TWI272149B - Laser scanning apparatus and methods for thermal processing - Google Patents
Laser scanning apparatus and methods for thermal processing Download PDFInfo
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- TWI272149B TWI272149B TW094101534A TW94101534A TWI272149B TW I272149 B TWI272149 B TW I272149B TW 094101534 A TW094101534 A TW 094101534A TW 94101534 A TW94101534 A TW 94101534A TW I272149 B TWI272149 B TW I272149B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Recrystallisation Techniques (AREA)
- Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/787,664 US7154066B2 (en) | 2002-11-06 | 2004-02-26 | Laser scanning apparatus and methods for thermal processing |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200528223A TW200528223A (en) | 2005-09-01 |
TWI272149B true TWI272149B (en) | 2007-02-01 |
Family
ID=35025552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094101534A TWI272149B (en) | 2004-02-26 | 2005-01-19 | Laser scanning apparatus and methods for thermal processing |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4001602B2 (ko) |
KR (1) | KR100722723B1 (ko) |
TW (1) | TWI272149B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI503873B (zh) * | 2011-11-04 | 2015-10-11 | Applied Materials Inc | 使用微透鏡陣列而產生線路之光學設計 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5105903B2 (ja) * | 2007-02-28 | 2012-12-26 | 住友重機械工業株式会社 | レーザアニール装置及びアニール方法 |
US20090114630A1 (en) * | 2007-11-05 | 2009-05-07 | Hawryluk Andrew M | Minimization of surface reflectivity variations |
US20090181553A1 (en) * | 2008-01-11 | 2009-07-16 | Blake Koelmel | Apparatus and method of aligning and positioning a cold substrate on a hot surface |
US20090278287A1 (en) | 2008-05-12 | 2009-11-12 | Yun Wang | Substrate processing with reduced warpage and/or controlled strain |
EP2210696A1 (en) * | 2009-01-26 | 2010-07-28 | Excico France | Method and apparatus for irradiating a semiconductor material surface by laser energy |
US7947968B1 (en) | 2009-01-29 | 2011-05-24 | Ultratech, Inc. | Processing substrates using direct and recycled radiation |
JP2011003630A (ja) * | 2009-06-17 | 2011-01-06 | Sumitomo Heavy Ind Ltd | レーザ照射装置、及びレーザ照射方法 |
KR20140062427A (ko) * | 2011-09-15 | 2014-05-23 | 니폰 덴키 가라스 가부시키가이샤 | 유리판 절단 방법 |
JP2013120936A (ja) * | 2011-12-07 | 2013-06-17 | Ultratech Inc | パターン効果を低減したGaNLEDのレーザーアニール |
US8546805B2 (en) * | 2012-01-27 | 2013-10-01 | Ultratech, Inc. | Two-beam laser annealing with improved temperature performance |
JP5902529B2 (ja) * | 2012-03-28 | 2016-04-13 | 株式会社ディスコ | レーザ加工方法 |
CN105448681B (zh) * | 2014-07-04 | 2018-11-09 | 上海微电子装备(集团)股份有限公司 | 激光退火装置 |
US10083843B2 (en) * | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
US10665504B2 (en) * | 2017-07-28 | 2020-05-26 | Veeco Instruments Inc. | Laser-based systems and methods for melt-processing of metal layers in semiconductor manufacturing |
KR102384289B1 (ko) * | 2017-10-17 | 2022-04-08 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 |
CN110047781B (zh) * | 2019-03-14 | 2021-08-24 | 云谷(固安)科技有限公司 | 激光退火设备及激光退火方法 |
WO2023203733A1 (ja) * | 2022-04-21 | 2023-10-26 | Jswアクティナシステム株式会社 | レーザ照射装置、レーザ照射方法、及び半導体デバイスの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3562389B2 (ja) | 1999-06-25 | 2004-09-08 | 三菱電機株式会社 | レーザ熱処理装置 |
US6366308B1 (en) * | 2000-02-16 | 2002-04-02 | Ultratech Stepper, Inc. | Laser thermal processing apparatus and method |
JP2002141301A (ja) | 2000-11-02 | 2002-05-17 | Mitsubishi Electric Corp | レーザアニーリング用光学系とこれを用いたレーザアニーリング装置 |
JP2002139697A (ja) | 2000-11-02 | 2002-05-17 | Mitsubishi Electric Corp | 複数レーザビームを用いたレーザ光学系とレーザアニーリング装置 |
JP2002141302A (ja) | 2000-11-02 | 2002-05-17 | Mitsubishi Electric Corp | レーザアニーリング用レーザ光学系とこれを用いたレーザアニーリング装置 |
-
2005
- 2005-01-19 TW TW094101534A patent/TWI272149B/zh not_active IP Right Cessation
- 2005-01-20 JP JP2005013256A patent/JP4001602B2/ja not_active Expired - Fee Related
- 2005-02-23 KR KR1020050014818A patent/KR100722723B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI503873B (zh) * | 2011-11-04 | 2015-10-11 | Applied Materials Inc | 使用微透鏡陣列而產生線路之光學設計 |
Also Published As
Publication number | Publication date |
---|---|
JP2005244191A (ja) | 2005-09-08 |
KR20060043106A (ko) | 2006-05-15 |
JP4001602B2 (ja) | 2007-10-31 |
TW200528223A (en) | 2005-09-01 |
KR100722723B1 (ko) | 2007-05-29 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |