TWI256419B - A nozzle source for a thermal evaporation process - Google Patents
A nozzle source for a thermal evaporation processInfo
- Publication number
- TWI256419B TWI256419B TW093105443A TW93105443A TWI256419B TW I256419 B TWI256419 B TW I256419B TW 093105443 A TW093105443 A TW 093105443A TW 93105443 A TW93105443 A TW 93105443A TW I256419 B TWI256419 B TW I256419B
- Authority
- TW
- Taiwan
- Prior art keywords
- crucible
- source
- heat
- substrate
- thermal evaporation
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000002207 thermal evaporation Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 7
- 239000000758 substrate Substances 0.000 abstract 4
- 238000003780 insertion Methods 0.000 abstract 2
- 230000037431 insertion Effects 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Abstract
The present invention relates to a nozzle source for a thermal evaporation process, wherein when a material in the source is deposited on a substrate during the thermal evaporation process, the evaporated material can be uniformly deposited on the substrate and heat can be uniformly applied to the material within a crucible of the source. The nozzle source of the present invention comprises an insertion portion 10 in which nozzles 11 for determining evaporation directions of a chemical material are conically arranged; a crucible 20 that is in the form of a cylinder with an opened upper end and formed with a catching step 21 by which the insertion portion 10 can be caught at the upper end of the crucible; a filament 30 disposed around the crucible 20 to heat the crucible 20; a reflecting plate 40 disposed around the filament 30 to minimize heat loss; and a heat conducting portion 50 inserted into the crucible 20 to transfer heat from the filament 30 to the interior of the crucible 20. According to the nozzle source of the present invention, the uniformity of the thickness of a material layer deposited on a substrate, particularly, upon manufacture of a large substrate can be improved, the deposition rate of a material can be prevented from being rapidly decreased with time, and the use rate of the material can be increased.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0071597A KR100434438B1 (en) | 2002-11-18 | 2002-11-18 | Circular nozzle source for thermal evaporation process |
KR10-2003-0084941A KR100517141B1 (en) | 2003-11-27 | 2003-11-27 | Inclined nozzle type evaporating source of evaporating direction -controllable and the method utilizing the source |
SG200401521-0A SG135026A1 (en) | 2004-03-03 | 2004-03-03 | A nozzle source for thermal evaporation process |
JP2004066639A JP4073409B2 (en) | 2004-03-10 | 2004-03-10 | Nozzle evaporation source for vapor deposition process and vapor deposition method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200530414A TW200530414A (en) | 2005-09-16 |
TWI256419B true TWI256419B (en) | 2006-06-11 |
Family
ID=37614654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093105443A TWI256419B (en) | 2002-11-18 | 2004-03-02 | A nozzle source for a thermal evaporation process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI256419B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110344004A (en) * | 2019-08-29 | 2019-10-18 | 上海天马有机发光显示技术有限公司 | A kind of vapor deposition crucible and evaporated device |
-
2004
- 2004-03-02 TW TW093105443A patent/TWI256419B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200530414A (en) | 2005-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100437768B1 (en) | Thin Film Sputtering Device | |
Tudose et al. | Chemical and physical methods for multifunctional nanostructured interface fabrication | |
US7226643B2 (en) | Thermal pyrolysising chemical vapor deposition method for synthesizing nano-carbon material | |
US20080014825A1 (en) | Deposition apparatus | |
US20020197418A1 (en) | Molecular beam epitaxy effusion cell for use in vacuum thin film deposition and a method therefor | |
EP0740710B1 (en) | Magnetron sputtering apparatus for compound thin films | |
CN109666897A (en) | A kind of crucible and point-type evaporation source | |
TWI361839B (en) | Sputtering film forming apparatus and backing plate for use in sputtering film forming apparatus | |
CN107299321A (en) | Evaporation source and evaporator | |
JP2004307877A (en) | Molecular beam source for depositing thin film, and thin-film depositing method using it | |
WO2001031080A3 (en) | Electron beam physical vapor deposition apparatus | |
US7727335B2 (en) | Device and method for the evaporative deposition of a coating material | |
TWI256419B (en) | A nozzle source for a thermal evaporation process | |
KR20060013735A (en) | Crucible switching apparatus for continuous deposiotion in oled process | |
KR20190056558A (en) | manufacturing method of Ti-Zr alloy target and coating method of gold color thin layer using the same | |
KR100830302B1 (en) | Evaporation source | |
ITRM950539A1 (en) | COMPOSITE STRUCTURE WITH A SEMICONDUCTOR LAYER PLACED ON A DIAMOND LAYER OR SIMILAR TO A DIAMOND AND PROCEDURE FOR ITS | |
CN211665166U (en) | OLED evaporation crucible | |
CN100494476C (en) | Resistance-heated boat and manufacturing method thereof | |
KR101216530B1 (en) | Deposition Apparatus Using Linear Evaporating Source | |
KR100833014B1 (en) | Evaporation apparatus for alloy deposition | |
RU2365842C1 (en) | Crucible aluminium evaporator for molecular-beam epitaxy | |
KR101140145B1 (en) | Apparatus for supplying deposition meterial and film depositing system having the same | |
US20130015057A1 (en) | CATHODE SPUTTER DEPOSITION OF A Cu(In,Ga)X2 THIN FILM | |
CN209522906U (en) | A kind of vapor deposition crucible |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |