TWI290351B - Wafer cassette used in high temperature baking process - Google Patents

Abstract

A wafer cassette for consolidation in process of high temperature baking is provided. The wafer cassette includes one front end member, two sidewall plates, one back end member, a plurality of fixture slots, two resilient sheets and two supporting rods. By using this wafer cassette in high temperature baking process, the change of having the wafer damage is minimized.

Description

.1290351 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種晶舟，特別是有關於一種高溫烘烤晶舟。 【先前技術】 在半導體製造產業中，從晶圓製成積體電路晶片時通常包括對 晶圓一再處理的幾個步驟，測試、存放及搬運。由於晶圓之易碎 ^ 性質及其貴重價格，必須在製造過程中適當地保護，而晶舟之目 的即為提供這種保護措施。 在高溫烘烤過程中，金屬製成之晶舟可用在高於攝氏三百度之 溫度中。然而在烘烤過程中，晶圓因運輸時，其邊緣與晶舟相碰 撞，而使晶圓的邊緣造成一些損傷或是晶圓破裂。.1290351 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a wafer boat, and more particularly to a high temperature baking wafer boat. [Prior Art] In the semiconductor manufacturing industry, when a fabricated circuit wafer is fabricated from a wafer, it usually includes several steps of processing, storing, and transporting the wafer. Due to the fragile nature of the wafer and its expensive price, it must be properly protected during the manufacturing process, and the purpose of the boat is to provide this protection. In the high temperature baking process, the metal boat can be used in temperatures above three degrees Celsius. However, during the baking process, the wafer collides with the wafer boat during transportation, causing some damage to the edge of the wafer or wafer rupture.

如第一圖顯示根據先前技術實施例之晶舟的透視圖，一晶舟 100用於搬運及存放晶圓，晶舟100包括一前端構件110、二側 壁板120、一後端構件130、複數個固定槽140、二圓柱玻璃棒 150及二支撐桿160，側壁板120分別固定於前端構件110及後 端構件130之間，複數.個固定槽140設置於各個側壁板120上， 二圓柱玻璃棒150分別位於各側壁板之下方，而支撐桿160係固 定於側壁板120及圓柱玻璃棒150之間。As shown in the first figure, a wafer boat 100 is used to carry and store wafers according to a prior art embodiment. The wafer boat 100 includes a front end member 110, two side wall panels 120, a rear end member 130, and a plurality of The fixing groove 140, the two cylindrical glass rods 150 and the two supporting rods 160 are respectively fixed between the front end member 110 and the rear end member 130, and a plurality of fixing grooves 140 are disposed on the respective side wall plates 120, the two cylindrical glasses The rods 150 are respectively located below the side wall panels, and the support rods 160 are fixed between the side wall panels 120 and the cylindrical glass rods 150.

Claims (1)

1290351 ' 十、申請專利範圍： 1 · 一種兩溫供烤晶舟’該南溫供烤晶舟包含· 一前端構件； 二側壁板相對地設置於該前端構件之兩端； 一後端構件位於該二側壁板之間； : 二彎曲之彈片擋板相對地設置於該二側壁板之下方；及 二支撐桿分別固定於該二側壁板及該二彎曲之彈片擋板之 間。 2. 如申請專利範圍第1項所述之高溫烘烤晶舟，其中各個該側壁 板具有複數個縱向溝槽及一橫向支撐桿。 3. 如申請專利範圍第1項所述之高溫烘烤晶舟，其中該彈片擋板 位於該側壁板之下方。 4. 如申請專利範圍第1項所述之高溫烘烤晶舟，其中該側壁板包 含複數個固定槽。 5. 如申請專利範圍第4項所述之高溫烘烤晶舟，其中該固定槽用 於放置晶圓。 6. 如申請專利範圍第1項所述之高溫烘烤晶舟，其中該彈片擋板 係由金屬製成。 1290351 料牛h /b轉後)正太I 7. 如申請專利範圍第6項所述之高溫烘烤晶舟，其中彈片擋板可 承受高於攝氏三百度之溫度。 8. 如申請專利範圍第1項所述之高溫烘烤晶舟，其中該彈片擋板 具有一斜面以增加與晶圓的接觸面積。1290351 ' X. Patent application scope: 1 · A two-temperature supply for baking a boat" The south temperature for baking boat includes a front end member; two side wall plates are oppositely disposed at opposite ends of the front end member; The two side wall plates are disposed opposite to the two side wall plates; and the two support bars are respectively fixed between the two side wall plates and the two curved elastic plate baffles. 2. The high temperature baking wafer boat of claim 1, wherein each of the side wall panels has a plurality of longitudinal grooves and a lateral support rod. 3. The high temperature baking wafer boat of claim 1, wherein the shrapnel baffle is located below the side wall panel. 4. The high temperature baking wafer boat of claim 1, wherein the side wall panel comprises a plurality of fixing grooves. 5. The high temperature baking wafer boat of claim 4, wherein the fixing groove is for placing a wafer. 6. The high temperature baking wafer boat of claim 1, wherein the shrapnel baffle is made of metal. 1290351 After the cattle h / b turn) Zheng Tai I 7. As in the high-temperature baking boat described in the scope of claim 6, the shrapnel baffle can withstand temperatures higher than three hundred degrees Celsius. 8. The high temperature baking wafer boat of claim 1, wherein the shrapnel baffle has a bevel to increase the contact area with the wafer.