TWI290094B - Flexible metal laminate and flexible printed board - Google Patents

Abstract

An object of the present invention is to provide a flexible metal laminate and a flexible printed board to which protrusions such as bumps are pressed under high temperature conditions and which can solve the problems caused due to softening, shrinking, or deformation of a resin layer, in order to achieve the object, the present invention provides a flexible metal laminate comprising a metal layer 10 and a resin layer 11, when the resin layer 11 is divided into 2 layers so as to have same thickness, and the layer contacting a surface 13 (contact surface) of the metal layer 10 is defined as a first sample, and a residual layer is defined as a second sample, an amount (L1) of displacement in the first sample when a pointer presses the first sample from a surface 13 contacting the metal layer 10 is smaller than an amount (L2) of displacement of the second sample when the pointer presses the second sample from a surface 12 (outermost surface) opposite to the metal layer 10.

Description

1290094 九、發明說明： 【發明所屬之技術領域】 本發明係關於可撓性金屬層疊體及可撓性印刷基板。 【先前技術】 目前在行動電話及液晶監視器等逐漸普及下，對於電 子機器乃更加的要求小型化、薄型化以及多功能化。為了 實現此需求，必須使電子零件達到小型化以及高積體化， 因此必須具備電子零件之高密度封裝技術。 • 最近，伴隨著液晶顯示器（LCD)之驅動1C的小型化以 及1C的多輸出化之需求，係採用1C(積體電路）晶片與可撓 性印刷基板的接合之覆晶接合（flip chip connection)，尤其 是COF(Chip On Film :薄膜覆晶封裝）封裝。 至目前為止之COF封裝，係將TCP(Tape Carrier Package :捲帶式封裝）封裝中所採用之ILB(Inner Lead Bonder ··内部引線接合）黏晶機（bonder)加以改造而使用。 $ 此外，對應於驅動1C的小型化以及1C的多輸出化之 更高密度化，必須更進一步縮小1C晶片與可撓性印刷基板 的接合之變動精準度，因此近年來係採用可對應於微細間 距而加以接合之COF黏晶機。 第3圖係顯示依據COF黏晶機之接合方式的一例之說 明圖。 COF黏晶機係概略由用以將1C晶片1及可撓性印刷 基板2加以壓接之加熱具（heating tool)3，以及承載台 (stage)4所構成。 5 318060 1290094 ic晶片1係具備板狀的主體u以及由金等所組成之 凸塊（bump)lb。凸塊lb例如為，使多數個板狀突起物隔著 特定間隔配置於主體la的單面上而構成。 此外，可撓性印刷基板2係具備板狀的絕緣性樹脂層 2a’以及設置於該絕緣性樹脂層㈣單面之金屬製的配線 2b。可撓性印刷基板2係對可撓性金屬層疊體進行加工而 衣者亦即，可撓性金屬層疊體係層疊有絕緣性樹脂層 以及金屬層’並藉由鐘敷處理等對此金屬層進行加工而形 籲^配線2b，藉此可獲得可撓性印刷基板2。 於1C晶片1及可撓性印刷基板2的壓接時，係使設置 有配線2b的面朝上，將可撓性印刷基板2配置於承載台4 上。並使ic晶片1的凸塊lb側與上述配線2b對峙般而配 置。 接下來從1C晶片1的上方將加熱具3按壓，使凸塊 1 b及配線2b於尚溫下熔融而達到共晶化，藉此使Ic晶片 1及可撓性印刷基板2接合。 ^ 之後，於結束如此接合後，於1C晶片1及可撓性印刷 基板2之間之凸塊lb及配線2b的周圍中，將稱為填充材 (under fill)之絕緣樹脂填入。 於曰本特開2004-82719號公報、曰本特開 2004-322636號公報、及日本特開2004-230670號公報中係 提出有，將非熱可塑性聚醯亞胺以及由銅箔所組成之金屬 箔加以層疊’並於這些層之間設置玻璃轉移點較非熱可塑 性聚醯亞胺層還低之熱可塑性聚醯亞胺而組成之層疊體 318060 6 1290094 等做為用以製造出使用於上述用途之可撓性印刷基板2 之可撓性金屬層疊體。 【發明内容】 -(發明所欲解決之課題） • ^而，若採用以往的可撓性金屬層疊體而獲得可撓性 印刷基板2,並將所獲得之可撓性印刷基板2如第3圖所 不之貼合於1C晶片1，則凸塊lb係於高溫條件下，經由 配線2b而強力按壓於可撓性印刷基板樹脂層2&。因此產 馨^可撓性印刷基板2的樹脂層2a之縮小變形之問題。 若樹脂層2a產生縮小變形，則於該上方所設置之配線 2b以及與配線2b接合之凸塊lb的位置產生偏移，或是使 1C晶片1及可撓性印刷基板2之間的間隙變窄，使得接合 後無法於1C晶片1及可撓性印刷基板2之間填入填充材。 此外，若樹脂層2a產生縮小變形，則使凸塊lb與配 線2b呈點接觸而強力按壓時，可能產生以這些接觸點為支 g使配線2b從樹脂層2a剝離之情況。此外，此剝離的配 货2b可能與1C晶片1接觸而導致短路（所謂的邊緣短路 (edge short)) ° 因此，本發明之課題在於提供一種，於高溫條件下進 行將凸塊般的突起物加以按壓的處理之用途中所使用之可 撓性金屬層豐體及使用該可撓性金屬層疊體之可撓性印刷 基板中，可解決因樹脂層的軟化及縮小變形（以下稱為變形） 所伴隨的缺失之可撓性金屬層疊體及使用該可撓性金屬層 豐體之可挽性印刷基板。 318060 7 1290094 (用以解決課題之手段） 為了解決上述課題，本發明# 層疊體，係呈古Am狂 提七、弟一種可橈性金屬 曰且骽^具有金屬層以及樹萄 脂層於厚度的"2處區分為2芦：、特欲為.將上述樹 面側為第1試料，以並；二層A:讀上述金屬層的接觸 層的接觸面穿刺之上述第丨試：的：2试料：，從與金屬 從與金屬層相反側的面穿刺之 =^(L1)，係較 (L2)還小。 、弟2武料的針入位移量 於上述第-種可撓性金屬層疊體中，較理 入位移量（L1)與上述針入位移量 “，、，，，十 2_以上。 #球2)的差之絕對值（dL)為 樹脂 上述樹脂層較理想為由多數層所組成。 =了解決上述課題，本發明乃提供第二種可撓性金屬 ^豐體’係具有金屬層以及形成於該金屬層上之2層以上 1組成之樹脂層，其特徵為：樹 曰 ^日層之取外層的吸濕膨脹 ，數⑹。」，係較樹脂層之與金屬層接觸之層的吸濕膨脹係 數（Chm)還小。 於上述第二種可撓性金屬層疊體中，較理想為樹脂層 的線性熱膨脹係數與金屬層的線性熱膨脹係數的差之絕對 值係未滿l〇xl〇-6/°C。 較理想為吸濕膨脹係數（CHM)與吸濕膨脹係數（c⑽）的 差（Chm_Cho)為 l〇xl〇-6/%RH 以上。 318060 8 1290094 於上述第二種可撓性金屬層疊體中，較理想為最外層 的厚度（Tl)與樹脂層全體的厚度（T0)之比值（τι)/(το)為 35/100 以上 95/100 以下。 • 於上述第一種及第二種可撓性金屬層疊體中，較理想 -為上述樹脂層之300°c時的存儲彈性模數（Ε，）為lGPa以 上’且具有300°C以上之玻璃轉移點（Tg)。 上述樹脂層較理想為包含可溶於有機溶劑之熱可塑性 樹脂。 ⑩上述树知層較理想為包含，從聚醯亞胺（Polyimide)樹 月曰、I醯胺醯亞胺（p〇lyamideimide)樹脂、聚醚醯亞胺 (Polyetherimide)樹脂、及聚石夕氧烧醯亞胺 (Polysiloxaneimide)樹脂所組成的一群當中所選出之至少工 種的樹脂。 上述金屬層較理想為由金屬箱所構成。 上述金屬箔較理想為由從銅箔、不銹鋼箔、鋁箔、及 g箔所組成的一群當中所選出之至少丨種而組成。 為了解決上述課題，本發明乃提供一種可撓性印刷基 板，其特徵為係採用上述可撓性金屬層疊體。 (發明之效果） 於本發明中可提供一種，於高溫條件下進行將凸塊般 的犬起物按壓的處理之用途所使用之可撓性金屬層疊體及 使用該可撓性金屬層疊體之可撓性印刷基板中，可解決因 樹脂層的軟化及縮小變形所伴隨的缺失之可撓性金屬層疊 體及使用該可撓性金屬層疊體之可撓性印刷基板。曰且 318060 9 1290094 【實施方式】 [第一可撓性金屬層疊體] 的構成之一例之剖 第1圖（a)係顯示可撓性金屬層疊體 面圖。 此例之可撓性金屬層疊體係由金屬層1〇以及於 屬層10的單面上所層疊之樹脂層u所構成。 人、’ 關於構成金屬層10之金屬，例如有鋼、不 鋼等。 6、 .其中’較理想為金屬箔。藉由使用金屬箔，可抑 孔的產生。因此可減少配線缺陷。因而可獲得良率的提: 以及電性:靠度的提升之效果。此外，若利用金屬落 即使於連續性的高溫加熱，亦可獲得樹脂層與金屬層門 不易產生剝離之優良效果。 9 於上述金屬落中，較理想為採用從銅箱、不鱗鋼箱、 鋁箔、及鋼箔所組成的一群當中所選出之丨種以上者。 更理想為㈣特性良好且可對應精㈣距化之 癌、可提升高彎折性之壓延銅荡、或是可提升銅箱之h 運送性之以銅箔為載體之極薄的銅箔等。 、主 5〇μιη，更理想為3至 間距化以及金屬荡之單 金屬箔的厚度較理想為3至 35μηι。此外，更理想為可對應微細 獨運送性之8至18μιη。 如第1圖（b)至（d)所不般，本發明之第一可繞性 疊體的特徵為，係將樹脂層u於厚度的1/2處區分a 層’以與上述金屬層1〇的接觸面13側為第"式料， 318060 10 1290094 其餘之部分為第2試料lib時，從與金屬層10的接觸面 13刺入上述第丨試料丨1 a的針入位移量（L1 )，係較從與金 屬層10為相反側的面（在此係為了簡便而稱為「最外面」）12 刺入第2試料nb的針入位移量（L2)還小。 於本發明中，所謂的針入位移量，係採用TMA(熱機 械分析儀（thermomechanical analyzer))，以前端為 lmmxlmm見方之針入探針並於荷重· 3〇〇mN、升溫速度： 20 C/min的測定條件下所測定出之3〇〇〇c時的探針位移量。 鲁關於TMA較理想為採用例如sh Nanotechnology社 (日本）製、商品名稱：EXSTAR6100TMA/SS者。 曰關於探針的種類、荷重、升溫速度、測定溫度等，係 考量到上述第3圖所示之依據c〇F黏晶機之接合方式的條 件來決定。 亦即，針狀探針係相當於凸起狀的凸塊。於如此的條 件下進行針入位移量的測定，藉此可由數值來表示出凸塊 |配線的連接時之樹脂層的狀態。 具體而言，例如以下列步驟來進行測定。 首先準備2個具有^圖⑷所示的構造之可撓 層疊體。 按署對2個可撓性金 一 扎扭合自如第1圖（b)所 不’將金屬層10去除而僅僅剩下樹脂層u。關於金 的去除，可適用化學敍刻處理等。例如於採用由銅^129. The invention relates to a flexible metal laminate and a flexible printed circuit board. [Prior Art] At present, mobile phones and liquid crystal monitors are becoming more and more popular, and electronic devices are required to be smaller, thinner, and more multifunctional. In order to achieve this demand, electronic components must be miniaturized and highly integrated, so high-density packaging technology for electronic components must be available. Recently, with the demand for miniaturization of the liquid crystal display (LCD) drive 1C and the multi-output of 1C, a flip chip connection using a 1C (integrated circuit) wafer and a flexible printed circuit board is used. ), especially COF (Chip On Film) package. The COF package used so far has been modified by using an ILB (Inner Lead Bonder) internal bond bonder used in a TCP (Tape Carrier Package) package. In addition, in order to reduce the miniaturization of the drive 1C and the higher density of the multi-output of the 1C, it is necessary to further reduce the variation accuracy of the bonding between the 1C wafer and the flexible printed circuit board. Therefore, in recent years, it has been adapted to be fine. A COF die bonder that is joined by spacing. Fig. 3 is an explanatory view showing an example of the joining method according to the COF die bonding machine. The COF die bonding machine is roughly constituted by a heating tool 3 for pressing the 1C wafer 1 and the flexible printed circuit board 2, and a stage 4 . The 5 318060 1290094 ic wafer 1 is provided with a plate-shaped main body u and a bump lb composed of gold or the like. The bump 1b is configured, for example, such that a plurality of plate-like projections are disposed on a single surface of the main body 1a with a predetermined interval therebetween. Further, the flexible printed circuit board 2 includes a plate-shaped insulating resin layer 2a' and a metal wiring 2b provided on one surface of the insulating resin layer (four). In the flexible printed circuit board 2, the flexible metal laminate is processed, and the insulating metal layer is laminated on the flexible metal laminate system, and the metal layer is laminated thereon. The flexible printed circuit board 2 can be obtained by processing the wiring 2b. At the time of pressure bonding of the 1C wafer 1 and the flexible printed circuit board 2, the surface on which the wiring 2b is provided faces upward, and the flexible printed circuit board 2 is placed on the stage 4 . The bump lb side of the ic wafer 1 is placed in alignment with the above-described wiring 2b. Next, the heating tool 3 is pressed from above the 1C wafer 1, and the bump 1b and the wiring 2b are melted at a temperature to be eutectic, whereby the Ic wafer 1 and the flexible printed circuit board 2 are joined. Then, after the bonding is completed, an insulating resin called an under fill is filled in the periphery of the bump 1b and the wiring 2b between the 1C wafer 1 and the flexible printed circuit board 2. In JP-A-2004-82719, JP-A-2004-322636, and JP-A-2004-230670, it is proposed to form a non-thermoplastic polyimine and a copper foil. a metal foil is laminated 'and a laminate of 318060 6 1290094 composed of a thermoplastic transfer polyimide having a lower glass transition point than the non-thermoplastic polyimide layer is disposed between the layers for use in manufacturing A flexible metal laminate of the flexible printed circuit board 2 for the above use. [Explanation] - (Problems to be Solved by the Invention) ^ When the flexible printed circuit board 2 is obtained by using a conventional flexible metal laminate, the obtained flexible printed circuit board 2 is as shown in the third When the film is not bonded to the 1C wafer 1, the bump 1b is strongly pressed against the flexible printed circuit board resin layer 2& via the wiring 2b under high temperature conditions. Therefore, the problem of shrinkage deformation of the resin layer 2a of the flexible printed circuit board 2 is produced. When the resin layer 2a is reduced in deformation, the position of the wiring 2b provided above and the bump lb bonded to the wiring 2b is shifted, or the gap between the 1C wafer 1 and the flexible printed substrate 2 is changed. It is narrow so that the filler cannot be filled between the 1C wafer 1 and the flexible printed circuit board 2 after bonding. Further, when the resin layer 2a is reduced in deformation, when the bump 1b is brought into point contact with the wiring 2b and strongly pressed, the wiring 2b may be peeled off from the resin layer 2a by the contact points. Further, the peeled distribution 2b may come into contact with the 1C wafer 1 to cause a short circuit (so-called edge short). Therefore, an object of the present invention is to provide a bump-like projection under high temperature conditions. In the flexible printed circuit board using the flexible metal laminate and the flexible printed circuit board using the flexible metal laminate, the softening and shrinkage deformation of the resin layer (hereinafter referred to as deformation) can be solved. The missing flexible metal laminate and the flexible printed circuit board using the flexible metal layer. 318060 7 1290094 (Means for Solving the Problem) In order to solve the above problems, the present invention is a laminated body which is a kind of ruthenium metal, and has a metal layer and a lipid layer in the thickness. The "2" is divided into 2 reeds: the special purpose is: the above-mentioned tree surface side is the first sample, and the second layer A: the contact surface of the contact layer of the above metal layer is punctured by the above-mentioned first test: : 2 sample: From the surface of the metal opposite to the side opposite to the metal layer, ^^(L1) is smaller than (L2). In the above-described first flexible metal laminate, the amount of penetration of the second material is proportional to the displacement amount (L1) and the above-mentioned needle insertion displacement amount ",,,,,,,,,,,,,,,,, 2) The absolute value of the difference (dL) is that the resin layer is preferably composed of a plurality of layers. In order to solve the above problems, the present invention provides a second flexible metal body having a metal layer and a resin layer of two or more layers formed on the metal layer, characterized in that the moisture absorption expansion of the outer layer of the tree layer is (6), which is a layer of the resin layer in contact with the metal layer. The coefficient of hygroscopic expansion (Chm) is still small. In the above second flexible metal laminate, it is preferable that the absolute value of the difference between the linear thermal expansion coefficient of the resin layer and the linear thermal expansion coefficient of the metal layer is less than x 〇 x 〇 -6 / °C. Preferably, the difference between the coefficient of hygroscopic expansion (CHM) and the coefficient of hygroscopic expansion (c(10)) (Chm_Cho) is l〇xl 〇 -6 /% RH or more. 318060 8 1290094 In the second flexible metal laminate, the ratio (T1) of the outermost layer to the thickness (T0) of the entire resin layer (τ0) is preferably 35/100 or more. /100 or less. In the first and second flexible metal laminates described above, it is preferable that the storage elastic modulus (Ε) at 300 ° C of the resin layer is 1 GPa or more and 300 ° C or higher. Glass transfer point (Tg). The above resin layer desirably contains a thermoplastic resin which is soluble in an organic solvent. The above-mentioned tree layer preferably comprises, from polyimide tree, 〇 amide imideimide resin, polyetherimide resin, and polyoxet A resin of at least a selected type selected from the group consisting of polysiloxane imide resins. The metal layer is preferably formed of a metal case. The above metal foil is preferably composed of at least one selected from the group consisting of copper foil, stainless steel foil, aluminum foil, and g foil. In order to solve the above problems, the present invention provides a flexible printed substrate characterized by using the above-mentioned flexible metal laminate. (Effect of the Invention) In the present invention, a flexible metal laminate for use in a process of pressing a bump-like canine object under high-temperature conditions and a flexible metal laminate using the same can be provided. In the flexible printed circuit board, a flexible metal laminate which is lacking in softening and shrinkage deformation of the resin layer and a flexible printed circuit board using the flexible metal laminate can be solved. 318060 9 1290094 [Embodiment] A section of the configuration of the [first flexible metal laminate] Fig. 1(a) is a view showing a flexible metal laminate. The flexible metal layered system of this example is composed of a metal layer 1A and a resin layer u laminated on one surface of the layer 10. Person, ' Regarding the metal constituting the metal layer 10, for example, steel, stainless steel, or the like. 6. Among them, it is more desirable to be a metal foil. By using a metal foil, the generation of holes can be suppressed. Therefore, wiring defects can be reduced. Therefore, the yield can be improved: and the electrical: the effect of the improvement of the degree of reliability. Further, if the metal is used, even if it is heated at a high temperature in a continuous manner, it is possible to obtain an excellent effect that the resin layer and the metal layer door are less likely to be peeled off. 9 In the above metal falling, it is preferable to use a selected one of a group consisting of a copper box, a stainless steel box, an aluminum foil, and a steel foil. More preferably, it is (4) a copper foil-based, extremely thin copper foil, etc., which has good characteristics and can correspond to fine (four) pitch cancer, can be used to improve the bending property of high bending, or can improve the transportability of the copper box. . The main 5 〇 μιη, more preferably 3 to the pitch and the metal singular metal foil preferably have a thickness of 3 to 35 μm. Further, it is more desirable to correspond to 8 to 18 μm of fine transportability. As shown in FIGS. 1(b) to (d), the first flexible laminate of the present invention is characterized in that the resin layer u is distinguished from the above-mentioned metal layer by a layer 1/2 at a thickness of 1/2. When the side of the contact surface 13 of the 1〇 is the "type material, 318060 10 1290094, when the remaining part is the second sample lib, the amount of the needle insertion into the first sample 丨1 a from the contact surface 13 with the metal layer 10 (L1) is smaller than the needle insertion displacement amount (L2) which penetrates the second sample nb from the surface opposite to the metal layer 10 (herein referred to as "outermost" for convenience). In the present invention, the so-called needle-in displacement amount is TMA (thermomechanical analyzer), and the tip is 1 mm x 1 mm square into the probe and the load is 3 〇〇 mN, and the heating rate is 20 C. The amount of probe displacement at 3 〇〇〇 c measured under the measurement conditions of /min. For the TMA, it is preferable to use, for example, sh Nanotechnology Co., Ltd. (Japan), trade name: EXSTAR6100TMA/SS.曰 The type of the probe, the load, the temperature increase rate, the measurement temperature, and the like are determined in consideration of the conditions of the bonding method of the c〇F die bonder shown in Fig. 3 described above. That is, the needle probe is equivalent to a convex bump. The measurement of the amount of the needle insertion displacement is carried out under such conditions, whereby the state of the resin layer at the time of connection of the bumps and the wirings can be expressed by numerical values. Specifically, for example, the measurement is carried out in the following procedure. First, two flexible laminates having the structure shown in Fig. 4 are prepared. The two flexible cores are twisted together as shown in Fig. 1(b). The metal layer 10 is removed and only the resin layer u remains. Regarding the removal of gold, chemical characterization can be applied. For example, using copper ^

、、且成的金屬層10時，可藉由氯化鐵溶液等去K 接著從一邊的樹脂層11，以下列^ + ' J的方式而獲得第1試 318060 11 1290094 料1 1 a。亦即，採用測微器對此樹脂層1 1 的厚度（T0)，並算出該1/2的膜厚T1。 測量出樹脂層 11 =測微器一邊測量膜厚，一邊以機械研磨等方 * φ 12側將'脂層11加以研磨至成為膜厚T1 马止。 藉此可獲得與金屬層1G的接觸面13側之第i試料 11 a 〇 以下列的方式而獲得第 並且從另一邊的樹脂層丨丨中， 或料11 b。 亦即，與獲得第丨試料lla為相同之步驟，對此樹脂 層y進行研磨，從與金屬層10的接觸面13側開始至成為 膜厚T1為止。藉此可獲得與金屬層1G為相反側的最外面 u側之第2試料lib。 也之後將f 1試料lla^23±5〇c、55±5%相對濕度的環 下放置24小呀以上後，如第i圖（c)所示，從接觸面i 3 ^將探針20加以壓抵，—邊以賊/min進行昇溫至柳 ”、、止一邊測定出針入位移量。並以到達3〇〇ΐ：之時點的針 入位移量為針入位移量（Ll)。 另一方面，亦同樣將第2試料Ub於23±5π、55±5% 相對濕度的環境下放置24小時以上後，如第i圖（(1)所示， 從最外面12侧以探針20按壓，一邊以2〇t：/min進行昇溫 至40(TC為止一邊測定出針入位移量。並以到達3〇〇<t之時 點的針入位移量為針入位移量（L2)。 於本發明中，針入位移量（L1)係設定為較針入位移量 318060 12 1290094 P於树月曰層11中，從接觸面13例以 探針20按壓時之釙入你梦曰 ^ j Λ 計入位私垔，係較從最外面12側將探斜 20按壓時之針入位移量還小。 ^木針 因此’於採用此可撓性金屬層疊體來製造出可撓性印 刷基板時，可於最外面12側保持做為可撓性基板所需之可 說I·生（可撓性）’並於接觸面13側，樹脂層^ _使按壓如 探針般之針狀物時，亦可較最外面12側更不易變形，因 此，即餘β高溫條件下凸塊經由由金屬層10所組成的配線 π強1按Μ於樹脂層u ’亦可抑制樹脂層u的變形等。 果為如上述’可抑制配線或凸塊滲入於樹脂層11， 並抑制因此所導致之填充材無法填人之缺失。此外，亦可 抑制配線接觸於1C晶片之邊緣短路。 分離為接觸面13側及最外面12側並各自對第i試料 ❿及第2試料m進行針入位移量的測定者，是為了正 確的評估接觸面13侧及最外面12側的特性之故。 若是未將樹脂層U分離，而各自從接觸面13側及最 Θ面12侧將探針2G按壓來測定樹脂層131全體的針入位移 置’則對應於第1試料Ua之部分與對應於第2試料爪 之部分會互相影響。因而無法正確的評估接觸面Η側及最 外面12側的特性。 針入位移1(L1)與針人位移量（L2)之值的差之絕對值 (dL)較理想為2_以上。更理想為5μιη以上，尤其理想為 ΙΟμιη以上。#由設定於此範目，可各自使最外面u側的 功能與接觸面13側的功能有效發揮，因此具有不僅可提升 318060 13 1290094 11的變形等之效 可撓性，並可提升高溫條件下之樹脂層 果0 面13側的特性均衡來看， 至6μηι，更理想為〇至 此外’從最外面12側與接觸 •針入位移量（L1)之值較理想為〇 ， 3μιη 〇 從最外M2侧與接觸面13側的特性 位移量⑽之值較理想為2至15卿，更理想為 •引ΪΓ:二撓Γ金屬層疊體的運送時所需的彎折性及 ，引強度’並可具有可撓性之方面來看，樹脂層u (TO)較理想為12至75μηι，更理想為12至从 又 樹J =移量(L1)較針入位移量(L2)還小的版 =曰：广例如可由多數層之不同種類的樹脂材料加以層 -而衣仏。例如第2圖所示，以第U 14及第2層Μ之 多數層來組成樹脂層11。 曰 j理想為’例如使構成接觸面13之層#該層鄰接之層 之二或是兩層，由具有可降低針人位移量的作用之層（二 「就祝明上的簡便’係稱為「位移防止層」）所構成。此外， 位移防止層」為未構成最外面12之層。 辦塞、私防止層係由「玻璃轉移點（Tg)」較高的樹脂材料 ▲構成j或者是由「動態黏彈性測定之存儲彈性模數（£，）」 々树知材料所構成。較理想為以玻璃轉移點（丁幻較高 且存儲彈性模數（E，）較大的樹脂材料所構成。 、、構成位移防止層之樹脂材料的玻璃轉移點，係如 下述之進行動態黏彈性測定，並將該結果與溫度及損失係 318060 14 1290094 ㈣叫之間的關係加以描繪時之峰值的頂點溫度（_ t〇P取大值溫度）。實際上，最大值溫度係由測定裝置所自 動檢測出。 亦p如採用強制振動非共振型黏彈性測定器 _entec社（日本）製、商品名稱：rhe〇vibr〇n)，以測 定條件··加振頻率數：11Hz、靜態張力：3輕、樣本尺寸： 〇.5mm(寬）x30mm(長度）χ厚度2〇(μηι)，於升溫速度為 l〇C/mln之下從常溫常濕環境下開始升溫，而求取溫度及 籲員 失係數之間的關係。 於構成樹脂層的各層之樹脂材料中，例如於混合有質 里平均分子篁為不同之樹脂時，最大值溫度可能存在2個 以上。較理想為該至少！點為3〇〇。〇以上。 構成位移防止層之樹脂材料的玻璃轉移點（Tg)愈高愈 理想，較理想為存在330°C以上的玻璃轉移點（Tg)，更理想 為存在350°C以上的玻璃轉移點（Tg)。 於存在多數個玻璃轉移點（Tg)時，就高溫處理時防止 ^小、交形荨的觀點來看，較理想為所有的玻璃轉移點（丁g) 均在300°C以上。 構成位移防止層之樹脂材料的存儲彈性模數（E，），為 採用強制振動非共振型黏彈性測定器（0rientec社（曰本） 製、商品名稱：RHEOVIBRON)進行動態黏彈性測定之溫 度300°C下的測定值。 具體的測定條件係與玻璃轉移點（Tg)相同，以加振頻 率數：11Hz、靜態張力：3.0gf、樣本尺寸：0e5mm(寬）χ 15 318060 1290094 30mm(長度）x厚度20(μιη)，於升溫速度為1(rc/min之下從 常溫常濕環境下開始升溫，而求取成為300°C時的測定值。 存儲彈性模數（E’）’較理想為iGPa以上，更理想為 • 3GPa以上。上限值並無特別限定，實質上為1〇GPa以下。 - 存儲彈性模數（E，）及玻璃轉移點（Tg)，例如可藉由改變 樹脂的種類（化學構造）及質量平均分子量（Mw)來加以 整。 就將針入位移量（L1)調整於適當的範圍來看，位移防 .層的厚度較理想為2至2()μηι，更理想為5至Μ帅。 就提升耐熱性的觀點來看，較理想為以與構成接觸面 13之層鄰接之層來做為位移防止層。 此時，構成接觸面13之層可由具有下列所示之位移防 止層以外之層的材料為相同特性之樹脂所製造出。此 二可二揮出與此鄰接而設置之位移防止層的效果之觀點來 τ之構成接觸面13之層的厚度較理想為2至1叫 如此若由夕數層來構成樹脂層11，則可容易隹/_ 1性金屬層疊體之特性控制。較理想為例如= ===就樹脂層疊良率等之成本降低來看， 較柔卜之層，較理想為可發揮可棱性之相對 移點(TI為止層广外之層之樹脂材料的玻璃轉 構二: 較理想為3〇〇。。以上的範圍。 夕方止層以外之層之樹脂材料的存儲彈性模數 318060 16 1290094 ()車乂理想為0·1至5GPa，更理想為〇·5至3(3Pa。 就提升耐熱性的觀點來看，樹脂層丨丨全體較理想為滿 j以下彳寸性。亦即，於以樹脂層丨丨全體為測定用樣本時， «接觸面13開始之針入位移量（L〇)較理想為1〇^m以下， 更里％、為8μηι以下，尤其理想為5μιη以下。藉此可有效 的抑制於咼溫時之樹脂層11的縮小變形。 針入位移量（L0)係如針入位移量（L1)的測定方法所說 明，以將金屬層10去除後的樹脂層11為（L0)測定用樣本。 •外，對於此樣本，可與上述第1試料lla相同，從接觸 面13開始將探針20按壓而進行測定。 於以樹脂層11全體為測定用樣本時，3〇〇。(：：時之存儲 彈性模數（E，）較理想為1QPa以上，更理想為3GPa以上。 上限值並無特別限定，實質上為1〇GPa以下。若位於此範 圍，則可有效的抑制於高溫時之樹脂層n的縮小變形。 此時之存儲彈性模數（E，），可採用與（L0)測定用樣本為 g同之樣本，以與上述每個樹脂材料的測定方法相同來進 ^測定。惟於上述每個樹脂材料的測定方法中係規定樣本 的厚度，但是於樹脂層11全體的測定時，則不需變更樹脂 層11的厚度。 由於樹脂層11例如以多數層之不同種類的樹脂材料 加以層豐而組成，因此若以樹脂層丨丨全體做為測定用樣 本，則存在多數個玻璃轉移點（Tg)。此外，於做為樹脂層 11的全體而進行測定時，樹脂層n較理想為存在至少^ 點之300°c以上的玻璃轉移點（Tg)。更理想為存在33〇它以 318060 17 1290094 上的玻璃轉移點（Tg)。最理想 點（Tg)。 為存在3 50 C以上的破螭轉移 於存在夕數個玻璃轉移點（τ 縮小變形箄的翻黜氺善,,桄同，皿處理時防止 均在300t以上。 π的玻璃轉移點(Tg) 此外 相m 可採用與（L_定用樣本為 樣本，以與上述每_脂材料的敎方法相同來進 。惟於上述每個樹脂材料㈣定方法中係規定樣本 構成樹脂層u之樹脂，只要為可獲得可撓性金屬層疊 體的運送時所需的彎折性及拉力強度，並可賦予可挽性 者’則並不特別限制。於本發明中，京尤加工性及可繞=的 觀點來看，較理想為採用熱可塑性樹脂。 此外，就製造時容易進行塗佈加工等操作來看，熱可 |性樹脂較理想為對有機溶劑具有可溶性。在此所謂的「可 各性」’是指於室溫至10(rc的溫度範圍中可溶解於有機溶 劑為1質量％以上。 具體而言，例如有聚醯亞胺樹脂（p〇lyimide resin)、聚 醯胺醯亞胺樹脂、聚醚醯亞胺樹脂、及聚矽氧烷醯亞胺樹 脂、聚醚酮（P〇lyether Ketone)樹脂、聚趟崎酮（p〇lyether Etherketone)樹脂等之耐熱熱可塑性樹脂。 較理想為對有機溶劑具有可溶性且充分完成醯亞胺化 反應等之脫水縮合反應後之聚醯亞胺樹脂、聚醯胺醯亞胺 18 318060 1290094 树月曰來醚亞胺樹脂、及聚矽氧烷醯亞胺樹脂、聚醚酮 樹脂、聚趟醚§§)。 ^更理想為從聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚 醯亞胺樹脂、及聚矽氧烷醯亞胺樹脂所組成的一群當中所 選出之至少1種的熱可塑性樹脂。 構成树脂層11之樹脂可為一種樹脂或是混合2種以上 的樹脂。 树月曰的貝里平均分子量例如可從20000至150000的範 鲁圍當中加以選擇。 在不損及本發明的效果之範圍内，可藉由三次元架橋 型熱硬=性樹脂，將構成樹脂層^之i層以上加以構成。 此4，亦可添加用以促進三次元架橋型熱硬化性樹脂 層的熱硬化之有機過氧化物或是路易斯酸（Lewis Acid)化 合物等之硬化促進劑。 亦可於樹脂層Ub加有用以料難燃性之鱗酸醋 ‘糸列化合物、氮系列酯化合物、鹵化環氧樹脂。 機填=等亦可添加用於控制線性膨脹之有機填充材、無 =機填靖、無機填崎較理想為並非調配於接觸 力於而是調配於最外侧12的層。此外，更理想為添 充σΓ Γ卜側12之最外層（第15)。若調配有有機填 運送性 崎，㈣提升可触㈣基板之製程時的 關於填充材，在這當中較理想為無機填充材，尤其是 318060 19 1290094 =粒徑為Ο.，至5μηι ’更理想為議至加之膠離 一軋化矽（collcndal silica)、％ 化坊 ^ 〜 鈣等。 虱化矽、滑石、氧化鈦、磷酸 • 該調配量例如為，對所、禾★ ^ ^ 為〇1至3質量部。“加的層之樹脂的議質量部 [弟一可挽性金屬層疊體] 接下來採用第2圖來說明太八αα 晶髀的椹$♦ 發明之第二可撓性金屬層 二=:一例。與上述第-可撓性金屬廣4趙相同， U性金屬層叠體亦由金屬層1〇以及於該金屬層1〇 的早面上所層疊之樹脂層11所構成。 於此例中，樹脂層η孫士、& WΤ、成為，由金屬層10上所層疊 :=層10的接觸面13之第1層(與金屬層； =m’及層疊於該上方之構成最外面12之 外層）15所組成之雙層構造。 4取 關於構成金屬層1G之金屬，係與上述第—可撓性全屬 ^體所使用的金屬相同，例如有銅、不錄鋼、銘、鎳、 f上述金屬層疊體’較理想為採用金屬 抑制穿孔的產生。因此可減少配線缺陷。因而 ^ 率的提相及電性可靠度的提升之效果。此外， 右利用金屬箱’則即使於連續性的高溫 脂層與金屬層之間不易產生剝離之優良效果。亦了獲件树 =:於金！箱當中，較理想為採用從銅荡、不銹鋼 '、’治、及鎳箔所組成的組群中所選出之1種以上者。 318060 20 1290094 更子之if形為，蝕刻特性良好而可適應微細間距化 之:解銅泊或可提高屈曲性之乾延銅箱，也可舉將能提言 銅箱之製程間輸送性之銅荡為載體(carrier)之極薄銅箱； 材料。 、 、，屬治的尽度較理想為3至5〇gm，更理想為3至 35μιη。再理想為可適應微細間距化以及金屬f|之單獨運送 性之8至Ι8μηι。 内本毛明之第二可撓性金屬層疊體的特徵為，樹脂層η •最外層（第2層15)之吸濕膨脹係數（Ch〇)，係較樹月9旨層 =與金屬層10鄰接之層(第1層η)的吸濕膨脹係數(c:m) 藉此可抑制樹脂層u的縮小變形，而減少所伴隨之缺 失。 、 關於可獲得如此效果之理由，係可推測如下。 、亦即’以往之可撓性金屬層疊體的樹脂層，就確保做 g該可撓性印刷基板的可撓性（可透性）之考量而言，係使 膶具，某種程度的吸濕性之樹脂。因此於製造出可撓性金 屬層疊體之後形成為可撓性印刷基板，而進行與ic晶片加 以接合等的加工為止之間，樹脂層會吸濕而包含某種程度 的水分。 & 亚且，如上述之進行可撓性印刷基板與1C晶片之間的 接合時，於高溫條件下進行以高壓將凸塊等按壓的處理時 所產生之樹脂層的縮小變形係可考量為，於可撓性金屬層 疊體的樹脂層中，存在於與配線（金屬層）接觸之附近的= 318060 21 1290094 分，於高溫條件下以高壓按壓凸塊時會從樹脂層放出至外 部，並因此使樹脂層之與上述配線（金屬層）鄰接之附近急 遽縮小之故。 因此，如本發明之第二可撓性金屬層疊體，使與金屬 層為相反側之最外層具有不易吸濕之特性，可藉由金屬層 以及此最外層而將鄰接於金屬層之部分加以保護。結果 為，於製造出可撓性金屬層疊體之後將此加工為可撓性印 刷基板，而進行與ic晶片加以連接等的處理為止之間，於 脂層中可減少與配線（金屬層）鄰接之附近中所累積之水 分量。 因此，即使於高溫條件下進行以高壓將凸塊等按壓的 處理’亦可減少該水分量，因此於與配線（金屬層）鄰接之 附近中，可防止水分急遽放出而產生縮小變形之現象。 於樹脂層11中，與金屬層10鄰接之層（第1層14)的 吸濕膨脹係數（CHM)及樹脂層u的最外層（第2層15)之吸 ^膨脹係數（cH0)的差（Chm_Ch〇)，較理想為1〇x1〇_6/%rh ，上，更理想為15x10-6/%rh以上，實質上為25x10-6/% RH以下。藉由設定於此範圍，可於第、層i5中發現到防 止吸濕之特性，並且於第丨層14中可發揮可挽特性。 最外層（第2層15)之吸濕祕係數（Chq)之值，就該效 果而吕較理想為5χ1〇·6·Η至35x1()_6/%rh，更理相為 1〇χ1〇·6/%ΚΗ至25咐6/%四。藉由設定於此範圍^可 有效抑制吸濕，而提升本發明的效果。 與金屬層丨〇鄰接之層（第丨層14)的吸濕膨脹係數 318060 22 1290094 (Chm) ’ _ 想為 15xl(r6/%RH 至 6Gxig、rh 為15X10 /讓至5〇Xl〇_6/灿H。藉由設定於此範圍，更 可維持可撓性印刷基板所需之可撓性（可挽性）。 - 與金屬層10鄰接之層（第1 ® ,Γ , ^ f 日1弟1層14)的吸濕膨脹係數 -(LHM)，係以下列方式來測定。 於金屬層10上形成第认备 層 接著去除金屬層10而 獲侍僅由弟1層14所組成的測宋 战自h則疋用樣本。測定用樣本的大 小為縱70mmx橫70mm。厚产係盥供在 ^ s 1/t AA 予又係共做為可撓性金屬層疊體 Φ守之弟1層14的厚度相同。關於金屬層H)的去除，可適 用士化學飯刻處理等。例如於採用由㈣所組成的金屬層ι〇 挎，可藉由氯化鐵溶液等去除。 接下來於測定用樣太 > 去&人R ρ 用银本之未與金屬層10接觸的表面 ^於_方向（結晶產生配向之方向）中標示出工點，之 後於與㈣的距離為55mm般標示出第2點。此外，於π 方向（與MD方向直交之方6、士 # a ,,A 方向）中，使2點之間的距離成為 ^5mm般標示出2點。 接著於乾燥里中置人五氧化二鱗粉末，於23n 相對濕度環境狀態下將敎用樣本放置之中72小時之 ，’以3次元數位尺寸測定機於_方向上载所標示之 點之間的距離。以此測定值為(md〇)。關於TD方向上所 票不之2點之間的距離’㈣樣以3次元數位尺寸測定機 加以測定。以此測定值為（TD〇)。 —接著於測疋後將測定用樣本放置於23<^、8()%相對濕 度環境下的怪溫怪濕槽中，同樣測定出_方向上所標示、 318060 23 1290094 之2點之間的距離及TD方向上所標示之2點之間的距 離。以MD方向的測定值為（MD80)。以TD方向的測定值 為（TD80)。 -之後藉由下列式子來求取吸濕膨脹係數（CHM)。When the metal layer 10 is formed, the first test 318060 11 1290094 material 1 1 a can be obtained by removing the K from the ferric chloride solution or the like from the resin layer 11 on one side by the following method. That is, the thickness (T0) of the resin layer 1 1 is measured by a micrometer, and the film thickness T1 of 1/2 is calculated. The resin layer 11 was measured. While measuring the film thickness, the micro-layer 11 was polished to the film thickness T1 by mechanical polishing or the like. Thereby, the i-th sample 11 a 与 on the side of the contact surface 13 of the metal layer 1G can be obtained in the following manner and in the resin layer 另一 from the other side, or the material 11 b. In other words, the resin layer y is polished from the contact surface 13 side with the metal layer 10 to the film thickness T1 in the same manner as the step of obtaining the second sample 11a. Thereby, the second sample lib on the outermost side of the side opposite to the metal layer 1G can be obtained. After that, after placing the f 1 sample 11a^23±5〇c and 55±5% relative humidity under the ring for 24 hours or more, as shown in Fig. 19(c), the probe 20 is taken from the contact surface i 3 ^ It is pressed, and the temperature is increased to the willow by the thief/min, and the amount of the needle-in displacement is measured. The amount of the needle-in displacement at the time of reaching 3〇〇ΐ is the amount of the needle-in displacement (L1). On the other hand, the second sample Ub is also placed in an environment of 23 ± 5π, 55 ± 5% relative humidity for 24 hours or more, as shown in Fig. i ((1), the probe is from the outermost 12 side. When the pressure is 20, the temperature is raised to 40 (the TC is measured until the TC is measured. The amount of the needle-in displacement at the time of reaching 3 〇〇 < t is the amount of the needle-in displacement (L2). In the present invention, the needle insertion displacement amount (L1) is set to be smaller than the needle insertion displacement amount 318060 12 1290094 P in the tree sap layer 11, and the nighttime when the probe surface 20 is pressed by the probe 20, it enters your nightmare. ^ j Λ In the private position, the amount of needle insertion is smaller when the probe 20 is pressed from the outermost 12 side. ^The wooden needle thus uses this flexible metal laminate to produce flexibility. print In the case of a plate, the desired outer surface of the flexible substrate can be held as the flexible substrate, and on the side of the contact surface 13, the resin layer can be pressed like a probe. In the case of the material, it is also less deformable than the outermost 12 sides. Therefore, the bumps can be inhibited from the resin layer u' by the wiring π strong by the metal layer 10 under the residual β high temperature condition. The deformation is equal to the above. As described above, it is possible to suppress the infiltration of the wiring or the bumps into the resin layer 11, and to suppress the inability of the filler to be filled, thereby preventing the wiring from being short-circuited to the edge of the 1C wafer. The measurement of the amount of the needle insertion displacement of the i-th sample and the second sample m on the side of the contact surface 13 and the outermost surface 12 is for the purpose of accurately evaluating the characteristics of the contact surface 13 side and the outermost surface 12 side. When the resin layer U is not separated, the probe 2G is pressed from the side of the contact surface 13 and the outermost surface 12, and the needle insertion displacement of the entire resin layer 131 is measured, which corresponds to the portion of the first sample Ua and corresponds to the first 2 The parts of the test claws will affect each other, so the contact surface cannot be correctly evaluated. Characteristics of the side of the stern side and the outermost side of the outer side. The absolute value (dL) of the difference between the value of the needle insertion displacement 1 (L1) and the needle displacement amount (L2) is preferably 2 or more. More preferably, it is preferably 5 μm or more. It is ΙΟμιη or more. # By setting this example, the function of the outermost u side and the function of the contact surface 13 side can be effectively utilized, so that it has the flexibility to improve not only the deformation of 318060 13 1290094 11 but also It can improve the characteristics of the resin layer on the 0 side 13 side of the high temperature condition, to 6μηι, more preferably 〇 to the other 'from the outermost 12 side and the contact ・the amount of the needle insertion (L1) is ideally 〇 3μιη 〇 The value of the characteristic displacement amount (10) from the outermost M2 side and the contact surface 13 side is preferably 2 to 15 qing, more preferably ΪΓ ΪΓ: the bending property required for the transportation of the bismuth metal laminate And, in terms of the strength and the flexibility, the resin layer u (TO) is desirably 12 to 75 μm, more preferably 12 to the distance from the tree J = shift (L1) to the amount of penetration ( L2) Small version = 曰: Wide, for example, can be layered by a different type of resin material of most layers - and 仏For example, as shown in Fig. 2, the resin layer 11 is composed of a plurality of layers of the U 14 and the second layer.曰j is ideally as 'for example, the layer constituting the contact surface 13 or the two layers adjacent to the layer, and the layer having the function of reducing the displacement of the needle (the second is "easy to be simple" It is composed of a "displacement prevention layer". Further, the displacement preventing layer is a layer that does not constitute the outermost layer 12. The sealing and private prevention layers are composed of a resin material ▲ with a higher glass transition point (Tg) ▲ or a storage elastic modulus (£,) measured by dynamic viscoelasticity. It is preferable to form a resin material having a glass transition point (higher Ding illusion and a large storage elastic modulus (E)). The glass transition point of the resin material constituting the displacement preventing layer is dynamically adhered as follows. Elasticity measurement, and the relationship between the result and the temperature and loss system 318060 14 1290094 (four) is plotted as the peak temperature of the peak (_t〇P takes a large temperature). In fact, the maximum temperature is determined by the measuring device. It is automatically detected. For example, a forced vibration non-resonant viscoelasticity measuring device is used. _entec (manufactured by Japan), trade name: rhe〇vibr〇n), measurement conditions··Vibration frequency: 11 Hz, static tension : 3 light, sample size: 〇. 5mm (width) x 30mm (length) χ thickness 2 〇 (μηι), at a heating rate of l 〇 C / mln from the normal temperature and humidity environment to start heating, and to find the temperature and The relationship between the loss of the coefficient of appeal. In the resin material constituting each layer of the resin layer, for example, when a resin having a different average molecular weight is mixed, the maximum temperature may be two or more. Ideal for this at least! The point is 3〇〇. 〇 Above. The glass transition point (Tg) of the resin material constituting the displacement preventing layer is preferably as high as possible, and preferably has a glass transition point (Tg) of 330 ° C or more, and more preferably a glass transition point (Tg) of 350 ° C or more. . When there are a plurality of glass transition points (Tg), it is preferable that all the glass transition points (but g) are at 300 ° C or more from the viewpoint of preventing the small and cross-linking at the time of high-temperature treatment. The storage elastic modulus (E,) of the resin material constituting the displacement preventing layer is a temperature 300 for dynamic viscoelasticity measurement using a forced vibration non-resonant viscoelasticity measuring device (manufactured by Zeroientec Co., Ltd., trade name: RHEOVIBRON) Measured value at °C. The specific measurement conditions are the same as the glass transition point (Tg), the number of vibration frequencies: 11 Hz, static tension: 3.0 gf, sample size: 0e5 mm (width) χ 15 318060 1290094 30 mm (length) x thickness 20 (μιη), When the temperature rise rate is 1 (r/min, the temperature is raised from the normal temperature and normal humidity environment, and the measured value at 300 ° C is obtained. The storage elastic modulus (E')' is preferably iGPa or more, more preferably • 3GPa or more. The upper limit is not particularly limited, and is substantially 1〇GPa or less. - Storage elastic modulus (E) and glass transition point (Tg), for example, by changing the type of resin (chemical structure) and The mass average molecular weight (Mw) is adjusted. The thickness of the displacement prevention layer is preferably 2 to 2 () μηι, more preferably 5 to Μ handsome. From the viewpoint of improving heat resistance, it is preferable to use a layer adjacent to the layer constituting the contact surface 13 as a displacement preventing layer. At this time, the layer constituting the contact surface 13 may be other than the displacement preventing layer shown below. The material of the layer is made of resin of the same characteristics. The thickness of the layer constituting the contact surface 13 of τ is preferably 2 to 1 as the effect of the effect of the displacement preventing layer provided adjacent thereto, so that if the resin layer 11 is formed by the octave layer, It is easy to control the characteristics of the _1 metal laminate. Preferably, for example, ====, in terms of the cost reduction of the resin laminate yield, etc., the layer of the softer layer is preferably a relative shift of the edgeability. Point (the glass transition structure of the resin material of the layer outside the TI layer is more preferably 3 〇〇. The above range. The storage elastic modulus of the resin material of the layer other than the stagnation layer 318060 16 1290094 ()乂 is preferably from 0. 1 to 5 GPa, more preferably from 〇 5 to 3 (3 Pa. From the viewpoint of improving heat resistance, it is preferable that the entire resin layer is not more than j. When the entire layer is a sample for measurement, the amount of needle insertion (L〇) at the beginning of the contact surface 13 is preferably 1 〇 ^ m or less, more preferably 8 μm or less, and particularly preferably 5 μm or less. Effectively suppresses the shrinkage deformation of the resin layer 11 at the time of the temperature. The amount of the needle insertion (L0) is as follows. In the method of measuring the amount of displacement (L1), the resin layer 11 obtained by removing the metal layer 10 is a sample for measurement of (L0). • This sample may be the same as the first sample 11a, and the contact surface may be the same. When the entire resin layer 11 is used as a sample for measurement, the storage elastic modulus (E:) is preferably 1 QPa or more, and more preferably 3 GPa. The upper limit is not particularly limited, and is substantially 1 〇 GPa or less. When it is within this range, the deformation and deformation of the resin layer n at a high temperature can be effectively suppressed. The storage elastic modulus (E,) at this time can be measured in the same manner as the measurement method of each of the above resin materials by using the same sample as the (L0) measurement sample. In the measurement method of each of the above resin materials, the thickness of the sample is specified. However, in the measurement of the entire resin layer 11, the thickness of the resin layer 11 is not required to be changed. Since the resin layer 11 is composed of, for example, a plurality of different types of resin materials, a plurality of resin layers are used as measurement samples, and a plurality of glass transition points (Tg) are present. Further, when the entire resin layer 11 is measured, the resin layer n preferably has a glass transition point (Tg) of at least 300 ° C or more. More preferably, there is a glass transition point (Tg) of 33 〇 on 318060 17 1290094. The most ideal point (Tg). For the existence of 3 50 C or more, the breakage is transferred to the existence of a plurality of glass transition points (the reduction of the deformation of the τ is good, and the same, the prevention of the dish is more than 300t. The glass transition point (Tg) of π) In addition, the phase m can be used as the sample (L_the sample is used in the same manner as the above-mentioned method for the per-lipid material. However, in each of the above-mentioned resin materials (4), the resin constituting the resin layer u is specified. The present invention is not particularly limited as long as it can obtain the bendability and the tensile strength required for the conveyance of the flexible metal laminate, and can be provided in the present invention. In view of the above, it is preferable to use a thermoplastic resin. In addition, it is preferable that the heat-resistant resin is soluble in an organic solvent in terms of handling such as coating processing at the time of production. "" means that it is soluble in the organic solvent at a temperature of from room temperature to 10 (the temperature range of rc is 1% by mass or more. Specifically, for example, a polypimide resin, a polyamidimide) Resin, polyether oxime imide resin, and polyoxyl A heat-resistant thermoplastic resin such as an alkaneimine resin, a polyether ketone resin or a p〇lyether Etherketone resin. It is preferably soluble in an organic solvent and sufficiently quinone imidized. Polyimine resin, polyamidimide, 18 318060 1290094, anthraquinone ether resin, polysiloxane ketone imide resin, polyether ketone resin, polyether ether §§). More preferably, at least one selected from the group consisting of polyimine resin, polyamide amide resin, polyether oxime resin, and polyoxy decylene amide resin The resin constituting the resin layer 11 may be a resin or a mixture of two or more kinds of resins. The average molecular weight of the Beryl may be selected from, for example, Van Rouge of 20,000 to 150,000. Within the scope of the effects of the present invention, the i-layer of the resin layer can be formed by a three-dimensional bridging type thermosetting resin. This can also be added to promote the three-element bridging type thermosetting resin. Layer hardening A curing accelerator such as a peroxide or a Lewis acid compound, or a squash vinegar compound, a nitrogen-based ester compound, or a halogenated epoxy resin which is useful for the flame retardancy of the resin layer Ub. It is also preferable to add a layer of organic filler for controlling linear expansion, a non-machine filling, and an inorganic filling. It is preferably a layer which is not disposed on the contact force but is disposed on the outermost layer 12. Further, it is more preferable Add σΓ to the outermost layer of the side 12 (15th). If there is an organic filling and transporting, (4) to improve the touchable (four) substrate process, the filling material is preferred, especially in the inorganic filler, especially 318060 19 1290094 = The particle size is Ο., to 5μηι ' More ideally, it is to be added to the collcndal silica, the chemical solution, the calcium, and the like. Antimony telluride, talc, titanium oxide, phosphoric acid • The blending amount is, for example, 所1 to 3 mass parts for the 、, 禾, ^ ^ ^. "The quality of the resin of the added layer [different pullable metal laminate] Next, the second figure is used to illustrate the 八$♦ of the octagonal αα crystal 髀. The second flexible metal layer of the invention II =: one case The U-metal laminate is also composed of a metal layer 1〇 and a resin layer 11 laminated on the early surface of the metal layer 1〇, in the same manner as the above-described first flexible metal tube. The resin layer η Sunshi, & WΤ, is laminated on the metal layer 10: the first layer of the contact surface 13 of the layer 10 (with the metal layer; =m' and the outermost layer 12 laminated on the upper side a double-layer structure composed of the outer layer 15 . 4 The metal constituting the metal layer 1G is the same as the metal used for the above-mentioned first flexible body, such as copper, non-recorded steel, inscription, nickel, f. The metal laminate described above preferably uses a metal to suppress the occurrence of perforations. Therefore, it is possible to reduce wiring defects, thereby improving the phase extraction and electrical reliability. Further, the right metal box is used for continuity. The high-temperature grease layer and the metal layer are not easy to produce the excellent effect of peeling. =: In the gold! box, it is preferable to use one or more selected from the group consisting of copper, stainless steel, 'rule, and nickel foil. 318060 20 1290094 The characteristics are good and can be adapted to the fine pitch: the copper-plated copper or the dry-bending copper box which can improve the buckling property, and the ultra-thin copper box which can be said to convey the copper between the process of the copper box as a carrier. The material, , and , the degree of treatment is preferably 3 to 5 〇 gm, more preferably 3 to 35 μm. It is preferably 8 to Ι 8 μηι which can accommodate the fine pitch and the individual transportability of the metal f|. The second flexible metal laminate of Maoming is characterized in that the resin layer η • the outermost layer (the second layer 15) has a coefficient of hygroscopic expansion (Ch〇) which is adjacent to the metal layer 10 The hygroscopic expansion coefficient (c: m) of the layer (the first layer η) can suppress the shrinkage deformation of the resin layer u and reduce the accompanying loss. The reason why such an effect can be obtained is presumed as follows. That is, the resin layer of the conventional flexible metal laminate is ensured to be the flexible printed substrate. In consideration of flexibility (permeability), the cookware is a resin having a certain degree of hygroscopicity. Therefore, after the flexible metal laminate is produced, it is formed into a flexible printed substrate, and Between the processing of the ic wafer and the like, the resin layer absorbs moisture and contains a certain amount of water. & Further, when the flexible printed circuit board and the 1C wafer are bonded as described above, the temperature is high. The shrinkage deformation of the resin layer which is produced when the bump or the like is pressed under high pressure is considered to be in the vicinity of the contact with the wiring (metal layer) in the resin layer of the flexible metal laminate. 318060 21 1290094 In the case where the bump is pressed at a high pressure under high temperature conditions, it is released from the resin layer to the outside, and thus the vicinity of the resin layer adjacent to the wiring (metal layer) is rapidly reduced. Therefore, according to the second flexible metal laminate of the present invention, the outermost layer on the opposite side to the metal layer has a property of being less hygroscopic, and the portion adjacent to the metal layer can be made by the metal layer and the outermost layer. protection. As a result, after the flexible metal laminate is manufactured and processed into a flexible printed circuit board, the process of connecting to the ic wafer or the like is performed, and the adhesion to the wiring (metal layer) can be reduced in the fat layer. The amount of water accumulated in the vicinity. Therefore, even if the treatment is performed by pressing the bumps or the like at a high pressure under high temperature conditions, the moisture content can be reduced. Therefore, in the vicinity of the wiring (metal layer), it is possible to prevent the water from being released and causing the deformation to be reduced. In the resin layer 11, the difference between the coefficient of hygroscopic expansion (CHM) of the layer adjacent to the metal layer 10 (the first layer 14) and the coefficient of absorption (cH0) of the outermost layer (the second layer 15) of the resin layer u (Chm_Ch〇) is preferably 1〇x1〇_6/%rh, and more preferably 15x10-6/%rh or more, and substantially 25x10-6/% RH or less. By setting it in this range, the characteristics of preventing moisture absorption can be found in the first layer i5, and the pull-up property can be exhibited in the second layer 14. The value of the moisture absorption coefficient (Chq) of the outermost layer (the second layer 15) is preferably 5χ1〇·6·Η to 35x1()_6/%rh, and the more reasonable phase is 1〇χ1〇. · 6/%ΚΗ to 25咐6/% four. By setting it in this range, moisture absorption can be effectively suppressed, and the effect of the present invention can be enhanced. The coefficient of hygroscopic expansion of the layer adjacent to the metal layer (the second layer 14) is 318060 22 1290094 (Chm) ' _ I want to be 15xl (r6/%RH to 6Gxig, rh is 15X10 / let to 5〇Xl〇_6 / Can H. By setting this range, the flexibility (lackability) required for the flexible printed circuit board can be maintained. - The layer adjacent to the metal layer 10 (1st, Γ, ^ f day 1 The coefficient of hygroscopic expansion - (LHM) of the first layer 14) is determined in the following manner. The formation of the first layer on the metal layer 10 followed by the removal of the metal layer 10 is performed only by the layer 1 of the brother. Song Zhan used samples from h. The size of the sample for measurement was 70 mm in length and 70 mm in width. The thick product was supplied in ^ s 1/t AA and was also used as a flexible metal laminate. The thickness is the same. Regarding the removal of the metal layer H), it is applicable to the chemical chemistry treatment. For example, the metal layer ι〇 composed of (4) may be removed by a ferric chloride solution or the like. Next, in the measurement use too > Go to & person R ρ with the surface of the silver that is not in contact with the metal layer 10 in the _ direction (the direction in which the crystal is aligned), and then the distance from (4) Point 2 is marked as 55mm. Further, in the π direction (the direction orthogonal to the MD direction, the direction #6, the direction of the A), the distance between the two points is marked as 2 points as ^5 mm. Then, the pentoxide powder is placed in the dry state, and the sample is placed in the sample under the condition of 23n relative humidity for 72 hours, 'between the points indicated by the 3-dimensional number measuring machine in the _ direction. distance. The measured value is (md〇). The distance between the two points of the ticket in the TD direction is measured by a three-dimensional digital size measuring machine. The measured value is (TD〇). - Then, after the test, the sample for measurement is placed in a strange temperature and humidity tank under 23 <^, 8 ()% relative humidity environment, and the difference between the two points indicated in the _ direction, 318060 23 1290094 is also determined. The distance between the distance and the 2 points indicated in the TD direction. The measured value in the MD direction was (MD80). The measured value in the TD direction is (TD80). - The hygroscopic expansion coefficient (CHM) is then determined by the following formula.

Chm =[(TD80)-(TD0)]/(TD0)-80(x10-6/%RH) 測定條件係假定於濕度極高之嚴苛條件下加以保管而 決定者。 樹脂層11的最外層（第2層15)之吸濕膨脹係數⑴的) 馨择以下列方式測定而求得。 於金屬層10上直接層疊形成第2層15，並與第1層 14的情況相同而去除金屬層1 〇，而獲得測定用樣本。測定 用樣本的大小為縱70mmx橫70mm。厚度係與做為可挽性 金屬層疊體時之第2層15的厚度相同。 以下係與第1層14的情況相同而測定出吸濕膨脹係數 (Cho)。 此外，若考量到可撓性金屬層疊體的運送時所需的彎 ，性及拉引強度、以及可撓性，則樹脂層u的厚度較理想 為12至75μιη，更理想為12至50μιη。 此外，最外層（第2層15)的厚度（Τ1)與樹脂層u全體 的厚度（T0)之比值（TIWTO)為35/100以上95/100以下，較 理想為5/100以上75/100以下。藉由設定最外層（第2層 15)的厚度於此範圍内，可提升最外層（第2層15)所帶來白\ 效果。此外，可藉由與金屬層10鄰接之層（第丨層14)，而 容易的確保適度的可撓性。 318060 24 1290094 尤χ最外層（第2層丨5)而有效的防止吸濕，最外層 € 15)的厚度（τι)的厚度較理想為4至7〇μιη，更理想 至 5〇μηχ。 樹脂層11並不限定於雙層構造，較理想為例如以2 至5層所構成，就層疊構造的良率等之成本面來看 想為2至3層。 於以3層以上所組成時，只需使與金屬層ι〇鄰接之層 j構成，觸面13之層）的吸濕膨脹係數(Chm)及構成該相反 響=取外面12之最外層的吸㈣脹係數（(^}之_，$ 足本發明的條件即可。 曰於3層構造以上時，與金屬層1〇鄰接之層（第丨層14) ，最外層（第2層15)之間所包夾的層之特性並無特別限 例如可具有與確保可撓性之第1層14相同之特性，或 疋”抑制吸濕之第2層1 5相同之特性。惟就提升本發明的 效果的觀點以及提升尺寸精準度的觀點來看，較理想為設 f吸濕膨脹係數較第1層14還小之層。 此外於本發明中，以樹脂層丨丨全體為測定用樣本時 之線性熱膨脹係數與金屬層1〇的線性熱膨脹係數的差之 絶對值係未滿l〇xl〇_6/°C。較理想為5χ1〇-6/^以下。 、如此，若树知層11與金屬層10的線性熱膨脹係數的 差較小，則可抑制於高溫條件下因樹脂層u產生較大變 形，使得與金屬層10的相對位置關係產生偏移等之缺失。 結果為可提升本發明的效果。 樹脂層11全體之線性熱膨脹係數係以下列方式來測 318060 25 1290094 〇 八百先準備將金屬層10與樹脂層u加以層疊之可撓性 金屬層疊體。之後與吸濕膨脹係數的測定相同，將金屬層 去除而僅剩樹脂層i丨，並以此為測定用樣本。測定用樣 -本的大小為縱7〇mmx橫70rnm。 、、之後依循JIS K7197中的平均線性膨脹係數算出方 去，對此測定用樣本進行測定。 /、體而a，係採用熱機械分析儀（TMA)(真空理工社 •本）衣商σ口名稱· TMA7)進行tma拉引測定，以 至25(TC之平均線性膨脹率為線性熱膨服係數。 測定條件如下所示。 。7狀5mm見xl5mm長、荷重·· 9.8mN、升溫速 又.1:0 ^ηπη、測定環境條件：常溫常濕環境下開始升溫。 —α &件為考里到與IC晶片進行接合時的條件而決 疋者。 ，屬層10的線性熱膨脹係數係與上 ，測定方法相同來i隹私、日r A 赶 金屬層Η)的全屬/疋。測定用樣本例如可採用構成 7Α 屬治。測定用樣本的大小為縱7〇mmx橫 70mm。 t、 从人^且於&用金屬箱以外的測定用樣本時，可將可幹 之驗性溶液中使樹量㈣度的氫氧化納水溶液等 將樹脂層π解，#此從可撓性金屬層疊體 、 1示而形成為測定用樣本。 為了將最外層（第？ s I弟2層15)之吸濕膨脹係數（Ch〇)調整為 318060 26 1290094 較與金屬層10鄰接之异f黛 ^ 丧 <層（弟1層14)的吸濕膨脹係數（cHM) 之值最外層（第2層15)例如可由「玻璃轉移點（丁幻」 車又二的樹月曰材料所構成。或者是由「動態黏彈性測定之存 .儲彈|±杈數(E’)」較大的樹脂材料所構成。較理想為以玻 璃轉移點（Tg)較南且存儲彈性模數(E，)較大的樹脂材料所 構成。 構成最外層（第2層15)之樹脂材料的玻璃轉移點 (Tg)係如下述之進行動態黏彈性測定，並將該結果與溫 ’及損失係數（tan5)之㈤的關係加以描繪時之峰值的頂點 咖度（波頂溫度peakt〇p temperature)。實際上，波頂溫度係 由測定裝置所自動檢測出。 亦即’係採用強制振動非共振型黏彈性測定器 (〇nenteC社（日本）製、商品名稱·· RHEOVIBRON)，以測 疋條件·加振頻率數：11Hz、靜態張力：3〇gf、樣本尺寸： 0.5mm(寬）x30mm(長度）χ厚度2〇(师），於升溫速度為 C /min之下從常溫常濕環境下開始升溫，而求取溫度及 ,失係數之間的關係。 於構成樹脂層的各層之樹脂材料中，例如於混合有質 量平均分子量為不同之樹脂時，波頂溫度可能有2個以 上。較理想為該至少1點為300°C以上。 構成最外層（第2層15)之樹脂材料的玻璃轉移點（Tg) 愈高愈理想，較理想為存在33〇它以上的玻璃轉移點（Tg)， 更理想為存在350°C以上的玻璃轉移點（Tg)。 此外’於存在多數個玻璃轉移點（Tg)時，就高溫處理 27 318060 1290094 時防止縮小變形等的觀點來看，較理想為所有的玻璃轉移 點（Tg)均於300°C以上。 構成最外層（第2層15)之樹脂材料的存儲彈性模數 (E )，為採用強制振動非共振型黏彈性測定器社 (曰本）製、商品名稱：RHEOVIBRON)進行動態黏彈性測定 之溫度300°C下的測定值。 具體的測定條件係與玻璃轉移點（Tg)相同，以加振頻 率數：11Hz、靜態張力：3.0gf、樣本尺寸：〇5mm(寬）^ • 〇mm(長度）χ厚度2〇(μπι)，於升溫速度為1〇<t/min之下從 常溫常濕環境下開始升溫，而求取成為3〇〇t：時的測定值。 存儲彈性模數（E，），較理想為1GPa以上，更理想為 3GPa以上。上限值並無特別限定，實質上為i〇Gpa以^’。 存儲彈性模數(E，)及玻璃轉移點（Tg)，可例如藉由改變 樹脂的種類（化學料）或質量平均分子量（Mw)來加以調 另一方面 —-關於與金屬層10接觸之第U 14,例如 =弟1層14之樹脂材料的玻璃轉移點(Tg)為高於某種程 度為宜，較理想為3〇〇cC以上的範圍。 ㈣再*且構成第1層14之樹脂材料的存儲彈性模數 (E)，較理想為0.1至職，更理想為0.5至3他。 此外，就提升耐熱性的觀點來看， 想為滿Μ下特性。 ♦ 11全體較理 =樹脂層U全體為敎㈣本時，實C時 松數（Ε，）較理想為1Gpa以上，更理想為腦以上。1 318060 28 !29〇〇94 則值卫媒4^別限疋’貫質上為1GGPa以下。若位於此範圍， 有效的抑制於高溫時之樹脂層11的縮小變形。 之存儲彈性難（E，），可採用從可撓性金屬層疊 將金屬層1G去除後的敎用樣本，以與上述每個樹 料的料的敎方法相同來進行測定。惟於上述每個樹脂材 枓的敎方法t係規定樣本的厚度，但是於樹脂層u全體 的測定時，則不需變更樹脂層11的厚度。 由於樹脂層U例如以多數層之不同種類的樹脂材料 T以層豐而組成’因此若以樹脂層u全體做為測定用樣 ，則存在多數個玻璃轉移點（Tg)。並且，於做為樹脂層 1的全體而進行測定時，樹脂層11較理想為存在至少i 點之300t以上的玻璃轉移點（Tg)。更理想為存在33〇它以 上的玻璃轉移點（Tg)。最理想為存在35(rc以上的 點（Tg)。 ,传秒 於存在多數個玻璃轉移點（Tg)時，就防止高温處Chm = [(TD80) - (TD0)] / (TD0) - 80 (x10-6 / %RH) The measurement conditions are determined on the assumption that they are stored under severe conditions with extremely high humidity. The coefficient of hygroscopic expansion (1) of the outermost layer (second layer 15) of the resin layer 11 was determined in the following manner. The second layer 15 was directly laminated on the metal layer 10, and the metal layer 1 was removed in the same manner as in the case of the first layer 14, to obtain a sample for measurement. The size of the sample used for the measurement was 70 mm in length and 70 mm in width. The thickness is the same as the thickness of the second layer 15 when it is made of a metal laminate. The hygroscopic expansion coefficient (Cho) was measured in the same manner as in the case of the first layer 14. Further, the thickness of the resin layer u is preferably from 12 to 75 μm, more preferably from 12 to 50 μm, in consideration of the bendability, the tensile strength, and the flexibility required for the conveyance of the flexible metal laminate. Further, the ratio (TIWTO) of the thickness (Τ1) of the outermost layer (second layer 15) to the thickness (T0) of the entire resin layer u is 35/100 or more and 95/100 or less, and more preferably 5/100 or more and 75/100. the following. By setting the thickness of the outermost layer (the second layer 15) within this range, the white effect of the outermost layer (the second layer 15) can be improved. Further, it is possible to easily ensure moderate flexibility by the layer (the second layer 14) adjacent to the metal layer 10. 318060 24 1290094 The outermost layer of the outer layer (the second layer 丨5) is effective to prevent moisture absorption. The thickness of the outermost layer (15 μ) is preferably 4 to 7 μmηη, more preferably 5〇μηχ. The resin layer 11 is not limited to the two-layer structure, and is preferably composed of, for example, two to five layers, and is two to three layers in terms of the cost of the laminate structure and the like. When it is composed of three or more layers, it is only necessary to make the layer j adjacent to the metal layer ι, the layer of the contact surface 13 has a coefficient of hygroscopic expansion (Chm) and constitute the opposite ring = the outermost layer of the outer layer 12 Suction (four) expansion coefficient ((^}_, $ is sufficient for the conditions of the present invention. When the structure is more than three layers, the layer adjacent to the metal layer 1〇 (the second layer 14), the outermost layer (the second layer 15 The characteristics of the layer sandwiched between the layers are not particularly limited, for example, may have the same characteristics as the first layer 14 for ensuring flexibility, or may have the same characteristics as the second layer 15 which suppresses moisture absorption. From the viewpoint of the effect of the present invention and the viewpoint of improving the dimensional accuracy, it is preferable to provide a layer having a smaller hygroscopic expansion coefficient than the first layer 14. Further, in the present invention, the entire resin layer is used for measurement. The absolute value of the difference between the linear thermal expansion coefficient of the sample and the linear thermal expansion coefficient of the metal layer 1〇 is less than l〇xl〇_6/°C. It is preferably 5χ1〇-6/^ or less. When the difference between the linear thermal expansion coefficients of the layer 11 and the metal layer 10 is small, it is possible to suppress large deformation due to the resin layer u under high temperature conditions. The relative positional relationship with the metal layer 10 is deviated by the offset or the like. As a result, the effect of the present invention can be improved. The linear thermal expansion coefficient of the entire resin layer 11 is measured in the following manner: 318060 25 1290094 〇 800 first prepared metal layer The flexible metal laminate which is laminated with the resin layer u. After the same as the measurement of the coefficient of hygroscopic expansion, the metal layer is removed and only the resin layer i is left, and this is used as a sample for measurement. The size is 7 〇mm x 70 70 rpm, and then calculated according to the average linear expansion coefficient in JIS K7197, and the measurement sample is measured. /, body a, using a thermomechanical analyzer (TMA) ( Vacuum Technology Co., Ltd. • This clothing company σ mouth name · TMA7) TMA pull measurement, up to 25 (TC average linear expansion rate is linear thermal expansion coefficient. The measurement conditions are as follows. 7-shaped 5mm see xl5mm long, Load ·· 9.8mN, heating rate and again. 1:0 ^ηπη, measurement of environmental conditions: temperature rises in normal temperature and normal humidity environment. -α & parts are the conditions for the connection to the IC wafer. , the line of layer 10 The coefficient of thermal expansion is the same as that of the above method, and the measurement method is the same as that of the sample. The sample for measurement can be used, for example, to form a 7Α genus. The size of the sample for measurement is 7 〇mm× horizontal. 70mm. t. When the sample for measurement other than the metal box is used in the &&>, the resin layer can be π-resolved by the amount of the (four) degree sodium hydroxide solution in the dry test solution. The flexible metal laminate and the sample for measurement are formed as shown in Fig. 1. In order to adjust the coefficient of hygroscopic expansion (Ch〇) of the outermost layer (the second layer of the second layer) to 318060 26 1290094, it is adjacent to the metal layer 10. The value of the coefficient of hygroscopic expansion coefficient (cHM) of the layer (the second layer 15) can be, for example, the "glass transition point (Ding illusion) car and the second tree 曰Made up of materials. Or it is composed of a resin material having a large dynamic storage viscoelasticity and a large number of storage cartridges (±' (E'). It is preferably composed of a resin material having a larger transition point (Tg) of the glass and a larger storage modulus (E,). The glass transition point (Tg) of the resin material constituting the outermost layer (the second layer 15) is measured by dynamic viscoelasticity as follows, and the relationship between the result and the temperature (and the coefficient of loss (tan5) (f) is plotted. Peak vertex (peakt〇p temperature). In fact, the wave top temperature is automatically detected by the measuring device. That is, the system uses a forced vibration non-resonant viscoelasticity measuring device (manufactured by 〇nenteC (Japan), trade name · RHEOVIBRON), measuring conditions, vibration frequency: 11 Hz, static tension: 3 〇 gf, sample Dimensions: 0.5mm (width) x 30mm (length) χ thickness 2〇 (teacher), the temperature rises from the normal temperature and normal humidity environment under the heating rate of C / min, and the relationship between temperature and loss coefficient is obtained. In the resin material constituting each layer of the resin layer, for example, when a resin having a different mass average molecular weight is mixed, the wave top temperature may be two or more. Preferably, the at least one point is 300 ° C or higher. The glass transition point (Tg) of the resin material constituting the outermost layer (the second layer 15) is preferably as high as possible, and preferably has a glass transition point (Tg) of 33 Å or more, more preferably glass having a temperature of 350 ° C or more. Transfer point (Tg). Further, when there are a plurality of glass transition points (Tg), it is preferable that all the glass transition points (Tg) are at least 300 ° C from the viewpoint of preventing shrinkage deformation at the time of high temperature treatment 27 318060 1290094. The storage elastic modulus (E) of the resin material constituting the outermost layer (the second layer 15) is measured by dynamic viscoelasticity using a forced vibration non-resonant viscoelasticity measuring apparatus (product name: RHEOVIBRON). The measured value at a temperature of 300 °C. The specific measurement conditions are the same as the glass transition point (Tg), the number of vibration frequencies: 11 Hz, static tension: 3.0 gf, sample size: 〇 5 mm (width) ^ • 〇 mm (length) χ thickness 2 〇 (μπι) When the temperature rise rate was 1 〇 < t/min, the temperature was raised from the normal temperature and normal humidity environment, and the measured value at 3 〇〇 t: was obtained. The storage elastic modulus (E,) is preferably 1 GPa or more, more preferably 3 GPa or more. The upper limit is not particularly limited, and is substantially i 〇 Gpa to ^'. The storage elastic modulus (E,) and the glass transition point (Tg) can be adjusted, for example, by changing the kind (chemical) or mass average molecular weight (Mw) of the resin - on contact with the metal layer 10 In the U14, for example, the glass transition point (Tg) of the resin material of the first layer 14 is preferably higher than a certain level, and more preferably 3 〇〇 cC or more. (4) The storage elastic modulus (E) of the resin material constituting the first layer 14 is more preferably 0.1 to the position, more preferably 0.5 to 3. In addition, from the viewpoint of improving heat resistance, it is desirable to be full. ♦ 11 All reasonable = The whole resin layer U is 敎 (4). At this time, the loose number (Ε,) is ideally 1 Gpa or more, more preferably more than the brain. 1 318060 28 !29〇〇94 The value of the media 4^ is limited to 疋's quality is below 1GGPa. If it is in this range, it is effective to suppress the shrinkage deformation of the resin layer 11 at a high temperature. The storage elasticity (E,) can be measured by using the sample for removing the metal layer 1G from the flexible metal layer and using the same method as the material of each of the above-mentioned materials. However, the enthalpy method t of each of the above-mentioned resin materials 规定 defines the thickness of the sample, but the thickness of the resin layer 11 does not need to be changed during the measurement of the entire resin layer u. Since the resin layer U is composed of a plurality of layers of the resin material T in a plurality of layers, for example, when the entire resin layer u is used for measurement, there are a plurality of glass transition points (Tg). Further, when the entire resin layer 1 is measured, the resin layer 11 preferably has a glass transition point (Tg) of at least 300 points or more. More preferably, there is a glass transition point (Tg) above 33 Å. It is most desirable to have a point (Tg) above 35 (rc). When passing through a plurality of glass transition points (Tg), the high temperature is prevented.

6縮小變形等的觀點來看，較理想為所有的玻璃#移 ，於 300°C 以上。 ·、、、V 玻璃轉移點（Tg)可使用從可撓性金屬層疊體中將金屬 層10去除後的測定用樣本，以與上述每個樹脂材料的測定 方法相同地進行測定。惟於上述每個樹脂材料的測定方= 中係規定樣本的厚度，但是於樹脂層丨丨全體的測定時， 不需變更樹脂層11的厚度。 T 、 構成樹脂層11之樹脂，只要為可獲得可撓性金屬層最 體的運送時所需的彎折性及拉力強度，並可賦予可: 318060 29 1290094 者，=不特別限制。於本發明中， 硯點來看’較理想為採用熱可塑性樹脂。 ⑼的 再^就製造時容易進行塗佈加工等操作來看，熱可 土 n树n理想為對有機溶劑具有可溶性。在此所謂的、二 =」，是指於室溫至100t的溫度範圍中 劑為1質量％以上。 成合 /、體而„例如有聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、 聚賴亞胺樹月旨、及聚石夕氧烧醯亞胺樹脂、聚賴樹脂、 春聚醚醚酮樹脂等之耐熱熱可塑性樹脂。 較理想為對有機溶劑具有可溶性且充分完成醯亞胺化 ，應等之脫水縮合反應後之聚酿亞胺樹脂、聚ϋ胺醯亞胺 樹月θ、承醚亞胺樹脂、及聚石夕氧烧醯亞胺樹脂、聚醚鲷 樹脂、聚鍵趟I同。 更理想為彳之聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚 I亞胺树知、及聚矽氧烷醯亞胺樹脂所組成的一群當中所 ^出之至少1種的熱可塑性樹脂。 構成樹脂層11之樹脂可為一種樹脂或是混合2種以上 的樹脂。 树脂的質量平均分子量例如可從20000至150000的範 圍當中加以選擇。 在不損及本發明的效果之範圍内，可藉由三次元架橋 型熱硬化性樹脂，將構成樹脂層u之i層以上加以構成。 此時’亦可添加用以促進三次元架橋型熱硬化性樹脂 層的熱硬化之有機過氧化物或是路易斯酸（Lewis Acid)化 30 318060 1290094 合物等之硬化促進劑。 系 亦可於樹脂層11中添加有 列化合物、氮系列酯化合物、 亦可添加用於進行線性膨脹控制之有 填充材等。 用以賦予難燃性之麟酸酯 鹵化環氧樹脂。 機填充材、無機 惟有機填充材、無機填充材較理想為並非調配於接觸 面13側，而是調配於最夕卜側12㈣。此夕卜，更理想為添 加於構成最外侧12之最外層（第2層15)。若調配有有機填 秦充材、錢填充材，則可提升可撓性印職板之製程時的 運送性。 關於填充材，較理想為無機填充材，尤其是平均粒徑 為0.005至5μιη，更理想為0.005至2μηι之膠態二氧化矽、 氮化矽、滑石、氧化鈦、鱗酸鈣等為特佳。 戎調配量例如為，對所添加的層之樹脂的丨〇〇質量部 為0.1至3質量部。 [第一及第二可撓性金屬層疊體的製造方法] 關於第一及第二可撓性金屬層疊體的製造方法，例如 有以下的方法。 藉由堯鑄（Casting)、浸潰、喷霧等方法將溶解於有機 溶劑後的樹脂溶液，塗佈於銅箔等之金屬層上，使有機溶 劑乾燥而形成第1層。為了使厚度達到一致，較理想為藉 由澆鑄來進行塗佈。 關於有機浴劑’只要為可使樹脂溶解之有機溶劑即 可，溶劑的種類可僅使用1種，或是適當的使用2種以上 31 318060 1290094 的混合溶劑。 可列舉極性溶劑例如有N-曱基咯烷§同、n_乙烯美 -2-咯烷酮等咯烷酮系列溶劑，队斗二甲基乙醯胺、n = 二乙基乙醯胺等乙醯胺系列溶劑，N，N-二 ’ 一 7丞T媪胺、 N，N-二乙基曱醯胺等曱醯胺系列溶劑，二甲亞碾、一 石風等亞石風系列溶劑。此外，除了這些相對高滞點溶劑之=卜亞 亦可在不影響塗料樹脂的溶解性之下，採用丙酮:丁酮、 環戊酮、環己酮等酮系列溶劑，甲苯、二甲笨系列之芳香 孀^系列溶劑，四氫呋喃、二噚烷、二乙二醇二甲醚、=二 二醇二甲驗等醚系列溶劑等來做為混合溶劑。 、之後重複上述塗佈及乾燥的操作，而形成由多數層所 組成之樹脂層11。此外，亦可於多數層之間不會產生混合 之矛王度來進行連續塗佈。 、、關於塗佈機，只要為可因應期望的樹脂層厚度來進行 塗佈者，則热任何限制。例如可因應期望的樹脂層厚度， g獨採用堤堰塗佈機（dam type c〇ater)、擠壓式塗佈機、反 ’ ^塗佈機（rev⑽_ei〇、裂縫式塗佈機㈣㈣㈣、轉 P”_、、像式塗佈機、塗液槽式（c〇merc〇ater)式塗佈機等，或 疋將上述各種塗佈機加以組合可進行連續塗佈等之塗佈 機0 此外，於塗佈中可採用2個以上的塗佈頭。 較理想的方法為，於將樹脂溶液塗佈於金屬層 10之 後j重複進行初期乾燥至該層表面不具有黏性的狀態為止 之紅作，而形成由多數層所組成之樹脂層n之後，使可以 32 318060 1290094 =制樹脂的耐熱性及可撓性金屬層疊體的翹曲性般，於減 壓或是無氧環境下可將有機溶劑完全去除之溫度下，將有 機》谷劑去除之方法。 [可撓性印刷基板] 本發明之可撓性印刷基板為採用本發明之第一或第二 可撓性金屬層疊體，例如於第丨圖所示之構成中，可藉由 =敷處理等對此金屬層10進行加工而形成配線，藉此可獲 得可撓性印刷基板。 • 如上所述，於本發明中可提供一種，於高溫條件下進 行將凸塊狀的突起物按壓的處理之用途所使用之可撓性金 屬層豐體及使用該可撓性金屬層疊體之可撓性印刷基板， 可解决隨著樹脂層的變形而產生的缺失之可撓性金屬層疊 體及使用該可撓性金屬層疊體之可撓性印刷基板。曰 亦即，如覆晶接合方式、尤其是如c〇F封裝，於高溫 條件下使凸塊般的突起物經由金屬層以及由該金屬層所組 g之金屬配線，而強力按壓於樹脂層之處理時，可抑制樹 %層的變形等之缺失。因此可抑制填充材的填入缺失以及 邊緣短路之問題。 (實施例） 以下係具體顯示實施例，但是本發明並不限定於這些 實施例。 &lt;聚酿亞胺糸列樹脂溶液：A &gt; 使聚醯亞胺樹脂（PI技術研究所社（日本）製、商品名 稱：Q-VR-FP007、玻璃轉移點33〇。〇成為固形物濃度12 318060 33 1290094 貝里％般而溶解於N- f基_2-咯烷酮（N-Methyl-9_ Pyrrolidone)，而獲得聚醯亞胺樹脂溶液（以下稱為「樹脂 溶液A」）。 〈聚醯亞胺系列樹脂溶液：B &gt; 使聚醯胺亞醯胺樹脂（東洋紡績社（曰本）製、商品名 % · Vylomax HR16NN、玻璃轉移點32〇t：)成為固形物濃 度12質量％般而溶解於^甲基：洛院酉同，而獲得聚賴 醯亞胺樹脂溶液（以下稱為「樹脂溶液B」）。 ⑩ &lt; 聚醯亞胺系列樹脂溶液：C&gt; 使聚醯胺醯亞胺樹脂（東洋紡績社（日本）製、商品名 稱：Vylomax N003TM、玻璃轉移點37〇。〇成為固形:濃 度12質篁％般而溶解於N_甲基_2_嘻烧啊，而獲得聚酿胺 醯亞胺樹脂溶液（以下稱為「樹脂溶液C」）。 &lt;聚酸亞胺系列樹脂溶液·· D &gt; 將300g之上述聚醯亞胺樹脂溶液入與1〇〇g之上述聚 ^胺酸亞胺樹脂溶液〇加以混合鮮，而獲得聚醯亞胺系 巧IJ樹脂溶液（以下稱為「樹脂溶液D」）。 〈聚醯亞胺系列樹脂溶液·· E &gt; 將200g之上述聚酿亞胺樹脂溶液a與2〇〇g之上述聚 酿胺醯亞胺樹脂溶液€加以混合授拌，而獲得聚醒亞胺系 列樹脂溶液（以下稱為「樹脂溶液E」）。 &lt;聚酿亞胺系列樹脂溶液·· F &gt; 使聚醯胺醯亞胺樹脂（東洋紡績社（日本）製、商品名 知· Vylomax NN95TM、玻璃轉移點29(rC)成為固形物濃 318060 34 1290094 度12質量％般而溶解於N_曱基_2_咯 酿亞胺樹脂溶液（以下稱為「樹脂溶液Fj)。胺 繼而使用上述所製作之樹脂溶液，依循下列 作出可撓性金屬層疊體。 衣 於以下的說明中，將採用樹脂溶液A至F所製造之 脂層，各稱呼為樹脂層A至F〇 衣乂 ^ 貫施例1 θ於電解銅箱（商品名稱：USLP、曰本電解社（日本）譽、 辦度：9_的粗化處理面上，使最終熱處王里後成為⑺衣、 的厚度般將樹脂溶液C加以塗佈，於1〇〇t下進行、〇八从^ 的加熱乾燥而獲得樹脂層c。接下來於樹脂層 =溶液A，於12代下進行5分鐘的加熱乾燥，並㈣^ 後成為30,的厚度般分2次塗佈，而獲得樹脂層a。之 後於氮氣環境下-邊從机升溫至·t —邊進行θ日士 ::熱處理，並於戰下進行1〇小時的熱處理，而獲得： g脂層的總厚度為40μηΐ2可撓性金屬層疊體。 ，施例2 於電解銅箱（商品名稱：USLP、日本電解社（日、 = 粗化處理面上’使最終熱處理後成為年 勺尽度心將树脂溶液£加以塗佈，於12(rc下進八 的加熱乾燥而獲得樹脂層E。接下來於樹脂層涂= 脂溶液A，並使乾燥後成為2〇 主佈树 I2(rrmn八^ 尽度般進行塗佈，於 乂下進灯10刀4里的加熱乾燥而獲得樹脂層Α。之後於 鼠虱裱境下一邊從30°c升溫至^(^一邊 透進仃18小時的熱 318060 35 1290094 處理，並於30(TC下進行3 ,J、眭沾说士 丁 J 8守的熱處理，而獲得全樹脂 層的總厚度為40μιη之可撓性金屬層疊體。 實施例3 於電解銅羯（商品名稱：USLP、日本電解社（日本）製、 厚度：9_的粗化處理面上，使乾燥後成為 &gt; 的厚度般 將樹脂溶液〇加以塗佈，於12〇t下進行5分鐘的加敎乾 無而獲得樹脂層D。接下來於樹脂層D上塗佈樹腊溶液E， 亚使乾無後成為20_的厚度般進行塗佈，於i3〇〇c下進行 祕0分鐘的加熱乾燥。之後於氮氣環境下-邊從3G°C升溫至 300 C-邊進行2G小時的熱處理，並於鳩。c下進行2小 時的熱處理，而獲得全樹脂層的總厚 金屬層疊體。 祝改 實施例4 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 =度. &gt;)的粗化處理面上，使乾燥後成為的厚度般 =谷液D加以塗佈，於12〇。〇下進行5分鐘的加敎乾 ^獲=脂層D。繼之_脂層D上塗佈樹脂溶液£， ^使乾燦後成為13μιη的厚度般進行塗佈，於12()。〇下進行 / 為19μΐη的厚度般進行塗佈，於130°C下進行 300:ctt加熱乾燥。之後於氮氣環境下一邊從30。〇升溫至 時的埶Γ理進行 =小時的熱處理，並於3G(rc下進行2小 金屬層^體獲得全樹脂層的總厚度為40㈣之可撓性 318060 36 1290094 比較例1 於電解銅落（商品名稱：F0_ws、古河Circuit F〇ii社（日 本）衣厚纟9μιη)的粗化處理面上，使最終熱處理後成為 30μΐη的厚度般將樹脂溶液Β加以塗佈，於i3〇t：下進行 10分鐘的加熱乾燥而獲得樹脂層B。接下來於樹脂層^ 重複塗佈樹脂溶液E，於12(rc下進行5分鐘的加熱乾燥， 亚使乾餘後成為1〇_的厚度般進行塗佈而獲得樹脂層 C。之後於氮氣環境下—邊從3Gt：升溫至·。c —邊進行 • 8小時的熱處理’並於28代下進行1〇小時的熱處理，而 獲得全樹脂層的總厚度為鄉^可撓性金屬層疊體。 比較例2 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 厚度：9μηι)的粗化處理面上’使乾燥後成為以㈣的厚度 般將樹脂溶液D加以塗佈，於13(rc下進行1()分鐘的加熱 乾燥而獲得樹脂層D。接下來於樹脂層^塗佈樹脂溶液 g，並使乾燥後成為14μιη的厚度般進行塗佈，於12〇它下 ’行,5分鐘的加熱乾燥。之後於樹脂層£上塗佈樹脂溶液 Β，並使乾燥後成為8μιη的厚度般進行塗佈，於12〇它下 進行5分鐘的加熱乾燥。然後於氮氣環境下一邊從如。^升 溫至30(TC-邊進行20小時的熱處理，並於遍。c下進行 2小4的熱處理，而獲得全樹脂層的總厚度為4叫瓜之 撓性金屬層疊體。 第1表係將實施例、比較例之可撓性金屬層疊體 脂層的構成加以整理而顯示。表中的數值為膜厚（陣）。 318060 37 1290094 為了說明上的簡便，係以從金屬箔側開妗 第2層、第3層，並顯示該樹脂層的種類。°”、、弟1層、 【第1表】6 From the viewpoint of reducing deformation, etc., it is preferable that all the glass # shifts to 300 ° C or more. The glass transition point (Tg) of the V-glass transition point (Tg) can be measured in the same manner as the measurement method of the above-mentioned resin material, using the measurement sample obtained by removing the metal layer 10 from the flexible metal laminate. However, in the measurement of the above-mentioned resin material, the thickness of the sample is specified in the middle, but the thickness of the resin layer 11 is not required to be changed in the measurement of the entire resin layer. T. The resin constituting the resin layer 11 is not particularly limited as long as it can obtain the bending property and the tensile strength required for the transportation of the flexible metal layer. In the present invention, it is preferable to use a thermoplastic resin. (9) In view of the ease of processing such as coating processing at the time of manufacture, the hot n-n tree n is preferably soluble in an organic solvent. Here, "second" means that the agent is 1% by mass or more in a temperature range from room temperature to 100t. For example, there are polyimine resin, polyamidiamine resin, polylysine tree, and polysulfide imine resin, poly-resin, spring polyetheretherketone A heat-resistant thermoplastic resin such as a resin. It is preferably a soluble and sufficient hydrazide for an organic solvent, and should be subjected to a dehydration condensation reaction, a polyaniline resin, a polyamidamine, a ruthenium, and an ether. Imine resin, polyoxo oxyn imide resin, polyether oxime resin, poly-bonding oxime I. More preferably yttrium polyimine resin, polyamidimide resin, polyether imine A thermoplastic resin which is at least one selected from the group consisting of a group of polyoxyalkylene phthalimide resins. The resin constituting the resin layer 11 may be a resin or a mixture of two or more resins. The mass average molecular weight can be selected, for example, from the range of 20,000 to 150,000. The i-layer bridging type thermosetting resin can be used to form the i-layer or more of the resin layer u, without damaging the effects of the present invention. At this time, 'can also be added to promote three yuan The thermosetting organic peroxide of the bridge type thermosetting resin layer or the hardening accelerator of Lewis acid 30 318060 1290094 or the like. The column compound and the nitrogen series may be added to the resin layer 11. The ester compound may be added with a filler for linear expansion control, etc. A lignosulfonate halogenated epoxy resin for imparting flame retardancy. The machine filler, the inorganic organic filler, and the inorganic filler are preferably not It is blended on the contact surface 13 side, but is disposed on the outermost side 12 (four). Further, it is more preferably added to the outermost layer (the second layer 15) constituting the outermost side 12. If the organic filling is filled, the money filler is added. The transportability of the flexible printed board can be improved. The filler is preferably an inorganic filler, especially a colloidal cerium oxide having an average particle diameter of 0.005 to 5 μm, more preferably 0.005 to 2 μm. Further, barium nitride, talc, titanium oxide, calcium silicate, etc. are particularly preferable. The amount of the hydrazine is, for example, 0.1 to 3 parts by mass of the enamel mass portion of the resin to be added. [First and second Flexible metal Method for Producing a Stacked Body For example, the method for producing the first and second flexible metal laminates is as follows: a method of dissolving in an organic solvent by a method such as casting, dipping, or spraying. The resin solution is applied onto a metal layer such as a copper foil, and the organic solvent is dried to form a first layer. In order to achieve a uniform thickness, it is preferably applied by casting. The organic solvent in which the resin is dissolved may be used, and only one type of the solvent may be used, or a mixed solvent of two or more types of 31 318060 1290094 may be used as appropriate. Examples of the polar solvent include N-fluorenylpyrrolidine, n-ethylene. A solvent such as a pyrrolidone series such as merolrolone, a solvent such as dimethylacetamide, n = diethylacetamide, etc., N,N-di'-7-T-amine , N,N-diethyl decylamine and other guanamine series solvents, dimethyl sub-milling, a stone wind and other sub-stone series of solvents. In addition, in addition to these relatively high hysteresis solvents = Buya can also be used without affecting the solubility of the coating resin, using acetone: methyl ethyl ketone, cyclopentanone, cyclohexanone and other ketone series solvents, toluene, dimethyl stupid series The aromatic 孀^ series solvent, tetrahydrofuran, dioxane, diethylene glycol dimethyl ether, = didiol dimethyl test and other ether series solvents are used as a mixed solvent. Then, the above coating and drying operations are repeated to form a resin layer 11 composed of a plurality of layers. In addition, continuous coating can be carried out without mixing spears between the majority of the layers. The applicator is not limited in any heat as long as it can be applied in accordance with the desired thickness of the resin layer. For example, depending on the desired thickness of the resin layer, g alone can be used as a dam type coating machine, a squeeze coater, a reverse coating machine (rev(10)_ei〇, a crack coater (4) (four) (four), and a transfer P _, an image coater, a coating tank type (c〇merc〇ater) type coater, or the like, or a combination of the above various coaters to perform continuous coating, etc. Two or more coating heads may be used for coating. Preferably, after the resin solution is applied to the metal layer 10, the initial drying is repeated until the surface of the layer is not viscous. After forming the resin layer n composed of a plurality of layers, the heat resistance of the resin and the warpage of the flexible metal laminate can be made, and the organic layer can be organic under reduced pressure or an oxygen-free environment. A method of removing an organic granule at a temperature at which the solvent is completely removed. [Flexible printed substrate] The flexible printed substrate of the present invention is a first or second flexible metal laminate using the present invention, for example, In the configuration shown in the figure, it can be processed by = The metal layer 10 is processed to form a wiring, whereby a flexible printed circuit board can be obtained. • As described above, in the present invention, it is possible to provide a process for performing a process of pressing a bump-like projection under high temperature conditions. The flexible metal layer used and the flexible printed circuit board using the flexible metal laminate can solve the missing flexible metal laminate which is deformed by the resin layer and use the flexibility A flexible printed circuit board of a metal laminate, that is, a flip chip bonding method, in particular, a c〇F package, which causes a bump-like protrusion to pass through a metal layer and a metal layer under high temperature conditions. When the metal wiring is strongly pressed against the resin layer, the loss of deformation of the tree layer or the like can be suppressed. Therefore, the problem of lack of filling of the filler and short-circuiting of the filler can be suppressed. (Examples) Hereinafter, the examples are specifically shown. However, the present invention is not limited to these examples. <Polymerin-resin resin solution: A &gt; Polyimine resin (manufactured by PI Technology Research Institute (Japan), trade name: Q-VR- FP 007, glass transfer point 33 〇. 〇 becomes a solid concentration 12 318060 33 1290094 Berry is dissolved in N-f-ethyl 2-pyrrolidone (N-Methyl-9_ Pyrrolidone) to obtain a polyimide resin Solution (hereinafter referred to as "resin solution A"). <Polyimide series resin solution: B &gt; Polyamide amine resin (produced by Toyobo Co., Ltd., trade name % · Vylomax HR16NN, glass The transfer point 32〇t:) is dissolved in the methyl group: the same as the solid content of 12% by mass, and a polylysine imine resin solution (hereinafter referred to as "resin solution B") is obtained. 10 &lt; Polyimine series resin solution: C&gt; A polyamidoximine resin (manufactured by Toyobo Co., Ltd., trade name: Vylomax N003TM, glass transfer point 37 使). The crucible is solid-formed, and is dissolved in N-methyl-2-indole in a concentration of 12% by mass to obtain a polystyrene quinone imine resin solution (hereinafter referred to as "resin solution C"). &lt;Polyacid imine series resin solution·· D &gt; 300 g of the above polyimine resin solution is mixed with 1 μg of the above polyamidiamine resin solution, and mixed to obtain a poly The amine is an IJ resin solution (hereinafter referred to as "resin solution D"). <Polyimide series resin solution·· E &gt; 200 g of the above-mentioned polyimine resin solution a and 2 〇〇g of the above-mentioned polyamin yimimide resin solution were mixed and mixed to obtain Ju Xingya Amine series resin solution (hereinafter referred to as "resin solution E"). &lt;Polyaniline series resin solution·· F &gt; Polyimide yttrium imide resin (manufactured by Toyobo Co., Ltd., trade name, Vylomax NN95TM, glass transition point 29 (rC), solid substance 318060 34 1290094 degree 12% by mass is dissolved in N_mercapto 2_ bromoimine resin solution (hereinafter referred to as "resin solution Fj". The amine is then used to make the flexible metal according to the following resin solution In the following description, the resin layers manufactured by the resin solutions A to F, each referred to as the resin layer A to F, are applied to the electrolytic copper box (trade name: USLP, Sakamoto Electrolysis Co., Ltd. (Japan) reputation, degree: 9_ on the roughened surface, the resin solution C is applied to the thickness of the final heat (W), and then the resin solution C is applied at 1 〇〇t. Then, the resin layer c is obtained by heat drying of the film, and then the resin layer = solution A is heated and dried for 5 minutes in the 12th generation, and then applied to the thickness of 30, and then coated twice. The resin layer a was obtained, and then θ was performed while heating from the machine to ·t in a nitrogen atmosphere. :: Heat treatment, and heat treatment for 1 hour under the war, to obtain: a total thickness of the g lipid layer is 40 μηΐ2 flexible metal laminate. Example 2 is in an electrolytic copper box (trade name: USLP, Japan Electrolysis Society) (Day, = roughening treatment surface) After the final heat treatment, the resin solution is applied as a spoon, and the resin layer E is obtained by heating under 12 (r. under rc). Next, the resin layer is coated. = fat solution A, and after drying, it becomes 2 〇 main cloth tree I2 (rmn 八 ^ 尽 尽 尽 尽 尽 尽 尽 尽 尽 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 Under the environment, the temperature is raised from 30 °C to ^(^, the heat is 318060 35 1290094, which is immersed in the 仃 18 hours, and the heat treatment is performed at 30 (the TC, 眭 说 说 士 士 士 士 J 8 守 守A flexible metal laminate having a total thickness of the resin layer of 40 μm. Example 3 After drying, a copper beryllium (trade name: USLP, manufactured by Nippon Seika Co., Ltd., thickness: 9 mm) was dried. The resin solution is applied as a thickness of > and is applied at 12 Torr for 5 minutes. The resin layer D was obtained by dryness, and then the tree wax solution E was applied onto the resin layer D, and the coating was applied to a thickness of 20 mm after drying, and the secret was carried out for 0 minutes under i3〇〇c. After heating and drying, heat treatment was carried out for 2 G hours while heating from 3 G ° C to 300 C in a nitrogen atmosphere, and heat treatment was carried out for 2 hours under 鸠.c to obtain a total thick metal laminate of the entire resin layer. In the roughened surface of the electrolytic copper box (trade name: USLP, manufactured by Nippon Seisakusho Co., Ltd., = degree. &gt;), the thickness of the solution is changed to the thickness of the valley solution D. At 12 o'clock. The underarm was dried for 5 minutes and the fat layer D was obtained. Subsequently, the resin layer was coated on the grease layer D, and the coating was applied to a thickness of 13 μm after drying, and was applied at 12 (). The crucible was carried out / coated for a thickness of 19 μΐη, and dried at 130 ° C for 300:ctt heating. Then, from 30 in the nitrogen atmosphere.埶Γ 〇 〇 = = = = = = = = = = = = = = = = = = 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 (The product name: F0_ws, Furukawa Circuit F〇ii (Japan) 纟 纟 9μιη) on the roughened surface, after the final heat treatment, the resin solution is applied to the thickness of 30μΐη, under i3〇t: The resin layer B was obtained by heating and drying for 10 minutes. Then, the resin solution E was repeatedly applied to the resin layer, and dried at 12 (rc for 5 minutes, and then dried to a thickness of 1 Å). After coating, the resin layer C was obtained. Then, under a nitrogen atmosphere, heat treatment was carried out from 3 Gt: to - c - 8 hours of heat treatment ', and heat treatment was performed for 1 hour in 28 passages to obtain a full resin layer. In the roughened surface of the electrolytic copper box (trade name: USLP, manufactured by Nippon Seika Co., Ltd., thickness: 9μηι), the total thickness is [4] Resin solution D The cloth was heated and dried at 13 (r) for 1 minute, and the resin layer D was obtained. Next, the resin solution g was applied to the resin layer, and dried to a thickness of 14 μm, and coated at 12 μm. The lower layer was heated and dried for 5 minutes. Then, the resin solution was coated on the resin layer, and coated with a thickness of 8 μm after drying, and dried under heating for 12 minutes under 12 Torr. Under the environment, the temperature is raised from 30° to 30 (TC-side heat treatment for 20 hours, and heat treatment of 2 hours and 4 times is performed under the c., and the total thickness of the entire resin layer is 4, and the flexible metal laminate of the melon is obtained. The first table shows the structure of the flexible metal laminate lipid layer of the examples and the comparative examples. The numerical values in the table are the film thicknesses. 318060 37 1290094 For the sake of simplicity, The second layer and the third layer are opened from the side of the metal foil, and the type of the resin layer is displayed. °", 1 layer, [1st table]

關於如此所獲知之實施例、比較例之可換性 體的物性值測定及評估，係如下列所示者來進行 &amp; $可撓性金屬層疊體的評估&gt; •針入位移量 各自準備多數個上述實施例、比較例之可撓性金 豐體，而進行下列之用於測定的樹腊層的樣本之玲 • (L0)測定用樣本 t 以氯化鐵溶液從可挽性金屬層疊體之尹將銅落層去 除’以測微器測量出於^ 以91定r μ人屆出射月曰；度亚加以確認之後，製作出用 :測疋攸與金屬層鄰接的樹脂層之針入位移量⑽之樣 318060 38 1290094 • (L1)測定用樣本 去除後之樹脂^於:2性金屬層疊體之中將銅笛層加以With respect to the measurement and evaluation of the physical property values of the interchangeable bodies of the examples and comparative examples thus obtained, the evaluation of &lt;$flexible metal laminates was carried out as follows. In the above-mentioned flexible specimens of the above-mentioned examples and comparative examples, the sample of the tree wax layer for the following measurement was carried out, and the sample t for measuring (t0) was laminated from a ferric metal solution with a ferric chloride solution. The body of the Yin removes the copper layer. The measurement is performed by the micrometer. The 91 is determined by the r μ people. After the confirmation is completed, the needle is used to test the resin layer adjacent to the metal layer. Into the displacement amount (10) 318060 38 1290094 • (L1) Resin after removal of the sample for measurement ^: The copper flute layer is added to the 2-strand metal laminate

Series研磨機，—、嘉丸本Sf社（日本）製造之Te㈣ k以測微器測量出樹脂厚度一邊從最外 側進灯研磨’而製作出膜厚為2_之樣本。 • (L2)測定用樣本 、—矛、了彳之人金屬層的接觸面側開始研磨之外，其他與（L1) 測疋用樣本相同來進行研磨，而製造出（U)測定用樣本。 丨對於上述3個樣本，係各自於23±5。〇、55±5%相對濕 度的環境下放置24小時以上後進行升溫，而測定3()〇。〇時 的針入位移量。 關於（L0)測定用樣本及（L1)測定用樣本，係各自從與 金屬層的接觸面側開始將探針按壓而進行測定。關於（L2) 測定用樣本，係從最外面側開始將探針按壓而進行測定。 測定條件如下。 測定裝置·· SII Nanotechnology社（曰本）製、商品名 9爯· EXSTAR6100TMA/SS、前端係採用immxlmm見方之 貫入探針、荷重：300mN、升溫速度：20°C/min。 結果如第2表所示。 【第2表】 實施例 比較例 1 2 3 4 1 2 針入位移量 (μηι) (L1) 2 2 3 6 8 10 (L2) 8 7 9 8 2 „ 5 —--- (dL) 6 5 6 2 (L〇) 4 5 6 9 11 Γό~ 318060 39 1290094 2.存儲彈性模數（E，）、玻璃轉移點（Tg) 係準備與（L0)測定用樣本為相同者，採用強制振動非 ^振型黏彈性測定器（〇dentec社（日本）製、商品名稱： RHEO V職0N)，於以下條件下對此樣本進行綱 儲彈性模數作，）的測定。 &lt; 仔 測定條件：加振頻率數：11Hz、靜態張力：3輕、樣 本尺寸：〇.5mm(寬）x3〇mm(長度）、升溫速度：1〇t：/min、 测定環境條件··常溫常濕環境下。 &gt;此外，同㈣亦檢測出損失係數（_)的波頂值而求取 破璃轉移點（Tg)。結果如第3表所示。 【第3表】Series Grinding Machine, Te, Te, manufactured by Sakura Sho (Japan), used to measure the thickness of the resin while measuring the thickness of the resin from the outermost side, and produced a sample with a film thickness of 2 mm. • (L2) The sample for measurement, the spear, and the contact surface side of the metal layer of the enamel are ground, and the other samples are polished in the same manner as the (L1) sample for measurement, and the (U) sample for measurement is produced.丨 For each of the above three samples, each is 23±5. After immersing in an environment of 55 ± 5% relative humidity for 24 hours or more, the temperature was raised to measure 3 () 〇. The amount of needle insertion during 〇. The (L0) measurement sample and the (L1) measurement sample were each measured by pressing the probe from the contact surface side with the metal layer. (L2) The sample for measurement was measured by pressing the probe from the outermost side. The measurement conditions are as follows. Measuring device · SII Nanotechnology Co., Ltd., product name 9爯· EXSTAR6100TMA/SS, front end using immxlmm square penetration probe, load: 300mN, heating rate: 20°C/min. The results are shown in Table 2. [Table 2] Example Comparative Example 1 2 3 4 1 2 Needle insertion amount (μηι) (L1) 2 2 3 6 8 10 (L2) 8 7 9 8 2 „ 5 —--- (dL) 6 5 6 2 (L〇) 4 5 6 9 11 Γό~ 318060 39 1290094 2. The storage elastic modulus (E,) and the glass transition point (Tg) are prepared in the same way as the (L0) measurement sample, and the forced vibration is used. ^Vibration type viscoelasticity measuring instrument (manufactured by 〇dentec (Japan), trade name: RHEO V job 0N), the sample is subjected to the measurement of the elastic modulus of the sample under the following conditions. Vibration frequency: 11 Hz, static tension: 3 light, sample size: 〇. 5 mm (width) x 3 〇 mm (length), heating rate: 1 〇 t: / min, measurement of environmental conditions · normal temperature and humidity environment. &gt; In addition, the same as (4), the wave top value of the loss coefficient (_) is also detected to determine the glass transition point (Tg). The result is shown in Table 3. [Table 3]

3·樹脂層的線性熱膨脹係數 係準備與（L〇)測定用樣本為相同者，採用熱機械分析 、（真空理J1社（日本）製、商品名稱：TMA7)，對此樣本進 行™ A拉引測定’以n s κ 7! 9 7中的平均線性膨服係數算 出方法來敎出從5(TC至25Gt：之平均線性膨脹率。 、測定條件如下所示。樣本形狀：長、 利疋溫度範圍：30—400。(：、荷重：9.8mN、升溫速度·· 318060 40 1290094 10°C/min、測定初期環境條件：常溫常濕環境下。 該結果如第4表所示。 4.麵曲量 將實施例、比較例之可撓性金屬層疊體裁剪為7〇mm 寬 x250mm 長。 繼而將裁剪後的樣本放置於調整為23±5°C/55±5%(濕 度）環境之恆溫恆濕槽中，進行72小時的恆溫恆濕調整， 以此狀態為常態下的翹曲量，將金屬層的面朝上放置於平 參腎的玻璃板上，而測量出翹曲為圓弧狀的樣本之距離玻璃 面的高度。 再且將可挽性金屬層豐體放置於丨互溫爐中，於空氣 中在15(TC下放置24小時後，放置於調整為23±；rc/55 土 5 %(濕度）環境之恆溫恆濕槽中，進行72小時的恆溫恆濕調 整，以此狀態為150°C下放置24小時後之翹曲量。 各個結果如第4表所示。 覆晶接合性（内部引線（ILB性）） 於實施例、比較例之可撓性金屬層疊體的金屬層上， 進行光阻劑塗佈、圖案曝光、顯像、姓刻、抗焊膜塗佈及 錫鍍敷，並藉由微影技術而形成覆晶接合用的電路圖案。 將形成有此電路圖案之可撓性印刷基板，於23。〇及“％ RH下放置72小時後，以覆晶黏晶機（涉谷工業社（日本）製0) 來進行覆晶接合用的電路圖案與IC的凸塊之接合。、 接合時的溫度、接合時間以及接合壓力係於下列條件 下進行。 、 318060 41 1290094 電路基板側承載台溫度：1〇〇。〇 晶片側工具溫度：4 5 〇。〇 接合時間·· 2.5秒 接合壓力· 200mN/mm2 此外，係根據下列評估標準，來進行樹脂層外觀上的 變化以及接合部位的剖面觀察。 該結果如第4表所示。 C評估標準&gt; • 〇：外觀上無問題，於接合部位上未產生顯著的變形 及剝離。 △:外觀上無問題，雖然接合部位上稍微產生樹脂的 滲入，但未產生邊緣短路及引線偏移的情況。 X外觀上具有問題，且接合部位上產生樹脂的滲入 以及邊緣短路或是引線偏移的情況。 第4表】3. The linear thermal expansion coefficient of the resin layer is the same as that of the (L〇) measurement sample, and is subjected to thermomechanical analysis (manufactured by JJ Corporation (Japan), trade name: TMA7). The measurement method is based on the calculation method of the average linear expansion coefficient in ns κ 7! 9 7 to extract the average linear expansion ratio from 5 (TC to 25 Gt: the measurement conditions are as follows. Sample shape: long, favorable temperature Range: 30-400. (:, load: 9.8 mN, heating rate·· 318060 40 1290094 10°C/min, initial environmental conditions: normal temperature and normal humidity. The results are shown in Table 4. 4. The flexible metal laminate of the examples and the comparative examples was cut to a length of 7 mm and a width of 250 mm. Then the cut sample was placed in a constant temperature adjusted to 23 ± 5 ° C / 55 ± 5% (humidity). In the constant humidity tank, the constant temperature and humidity adjustment was carried out for 72 hours, and the state was the amount of warpage under normal conditions, and the metal layer was placed face up on the glass plate of the ginseng kidney, and the warpage was measured as an arc. The height of the sample is from the height of the glass surface. Placed in a 丨inter-heating furnace, placed in air at 15 (TC for 24 hours, placed in a constant temperature and humidity chamber adjusted to 23 ±; rc / 55 soil 5% (humidity) environment, for 72 hours of constant temperature The constant humidity adjustment was carried out in this state at a temperature of 150 ° C for 24 hours. The results are shown in Table 4. The flip chip bondability (internal lead (ILB)) can be used in the examples and comparative examples. On the metal layer of the flexible metal laminate, photoresist coating, pattern exposure, development, surname, solder resist coating, and tin plating are performed, and a circuit for flip chip bonding is formed by lithography. The flexible printed circuit board on which the circuit pattern was formed was subjected to flip chip lamination at 23 ° C. and "% RH for 72 hours, and then a crystal-chip bonded crystal machine (manufactured by Shibuya Kogyo Co., Ltd., Japan). The bonding circuit pattern is bonded to the bumps of the IC. The bonding temperature, bonding time, and bonding pressure are performed under the following conditions: 318060 41 1290094 Circuit board side carrier temperature: 1 〇〇. 〇 wafer side tool Temperature: 4 5 〇. 〇 bonding time · 2.5 seconds bonding pressure · 200m N/mm2 In addition, the appearance of the resin layer and the cross-sectional observation of the joint were performed according to the following evaluation criteria. The results are shown in Table 4. C Evaluation Criteria&gt; • 〇: No problem in appearance, in the joint No significant deformation or peeling occurred in the part. △: There was no problem in appearance, and although resin penetration occurred slightly at the joint portion, there was no occurrence of edge short circuit and lead offset. X had a problem in appearance and was produced at the joint portion. Infiltration of resin and short-circuiting of edges or lead deflection. Table 4]

從第2至4表當中可得知，針入位移量滿足本發明的 條件之實施例1至4之可撓性金屬層疊體，於覆晶接合性 318060 42 1290094 (内部引線（ILB性）)項目中可獲得良好的結果。相對於此， 於比較例1及2之可撓性金屬層疊體中’未能滿足針入位 移量的條件，覆晶接合性（内部引線（ILB性））的結果為不 良。 實施例5 •可撓性金屬層疊體的製作 於電解銅落（商品名稱：USLP、日本電解社（日本）製、 厚度·· 9Rm)的粗化處理面上，使最終處理後成為“η的厚 祕般將樹脂溶液Α加以塗佈，於11()。〇下進行5分鐘的加 熱乾燥而獲得樹脂層A。 系k之於樹脂層a上塗佈樹脂溶液B，於i 2〇艺下進行$ 分鐘的加熱乾燥，並獲得乾燥後的厚度為32μιη之樹脂層 Β 〇 之後於氮氣環境下一邊從30°c升溫至3〇〇它一邊進行 Hj、時的熱處理’並於3〇〇t：下進行丄小時的熱處理，而 |得王树知層的總厚度為4〇μιη之可撓性金屬層疊體。 •吸濕膨脹係數（CHM)測定用樣本的製作 於電解銅箔（商品名稱：USLP、日本電解社（日本）製、 厚度：％m)的粗化處理面上，使最終處理後成為厚 度般將樹脂溶液入加以塗佈，於11〇t下進行5分鐘的加 熱乾燥而獲得樹脂層A。之後於氮氣環境下一邊從3(Γ(：升 溫至300。(：一邊進行18小時的熱處理，並於3〇〇。〇下進 1小時的熱處理。 繼之使用氯化鐵溶液，藉由化學餘刻處理將電解銅箱 318060 43 1290094 (金屬層）加以去除，而獲得測定樣本。測定用樣本的大小 為縱 70mmx橫 70mm。 •吸 &gt;絲知脹係數（CH0)測定用樣本的製作 -於電解銅箱（商品名稱：USLp、日本電解社（日本）製、 ^厚度· 9μΠ1)的粗化處理面上，將樹脂溶液B加以塗佈並於 120 C下進行5分鐘的加熱乾燥，並使乾燥後的厚度成為 32μιη般進行塗佈，而獲得樹脂層Β。之後於氮氣環境下一 邊從3(TC升溫至30(rc 一邊進行18小時的熱處理，並於 _^00°C下進行1小時的熱處理。 繼之藉由與上述相同之化學蝕刻處理將電解銅箔（金 屬層）去除，而獲得測定樣本。測定用樣本的大小為縱 70mmx橫 70mm。 •樹脂層全體之測定用樣本的製作 以上述化學㈣處理，從可撓性金屬層疊體將金屬層 去除’而製作出測定用樣本。 實施例6 •可撓性金屬層疊體的製作 s於電解銅箱（商品名稱·· USLp、日本電解社（日本）製、 厚度·、9μιη)的粗化處理面上塗佈樹脂溶液B，使其最終處 理後成為Η)μΐη的厚度，於12〇t下進行5分鐘的力:熱乾燥 而獲得樹脂層B。 繼而將樹脂溶^塗佈於樹脂層B上使其乾燥後成為 3〇Mm的厚度般’於13Qt下進行1()分鐘的加熱乾燥 得樹脂層F。 318060 44 1290094 之後於氮氣環境下-邊從3〇tfh溫至3〇〇t 18小時的熱處理，並於3〇〇。〇下進行！小時的熱處理，仃 獲得全樹脂層的總厚度為40μιη之可撓性金屬層疊體。而 •吸濕膨脹係數（cHM)測定用樣本的製作 且也 於電解銅箔（商品名稱·· USLP、日木雷絃、丄/ 不冤解社（日本）製、 旱又·· 9μηι)的粗化處理面上塗佈樹脂溶液b， 、 理後成為ΙΟμπι的厚度，於120°C下推;τ ς、 ^ ^ 下進仃5分鐘的加熱乾焊 而獲付樹脂層Β。之後於氮教j罗接τ ^ 、 以阶Α (絲⑽以下-邊從机升溫至 • 00C —邊進行18小時的熱處理，並於3〇〇 時的熱處理。 延仃·3小 繼之藉由與上述相同之化學巍刿步 趙托 子蝕刻處理將電解銅箔（金 屬層）去除，而獲得測定樣本。測定用揭 ^ j疋用樣本的大小為縱 70mmx橫 70mm。 •吸濕膨脹係數（CHO)測定用樣本的製作 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 f度：Mm)的粗化處理面上，塗佈樹脂溶液f並於i3^c f進行10分鐘的加熱乾燥，並使乾燥後的厚度成為卿m 進行塗佈，而獲得樹脂層F。之後於氮氣環境下一邊從3〇Qc 升溫至300 C —邊進行18小時的熱處理，並於3〇〇。〇下進 行3小時的熱處理。 繼之藉由與上述相同之化學則處理將電解銅羯（金 屬層）去除，而獲得測定樣本。測定用樣本的大小為縱 70mmx橫 70mm。 •樹脂層全體之測定用樣本的製作 318060 45 1290094 本除：:㈣處理，從可撓性金屬層疊體將金屬層 -除而製作出測定用樣本。 實施例7 •可撓性金屬層疊體的製作 '日本電解社（日本）製、 I: 2。九化處理面上塗佈樹脂溶液B，使其乾燥後 烕為20μιη的厚度塗佈，於12〇。 夂 燥而獲得樹脂層B。 C下進订1〇分鐘的加熱乾 •。繼而樹脂溶液F塗佈於所獲得之樹脂層b上並使 燥後成為20μηι的厚度，於][3〇。厂下、# &gt; ! λ ^ ^ 於130C下進仃1〇分鐘的加埶齡 .燥而獲得樹脂層F。 …、礼 之後於氮氣環境下-邊從3(rc升溫至3〇〇。〇一邊進^ 1M、時的熱處理，並於3G(rc下進行3小時的熱處理，= 獲得全樹脂層的總厚度為4G_之可撓性金屬層疊體。 •吸濕膨脹係數（cHM)測定用樣本的製作 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 $度：9_的粗化處理面上塗佈樹脂溶液B，*其最二 理後成為20,的厚度，於！20t下進行1〇分鐘的加:二 燥而獲得樹脂層B。之後於氮氣環境下一邊從3〇。〇升溫^ 300°C —邊進行18小時的熱處理，並於3〇〇t：下進行f 時的熱處理。 + 繼而藉由與上述相同之化學蝕刻處理將電解銅箱（八 屬層）去除，而獲得測定樣本。測定用樣本的大小為= 70mmX橫 70mm。 318060 46 1290094 •吸濕膨脹係數（Cho)測定用樣本的製作 於電解銅箔（商品名稱：USLP、曰本電解社（日本）製、 厚度：9μιη)的粗化處理面上，將樹脂溶液F加以塗佈並於 -l3〇C下進行10分鐘的加熱乾燥，並使乾燥後的厚度成為 20μΓΠ而進行塗佈，而獲得樹脂層F。之後於氮氣環境下一 邊從30°C升溫至3GG°C-邊進行18小時的熱處理，並於 3〇〇°C下進行3小時的熱處理。以此為Ch。的樣本。 繼而藉由與上述相同之化學餘刻處理將電解銅箱（全 #層）去除，而獲得測定樣本。測定用樣本的大小為縱 70mmx橫 70mm。 •樹脂層全體之測定用樣本的製作 以上述化學蝕刻處理，從可撓性金屬層疊體將金屬層 去除，而製作出測定用樣本。 曰 實施例8 •可撓性金屬層疊體的製作 於電解銅箱（商品名稱：USLP、日本電解社（日本❻、 ，度：㈣的粗化處理面上塗佈樹脂溶液c，使其乾燥後 3 8哗的厚度’於11〇t下進行5分鐘的加熱乾燥而獲 传樹脂層C。 繼而將樹腊溶液B塗佈於樹脂層c上使其 叫m的厚度，於12(rc下進行1()分 = 樹脂層B。 …、Μ而獲传 之後於氮氣環境下一邊從3〇t升溫至鳩。c 18小時的熱處理，並於·。CT進行3小時的熱處理，而丁 318060 47 1290094 獲得全樹脂層的總厚度為40μπι之可撓性金屬層疊體。 •吸濕膨脹係數（CHM)測定用樣本的製作 於電解銅、治（商品名稱· U S L P、曰本電解社（日本）案』、 尽度· 9μπι)的粗化處理面上塗佈樹脂溶液c，使盆最終處 ，理後成為8μπι的厚度，於llOt：下進行5分鐘的加熱乾燥 而獲得樹脂層。之後於氮氣環境下一邊從3(rc升溫至 300°C —邊進行18小時的熱處理，並於3〇(rc下進行3小 時的熱處理。 • 繼而藉由與上述相同之化學蝕刻處理將電解銅箔（金 屬層）去除，而獲得測定樣本。測定用樣本的大小為縱 7〇mmx橫 70mm。 •吸濕膨脹係數（CHO)測定用樣本的製作 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 厚度丄％m)的粗化處理面上，塗佈樹脂溶液f並於123艺 ^進仃10为知的加熱乾燥，並使乾燥後的厚度成為14㈣ ^進行塗佈’而獲得樹脂層F。之後於氮氣環境下一邊從As can be seen from the second to fourth tables, the flexible metal laminates of Examples 1 to 4 in which the amount of the insertion and the amount of the present invention satisfy the conditions of the present invention are in the flip chip bonding property 318060 42 1290094 (internal lead (ILB property)) Good results are obtained in the project. On the other hand, in the flexible metal laminates of Comparative Examples 1 and 2, the condition of the needle insertion amount was not satisfied, and the flip chip adhesion (internal lead (ILB)) was deteriorated. Example 5: The flexible metal laminate was produced on a roughened surface of electrolytic copper (product name: USLP, manufactured by Nippon Seika Co., Ltd., thickness: 9Rm), and was finally treated as "n". The resin solution was applied as a thick layer, and dried under heating for 5 minutes under a crucible to obtain a resin layer A. The resin solution B was coated on the resin layer a under the i 2 Heat-drying for $ minutes, and obtaining a resin layer having a thickness of 32 μm after drying, and then heat-treating from 30 ° C to 3 Torr in a nitrogen atmosphere while performing heat treatment at Hj, and at 3 〇〇t : a flexible metal laminate having a total thickness of 4 〇 μηη, which is a heat treatment of 得 树 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • On the roughened surface of the Japan Electrolysis Co., Ltd. (Japan), thickness: %m), the resin solution was applied as a thickness after the final treatment, and heated and dried at 11 °t for 5 minutes to obtain a resin. Layer A. After a nitrogen atmosphere 3 (Γ (: warmed to 300. (: while performing 18 hours of heat treatment, and at 3 〇〇. 〇 under the heat treatment for 1 hour. Following the use of ferric chloride solution, electrolytic copper processing by chemical reprocessing 318060 43 1290094 (metal layer) was removed to obtain a measurement sample. The size of the sample for measurement was 70 mm in length and 70 mm in width. • Preparation of the sample for measuring the coefficient of expansion (CH0) - in electrolytic copper box (product name) : The resin solution B was applied to the roughened surface of the USLp, manufactured by Nippon Seika Co., Ltd. (manufactured by Nippon Seika Co., Ltd., thickness: 9 μΠ1), and dried at 120 C for 5 minutes, and the thickness after drying was 32 μm. The coating was carried out in the same manner, and the resin layer was obtained. Then, the temperature was raised from 3 (TC to 30 (r) while heat treatment was carried out for 18 hours under argon atmosphere, and heat treatment was performed at 00 ° C for 1 hour. The electrolytic copper foil (metal layer) is removed by the same chemical etching treatment as described above to obtain a measurement sample. The size of the sample for measurement is 70 mm in length and 70 mm in width. • The measurement sample for the entire resin layer is processed by the above chemical (IV). From In the flexible metal laminate, the metal layer was removed to produce a sample for measurement. Example 6 Production of a flexible metal laminate in an electrolytic copper box (product name: USLp, manufactured by Nippon Seika Co., Ltd., Japan) The resin solution B was applied to the roughened surface of 9 μm, and finally treated to have a thickness of Η)μΐη, and subjected to a force of 5 Torr for 5 minutes: thermal drying to obtain a resin layer B. Then, the resin was obtained. After being dried and applied to the resin layer B, it is dried to a thickness of 3 〇Mm. The resin layer F is obtained by heating at 13 Torr for 1 minute. 318060 44 1290094 After the nitrogen atmosphere, the side is from 3 〇. The temperature of tfh was 3 Torr for 18 hours and was 3 Torr. Let's go! After a small heat treatment, 可 a flexible metal laminate having a total thickness of the entire resin layer of 40 μm was obtained. And the sample for measuring the coefficient of hygroscopic expansion (cHM) is also produced in electrolytic copper foil (product name···················································································· The resin solution b was applied to the roughened surface, and then the thickness was ΙΟμπι, and was pushed at 120 ° C; τ ς, ^ ^ was heated and dry-welded for 5 minutes to obtain a resin layer Β. After that, the nitrogen is taught to be τ ^ , and the heat treatment is carried out for 18 hours with the order of 丝 (the wire is below (10) and the temperature is raised to 00C from the machine, and the heat treatment is performed at 3 。. The electrolytic copper foil (metal layer) is removed by the same chemical stepping as described above to obtain a measurement sample. The size of the sample for measurement is 70 mm in length and 70 mm in width. • Moisture absorption coefficient (CHO) Preparation of a sample for measurement The resin solution f was applied to a roughened surface of an electrolytic copper box (trade name: USLP, manufactured by Nippon Seika Co., Ltd., f: Mm) and was subjected to i3^cf. The heat was dried in a minute, and the thickness after drying was applied to obtain a resin layer F. Thereafter, the temperature was raised from 3 〇 Qc to 300 C in a nitrogen atmosphere, and heat treatment was performed for 18 hours at 3 Torr.热处理. The heat treatment was carried out for 3 hours. The electrolytic copper ruthenium (metal layer) was removed by the same chemical treatment as above to obtain a measurement sample. The size of the sample for measurement was 70 mm in length and 70 mm in width. Production of all measurement samples 3180 60 45 1290094 In addition to the following: (4) Processing, a metal sample was removed from the flexible metal laminate to prepare a sample for measurement. Example 7: Production of a flexible metal laminate [manufactured by Nippon Seika Co., Ltd., Japan) I: 2. The resin solution B was applied to the surface of the nine-treated surface, and dried to a thickness of 20 μm, and coated at 12 Å. The resin layer B was obtained by drying. The heating was dried for 1 minute. Then, the resin solution F is applied onto the obtained resin layer b and dried to a thickness of 20 μm, and is added to the [[3〇.厂下,# &gt; ! λ ^ ^ at 130C for 1 minute.埶 . 燥 燥 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂Heat treatment, = a flexible metal laminate having a total thickness of 4 G_ of the entire resin layer. • Preparation of a sample for measuring the coefficient of hygroscopic expansion (cHM) in an electrolytic copper box (trade name: USLP, Japan Electrolys Society (Japan) ), the degree: $: 9_ roughening treatment surface coated with resin solution B, * the second most reasonable to become 20, the thickness, in! Adding for 1 minute at 20t: drying to obtain the resin layer B. Then, under a nitrogen atmosphere, heat treatment was carried out for 3 hours from a temperature of 300 ° C for 30 hours, and was carried out at 3 〇〇 t: Heat treatment at time f. Then, the electrolytic copper box (eight layers) was removed by the same chemical etching treatment as above to obtain a measurement sample. The size of the sample for measurement was = 70 mm X 70 mm. 318060 46 1290094 • Hygroscopic expansion The sample for measuring the coefficient of Cho (Cho) was prepared by coating a resin solution F on a roughened surface of an electrolytic copper foil (trade name: USLP, manufactured by Japan Chemical Co., Ltd., thickness: 9 μm). The resin layer F was obtained by heating and drying for 10 minutes under 〇C, and coating the thickness after drying to 20 μ. Thereafter, heat treatment was carried out for 18 hours while raising the temperature from 30 ° C to 3 GG ° C under a nitrogen atmosphere, and heat treatment was performed at 3 ° C for 3 hours. Use this as Ch. Sample. Then, the electrolytic copper box (full # layer) was removed by the same chemical residue treatment as described above to obtain a measurement sample. The size of the sample for measurement was 70 mm in length and 70 mm in width. • Preparation of sample for measurement of the entire resin layer The metal layer was removed from the flexible metal laminate by the above chemical etching treatment to prepare a sample for measurement.曰Example 8: Preparation of flexible metal laminate The resin solution c was applied to an electrolytic copper box (trade name: USLP, Japan Electrolysis Co., Ltd., Japan: Degree: (4), and dried. The thickness of 3 8 ' was heat-dried at 11 〇t for 5 minutes to obtain a resin layer C. Then, the wax solution B was applied onto the resin layer c to have a thickness of m, which was carried out at 12 (rc). 1 () = = resin layer B. ..., after the transfer was carried out, the temperature was raised from 3 〇t to 鸠 in a nitrogen atmosphere, and the heat treatment was carried out for 18 hours, and the heat treatment was carried out for 3 hours in CT. 1290094 A flexible metal laminate having a total thickness of 40 μm is obtained for the entire resin layer. • The sample for measuring the coefficient of hygroscopic expansion (CHM) is produced in electrolytic copper and treated (trade name · USLP, Sakamoto Electrolysis Co., Ltd. (Japan) The resin solution c was applied to the roughened surface of the utmost degree, and the final surface of the pot was adjusted to a thickness of 8 μm, and heated and dried for 5 minutes at llOt: to obtain a resin layer. The lower side is heated from 3 (rc to 300 ° C) for 18 hours. Heat treatment and heat treatment at 3 Torr for 3 hours. Then, the electrolytic copper foil (metal layer) was removed by the same chemical etching treatment as above to obtain a measurement sample. The size of the sample for measurement was 7 〇mmx is 70mm horizontally. • The sample for measuring the coefficient of hygroscopic expansion (CHO) is applied to a roughened surface of an electrolytic copper box (product name: USLP, manufactured by Nippon Seika Co., Ltd., thickness 丄%m). The resin solution f is heated and dried in a known manner, and the thickness after drying is 14 (four) ^ is applied to obtain a resin layer F.

C升溫至3〇(TC 一邊進行18小時的熱處理 下進行3小時的熱處理。 於3〇()C •樹脂層全體之測定用樣本的製作 八严：：上述化學蝕刻處理，從可撓性金屬層疊體當中將 金屬層去除’而製作出測定用樣本。 it中將 318060 48 1290094 比較例3 •可撓性金屬層疊體的製作 於電解銅箔（商品名稱·· USI p 戶择· n 石梆uAp、曰本電解社（日本）製、 子又· 9μηι)的粗化處理面上分2今淨德社 最終處理m μ 月旨溶液八，使其 _二里後成為40μιη的厚度’於13(rc下進行ι〇分鐘的 加熱乾燥而獲得樹脂層A。 之後於氮氣環境下-邊從溫至卿。卜邊進行 小蛉的熱處理，並於300t:下進行 ,把仃1小4的熱處理，而 _侍王樹脂層的總厚度為40,之可撓性金屬層属體。 定偏測定用樣本、吸濕膨脹係“η。)測 疋用樣本的製作 與下列樹脂層全體之測定用樣本的製作相同，將金屬 曰去除^製作出敎用樣本。敎用樣本的大小為縱 7〇imnx檢 70mm 〇 於樹脂層由丨種的層所構成時，吸濕膨服係邮腦） 吸濕膨脹係數（Cho)均為相同的值。亦即吸濕膨脹係數 Τ^ημ)及吸濕膨脹係數（cH0)之測定用樣本為共通。 •樹脂層全體之測定用樣本的製作 、 以上述化學姓刻處理，從可撓性金屬層疊體將金屬層 去除，而製作出測定用樣本。 比較例4 •可撓性金屬層疊體的製作 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 厚度：9_的粗化處理面上分2次塗佈樹月旨溶液b，使其 318060 49 1290094 取終處理後成為4〇μηα的厚度，於13(rc下進行1〇分鐘的 加熱乾燥而獲得樹脂層B。 之後於氮氣環境下一邊從3〇它升溫至3〇〇ac —邊進行 18^、柃的熱處理，並於3〇〇。〇下進行！小時的熱處理，而 獲知全树脂層的總厚度為4〇μιη之可撓性金屬層疊體。 •吸濕膨脹係數（cHM)測定用樣本、吸_脹係數（Ch〇)測 疋用樣本的製作 與下列樹脂層全體之測定用樣本的製作相同，將金屬 #t去除’而製作出測定用樣本。測定用樣本的大小為縱 70mmx橫 70mm。 於樹脂層由1種的層所構成時’吸濕膨脹係數“) 及吸〉絲膨騰係數（Ch〇)均為；I：日[51 Μ Λ 口 、 V 马相冋的值。亦即吸濕膨脹係數 (cHM)及吸濕膨脹係數（Ch〇)之測定用樣本為共通。 •樹脂層全體之測定用樣本的製作 藉由上述化學蝕刻處理，你卜；十、a mβ 彳上述可撓性金屬層疊體將 金屬層去除，而製作出測定用樣本。 笔較例5 •可撓性金屬層疊體的製作 於電解銅箔（商品名稱·· USI Ρ、α 士 + 4 彿UbLP、日本電解社（日本 厚度的粗化處理面上分2次塗佈樹脂溶液c，使 最終處理後成為15μιη的厚度，於13代下進行w八 加熱乾燥而獲得樹脂層C。 刀、里 之後於氛氣ϊ衣境下一邊你3 π y „ 兄「达仗3〇C升溫至3〇(Γ(： — 18小時的熱處理，並於3〇〇〇c下！隹;?- t τ 士 L下進仃1小時的熱處理， 318060 50 1290094 撓性金屬層疊體。 吸濕、膨脹係數（cH0)測 獲付全樹脂層的總厚度為1 5 之可 •吸濕膨脹係數（CHM)測定用樣本、 定用樣本的製作 樣本的製作相同，將金屬 測定用樣本的大小為縱 與下列樹脂層全體之測定用 層去除，而製作出測定用樣本。 70mmx橫 70mm。 於樹脂層由1種的層所構成時’吸濕膨脹係數 及吸濕膨脹係數（CHG)均為相同的值。亦即吸濕膨服係數 〖CHM)及吸濕膨脹係數（Ch〇)之測定用樣本為共通。 •樹脂層全體之測定用樣本的製作 以上述化學姓刻處理，從可撓性金屬層疊體將金屬層 去除，而製作出測定用樣本。 比較例6 •可撓性金屬層疊體的製作 於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 ^度：9_的粗化處理面上分2次塗佈樹脂溶^，使其 I終處理後成為4GMm的厚度，於13(rc下進行1()分鐘的 加熱乾燥而獲得樹脂層F。 之後於氮氣環境下-邊從3(rc升溫至3〇〇。〇一邊進行 1M、時的熱處理，並於綱。c下進行i小時的熱處理，而 獲得全樹脂層的總厚度為4一之可撓性金屬層疊體。 —吸祕脹係數（cHM)敎用樣本、吸濕膨脹係數⑹。)測 定用樣本的製作 ，、下列树知層全體之測定用樣本的製作相同，將金屬 318060 51 1290094 層加以去除，而製作出測定用樣本。測定用樣本的大小為 縱 70mmx橫 70mm。 於樹脂層由1種的層所構成時’吸濕膨脹係數（Chm) 及吸濕膨脹係數（CH0)均為相同的值。亦即吸渴膨服係數 ' (ChM)及吸濕膨服係數（Ch〇)之測定用樣本為通。 •樹脂層全體之測定用樣本的製作 以上述化學蝕刻處理，從可撓性金屬層疊體將金屬層 去除，而製作出測定用樣本。 較例7 •可撓性金屬層疊體的製作 於電解銅箔（商品名稱：USLP、日本電解社（日本）製、 厚度：9μιη)的粗化處理面上塗佈樹脂溶液a，使其最終處 理後成為30μΐη的厚度，於13(TC下進行1〇分鐘的加熱$ 燥而獲得樹脂層A。 繼之將樹脂溶液F塗佈於樹脂層A上使其最終處理後 ^為1〇μΐη的厚度，於12(rc下進行5分鐘的加熱乾燥而獲C is heated to 3 Torr (TC is heat-treated for 3 hours under heat treatment for 18 hours. 3 〇 () C • Preparation of a sample for measurement of the entire resin layer: Strict: The above chemical etching treatment, from a flexible metal In the laminate, the metal layer was removed to prepare a sample for measurement. It was 318060 48 1290094 Comparative Example 3 • The flexible metal laminate was fabricated on an electrolytic copper foil (product name·· USI p. The roughening treatment surface of uAp, Sakamoto Electrolysis Co., Ltd., Japan, and 9μηι) is divided into 2 final treatments of m μ Yue, which is the thickness of 40 μm. (The resin layer A is obtained by heating and drying at rc for 1 minute. Then, under the nitrogen atmosphere, the heat treatment is carried out from the temperature to the cleavage, and the heat treatment is carried out at 300 t:, and the heat treatment of 仃1 is small, and _ The thickness of the resin layer of the Shiwang resin layer is 40, and the flexible metal layer is a body. The sample for the measurement of the constant deviation, the sample of the moisture absorption expansion system "η.), the sample for the measurement of the sample, and the sample for the measurement of the entire resin layer. Make the same, remove the metal ^ ^ make 敎Sample. The size of the sample for the sample is 70 mm for the vertical 7〇imnx. When the resin layer is composed of the layer of the seed, the hygroscopic expansion coefficient (Cho) is the same value. The sample for measurement of the coefficient of hygroscopic expansion and the coefficient of hygroscopic expansion (cH0) is common. • Preparation of a sample for measurement of the entire resin layer, treatment with the above chemical name, and metal from the flexible metal laminate The measurement sample was prepared by the removal of the layer. Comparative Example 4: The flexible metal laminate was produced in an electrolytic copper box (trade name: USLP, Japan Electrolysis Co., Ltd., Japan, thickness: 9_ roughened surface) The coating solution b was applied twice in two times, and the thickness of the coating was 318060 49 1290094, and the thickness was 4〇μηα, and the resin layer B was obtained by heating and drying at 13 (rc) for 1 minute. Then, under a nitrogen atmosphere. While heating from 3 〇 to 3 〇〇 —, the heat treatment of 18^, 柃 is carried out, and at 3 〇〇. The heat treatment is carried out for an hour, and the total thickness of the entire resin layer is 4 〇 μιη Metal laminates • Moisture expansion coefficient (cHM) The sample for measurement and the sample for the measurement of the coefficient of absorption and contraction (Ch〇) are prepared in the same manner as the sample for measurement of the entire resin layer, and the sample for measurement is removed to produce a sample for measurement. The size of the sample for measurement is Vertical 70mmx horizontal 70mm. When the resin layer is composed of one layer, the 'hygroscopic expansion coefficient') and the suction and silk expansion coefficient (Ch〇) are both; I: day [51 Μ Λ mouth, V horse phase 冋The value of the measurement, that is, the measurement coefficient of the coefficient of hygroscopic expansion (cHM) and the coefficient of hygroscopic expansion (Ch〇) are common. • The measurement sample for the entire resin layer is prepared by the above chemical etching treatment. a mβ 彳 The flexible metal laminate was removed from the metal layer to prepare a sample for measurement. Example 5: Preparation of flexible metal laminate in electrolytic copper foil (product name · USI Ρ, α 士 + 4 佛 UbLP, Japan Electrolytic Society (Japan thickening treatment surface is divided into two coating resins) The solution c is made to have a thickness of 15 μm after the final treatment, and is heated and dried under the 13th generation to obtain the resin layer C. After the knife and the inside, in the atmosphere, you are 3 π y „ 兄 “达仗 3〇 C is heated to 3 〇 (Γ (: 18 hours of heat treatment, and under 3〇〇〇c! 隹;?- t τ 士 士 L 仃 1 hour heat treatment, 318060 50 1290094 flexible metal laminate. Wet and expansion coefficient (cH0) The total thickness of the entire resin layer is 15 • The sample for the measurement of hygroscopic expansion coefficient (CHM) is the same as the sample for the sample for the fixed sample, and the size of the sample for metal measurement is used. In the longitudinal direction and the measurement layer of the entire resin layer, the measurement sample was removed to prepare a sample for measurement. 70 mm x 70 mm. When the resin layer was composed of one type of layer, both the hygroscopic expansion coefficient and the hygroscopic expansion coefficient (CHG) were The same value, ie moisture absorption coefficient (CHM) and hygroscopic expansion coefficient (Ch〇) The sample for measurement is common. • The sample for measurement of the entire resin layer was processed by the above chemical name, and the metal layer was removed from the flexible metal laminate to prepare a sample for measurement. - The production of the flexible metal laminate is carried out in an electrolytic copper box (product name: USLP, manufactured by Nippon Seika Co., Ltd., Japan), and the resin is melted twice in a roughened surface. After the final treatment, the thickness was 4 GMm, and the resin layer F was obtained by heating and drying at 13 (rc) for 1 () minutes. Then, the temperature was raised from 3 (rc to 3 Torr in a nitrogen atmosphere). Heat treatment at the time, and heat treatment for 1 hour under the condition of c., to obtain a flexible metal laminate having a total thickness of the entire resin layer of 4. One-time absorption coefficient (cHM), sample, moisture absorption expansion Coefficient (6).) For the preparation of the sample for measurement, the measurement samples for the entire tree layer were prepared in the same manner, and the layer of metal 318060 51 1290094 was removed to prepare a sample for measurement. The size of the sample for measurement was 70 mm in length and 70 mm in width. The resin layer is composed of one layer The hygroscopic expansion coefficient (Chm) and the hygroscopic expansion coefficient (CH0) are the same values. The sample for measuring the thirst swelling coefficient (ChM) and the moisture absorption coefficient (Ch〇) is • Preparation of a sample for measurement of the entire resin layer The metal layer was removed from the flexible metal laminate by the above chemical etching treatment to prepare a sample for measurement. Comparative Example 7 • Production of a flexible metal laminate The resin solution a was applied to the roughened surface of the electrolytic copper foil (trade name: USLP, manufactured by Nippon Seika Co., Ltd., thickness: 9 μm), and was finally treated to a thickness of 30 μΐ, and was carried out at 13 (TC). After a few minutes of heating, the resin layer A was obtained. Then, the resin solution F was applied onto the resin layer A to have a thickness of 1 〇μΐη after final treatment, and heat-dried at 12 (rc for 5 minutes).

樹脂層F。 X 之後於氮氣環境下一邊從3(TC升溫至3〇〇&lt;t —邊進行 1M、時的熱處理，並於3〇〇。〇下進行j小時的熱處理，而 獲得全樹脂層的總厚度為40μηΐ2可撓性金屬層疊體。 及/愚％脹係數（cHM)測定用樣本的製作 S於電解銅箱（商品名稱：USLP、日本電解社（日本）製、 厚度.9μιη)的粗化處理面上塗佈樹脂溶液A，使其最故處 理後成為卿m的厚度，於13〇。〇下進行1〇分鐘的加熱乾 318060 52 1290094 燥而獲得樹脂層。之後於氮氣 3，-邊進行料時的孰;^二—f從3代升溫至 時的熱處理。 ’、、、處理，亚於30(TC下進行h、 知之以與上述相同之介星 厗 蝕刻處理將電解銅箔（金屬 層）去除，而獲得測定樣本。測定 橫7〇_。 ]疋用樣本的大小為縱70mmx •吸濕膨脹係數（cH0)測定用樣本的製作 於電解㈣（商品名稱：USLP、林電解社（日本❻、 _度· 9_)的粗化處理面上塗佈，樹脂溶液F並於⑽ 鐘的加熱乾燥’並使乾燥後的厚度成為1 一 佈’而獲得樹脂層。之後於氮氣環境下 3〇t升溫至300〇C—邊進扞]8 , R士从為老 L &amp;進仃18小時的熱處理，並於 下進仃1小時的熱處理。以此為Ch〇的樣本。 繼之以與上述相同之化學兹刻處理將電解鋼 ㈤去除，而獲得敎樣本。測定用樣本的大小為縱7〇= 橫 70mm。 樹脂層全體之測定用樣本的製作 去除 屬層 以上述化學|虫刻處3里，從可撓性金屬層疊體將 ，而製作出測定用樣本。 曰 第5表係將實施例5至8、比較例3至7之可持性入 疊體的樹脂層的構成加以整理而顯示。 至 此外，為了說明上的簡便，係以從金屬層側開 層、第2層、第3層，並顯示該樹脂層的種類。 關於膜厚（το)、膜厚（T1)亦一同顯示於第5 I算Μ 1 318060 53 1290094 層構造所組成時，係顯示膜厚（το)=膜厚（τι)。 表中的數值為膜厚（單位：μιη)。 【第5表】 樹脂層的 種類 實施例 比較例 5 6 7 8 3 4 5 6 7 第1層 樹脂層A 8 40 30 樹脂層B 10 20 40 樹脂層C 8 15 樹脂層F 40 第2層 樹脂層A 樹脂層B 32 18 樹脂層F 30 20 10 第3層 樹脂層B 樹脂層F 14 ^樹脂層全體的厚度 (T0) 40 40 40 40 40 40 15 40 40 最外層的厚度(T1) 32 30 20 14 40 40 15 40 10 最外層/樹脂層全體 (T1/T0) 80/100 75/100 50/100 35/100 moo 麵⑴ ιοοαω νχηω 25/100 關於如此所獲得之實施例5至8、比較例3至7之可 撓性金屬層疊體的物性值測定及評估，係如下列所示者來 進行。 g可撓性金屬層疊體的評估&gt; 1.樹脂層及金屬層的線性熱膨脹係數 對於樹脂層全體之測定用樣本，係依循JIS K7197中 的平均線性膨脹係數算出方法來進行測定。 具體而言，係採用熱機械分析儀（TMA)(真空理工社 (日本）製、商品名稱·· TMA7)來進行TMA拉力測定，以從 50°C至250°C之平均線性膨脹率為線性熱膨脹係數。 谢定條件如下所示。 54 318060 1290094 樣本形狀：5mm寬xl5rnm長、初&amp;且ώ 食》i 1 5 m rn、广 重：9.8mN、升溫速度：10°c/min、測定 何 义衣丨兄條件：從當、、田 常濕環境開始升溫。測定用樣本的大 ^ ,Λ 人小為縱70mmx橫 70mm ° 「，、 &gt;自’係同樣的進行 7〇mmx橫 7〇mm。 另一方面，關於構成金屬層之金屬 線性膨脹係數。測定用樣本的大小為縱 該結果如第6表所示。 2·吸濕膨脹係數 '糟由上述所說明的方法’來測定吸 及吸濕膨脹係數（cH0)。該結果如第6表所干。糸數（Chm) 【第6表】 $ °Resin layer F. After X, the temperature was heat-treated from 3 (TC to 3 Torr) in a nitrogen atmosphere, and heat treatment was performed for 3 hours. The heat treatment was performed for 3 hours under the nitrogen atmosphere to obtain the total thickness of the entire resin layer. It is a 40 μηΐ2 flexible metal laminate. The production of a sample for measuring the coefficient of expansion (cHM) is roughened by an electrolytic copper box (product name: USLP, manufactured by Nippon Seika Co., Ltd., thickness: 9 μm). The surface of the resin solution A was applied to the surface, and the thickness of the resin solution was changed to 13 〇. The heat was dried for 1 minute and dried at 318060 52 1290094 to obtain a resin layer.孰 料 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The layer was removed and the measurement sample was obtained. The measurement was performed at 7 〇. The size of the sample used was 70 mm in length. • The sample for measuring the coefficient of hygroscopic expansion (cH0) was produced in electrolysis (4) (trade name: USLP, Lin Electrochemical Society ( Japanese ❻, _度·9_) roughened surface coated, tree The solution F was heated and dried in (10) minutes and the thickness of the dried layer was changed to 1 cloth to obtain a resin layer. After that, the temperature was raised to 300 〇C under a nitrogen atmosphere, and the temperature was increased to 300 〇. The old L & was subjected to heat treatment for 18 hours, and heat treatment was carried out for 1 hour. This was used as a sample of Ch〇. The electroless steel (5) was removed by the same chemical treatment as above, and a sample of bismuth was obtained. The size of the sample for measurement is 7 〇 = 70 mm in width. The sample for measurement of the entire resin layer is removed, and the genus layer is removed from the flexible metal laminate by the above-mentioned chemistry. 。 。 。 。 。 。 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰The side opening layer, the second layer, and the third layer are displayed, and the type of the resin layer is displayed. The film thickness (το) and the film thickness (T1) are also shown together in the 5th I Μ 1 318060 53 1290094 layer structure. , shows the film thickness (το) = film thickness (τι). The value in the table is the film thickness (unit [Table 5] Type of resin layer Example Comparative Example 5 6 7 8 3 4 5 6 7 First resin layer A 8 40 30 Resin layer B 10 20 40 Resin layer C 8 15 Resin layer F 40 2 resin layer A Resin layer B 32 18 Resin layer F 30 20 10 Third resin layer B Resin layer F 14 ^Thickness of the entire resin layer (T0) 40 40 40 40 40 40 15 40 40 Thickness of the outermost layer (T1 ) 32 30 20 14 40 40 15 40 10 Outer layer/resin layer total (T1/T0) 80/100 75/100 50/100 35/100 moo surface (1) ιοοαω νχηω 25/100 About the thus obtained Example 5 to 8. Measurement and evaluation of the physical property values of the flexible metal laminates of Comparative Examples 3 to 7 were carried out as shown below. Evaluation of the flexible metal laminate of the present invention 1. The linear thermal expansion coefficient of the resin layer and the metal layer The measurement sample for the entire resin layer was measured in accordance with the method for calculating the average linear expansion coefficient in JIS K7197. Specifically, a TMA tensile force measurement is performed using a thermomechanical analyzer (TMA) (manufactured by Vacuum Engineering Co., Ltd., trade name, TMA7) to linearize the linear expansion ratio from 50 ° C to 250 ° C. Thermal expansion coefficient. The conditions are as follows. 54 318060 1290094 Sample shape: 5mm wide xl5rnm long, initial &amp; and food" i 1 5 m rn, wide weight: 9.8mN, heating rate: 10 °c / min, determine the condition of the Yi Yi Yi brother: from the The Tian Chang wet environment began to heat up. The measurement sample is large, and the length of the sample is 70 mm x 70 mm. ",, &gt; 7 〇mm x 7 mm from the same line. On the other hand, the linear expansion coefficient of the metal constituting the metal layer. The sample size is vertical. The result is shown in Table 6. 2. The hygroscopic expansion coefficient 'badness is measured by the method described above' to measure the absorption and hygroscopic expansion coefficient (cH0). The result is as shown in Table 6. Number of turns (Chm) [Table 6] $ °

3·存儲彈性模數(E，）、玻璃轉移點（Tg) ^ ^ ^ ^ ^ ^ ^ (0rientec ^(a 声全體之°、、1^ %、·RHEQVIBRQN)，於以下條件下對樹脂 二:，疋用樣本進行3GGt：時之存儲彈性模數（E，）的 測定條件··加振頻率 數 11Hz、靜態張力·· 3 〇gf、樣 318060 55 1290094 本尺寸：〇.5mm(寬）x30mm(長度）、升温速度：10°C/min、 測定環境條件：常溫常濕環境下。 此外，同樣的亦檢測出損失係數（tan5)的最大值而求取 玻璃轉移點（Tg)。結果如第7表所示。 【第7表】 實施例 比較例 5 6 7 8 3 4 5 6 7 動 態 30(TC時之存儲彈性 模數(GPa) 1.1 1.1 1.0 2.0 1.1 1.1 4.0 0.7 1.1 黏 玻璃轉移點(Tg) (玻璃轉移溫度)Ct) 320 290 290 290 330 3320 370 290 320 彈 330 320 320 320 330 性 370 4.麵曲量 將可撓性金屬層疊體裁剪為70mm寬X 2 5 0mm長。 繼之將裁剪後的樣本放置於調整為23±5°C/20±5%(濕 度）環境之恆溫恆濕槽中，進行72小時的恆溫恆濕調整， 以此狀態為常態下的赵曲量，將金屬層的面朝上放置於平 滑的玻璃板上，而測量出輕曲為圓弧狀的樣本之距離玻璃 #的高度。 此外，將可撓性金屬層疊體放置於恆溫爐中，於空氣 中在150°C下放置24小時後，放置於調整為23 士 5°C/80±5 % (濕度）環境之恆溫恆濕槽中，進行24小時的恆溫恆濕調 整，以此狀態為150°C下放置24小時後之捲曲量。 此外並求取前者與後者的差。結果如第8表所示般。 5·覆晶接合性（内部引線（ILB性）） 於可撓性金屬層疊體的金屬層上，進行光阻塗佈、圖 56 318060 1290094 案曝光、顯像、蝕刻、防焊膜塗佈及錫鍍敷，並藉由微影 技術而形成覆晶接合用的電路圖案。將形成有此電路圖案 之:撓性印刷基板，於23°C及55%RH下放置72小時後， 以覆晶黏晶機（涉谷工業社（日本）製）來進行覆晶接合用的 電路圖案與1C的凸塊之接合。 接合時的溫度、接合時間以及接合壓力係於下列條件 下進行。 電路基板側承载台溫度：l〇〇°C _ 晶片側工具溫度·· 35(rc 接合時間：2 · 5秒 接合壓力·· 150mN/mm2 係根據下列5平估標準，來進行樹脂層外觀上的變化以 及接合部位的剖面觀察。該結果如第8表所示。 &lt;評估標準&gt; 〇·外觀上無問題，於接合部位上未產生顯 及剝離。 △ •外、硯上無問題’雖然接合部位上稍微產生樹脂的 .^入仁未產生邊緣短路及引線偏移的情況。 X:外觀上具有問題，且接合部位上產生樹脂的渗入 以及邊緣短路或是引線偏移的情況。 318060 57 1290094 【第8表】3. Storage elastic modulus (E,), glass transition point (Tg) ^ ^ ^ ^ ^ ^ ^ (0rientec ^ (a total sound of °, 1 ^ %, · RHEQVIBRQN), under the following conditions for resin II : 测定 进行 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 GG GG GG GG GG GG GG GG 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 318 X30 mm (length), temperature increase rate: 10 ° C / min, measurement environmental conditions: under normal temperature and normal humidity environment. Similarly, the maximum value of the loss coefficient (tan5) was also detected to determine the glass transition point (Tg). As shown in Table 7. [Table 7] Example Comparative Example 5 6 7 8 3 4 5 6 7 Dynamic 30 (Storage Elastic Modulus (GPa) at TC 1.1 1.1 1.0 2.0 1.1 1.1 4.0 0.7 1.1 Sticky Glass Transfer Point (Tg) (glass transition temperature) Ct) 320 290 290 290 330 3320 370 290 320 Bomb 330 320 320 320 330 Properties 370 4. Surface curl The flexible metal laminate was cut to 70 mm wide by X 2 50 mm long. Then place the cut sample in a constant temperature and humidity chamber adjusted to 23 ± 5 ° C / 20 ± 5% (humidity) environment, for 72 small The constant temperature and humidity adjustment is performed, and the state is the Zhao volume of the normal state, and the metal layer is placed face up on the smooth glass plate, and the height of the sample glass which is lightly curved is measured. The flexible metal laminate was placed in a constant temperature oven, placed in air at 150 ° C for 24 hours, and placed in a constant temperature and humidity chamber adjusted to 23 ± 5 ° C / 80 ± 5% (humidity). The constant temperature and humidity adjustment was carried out for 24 hours, and the amount of crimping after leaving it at 150 ° C for 24 hours was obtained. Further, the difference between the former and the latter was obtained. The results are shown in Table 8. 5. Flip chip bonding (internal lead (ILB)) on the metal layer of the flexible metal laminate, photoresist coating, exposure, development, development, solder masking, solder plating, and tin plating in Figure 56, 318060 1290094 A circuit pattern for flip chip bonding is formed by a lithography technique. A flexible printed circuit board having the circuit pattern formed thereon is placed at 23 ° C and 55% RH for 72 hours, and then a flip chip bonding machine is used. Valley Industrial Co., Ltd. (made in Japan) to perform circuit pattern bonding and 1C bump The bonding temperature, the bonding time, and the bonding pressure were performed under the following conditions: Circuit board side carrier temperature: l 〇〇 ° C _ Wafer side tool temperature · · 35 (rc bonding time: 2 · 5 seconds bonding Pressure··150 mN/mm2 The change in the appearance of the resin layer and the cross-sectional observation of the joint were performed according to the following five evaluation criteria. The result is shown in Table 8. &lt;Evaluation Criteria&gt; 〇 There was no problem in appearance, and no peeling occurred at the joint portion. △ • There is no problem on the outer and the cymbal. Although the resin is slightly generated on the joint, there is no edge short circuit or lead offset. X: There is a problem in appearance, and infiltration of the resin and short-circuiting of the edges or deflection of the leads occur at the joint portion. 318060 57 1290094 [Table 8]

捲曲量 (m) 23°C/20%RH ^C/80%RH 覆晶接合性(内部引線 (ILB 性)） 〇 〇 〇 •ΖΣΖ _ ^—— 比較例 —----- ~~ ~~7 -4 -3 —-2 -6 ~~7^ 1 4 13 Δ 〇 X Δ 伙以上的結果當中可媒 撓性金屬層疊體，本發明之：:目較於比較例3至7之可 疊體，該捲曲量較少且：二:至8之可撓性金屬層 ^目中可獲得良好的結果^ ⑺部引線（ILB性 曰曰 部引線_性))的結果為不良：令，復 【圖式簡單說明】 第1圖（a)k顯示本發明之可晶 剖面圖，第1圖（b)至孟屬層宜肢的一例之 明圖。（)至⑷㈣示針人位移量的測定步驟之說 .剖面第』圖係顯示本發明之可挽性金屬層疊體的其他例子 1 lb 2a 3 明圖弟3圖係顯示依據C0F黏晶機之接合方式的-例之說 r主要元件符號說明】 1C晶片 凸塊 絕緣性樹脂層 加熱具 la 主體 2 可撓性印刷基板 2b 配線 4 承載台 318060 58 1290094 10 金屬層 11 樹脂層 11a 第1試料 lib 第2試料 12 與金屬層為相反側之.面（最外面） 13 接觸面 14 第一層（與金屬層鄰接之層） 15 第二層（最外層） 20 探針 59 318060Curl amount (m) 23°C/20%RH ^C/80%RH Flip chip bonding (internal lead (ILB)) 〇〇〇•ΖΣΖ _ ^—— Comparative example—----- ~~ ~ ~7 -4 -3 -2 -6 ~~7^ 1 4 13 Δ 〇X Δ The result of the above-mentioned dielectric flexible metal laminate, the present invention:: compared with the comparative examples 3 to 7 In the stack, the amount of curl is small and: a good result is obtained in the flexible metal layer of two: to eight (^) The lead of the (7) lead (ILB-based lead wire) is defective: BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(a)k shows a crystallographic cross-sectional view of the present invention, and Fig. 1(b) shows an example of an example of a suitable limb of the Mongol layer. (4) (4) The step of measuring the displacement of the needle person. The section of the section shows other examples of the pullable metal laminate of the present invention. 1 lb 2a 3 The diagram of the 3 shows the structure according to the C0F die bonder - The example of the bonding method - the main component symbol description] 1C wafer bump insulating resin layer heating device la main body 2 flexible printed circuit board 2b wiring 4 carrier 318060 58 1290094 10 metal layer 11 resin layer 11a sample 1 lib The second sample 12 is opposite to the metal layer. The surface (outermost surface) 13 The contact surface 14 The first layer (the layer adjacent to the metal layer) 15 The second layer (the outermost layer) 20 Probe 59 318060

Claims (1)

1290094 、申請專利範圍·· 係具有金屬層以及樹脂層 其 種可撓性金屬層疊體， 特徵為： 迟树月曰層於厚度的1/2處區分為2層，以直中 為=述金屬層的接觸面側為第工試料，以其餘之部分 料=式料時’從與金屬層的接觸面刺入之上述第！試 二：針：位#!(L1) ’係較從與金屬層相反侧的面刺入 述第2試料的針人位移量(L2)還小。 鲁.tr專利範圍第1項之可撓性金屬層疊體，其中，上 位移1^1)與上述針人位移量(L2)的差之絕對值 (dL)為2μιη以上。 3.:申請專利範圍第1項之可撓性金屬層疊體，其中，從 :=述金屬層的㈣面刺人之上述樹脂層 置（L0)為10μιη以下。 4·如申請專利範圍第1項之可撓性金屬層疊體，其中，上 述樹脂層係由多數層所組成。 P ®可說眭孟屬層豐體，係具有金屬層以及形成於該金 “上之2層以上所組成之樹脂層，其特徵為： 樹脂層之最外層的吸濕膨脹係數（Ch〇)，係較樹脂 s之與金屬層接觸之層的吸㈣脹係數(c腿)還小。 .如申請專利範圍第5項之可撓性金屬層疊體，其中，樹 脂層的線性熱膨脹係數與金屬層的線性熱膨服係數的 差之絶對值係未滿ΙΟχΙΟ-6/。^。 7.如申請專利範圍第5項之可撓性金屬層疊體，其中，吸 318060 60 1290094 濕膨脹係數（cHM)與吸濕膨脹係數d的差（Ch『c⑽） 為 l〇xl(T6/%RH 以上。 8. 如申請專利範圍第5項之可撓性金屬層疊體，其中，最 外層的厚度συ與樹脂層全體的厚度（T0)之比值 (Τ1)/(Τ0)為 35/100 以上 95/100 以下。 9. 如申請專利範圍第i項或第5項之可撓性金屬層疊體， 其中，、上述樹脂層之300t時的存儲彈性模數（e,)為 Pa以上且具有3〇〇 c以上之玻璃轉移點（如。 如申請專利範圍第i項或第5項之可撓性金屬層疊體， 其t’上述樹脂層係包含可溶於有機溶劑之熱可塑性樹 脂。 請專利範圍第1項或第5項之可撓性金屬層疊體， t中，上述樹脂層係包含，從聚醯亞胺(polyimide)樹 2、聚醯胺酸亞胺（polyamideimide)樹脂、聚賴亞胺 (Polyetherimide)樹脂、及聚矽氧烷醯亞胺 (P〇iySu〇x_imide)樹脂所組成的—群當中所選出之至 &gt; 1種的樹脂。 12.2請專利範圍第1項或第5項之可撓性金屬層疊體， ^ ，上述金屬層係由金屬箔所構成。 13.t申請專利範圍第12項之可撓性金屬層疊體，其中， ::屬箱係由，從銅箱、不銹_、銘箱、及錄荡所 :成的一群當中所選出之1種以上而組成。 刷基板，其特徵為:係採用如申請專利範 圍弟1項或弟5項所記載之可撓性金屬層疊體。 318060 611290094, the scope of the patent application is a flexible metal laminate having a metal layer and a resin layer, and is characterized in that: the Chisue Mooncake layer is divided into two layers at a thickness of 1/2, and the metal is defined as The contact surface side of the layer is the first sample, and the rest of the material = the material when the material is penetrated from the contact surface with the metal layer! Test 2: Needle: Bit #! (L1) ' is smaller than the needle displacement amount (L2) of the second sample from the surface opposite to the metal layer. The flexible metal laminate according to the first aspect of the invention, wherein the absolute value (dL) of the difference between the upper displacement 1^1) and the needle displacement amount (L2) is 2 μm or more. 3. The flexible metal laminate according to the first aspect of the invention, wherein the resin layer (L0) from the (four) surface of the metal layer is 10 μm or less. 4. The flexible metal laminate according to claim 1, wherein the resin layer is composed of a plurality of layers. P ® can be said to have a metal layer and a resin layer composed of two or more layers formed on the gold, characterized by: a coefficient of hygroscopic expansion of the outermost layer of the resin layer (Ch〇) , which is smaller than the suction (four) expansion coefficient (c leg) of the layer in contact with the metal layer of the resin s. The flexible metal laminate according to claim 5, wherein the linear thermal expansion coefficient of the resin layer and the metal The absolute value of the difference between the linear thermal expansion coefficient of the layer is less than -6 -6. 7. The flexible metal laminate of claim 5, wherein 318060 60 1290094 wet expansion coefficient (cHM) The difference from the hygroscopic expansion coefficient d (Ch 『c(10)) is l〇xl (T6/%RH or more. 8. The flexible metal laminate according to claim 5, wherein the outermost layer has a thickness συ and The ratio (Τ1) / (Τ0) of the thickness (T0) of the entire resin layer is 35/100 or more and 95/100 or less. 9. The flexible metal laminate according to item i or item 5 of the patent application, wherein The storage elastic modulus (e,) at 300 t of the resin layer is not less than Pa and has a value of 3 〇〇 c or more. A transfer point of a glass (such as a flexible metal laminate according to item i or item 5 of the patent application, wherein the resin layer contains a thermoplastic resin soluble in an organic solvent. Please refer to item 1 of the patent scope or The flexible metal laminate according to item 5, wherein the resin layer comprises, from a polyimide tree 2, a polyimide imide resin, and a polyetherimide resin. And a resin selected from the group consisting of P〇iySu〇x_imide resins. 1.2 Please apply the flexible metal of item 1 or 5 of the patent scope. The laminate, ^, the above metal layer is composed of a metal foil. 13.t The flexible metal laminate of claim 12, wherein: :: a box is made from a copper box, stainless _, Ming The box and the shovel are composed of one or more selected ones of the group. The brush substrate is characterized in that the flexible metal laminate described in the first application or the fifth of the patent application is used. 318060 61