CN110072345A - A kind of addition process manufacture craft of flexible circuit board precise circuit - Google Patents
A kind of addition process manufacture craft of flexible circuit board precise circuit Download PDFInfo
- Publication number
- CN110072345A CN110072345A CN201910309633.3A CN201910309633A CN110072345A CN 110072345 A CN110072345 A CN 110072345A CN 201910309633 A CN201910309633 A CN 201910309633A CN 110072345 A CN110072345 A CN 110072345A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- ink
- flexible circuit
- copper
- manufacture craft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 238000011161 development Methods 0.000 claims abstract description 17
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- 238000006116 polymerization reaction Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 239000003814 drug Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000000839 emulsion Substances 0.000 claims description 3
- VZOPRCCTKLAGPN-ZFJVMAEJSA-L potassium;sodium;(2r,3r)-2,3-dihydroxybutanedioate;tetrahydrate Chemical compound O.O.O.O.[Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O VZOPRCCTKLAGPN-ZFJVMAEJSA-L 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 229940074446 sodium potassium tartrate tetrahydrate Drugs 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 238000010923 batch production Methods 0.000 abstract description 3
- 230000008676 import Effects 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- ZKDNBOAOTQCXLM-UHFFFAOYSA-N 2,3-dihydroxybutanedioic acid;potassium;sodium Chemical compound [Na].[K].OC(=O)C(O)C(O)C(O)=O ZKDNBOAOTQCXLM-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of addition process manufacture crafts of flexible circuit board precise circuit, it include: that step S1 prepares, step S2 plated film, step S3 inking, step S4 exposure, step S5 development, step S6 sinks copper, the present invention improves the manufacturing capacity of flexible circuit board, 40um line width makes capability improving to the line width ability of 10um, efficiently solve industry problems, improve the yield of precise circuit, 40um line width yield can promote 5% or more, process is simple, it is at low cost, easily import batch production, solves existing flexible circuit board technique, subtractive process makes route, limit capacity minimum wire is 40um, not the problem of not reaching requirement rigorous.
Description
Technical field
The present invention relates to flexible circuit board processing technique field, especially a kind of addition process of flexible circuit board precise circuit
Manufacture craft.
Background technique
Existing flexible circuitry board industry route is made as subtractive process technique, process flow: patch dry film -- route exposure --- is aobvious
Shadow/etches/moving back film -- lower process；By crossing the dry film with photobehavior, through film exposure in pattern transfer to copper sheet, then
It/is etched/by way of moving back film development, extra unwanted copper is etched away, leave the figure route of our needs.
Description of the process is as follows:
Patch dry film: photosensitive dry film is pressed on copper face using film laminator, is the critical material of route formation.
Route exposure: being to irradiate dry film using ultraviolet light, and dry film is made to generate polymerization reaction, and traditional handicraft is needed using exposure
Egative film, lightproof part has blocked ultraviolet irradiation on egative film, and light transmission part polymerize plate face dry film, forms route.
Development: Na is utilized2CO3The dry film not polymerizeing is got rid of, allow should not copper foil reveal.
Etching: etching is to utilize CuCL2+HCl+H2O2Reacted with copper foil, thus by should not copper foil get rid of.
Stripping: stripping is to be reacted using highly basic NaOH with the dry film of polymerization, to remove dry film, exposes copper foil circuit
Come.
With the increase of electronic product function, circuit level also comes higher, it is desirable that route is more accurate, existing flexible circuitry
Plate technique, subtractive process make route, and limit capacity minimum wire is 40um, do not reach requirement rigorous, in consideration of it, for upper
Problem further investigation is stated, there is this case generation then.
Summary of the invention
The purpose of the present invention is to solve the above problems, devise a kind of addition legal system of flexible circuit board precise circuit
Make technique, solve existing flexible circuit board technique, subtractive process makes route, and limit capacity minimum wire is 40um, is not achieved
It is required that the problem of rigorous.
Above-mentioned purpose is realized the technical solution of the present invention is as follows: a kind of addition process of flexible circuit board precise circuit makes work
Skill, comprising: step S1 preparation, step S2 plated film, step S3 inking, step S4 exposure, step S5 development, the heavy copper of step S6；
S1: prepare web-like Kapton, with a thickness of 25um；
S2: sputter coating, by sputter coating process, sputter Cr forms seed layer on Kapton；
S3: coating photosensitive-ink is coated with one layer of photosensitive-ink on Kapton；
S4: route exposure is irradiated ink layer using ultraviolet light, ink is made to generate polymerization reaction using positive film figure,
Lightproof part has blocked ultraviolet irradiation on the film, forms figure after development, and light transmission part make it is ink curing；
S5: development utilizes the Na of 1% concentration2CO3The ink of not polymerization reaction is got rid of, seed layer, shape are manifested
At figure；
S6: heavy copper deposits one layer of copper on the figure that development comes out, forms preset route using heavy copper liquid medicine.
Preferably, during sputter coating described in step S2, sputter rate 0.1-0.3um/Min.
Preferably, ink described in step S3, main component are resin, emulsion, curing agent etc., and the coating is photosensitive
Ink with a thickness of 10 scholar 5um.
Preferably, in developing process described in step S5, developing time 2-3Min, development temperature is 28-30 DEG C.
Preferably, during heavy copper described in step S6, copper temperature of sinking is 38-40 DEG C, and the heavy copper time is 10-15Min, heavy copper
With a thickness of 0.5-2.0um.
Preferably, heavy copper liquid medicine described in step S6, mainly includes copper sulphate, formaldehyde, sodium hydroxide and tartaric acid
Potassium sodium.
Utilize the addition process manufacture craft of the flexible circuit board precise circuit of technical solution of the present invention production, the flexible wires
The addition process manufacture craft of road plate precise circuit, improves the manufacturing capacity of flexible circuit board, and 40um line width makes capability improving
To the line width ability of 10um, industry problems are efficiently solved, the invention can directly generate the market scale of 1,000,000,000 yuan of grades or more, mention
The yield of precise circuit has been risen, 40um line width yield can promote 5% or more, and process is simple, and it is at low cost, batch production is easily imported,
Solves existing flexible circuit board technique, subtractive process makes route, and limit capacity minimum wire is 40um, does not reach requirement precision
It is required that the problem of.
Detailed description of the invention
Fig. 1 is a kind of addition process fabrication processing schematic diagram of flexible circuit board precise circuit of the present invention.
Specific embodiment
The present invention is specifically described with reference to the accompanying drawing, as shown in Figure 1, a kind of flexible circuit board precise circuit adds
At method manufacture craft.
Embodiment:
Step S1 prepares: preparing Kapton, is commonly called as PI film, with the characteristic that high temperature resistant, stability are excellent, using volume
Shape Kapton film, the best 25um of thickness；
Step S2 plated film: sputter coating, by sputter coating process, sputter Cr forms seed on Kapton
Layer, sputter rate 0.1-0.3um/Min；
Step S3 inking: coating photosensitive-ink is coated with one layer of photosensitive-ink, ink main component on Kapton
For resin, emulsion, curing agent etc., it is coated with 10 scholar 5um of ink thickness；
Step S4 exposure: route exposure is irradiated ink layer using ultraviolet light, generates ink using positive film figure
Polymerization reaction, lightproof part has blocked ultraviolet irradiation on the film, figure is formed after development, and light transmission part keeps ink hard
Change.
Step S5 development: being got rid of using the ink by not polymerization reaction of 1% concentration, manifest seed layer, is formed
Figure, developing time: 2-3Min, 28-30 DEG C of development temperature.
Step S6 sinks copper: using heavy copper liquid medicine, one layer of copper is deposited on the figure that development comes out, forms the line of our needs
Road, heavy copper liquid medicine, mainly includes copper sulphate, sodium hydroxide and sodium potassium tartrate tetrahydrate, and wherein copper sulphate is the main salt in solution,
Bivalent cupric ion source is provided；Formaldehyde is as reducing agent；Sodium hydroxide makes solution keep certain pH value, because formaldehyde is in alkalinity
Under the conditions of, just there is reduction；Sodium potassium tartrate tetrahydrate is complexing agent, and main function has copper in the complex status of dissolution, prevents
Only bivalent cupric ion generates Cu (OH) in alkaline medium2Precipitating, while the concentration that can also control bivalent cupric ion has
Buffer function；
The addition process manufacture craft of the flexible circuit board precise circuit, improves the manufacturing capacity of flexible circuit board, 40um
Line width makes capability improving to the line width ability of 10um, efficiently solves industry problems, improves the yield of precise circuit, 40um
Line width yield can promote 5% or more, and process is simple, at low cost, easily import batch production.
Above-mentioned technical proposal only embodies the optimal technical scheme of technical solution of the present invention, those skilled in the art
The principle of the present invention is embodied to some variations that some of them part may be made, belongs to the scope of protection of the present invention it
It is interior.
Claims (6)
1. a kind of addition process manufacture craft of flexible circuit board precise circuit characterized by comprising step S1 preparation, step
S2 plated film, step S3 inking, step S4 exposure, step S5 development, the heavy copper of step S6；
S1: prepare web-like Kapton, with a thickness of 25um；
S2: sputter coating, by sputter coating process, sputter Cr forms seed layer on Kapton；
S3: coating photosensitive-ink is coated with one layer of photosensitive-ink on Kapton；
S4: route exposure is irradiated ink layer using ultraviolet light, ink is made to generate polymerization reaction, the film using positive film figure
Upper lightproof part has blocked ultraviolet irradiation, forms figure after development, and light transmission part make it is ink curing；
S5: development utilizes the Na of 1% concentration2CO3The ink of not polymerization reaction is got rid of, seed layer is manifested, forms figure
Shape；
S6: heavy copper deposits one layer of copper on the figure that development comes out, forms preset route using heavy copper liquid medicine.
2. a kind of addition process manufacture craft of flexible circuit board precise circuit according to claim 1, which is characterized in that step
During sputter coating described in rapid S2, sputter rate 0.1-0.3um/Min.
3. a kind of addition process manufacture craft of flexible circuit board precise circuit according to claim 1, which is characterized in that step
Ink described in rapid S3, main component are resin, emulsion, curing agent etc., the coating photosensitive-ink with a thickness of 10 scholars
5um。
4. a kind of addition process manufacture craft of flexible circuit board precise circuit according to claim 1, which is characterized in that step
In developing process described in rapid S5, developing time 2-3Min, development temperature is 28-30 DEG C.
5. a kind of addition process manufacture craft of flexible circuit board precise circuit according to claim 1, which is characterized in that step
It is sunk during copper described in rapid S6, copper temperature of sinking is 38-40 DEG C, and the heavy copper time is 10-15Min, and the copper thickness that sinks is 0.5-2.0um.
6. a kind of addition process manufacture craft of flexible circuit board precise circuit according to claim 1, which is characterized in that step
Heavy copper liquid medicine, mainly includes copper sulphate, sodium hydroxide, formaldehyde and sodium potassium tartrate tetrahydrate described in rapid S6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309633.3A CN110072345A (en) | 2019-04-17 | 2019-04-17 | A kind of addition process manufacture craft of flexible circuit board precise circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309633.3A CN110072345A (en) | 2019-04-17 | 2019-04-17 | A kind of addition process manufacture craft of flexible circuit board precise circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110072345A true CN110072345A (en) | 2019-07-30 |
Family
ID=67367918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910309633.3A Pending CN110072345A (en) | 2019-04-17 | 2019-04-17 | A kind of addition process manufacture craft of flexible circuit board precise circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110072345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110502147A (en) * | 2019-08-12 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of flexibility touch screen display board and preparation method thereof and application |
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| TW200412215A (en) * | 2002-12-26 | 2004-07-01 | Goldmickle Technology Corp | PCB ultra-thin circuit forming method |
| JP2005005453A (en) * | 2003-06-11 | 2005-01-06 | Fujikura Ltd | Printed wiring board and its manufacturing method |
| KR20100072921A (en) * | 2008-12-22 | 2010-07-01 | 이준세 | Manufacturing method of double side flexible printed circuit board for fine pattern |
| CN101790288A (en) * | 2009-01-22 | 2010-07-28 | 上海美维科技有限公司 | Manufacturing method of novel printed circuit board |
| TW201230909A (en) * | 2011-01-05 | 2012-07-16 | Chunghwa Prec Test Tech Co Ltd | Manufacturing process for printed circuit board with conductive structure of lines |
| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
| CN209994652U (en) * | 2019-04-17 | 2020-01-24 | 深圳市隽美泰和电子科技有限公司 | Copper deposition equipment for manufacturing flexible circuit board by addition method |
-
2019
- 2019-04-17 CN CN201910309633.3A patent/CN110072345A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200412215A (en) * | 2002-12-26 | 2004-07-01 | Goldmickle Technology Corp | PCB ultra-thin circuit forming method |
| JP2005005453A (en) * | 2003-06-11 | 2005-01-06 | Fujikura Ltd | Printed wiring board and its manufacturing method |
| KR20100072921A (en) * | 2008-12-22 | 2010-07-01 | 이준세 | Manufacturing method of double side flexible printed circuit board for fine pattern |
| CN101790288A (en) * | 2009-01-22 | 2010-07-28 | 上海美维科技有限公司 | Manufacturing method of novel printed circuit board |
| TW201230909A (en) * | 2011-01-05 | 2012-07-16 | Chunghwa Prec Test Tech Co Ltd | Manufacturing process for printed circuit board with conductive structure of lines |
| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
| CN209994652U (en) * | 2019-04-17 | 2020-01-24 | 深圳市隽美泰和电子科技有限公司 | Copper deposition equipment for manufacturing flexible circuit board by addition method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110502147A (en) * | 2019-08-12 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of flexibility touch screen display board and preparation method thereof and application |
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