TW200632117A - Method of mounting substrate in film deposition apparatus and method of depositing film - Google Patents

Method of mounting substrate in film deposition apparatus and method of depositing film

Info

Publication number
TW200632117A
TW200632117A TW095105918A TW95105918A TW200632117A TW 200632117 A TW200632117 A TW 200632117A TW 095105918 A TW095105918 A TW 095105918A TW 95105918 A TW95105918 A TW 95105918A TW 200632117 A TW200632117 A TW 200632117A
Authority
TW
Taiwan
Prior art keywords
deposition apparatus
film deposition
film
chuck
mounting substrate
Prior art date
Application number
TW095105918A
Other languages
Chinese (zh)
Other versions
TWI316968B (en
Inventor
Tatsuya Kataoka
Kenji Nagao
Kenichi Saito
Original Assignee
Mitsui Shipbuilding Eng
Vieetech Japan Co Ltd
Choshu Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Shipbuilding Eng, Vieetech Japan Co Ltd, Choshu Industry Company Ltd filed Critical Mitsui Shipbuilding Eng
Publication of TW200632117A publication Critical patent/TW200632117A/en
Application granted granted Critical
Publication of TWI316968B publication Critical patent/TWI316968B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Abstract

To provide a method of mounting substrate in film deposition apparatus capable of performing film deposition while keeping a substrate in a plane. The solution of the present invention is that in the method of mounting substrate in the film deposition apparatus, an evaporation source and a chuck 14 facing the evaporation source are provided on the film deposition apparatus, and the substrate is mounted on and held by the chuck 14. A glass substrate 26 is placed on a mask 28 arranged between the chuck 14 and the evaporation source, the mask 28 is brought close to the chuck 14 together with the glass substrate 26, and the glass substrate 26 is brought into contact with the chuck 14 to hold the glass substrate 26.
TW095105918A 2005-02-23 2006-02-22 Method of mounting substrate in film deposition apparatus and method of depositing film TW200632117A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005047815A JP4609757B2 (en) 2005-02-23 2005-02-23 Substrate mounting method in film forming apparatus

Publications (2)

Publication Number Publication Date
TW200632117A true TW200632117A (en) 2006-09-16
TWI316968B TWI316968B (en) 2009-11-11

Family

ID=36927387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105918A TW200632117A (en) 2005-02-23 2006-02-22 Method of mounting substrate in film deposition apparatus and method of depositing film

Country Status (5)

Country Link
JP (1) JP4609757B2 (en)
KR (1) KR100932140B1 (en)
CN (1) CN101090996B (en)
TW (1) TW200632117A (en)
WO (1) WO2006090749A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400345B (en) * 2008-04-09 2013-07-01 Ulvac Inc Vapor source and film forming apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010106958A1 (en) * 2009-03-18 2010-09-23 株式会社アルバック Positioning method and vapor deposition method
DE102009034532A1 (en) * 2009-07-23 2011-02-03 Msg Lithoglas Ag Process for producing a structured coating on a substrate, coated substrate and semifinished product with a coated substrate
TWI598377B (en) 2015-08-20 2017-09-11 大連化學工業股份有限公司 Polycarbonatediol and thermoplastic polyurethane made from the polycarbonatediol
CN105762278B (en) * 2016-03-04 2018-05-01 苏州大学 A kind of vacuum deposition apparatus and prepare the method for organic electroluminescence device using it
JP6876520B2 (en) * 2016-06-24 2021-05-26 キヤノントッキ株式会社 Substrate sandwiching method, substrate sandwiching device, film forming method, film forming device, and electronic device manufacturing method, substrate mounting method, alignment method, substrate mounting device
US20190355906A1 (en) * 2017-05-19 2019-11-21 Sharp Kabushiki Kaisha Vapor deposition method, and el device manufacturing method
JP6468540B2 (en) * 2017-05-22 2019-02-13 キヤノントッキ株式会社 Substrate transport mechanism, substrate mounting mechanism, film forming apparatus, and methods thereof
JP2024037209A (en) * 2022-09-07 2024-03-19 キヤノントッキ株式会社 Film-forming equipment, driving method of film-forming equipment, and film-forming method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051375A (en) * 1991-06-25 1993-01-08 Canon Inc Vacuum treating device
JP3516346B2 (en) * 1992-09-08 2004-04-05 大日本印刷株式会社 Jig for sputtering
JPH1046339A (en) * 1996-07-29 1998-02-17 Matsushita Electric Ind Co Ltd Substrate handling method
JP2004183044A (en) * 2002-12-03 2004-07-02 Seiko Epson Corp Mask vapor deposition method and apparatus, mask and mask manufacturing method, display panel manufacturing apparatus, display panel and electronic equipment
JP2004303559A (en) * 2003-03-31 2004-10-28 Tohoku Pioneer Corp Alignment device, alignment method, and organic el element manufactured by using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400345B (en) * 2008-04-09 2013-07-01 Ulvac Inc Vapor source and film forming apparatus

Also Published As

Publication number Publication date
WO2006090749A1 (en) 2006-08-31
JP4609757B2 (en) 2011-01-12
CN101090996A (en) 2007-12-19
CN101090996B (en) 2010-05-26
KR100932140B1 (en) 2009-12-16
KR20070087080A (en) 2007-08-27
JP2006233259A (en) 2006-09-07
TWI316968B (en) 2009-11-11

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