1267726 玖、發明說明： 【發明所屬之技術領域】 5 指一 法0 本發明係關於-種集熱器片改良結構與製造方法，尤 種適用於散熱裝置之集熱器片之改良結構與製造方 【先前技術】 於-般傳統之散熱裝置中，其主要係於散熱韓片之下 10 15 =設卜集熱器片，並將集熱器片平貼於一發熱電子元 2上’例如電《置之中央處理單元（cpu)，以 片吸收前述發熱電子元件所產生之熱量，並 ^ 予以散熱。 月…、.、，、曰片 此外，為使集熱器片與發熱電子元件之間可保持_較 觸面上與發熱電子元件之間尤接 片與發熱電子元件二接：面：散熱膏可用以填滿集熱器 彼此間之熱傳導效率。上之毛細孔，藉此可提昇其 然而’受限於傳統之製造 亚非為—平整面，因μ法完 二/之表面 亦即集熱器片與㈣電；；^ 兔熱笔子元件上， 傳導目的之面積將=間因彼此接觸才能達成熱 使隼熱哭只金称拥 /夕，即使塗佈一層散熱膏亦無法 影響集：器fi:電：元件之間達成完全 木…、作用，進而降低散熱裝置之散熱效 20 I267726 益 ’並非十分理想 【發明内容】 5 本發明之主要目的係在提# 一蘇 邀制！t 土 μ处土& "種布熱器片改良結構 片與發熱電子元件之間達成密 d接觸，错以提昇其集熱與散熱效益。 為達成上述目的，本發明之集熱器 括下列步驟·· 月裟&方法主要包 10 15 步驟A :滾軋一導熱素材並使其形成―平板； 步驟B··裁切上述之平板並使其形成為一集熱 步驟C:重力衝壓於上述集熱 部/八、， 门 < 上表面之至少一 …亚於上表面對應凹陷形成至少—平整區域；以及1267726 玖, invention description: [Technical field of invention] 5 refers to a method 0 The invention relates to an improved structure and manufacturing method of a collector sheet, and particularly improved structure and manufacture of a collector sheet suitable for a heat sink [Prior Art] In the conventional heat sink, it is mainly under the heat sink Korean film 10 15 = set collector plate, and the collector plate is flat on a heating electronic element 2 'eg electricity The central processing unit (cpu) is configured to absorb heat generated by the heat-generating electronic components and to dissipate heat. In addition, in order to make the collector sheet and the heat-generating electronic component maintainable, the contact between the contact surface and the heat-generating electronic component is connected with the heat-generating electronic component: surface: thermal grease It can be used to fill the heat transfer efficiency of the collectors with each other. The capillary pores on the surface can be improved, however, it is 'constrained by the traditional manufacturing of the Asian-African--flat surface, because the surface of the μ method is the collector plate and the (4) electricity;; ^ rabbit hot pen component On the upper, the area of the conduction purpose will be in contact with each other to reach the heat, so that the hot crying is only called the golden eve/even, even if a layer of thermal grease is applied, the set cannot be affected: the device fi: electricity: the complete wood between the components... Function, and thus reduce the heat dissipation effect of the heat sink 20 I267726 益 ' is not very ideal [invention content] 5 The main purpose of the invention is to mention #一苏 Invitation! t soil μ &"" heat exchanger sheet improved structure The sheet and the heating electronic components to achieve dense d contact, wrong to enhance its heat collection and heat dissipation benefits. In order to achieve the above object, the heat collector of the present invention comprises the following steps: · Months & Method Main Package 10 15 Step A: Rolling a heat conductive material and forming it into a "plate"; Step B · Cutting the above-mentioned flat plate and Forming it as a heat collecting step C: gravity punching on the heat collecting portion/eighth, at least one of the upper surfaces of the door < the upper surface corresponding to the recess forming at least a flat area;
步驟對應組設至少—發熱電子元件於 一平整區域内。 V :外’本發明之集熱器片改良結構係主要 二片：：及至少一發熱電子元件。其中之集熱器片並包 二上表面、以及至少-平整區域，且其中之至少一平 力衝壓方式凹陷形成於上表面上。而至少- r，、、且至=應組設於集熱器片之至少一平整區域 區域。〃 #熱電子元件係略小於其對應之至少-平整 集熱器片與發熱電子元件之間係彼此接合於一 ΐ二二此平整區域係使用重力衝壓方式所形成，故 千正度極高之平整區域，當集熱器片與發熱電子 20 1267726 几件接合於平整區域内時，复― 鰥，拉 ， v、—者之間可達成極密合之接 觸，错以增加其二者之間之掊 之接 與散熱效益。 _面積，並進•昇其集熱 5 【實施方式】 =讓貴審查委員能更瞭解本發明之技術 舉一較佳具體實施例說明如下。 特 ㈣、!：：圖1係本發明之流程圖，其顯示本發明之隼敎 10 15 ^造方法之製造流程。並請_併參閱圖2至圖6; 顯不本發明之滾軋動作立 一刀别 r > 動作不忍圖、裁切動作示意圖、重力输 壓動作示意圖、塗佈散埶喜 t 口重力衝 子元件動作示意圖—、以及組設發熱電 首先，係先藉由一滾軋設備71滾軋 使其形成為-平板2(SA)，於本實施例中，導:=二 銅板之金屬板材，其具有極佳之熱傳導性， 木 然以其他具熱傳導特性之材質亦可。之後，以一切;刀片 ^ 別述滾軋所得之平板2進行裁切，並使其形成為—集熱 為片3(SB)，如圖3戶斤示。 …、 上述經由裁切所得之集熱器片3，其係包括有一 面31,亚藉由一衝模73重力衝壓於集熱器片3上表面31之： 中。P伤，而於其上表面31對應凹陷形成一平整區 32(SC)，如圖4所示。請注意，由於前 2 舌士你两士』〜 丁正^域32係以 式所形成，因此可得到一平整度極高之平整區 域3 2 〇 20 1267726 重力衝壓出平整區域32後，再於平整區域32内塗佈 (或疋以印刷方式亦可）散熱膏5(SD1)，如圖5所示，最後 再將一發熱電子元件4對應組設於平整區域32内即可，如圖 6所不。蚋述發熱電子元件4於本實施例中係為一電腦裝置 5内之中央處理單元（CPU)。 清再蒼閱圖7係本發明之立體組合圖，其顯示以上述 集熱器片製造方法所製造出之集熱器片改良結構，且此集 熱器片改良結構係會包括有-集熱器片3、以及一發熱電子 元^4。其中之集熱器片3係包括有一上表面31、以及一平 品或32且平整區域32係以重力衝壓方式凹陷形成於集 熱器片3上表面31上’而發熱電子元件4之大小則係略小於 平整區域32，且對應組設於前述之平整區域32内。另外， 於平整區域32内塗佈有散熱膏5，其可將發熱電子元件4黏 合於其所對應之平整區域32内。 15 i述之集熱器片3並包括有—下表面33,且於下表面 33上組設有複數個散熱鰭片34，藉以形成—散熱裝置，並 將其與發熱電子元件4彼此組設以進行散熱作業。 由土述可知，藉由重力衝壓方式所形成之平整區域32 /、有極冋之平正度’故當集熱器片3與發熱電子元件4彼此 20接合於平整區域32内時，其二者之間可達成極密合之接 觸，如此可增加其二者之間之接觸面積，並進而提昇直隹 熱與散熱效益。此外，於集熱器片3上可重力衝壓出多個； 整區域32,亦即可搭配實際發熱電子元心之數量而加 化設計，且同樣可達成前述之功效。 1267726 另外，集熱器片3並不限於搭配使用散熱鰭片34，其 他如水冷式、氣冷式等各種型式之散熱裝置亦皆可使用本 發明所述之集熱器片3。 上述實施例僅係為了方便說明而舉例而已，本發明所 5主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述貫施例0 【圖式簡單說明】 圖1係本發明之流程圖。 10圖2係本發明之滾軋動作示意圖。 圖3心本發明之裁切動作示意圖。 圖4係本發明之重力衝壓動作示意圖。 圖5係本發明之塗佈散熱膏動作示意圖。 圖6係本發明之組設發熱電子元件動作示意圖。 15圖7係本發明之立體組合圖。 【圖號說明】 平板 平整區域 發熱電子元件 切割刀片 集熱器片 33下表面 5 散熱膏 73衝模 1 導熱素材 2 31 上表面 32 34 散熱鰭片 4 71 滾軋設備 72The step corresponds to grouping at least the heat generating electronic component in a flat area. V: Outer The improved structure of the collector sheet of the present invention is mainly two sheets: and at least one heat-generating electronic component. The collector sheet includes two upper surfaces and at least a flat surface, and at least one of the flat stamping recesses is formed on the upper surface. And at least - r, , and to = should be disposed in at least one flat region of the collector sheet. 〃 #Thermal electronic component is slightly smaller than its corresponding at least - the flat collector plate and the heat-generating electronic component are connected to each other in one or two. The flat region is formed by gravity stamping, so the height is extremely high. In the flattening area, when the collector piece and the heat-generating electron 20 1267726 are joined in the flat area, a close contact can be achieved between the complex, the pull, the v, and the After the connection and cooling benefits. _ area, parallel, and its heat collection 5 [Embodiment] = Let the review board know more about the technology of the present invention. A preferred embodiment will be described below. (4), !:: Figure 1 is a flow chart of the present invention, which shows the manufacturing process of the method of the present invention. Please _ and refer to Fig. 2 to Fig. 6; show that the rolling action of the present invention is set aside, r > action can not bear the picture, the cutting action diagram, the gravity pressure action diagram, the coating disperse 埶 t mouth gravity punch The schematic diagram of the operation of the component—and the setting of the heating power is firstly rolled into a flat plate 2 (SA) by a rolling device 71. In the present embodiment, the metal plate of the two copper plates is guided. It has excellent thermal conductivity, and it can also be made of other materials with thermal conductivity. After that, the flat plate 2 obtained by rolling the blade 2 is cut and formed into a heat collecting sheet 3 (SB), as shown in Fig. 3. The above-mentioned collector sheet 3 obtained by cutting comprises a surface 31 which is gravity-punched from the upper surface 31 of the collector sheet 3 by a die 73. P is damaged, and a flat area 32 (SC) is formed on the upper surface 31 corresponding to the depression, as shown in FIG. Please note that due to the formation of the first 2 tongues, you are two pairs of 』~ 丁正^ domain 32, so you can get a flat area with a very high flatness. 3 2 〇20 1267726 After gravity punching out the flat area 32, then The heat-dissipating paste 5 (SD1) is coated in the flattening area 32 (or in a printing manner), as shown in FIG. 5, and finally a heat-generating electronic component 4 is correspondingly disposed in the flattening area 32, as shown in FIG. 6. No. The heat generating electronic component 4 is referred to as a central processing unit (CPU) in a computer device 5 in this embodiment. Fig. 7 is a perspective assembled view of the present invention, which shows a modified structure of a collector sheet manufactured by the above method for manufacturing a collector sheet, and the collector structure improved structure includes heat collection The chip 3 and a heat generating electronic component ^4. The collector sheet 3 includes an upper surface 31, and a flat or 32 flat portion 32 is recessed by gravity stamping on the upper surface 31 of the collector sheet 3, and the size of the heat-generating electronic component 4 is It is slightly smaller than the flat area 32, and the corresponding group is disposed in the aforementioned flat area 32. Further, a heat dissipating paste 5 is applied to the flattened region 32, which bonds the heat-generating electronic component 4 to the flat region 32 corresponding thereto. The heat collector sheet 3 includes a lower surface 33, and a plurality of heat dissipation fins 34 are disposed on the lower surface 33 to form a heat sink and assemble the heat generating electronic components 4 with each other. For heat dissipation work. As can be seen from the description, the flattened region 32 / formed by the gravity stamping method has a flatness of the extremes. Therefore, when the collector sheet 3 and the heat-generating electronic component 4 are joined to each other in the flat region 32, both of them A very close contact can be achieved, which increases the contact area between the two and further improves the heat and heat dissipation efficiency of the direct heat. In addition, a plurality of gravity stampings can be performed on the collector sheet 3; the entire area 32 can be added with the number of actual heat-generating electronic cores, and the aforementioned effects can be achieved. 1267726 In addition, the collector sheet 3 is not limited to use the heat dissipating fins 34. Other types of heat sinks such as water-cooled and air-cooled can also use the collector sheet 3 of the present invention. The above-mentioned embodiments are merely examples for convenience of description, and the scope of claims of the present invention is determined by the scope of the patent application, and is not limited to the above-described embodiments. [Simplified description of the drawings] FIG. Flow chart of the invention. Figure 2 is a schematic view of the rolling action of the present invention. Figure 3 is a schematic view of the cutting action of the present invention. Figure 4 is a schematic view of the gravity stamping action of the present invention. Figure 5 is a schematic view showing the action of the coated heat-dissipating paste of the present invention. Fig. 6 is a schematic view showing the operation of the heat generating electronic component of the present invention. Figure 7 is a perspective assembled view of the present invention. [Description of the figure] Flat plate Area Heated electronic components Cutting blade Collector plate 33 Lower surface 5 Thermal paste 73 Die 1 Thermally conductive material 2 31 Upper surface 32 34 Heat sink fin 4 71 Rolling equipment 72