TWI268755B - Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof - Google Patents

Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof

Info

Publication number
TWI268755B
TWI268755B TW094108675A TW94108675A TWI268755B TW I268755 B TWI268755 B TW I268755B TW 094108675 A TW094108675 A TW 094108675A TW 94108675 A TW94108675 A TW 94108675A TW I268755 B TWI268755 B TW I268755B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
heat
exchange device
heat exchange
chip
Prior art date
Application number
TW094108675A
Other languages
Chinese (zh)
Other versions
TW200635485A (en
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Ping-Feng Lee
Hsin-Lung Kuo
Bin Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Tech Corporation filed Critical Mitac Tech Corporation
Priority to TW094108675A priority Critical patent/TWI268755B/en
Priority to DE200610004189 priority patent/DE102006004189A1/en
Priority to JP2006043033A priority patent/JP2006270068A/en
Publication of TW200635485A publication Critical patent/TW200635485A/en
Application granted granted Critical
Publication of TWI268755B publication Critical patent/TWI268755B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention discloses a chip heat dissipation system for chip heat dissipation and a manufacturing method and structure of heat dissipation device thereof. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. This heat dissipation device is used for receiving waste heat from chip, then heat exchange device is used for discharging waste heat. Moreover, the heat exchange device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element. Also, the pipes are used for connecting at least two joints of the heat dissipation device and the heat exchange device and then the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency. The manufacturing method for thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, melting or the other materials preparation method. The bracket structure of carbon element can coat on the metal material surface and also can be mixed into the metal material.
TW094108675A 2005-03-21 2005-03-21 Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof TWI268755B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094108675A TWI268755B (en) 2005-03-21 2005-03-21 Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof
DE200610004189 DE102006004189A1 (en) 2005-03-21 2006-01-27 Cooling system for IC (integrated circuit) chips used in e.g. personal computer, has heat sink connected to heat exchanger by connecting tubes through which liquid from pump circulates to cool IC chip
JP2006043033A JP2006270068A (en) 2005-03-21 2006-02-20 Semiconductor chip cooling system, structure and manufacturing method of heat exchange device for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094108675A TWI268755B (en) 2005-03-21 2005-03-21 Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof

Publications (2)

Publication Number Publication Date
TW200635485A TW200635485A (en) 2006-10-01
TWI268755B true TWI268755B (en) 2006-12-11

Family

ID=36973781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108675A TWI268755B (en) 2005-03-21 2005-03-21 Chip heat dissipation system and manufacturing method and structure of heat exchange device thereof

Country Status (3)

Country Link
JP (1) JP2006270068A (en)
DE (1) DE102006004189A1 (en)
TW (1) TWI268755B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
CN112747562B (en) * 2020-12-22 2022-06-24 湖南徽宏五金有限公司 Aluminum alloy die casting
CN113993311B (en) * 2021-10-14 2023-04-11 海南师范大学 Sample monitoring equipment for artificial intelligence data acquisition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003248530A (en) * 2002-02-22 2003-09-05 Sanyo Electric Co Ltd Electronic device
AT7382U1 (en) * 2003-03-11 2005-02-25 Plansee Ag HEAT SINK WITH HIGH HEAT-CONDUCTIVITY
US20040200599A1 (en) * 2003-04-10 2004-10-14 Bradley Michael William Amorphous carbon layer for heat exchangers and processes thereof

Also Published As

Publication number Publication date
DE102006004189A1 (en) 2006-09-28
TW200635485A (en) 2006-10-01
JP2006270068A (en) 2006-10-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees