(1) 1276796 【發明所屬之技術領域】 本發明是有關於配線圖案檢查裝置，有關於對著利用 捲帶載體方式的TAB(Tape Automated Bonding)膠帶照射 照明光，將形成在TAB膠帶上的配線圖案，利用攝影手 段來拍攝且與基準圖案做比較，藉此自動進行外觀檢查的 配線圖案檢查裝置。 【先前技術】 半導體裝置是對應於高積體化和高密度實裝的要求， 促進引線的多針腳化和微小化。因爲有利於該多針腳化、 微小化，所以採用將半導體晶片與設置在薄膜狀的TAB 膠帶的多數引線連接的方法。 於第5圖表示製作TAB膠帶的順序。 如第5圖所示，TAB膠帶101是在厚度20〜150//m 左右（多數爲25〜75// m)、寬度35〜165mm左右的樹脂薄 膜1 02上，除了形成穿孔1 〇3之兩側周邊部外，塗佈厚度 10〜15//m左右的黏著劑1〇4，在其上如同圖（b)所示，粘 貼著銅箔等之金屬箔105。 利用曝光及蝕刻來加工該金屬箔（銅箔）1 〇5，形成配 線圖案。此時，如同圖（c)所示’不除去黏著劑這層’依 然保留。 於第6圖表示成爲如上述而形成配線圖案的TAB膠 帶的外觀。如同圖’在帶狀的膠帶（TAB膠帶）上，連續複 數的加以製作同一電路。同圖之內部的白長方形是指安裝 -4- (2) 1276796 半導體晶片的開口部（裝置孔）1 1 ο，111是指配線電路圖 案。 此種TAB膠帶101的製造工程中，必須使用配線圖 案檢查裝置來檢查配線圖案是否形成正常。 配線圖案檢查裝置是利用照明光來照明欲檢查的TAB 膠帶1 〇 1，利用攝影裝置或是目視來檢測電路圖案的狀態 (外觀），與基準圖案比較判斷所形成的圖案良否。 近年來也採用事先在檢查裝置的控制部的記憶部記憶 著基準圖案，加以比較所記憶的基準圖案和利用攝影裝置 所拍攝的實際配線圖案，自動的加以判定良否的自動檢查 裝置。 爲了拍攝圖案，對著TAB膠帶照射照明光的方法 有：採用落射光的方法和採用透過光的方法。 採用落射光的方法是從TAB膠帶的上方（形成配線的 這面）照射照明光，且從照射照明光的方向，觀察因來自 TAB膠帶的反射光的配線圖案影像，例如利用CCD攝影 元件拍攝配線圖案影像進行圖像處理。 另一方面，採用透過照明的方法是從TAB膠帶的下 方（與形成配線的這面相反的一側）進行照明，且從TAB膠 帶的上方（與照射照明光這側相反的一側）來觀察因穿透 TAB膠帶的透過光的配線圖案影像。 TAB膠帶的樹脂薄膜的材質大部分情形採用聚醯亞 胺，雖根據厚度，但穿透比500nm還長的波長的光。因 而，進行透過照明的時候’選擇包括5〇〇nm以上之波長 1276796 (3) 的光作爲照明光。 也提案（例如參照日本特許文獻1的習知例）一種採用 落射照明光和透過照明光這兩者來檢查板狀的工件。 上記日本特許文獻1所記載的是設有··照射板狀工件 之表面側的落射照明手段、和照射該工件的背面側的透過 照明手段、和拍攝利用上記落射照明手段的上記工件的反 射像（以下稱爲落射照明圖像）以及利用上記透過照明手段 的上記工件的透過像（以下稱爲透過照明圖像）的照相機， 基於工件的反射像和透過像進行工件的各種缺陷的檢查。 [曰本特許文獻1 ] 【發明內容】 [發明欲解決之課題] 配線圖案的檢查目的在於判定配線圖案是否爲以所希 望的形狀所形成，例如判定所形成的配線圖案的粗度，對 基準圖案而言，是否爲容許範圍。如果所形成的配線圖案 的粗度太粗（以下稱爲粗），就會有與相鄰的配線圖案短路 的情形’如果粗度太細（以下稱爲細），就會有斷線的情 形。 在其中一方面，也有所謂想儘量減少檢查裝置之誤檢 測的要求。 誤檢測的原因之一，有附著在基板表面或是背面上的 灰塵（異物）。如後述，如果有灰塵，被拍攝的圖像，配線 會看成粗的或是看成細的。灰塵也是不良的原因之一，不 -6 - (4) 1276796 過在後面工程多半會利用洗淨除去。於是，有所謂欲減少 光檢查配線的粗、細，習知檢查裝置的情形，如果檢查裝 置檢測配線的粗、細，會因出現警報而停止。作業員對應 於此，視真的根據目視使用監視器等來確認圖案是不良或 是誤檢測，如果是誤檢測就使裝置重新啓動（restart)。如 果誤檢測很多，檢查的效率就非常低。 於以下針對配線的粗和組以及因灰塵的誤檢測，舉具 體上的例子做說明。 例如，檢查圖案的粗、細之情形，希望利用透過照明 來檢查。此乃因以下的理由。 如第7圖所示，蝕刻銅箔等之金屬箔而形成圖案時， 所形成的圖案斷面爲梯形，如果圖案上側的寬度a與下側 的寬度b的尺寸相比，下側的寬度b變寬。此乃基於蝕刻 液從銅箔表面鈾刻到內部時的擴散和速度，很淸楚。 檢查此種圖案的情形，在落射照明，攝影元件是捕捉 反射在配線圖案之表面的光，除此以外的部分變暗黑。 因此，如第8圖（a)所示，即使配線圖案在下側與相 鄰的圖案形成短路，所拍攝的圖像會成爲沒有短路的正常 圖案被映射出來。 因而，在落射照明會有漏看不良的情形。像這樣’配 線的圖案在下側與相鄰的圖案形成短路的狀態稱爲「根部 殘留」。 另一方面，如果採用透過照明，攝影元件是捕捉穿透 樹脂薄膜的光，除此以外的部分變暗黑。 (5) 1276796 因而，如第8圖（b)所示，配線圖案如果是在下側與 相鄰的圖案形成短路，照明光就不會穿透該部分，所拍攝 的圖像會成爲粗的異常配線圖案被反映出來，因而可檢測 不良。當然因配線細小的不良也能檢測。 但是透過照明會有如下的缺點。 在基板表面或背面上附著灰塵（異物）的時候，灰塵是 不透光。因而，附著灰塵的部分變暗黑，所拍攝的圖像 中，成爲與配線粗的情形相同。因透過照明的檢查，無法 區別附著灰塵和配線粗大，附著灰塵會誤檢測爲配線粗 大。 另一方面，在落射照明，就灰塵附著在基板之背面來 看，不會因照明光反射在配線圖案的表面而產生誤檢測。 但灰塵在基板的表面，即附著在配線圖案之上的情形 下，灰塵會讓照明光形成亂反射，附著灰塵的部分變暗 黑。利用落射照明光所拍攝的圖像中，圖案影像映射出明 亮，除此以外的部分映射出暗黑，附著灰塵會誤檢測爲配 線細小。 如以上，僅利用落射照明光的檢查，或是利用透過照 明光的檢查的任一者’均沒有因附著灰麈的誤檢測，就很 難檢查配線圖案的粗、細。 如前記特許文獻1所記載，認爲如果採用落射光和透 過光，使用落射照明圖像和透過照明圖像的這者進行檢 查，就能防止上記誤檢測，不過如何使用落射照明圖像和 透過照明圖像來判定形成在前記的光透過性基板上的配線 -8 · 1276796 (6) 圖案良否並不明確。 本發明是有鑑於上記事情的發明，其目的在於提供一 種可藉由組合利用落射照明的檢查和利用反射照明的檢 查’減少誤檢測，縮短檢查時間的配線圖案的檢查裝置。 [用以解決課題之手段] 就本發明是按以下來解決上記課題。 設置由：對基板照射照明光的照明手段、和將穿透從 該照明手段被照射的該基板的透過照明光加以顯像而取得 上記基板的透過照明圖像之同時，將反射在上記基板的反 射照明光加以顯像，而取得上記基板的落射照明圖像的攝 影手段所形成的圖像取得手段。 而且，針對形成配線圖案的TAB膠帶、撓性印刷基 板等的光透過性的基板，使用透過照明來拍攝配線圖案之 同時，使用落射照明來拍攝相同部分的圖像，取得透過照 明圖像的圖案和落射照明圖像的圖案。 其次，如以下來判定基板的配線圖案良否。 (i) 將利用透過照明所拍攝的透過照明圖像的圖案與事 先記憶的第一基準圖案做比較，並進行上記透過照明圖像 的圖案檢查。 (ii) 於上記之檢查中，判定沒有缺陷良好的情形下， 其配線圖案爲良好的。 (iii) 另外，判定爲有缺陷的情形下，其缺陷爲配線細 小的情形下，其配線圖案爲不良的。另外，其缺陷部分爲 -9- (7) 1276796 配線粗大的情形下，形成不良候補，且於不良候補的部 分’將利用對應於該部分的位置的落射照明所拍攝的圖案 與事先記憶的第二基準圖案做比較進行檢查。 而且，基於利用該落射照明的檢查結果，判定利用透 過照明形成不良候補的部分良否。 例如，與第二基準圖案做比較進行檢查的結果，形成 不良候補的部分爲配線粗大的情形下，其配線圖案爲不良 的。 另外，與第二基準圖案做比較進行檢查的結果，形成 不良候補的部分爲配線細小的情形下，以透過照明圖像的 圖案檢查而判定爲配線粗大的原因，判定是因異物引起 的，配線圖案良好。 而且，與第二基準圖案做比較進行檢查的結果，在形 成不良候補的部分沒有配線粗大或配線細小的情形下，在 透過照明圖像的圖案的檢查，判定爲配線粗大的原因作爲 在圖案之下側因粗大的圖案，即判定不良。再者，此時， 在透過照明圖像的圖案的檢查，判定爲配線粗大的原因作 爲因基板的污點的圖案，也可將配線圖像判定爲良好。 於本發明中，如上記，組合利用透過照明所拍攝的透 過照明圖像的圖案的檢查和落射照明圖像的圖案的檢查， 來進行配線圖案的檢查，就能減少配線圖案的粗、細之檢 查的誤檢測。 另外，關於針對利用透過照明所拍攝的透過照明圖像 的圖案進行檢查，判定爲不良候補的配線圖案，進行對應 -10- (8) 1276796 於該配線圖案的位置的落射照明圖像的圖案的檢查’就落 射照明圖像的圖案來看，不檢查整個領域就能判定配線圖 像良否，能縮短檢查時間。 【實施方式】 [發明之實施形態] 第1圖是本發明之實施例的配線圖案檢查裝置的方塊 圖。 再者，在以下的實施例針對基板爲TAB膠帶的情形 做說明，不過本發明除TAB膠帶之外，可適用於利用透 過照明光的各種基板的檢查。 本實施例的圖案檢查裝置乃如同圖所示，具備有：由 搬送TAB膠帶5的遞送捲輪11、捲繞捲輪12等所構成的 膠帶搬送機構1〇、對著從遞送捲輪11被送出的TAB膠帶 5照射透過照明光、落射照明光且拍攝圖案5a的檢查部 1、在TAB膠帶的檢查圖案5a上掃描檢查部1的掃描手 段2、在不良的圖案加註標記的標誌部3。 標誌部3可在判定爲不良的圖案利用冲壓形成穿孔， 或是欲以目視馬上確認該部分爲不良品的方式，施以塗色 等之標記亦可。 另外，具備有：比較所拍攝的透過照明圖像圖案、落 射照明圖像圖案和屬於基準的主圖案來判斷製品良否的同 時用來控制檢查部1、掃描手段2、標誌部3以及膠帶搬 送機構1 〇之動作的控制部4。於控制部4事先輸入屬於 •11 - (9) 1276796 圖案檢查之基準的基準圖案。基準圖案有：落射照明用的 圖案和透過照明用的圖案兩種。再者，基準圖案可爲拍攝 判定爲良品的實際圖案的圖像，也可爲利用CAD資料的 圖像。 檢查部1是由：從背面側照明TAB膠帶5的兩個透 過照明手段1 a、和從表面側照明的兩個落射照明手段 1 b、欲拍攝利用經由TAB膠帶5穿透設置在與透過照明 手段la相對的位置的TAB膠帶5的照明光以及反射在 TAB膠帶5的 落射照明光形成在TAB膠帶5的電路等 的圖案5a的攝影手段lc所構成。 透過照明手段la的光源是適當選穿透TAB膠帶5之 樹脂薄膜的波長，不過本實施例是採用射出波長85 0 /zm 以上之光的LED。 攝影手段1 c是屬於在照明光之波長具有受光感度的 例如CCD直列式感測器，以下是針對攝影手段1 c採用 C CD直列式感測器的情形做說明。再者，透過照明手段 la、落射照明手段lb的光量十分大的話，取代CCD直列 式感測器，也可採用能一倂拍攝檢查圖案全面的CCD感 測器。 掃描手段2是在TAB膠帶5的檢查圖案5a上，在同 圖的紙面左方向掃描CCD直列式感測器1 c、透過照明手 段1 a和落射照明手段1 b，得到TAB膠帶5的全體圖像。 再者，利用掃描手段2的掃描方向可爲同圖紙面的前 後方向，此時，上記透過照明手段1 a、落射照明手段lb -12- (10) 1276796 是配置爲以c C D直列式感測器1 C的光軸當作軸心而旋轉 90°的狀態。 第2圖是表示本發明之實施例的配線圖案的檢查的判 定演算機構的流程圖，邊參照同圖邊針對本實施例的配線 圖案之檢查做說明。 如前記第6圖所示，在TAB膠帶5連續複數加以製 作同一配線圖案，控制部4是驅動膠帶搬送機構10，將 TAB膠帶5搬送到檢查部5。 一旦成爲TAB膠帶5之檢查對象的檢查圖案5a藉由 前記膠帶搬送機構1〇被搬送到檢查部1的特定位置， TAB膠帶5即停止在該位置。 利用透過照明手段la從TAB膠帶5的下方（未設配 線圖案的這方）照射照明光。然後，利用上記掃描手段2 在同圖的紙面左右方向掃描透過照明手段1 a、落射照明 手段1 b、CCD直列式感測器1 c。藉此，從上記透過光照 明手段la射出的照明光會穿透TAB膠帶5而在CCD直 列式感測器lc受光，檢查圖案5a的圖像會被取入到CCD 直列式感測器1 c(第2圖的步驟S 1 )。 在C CD直列式感測器1 c受像的圖像，有配線圖案的 部分爲暗黑，除此以外的部分映射出明亮。以該圖像爲透 過照明圖像而記憶在控制部4。 其次，利用落射照明手段1 b，從TAB膠帶5的上方 (設有配線圖案的這方）針對相同領域而照射照明光，利用 掃描手段2來掃描透過照明手段1 a、落射照明手段〗b、 -13- (11) 1276796 c C D直列式感測器1 c。再者，如果掃描到與拍攝上記透 過照明圖像之際的掃描方向相反的方向，檢查部1就會回 到原來的位置。 c CD直列式感測器1是指來自TAB膠帶5的反射光 加以受光，將檢查圖案5a的圖像取入到CCD直列式感測 器lc(第2圖的步驟S2)。所受像的圖像係圖案部分會反 射照明光而變明亮，除此以外的部分映射出暗黑。 使上記圖像明暗反轉，當作落射照明圖像而記憶在控 制部4(第2圖的步驟S3)。 再者，明暗反轉的理由乃如下所述。 在透過照明圖像和落射照明圖像，乃如上述，明暗爲 相反。在後面的工程，比較利用透過照明的圖像和利用落 射照明的圖像之時，像是暗黑的部分爲存在圖案的部分， 合乎明暗就很容易比較。 其次，控制部4是比較所記憶的透過照明圖像和透過 照明用的基準圖案，透過照明圖像的配線圖案是針對基準 圖案而進行是否在特定尺寸之範圍內的檢查（步驟S4)。 於第3圖表示檢查方法之一例。如同圖所示，在每個 特定的間隔（5求得配線圖案之寬度wl、w2、w3、…，將 配線的寬度與基準圖案的寬度做比較。 例如，相對於基準圖案的寬度爲± 3 0%以上者屬於 「粗大」或「細小」的不良。以下，像這樣的檢查稱爲圖 案的細小及粗大的檢查。 然後，對應於上記檢查的結果，如下判定配線圖案之 -14- (12) 1276796 良否。 (a) 沒有細小及粗大的（沒有缺陷）情形，所檢查的配線 圖案判定爲良品，從步驟S5前行至步驟S 1 5。此時，配 線圖案爲良品，搬送TAB膠帶5，並將屬於下一個檢查對 象的檢查圖案5a送到檢查部1，進行下一次的配線圖案 的檢查。 (b) 有缺陷的情形，對應其缺陷爲細小或粗大，進行 如以下⑴或（ii)的判定。 (i)有細小的情形 透過照明圖像的配線圖案之寬度比特定尺寸的範圍更 細的時候，其原因是配線不能有缺陷。 因而，判定所檢查的配線圖案爲配線缺陷的不良品 (步驟S7)，記憶該配線圖案的位置，其配線圖案送到第！ 圖所示的標誌部3的時候，附加上不良標記（步驟S 1 3)， 前行到步驟S 1 5。 於第4圖（a)表示配線細小時的透過照明圖像之一 例。再者，於同圖亦表示落射照明圖像，不過此時不使用 落射照明圖像就能判定。 (Π)有粗大的情形 透過照明圖像的配線圖案的寬度比特定尺寸的範圍還 大的時候，所檢查的配線圖像判定爲不良候補。然後，從 步驟S 6前行至步驟S 8，記憶包括不良候補之配線圖案之 有粗大的部分的領域A的位置。 接著，比較對應於上記領域A的位置的周邊的特定 -15- (13) 1276796 範圍（例如在CCD照相機lc的受像面，半徑10像素的範 圍）的落射照明圖像的圖像和落射照明用的基準圖案的相 同位置的圖像，進行細小及粗大的檢查。 此檢查的結果，與利用透過照明圖像的檢查結果同樣 地，檢測爲粗大的時候（步驟S 1 0 )，判定配線圖案有可能 會因粗大產生短路的不良品（步驟S 1 2 )，從步驟S 1 2前行 至步驟S 1 3，如前記，事先記憶該配線圖案的位置，該配 線圖案被送到第1圖所示的標誌部3時，附加上不良標 記。 於第4圖（b)表示在透過照明圖像檢測出粗大，即使 落射照明圖像也同樣地，檢測出粗大時的透過照明圖像和 落射照明圖像之一例。 同時，與利用透過照明圖像的檢查結果相反地，檢測 出細小的時候（步驟S 1 )，因透過照明圖像之粗大的原因， 判定爲圖案上的「異物」（步驟S 1 4)，配線圖像判定爲良 品，如前記前行至步驟S 1 5，搬送TAB膠帶5，並將屬於 下一次的檢查對象的檢查圖案5a送到檢查部1，進彳了下 一次的配線圖案檢查。 其理由，如上記，圖案上有灰塵的時候，在透過照明 圖像檢測爲粗大，在落射照明圖像檢測爲細小。 於第4圖（c)表示在透過照明圖像檢測出粗大，在落 射照明圖像檢測出細小時的透過照明圖像和落射照明圖像 之一例。 而且，未檢測出粗或細的時候’因透過照明圖像產生 -16- (14) 1276796 粗大的原因，在圖案下側變粗大（根部殘留）引起的（步驟 s 1 2)，配線圖像判定爲不良品，前行至步驟S丨3，如前 記，於該配線圖案附加上不良標記。 於第4圖（d)表示在透過照明圖像檢測出粗大，在落 射照明圖像檢查不出粗或細時的透過照明圖像和落射照明 圖像之一例。 再者’上記實施例的判定演算機構爲其中一例，亦可 進行其它判定。 例如，利用透過照明的檢查中，因存在於前記第5圖 所示的銅箔剝離後的接著劑層之表面的微小凹凸產生亂反 射，在透過照明圖像產生污點、斑點。此時也如第4圖 (d)，在透過照明圖像，於第2圖的步驟6中，檢查出粗 大’於步驟1 0及1 1中，並未在落射照明圖像檢查出粗或 細。 像這樣，在有污點、斑點的基板的情形下，接著於步 驟12中，該污點、斑點會誤檢爲配線粗大，判斷爲不 良。 像這樣的情形，上記實施例未檢查粗或細之情形的步 驟1 2的判定，以經由「透過照明圖像引起粗大的原因成 爲接著劑層之污點、斑點，配線圖案判定爲良品，向步驟 1 5行進。此乃如果使用落射照明，就能等到不影響接著 劑層之表面狀態的圖像。 上述判定演算機構可對應如果屬於檢查對象的基板之 狀態，在配線圖案有不良的可能性之情形下，將此等全部 -17- (15) 1276796 應對於不良與是否處理等之利用者的要求而做適當的選 擇。 如上記，在本實施例，利用透過照明圖像開始進行檢 查，在透過照明圖像針對不良候補的部分，利用落射照明 圖像進行檢查，像這樣就能縮短檢查時間。 其理由乃如下所述。 (1) 利用透過照明的檢查，未在配線圖案檢測出粗或 細的時候，就能判斷爲良品，不需要利用落射照明的檢 查。 一方面，即使利用落射照明的檢查未檢測出粗或細， 還是有根部殘留的時候，就需要利用透過照明的檢查。 (2) 利用透過照明的檢查，在配線圖案有細小的情 形，就能判斷爲不良品，不需要利用落射照明的檢查。 一方面，即使利用落射照明的檢查檢測出細小，會有 因圖案上之灰塵的誤檢測的可能性，就需要利用透過照明 的檢查。 (3) 實際上，進行檢查的配線圖案多爲良品。因而， 如本實施例，可能不良（不良候補的）配線圖案是由於判定 爲因灰塵等的誤檢測或真的不良，進行利用落射照明的檢 查就很有效。 再者’在上記實施例，針對設置一個攝影手段（C C D 照相機）的情形做說明，不過可以分別設置：拍攝透過照 明圖像的攝影手段、和拍攝落射照明圖像的攝影手段。同 時，將攝影手段設置在TAB膠帶的兩側，就能利用一個 •18- (16) 1276796 照明手段的照明光，取得透過照明圖像和落射照明圖像。 [發明效果] 如以上說明，於本發明中，可得到以下效果。 (1) 組合利用透過照明拍攝的透過照明圖像之圖案的 檢查、和利用落射照明拍攝的落射照明圖像的檢查，來判 疋配線圖案之良否，就能減少誤檢查配線圖案之粗、細的 檢查。 (2) 針對利用透過照明拍攝的透過照明圖像之圖案進 行檢查，關於判定爲不良候補的配線圖案，進行對應於該 配線圖案之位置的上記落射照明圖像之圖案的檢查，來判 定配線圖像之良否，就能縮短檢查時間。 而且，藉由對應屬於檢查對象的基板而適當選擇判定 演算機構，加上配線圖案的粗、細，進行有無異物的判 定’同時也能藉由基板上有無污點、根部殘留等來檢查異 常等。 【圖式簡單說明】 第1圖是本發明之實施例的配線圖案檢查裝置的方塊 圖。 第2圖是表示本發明之實施例的配線圖案的檢查的判 定演算機構的流程圖。 第3圖是表示配線圖案的檢查方法之其中一例的圖。 第4圖是表示細、粗、有異物等之時的透過照明圖像 -19 - (17) 1276796 和落射照明圖像之其中一例的圖。 第5圖是表示TAB膠帶之構造的其中一例的圖。 第6圖是表示形成圖案的TAB膠帶之例的圖。 第7圖是飩刻銅箔等的金屬箔而形成圖案時，所γ _ 的圖案之斷面的圖。 第8圖是說明作爲照明光採用落射光時，漏看 良的圖。(1) 1276796 [Technical Field] The present invention relates to a wiring pattern inspection device, which relates to a wiring formed on a TAB tape by irradiating illumination light against a TAB (Tape Automated Bonding) tape using a tape carrier method. A pattern, a wiring pattern inspection device that automatically captures an appearance inspection by photographing and comparing it with a reference pattern. [Prior Art] The semiconductor device is required for high integration and high-density mounting, and facilitates multi-pinning and miniaturization of leads. Since it is advantageous for the multi-pinning and miniaturization, a method of connecting a semiconductor wafer to a plurality of leads provided on a film-like TAB tape is employed. Figure 5 shows the sequence of making TAB tape. As shown in Fig. 5, the TAB tape 101 is formed on the resin film 102 having a thickness of about 20 to 150/m (mostly 25 to 75/m) and a width of about 35 to 165 mm, except that the perforations 1 to 3 are formed. An adhesive 1〇4 having a thickness of about 10 to 15/m is applied to the outside of the peripheral portions on both sides, and a metal foil 105 such as a copper foil is attached thereto as shown in Fig. 2(b). The metal foil (copper foil) 1 〇 5 was processed by exposure and etching to form a wiring pattern. At this time, as shown in Fig. (c), the layer of "the adhesive is not removed" remains. Fig. 6 shows the appearance of a TAB tape which is formed into a wiring pattern as described above. As in the figure 'on a strip of tape (TAB tape), the same circuit is continuously made in plural. The white rectangle inside the same figure refers to the opening (device hole) of the -4- (2) 1276796 semiconductor wafer. 1 1 ο, 111 refers to the wiring circuit pattern. In the manufacturing process of such a TAB tape 101, it is necessary to check whether or not the wiring pattern is formed normally by using a wiring pattern inspection device. The wiring pattern inspection device illuminates the TAB tape 1 〇 1 to be inspected by illumination light, and detects the state (appearance) of the circuit pattern by a photographing device or a visual inspection, and judges whether the formed pattern is good or not in comparison with the reference pattern. In recent years, an automatic inspection device that automatically stores a reference pattern in a memory portion of a control unit of the inspection device and compares the stored reference pattern with an actual wiring pattern captured by the imaging device is automatically used. In order to photograph a pattern, a method of illuminating the illumination light against the TAB tape includes a method of emitting light and a method of transmitting light. The method of emitting the light is to irradiate the illumination light from above the TAB tape (the side on which the wiring is formed), and to observe the wiring pattern image of the reflected light from the TAB tape from the direction in which the illumination light is irradiated, for example, to photograph the wiring by using a CCD imaging element. The pattern image is image processed. On the other hand, the method of transmitting illumination is to illuminate from the lower side of the TAB tape (the side opposite to the side on which the wiring is formed), and to observe from above the TAB tape (the side opposite to the side on which the illumination light is irradiated). The wiring pattern image of the transmitted light that penetrates the TAB tape. The material of the resin film of the TAB tape is mostly polyimide, and it penetrates light of a wavelength longer than 500 nm depending on the thickness. Therefore, when the illumination is transmitted, light having a wavelength of 1276796 (3) of 5 〇〇 nm or more is selected as the illumination light. It is also proposed (for example, refer to the conventional example of Japanese Patent Laid-Open Publication No. 1) that a plate-shaped workpiece is inspected by using both of the epi-illumination light and the transmission illumination light. As described in Japanese Patent Laid-Open Publication No. 1, it is described that an epi-illumination means for illuminating the surface of the plate-like workpiece, a transillumination means for irradiating the back side of the workpiece, and a reflection image of the upper workpiece by the above-described epi-illumination means are provided. (hereinafter referred to as an epi-illumination image) and a camera that transmits a transmission image of a workpiece (hereinafter referred to as a transmission illumination image) by the illumination means, and examines various defects of the workpiece based on the reflection image and the transmission image of the workpiece. [Problems to be Solved by the Invention] The purpose of the inspection of the wiring pattern is to determine whether or not the wiring pattern is formed in a desired shape, for example, to determine the thickness of the wiring pattern to be formed, and to Whether the pattern is an allowable range. If the thickness of the formed wiring pattern is too thick (hereinafter referred to as coarse), there is a case of short-circuiting with the adjacent wiring pattern. 'If the thickness is too thin (hereinafter referred to as thin), there will be a disconnection. . On the other hand, there is also a requirement to minimize the false detection of the inspection device. One of the causes of erroneous detection is dust (foreign matter) attached to the surface of the substrate or the back surface. As will be described later, if there is dust, the image to be photographed, the wiring will be regarded as thick or thin. Dust is also one of the causes of bad, not -6 - (4) 1276796 Most of the work in the future will be removed by washing. Therefore, there is a case where it is desired to reduce the thickness and thickness of the optical inspection wiring, and the conventional inspection apparatus is used. If the inspection apparatus detects the thickness of the wiring, it will stop due to an alarm. In response to this, the operator confirms whether the pattern is defective or falsely detected by visual observation using a monitor or the like, and restarts the device if it is erroneously detected. If there are many false detections, the efficiency of the inspection is very low. The following is an example of the rough and the wiring of the wiring and the false detection of dust. For example, check the coarse and fine patterns of the pattern, and it is desirable to check with the transmitted illumination. This is for the following reasons. As shown in Fig. 7, when a metal foil such as a copper foil is etched to form a pattern, the formed pattern has a trapezoidal cross section, and if the width a of the upper side of the pattern is smaller than the size of the width b of the lower side, the width b of the lower side is b. Widening. This is based on the diffusion and velocity of the etchant from the uranium engraved on the surface of the copper foil, which is very difficult. In the case of examining such a pattern, in the epi-illumination, the photographic element captures light reflected on the surface of the wiring pattern, and the other portions become dark. Therefore, as shown in Fig. 8(a), even if the wiring pattern is short-circuited with the adjacent pattern on the lower side, the captured image becomes a normal pattern in which no short circuit is mapped. Therefore, in the case of epi-illumination, there is a case where the leakage is poor. The state in which the pattern of the wiring is short-circuited to the adjacent pattern on the lower side is referred to as "root residue". On the other hand, if transmissive illumination is used, the photographic element captures light that penetrates the resin film, and the other portions become dark. (5) 1276796 Therefore, as shown in Fig. 8(b), if the wiring pattern is short-circuited with the adjacent pattern on the lower side, the illumination light does not penetrate the portion, and the captured image becomes a rough abnormality. The wiring pattern is reflected and thus can be detected poorly. Of course, it can be detected because of poor wiring. However, there are the following disadvantages through lighting. When dust (foreign matter) is attached to the surface or the back surface of the substrate, the dust is opaque. Therefore, the portion to which the dust adheres is darkened, and the captured image is the same as the case where the wiring is thick. Due to the inspection through the illumination, it is impossible to distinguish the attached dust and the wiring from being large, and the attached dust may be erroneously detected as a large wiring. On the other hand, in the case of epi-illumination, dust adheres to the back surface of the substrate, and erroneous detection is not caused by the illumination light being reflected on the surface of the wiring pattern. However, in the case where the dust is on the surface of the substrate, i.e., adhered to the wiring pattern, the dust causes the illumination light to be disorderly reflected, and the portion to which the dust adheres becomes dark. In the image captured by the epi-illumination light, the pattern image is brightly lit, and the other portions are dark, and the attached dust is erroneously detected as a small line. As described above, it is difficult to check the thickness and thinness of the wiring pattern by using only the inspection of the epi-illumination light or the inspection using the illumination light without any erroneous detection of the adhesion of the ash. As described in the aforementioned Patent Document 1, it is considered that if the epi-illumination image and the transmitted illumination image are used, it is possible to prevent the erroneous detection by using the epi-illumination image and the transmission-illuminated image, but how to use the epi-illumination image and the transmission The illumination image is used to determine the wiring formed on the light-transmitting substrate -8. 1276796 (6) The pattern is not clear. The present invention has been made in view of the above-described invention, and an object of the invention is to provide an inspection apparatus capable of reducing the erroneous detection and reducing the inspection time by combining the inspection using the epi-illumination and the inspection using the reflective illumination. [Means for Solving the Problem] The present invention solves the above problems as follows. An illumination means for illuminating the substrate with illumination light and a transmission illumination light for penetrating the substrate illuminated by the illumination means to obtain a transmission illumination image of the substrate, and reflecting the substrate on the substrate The image obtaining means formed by the imaging means for obtaining the epi-illumination image of the substrate is reflected by the reflected illumination light. In addition, a light transmissive substrate such as a TAB tape or a flexible printed circuit board on which a wiring pattern is formed is used to capture a wiring pattern by using illumination, and an image of the same portion is captured by epi-illumination to obtain a pattern of the transmitted illumination image. And the pattern of the projected illumination image. Next, the quality of the wiring pattern of the substrate is determined as follows. (i) The pattern of the transmitted illumination image captured by the illumination is compared with the first reference pattern previously memorized, and the pattern inspection of the transmitted illumination image is performed. (ii) In the above-mentioned inspection, if it is determined that there are no defects, the wiring pattern is good. (iii) In addition, when it is judged that there is a defect, if the defect is that the wiring is small, the wiring pattern is defective. In addition, the defective portion is -9-(7) 1276796. When the wiring is thick, the candidate candidate is formed, and the portion of the defective candidate is the pattern captured by the epi-illumination corresponding to the position of the portion and the memory recorded in advance. The two reference patterns are compared for inspection. Then, based on the inspection result by the epi-illumination, it is determined whether or not the portion where the defective candidate is formed by the illumination is good or not. For example, when the inspection is performed in comparison with the second reference pattern, the portion where the defective candidate is formed is a wiring having a large wiring, and the wiring pattern is defective. In addition, when the inspection is performed in comparison with the second reference pattern, the portion where the defect candidate is formed is determined to be a cause of coarse wiring due to the pattern inspection of the transmitted illumination image, and the wiring is determined to be caused by foreign matter. The pattern is good. In addition, when the inspection is performed in comparison with the second reference pattern, when the portion where the defect candidate is formed is not thick or the wiring is small, the inspection of the pattern of the transmitted illumination image is determined as the reason why the wiring is thick. The lower side is judged to be defective due to the coarse pattern. In this case, it is determined that the wiring is large due to the pattern of the stain on the substrate, and the wiring image can be judged to be good. In the present invention, as described above, by combining the inspection of the pattern of the transmitted illumination image captured by the illumination and the inspection of the pattern of the epi-illumination image, the inspection of the wiring pattern can be performed, and the thickness and fineness of the wiring pattern can be reduced. Misdetection of the inspection. In addition, regarding the inspection of the pattern of the transmission illumination image captured by the transmission illumination, it is determined that the wiring pattern of the candidate candidate is a pattern of the epi-illumination image corresponding to the position of the wiring pattern at -10- (8) 1276796. Checking 'With regard to the pattern of the projected illumination image, it is possible to determine whether the wiring image is good or not without checking the entire field, and the inspection time can be shortened. [Embodiment] [Embodiment of the Invention] Fig. 1 is a block diagram of a wiring pattern inspection device according to an embodiment of the present invention. Further, in the following embodiments, the case where the substrate is a TAB tape will be described. However, the present invention can be applied to inspection of various substrates using the illumination light in addition to the TAB tape. As shown in the figure, the pattern inspection device of the present embodiment includes a tape conveyance mechanism 1 that is constituted by a delivery reel 11 that conveys the TAB tape 5, a winding reel 12, and the like, and is opposed to the delivery reel 11 The TAB tape 5 that has been sent out irradiates the inspection unit 1 that transmits the illumination light, the projection illumination light, and the imaging pattern 5a, and the scanning means 2 that scans the inspection unit 1 on the inspection pattern 5a of the TAB tape, and the marker portion 3 that is marked with a defective pattern. . The mark portion 3 may be formed by punching a pattern determined to be defective, or may be visually confirmed that the portion is a defective product, and may be marked with a color or the like. Further, the present invention is configured to control the inspection unit 1, the scanning means 2, the indicator portion 3, and the tape conveying mechanism while comparing the captured illumination image pattern, the epi-illumination image pattern, and the main pattern belonging to the reference to determine the quality of the product. 1 The control unit 4 of the action. The control unit 4 inputs a reference pattern belonging to the reference of the pattern inspection of •11 - (9) 1276796 in advance. The reference pattern includes two types of patterns for epi-illumination and patterns for illumination. Further, the reference pattern may be an image in which an actual pattern judged to be good is taken, or an image using CAD data. The inspection unit 1 is composed of two transmission illumination means 1a that illuminate the TAB tape 5 from the back side, and two projection illumination means 1b that are illuminated from the front side, and are intended to be imaged by penetration through the TAB tape 5. The illumination light of the TAB tape 5 at the position where the means la is opposed and the imaging means lc which is reflected on the pattern 5a of the circuit of the TAB tape 5 such as the epi-illumination light of the TAB tape 5 are formed. The light source that has passed through the illumination means 1a is a wavelength that appropriately selects the resin film that penetrates the TAB tape 5, but in this embodiment, an LED that emits light having a wavelength of 85 0 /zm or more is used. The photographing means 1 c is a CCD in-line type sensor which has a light-sensing sensitivity at the wavelength of the illumination light. Hereinafter, a case where the C CD in-line sensor is used for the photographing means 1 c will be described. Further, if the amount of light transmitted through the illumination means la and the epi-illumination means 1b is extremely large, instead of the CCD in-line type sensor, a CCD sensor capable of taking a comprehensive inspection pattern can be used. In the scanning means 2, on the inspection pattern 5a of the TAB tape 5, the CCD in-line sensor 1c, the illumination means 1a, and the epi-illumination means 1b are scanned in the left direction of the paper surface of the same figure, and the whole figure of the TAB tape 5 is obtained. image. Furthermore, the scanning direction by the scanning means 2 can be the front-rear direction of the same drawing surface. At this time, the above-mentioned transmission illumination means 1a and the epi-illumination means lb -12-(10) 1276796 are configured to be in-line sensing by c CD. The optical axis of the device 1 C is rotated by 90° as an axis. Fig. 2 is a flowchart showing a determination calculation means for inspecting a wiring pattern according to an embodiment of the present invention, and an inspection of the wiring pattern of the present embodiment will be described with reference to the same drawing. As shown in the sixth drawing, the TAB tape 5 is continuously formed in the same wiring pattern, and the control unit 4 drives the tape transport mechanism 10 to transport the TAB tape 5 to the inspection unit 5. When the inspection pattern 5a to be inspected by the TAB tape 5 is conveyed to the specific position of the inspection unit 1 by the tape conveyance mechanism 1〇, the TAB tape 5 is stopped at this position. The illumination light is irradiated from below the TAB tape 5 (the side where the wiring pattern is not provided) by the illumination means la. Then, the transmission illumination means 1a, the epi-illumination means 1b, and the CCD in-line sensor 1c are scanned by the above-described scanning means 2 in the left-right direction of the drawing. Thereby, the illumination light emitted from the above-described light illumination means 1a passes through the TAB tape 5 and is received by the CCD inline sensor lc, and the image of the inspection pattern 5a is taken into the CCD inline sensor 1c. (Step S 1 of Fig. 2). In the image of the image received by the C CD in-line sensor 1c, the portion having the wiring pattern is dark, and the other portions are bright. The image is stored in the control unit 4 as an illuminating image. Next, the epi-illumination means 1b is used to illuminate the illumination light from the upper side of the TAB tape 5 (the side where the wiring pattern is provided), and the scanning means 2 is used to scan the transmission illumination means 1a, the projection illumination means Bb, -13- (11) 1276796 c CD in-line sensor 1 c. Further, if the scanning direction is opposite to the scanning direction in which the illumination image is photographed, the inspection unit 1 returns to the original position. The c-inline sensor 1 refers to the reflected light from the TAB tape 5, and receives the light, and takes the image of the inspection pattern 5a into the CCD in-line sensor lc (step S2 of Fig. 2). The portion of the image pattern of the image received reflects the illumination light and becomes bright, and the other portions are dark. The upper and lower images are inverted in the light and dark, and are stored in the control unit 4 as an epi-illumination image (step S3 in Fig. 2). Furthermore, the reason for the light and dark reversal is as follows. In the illumination image and the epi-illumination image, as described above, the light and dark are opposite. In the latter project, when comparing the image through the illumination and the image using the projection illumination, the portion that is dark is the portion where the pattern exists, and it is easy to compare with the light and dark. Next, the control unit 4 compares the stored transmitted illumination image with the reference pattern for transmission illumination, and the wiring pattern that transmits the illumination image is an inspection for whether or not the reference pattern is within a specific size (step S4). An example of the inspection method is shown in Fig. 3. As shown in the figure, the width of the wiring is compared with the width of the reference pattern at each specific interval (5 to find the width w1, w2, w3, ... of the wiring pattern. For example, the width of the reference pattern is ± 3 0% or more is a problem of "thickness" or "smallness." Hereinafter, such inspection is called a small and coarse inspection of the pattern. Then, corresponding to the result of the above inspection, the wiring pattern is determined as follows -14 1276796 Good or not. (a) There is no small and coarse (no defect), and the checked wiring pattern is judged to be good. From step S5 to step S15. At this time, the wiring pattern is good, and the TAB tape 5 is transported. The inspection pattern 5a belonging to the next inspection target is sent to the inspection unit 1 to perform inspection of the next wiring pattern. (b) In the case of a defect, the defect is small or coarse, and the following (1) or (ii) is performed. (i) When there is a small case, the width of the wiring pattern passing through the illumination image is thinner than the range of the specific size, because the wiring cannot be defective. Therefore, the inspection is determined. When the pattern is a defective product of the wiring defect (step S7), the position of the wiring pattern is memorized, and when the wiring pattern is sent to the indicator portion 3 shown in Fig. 3, a defective flag is added (step S1 3), and the line is advanced. Step S1 5. Fig. 4(a) shows an example of a transmission illumination image with a small wiring. Further, the same figure also shows an epi-illumination image, but this can be determined without using an epi-illumination image. (Π) In the case where the width of the wiring pattern of the illumination image is larger than the range of the specific size, the checked wiring image is determined to be a defective candidate. Then, the process proceeds from step S6 to step S8. The memory includes the position of the field A having the thick portion of the wiring pattern of the defective candidate. Next, the specific -15-(13) 1276796 range corresponding to the position of the position of the above-mentioned field A is compared (for example, on the image receiving surface of the CCD camera lc, The image of the same position of the epi-illumination image and the reference pattern for the epi-illumination in the range of 10 pixels in radius are examined in a small and coarse manner. The result of this inspection is compared with the use of the transmitted illumination image. Similarly, when the detection result is coarse (step S1 0), it is determined that there is a possibility that the wiring pattern may be short-circuited due to coarsening (step S1 2 ), and step S 1 2 is advanced to step S 13 . As described above, the position of the wiring pattern is memorized in advance, and when the wiring pattern is sent to the indicator portion 3 shown in Fig. 1, a defective flag is added. In Fig. 4(b), coarseness is detected in the transmitted illumination image. Similarly, in the case of the epi-illumination image, an example of the transmitted illumination image and the epi-illumination image when the image is large is detected. At the same time, when the detection result is small by the inspection result of the transmission illumination image (step S1) It is determined that the "foreign matter" on the pattern is caused by the coarseness of the illumination image (step S1 4), and the wiring image is judged to be good. If the pre-recording proceeds to step S15, the TAB tape 5 is transported, and The inspection pattern 5a belonging to the next inspection object is sent to the inspection unit 1, and the next wiring pattern inspection is performed. The reason is as follows. When there is dust on the pattern, the image is detected to be coarse in the transmitted illumination image, and is detected as small in the epi-illumination image. Fig. 4(c) shows an example of a transmitted illumination image and an epi-illumination image in which a large size is detected through the illumination image and a small amount of time is detected in the epi-illumination image. Moreover, when it is not detected that the thickness is thin or thin, it is caused by the thickening of the lower side of the pattern (the root remains) due to the coarseness of the -16 (14) 1276796 generated by the illumination image (step s 1 2), the wiring image If it is determined to be defective, the process proceeds to step S3, and as described above, a defective mark is added to the wiring pattern. Fig. 4(d) shows an example of a transmitted illumination image and an epi-illumination image when the transmission illumination image is detected to be coarse and the projection illumination image is not thick or thin. Further, the determination calculation means of the above embodiment is an example, and other determinations may be made. For example, in the inspection by the transmission illumination, the fine concavities and convexities on the surface of the adhesive layer which has been peeled off after the copper foil peeled off in the fifth drawing shown in Fig. 5 are scattered, and stains and spots are generated in the transmitted illumination image. At this time, as shown in Fig. 4(d), in the transmission of the illumination image, in step 6 of Fig. 2, the coarseness is checked. In steps 10 and 1 1, the coarseness of the illumination image is not detected. fine. In the case of a substrate having stains or spots, in the case of the step 12, the stains and spots are erroneously detected as large wiring, and it is judged to be defective. In such a case, the determination of the step 1 2 in the case where the embodiment is not checked for the thick or thin is described as "a stain or a spot of the adhesive layer caused by the transmission of the illumination image, and the wiring pattern is judged to be good. When the epi-illumination is used, it is possible to wait for an image that does not affect the surface state of the adhesive layer. The above-described determination calculation means can correspond to the state of the substrate to be inspected, and the wiring pattern may be defective. In this case, all of the -17-(15) 1276796 should be appropriately selected for the requirements of the user who is defective or not, etc. As described above, in the present embodiment, the inspection is started by using the transmitted illumination image. When the illumination image is used for the defective candidate, the inspection is performed by the epi-illumination image, and the inspection time can be shortened. The reason is as follows. (1) The inspection of the transmitted illumination does not detect the roughness of the wiring pattern. When it is fine, it can be judged as a good product, and it is not necessary to use the inspection of the epi-illumination. On the one hand, even if the inspection using the epi-illumination is not used When measuring thick or thin, or when there is residual root, it is necessary to use the inspection through the illumination. (2) Using the inspection of the transmitted illumination, if the wiring pattern is small, it can be judged as defective, and it is not necessary to use the epi-illumination. On the one hand, even if the inspection using the epi-illumination is small, there is a possibility of erroneous detection of dust on the pattern, and it is necessary to use the inspection of the transmitted illumination. (3) Actually, many wiring patterns are inspected. Therefore, as in the present embodiment, it is determined that the wiring pattern which is defective (bad candidate) is determined to be erroneously detected due to dust or the like, and it is effective to perform inspection using the epi-illumination. For example, a case where a photographing means (CCD camera) is provided will be described, but it may be separately provided: photographing means for photographing the illumination image, and photographing means for photographing the epi-illumination image. Meanwhile, the photographing means is set on the TAB tape. On both sides, you can use the illumination light of a •18- (16) 1276796 illumination to get through the illumination image and fall [Effect of the Invention] As described above, in the present invention, the following effects can be obtained: (1) Combining inspection of a pattern of a transmitted illumination image captured by illumination, and an epi-illumination diagram by an epi-illumination In the inspection of the image, it is possible to reduce the thickness and fine inspection of the wiring pattern by erroneously checking the wiring pattern. (2) Checking the pattern of the transmitted illumination image captured by the transmission illumination, and determining that it is a defective candidate In the wiring pattern, the inspection of the pattern of the epitaxial illumination image corresponding to the position of the wiring pattern is performed, and the inspection time is determined by determining whether or not the wiring image is good or not. Further, the determination is made by appropriately selecting the substrate to be inspected. The calculation mechanism adds the thickness and thinness of the wiring pattern to determine whether or not there is a foreign matter. At the same time, it is possible to check for abnormality by the presence or absence of stains on the substrate, residue at the roots, and the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram of a wiring pattern inspection device according to an embodiment of the present invention. Fig. 2 is a flowchart showing a determination calculation means for checking the wiring pattern in the embodiment of the present invention. Fig. 3 is a view showing an example of a method of inspecting a wiring pattern. Fig. 4 is a view showing an example of a transmission illumination image -19 - (17) 1276796 and an epi-illumination image when thin, thick, or foreign matter is present. Fig. 5 is a view showing an example of the structure of a TAB tape. Fig. 6 is a view showing an example of a patterned TAB tape. Fig. 7 is a view showing a cross section of a pattern of γ _ when a metal foil such as a copper foil is engraved and patterned. Fig. 8 is a view for explaining a good leak when the incident light is used as the illumination light.
[主要元件對照表] 1 檢查部 la 透過照明手段 lb 落射照明手段 1 c 攝影手段（C CD直列式感測器） 2 掃描手段 3 標誌部 4 控制部 5 • TAB膠帶 5a 檢查圖案 10 膠帶搬送機構 11 遞送捲輪 12 捲繞捲輪[Main component comparison table] 1 Inspection unit la Through illumination means lb Falling illumination means 1 c Photographing means (C CD in-line sensor) 2 Scanning means 3 Marking part 4 Control part 5 • TAB tape 5a Inspection pattern 10 Tape conveying mechanism 11 delivery reel 12 winding reel
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