TWI276881B - Method for making glass structures for flat panel displays - Google Patents

Abstract

An assembly of rib structures sandwiched between a dielectric glass layer and a glass substrate for use in flat panel display, such as plasma addressed liquid crystal (PALC) displays, is formed by a number of methods. One method includes molding thermoplastic glass frit containing paste into rib structures, transferring the rib structures to a thin transparent layer of a thermoplastic dielectric glass frit containing composition on a drum, and transferring the rib structures with the thin transparent dielectric glass layer to a glass substrate having metallic electrodes already formed thereon.

Description

五 發明說明（1) 一、 發明所屬之技術領域： 本發明係關於平板顯示哭Μ則Η 址液晶顯示器之方法。 时，特別疋關於製造等離子定 二、 先前技術： 平板顯示器例如為液晶顯示器為ρ 4沾旦、 等離子通道以定址液晶顯示 L γ σ的。最近，使用 48961 4 9,503 63 1 7,50775 53,5272472 531 322 V i Ϊ. 1 為高線；數目ίί ί 技術產生主動定址基質以適合作 式為競以及對薄膜半導體™主動基質方 子通道平板亦稱為等離子定址液晶顯示器。 心ΐίΐ:顯不板通常由兩個平行基板所構成，其彼此 :離以，成基板間放電空間，其包含放電氣體例如為氦氣， ，X及氙/tt4 β氣體。母一基板内側表面承受一種相隔離平 行電極之圖案，在基板上電極指向垂直於另外一個基板上 電極之方向。承受於基板表面之電極通常覆蓋介電質層， 以及紅色，綠色以及藍色磷光物分離地位於在兩個基板之 一基板介電質層内侧表面上之分離區域中。介電質層為 50 0與6 0 0 °C間煆燒主成份為鉛之玻璃料，其通常決定於配 方以及所需要均勻程度而決定。所顯示圖案藉由等離子放 電形成，其藉由在氣體中施加適當的電壓於一個基板電極 與另外一個基板電極之間局部地形成。藉由氣體放電局部 地發射出紫外線將使相鄰磷光物發光。 PALC顯示器依靠相當低壓力（例如為10至1 0 0托）氣體V. DESCRIPTION OF THE INVENTION (1) 1. Field of the Invention: The present invention relates to a method of displaying a liquid crystal display by a flat panel display. In particular, the prior art relates to the manufacture of plasma. Second, the prior art: flat panel displays such as liquid crystal displays are ρ 4 smear, plasma channels to address liquid crystal display L γ σ. Recently, 48961 4 9,503 63 1 7,50775 53,5272472 531 322 V i Ϊ. 1 is the high line; the number ίί ί technology generates the active addressing matrix to suit the film and the thin film semiconductor TM active substrate square channel plate Also known as a plasma addressed liquid crystal display. The 显 ΐ 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显The inner side surface of the mother substrate is subjected to a pattern of phase-separated parallel electrodes on which the electrodes are directed perpendicular to the direction of the electrodes on the other substrate. The electrodes that are exposed to the surface of the substrate typically cover the dielectric layer, and the red, green, and blue phosphors are separately disposed in separate regions on the inner surface of a substrate dielectric layer of the two substrates. The dielectric layer is a glass frit whose main component is lead between 50 0 and 60 ° C, which is usually determined by the formulation and the degree of uniformity required. The displayed pattern is formed by plasma discharge, which is locally formed between one substrate electrode and the other substrate electrode by applying an appropriate voltage in the gas. Local emission of ultraviolet light by a gas discharge causes adjacent phosphors to emit light. PALC displays rely on relatively low pressure (eg 10 to 100 Torr) gas

1276881 五、發明說明（2) 例如為氦氣之高度非線性電子特性，其界限於平行通道中 。部份PALC顯示器100部份斷面顯示於圖1中。一對平行電 極101AC陽極）以及i〇ic(陰極）沉積於在後端玻璃板i〇ig上 之每一通道102中，形成通道底部，以及非常薄介電質層ι〇3 例如厚度約為50微米玻璃片形成通道1〇2之頂部。在細微 薄片1 0 3頂部上液晶層1 〇 4為顯示器1 〇 〇之光學主動性部份 蓋板1 0 5例如為被動性玻璃板約為1 · 1毫米為透明導電電1276881 V. INSTRUCTIONS (2) For example, the highly nonlinear electronic properties of helium, which are confined in parallel channels. A partial cross-section of a portion of the PALC display 100 is shown in FIG. A pair of parallel electrodes 101AC anodes and i〇ic (cathodes) are deposited in each of the channels 102 on the rear glass plate i ig to form a channel bottom, and a very thin dielectric layer ι 3 such as approximately A 50 micron glass sheet forms the top of the channel 1〇2. On the top of the fine sheet 1 0 3, the liquid crystal layer 1 〇 4 is the optical active portion of the display 1 〇 The cover plate 1 0 5 is, for example, a passive glass plate of about 1 · 1 mm for transparent conductive electricity.

極例如為由銦錫氧化物（I TO )所構成，其垂直於等離子通道 102而位於液晶丨04頂部。亦使用傳統偏極器1〇6，色彩滤波 器107,以及折回光線108，其類似於其他傳統液晶顯。The pole is, for example, composed of indium tin oxide (I TO ), which is perpendicular to the plasma channel 102 and located on top of the liquid crystal germanium 04. A conventional polarizer 1, 6 color filter 107, and a folded back light 108 are also used, which is similar to other conventional liquid crystal displays.

當電壓施加於透明電極時，由於並無接地面，電壓被分 隔於液晶間，細微薄片，等離子通道，以及任何其他絕緣器 加入於透明電極之間以及變為實際接地面。在實際情況’。中 ，其係指在等離子通道中並無等離子，在液晶兩端電壓降將 可忽略，以及由透明電極與等離子通道相交所界定出圖素 將不切換。不過假如足以使氣體解離氣體之電壓差值°首先 施加於等離子通道中一對電極之間，等離子形成於等離 通道中使得其變為導電性，以及構成接地面。因此，對於在 ，道頂部上圖素，電壓將隔離於液晶與細微薄片之間。此 ，加主要電壓於液晶兩端以及促使圖素產生切換。3在 :觸發等離子將促使高於通道之列被選取。由於通== 體並非導電性持續到在一對電極間達到精確地界定Z限 ，壓’除了並不選取之各列極良好地與行電壓隔離。兮、 度非線性允許大數目列被定址而不會損及對比。μ的When a voltage is applied to the transparent electrode, since there is no ground plane, the voltage is divided between the liquid crystals, fine flakes, plasma channels, and any other insulators are added between the transparent electrodes and become the actual ground plane. In the actual situation’. Medium means that there is no plasma in the plasma channel, the voltage drop across the liquid crystal will be negligible, and the pixel defined by the intersection of the transparent electrode and the plasma channel will not switch. However, if the voltage difference of the gas to dissociate the gas is first applied between a pair of electrodes in the plasma channel, the plasma is formed in the plasma channel so that it becomes conductive and constitutes a ground plane. Therefore, for the pixel on top of the track, the voltage will be isolated between the liquid crystal and the fine sheet. Therefore, the main voltage is applied to both ends of the liquid crystal and the pixel is switched. 3 at : Triggering the plasma will cause the column above the channel to be selected. Since the pass == body is not electrically conductive until the Z limit is accurately defined between the pair of electrodes, the pressures are well insulated from the row voltage except for the columns that are not selected. The 兮, degree nonlinearity allows a large number of columns to be addressed without compromising the contrast. μ

第7頁 1276881______ 五、發明說明（3) 為了防止相鄰區域間發光相互干擾以及改善該顯示器 之對比，不透明障壁版110放置於至少一個基板上（通常為 後端處）形成導電性絕緣放電小室。障壁條結構通常為週 期性的，具有例如為200微米至40 0微米間距，其決定於平板 之解析度。這些板條約為3 0 -1 0 0微米寬度以及1 〇 〇 — 2 〇 〇微 米厚度（即高度）。 可加以變化，閉合小室設計採用每一邊約為2〇〇-4〇〇微 米方形小室。形成這些方形小室板條寬度為3〇至7〇微米以 及高度為30至20 0微米。該形式等離子板說明於美國第j〇4 255638及J04075232號專利中。先前所提及平行障壁層肋 條網狀結構界限出行圖素，其能夠獨立地定址出。兩個相 互垂直網狀結構電極允許氣體解離於所選擇圖素處。由解 離氣體發射出紫外線依據所顯示影像構造促使與該圖素結 合發磷光產物區域激發。 PALC顯示器依靠使用細微薄片以將等離子與液晶隔離 。細微薄片儘可能薄（即1 · 5 -2 m i 〇,及儘可能為高介電質 常數使在兩端之電壓降減為最低。目前顯示器製造商基於 該目的使用單一單件細微薄片例如由Schott製造出3〇至5〇 微米D- 2 63細微薄片。不過，這些大型玻璃片難以製造出， 促使大型細微薄片使用性為能夠製造出PALC顯示器尺寸之 主要限制。 在過去，障壁層肋條通常由絲篩網方法或藉由喷砂去 除玻璃料沉積層製造出。因而，障壁層肋條間通道藉由雀虫 刻至基板或藉由沉積處理過程例如為網版印刷建立破璃壁Page 7 1267881______ V. Description of the Invention (3) In order to prevent mutual interference between adjacent regions and to improve the contrast of the display, the opaque barrier stencil 110 is placed on at least one substrate (usually at the rear end) to form a conductive insulated discharge chamber . The barrier strip structure is typically periodic, having a pitch of, for example, 200 microns to 40 microns, which is determined by the resolution of the panel. These plate treaties are 30-100 micron width and 1 〇 〇 2 〇 〇 micrometer thickness (ie height). It can be changed, and the closed cell design uses a square chamber of approximately 2〇〇-4〇〇 on each side. These square cell slats are formed to have a width of 3 to 7 microns and a height of 30 to 20 microns. The plasma plate of this type is described in U.S. Patent Nos. 4,255,638 and 6,040,232,232. The parallel barrier layer rib network structure previously mentioned limits the travel pixels, which can be independently addressed. Two mutually perpendicular mesh electrode electrodes allow gas to dissociate at the selected pixel. The emission of ultraviolet light from the dissociated gas promotes excitation of the phosphorescent product region with the pixel in accordance with the displayed image configuration. PALC displays rely on the use of fine flakes to isolate the plasma from the liquid crystal. The thin flakes are as thin as possible (ie 1 · 5 -2 mi 〇, and the high dielectric constant is minimized to minimize the voltage drop across the ends. Currently, display manufacturers use a single single piece of fine flakes for this purpose, for example Schott manufactures 3 to 5 micron D- 2 63 fine sheets. However, these large glass sheets are difficult to manufacture, and the use of large fine sheets is a major limitation in the size of PALC displays. In the past, barrier ribs were usually used. Manufactured by a wire screen method or by blasting to remove a frit deposit layer. Thus, the barrier layer rib interpass is engraved to the substrate by a spider or by a deposition process such as screen printing to create a glazed wall

第8頁 1276881Page 8 1276881

板於基板上而形成。不過，通道蝕刻通常產生具有圓形化 底部通道，同時累積材料以形成壁板通常將形成非垂直側 邊壁板。這些情況對光線通過平板有負面影響。除此，具 有南縱橫比之肋條結構製造通常需要多個處理步驟，包含 拋光肋條頂部以與玻璃微細薄片平坦性相匹配。 因而，需要一種方法以解決上述問題及克服已知PAlc 顯不器製造處理過程之限制。更進一步存在需要一種方法 能夠達成後側玻璃板之改良結構，以及其能夠得到具有薄 介電貝玻璃片之結構。 三 '發明内容： 本發明提供一種方法以製造平板顯示器玻璃構造。本 發明更進一步提供一種方法，其解決先前所提及問題而能 夠達成改良結構以及較低製造費用。 本公司相關美國第0 8/8 2 020 6號專利申請案揭示出細 微鑄造方法以形成障壁層肋條。本發明方法將該細微鑄造 方法加入PALC結構製造過程將克服先前已知之許多缺點以 及產生該結構製造之簡化處理過程。 依據本發明縱橫比，製造玻璃基板間肋條結構組件以 使用於等離子定址液晶顯示器中之方法包含：（a )提供一個 具有凹腔鑄模；（b )提供一種玻璃糊狀物於鑄模凹腔内以形 成肋條結構；（c )形成薄的透明玻璃層於收集滾筒上·（ ^)將 肋條結構由鑄模轉移至薄的透明玻璃層於收集滾筒上；以 及（e)將肋條結構以及薄透明玻璃層由收集滾筒轉移至玻 璃基板上。The plate is formed on the substrate. However, channel etching typically produces a circular bottom channel while accumulating material to form the wall will typically form a non-vertical side wall. These conditions have a negative impact on the light passing through the panel. In addition, the fabrication of rib structures having a south aspect ratio typically requires multiple processing steps, including polishing the top of the ribs to match the flatness of the glass flakes. Thus, a need exists for a method to address the above problems and to overcome the limitations of known PAlc display manufacturing processes. Still further, there is a need for a method for achieving an improved structure of the rear side glass sheet, and a structure capable of obtaining a thin dielectric glass sheet. SUMMARY OF THE INVENTION: The present invention provides a method for fabricating a flat panel display glass construction. The present invention still further provides a method that solves the problems mentioned previously and achieves an improved structure and lower manufacturing costs. The patent application of U.S. Patent No. 0 8/8 2 020 6 discloses a fine casting method to form barrier ribs. The method of the present invention incorporates the fine casting process into the PALC structure fabrication process to overcome many of the previously known disadvantages and to create a simplified process for the fabrication of the structure. In accordance with the aspect ratio of the present invention, a method of fabricating a rib structure component between glass substrates for use in a plasma addressed liquid crystal display includes: (a) providing a cavity mold; (b) providing a glass paste in the mold cavity Forming a rib structure; (c) forming a thin transparent glass layer on the collecting roller, (^) transferring the rib structure from the mold to the thin transparent glass layer on the collecting roller; and (e) rib structure and thin transparent glass layer Transfer from the collection roller to the glass substrate.

Π76881 五、發明說明（5) 本發明鑄模為柔軟凹刻鑄模，其由具 之材料例如為矽氧樹脂製造出。在本發明^出特性 勹^虱树脂製造出。在本發明另外一 ^ 物具有可固化，可固定或可硬化有機符接':兄中，玻璃糊狀 九女枚 心又文亿百铖黏接劑之玻璃料。 在本叙明另外一項情況中，玻螭基板 包八面。在另夕卜一個實施例中，薄的透明玻璃層 外一：為50微米或煆燒後厚度更小之玻璃。本發明另 隼穿將肋條結構藉由接觸以及冷卻由鑄模轉移至收 果/袞旖之薄的透明玻璃層上。 砂王收 頻干ΐ t:另外一項係關於提供一種製造等離子定址液晶 有 之其包含:(a)提供玻璃基板，⑻提供具 成電極处i u ^(c)提供金屬性糊狀物至鑄模凹腔以形 有凹腔ΙΪ 電極結構轉移至玻璃基板上；（d)提供具 彤&二π第一鑄拉；（f)提供玻璃糊狀物至第二鑄模凹腔以 ^ U結構；（g)形成薄層透明玻璃於收集器滾筒上；（h) 及〖、結構由第二鑄模轉移至收集器滾筒上玻璃層上；以 1將肋條結構以及薄的透明玻璃層由收集器滾筒轉移 至承栽電極玻璃基板之表面上。 本發明將由下列詳細說明為人們了解。 四 '實施方式： 本發明針對附圖所顯示實施例之範例詳細加以說明。 人們了解下列所說明實施例只作為範例性說明以及並不構Π76881 V. DESCRIPTION OF THE INVENTION (5) The mold of the present invention is a soft intaglio mold which is made of a material such as a silicone resin. In the present invention, the characteristics of the resin are produced. In the present invention, the other material has a curable, fixable or hardenable organic conformable ': brother, glass paste, nine female cores and a glass frit of a hundred million adhesives. In another case described in this description, the glass substrate is wrapped in eight sides. In still another embodiment, the thin transparent glass layer is a glass having a thickness of 50 microns or less after firing. The present invention further penetrates the rib structure by contact and cooling from the mold to the thin transparent glass layer of the receiving/twisting. Sand King is frequency-collecting t: Another is about providing a plasma-addressed liquid crystal that includes: (a) providing a glass substrate, and (8) providing a metal-containing paste at the electrode iu ^ (c) to the mold The cavity is transferred to the glass substrate by a cavity ΙΪ electrode structure; (d) providing a first casting of 彤 &π; (f) providing a glass paste to the second cavity of the mold; (g) forming a thin layer of transparent glass on the collector drum; (h) and [, the structure is transferred from the second mold to the glass layer on the collector drum; the rib structure and the thin transparent glass layer are provided by the collector roller Transfer to the surface of the glass substrate of the load-bearing electrode. The invention will be apparent from the following detailed description. Fourth Embodiments The present invention is described in detail with respect to examples of the embodiments shown in the drawings. It is understood that the examples described below are illustrative only and not

第10頁 1276881Page 10 1276881

成限制本發明任何實際構造之構思。 圖1顯示出等離子定址液晶顯示器之斷面圖，其已簡單 地說明於前面背景說明段中。一對平行電極101；^^陽極）以 及101C(陰極）沉積於在後端玻璃板iqig上之每一通道 中，例如形成通道底部，以及非常薄介電質層丨〇3例如厚度 約為50微米玻璃片形成通道i 02之頂部。在細微薄片1〇3^員 部上液晶層1 〇 4為顯示器1 〇 〇之光學主動性部份。蓋板1 〇 5 例如為被動性玻璃板約為1· i毫米為透明導電電極例如為 由銦錫氧化物（ITO)所構成，其垂直於等離子通道1〇2而位 於液晶104頂部。亦使用傳統偏極器1〇6，色彩濾波器1〇7 以及折回光線1〇8,其類似於其他傳統液晶顯示“器/不透明 肋條11 0將通道1 〇 2隔離。 圖2A至2K顯示出本發明範例性實施例方法之步驟，特 ，是經由連續性製造處理過程製造完整PALC結構之方法’。 70整PALC結構包含一個附加性介電質障壁層2 〇 2於玻 板2 0 1上。The idea of limiting any actual construction of the invention. Figure 1 shows a cross-sectional view of a plasma addressed liquid crystal display, which is briefly illustrated in the preceding background section. A pair of parallel electrodes 101; anodes) and 101C (cathodes) are deposited in each of the channels on the rear glass plate iqig, for example forming a channel bottom, and a very thin dielectric layer 丨〇3 having a thickness of, for example, about 50 The micron glass sheet forms the top of the channel i 02. The liquid crystal layer 1 〇 4 is the optically active portion of the display 1 细 在 on the fine sheet. The cover plate 1 〇 5 is, for example, a passive glass plate of about 1 mm. The transparent conductive electrode is made of, for example, indium tin oxide (ITO), which is perpendicular to the plasma channel 1〇2 and is located on top of the liquid crystal 104. The conventional polarizer 1〇6, the color filter 1〇7, and the folded back light 1〇8 are also used, which is similar to other conventional liquid crystal display “device/opaque ribs 11 0 to isolate channel 1 〇 2. Figures 2A to 2K show The steps of the method of the exemplary embodiment of the present invention, in particular, the method of manufacturing a complete PALC structure via a continuous manufacturing process. The 70-integrated PALC structure comprises an additional dielectric barrier layer 2 〇2 on the glass plate 201 .

在該範例性方法中，等離子通道結構之形成含有或並 不含有附加性玻璃料介電質障壁層2 02於玻璃基板2〇1上 其可在連續性處理過程中達成。對於該範例性方法，所使 用材料可包含：電極材料由分散於可固化有機介質金屬粉 末（例如為銀粉末分散於熱塑性蠟介質中）所構成；介電 玻璃料材料例如由分散於可固化有機介質（例如埶塑性蠟 介質）中玻璃粉末所構成，該材料為透明的；以及肋條材 由例如分散於可固化有機介質中（例如熱塑性蠟介質）破螭In this exemplary method, the formation of the plasma channel structure with or without the additional frit dielectric barrier layer 206 on the glass substrate 2〇1 can be achieved during the continuity process. For the exemplary method, the material used may include: the electrode material is composed of a metal powder dispersed in a curable organic medium (for example, a silver powder dispersed in a thermoplastic wax medium); and the dielectric frit material is dispersed, for example, by a curable organic a medium consisting of a glass powder in a medium (for example, a ruthenium plastic wax medium) which is transparent; and the rib material is broken, for example, by being dispersed in a curable organic medium (for example, a thermoplastic wax medium).

第11頁 1276881___ 五、發明說明（7) ' ------ 粉末所構成，其能夠藉由加入不透明色素產生不透明。有 用的可固化介質應該為微細可鑄造的以及藉由燃燒报容 地去除，以及包含熱塑性以及熱凝性材料。不過，熱塑性 料通常為優先採用的。 Μ 參考圖2Α，步驟1決定於所使用玻璃基板2〇][之特性， 加性介電質玻璃糊狀物2 02刮抹至玻璃基板2〇1上。破螭糊 狀物優先地包含熱塑性黏接劑材料以及能夠在塗覆破璃美 板前藉由加熱加以軟化。加入介電質層2〇2能夠在步驟3 $ 有助盈於將電極由矽氧樹脂鑄模轉移至玻璃基板中，但是 其並非必要的。除此，視介電質層2〇2組成份決定，其亦= 夠使用作為障壁層以防止金屬氧化物由電極材料擴散至破 璃基板，其可能在長期使用顯示器後使線路短路。 圖2Β中顯示之步驟2顯現出將銀電極糊狀物2〇3刮至於 凹刻鑄模2 0 4上。銀糊狀物2 0 3將形成電極於鑄模2 〇 4中凹 下或凹腔排列決定出之位置處。銀糊狀物優先地含有熱塑 性黏接劑以及能夠在塗覆於鑄模前藉由加熱加以軟化。轉 模優先地由呈現出適當釋出特性例如為矽氧樹脂柔軟材料 所構成。 圖2C所顯示之步驟3顯現出將銀電極糊狀物電極2 〇3轉 移至具有或不具有障壁層介電質之玻璃基板2〇1上，其藉由 擠壓鑄模2 0 4達成，其具有銀糊狀物電極2 0 3包含於凹腔内， 利用轉移滾軸2 0 5靠在玻璃基板2 0 1上使得電極2 〇 3與玻璃 基板2 0 1接觸以及藉由冷卻玻璃基板2 〇 1以及鑄模2 〇 4黏附 在其上面而達成。因而，在圖2D所顯示步驟4中，鑄模20 4在Page 11 1276881___ V. INSTRUCTIONS (7) ' ------ Powder consists of opaque by the addition of opaque pigments. Useful curable media should be finely castable and reproducibly removed by combustion, as well as thermoplastic and thermosetting materials. However, thermoplastics are usually preferred. Μ Referring to FIG. 2Α, step 1 is determined by the characteristics of the glass substrate used, and the additive dielectric glass paste 02 is scraped onto the glass substrate 2〇1. The crepe paste preferentially comprises a thermoplastic binder material and can be softened by heating prior to application of the glazing sheet. The addition of the dielectric layer 2〇2 can assist in transferring the electrode from the silicone resin mold to the glass substrate in step 3$, but it is not necessary. In addition, depending on the composition of the dielectric layer 2〇2, it is also used as a barrier layer to prevent metal oxide from diffusing from the electrode material to the glass substrate, which may short-circuit the line after long-term use of the display. Step 2 shown in Fig. 2A shows that the silver electrode paste 2〇3 is scraped onto the intaglio mold 204. The silver paste 2 0 3 will form the electrode at the position where the mold 2 〇 4 is recessed or the cavity arrangement is determined. The silver paste preferably contains a thermoplastic binder and can be softened by heating prior to application to the mold. The mold is preferably composed of a soft material which exhibits an appropriate release property such as a silicone resin. Step 3 shown in Fig. 2C shows that the silver electrode paste electrode 2 〇3 is transferred onto the glass substrate 2〇1 with or without the barrier layer dielectric, which is achieved by extrusion molding 2 0 4 The electrode having the silver paste 2 0 3 is contained in the cavity, and the electrode 2 5 3 is placed on the glass substrate 210 by the transfer roller 2 0 5 so as to be in contact with the glass substrate 2 0 1 and by cooling the glass substrate 2 1 and the mold 2 〇 4 adhered to it to achieve. Thus, in step 4 shown in Figure 2D, the mold 20 4 is

第12頁 1276881 五、發明說明（8) 室溫下被釋出以及移除，遺留下電極2 0 3位於玻璃基板2 01 中，其具有或不具有障壁層介電質層202。 人們了解上述說明處理過程步驟1至4能夠由任何形式 將電極印刷於含有或不含塗膜玻璃基板上而加以替代，其 包含適當處理過程，主要為光石版印刷法，網版印刷，或使 用揭示於美國第08 /82〇2 〇6號專利凹刻收集器滚筒或凹刻 鑄模之微細鑄模處理過程，其為熟知此技術者了解。 圖2E及2F所顯示之步驟5顯現出第一肋條形成步驟，其 能夠由任何範例性所顯示方式達成。圖2E顯示出第一替代 情況，使用作為肋條結構介電質玻璃糊狀物2〇7能夠依據本 公司1 9 9 9年1月25日申請之相關專利”〇paque Ribs Structures for Display panei"產生不透明，該糊狀物刮抹至鑄模2〇6 例如為柔軟凹刻鑄模内。圖2F顯示出第二替代方法，其使 用鑄模2一08位於平坦及厚網版印刷之堅硬基板2〇9上。在圖 2 F之第一替代情況中，肋條糊狀物2 〇 7經由鑄模2 〇 8細縫印 板』〇9上。在兩種替代情況中，鑄模能夠由任何 ϊϊ籌i…、能夠利用已知的技術加以圖案化以及具有 可接文之釋出特性並為熟知此技術 由矽氧樹脂所構成。 傻尤地’ ％耦 圖2 E顯示之步驟5# 優先地由石夕氧樹脂所構刻鑄模206 含有不透明色素玻璃:i，二及/璃·糊狀物2 〇 7優先地使用 能夠由玻璃料，不透明、去形成：透明。例如，糊狀物2〇7 小达月色素，以及熱塑性黏接劑所構成使得Page 12 1276881 V. INSTRUCTION DESCRIPTION (8) Released and removed at room temperature, leaving electrode 2 0 3 in glass substrate 201 with or without barrier layer dielectric layer 202. It is understood that steps 1 to 4 of the above description process can be replaced by printing the electrode on or without a coated glass substrate in any form, including appropriate processing, mainly for photolithography, screen printing, or use. The micro-molding process disclosed in U.S. Patent Application Serial No. 08/82, No. 6, No. 6, No. 6, s. Step 5, shown in Figures 2E and 2F, shows a first rib forming step that can be achieved by any of the exemplary ways shown. Figure 2E shows the first alternative, using the rib structure dielectric glass paste 2〇7 according to the company's patent application dated January 25, 1989 “〇paque Ribs Structures for Display panei" Opaque, the paste is scraped into the mold 2〇6, for example in a soft intaglio mold. Figure 2F shows a second alternative method using a mold 2-08 on a rigid substrate 2〇9 of flat and thick screen printing. In the first alternative of Fig. 2F, the rib paste 2 〇7 is passed through the mold 2 〇8 to the fine stencil 〇9. In both alternative cases, the mold can be used by any... It is patterned by known techniques and has an accommodating release characteristic and is made of a neodymium resin for the well-known technique. Stupidly, the % coupling diagram 2 E shows the step 5# preferentially by Shi Xi Oxy Resin The etched mold 206 contains opaque pigmented glass: i, bis, and glazed paste 2 〇 7 is preferentially used to be formed from a glass frit, opaque, and formed: transparent. For example, paste 2 〇 7 small moon pigment And thermoplastic adhesives make up

第13頁 1276881 五、發明說明（9) 玻璃糊狀物材料能夠在溫度些微地高於室溫例如為5 0。(：至 1 0 0 °c刮至鑄模内。 圖2F所顯示步驟5第二替代情況中，其中顯示出厚網版 印刷經由鑄模20 8到達堅硬基板之處理過程，該方法優先地 使用具有細縫厚矽氧樹脂鑄模達成網版印刷，該細縫相對 於肋條結構。該方法優於圖2E凹刻替代方法主要在於肋條 結構能夠加以填充經由厚矽氧樹脂鑄模2〇8細縫到達非常 堅硬以及平坦基板209上。此將確保所形成肋條底部完美 平坦性，因而在刮平，及達成較佳緊接轉移至玻璃基板2 〇 1 後避免負值液灣形狀，其將形成於柔軟凹刻方法中。當人 f · 們希望直接地沉積出相當厚例如為5 〇至3 〇〇微米厚度肋條 結構於顯示器版1〇〇後端平板1〇16上時，圖2F第二種其他方 法為較容易使用。 'Page 13 1276881 V. INSTRUCTIONS (9) The glass paste material can be at a temperature slightly above room temperature, for example, 50. (: to 10 ° C scraped into the mold. Figure 2F shows the second alternative of step 5, which shows the process of thick screen printing through the mold 20 8 to the hard substrate, the method is preferentially used with fine The slit thick epoxy resin mold reaches the screen printing, the slit is relative to the rib structure. The method is superior to the recessed method of Fig. 2E. The main method is that the rib structure can be filled through the thick epoxy resin mold 2〇8 slit to reach very hard And on the flat substrate 209. This will ensure perfect flatness of the bottom of the formed ribs, thus avoiding a negative liquid bay shape after smoothing and achieving a better transfer to the glass substrate 2 ,1, which will be formed in a soft intaglio In the method, when the person f wants to directly deposit a relatively thick rib structure such as 5 〇 to 3 〇〇 micron thickness on the display plate 1 〇〇 rear end plate 1 〇 16 , the second other method of FIG. 2F is It's easier to use.'

顯不於圖2G中步驟6包含對轉移滾筒21〇塗覆薄層透明 介電貝層玻璃糊狀物211，其厚度通常為15微米至5〇微米。 轉移滾筒優先地由呈現出適當釋出特性材料所構成使移除 ^覆層，不會受到損壞，或塗覆適當釋出劑或材料例如為 I乙烯笨對二曱酯薄膜。除此，玻璃糊狀物優先地包含熱 』丨生‘接9彳材料以及轉移滾軸優先地加熱至溫度為4 〇 至 ISOJC使塗覆塗膜變為容易以及保持塗膜為膠黏狀態足以 促使肋條由於接觸而由鑄模釋出以及黏附至其上面。 及2J中步驟7包含藉由滾動含有塗膜 銘5二二/鑄杈表面上將肋條結構2 0 7由鑄模20 6或207轉 s有塗膜轉移滚筒2丨〇上使得包含於鑄模凹腔内之障It is apparent that step 6 of Figure 2G comprises coating the transfer roll 21 with a thin layer of transparent dielectric shell glass paste 211 having a thickness typically between 15 microns and 5 microns. The transfer drum is preferably constructed of a material that exhibits the appropriate release characteristics to remove the coating without damage, or to coat a suitable release agent or material such as a film of ethylene diphenyl ester. In addition, the glass paste preferentially contains the thermal enthalpy of the material and the transfer roller is preferentially heated to a temperature of 4 〇 to ISOJC to make the coating film easy and to keep the coating film in a sticky state. The ribs are caused to be released from the mold by the contact and adhered thereto. And step 7 of 2J comprises transferring the rib structure 2 0 7 from the mold 20 6 or 207 to the coating film transfer roller 2 by rolling on the surface of the casting film containing the coating film 5 222 / casting enamel so as to be contained in the cavity of the casting mold Inner barrier

第14頁 」276881 五、發明說明（10) 壁層肋條接觸滾筒塗膜以及由於冷卻而黏附於其上面。肋 條結構207能夠藉由加熱至溫度4 0 0 °C至600 °c加以固結。 圖2H為步驟7其他方法，其緊接圖2E鑄造步驟，以及圖21為 步驟7其他情況緊接於圖2F鑄造步驟。圖2 J顯示出含有塗 膜轉移滾筒2 1 0具有轉移至其上面之肋條結構2 〇 7。薄的介 電質玻璃層211塗膜與肋條結構2 0 7頂部接觸。Page 14 276881 V. INSTRUCTIONS (10) The wall ribs contact the roller coating and adhere to it due to cooling. The rib structure 207 can be consolidated by heating to a temperature of 40 ° C to 600 ° C. Figure 2H shows the other method of step 7, which is followed by the casting step of Figure 2E, and Figure 21 is the other case of step 7 immediately following the casting step of Figure 2F. Fig. 2 J shows a rib structure 2 〇 7 having a transfer film transfer roller 210 having a transfer thereto. The thin dielectric glass layer 211 coating is in contact with the top of the rib structure 2 0 7 .

在顯示於圖2K步驟8中，在頂部具有薄的介電質層211 肋條結構207 (由轉移滾筒21 0)轉移至玻璃基板2〇1，其具有 或不具有障壁層20 2。藉由先前所說明處理步驟，玻璃基板 2 0 1包含電極2 〇 3以及附加上障壁層2 〇 2。 為了輔助轉移至玻璃基板2 〇 1上，特別設計電極2 〇 3對 準肋條結構2 07，薄的聚合層例如為乙基纖維素層（並未顯 示出）能夠置於玻璃201以及電極2〇3頂部以確實使肋條2〇1 轉移變為容易。該聚合物層藉由提供膠黏性表面而提高玉 層在煆燒整個結構將玻璃料熔融過程中去除。 避* ΐϊί:製”程之一些優點包含價：便宜，其由於 網；=以及光石版印刷法製造具有大的絲In a step 8 shown in Fig. 2K, a thin dielectric layer 211 rib structure 207 (by transfer roll 210 0) is transferred to the glass substrate 2〇1 with or without a barrier layer 20 2 at the top. The glass substrate 210 includes the electrode 2 〇 3 and the upper barrier layer 2 〇 2 by the processing steps previously described. In order to assist in the transfer to the glass substrate 2 ,1, the electrode 2 〇3 is specifically designed to be aligned with the rib structure 2 07, and a thin polymeric layer such as an ethyl cellulose layer (not shown) can be placed in the glass 201 and the electrode 2 The top of the 3 makes it easy to transfer the ribs 2〇1. The polymer layer enhances the removal of the jade layer during the melting of the frit by heating the entire structure by providing an adhesive surface. Avoid * ΐϊί: Some of the advantages of the system include price: cheap, because of the net; = and the lithographic printing method has a large wire

結構轉移至具有電極後端玻璃及上由於致在 處理過程解決大尺寸玻璃V細 以及使该介電質隔離層厚度減小1 浔月之而衣， 能。除此’肋條頂部與薄介電質玻璃層間生The structure is transferred to the glass with the back end of the electrode and the coating is made to solve the problem that the thickness of the large-sized glass V is reduced and the thickness of the dielectric spacer layer is reduced by one month. In addition to this, the top of the rib and the thin dielectric glass layer

第15頁 1276881Page 15 1276881

因為接觸藉由轉移處理過程達成。因而肋條頂部不再需要 拋光，其通常使用於PALC結構製造處理過程以與破璃平辦 性相匹配。 上述微細鑄模技術可使用來形成障壁層肋條以及將其 轉移至滾筒上介電質玻璃塗膜，以避免障壁層肋條材料殘 餘薄膜沉積於肋條間之介電質玻璃層上。不過，在本發明 另外一個實施例中，該問題能夠藉由如先前所說明直^地 經由厚的篩網印刷障壁層肋條至玻璃基板上，以及再塗覆 薄介電質層玻璃層於肋條頂部上而可避免。Because the contact is achieved by the transfer process. Thus, the top of the ribs no longer requires polishing, which is typically used in the PALC structure manufacturing process to match the flatness of the glass. The above micro-molding technique can be used to form the barrier ribs and transfer them to the dielectric glass coating on the cylinder to prevent residual film of the barrier rib material from depositing on the dielectric glass layer between the ribs. However, in another embodiment of the invention, the problem can be achieved by printing the barrier ribs directly onto the glass substrate via a thick screen as previously described, and recoating the thin dielectric layer of glass on the ribs. Can be avoided on the top.

在0亥方法中，具有細缝圖案之厚師網由呈現出適當可 釋出特性材料例如為矽氧樹脂薄膜所構成。薄膜沉積曰於玻 璃基板以及優先地加熱至溫度為40 °C至150 °C。含有障壁 層肋條之玻璃料糊狀物經由缔網中細縫再刮抹於玻璃基板 ^ °在冷卻後，去除圖案化篩網遺留下位於玻璃基板上之 障壁層肋條結構。為了增加該厚篩網3〇 1硬度，以及因而對 所幵y j肋條結構具有較佳尺寸控制，使用例如金屬所構成 堅，咖〜結構3 〇 2能夠***於圖案化篩網3 〇 1中如圖3 a及3 b 所不。—為了保持細縫間距例如長細縫所需要顯示器應用情 況I，薄的橋狀物3 03能夠加入而不會在刮抹操作過程中阻 礙t有糊狀物玻璃料流動至細缝。圖3B顯示出本發明範例 性貝施例橋狀結構3 〇 3。 現在說明另外一個範例性方法，其將達成介電質玻璃 J =積於肋條結構而凸出玻璃基板使等離子通道形成。在 #乾例中所說明方法顯示出使用該實施例於連續性製造過In the 0 kel method, a thick mesh having a slit pattern is composed of a material exhibiting a suitable releasable property such as a silicone resin film. The film is deposited on a glass substrate and preferentially heated to a temperature of 40 ° C to 150 ° C. The frit paste containing the barrier ribs is scraped onto the glass substrate through the slits in the web. After cooling, the barrier rib structure on the glass substrate is removed from the patterned screen. In order to increase the hardness of the thick screen 3〇1, and thus the size control of the 幵j rib structure, using, for example, a metal, the structure 32 can be inserted into the patterned screen 3 〇1. Figure 3 a and 3 b are not. - In order to maintain the spacing of the slits, such as the display application I required for long slits, a thin bridge 303 can be added without hindering the flow of the batter into the sipe during the scraping operation. Fig. 3B shows an exemplary beaked bridge structure 3 〇 3 of the present invention. Another exemplary method will now be described which will achieve dielectric glass J = accumulate in the rib structure and project the glass substrate to form a plasma channel. The method described in the # dry example shows the use of this embodiment for continuous manufacturing.

J276881____ 五、發明說明（12) " · 程為可行的，同時解決PALC製造中大尺寸玻璃細微薄片之 需求。 依據該方法，具有凸出肋條之玻璃基板最先加以處理 在介電質玻璃層沉積之前將肋條固化/堅硬化。此能夠藉 由在4 0 0 C至6 0 0 °C溫度下烘烤基板以熔融玻璃料以及去除 有機黏接劑而達成。不過假如使用來形成肋條之糊狀物含 有紫外線可固化介質，使用紫外線處理之固化通常足以使 肋條產生適當結構完整性以允許介電質層玻璃轉移而不會 使肋條變形。因而，一層含有糊狀物之介電質玻璃料塗覆 於肋條頂部將等離子通道封閉。含有介電質玻璃料層可由 適當釋出基板藉由轉移而置於肋條上。例如含有玻璃料材 料可塗覆於例如為聚乙烯苯對二甲酯薄膜上為所需要之厚 度例如為1 5微米至50微米，以及塗膜藉由接觸由釋出基板 轉移至肋條頂部上。優先地，玻璃料糊狀物包含熱塑性黏 接劑以及藉由加熱軟化使塗覆於釋出基板及藉由接觸而黏 附至肋條頂部變為容易。釋出基板在冷卻後可加以去除。 圖4示意性地顯示出一個範例性裝置以依據本發明所 說明靶例性實施例操作該方法。在該實施例中，由基板表 面上釋出基板所構成連續性移動帶4〇9通過加熱區域4〇6到 達冷卻區域4 06,其圍繞著轉移滾筒41〇以及惰輪滾轴411。 熱塑性玻璃料糊狀物4〇1藉由任何適當構件加以塗覆，但是 優先地藉由萬用刮板403形成所需要厚度層4()2。優先地厚 度層40 2約為15至50微米。當移動帶4〇9繞著轉移滾筒41() 通過時，含有材料4 02玻璃料層與向外凸出於玻璃基板412J276881____ V. INSTRUCTIONS (12) " · The process is feasible, and at the same time solves the demand for large-size glass micro-sheets in PALC manufacturing. According to this method, the glass substrate having the raised ribs is first treated to cure/harden the ribs prior to deposition of the dielectric glass layer. This can be achieved by baking the substrate at a temperature of 400 ° C to 600 ° C to melt the glass frit and remove the organic binder. However, if the paste used to form the ribs contains an ultraviolet curable medium, curing using ultraviolet treatment is generally sufficient to impart proper structural integrity to the ribs to allow the dielectric layer to migrate without deforming the ribs. Thus, a layer of a dielectric frit containing a paste is applied to the top of the rib to enclose the plasma channel. The layer containing the dielectric frit may be placed on the rib by transfer of the appropriately released substrate. For example, the glass frit containing material may be applied to, for example, a polyethylene benzotriene film to a desired thickness of, for example, 15 to 50 μm, and the coating film is transferred from the release substrate to the top of the rib by contact. Preferably, the frit paste comprises a thermoplastic binder and is softened by heating to facilitate application to the release substrate and adhesion to the top of the rib by contact. The released substrate can be removed after cooling. Fig. 4 schematically shows an exemplary apparatus for operating the method in accordance with the illustrative exemplary embodiment of the invention. In this embodiment, the continuous moving belt 4〇9 formed by the substrate on the surface of the substrate passes through the heating region 4〇6 to reach the cooling region 060, which surrounds the transfer drum 41〇 and the idler roller 411. The thermoplastic frit paste 4〇1 is coated by any suitable means, but the desired thickness layer 4()2 is preferably formed by the squeegee 403. The preferential thickness layer 40 2 is approximately 15 to 50 microns. When the moving belt 4〇9 passes around the transfer drum 41(), it contains the material 2020 glass layer and protrudes outward from the glass substrate 412.

1276881_____ 五、發明說明（13) 之障壁層肋條40 5頂部40 4接觸，其朝著箭頭A下方移動。冬 玻璃料層通過冷卻區域4 0 8，其固化及黏附至障壁廣肋條$ 4 0 4頂部。當移動帶繞著惰性滾軸41 1通過時，含有玻璃'料 層402由移動帶4 09表面釋出以及轉移至肋條結構。 熟知此技術者了解製造以及使用本發明之方式已p w 附圖揭示於上述所說明之優先實施例中。 ％者1276881_____ V. Shielding ribs 40 5 of the invention description (13) The top 40 4 contacts, which move downwards under the arrow A. The winter glass layer passes through the cooling zone 408, which solidifies and adheres to the top of the barrier ribs $4 0 4 . When the moving belt passes around the inert roller 41 1 , the glass containing layer 402 is released from the surface of the moving belt 409 and transferred to the rib structure. Those skilled in the art are aware of the manner in which the invention is made and the manner in which it is used. The drawings are disclosed in the preferred embodiments described above. %By

種可硬化或固化材料例如為對紫 人/ ，改善， 例： 本發明 是，雖然 施例中， 外線靈敏性材料。 1276881 圖式簡單說明 五、附圖簡單說明： 斷面圖(圖n顯示出等離子定址液晶(PALC)顯示器之 圖2A)至第二子圖(圖2K)顯示出*發明配製 ”、、員不裔乾例性實施例方法之步驟。 第三甲圖（圖3Α)至第三乙圖（圖3Β)顯示出提供太疏叫 範例性實施例金屬蕊心以及橋接結構。 八 第四圖（圖4 )顯示出一種範例性裝置以操作本發 例性實施例之方法。 附圖元件數字符號說明： 顯示器100;電極ΗΙΑ,ΙΟΚ;玻璃板i〇1G;通道102; 介電質層1 0 3 ;液晶層1 〇 4 ;蓋板1 〇 5 ;偏極器1 〇 6 ;濾波器 1 〇 7 ;光線1 〇 8 ;肋條11 〇 ;玻璃基板2 0 1 ;障壁層2 0 2 ;電極 2 〇 3 ;鑄模2 0 4 ;滾軸2 0 5 ;鑄模2 0 6 ;肋條結構2 0 7 ;鑄模 2〇8;基板20 9;滾筒210 ;玻璃層21 1 ;篩網301 ;心蕊結構 3〇2 ;橋狀物3 0 3 ;糊狀物40 1 ;玻璃層402 ;萬用刮板403 ; 頂部4 0 4 ;肋條4 0 5 ;加熱區域4 0 6 ;冷卻區域4 0 8 ;移動帶 4〇9 ;轉移滚筒41 0 ;惰輪滾軸411 ;玻璃基板412。The hardenable or curable material is, for example, improved against purple/, for example: The present invention is, although in the embodiment, an external sensitive material. 1276881 Brief description of the diagram 5. Brief description of the drawing: Sectional view (Figure n shows the plasma-addressed liquid crystal (PALC) display in Figure 2A) to the second sub-picture (Figure 2K) shows the *invention preparation", Steps of the method of the exemplary embodiment. The third figure (Fig. 3A) to the third figure B (Fig. 3A) show the metal core and the bridge structure of the exemplary embodiment provided too sparse. 4) An exemplary device is shown to operate the method of the present exemplary embodiment. The components of the drawing are illustrated by the numeral: display 100; electrode ΗΙΑ, ΙΟΚ; glass plate i〇1G; channel 102; dielectric layer 1 0 3 Liquid crystal layer 1 〇4; cover plate 1 〇5; polarizer 1 〇6; filter 1 〇7; light 1 〇8; rib 11 〇; glass substrate 2 0 1 ; barrier layer 2 0 2 ; electrode 2 〇 3; mold 2 0 4; roller 2 0 5; mold 2 0 6; rib structure 2 0 7; mold 2〇8; substrate 20 9; drum 210; glass layer 21 1; screen 301; core structure 3〇 2; bridge 3 0 3; paste 40 1; glass layer 402; universal scraper 403; top 4 0 4; ribs 4 0 5; heating zone 4 0 6; cooling zone 4 0 8; 〇9; transfer roll 410; idler rollers 411; 412 glass substrate.

第19頁Page 19

Claims (1)

J276881 ^ 六、申請專利範圍1 1 '種沉積介電質破璃層於凸屮谈絲 方法，該方法包含·· '凸出玻璃基板肋條結構上之 由含有玻璃料糊狀物艰+ 條結構具有外露之頂部^面.条結構於基板表面上，該肋 對肋條結構加熱至溫度為400 1至 沉積經標定含有可因π人 c， 面上； ；丨電貝玻璃料組成份層於釋出表 將釋出基板上介雷暂士志 接觸；以及 電質玻璃組成份層與肋條結構頂部表面 移除釋出基板。 2物：ί Π ί利範圍第1項之方法，其中含有玻璃料糊狀 物由熱塑性黏接劑所構成。 料组：：：ί利1&圍第2項之方法，其中含有介電質玻璃 "、、、成伤由熱塑性黏接劑所構成。 4古=據申請專利範圍第3項之方法，其中肋條結構在與含 有”電質玻璃料接觸前加熱至4〇。〇：至15()。(：。 5 ·依據申請專利範圍第1項之方法，其中含有介電質玻璃 料組成份標定層厚度為15微米至50微米。 6:依據申請專利範圍第3項之方法，其中含有介電質玻璃 料層在障壁層肋條結構接觸前加熱至40 °C至150 °C。 了·依據申請專利範圍第1項之方法，其中形成肋條結構於 基板上包含： 沉積含有可固化玻璃料糊狀物進入鑄模凹下處，其相對 於所需要肋條結構位置與形狀；J276881 ^ VI. Application for Patent Range 1 1 'A method for depositing a dielectric virgin layer in a ridged wire method, the method includes ·· 'The protruding glass substrate rib structure is composed of a frit containing a glass frit The exposed top surface is provided on the surface of the substrate, and the rib is heated to a temperature of 400 1 to the rib structure until the deposition is calibrated to contain π human c, the surface; The surface will release the temporary contact with the medium on the substrate; and the constituent layer of the electro-optic glass and the top surface of the rib structure are removed to release the substrate. 2: The method of item 1, wherein the glass frit paste is composed of a thermoplastic adhesive. The material group::: ί利 1 & The method of the second item, which contains a dielectric glass ",, and the wound is composed of a thermoplastic adhesive. 4古 = According to the method of claim 3, wherein the rib structure is heated to 4 前 before contact with the "electric frit. 〇: to 15 (). (: 5) According to the scope of claim 1 The method comprises the dielectric frit component having a calibration layer thickness of 15 micrometers to 50 micrometers. 6: The method according to claim 3, wherein the dielectric frit layer is heated before the barrier layer rib structure contacts According to the method of claim 1, wherein the rib structure is formed on the substrate: depositing a paste containing the curable glass frit into the concave portion of the mold, which is required as needed Rib structure position and shape; 第20頁 1276881_ 六、申請專利範圍 將可固化糊狀物固化以形成肋條結構； 將肋條結構在其可黏附條件下與基板接觸· p 移除鑄模。 ，u及 8·依據申請專利範圍第7項之方法，其中含 料糊狀物由玻璃料及熱塑性黏接劑所構成。ϋ固化玻璃 %依據申請專利範圍第7項之方法，其中肋 玻璃基板上而不會形成含有玻璃料糊狀殘 y ； 之間。 狀物殘餘薄膜於肋條 ίο.依據申請專利範圍第2項之方法，其中該鑄模包含· 要产辟ί具有細縫圖案化玻璃基板頂部上，其相對於所需 要Ρ早壁層肋條位置處。 、々曰耵於所而 專利範圍第ig項之方法，其中薄膜厚度為η微 13依攄破璃料糊狀物前加熱至“^至150。0。 中第10項之方法，其中含有圖案薄膜具 薄：橋據接 ! 5 、5、、、田縫以保持細缝間距。 續性㈣第1項之方法，其中可釋出基板為連 16.依據申7專，驅動滚轴與第…^ 組成份沉積 範圍第15項之方法，其含有介電質玻璃料 在與肋條結構ί ^帶上及形成一層所需要厚度，其藉由 Η表面接觸前通過界定尺寸之開孔達成。Page 20 1276881_ VI. Scope of Application Patent The curable paste is cured to form a rib structure; the rib structure is brought into contact with the substrate under its adherable conditions. p The mold is removed. , u and 8. According to the method of claim 7, wherein the material paste is composed of a glass frit and a thermoplastic binder. ϋCuring glass % according to the method of claim 7 of the patent application, wherein the rib glass substrate is not formed to contain a frit residue y; Residual film in ribs ίο. The method according to claim 2, wherein the mold comprises a splicing pattern on the top of the glass substrate, which is located at the position of the rib of the early wall layer as needed. The method of the ig item of the patent scope, wherein the film thickness is η micro 13 摅 摅 摅 摅 糊 糊 糊 加热 加热 “ “ “ “ “ “ “ “ “ “ “ “ 150 150 150 150 150 150 150 150 第 第 第 第 第 第The film is thin: the bridge is connected! 5, 5,,, and the seam to maintain the spacing of the slits. Continuation (4) The method of item 1, wherein the substrate can be released as a connection. 16. According to Shen 7, driving the roller and the first The method of claim 15, wherein the dielectric frit is formed on the rib structure and the desired thickness of the layer is formed by the opening of the defined size before the surface of the crucible is contacted.