TWI265188B - Adhesive films and method for manufacturing adhesive film - Google Patents
Adhesive films and method for manufacturing adhesive filmInfo
- Publication number
- TWI265188B TWI265188B TW093139608A TW93139608A TWI265188B TW I265188 B TWI265188 B TW I265188B TW 093139608 A TW093139608 A TW 093139608A TW 93139608 A TW93139608 A TW 93139608A TW I265188 B TWI265188 B TW I265188B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin layer
- adhesive film
- adhesive
- manufacturing
- bodies
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
Abstract
An adhesive film (4) is provided, having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), in which the lowest viscosity in the temperature range lower than the bonding temperature of the first resin layer (10) is higher than the lowest viscosity in the temperature range lower than the bonding temperature of the second and third resin layers (20, 25). When first and second bodies (40, 50) to be bonded are hot pressed while sandwiching the adhesive film (4), the second resin layer (20) flows out toward the outside of the body (50). However, since the first resin layer (10) containing conductive particles (12) does not flow out but stays between the first and second bodies (40, 50), the number of conductive particles (12) sandwiched between first and second connection terminals (42, 52) increases.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004007492A JP5196703B2 (en) | 2004-01-15 | 2004-01-15 | Adhesive film |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200525004A TW200525004A (en) | 2005-08-01 |
TWI265188B true TWI265188B (en) | 2006-11-01 |
Family
ID=34792183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093139608A TWI265188B (en) | 2004-01-15 | 2004-12-20 | Adhesive films and method for manufacturing adhesive film |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5196703B2 (en) |
KR (1) | KR101151133B1 (en) |
TW (1) | TWI265188B (en) |
WO (1) | WO2005068573A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI386475B (en) * | 2007-06-27 | 2013-02-21 | Sony Chem & Inf Device Corp | Adhesive film, connecting method, and connected structure |
Families Citing this family (19)
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JP4735229B2 (en) * | 2005-12-12 | 2011-07-27 | 住友ベークライト株式会社 | Anisotropic conductive film |
WO2009001605A1 (en) * | 2007-06-26 | 2008-12-31 | Sony Chemical & Information Device Corporation | Anisotropic elctroconductive material, connection structure, and process for producing the connection structure |
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JP5970814B2 (en) * | 2009-08-05 | 2016-08-17 | 味の素株式会社 | the film |
JP5631654B2 (en) | 2010-07-28 | 2014-11-26 | デクセリアルズ株式会社 | Manufacturing method and connection method of mounting body |
JP5369163B2 (en) * | 2011-10-19 | 2013-12-18 | 三菱電機株式会社 | Insulating sheet and semiconductor device |
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KR101651718B1 (en) | 2012-05-14 | 2016-08-29 | 주식회사 엘지화학 | Preparation method for pressure sensitive adhesive article |
JP5880283B2 (en) * | 2012-05-29 | 2016-03-08 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
JP2015079586A (en) * | 2013-10-15 | 2015-04-23 | デクセリアルズ株式会社 | Anisotropic conductive film |
US20150371916A1 (en) * | 2014-06-23 | 2015-12-24 | Rohm And Haas Electronic Materials Llc | Pre-applied underfill |
WO2016114314A1 (en) | 2015-01-13 | 2016-07-21 | デクセリアルズ株式会社 | Anisotropic conductive film |
TWI691977B (en) * | 2015-05-27 | 2020-04-21 | 日商迪睿合股份有限公司 | Anisotropic conductive film and connection structure |
JP6750197B2 (en) * | 2015-07-13 | 2020-09-02 | デクセリアルズ株式会社 | Anisotropic conductive film and connection structure |
CN114196334A (en) * | 2016-01-29 | 2022-03-18 | 昭和电工材料株式会社 | Adhesive tape, method for producing same, and reel for adhesive film |
KR20230056827A (en) * | 2021-10-20 | 2023-04-28 | 에이치엔에스하이텍 (주) | Method for manufacturing anisotropic conductive adhesive film with controlled fluidity of conductive particles |
KR20230056826A (en) * | 2021-10-20 | 2023-04-28 | 에이치엔에스하이텍 (주) | Anisotropic conductive adhesive film with controlled fluidity of conductive particles |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61195179A (en) * | 1985-02-25 | 1986-08-29 | Matsushita Electric Ind Co Ltd | Anisotropically conductive adhesive sheet |
JPH01236588A (en) * | 1988-03-17 | 1989-09-21 | Matsushita Electric Ind Co Ltd | Aeolotropic conductive adhesive body |
JPH03107888A (en) * | 1989-09-21 | 1991-05-08 | Sharp Corp | Connecting structure for circuit board |
JPH04366630A (en) * | 1991-06-13 | 1992-12-18 | Sharp Corp | Anisotropic conductive adhesive tape |
JPH0645024A (en) * | 1992-07-22 | 1994-02-18 | Hitachi Chem Co Ltd | Anisotropic conductive adhesive film |
JPH079821B2 (en) * | 1993-03-25 | 1995-02-01 | 日本黒鉛工業株式会社 | Method for producing three-layer structure anisotropic conductive film member |
JPH07224252A (en) * | 1994-02-10 | 1995-08-22 | Hitachi Chem Co Ltd | Bonded insulating material sheet, copper-clad bonded insulating material sheet, their production, and production of multilayer circuit board from them |
JPH07230840A (en) * | 1994-02-17 | 1995-08-29 | Hitachi Chem Co Ltd | Connecting member and electrode connecting structure using the same |
JP4032439B2 (en) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | Connection member, electrode connection structure and connection method using the connection member |
JPH08279388A (en) * | 1995-04-04 | 1996-10-22 | Idemitsu Kosan Co Ltd | Connecting method of electric circuit |
TW505686B (en) * | 1996-07-15 | 2002-10-11 | Hitachi Chemical Ltd | Film-like adhesive for connecting circuit and circuit board |
TW560535U (en) * | 1997-02-27 | 2003-11-01 | Seiko Epson Corp | Adhesive, liquid crystal device and electronic apparatus |
JP3871082B2 (en) * | 1997-03-28 | 2007-01-24 | 日立化成工業株式会社 | Film adhesive and circuit board manufacturing method |
JP3678547B2 (en) * | 1997-07-24 | 2005-08-03 | ソニーケミカル株式会社 | Multilayer anisotropic conductive adhesive and method for producing the same |
JP2000290613A (en) * | 1999-04-13 | 2000-10-17 | Hitachi Chem Co Ltd | Thermosetting adhesive sheet |
JP2001052778A (en) * | 1999-08-06 | 2001-02-23 | Hitachi Chem Co Ltd | Anisotropic conductive adhesive film and its manufacture |
JP3372511B2 (en) * | 1999-08-09 | 2003-02-04 | ソニーケミカル株式会社 | Semiconductor element mounting method and mounting device |
JP4696360B2 (en) * | 2000-12-28 | 2011-06-08 | 日立化成工業株式会社 | Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure |
JP2002358825A (en) * | 2001-05-31 | 2002-12-13 | Hitachi Chem Co Ltd | Anisotropic conductive adhesion film |
JP3912244B2 (en) * | 2002-09-24 | 2007-05-09 | 住友電気工業株式会社 | Anisotropic conductive film |
JP2004006417A (en) * | 2003-08-22 | 2004-01-08 | Hitachi Chem Co Ltd | Connecting element and connection structure of electrode using this |
-
2004
- 2004-01-15 JP JP2004007492A patent/JP5196703B2/en not_active Expired - Lifetime
- 2004-12-20 TW TW093139608A patent/TWI265188B/en active
- 2004-12-27 WO PCT/JP2004/019527 patent/WO2005068573A1/en active Application Filing
- 2004-12-27 KR KR1020067014078A patent/KR101151133B1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI386475B (en) * | 2007-06-27 | 2013-02-21 | Sony Chem & Inf Device Corp | Adhesive film, connecting method, and connected structure |
Also Published As
Publication number | Publication date |
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TW200525004A (en) | 2005-08-01 |
KR20060123491A (en) | 2006-12-01 |
JP5196703B2 (en) | 2013-05-15 |
KR101151133B1 (en) | 2012-06-01 |
JP2005200521A (en) | 2005-07-28 |
WO2005068573A1 (en) | 2005-07-28 |
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