TWI261379B - Three-dimensional LED device - Google Patents

Three-dimensional LED device Download PDF

Info

Publication number
TWI261379B
TWI261379B TW94134599A TW94134599A TWI261379B TW I261379 B TWI261379 B TW I261379B TW 94134599 A TW94134599 A TW 94134599A TW 94134599 A TW94134599 A TW 94134599A TW I261379 B TWI261379 B TW I261379B
Authority
TW
Taiwan
Prior art keywords
base
emitting diode
light
support frame
dimensional light
Prior art date
Application number
TW94134599A
Other languages
Chinese (zh)
Other versions
TW200715598A (en
Inventor
Zeng-Boa Sun
Ke-Sin Li
Yung-Yuan Shiu
Original Assignee
Quasar Optoelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quasar Optoelectronics Inc filed Critical Quasar Optoelectronics Inc
Priority to TW94134599A priority Critical patent/TWI261379B/en
Application granted granted Critical
Publication of TWI261379B publication Critical patent/TWI261379B/en
Publication of TW200715598A publication Critical patent/TW200715598A/en

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

The present invention relates to a three-dimensional LED device, which mainly consists of a design of a multi-level reflection chip base and mainly includes a base, at least a level of platform and a support frame connected with the base and each platform, wherein each platform at least contains a lower bevel surface, a plurality of LED chips are disposed on the top side of each platform. When LEDs on each level of platform are illuminated, lights are transversely guided out from the lower bevel surface of its top level of platform such that entire chip base emits multi-directional lights and the overall luminance of emitted lights is augmented as a result of a plurality of LED chips disposed on every level.

Description

1261379 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種發光二極體 冬M a以 1丁尤才曰一種呈立體 $、、、Ό構的發光二極體元件。 【先前技術】 广U二極體的製作技術成熟,使得其應用範圍相 ”泛’而目前的發光二極體元件 用需龙而古丁门 傅也Ik者不同應 路柘俨垃制加 干^毛先一極體元件配合電 著封以為雙插腳的早顆晶片構裝態樣,隨 …支術的成熟’發光二極體元件的構裝不再僅包含一 顆“,可能使用為二至三顆甚至更多的晶片。 誠如第四圖所示,一 種丁面夕顆日日片的發光二極體元 件(5 0 )的構裝結構,苴 再共王要於一基板(5 1)上哼罟 有複數發光二極體晶片Γ β " 一 片(6 〇 ),以使整個該發光二極體 元件(50)的出光輝声接古 1. a 碑度如同,或疋措由不同顏色晶片(5 0 )的使用,達到混出又n 匕出不冋顏色光的效果。 而前段介紹的發亦—托遍一 一極體7L件相較於早期雙插腳的單 顆發光二極體元件的出光艘 尤輝度佳,且其產品尺寸亦較薄, 此一發光二極體元件的执4 的叹计必然有其需求的市場。 由於發光二極體納少+ , 、 的噌電低功耗、高亮度等特性,使得1261379 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode, a winter LED, and a light-emitting diode element having a three-dimensional structure. [Prior Art] The production technology of wide U diodes is mature, which makes the application range "pan" and the current LED components are used in the long-term and the ancient Dingfu Fu Ik is different. Mao's first polar body component is matched with the electric seal to form the two-pin early wafer structure. With the maturity of the branch, the assembly of the LED component no longer contains only one ", may be used as two Three or more wafers. As shown in the fourth figure, the structure of a light-emitting diode component (50) of a dice faceted Japanese film, the re-community king has a plurality of light-emitting lights on a substrate (5 1). The polar body wafer Γ β " a piece (6 〇), so that the entire glow of the light-emitting diode element (50) is connected to the ancient 1. a monument like, or 疋 by different color chips (50) Use, to achieve the effect of mixing out and not licking out the color light. The hairpins introduced in the previous paragraph are also better than the light-emitting diodes of the single-pin diode components of the early dual-pins, and the size of the product is also thin, and this light-emitting diode is also thin. The sigh of the component's implementation 4 must have a market for its needs. Due to the low power consumption and high brightness of the light-emitting diodes, the characteristics of the low-power, high-brightness

其需求快速地成長,目益 A 、 則各豕廒商亦提供針對客戶端產品 勺而東開^ 口適的構裝或結構的服務,因此可預見未來 有更多不同發光二極體的構裝或結構問世。 【發明内容】 1261379 目的係提供一種立體結構的發光 面積下提高發光二極體元件的整 為此,本發明的發明 二極體元件,可於有限的 體出光輝度。 右人達上述目的所提供的主要技術手段係令該立體式發 光二極體元件包含有: 夕層反射晶座,係主要包含有一底座、至少一層基 座及=支禮架,該支擇架係設於該底座上,而各基座則順 序口疋在支撐架上,令底座與基座呈一重疊的立體架構; /、中各基座至)具有一下斜面,該下斜面係為一反射面; 及 複數發光一極體晶片,係分別置放於各基座的上端 面,其發光面朝上。 上述發光二極體元件係主要設計一個立體多層式的晶 座供大里的發光二極體晶片置於其上,以增加出光輝度 以及提高出光面積。 本發明的次一目的係提供一更佳散熱效果的發光二極 體元件,係上述晶座之支撐架内形成一容置空間,供一外 部散熱裝置插設於其中,當晶片被驅動點亮時,其產生的 熱可透過該底座、基座及支撐架傳導至該散熱裝置中,由 散熱裝置將其散熱到外部,而使發光二極體元件具更佳的 散熱效果。 【實施方式】 首先請參閱第一圖所示,係為本發明一較佳實施例的 立體圖,配合第二圖所示,本發明發光二極體元件(1〇) 4 1261379 包含有: -多層反射晶座(2 〇 ) ’係主要包含有一底座(2 1) 、至少一層基座(22)及一支撐架(23),該支 撲架(23)係設於該底座(2 1)上,而各基座(22) 則順序固定在支撐架(23)上,令底座(21)與基座 (22)呈一重疊的立體架構,如二圖所示,各基座(2 2 )與該支撐架(2 3 )係一體成型;其中各基座(2 2 ) 至^具有一下斜面(2 2 2 ),該下斜面( 2 2 2 )係為 :反射面;又’各基座(⑴的上端面(221)亦可 形成為一外斜面,同樣具有反射功能;及 複數發光二極體曰Κq 〇 \ …、 U ( 3 0 ),係分別置放於各基座 (22)的上端面(221),其發光面朝上。 上述各基座(22)的形狀可為各種形狀,其 形為最佳,而多撐八 ”之門可,: 底座(21)及各基座(2 2) 之間了為一體成型。又, 銅等,如 一個好的 具有較大 極體元件 1 )及各基座(2 2 )… (2 3 )、底座(2 (2 2 )係為熱傳導材質,如鋁 此即可提供各發光二極 散熱途徑,特別是各美(3 Q)點亮時 衧別疋各基板之間又 的熱交換面積。 ^此離 請配合參閱第三圖所 r -, 〇 . X 下,係為本發明發光— 撐架(2 3 )内开,成右、部份剖面圖,上述實施例的支 傳導性的散熱== 置空間(231),供一高熱 底座(21)及各層基座當該支撐架(23)、 2 2 )以具熱傳導性的材料製 5 1261379 作日t ’各晶片(q 基座(2 ? )所產生的熱會藉由底座(2 1 )、 耑娩,且古丄 牙木(2 3 )及散熱裝置(4 0 )對外 放逸,具有雨散熱功效。 再請參閱第-岡你:一 ,^ s ^ 圖所不,該發光二極體元件(10)藉 由多層立體的晶庙 κ 1 u j m (2 0 ) 设計,使得获亦一 〇 ) ^ ^ Ff^ ^ s ^ ^ , 便仔極晶片㈡ T面面積上,相勒;於_ Λ 二極體元件(如笛闽 車乂於-般呈平面排列的發光 、女弟四圖所),且古舌丄 因為能置放更f @ & 八 、出光面積,並能 工… 發先二極體晶片,以及晶9 η、 面的设計,爭·(2〇)斜 Τ有效提南各散射方向的出光輝度。 【圖式簡單說明】 第一圖 第二圖 第三圖 係本發明一較佳實施例的立體外觀圖。 係本發明-較佳實施例的部份剖面圖。 係本發明另一較佳實施例的部份剖面圖。 圖。 #既有平面式發光二極體元件的部份剖面 主要元件符號說明】 1〇) (10a)發光二極體元件 (2 0 )晶座 (2 2 )基座 (2 2 2 )下斜面 (2 3 1 )容置空間 (4 〇 )散熱裝置 (51)基座 (2 1 )底座 (2 2 1 )上端面 (2 3 )支樓架 (3 0 )晶片 (5 0 )發光二極體元件 (6 0 )晶片 6Its demand is growing rapidly, and the benefits of A, the various vendors also provide services for the customer's products and the structure or structure of the interface, so it is foreseeable that there will be more different LEDs in the future. Or the structure came out. SUMMARY OF THE INVENTION The object of the present invention is to provide a three-dimensional structure for improving the size of a light-emitting diode element. The invention of the invention provides a diode element with a limited body brightness. The main technical means provided by the right person for the above purpose is that the three-dimensional light-emitting diode element comprises: an eclipse reflection crystal seat, which mainly comprises a base, at least one base and a ritual frame, and the support frame is The base is arranged on the support frame, and the bases are sequentially arranged on the support frame, so that the base and the base have an overlapping three-dimensional structure; /, each of the bases has a lower slope, and the lower slope is a reflection. And a plurality of light-emitting one-pole wafers are respectively placed on the upper end faces of the pedestals, and the light-emitting surface faces upward. The above-mentioned light-emitting diode element is mainly designed with a three-dimensional multilayered crystal substrate for placing a large-sized light-emitting diode wafer thereon to increase the brightness and increase the light-emitting area. The second object of the present invention is to provide a light-emitting diode component with better heat dissipation effect, wherein an accommodating space is formed in the support frame of the crystal seat for an external heat sink to be inserted therein, when the wafer is driven to light The heat generated by the heat can be transmitted to the heat sink through the base, the base and the support frame, and is radiated to the outside by the heat sink, so that the light emitting diode component has better heat dissipation effect. [Embodiment] Referring first to the first embodiment, a perspective view of a preferred embodiment of the present invention is shown. As shown in the second figure, the LED component (1〇) 4 1261379 of the present invention comprises: - a plurality of layers The reflective crystal seat (2 〇) 'system mainly includes a base (2 1), at least one base (22) and a support frame (23), and the support frame (23) is attached to the base (2 1) And each base (22) is sequentially fixed on the support frame (23), so that the base (21) and the base (22) have an overlapping three-dimensional structure, as shown in the second figure, each base (2 2 ) Formed integrally with the support frame (23); wherein each of the bases (2 2 ) to ^ has a lower slope (2 2 2 ), the lower slope (2 2 2 ) is: a reflective surface; (The upper end surface (221) of (1) may also be formed as an outer slope, which also has a reflection function; and the plurality of light-emitting diodes 曰Κq 〇\ ..., U (30) are respectively placed on the bases (22) The upper end surface (221) has a light-emitting surface facing upward. The shape of each of the pedestals (22) can be various shapes, and the shape is optimal, and the door of the eight-door can be:, the base (21) Each base (2 2) is integrally formed. Also, copper, etc., such as a good larger polar body component 1) and each base (2 2 )... (2 3 ), base (2 (2) 2) It is a heat-conducting material, such as aluminum, which can provide a heat-dissipating way for each light-emitting diode, especially when each (3 Q) is lit, and the heat exchange area between the substrates is different. In the third figure, r -, 〇. X is the illumination of the present invention - the bracket (23) is opened in the right, partial cross-sectional view, and the conduction heat dissipation of the above embodiment == space (231 ), for a high-heat base (21) and each layer of the base when the support frame (23), 2 2 is made of a thermally conductive material 5 1261379 for the day t 'each wafer (q pedestal (2 ?) The heat will be released by the base (2 1 ), the delivery, and the ancient altar (2 3 ) and the heat sink (40), which has the function of rain cooling. Please refer to the first - you: one, ^ s ^ Figure, the LED component (10) is designed by multi-layered crystal temple κ 1 ujm (2 0 ), so that it can also be obtained) ^ ^ Ff ^ ^ s ^ ^ (2) T-face area , 勒 ; 于 Λ Λ Λ Λ 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于And can work... The first diode chip, and the design of the crystal 9 η, the surface, the content of the (2〇) slanting Τ Τ 提 提 Τ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Figure 3 is a perspective view of a preferred embodiment of the present invention. A partial cross-sectional view of the preferred embodiment of the invention. A partial cross-sectional view of another preferred embodiment of the invention. Figure. #部分部分部分部分 Partial section main component symbol description] 1〇) (10a) LED component (2 0) crystal holder (2 2 ) pedestal (2 2 2 ) lower slope ( 2 3 1 ) accommodating space (4 〇) heat sink (51) pedestal (2 1 ) base (2 2 1 ) upper end (2 3 ) branch (30) wafer (50) light-emitting diode Component (60) wafer 6

Claims (1)

1261379 十、申請專利範圍: 1 · 一種立體式發光二極體元件,係主要包含有·· 夕層反射晶座’係主要包含有一底座、至少一層基 座及一支樓架,該支撐架係設於該底座上,而各基座則順 序固定在支撐架上,令底座與基座呈一重疊的立體架構; 其中各基座至少具有一下斜面,該下斜面係為一反射面; 及 複數發光二極體晶片,係分別置放於各基座的上端 面’其發光面朝上。 2 ·如申請專利範圍第i項所述之立體式發光二極體 元件,各基座的上端面係形成為一外斜面,該外斜面為一 反射面。 3 ·如申睛專利範圍第1項所述之立體式發光二極體 元件,該支撐架内形成有一容置空間,供一高熱傳導性的 散熱裝置插設其中。 4 .如申請專利範圍第2項所述之立體式發光二極體 元件’該支撐架内形成有一容置空間,供一高熱傳導性的 散熱裝置插設其中。 5 .如申請專利範圍第i、2或3項所述之立體式發 光二極體元件,該支撐架、底座及各基座之間係為一體成 型。 6 .如申請專利範圍第5項所述之立體式發光二極體 元件,該支撐架、底座及各基座係為一熱傳導材質。 7 .如申請專利範圍第6項所述之立體式發光二極體 7 1261379 元件, 元件, 十一 該熱傳導材質為鋁或銅。 •如申請專利範圍第1項所述之立體式發光二極體 各基座係為一圓形狀。 圖式: 次頁 81261379 X. Patent application scope: 1 · A three-dimensional light-emitting diode component mainly includes a · · · · · · · · · · ··································································· Provided on the base, and each base is sequentially fixed on the support frame, so that the base and the base have an overlapping three-dimensional structure; wherein each base has at least a lower inclined surface, the lower inclined surface is a reflective surface; The light-emitting diode chips are respectively placed on the upper end faces of the respective pedestals, and their light-emitting surfaces face upward. 2. The three-dimensional light-emitting diode element according to claim i, wherein the upper end surface of each of the pedestals is formed as an outer inclined surface, and the outer inclined surface is a reflecting surface. 3. The three-dimensional light-emitting diode element according to claim 1, wherein an accommodating space is formed in the support frame for inserting a heat-dissipating heat-dissipating device therein. 4. The three-dimensional light-emitting diode element according to claim 2, wherein an accommodating space is formed in the support frame for a heat-dissipating heat-dissipating device to be inserted therein. 5. The three-dimensional light-emitting diode element according to claim i, 2 or 3, wherein the support frame, the base and the bases are integrally formed. 6. The three-dimensional light-emitting diode component of claim 5, wherein the support frame, the base and each of the bases are a heat conductive material. 7. The three-dimensional light-emitting diode according to claim 6 of the patent scope 7 1261379 component, component, eleven, the heat conduction material is aluminum or copper. • The three-dimensional light-emitting diode according to claim 1 of the patent application has a circular shape. Schema: Next page 8
TW94134599A 2005-10-04 2005-10-04 Three-dimensional LED device TWI261379B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94134599A TWI261379B (en) 2005-10-04 2005-10-04 Three-dimensional LED device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94134599A TWI261379B (en) 2005-10-04 2005-10-04 Three-dimensional LED device

Publications (2)

Publication Number Publication Date
TWI261379B true TWI261379B (en) 2006-09-01
TW200715598A TW200715598A (en) 2007-04-16

Family

ID=37876173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94134599A TWI261379B (en) 2005-10-04 2005-10-04 Three-dimensional LED device

Country Status (1)

Country Link
TW (1) TWI261379B (en)

Also Published As

Publication number Publication date
TW200715598A (en) 2007-04-16

Similar Documents

Publication Publication Date Title
TWI253189B (en) Light emitting device and illumination instrument using the same
US8322896B2 (en) Solid-state light bulb
US6634770B2 (en) Light source using semiconductor devices mounted on a heat sink
TWI274209B (en) Light emitting diode and backlight module having light emitting diode
CN203300693U (en) Light emitting diode chip capable of emitting light in multiple directions and light emitting device thereof
TWI428542B (en) Lighting unit having lighting strips with light emitting elements and a remote luminescent material
TWI398186B (en) Illumination system
TW200905854A (en) White LED device capable of adjusting correlated color temperature
TW201111699A (en) Lighting device with heat dissipation elements
TW201133775A (en) Solid state emitter package including multiple emitters
TW200808123A (en) Lighting device and method of lighting
TW201105898A (en) Luminous module and lighting apparatus
TWM419233U (en) Light source apparatus
TWI354749B (en) Light source apparatus
TWI329181B (en) Illumination device
TW200901863A (en) Heat-dissipation module of a light-emitting device
TWI261379B (en) Three-dimensional LED device
TWM318702U (en) LED module
TWM404312U (en) Thin planar light emitting type LED light source module
TW200822797A (en) Light emitting system, method of fabricating a light emitting module and a subatrate with circuit patterns
TWM343924U (en) Parallel assembling structure of luminant
TWM285044U (en) Three-dimensional LED unit
TWM329138U (en) LED illuminating device
TW200928216A (en) Lighting emitting diode illuminator
TWM345952U (en) Lamp assembly with uniform and auxiliary heat dissipation

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees