame 11 to lock the cover cover body 130 to the cover cover frame 110. The assembled cover device is as shown in Figure 1B. Referring to Figures 1A and 2, Figure 2 is a flow chart showing a preferred embodiment of the mask cover design method of the present invention. The cover cover design method 2 includes a step 210 of disposing the cover cover frame 11 on the circuit board 1 . Next, step 230 is to configure the ground structure 120 on the circuit board 1 . Finally, step 10 1298609 240 is to cover the cover body 13 to cover the cover frame. Step 2 (7) is preferably to fix the shield cover frame 11 to the circuit board 100 by surface bonding techniques. If the material of the grounding structure 12 is plastic, the method 2 needs to further include the step 22 of spraying the conductive paint on the surface of the grounding structure 120. If the material of the grounding structure 120 is metal or electrically conductive, step 22 can be omitted.
其中，配置接地結構12〇於電路板1〇〇上之步驟23〇， 可包含利用接地結構120之凸點124，與遮蔽蓋框架ιι〇 之凹槽112輕合，並更可利用黏膠固定凹槽112盥凸點 124。步驟23〇亦可利用黏合劑或熱輯，直接將接地結構 120固定於遮蔽蓋框架11〇上。其中，覆蓋遮蔽蓋本體 於遮蔽蓋框架no之步驟240’包含使遮蔽蓋本體13〇上之 定位孔134,與接地結構12〇定位突起126耦合，並利用螺 絲鎖固遮蔽蓋本體130與遮蔽蓋框架11〇。步驟綱中，更 包含使接地結構12〇之接地部122，露出於遮蔽蓋本體13〇 之接地部開口 132。 由上述本發明較佳實施例可知，應用本發明具有下列 優點。此遮蔽蓋設計方法巾，㈣用接地結構作為接地區， 接地結構可設計任意形狀’以配合電路板之電路佈局。因The step 23 of configuring the grounding structure 12 on the circuit board 1 〇 may include using the bumps 124 of the grounding structure 120 to be lightly coupled with the recess 112 of the shielding cover frame, and more preferably being fixed by adhesive. The groove 112 has a bump 124. In step 23, the grounding structure 120 can also be directly fixed to the shielding cover frame 11 by using an adhesive or a thermal package. The step 240 ′ of covering the cover body of the cover cover frame includes the positioning hole 134 of the cover cover body 13 and the positioning protrusion 126 of the grounding structure 12 , and the cover cover body 130 and the cover cover are locked by screws. Frame 11〇. In the step, the grounding portion 122 of the grounding structure 12 is exposed to the grounding portion opening 132 of the shielding cover body 13A. It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The cover cover design method towel, (4) the ground structure is used as the connection area, and the ground structure can be designed in any shape to match the circuit layout of the circuit board. because
Li 現過去利用沖床技術無法完成之較為曲折複雜的 接地區佈局，增加了工程師設計電路時的便利性。由於此 遮敝蓋裝置係由多個零組件所組合而成，因此，可配合不 同之電路佈局更換對虛 、對應之接地結構，而具有較佳的設計彈 性，並可降低生產成本。 雖然本發明已以—較佳實施例揭露如上，然其並非用 11 1298609 以限定本發明，任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範_，t可作各種之更動盘潤 飾’因此本發明之保護範圍當視後附之申請專利範圍料 疋者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、驻 Ab ^ 、他日的特徵、優點與實施例 月b更明顯易懂，所附圖式之詳細說明如下·· ▲ f 1A圖及第1B圖係分別繪示本發明之遮蔽蓋裝置一 較佳實施例的***圖及組裝完成之示意圖。 第2圖係繪示本發明之遮蔽蓋設計方法—較佳實施例 之流程圖。 、 主要元件符號說明 100 ： 電路板 110 :遮蔽蓋框架 112 ： 凹槽 120 ··接地結構 122 ： 接地部 124 :凸點 126 : 定位突起 130·遮蔽蓋本體 132 ： 接地部開口 134 :定位孔 142 ： 螺絲孔 200 :方法 210 : 步驟 220 :步驟 230 ： 步驟 240 :步驟 12In the past, Li has been able to complete the tortuous and complicated layout of the area with the use of punching technology, which has increased the convenience of engineers in designing circuits. Since the concealer cover device is composed of a plurality of components, the virtual and corresponding ground structure can be replaced with different circuit layouts, and the design flexibility is better, and the production cost can be reduced. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make various changes without departing from the spirit and scope of the invention. The invention is therefore subject to the patentability of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects of the present invention, the features, advantages and embodiments of the present invention more obvious and easy to understand, the detailed description of the drawings is as follows: ▲ f 1A And FIG. 1B is a schematic view showing the exploded view and the assembled assembly of a preferred embodiment of the mask cover device of the present invention. Figure 2 is a flow chart showing a method of designing a mask cover of the present invention - a preferred embodiment. Main component symbol description 100 : Circuit board 110 : shielding cover frame 112 : groove 120 · · grounding structure 122 : grounding portion 124 : bump 126 : positioning protrusion 130 · shielding cover body 132 : grounding opening 134 : positioning hole 142 : Screw Hole 200: Method 210: Step 220: Step 230: Step 240: Step 12