CN207303146U - Flexible display device and display device - Google Patents
Flexible display device and display device Download PDFInfo
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- CN207303146U CN207303146U CN201721417013.4U CN201721417013U CN207303146U CN 207303146 U CN207303146 U CN 207303146U CN 201721417013 U CN201721417013 U CN 201721417013U CN 207303146 U CN207303146 U CN 207303146U
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Abstract
Present disclose provides a kind of flexible display device and display device.The flexible display device includes：Flexible display panels, the front of the flexible display panels include circuit binding region, which includes the first flexible substrate, formed with hardened layer in first flexible substrate, wherein, the hardened layer be located at at the corresponding position of circuit binding region；And the integrated circuit layer with lug boss, the integrated circuit layer are engaged by the lug boss with the circuit binding region.By setting hardened layer in the first flexible substrate of flexible display panels, the hardened layer is corresponding with circuit binding region, so as to mitigate integrated circuit layer and flexible display panels engaging processes institute may caused by notch distortion and the problem of tilt under panel.
Description
Technical field
This disclosure relates to display technology field, more particularly to a kind of flexible display device and display device.
Background technology
At present, flexible display screen is generally realized using the mode of COF (Chip On Flex, the chip on fexible film)
With the binding of IC (Integrated Circuit, integrated circuit).COF is soft materials, will not when being crimped with flexible display screen
Cause rupture of line.But COF costs are higher, and circuit cannot be made too thin.
Can directly it be bound using the method for COP (Chip on plastic, the chip on plastics) on flexible display screen
IC, this is developing direction from now on.But COP methods are easy to cause notch distortion and tilting under display panel, so as to cause
Rupture of line and IC short circuits in display panel.
Utility model content
Embodiment of the disclosure solve a technical problem be：Easily there is display panel in the COP methods of correlation technique
The problem of lower notch distortion and tilting.
According to the one side of the embodiment of the present disclosure, there is provided a kind of flexible display device, including：Flexible display panels,
The front of the flexible display panels includes circuit binding region, and the flexible display panels include the first flexible substrate, in institute
State in the first flexible substrate formed with hardened layer, wherein, the hardened layer is located at and the corresponding position of circuit binding region
Put place；And the integrated circuit layer with lug boss, the integrated circuit layer bind area by the lug boss and the circuit
Domain engages.
Alternatively, the area of the hardened layer is greater than or equal to the area of the circuit binding region.
Alternatively, the flexible display panels further include the second flexible substrate, and the hardened layer is in first flexible liner
Between bottom and second flexible substrate.
Alternatively, the back side of first flexible substrate is the back side of the flexible display panels, and the hardened layer is located at
The back side of first flexible substrate.
Alternatively, the flexible display device further includes：Base membrane layer；And cover the hardened layer and the Flexible Displays
First tack coat of back side of panel, is configured as bonding at the back side of the base membrane layer and the flexible display panels；Wherein, institute
State thickness of the thickness less than the part for being covered in the flexible display panels back side of first tack coat of hardened layer.
Alternatively, the thickness range of the hardened layer is 5 microns to 50 microns.
Alternatively, the material of the hardened layer includes：Siloxanes or the resin containing inorganic nanoparticles.
Alternatively, the lug boss is engaged by the second tack coat with the circuit binding region.
Alternatively, second tack coat includes anisotropic conductive film.
According to the other side of the embodiment of the present disclosure, there is provided a kind of display device, including：It is foregoing flexible aobvious
Show device.
In embodiment of the disclosure, by setting hardened layer in the first flexible substrate of flexible display panels, this is hard
It is corresponding with circuit binding region to change layer, may be led so as to mitigate integrated circuit layer and flexible display panels engaging process
The problem of notch distortion is with tilting under the display panel of cause.This can to avoid by under flexible display panels notch distortion may cause
Rupture of line phenomenon and due to flexible display panels tilt institute may caused by integrated circuit layer short circuit phenomenon.
By referring to the drawings to the detailed description of the exemplary embodiment of the disclosure, the further feature of the disclosure and its
Advantage will be made apparent from.
Brief description of the drawings
The attached drawing of a part for constitution instruction describes embodiment of the disclosure, and is used to solve together with the description
Release the principle of the disclosure.
Referring to the drawings, according to following detailed description, the disclosure can be more clearly understood, wherein：
Fig. 1 is the sectional view for the structure for schematically showing the flexible display device according to the disclosure some embodiments.
Fig. 2 is the sectional view for the structure for schematically showing the flexible display device according to the disclosure other embodiments.
Fig. 3 is the sectional view for the structure for schematically showing the flexible display device according to the disclosure other embodiments.
Fig. 4 is the flow chart for the manufacture method for showing the flexible display device according to the disclosure some embodiments.
Fig. 5 A are to schematically show in the manufacturing process according to the flexible display device of the disclosure some embodiments one
The sectional view of the structure in stage.
Fig. 5 B are to schematically show in the manufacturing process according to the flexible display device of the disclosure some embodiments one
The sectional view of the structure in stage.
Fig. 6 is the flow chart for the manufacture method for showing the flexible display device according to the disclosure other embodiments.
Fig. 7 is to schematically show in the manufacturing process according to the flexible display device of the disclosure other embodiments one
The sectional view of the structure in stage.
Fig. 8 is to schematically show in the manufacturing process according to the flexible display device of the disclosure other embodiments one
The sectional view of the structure in stage.
Fig. 9 is the top view for schematically showing the flexible display device according to the disclosure some embodiments；Wherein Fig. 1,
Fig. 2 and Fig. 3 is the sectional view along the structures intercepted of the line A-A ' in Fig. 9.
It should be understood that the size of the various pieces shown in attached drawing is not to be drawn according to actual proportionate relationship.
In addition, same or similar reference number represents same or similar component.
Embodiment
The various exemplary embodiments of the disclosure are described in detail now with reference to attached drawing.Description to exemplary embodiment
It is merely illustrative, never as to the disclosure and its application or any restrictions used.The disclosure can be with many differences
Form realize, be not limited to the embodiments described herein.These embodiments are provided so that the disclosure is thorough and complete, and
The scope of the present disclosure is given full expression to those skilled in the art.It should be noted that：Unless specifically stated otherwise, otherwise implement at these
The component and positioned opposite, material component, numerical expression and the numerical value of step illustrated in example, which should be construed as merely, to be shown
Example property, not as limitation.
" first ", " second " and the similar word used in the disclosure is not offered as any order, quantity or again
The property wanted, and be used only to distinguish different parts.The similar word such as " comprising " or "comprising" means the key element before the word
Cover the key element enumerated after the word, it is not excluded that be also covered by the possibility of other element." on ", " under ", "left", "right" etc. are only used
In representing relative position relation, after the absolute position for being described object changes, then the relative position relation may also be correspondingly
Change.
In the disclosure, when being described to certain device between the first device and the second device, in the certain device
There may be device between two parties between the first device or the second device, there can not also be device between two parties.When being described to specific device
When part connects other devices, which can be directly connected to without device between two parties with the other devices, can also
It is not directly connected to the other devices and there is device between two parties.
All terms (including technical term or scientific terminology) that the disclosure uses are common with disclosure fields
The implication that technical staff understands is identical, unless otherwise specifically defined.It is also understood that in term such as defined in the general dictionary
The implication consistent with their implications in the context of correlation technique should be interpreted as having, without application idealization or
The meaning of extremely formalization is explained, unless clearly so definition here.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as part for specification.
The inventor of the disclosure has found, during IC is bound directly on flexible display screen using the method for COP, by
Higher in the hardness of IC, directly crimping can cause and PSA (the Pressure Sensitive in the notacoria structure of IC bindings
Adhesive, pressure sensitive adhesive) flowing.This will cause notch distortion under display panel so as to cause the phenomenon for rupture of line occur.
In addition, in the related art, IC lug bosses (bump) by ACF (Anisotropic Conductive Film,
Anisotropic conductive film) engaged with the circuit binding region of display panel.ACF is a kind of lateral isolation and leading for longitudinally turning on
Electric glued membrane.It can realize that the longitudinal direction of IC and the circuit in display panel turn on by ACF to implement joint technology.The hair of the disclosure
A person of good sense also found, during IC is bound directly on flexible display screen using the method for COP, IC is directly crimped and is also possible to
So that panel tilts, panel is caused to tilt ACF (Anisotropic Conductive Film, the anisotropy conductiving glue in region
Film) build-up of particles.And ACF is turned on by conducting particles.Due to the flow deformation of notacoria glue-line (such as PSA), panel
It is excessive to tilt the build-up of particles in region, produces transverse pressure, so as to cause ACF particles to be turned on by laterally crushing.Laterally
The contacts side surfaces of the ACF particles of conducting and two IC lug bosses, so as to cause IC short circuit phenomenons.
The disclosure inventors herein proposes a kind of structure of flexible display device, so as to mitigate integrated circuit layer with it is soft
Property display panel engaging process institute may caused by notch distortion and the problem of tilt under display panel.Retouch in detail below in conjunction with the accompanying drawings
State the structure of the flexible display device according to the disclosure some embodiments.
Fig. 1 is the sectional view for the structure for schematically showing the flexible display device according to the disclosure some embodiments.
As shown in Figure 1, the flexible display device includes flexible display panels 10.The front of the flexible display panels 10 includes
Circuit binding region 1042.In certain embodiments, flexible display panels can include viewing area 92 and non-display area 94, please join
As shown in Figure 9, and circuit binding region is located at the non-display area 94.Here, Fig. 1 is along the line A-A ' in Fig. 9
The sectional view of the structure of interception.
As shown in Figure 1, the flexible display panels 10 include the first flexible substrate 102.The shape in first flexible substrate 102
Into there is hardened layer 14.The hardened layer 14 be located at at the 1042 corresponding position of circuit binding region.For example, the hardened layer 14
The underface of circuit binding region 1042 can be located at；It can also be located off the position of the underface of circuit binding region 1042
Put, but at least part of hardened layer is located at the underface of circuit binding region 1042.In another example at least the one of the hardened layer 14
Part is overlapped in the positive projection of flexible display panels with circuit binding region.
As shown in Figure 1, the flexible display device further includes the integrated circuit layer 12 with lug boss 122.The integrated circuit
Layer 12 is engaged by the lug boss 122 with circuit binding region 1042.
It is hard by being set in the first flexible substrate of flexible display panels in the flexible display device of above-described embodiment
Change layer, the hardened layer is corresponding with circuit binding region, is engaged so as to mitigate integrated circuit layer with flexible display panels
The problem of notch distortion is with tilting under display panel caused by journey institute is possible.This can be to avoid due to notch distortion under flexible display panels
Rupture of line phenomenon caused by institute is possible and the integrated circuit layer short circuit caused by flexible display panels tilting institute is possible are now
As.
In certain embodiments, as shown in Figure 1, the back side of the first flexible substrate 102 is the back side of flexible display panels 10,
The hardened layer is located at the back side of first flexible substrate 102.In this embodiment, by being set at the back side of the first flexible substrate
Hardened layer, the hardened layer is corresponding with circuit binding region, is engaged so as to mitigate integrated circuit layer with flexible display panels
The problem of notch distortion is with tilting under display panel caused by process institute is possible.
In certain embodiments, as shown in Figure 1, the flexible display panels 10 can also include：In the first flexible substrate 102
On structure sheaf 104.The front of the structure sheaf 104 is the front of the flexible display panels 10.Certainly, those skilled in the art
It will be appreciated that material layer or functional layer that structure sheaf 104 here is included etc., for example, the structure sheaf 104 can include shining
Layer, thin-film encapsulation layer and display panel circuit layer etc., therefore be not detailed herein.
In certain embodiments, the area of hardened layer 14 is greater than or equal to the area of circuit binding region 1042.So may be used
The big region that must be covered in below circuit binding region so that hardened layer can try one's best, so as to preferably mitigate display panel
The problem of lower notch distortion and tilting.
In certain embodiments, the material of the hardened layer 14 can include：Siloxanes contains inorganic nanoparticles
Resin etc..Certainly, it will be appreciated by those skilled in the art that the material of the hardened layer of the embodiment of the present disclosure can also use other tools
There is the material of hardening function, therefore, the scope of the embodiment of the present disclosure is not limited to that.
In certain embodiments, as shown in Figure 1, the flexible display device can also include base membrane layer 17 and covering hardened layer
14 and first tack coat 16 at 10 back side of flexible display panels (i.e. the back side of the first flexible substrate 102).17 conduct of base membrane layer
The lower protective film of flexible display panels, plays flexible display panels protection supporting role.First tack coat 16 is configured as
The back side of the base membrane layer 17 and the flexible display panels 10 is bonded.For example, first tack coat 16 can include pressure-sensitive adhesion
Agent.Alternatively, the thickness H of the hardened layer 141Less than the portion for being covered in the flexible display panels back side of first tack coat 16
The thickness H divided2.In this way, during bonding base membrane layer at the flexible display panels back side, the first tack coat can be completely covered firmly
Change layer, so as to avoid due to the base membrane layer out-of-flatness problem that hardened layer is higher by the flexible display panels back side and is likely to occur so that
Base membrane layer is bonded as far as possible smooth.
Alternatively, the thickness range of the hardened layer 14 can be 5 microns to 50 microns.For example, the thickness of the hardened layer 14
It can be 10 microns, 20 microns, 30 microns or 40 microns etc..Hardened layer enables to bonding base in above-mentioned thickness range
During film layer, base membrane layer is bonded more smooth.
In certain embodiments, as shown in Figure 1, lug boss 122 can pass through the second tack coat 18 and circuit binding region
1042 engagements.For example, second tack coat 18 can include ACF.Certainly, it will be appreciated by those skilled in the art that lug boss 122
The mode engaged with circuit binding region 1042 can be not limited to that, such as lug boss 122 and circuit can be bound area
Domain 1042 is directly crimped together.
Fig. 2 is the sectional view for the structure for schematically showing the flexible display device according to the disclosure other embodiments.
Here, Fig. 2 is the sectional view along the structures intercepted of the line A-A ' in Fig. 9.The structure of flexible display device shown in the Fig. 2 with
The structure of flexible display device shown in Fig. 1 is similar.Compared to Figure 1, the structure institute of the flexible display device shown in Fig. 2 is different
Be：In the flexible display device shown in Fig. 2, hardened layer 24 is located at the front of the first flexible substrate 102.I.e. hardened layer 24 is set
Put inside flexible display panels 20.With it is noted earlier similarly, hardened layer 24 is positioned at corresponding with circuit binding region 1042
Position at.Here, hardened layer 24 is arranged on to the front of the first flexible substrate 102, that is, is arranged on inside flexible display panels,
Also integrated circuit layer and notch distortion and tilting under display panel caused by flexible display panels engaging process possibility can be mitigated
The problem of.
Fig. 3 is the sectional view for the structure for schematically showing the flexible display device according to the disclosure other embodiments.
Here, Fig. 3 is the sectional view along the structures intercepted of the line A-A ' in Fig. 9.The structure of flexible display device shown in the Fig. 3 with
The structure of flexible display device shown in Fig. 2 is similar.Compared with Fig. 2, the structure institute of the flexible display device shown in Fig. 3 is different
Be：Flexible display panels 30 shown in Fig. 3 can also include the second flexible substrate 306, wherein, hardened layer 34 is first soft at this
Between property substrate 102 and second flexible substrate 306.For example, as shown in figure 3, the second flexible substrate can be in the first flexible liner
On bottom.In this embodiment, hardened layer can be located in the Double-layer flexible substrate inside flexible display panels, can also mitigate
Integrated circuit layer and flexible display panels engaging processes institute may caused by notch distortion and the problem of tilt under display panel.
It should be noted that the Double-layer flexible substrate shown in Fig. 3 is except including the first flexible substrate 102 and the second flexible liner
Outside bottom 306, the insulating layer being additionally may included between the first flexible substrate 102 and the second flexible substrate 306 (does not show in Fig. 3
Go out, such as the material of the insulating layer can include silica).Hardened layer can be located at the first flexible substrate and the insulating layer it
Between, or between the insulating layer and the second flexible substrate.
In the flexible display device of above example, hardening is provided with the first flexible substrate of flexible display panels
Layer, such as hardened layer is set in the front of the first flexible substrate or the back side, the hardened layer is corresponding with circuit binding region, so that
Can mitigate integrated circuit layer and flexible display panels engaging process institute may caused by notch distortion and tilting under display panel
Problem.This can be to avoid by rupture of line phenomenon caused by notch distortion institute possibility under flexible display panels and since flexibility is aobvious
Show that panel tilts integrated circuit layer short circuit phenomenon caused by institute's possibility.
In embodiment of the disclosure, a kind of display device is additionally provided.The display device can include foregoing
Flexible display device, such as the flexible display device shown in Fig. 1, Fig. 2 or Fig. 3.
In embodiment of the disclosure, a kind of manufacture method of flexible display device is additionally provided.
In embodiment of the disclosure, which can include：Flexible display panels are provided.The flexible display panels
Front include circuit binding region.The flexible display panels include the first flexible substrate, are formed in first flexible substrate
Have hardened layer, wherein, the hardened layer be located at at the corresponding position of circuit binding region.The back side of first flexible substrate
For the back side of the flexible display panels.For example, the hardened layer can be formed in the back side of the first flexible substrate.In another example this is hard
The front of the first flexible substrate can also be formed in by changing layer.
In certain embodiments, in the step of providing flexible display panels, which can also include the
Two flexible substrates, the hardened layer is between the first flexible substrate and the second flexible substrate.That is, it is formed in the first flexibility in hardened layer
Substrate it is positive in the case of, which can be formed between the first flexible substrate and the second flexible substrate.
In certain embodiments, there is provided the step of flexible display panels can include：By wet coating technique first
Hardened layer is formed in flexible substrate.For example, it can be formed by wet coating technique in the front of the first flexible substrate or the back side
Hardened layer.Certainly, it will be appreciated by those skilled in the art that the step of providing flexible display panels can also include other steps,
Such as the step of structure sheaf is formed on the first flexible substrate etc..
In embodiment of the disclosure, which can also include：The lug boss of integrated circuit layer is tied up with circuit
Region engagement is determined so that the integrated circuit layer to be engaged with flexible display panels.For example, by heat pressing process, the second tack coat is utilized
Lug boss is engaged with circuit binding region.
In the manufacture method of above-described embodiment, formed with hardened layer in the first flexible substrate, the hardened layer be located at
At the corresponding position of circuit binding region；Then integrated circuit layer is engaged with flexible display panels.Held in the joint technology
In capable process, hardened layer provides a flat platform to absorb stress, so that by stress mean allocation so that viscous to first
The pressure of knot layer can be uniformly distributed.This can mitigate caused by integrated circuit layer and flexible display panels engaging process institute possibility
Under display panel notch distortion and tilt the problem of, so as to avoid by under flexible display panels notch distortion institute may caused by
Rupture of line phenomenon and the integrated circuit layer short circuit phenomenon caused by flexible display panels tilting institute is possible.
Hardened layer is formed in separately below to the situation of the back or front of the first flexible substrate, be described in detail according to this public affairs
Open the manufacturing process of the flexible display device of some embodiments.
Fig. 4 is the flow chart for the manufacture method for showing the flexible display device according to the disclosure some embodiments.Fig. 5 A, figure
5B and Fig. 1 is some stages in the manufacturing process according to the flexible display device of the disclosure some embodiments that schematically show
Structure sectional view.The flexibility according to some embodiments of the disclosure is described in detail with reference to Fig. 4, Fig. 5 A, Fig. 5 B and Fig. 1
The manufacturing process of display device.
As shown in figure 4, in step S42, there is provided flexible display panels, the front of the flexible display panels are bound including circuit
Region, the flexible display panels include the first flexible substrate, and the back side of first flexible substrate is the back of the body of the flexible display panels
Face.
Fig. 5 A are schematically shown in the manufacturing process according to the flexible display device of the disclosure some embodiments in step
The sectional view of the structure of rapid S42.As shown in Figure 5A, there is provided flexible display panels 10.The front of the flexible display panels 10 can be with
Including circuit binding region 1042.The flexible display panels 10 can include the first flexible substrate 102.First flexible substrate
102 back side is the back side of the flexible display panels 10.The flexible display panels 10 are additionally may included in the first flexible substrate 102
On structure sheaf 104, wherein, circuit binding region 1042 is located at the front of structure sheaf 104.
In certain embodiments, there is provided the step of flexible display panels can include：The coating flexible base in glass support plate
Bottom material layer, and by flexible base material layer film-forming to form the first flexible substrate.
In certain embodiments, there is provided the step of flexible display panels can also include：Formed in the first flexible substrate
Barrier layer (barrier layer, the barrier layer is such as including silicon nitride or silica), and TFT is completed over the barrier layer
The making of (Thin Film Transistor, thin film transistor (TFT)) array element.
In certain embodiments, there is provided the step of flexible display panels can also include：Hair is formed on tft array element
Photosphere (such as OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) luminescent layer), is then shining
Thin-film encapsulation layer (Thin film encapsulation, referred to as TFE) is formed on layer.The thin-film encapsulation layer can include
The stacked structure of inorganic/organic layer.
In certain embodiments, there is provided the step of flexible display panels can also include：Pasted in TFE thin-film encapsulation layers
Upper protective film, the size of the upper protective film can be than the size bigger of the first flexible substrate, so as to be formd in glass support plate
Flexible display panels；Then by flexible display panels, (Laser lift off, are referred to as laser lift-off from glass support plate
LLO).Here, flexible display panels include the first flexible substrate and the structure sheaf on first flexible substrate.Such as the knot
Structure layer can include：Barrier layer, tft array element, luminescent layer and thin-film encapsulation layer etc..In addition, the structure sheaf can also include
Display panel circuit layer etc..For example, display panel circuit layer can be formed before thin-film encapsulation layer is formed.
Fig. 4 is returned to, in step S44, hardened layer is formed at the back side of the first flexible substrate, which is located at ties up with circuit
Determine at the corresponding position in region.
Fig. 5 B are schematically shown in the manufacturing process according to the flexible display device of the disclosure some embodiments in step
The sectional view of the structure of rapid S44.As shown in Figure 5 B, such as by techniques such as wet coatings at the back side of the first flexible substrate 102
(i.e. the back sides of flexible display panels 10) form hardened layer 14.The hardened layer 14 is located at corresponding with circuit binding region 1042
At position.As shown in Figure 5 B, which can be located at the underface of circuit binding region 1042；Alternatively, the hardened layer 14
The location directly below of circuit binding region 1042 can also be located off, but at least part of hardened layer is located at circuit binding
The underface in region 1042.
Fig. 4 is returned to, in step S46, the lug boss of integrated circuit layer is engaged with circuit binding region with by integrated circuit
Layer is engaged with flexible display panels.
Fig. 1 is schematically shown in the manufacturing process according to the flexible display device of the disclosure some embodiments in step
The sectional view of the structure of S46.As shown in Figure 1, for example by heat pressing process, using the second tack coat 18 by lug boss 122 and electricity
Road binding region 1042 engages, so that integrated circuit layer 12 be engaged with flexible display panels 10.
In certain embodiments, before the lug boss of integrated circuit layer is engaged with circuit binding region, the manufacture
Method can also include：As shown in Figure 1, base membrane layer 17 is sticked to flexible display panels using the first tack coat (such as PSA) 16
The back side of 10 back side, first tack coat 16 covering hardened layer 14 and flexible display panels 10.Alternatively, the hardened layer 14
Thickness H1Less than the thickness H of the part for being covered in 10 back side of flexible display panels of first tack coat 162。
In certain embodiments, after base membrane layer is pasted, the method can also include：Flexible display panels are carried out
Cutting.Here cutting can include complete cut and hemisection.Complete cut refers to that all film layers are all cut off, and obtains single display panel
(being properly termed as display panel unit).Hemisection refers to one layer or two layers of film layer for cutting off outermost, such as can cut electricity
A part for upper protective film above the binding region of road.Then, in the circuit binding region for removing each single display panel
The part of the upper protective film in face, is carried out COP engagements, i.e., is engaged lug boss with circuit binding region using the second tack coat.
So far, there is provided according to the manufacture method of the flexible display device of the disclosure some embodiments.In the manufacture method
In, form hardened layer at the back side of the first flexible substrate, the hardened layer be located at at the corresponding position of circuit binding region；
Then integrated circuit layer is engaged with flexible display panels.During the joint technology performs, hardened layer provides one
Flat platform absorbs stress, so that by stress mean allocation so that the pressure of the first tack coat can be uniformly distributed.This keeps away
Exempt to cause non-uniform stress to be transmitted in first binder due to the skewness of lug boss, it is soft so as to prevent
Property display panel tilt, and then can prevent flexible display panels tilt the ACF build-up of particles in region and with two lug bosses
IC short circuit phenomenons caused by contacts side surfaces, and prevent the problems such as notch distortion causes rupture of line under flexible display panels, so that
Improve the yield of joint technology.
In certain embodiments, the manufacture method can also include：Remove upper protective film, paste functional membrane (such as
POL (Polarizer, polaroid), touch controllable function layer etc.), module technique is completed, so as to form complete flexible module device.
Fig. 6 is the flow chart for the manufacture method for showing the flexible display device according to the disclosure other embodiments.Fig. 7 is
Schematically show the structure in a stage in the manufacturing process according to the flexible display device of the disclosure other embodiments
Sectional view.The manufacture of the flexible display device of the disclosure other embodiments is described in detail with reference to Fig. 6, Fig. 7 and Fig. 2
Journey.
As shown in fig. 6, in step S62, there is provided flexible display panels, the front of the flexible display panels are bound including circuit
Region, the flexible display panels include the first flexible substrate, and the back side of first flexible substrate is the back of the body of the flexible display panels
Face, is located at and the corresponding position of circuit binding region in the front of first flexible substrate formed with hardened layer, the hardened layer
Place.
Fig. 7 is schematically shown in the manufacturing process according to the flexible display device of the disclosure other embodiments in step
The sectional view of the structure of rapid S62.As shown in Figure 7, there is provided flexible display panels 20.The front of the flexible display panels 20 includes electricity
Road binding region 1042.The flexible display panels 20 include the first flexible substrate 102, and the back side of first flexible substrate 102 is
The back side of the flexible display panels 20.It is located in the front of first flexible substrate 102 formed with hardened layer 24, the hardened layer 24
At 1042 corresponding position of circuit binding region.The flexible display panels 20 are additionally may included in the first flexible substrate 102
On structure sheaf 104.The circuit binding region 1042 is located at the front of the structure sheaf 104.The hardened layer 24 is soft positioned at first
Between property substrate 102 and structure sheaf 104.
In certain embodiments, there is provided the step of flexible display panels can include：First flexible substrate is provided；First
Hardened layer is formed in flexible substrate；And the structure sheaf for covering the hardened layer is formed in the first flexible substrate.
Fig. 6 is returned to, in step S64, the lug boss of integrated circuit layer is engaged with circuit binding region with by integrated circuit
Layer is engaged with flexible display panels.
Fig. 2 is schematically shown in the manufacturing process according to the flexible display device of the disclosure other embodiments in step
The sectional view of the structure of rapid S64.As shown in Fig. 2, for example by heat pressing process, using the second tack coat 18 by integrated circuit layer 12
Lug boss 122 engaged with circuit binding region 1042, so that integrated circuit layer 12 be engaged with flexible display panels 20.
In certain embodiments, before step S64, the manufacture method can also include：As shown in Fig. 2, utilize
Base membrane layer 17 is sticked to the back side of flexible display panels 20 by one tack coat 16.
So far, there is provided according to the manufacture method of the flexible display device of the disclosure other embodiments.In the manufacturer
In method, in the front of the first flexible substrate formed with hardened layer, i.e., hardened layer is internally formed in flexible display panels, this is hard
Change layer be located at at the corresponding position of circuit binding region；Then integrated circuit layer is engaged with flexible display panels.At this
During joint technology performs, hardened layer provides a flat platform to absorb stress, so that by stress mean allocation, makes
The pressure of first tack coat must can be uniformly distributed.This can mitigate integrated circuit layer and flexible display panels engaging process institute
The problem of notch distortion is with tilting under display panel caused by possible, so as to avoid by notch distortion institute under flexible display panels
Rupture of line phenomenon caused by possible and the integrated circuit layer short circuit phenomenon caused by flexible display panels tilting institute is possible.
Fig. 8 and Fig. 3 is the manufacturing process for schematically showing the flexible display device according to the disclosure other embodiments
In some stages structure sectional view.The Flexible Displays of other embodiments of the disclosure are described in detail with reference to Fig. 8 and Fig. 3
The manufacturing process of device.
First, as shown in Figure 8, there is provided flexible display panels 30.Bound including circuit in the front of the flexible display panels 30
Region 1042.The flexible display panels 30 include the first flexible substrate 102.The back side of first flexible substrate 102 is the flexibility
The back side of display panel 30.In the front of first flexible substrate 102 formed with hardened layer 34, which is located at and circuit
At 1042 corresponding position of binding region.The flexible display panels 30 are additionally may included on the first flexible substrate 102
Structure sheaf 104.Wherein, circuit binding region 1042 is located at the front of structure sheaf 104.The offer flexible display panels the step of
In, as shown in figure 8, the flexible display panels 30 can also include the second flexible substrate 306, wherein, the hardened layer 34 this
Between one flexible substrate 102 and second flexible substrate 306.For example, second flexible substrate 306 is in first flexible substrate
On 102.First flexible substrate and second flexible substrate form Double-layer flexible substrate.
In certain embodiments, which is additionally may included in the first flexible substrate 102 and the second flexible liner
Insulating layer between bottom 306 (not shown in Fig. 8).Hardened layer can between the first flexible substrate and the insulating layer, or
Between the insulating layer and the second flexible substrate.
In certain embodiments, there is provided the step of flexible display panels can include：First flexible substrate is provided；Form position
Hardened layer on the first flexible substrate；Form the second flexible substrate for directly or indirectly covering hardened layer；And
Structure sheaf is formed in two flexible substrates.
Next, as shown in figure 3, base membrane layer 17 is for example sticked to the back of the body of flexible display panels 20 using the first tack coat 16
Face.Then, such as by heat pressing process, the lug boss 122 of integrated circuit layer 12 and circuit are bound using the second tack coat 18
Region 1042 engages, so that integrated circuit layer 12 be engaged with flexible display panels 30.
So far, there is provided according to the manufacture method of the flexible display device of the disclosure other embodiments.In the manufacturer
In method, formed with hardened layer, i.e. being internally formed in flexible display panels between the first flexible substrate and the second flexible substrate
Have hardened layer, the hardened layer be located at at the corresponding position of circuit binding region；Then by integrated circuit layer and Flexible Displays
Panel engages.During the joint technology performs, hardened layer provides a flat platform to absorb stress, so that should
Power mean allocation so that can be uniformly distributed to the pressure of the first tack coat.This can mitigate integrated circuit layer and Flexible Displays
The problem of notch distortion is with tilting under flexible display panels caused by panel engaging process institute is possible, so as to avoid due to flexibility
Under display panel notch distortion institute may caused by rupture of line phenomenon and due to flexible display panels tilt institute may caused by
Integrated circuit layer short circuit phenomenon.
So far, the presently disclosed embodiments is described in detail.In order to avoid covering the design of the disclosure, do not describe
Some details known in the field.Those skilled in the art as described above, can be appreciated how to implement here completely
Disclosed technical solution.
Although some specific embodiments of the disclosure are described in detail by example, the skill of this area
Art personnel it should be understood that above example merely to illustrate, rather than in order to limit the scope of the present disclosure.The skill of this area
Art personnel it should be understood that can not depart from the scope of the present disclosure and spirit in the case of, modify to above example or
Equivalent substitution is carried out to some technical characteristics.The scope of the present disclosure is defined by the following claims.
Claims (10)
- A kind of 1. flexible display device, it is characterised in that including：Flexible display panels, the front of the flexible display panels include circuit binding region, and the flexible display panels include First flexible substrate, formed with hardened layer in first flexible substrate, wherein, the hardened layer is located to be tied up with the circuit Determine at the corresponding position in region；AndIntegrated circuit layer with lug boss, the integrated circuit layer are connect by the lug boss and the circuit binding region Close.
- 2. flexible display device according to claim 1, it is characterised in thatThe area of the hardened layer is greater than or equal to the area of the circuit binding region.
- 3. flexible display device according to claim 1, it is characterised in thatThe flexible display panels further include the second flexible substrate, and the hardened layer is in first flexible substrate and described second Between flexible substrate.
- 4. flexible display device according to claim 1, it is characterised in thatThe back side of first flexible substrate is the back side of the flexible display panels, and the hardened layer is flexible positioned at described first The back side of substrate.
- 5. flexible display device according to claim 4, it is characterised in that further include：Base membrane layer；AndThe hardened layer and first tack coat at the flexible display panels back side are covered, is configured as the base membrane layer and institute The back side for stating flexible display panels bonds；Wherein, the thickness of the hardened layer is less than the part for being covered in the flexible display panels back side of first tack coat Thickness.
- 6. flexible display device according to any one of claim 1 to 5, it is characterised in thatThe thickness range of the hardened layer is 5 microns to 50 microns.
- 7. flexible display device according to claim 1, it is characterised in thatThe material of the hardened layer includes：Siloxanes or the resin containing inorganic nanoparticles.
- 8. flexible display device according to claim 1, it is characterised in thatThe lug boss is engaged by the second tack coat with the circuit binding region.
- 9. flexible display device according to claim 8, it is characterised in thatSecond tack coat includes anisotropic conductive film.
- A kind of 10. display device, it is characterised in that including：Flexible display device as described in claim 1 to 9 any one.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721417013.4U CN207303146U (en) | 2017-10-30 | 2017-10-30 | Flexible display device and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201721417013.4U CN207303146U (en) | 2017-10-30 | 2017-10-30 | Flexible display device and display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326529A (en) * | 2020-02-28 | 2020-06-23 | 京东方科技集团股份有限公司 | Back membrane structure and display device |
| WO2020192556A1 (en) * | 2019-03-26 | 2020-10-01 | 京东方科技集团股份有限公司 | Flexible display substrate, display panel, display device and fabrication method |
| CN112889144A (en) * | 2018-10-22 | 2021-06-01 | 深圳市柔宇科技股份有限公司 | Flexible substrate, flexible panel and electronic device |
-
2017
- 2017-10-30 CN CN201721417013.4U patent/CN207303146U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112889144A (en) * | 2018-10-22 | 2021-06-01 | 深圳市柔宇科技股份有限公司 | Flexible substrate, flexible panel and electronic device |
| WO2020192556A1 (en) * | 2019-03-26 | 2020-10-01 | 京东方科技集团股份有限公司 | Flexible display substrate, display panel, display device and fabrication method |
| US11937444B2 (en) | 2019-03-26 | 2024-03-19 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible display substrate having first and second bonding regions, display panel, display device, and manufacturing method |
| CN111326529A (en) * | 2020-02-28 | 2020-06-23 | 京东方科技集团股份有限公司 | Back membrane structure and display device |
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