TWI267346B - Thermal module - Google Patents

Thermal module

Info

Publication number
TWI267346B
TWI267346B TW94133044A TW94133044A TWI267346B TW I267346 B TWI267346 B TW I267346B TW 94133044 A TW94133044 A TW 94133044A TW 94133044 A TW94133044 A TW 94133044A TW I267346 B TWI267346 B TW I267346B
Authority
TW
Taiwan
Prior art keywords
group
thermal module
fin
main body
plate
Prior art date
Application number
TW94133044A
Other languages
Chinese (zh)
Other versions
TW200714190A (en
Inventor
Ching-Bai Hwang
Jing-Gong Meng
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94133044A priority Critical patent/TWI267346B/en
Application granted granted Critical
Publication of TWI267346B publication Critical patent/TWI267346B/en
Publication of TW200714190A publication Critical patent/TW200714190A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thermal module includes a plate, and at least a group of fins mounted on the plate. Each fin of the group includes a main body. The main body of at least a fin of the group forms a sharp angle with an arrangement direction of the group, for increasing heat dissipating areas of the group of fins.
TW94133044A 2005-09-23 2005-09-23 Thermal module TWI267346B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94133044A TWI267346B (en) 2005-09-23 2005-09-23 Thermal module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94133044A TWI267346B (en) 2005-09-23 2005-09-23 Thermal module

Publications (2)

Publication Number Publication Date
TWI267346B true TWI267346B (en) 2006-11-21
TW200714190A TW200714190A (en) 2007-04-01

Family

ID=38191837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133044A TWI267346B (en) 2005-09-23 2005-09-23 Thermal module

Country Status (1)

Country Link
TW (1) TWI267346B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9013871B2 (en) 2012-03-22 2015-04-21 Compal Electronics, Inc. Electronic device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014035362A1 (en) 2012-08-27 2014-03-06 Razer (Asia-Pacific) Pte. Ltd. Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9013871B2 (en) 2012-03-22 2015-04-21 Compal Electronics, Inc. Electronic device

Also Published As

Publication number Publication date
TW200714190A (en) 2007-04-01

Similar Documents

Publication Publication Date Title
TW200728961A (en) Heat sink
TW200638764A (en) Water-cooled projector
TWI265775B (en) Portable electronic device and heat dissipation method and cradle thereof
EP2085599A3 (en) Shared flow thermal management system
WO2005124514A3 (en) System for efficiently cooling a processor
TW200714196A (en) Systems for integrated cold plate and heat spreader
TW200711561A (en) Electronic apparatus and thermal dissipating module thereof
WO2011022534A3 (en) Interlocked jets cooling method and apparatus
WO2007050547A3 (en) Lamp thermal management system
DE50311004D1 (en) HEAT EXCHANGERS, ESPECIALLY CHOPPERS
WO2009078168A1 (en) Heat exchange device and device for receiving heat generation body
GB2464046A (en) Computer device heat dissipation system
TW200641472A (en) Backlight module
TW200802762A (en) Heat sink, electronic device, and tuner apparatus
CA2536124A1 (en) Heat exchanging apparatus
TW200721947A (en) Clip adapted to heat sink
EP1723486A4 (en) Laser cooling system and method
TW200633630A (en) A structure for dissipating heat used in the flat panel display
TWI267346B (en) Thermal module
TW200701492A (en) Semiconductor package structure
TWI265267B (en) Heat dissipation device with heat pipe
FR2875591B1 (en) HEAT EXCHANGER WITH PERFECTED FINS
WO2009133199A3 (en) A light comprising leds and a heat sink within a housing
TW200746981A (en) Heat dissipation device
TW200738109A (en) Thermal module

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees