TWI267317B - Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens - Google Patents

Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens Download PDF

Info

Publication number: TWI267317B
Authority: TW; Taiwan
Prior art keywords: support; assembly; deposit; metal; gas
Prior art date: 2002-06-03

Application number

TW092114156A

Other languages

English (en)

Chinese (zh)

Other versions

TW200308177A (en

Inventor

Porta Massimo Della

Stefano Tominetti

Original Assignee

Getters Spa

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-06-03

Filing date

2003-05-26

Publication date

2006-11-21

2003-05-26 Application filed by Getters Spa filed Critical Getters Spa

2003-12-16 Publication of TW200308177A publication Critical patent/TW200308177A/zh

2006-11-21 Application granted granted Critical

2006-11-21 Publication of TWI267317B publication Critical patent/TWI267317B/zh

Links

239000000463 material Substances 0.000 title abstract description 18
229910052751 metal Inorganic materials 0.000 claims description 12
239000002184 metal Substances 0.000 claims description 12
239000011521 glass Substances 0.000 claims description 9
230000002093 peripheral effect Effects 0.000 claims description 4
229910052784 alkaline earth metal Inorganic materials 0.000 claims description 3
150000001342 alkaline earth metals Chemical class 0.000 claims description 3
238000005520 cutting process Methods 0.000 claims description 2
KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical class [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 claims 1
238000009825 accumulation Methods 0.000 claims 1
229910001922 gold oxide Inorganic materials 0.000 claims 1
239000007769 metal material Substances 0.000 claims 1
239000004576 sand Substances 0.000 claims 1
238000000926 separation method Methods 0.000 claims 1
238000003466 welding Methods 0.000 claims 1
239000007789 gas Substances 0.000 abstract description 4
238000004519 manufacturing process Methods 0.000 abstract description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
238000000034 method Methods 0.000 description 5
239000013049 sediment Substances 0.000 description 5
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
229910052783 alkali metal Inorganic materials 0.000 description 2
150000001340 alkali metals Chemical class 0.000 description 2
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
238000000151 deposition Methods 0.000 description 2
230000008021 deposition Effects 0.000 description 2
229910052744 lithium Inorganic materials 0.000 description 2
239000011368 organic material Substances 0.000 description 2
239000001301 oxygen Substances 0.000 description 2
229910052760 oxygen Inorganic materials 0.000 description 2
229910018134 Al-Mg Inorganic materials 0.000 description 1
229910018467 Al—Mg Inorganic materials 0.000 description 1
OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
229910052786 argon Inorganic materials 0.000 description 1
238000005452 bending Methods 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
229910052791 calcium Inorganic materials 0.000 description 1
239000011575 calcium Substances 0.000 description 1
239000002131 composite material Substances 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
230000001627 detrimental effect Effects 0.000 description 1
230000000694 effects Effects 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
238000005562 fading Methods 0.000 description 1
239000003292 glue Substances 0.000 description 1
229910052734 helium Inorganic materials 0.000 description 1
239000001307 helium Substances 0.000 description 1
SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
229910003437 indium oxide Inorganic materials 0.000 description 1
PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
229910010272 inorganic material Inorganic materials 0.000 description 1
239000011147 inorganic material Substances 0.000 description 1
238000002844 melting Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
239000000203 mixture Substances 0.000 description 1
SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
230000035699 permeability Effects 0.000 description 1
238000005240 physical vapour deposition Methods 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000002861 polymer material Substances 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
239000010453 quartz Substances 0.000 description 1
239000000376 reactant Substances 0.000 description 1
238000005546 reactive sputtering Methods 0.000 description 1
229910052707 ruthenium Inorganic materials 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
229910001887 tin oxide Inorganic materials 0.000 description 1
VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/802—Applying energy for connecting
- H01L2224/80201—Compression bonding
- H01L2224/80203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding

Landscapes

Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Electroluminescent Light Sources (AREA)

TW092114156A 2002-06-03 2003-05-26 Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens TWI267317B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
IT2002MI001201A ITMI20021201A1 (it)	2002-06-03	2002-06-03	Assemblato comprendente almeno un supporto con deposito di materiale getter per l'uso in schermi organi elettroluminescenti

Publications (2)

Publication Number	Publication Date
TW200308177A TW200308177A (en)	2003-12-16
TWI267317B true TWI267317B (en)	2006-11-21

Family

ID=11450029

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW092114156A TWI267317B (en)	2002-06-03	2003-05-26	Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens

Country Status (8)

Country	Link
EP (1)	EP1509958A2 (it)
JP (1)	JP2005528761A (it)
KR (1)	KR20050010853A (it)
CN (1)	CN1656625A (it)
AU (1)	AU2003241156A1 (it)
IT (1)	ITMI20021201A1 (it)
TW (1)	TWI267317B (it)
WO (1)	WO2003103069A2 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI257269B (en) *	2004-05-04	2006-06-21	Byoung-Chul Lee	Film-type getter and producing method thereof
ITMI20070301A1 (it) *	2007-02-16	2008-08-17	Getters Spa	Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
KR102448843B1 (ko)	2017-12-29	2022-09-28	엘지디스플레이 주식회사	유기전계발광 표시장치 및 그 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3913066A1 (de) *	1989-04-21	1990-11-08	Schoppe & Faeser Gmbh	Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse
IT1269978B (it) *	1994-07-01	1997-04-16	Getters Spa	Metodo per la creazione ed il mantenimento di un'atmosfera controllata in un dispositivo ad emissione di campo tramite l'uso di un materiale getter
US5551557A (en) *	1994-10-25	1996-09-03	Convey, Inc.	Efficient method and apparatus for establishing shelf-life of getters utilized within sealed enclosures
JPH09148066A (ja) *	1995-11-24	1997-06-06	Pioneer Electron Corp	有機ｅｌ素子
US6069443A (en) *	1997-06-23	2000-05-30	Fed Corporation	Passive matrix OLED display
JPH11329719A (ja) *	1998-04-08	1999-11-30	Lg Electronics Inc	有機電界発光素子
JP4342023B2 (ja) *	1999-03-11	2009-10-14	トヨタ自動車株式会社	吸湿膜及び有機ｅｌ表示装置
JP2001319775A (ja) *	2000-05-10	2001-11-16	Auto Network Gijutsu Kenkyusho:Kk	有機ｅｌ表示装置の封止方法および封止構造
JP4801297B2 (ja) *	2000-09-08	2011-10-26	株式会社半導体エネルギー研究所	発光装置
ITMI20011092A1 (it) *	2001-05-23	2002-11-24	Getters Spa	Sistema precursore di dispositivi assorbitori di acqua per schermi org anici elettroluminescenti, processo per la sua produzione e metodo d'u so

2002
- 2002-06-03 IT IT2002MI001201A patent/ITMI20021201A1/it unknown
2003
- 2003-05-26 TW TW092114156A patent/TWI267317B/zh not_active IP Right Cessation
- 2003-05-27 EP EP03730476A patent/EP1509958A2/en not_active Withdrawn
- 2003-05-27 WO PCT/IT2003/000324 patent/WO2003103069A2/en not_active Application Discontinuation
- 2003-05-27 AU AU2003241156A patent/AU2003241156A1/en not_active Abandoned
- 2003-05-27 CN CNA038116944A patent/CN1656625A/zh active Pending
- 2003-05-27 JP JP2004510048A patent/JP2005528761A/ja not_active Abandoned
- 2003-05-27 KR KR10-2004-7019607A patent/KR20050010853A/ko not_active Application Discontinuation

Also Published As

Publication number	Publication date
EP1509958A2 (en)	2005-03-02
CN1656625A (zh)	2005-08-17
TW200308177A (en)	2003-12-16
AU2003241156A1 (en)	2003-12-19
ITMI20021201A0 (it)	2002-06-03
JP2005528761A (ja)	2005-09-22
WO2003103069A8 (en)	2004-04-15
WO2003103069A2 (en)	2003-12-11
KR20050010853A (ko)	2005-01-28
ITMI20021201A1 (it)	2003-12-03
WO2003103069A3 (en)	2004-01-29

Legal Events

Date	Code	Title	Description
2010-09-01	MM4A	Annulment or lapse of patent due to non-payment of fees

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