TW200632128A - Heat dissipation metal of surface plating film structure and manufacturing method thereof - Google Patents

Heat dissipation metal of surface plating film structure and manufacturing method thereof

Info

Publication number
TW200632128A
TW200632128A TW094106361A TW94106361A TW200632128A TW 200632128 A TW200632128 A TW 200632128A TW 094106361 A TW094106361 A TW 094106361A TW 94106361 A TW94106361 A TW 94106361A TW 200632128 A TW200632128 A TW 200632128A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation metal
surface plating
plating film
manufacturing
Prior art date
Application number
TW094106361A
Other languages
Chinese (zh)
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Hsin-Lung Kuo
Bin-Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Priority to TW094106361A priority Critical patent/TW200632128A/en
Priority to JP2006027578A priority patent/JP2006245561A/en
Priority to DE200610007527 priority patent/DE102006007527A1/en
Publication of TW200632128A publication Critical patent/TW200632128A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention discloses a manufacturing method and the structure for surface plating film on heat dissipation metal. This surface plating film structure on heat dissipation metal includes a heat dissipation metal and a film. The heat dissipation metal of surface plating film structure is often used in dissipation the heat from the electronics device. The film is composed of a bracket structure of carbon element which has high thermal conductivity so as to improve the heat dissipation efficiency of heat dissipation metal. The corresponding manufacturing method for this film can be made with chemical vapor deposition, physical vapor deposition or the other materials preparation method.
TW094106361A 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof TW200632128A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof
JP2006027578A JP2006245561A (en) 2005-03-02 2006-02-03 Thin film structure on heat dissipation metal surface and its production process
DE200610007527 DE102006007527A1 (en) 2005-03-02 2006-02-16 Coated metal element for cooler of electronic installation consisting of at least one metal element and one coating formed of crystalline carbon with high thermal conductivity coefficient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
TW200632128A true TW200632128A (en) 2006-09-16

Family

ID=36848306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP2006245561A (en)
DE (1) DE102006007527A1 (en)
TW (1) TW200632128A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105386003A (en) * 2015-12-02 2016-03-09 哈尔滨工业大学 Preparation method for three-dimensional structure graphene reinforced copper matrix composite material

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160021788A1 (en) * 2014-07-16 2016-01-21 General Electric Company Electronic device assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105386003A (en) * 2015-12-02 2016-03-09 哈尔滨工业大学 Preparation method for three-dimensional structure graphene reinforced copper matrix composite material
CN105386003B (en) * 2015-12-02 2018-01-30 哈尔滨工业大学 A kind of preparation method of three-dimensional structure graphene enhancing Cu-base composites

Also Published As

Publication number Publication date
JP2006245561A (en) 2006-09-14
DE102006007527A1 (en) 2006-09-07

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