TWI263691B - Sputtering target and method for producing the same - Google Patents
Sputtering target and method for producing the sameInfo
- Publication number
- TWI263691B TWI263691B TW92104304A TW92104304A TWI263691B TW I263691 B TWI263691 B TW I263691B TW 92104304 A TW92104304 A TW 92104304A TW 92104304 A TW92104304 A TW 92104304A TW I263691 B TWI263691 B TW I263691B
- Authority
- TW
- Taiwan
- Prior art keywords
- sputtering target
- sintered body
- sputtering
- oxide
- producing
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Ceramic Products (AREA)
Abstract
A sputtering target is characterized in that the sputtering target will not form cracking, be damaged or generate abnormal discharge during sputtering, and can perform stable sputtering at a high speed, and can obtain a phase change photo recording medium with excellent recording regeneration characteristics under high productivity. The sputtering target is formed of a sintered body sintered from more than one oxide and more than one carbide. Furthermore, the sintered body contains 0.1 wt% to 20 wt% of carbon content, and has a relative density of more than 70%. Particularly, the sintered body is formed of Mo oxide and silicon carbide, and contains 0.1 wt% to 20 wt% of silicon carbide, and has a relative density of more than 70%.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002054738 | 2002-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200303931A TW200303931A (en) | 2003-09-16 |
TWI263691B true TWI263691B (en) | 2006-10-11 |
Family
ID=27784598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92104304A TWI263691B (en) | 2002-02-28 | 2003-02-27 | Sputtering target and method for producing the same |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1441082A (en) |
TW (1) | TWI263691B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5651095B2 (en) * | 2010-11-16 | 2015-01-07 | 株式会社コベルコ科研 | Oxide sintered body and sputtering target |
JP2013047361A (en) * | 2011-08-29 | 2013-03-07 | Mitsubishi Materials Corp | Sputtering target, method for production thereof, thin film using the target, and thin film sheet and laminated sheet provided with the thin film |
CN108655403B (en) * | 2018-06-25 | 2020-08-28 | 河南科技大学 | Preparation method of high-purity tantalum target material for electronic material |
JP2020041217A (en) * | 2018-09-07 | 2020-03-19 | 三菱マテリアル株式会社 | Optical functional film, sputtering target, and method for manufacturing sputtering target |
-
2003
- 2003-02-27 TW TW92104304A patent/TWI263691B/en not_active IP Right Cessation
- 2003-02-27 CN CN03104948A patent/CN1441082A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1441082A (en) | 2003-09-10 |
TW200303931A (en) | 2003-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3611853B2 (en) | Cemented carbide with a binder phase rich surface area and improved edge toughness strength | |
KR100753328B1 (en) | Sputtering target, thin film for optical information recording medium and process for producing the same | |
JP3934160B2 (en) | Method for producing cemented carbide with surface area enriched in binder phase | |
JP2004514790A (en) | Manufacturing method of cemented carbide cutting tool with coating | |
JPS55154565A (en) | Surface-covered sintered hard alloy member | |
WO2012086300A1 (en) | Sputtering target for magnetic recording film, and process for production thereof | |
JP2013139065A (en) | Surface-coated cutting tool with hard coating layer exhibiting superior chipping resistance in high-speed intermittent cutting work | |
CN104630590B (en) | A kind of composite hard alloy material and preparation method thereof | |
ATE205888T1 (en) | METHOD FOR PRODUCING A SINTERED CARBIDE BODY | |
TWI263691B (en) | Sputtering target and method for producing the same | |
SE9802487D0 (en) | Cemented carbide insert with binder phase enriched surface zone | |
CN104099580A (en) | Cutter coating layer having nanometer columnar crystal for enhancing wear resistance and toughness | |
JP2000345207A5 (en) | ||
AU1857001A (en) | Carbonaceous refractory shaped body with improved oxidation behavior and batch composition and method for producing the same | |
JP5080527B2 (en) | Sputtering target | |
JPH0222453A (en) | Surface-treated tungsten carbide-base sintered hard alloy for cutting tool | |
JP2006247751A (en) | Diamond film removing method and manufacturing method of diamond film coated member | |
EP1541262A4 (en) | Iron-based sintered compact and method for production thereof | |
JPS5839764A (en) | Sintered hard alloy | |
EP0399747A3 (en) | Substrate used for magnetic disk and magnetic recording medium using the substrate | |
JPH07150286A (en) | Ticn-based cermet | |
GB860563A (en) | Improved method of surface treatment for non-ferrous bodies | |
JP2666853B2 (en) | Manufacturing method of cemented carbide | |
Jones et al. | Theory of aggregation of nitrogen in diamond | |
JPS56169236A (en) | Manufacture of stylus with electrode |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |