TWI240839B - TFT LCD device having multi-layered pixel electrodes - Google Patents
TFT LCD device having multi-layered pixel electrodes Download PDFInfo
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- TWI240839B TWI240839B TW090127318A TW90127318A TWI240839B TW I240839 B TWI240839 B TW I240839B TW 090127318 A TW090127318 A TW 090127318A TW 90127318 A TW90127318 A TW 90127318A TW I240839 B TWI240839 B TW I240839B
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000010409 thin film Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 131
- 230000000694 effects Effects 0.000 description 15
- 239000011241 protective layer Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000011651 chromium Substances 0.000 description 6
- 238000002310 reflectometry Methods 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910000595 mu-metal Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/02—Function characteristic reflective
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
1240839
、,本l明係關於一種薄膜電晶體液晶顯示阳T l⑶)裝置 夏且特別疋關於具有多層式圖素電極以絕緣層***其間 而連接到及極電極之反射或半穿透式TFT LCD裝置。 iljg之背景 TFT LCD裝置—般分類為使用反射層當作圖素電極之反 射式TFT LCD裝置’使用透明圖素電極之穿透式tft :⑶ 裝置’以及根據圖素電極之反射性或漏光性,以部分反射 區域反射層具有穿透區域為圖素電極之半穿透式丁Η [CD 裝置。TFT LCD裝置中’供應電壓來控制液晶對於圖素電 極的安置’在每一圖素形成之薄膜電晶體汲極電極連接到 對應之圖素電極。圖素電極一般透過在夾層絕緣物所形成 之孔洞,而連接到汲極電極。 穿透式TFT LCD裝置中,圖素電極以姻氧化物為透明電 極 '然而’此材料引起料氧化成絕緣氧化物,而阻止供 應到圖素電極的電壓。所以,穿透式丁FT LCD裝置中,及 極電極由單層金屬如鉻(Cr),或含A1金屬層與料化物之兩 層導電層,或鉻在含A1金屬層上形成。 反射式TFT LCD裝置中,通常使用_化物^_為_ 素電極。在此情形之下,形成汲極電極的材料也受到限制 。參考圖1 ’展列出反射式TFT LCD裝置的圖素部分使用易 於氧化的金屬如A1為源極與沒極電極2 1,2 1,。源極與、及 極電極21,2 1’上,放置一種如感光有機絕緣層當作保護層 23。此保護層23有一通孔將汲極電極2丨,連接到圖素雷極u -4 - 1240839 五 、發明説明( 因此,於光學照像蝕刻之曝光顯影以及清潔處理中,若 顯影劑或強力氧化物清潔劑透過接觸通孔汲極電極2丨,時, /及極電極21 ’上層會形成絕緣層25。此絕緣層25增加及極電 極21,與圖素電極27之間的接觸電阻。 為解決此問題,汲極電極21,的上 2,以 一形成,如圖2所列。然而,這種情形下二^ 池内部一樣,因為汲極電極21,的上層212,與圖素電極U 所形成含A1反射層之間陰電性差異,而發.生電池效應。例 口為又到黾池效應腐|虫,間隙2 9近似於石夕層與a 1層之界 面所發生的突起現象,而在上層2丨2,與含A1反射層界面處 形成。同樣地,當圍繞著間隙29之部分含A1反射層掉落時 ,圍繞著通孔的含A1反射層會產生裂痕31。間隙29或裂痕 3 1會引起增加圖素電極27與汲極電極2丨,之間接觸電阻的 問題。 一般而言,電池效應隨著兩金屬層間表面面積差與陰電 性差成比例增加。因此,通常汲極電極21,和圖素電極以相 較有相當小面積’以強迫更多電池效應,因此更增加圖素 電極2 7與〉及極電極2 1 ’之間接觸電阻。 、 為解決電池效應,可以考慮使用MoW4Cr作為反射板或 是圖素電極27。然而如此選擇退化了圖素電極反射性與導 電性。 ^ 因此,需要一種新型TFT LCD裝置可以防止因為電池效 應引起接觸電阻增加或圖素電極與汲極電極之間界面之表 面氧化,而維持高度反射性與導電性。 本紙張尺度適用中國國家標A4規格(21〇χ 297公釐) 1240839 A7
本發明之一目標為提 捉1,、種改善之TFT LCD裝置,可以 預防圖素電極與汲 了以 度反射性與導電性。之間界面之電池效應’而維持高 本务明之另一目標為描 不马挺ί、一種改善之TFT LCD裝置,可 以預防圖素電極與:及極 ^ ,、义柽包極之間界面之絕緣氧化物,而維 持南度反射性與導電性。 本發明之其他目標A摇 、一種改善之TFT LCD裝置,可 以預防圖素電極與汲極雷 ^ %才°之間界面接觸電阻增加,而維 持高度反射性與導電彳生。 ^據本I月,藉著由多層導電層形成圖素電極之TFT 裝置提t、這些與其他目標。較佳地,沒極電極為多 層結構]匕多層結構最上層為強力抗氧化金屬組成。同樣 地〔層結構導電層包含兩層導電層結構,其本身與沒極 電極最上層以及含A1金屬較上層之間有小的陰電性差。 本發明中’兩層導電層結構低層較佳地包含與汲極電極 上層相同材料,例如由Cr|%M〇w選出。含A1金屬常使用純 A或AINd目此兩層導電層結構,低層自心與M〇w選出沉 積,亚且由含A1金屬成為上層,然後對之圖形定義。 值得注意的是,多層導電層結構不侷限於兩層導電層結 構。如有需要,為了有效地減少電池效應,需在兩層導電 層結構下層與上層之間***一中間金屬。 通常汲極電極之多層導電層結構使用高導電性金屬,來 防止因資料線阻值引起之信號電壓降。同樣地,此汲極電 -6,
1240839 五、發明説明(4 °吏用人連接到源極電極資料線相同的導電材料。因此, :成及極電極的多層導電層結構較佳地包含兩層結構,星 有A1層增加導電性 "、 仆+ _ 乂及Ct^MoW在A1上形成而強力抗氧 S二層結構’使用—中間含A1金屬,含A1金屬層之 上下層為WMQW,來防止主動面積切層所引起之突起 現象。當及極電極與資料線為三層結構時,MOW較Cr適用 於下層與上層’因為它較易於與中間含A1層做圖形定義。 根據本發明’因為汲極電極上層與圖素電極下層由相同 材料或具有小陰電性差異金屬形成,#間的電池效應可被 ί略。同樣地,兩層結構之圖素電極中,目前上層與下層 错由相同之光學照像蝕刻處王里,而有相同之表面積。此會 仏成陰私性差# ’但能避免電池效應。因此,圖素電極與 及極電極之界面上’電池效應可明顯減輕,同時可以避免 突起或裂痕現象。 同樣地’因為汲極電極上層為強力抗氧化金屬組成,即 使曝露在氧化材料如顯影劑或清潔劑,絕緣氧化物不會在 上層表面形成,因此防止接觸電阻增加。 败圖之詳細說明 圖1與圖2為傳統反射式TFT LCD裝置圖素部分的切面視 圖。 圖3為一上視圖,列出根據本發明一實施例之上閘極型式 多晶矽TFT LCD裝置圖素部分的佈局。 圖4列出圖j中’沿著線條I之切面視圖。 圖),6,7與8為示意圖,列出一方法之處理步驟,製造 -7- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)-"—--- Ϊ240839 A7 B7 五 發明説明 圖4所列的上閘極型式多晶矽TFT LCD裝置圖素部分。 &佳實施例之說明 本發明稍後將參考附圖完整說明,其中列出本發明之較 佳實施例。然而本發明以不同型式具體化,並且不限於此 處實施例所述。相似數字參照為相似元素。 圖3為一平面上視圖,列出根據本發明一實施例之上閘 極型式多晶矽TFT LCD裝置圖素部分的佈局。參考圖3, 可以清楚地在平面上視圖中見到,本發明之TFT 置圖素部分具有與一般反射式或穿透式Tft [CD裝置相 同之結構。那就是,TFT LCD裝置在基板上形成一主動 區域圖形13,在主動區域圖形13上形成一閘極絕緣層(圖 4之15),以及在閘極絕緣層15上形成一薄膜電晶體。此 薄膜黾a曰體具有一包含許多閘極電極之閘極線1 7,每一 者將線型或棒型之主動區域圖形i 3次區域分成跨越主動 區域圖形1 3的兩部分。 艰成閘極線1 7部 π上形成之絕緣中間層(圖4之19)所覆蓋。絕緣中間層_ ,形成接觸孔22連接源極與汲極電極121,121,,並且主動 區域圖形13上每一線型次區域的兩部分是由閘極電極所分 割。源極與沒極電極12卜121,由導電層组成,分別在此二 部分上形成。關於源極與汲極電極ΐ2ι,12「,源極電極 12 1連接到資料線2 1 〇。此資料綠〇 此貝枓線21Q包含與源極與汲極電極 121,相同材料之導電層’放置於與閘極線”垂直的方 向。 -8- 1240839 A7 _______ B7 五、發明説明(6 ) 在源極與汲極電極12丨,12丨,以及資料線21〇上形成一保 濩層(圖4之23)。此.保護層具有孔洞24曝露每一汲極電極 121’的部分。圖素電極丨27由導電層組成,而在保護層形成 ,透過孔洞24連接至汲極電極丨2丨,。用以供應電容之儲存 線5 3平行於閘極線1 7形成。
本發明上述TFT LCD裝置圖素部分結構與傳統TFT lCD 裝置相同’因為本發明描述圖素電極並非單層結構,而是 多層導電層。 圖4列出沿著圖3線條u之切面圖,一上閘極多晶矽型式 薄膜電晶體置於基槔10。在絕緣中間層19上形成電晶體之 源極與汲極電極121,121,,為透過絕緣中間層丨9的孔洞22 連接到源極與汲極區域。源極與汲極電極丨2丨,丨2 1,為三層 金屬結構,包含底部M〇w層122,中間A1Nd層123以及頂部 MoW層124。在源極與汲極電極12丨,121,上,保護層23為 幾微米厚之感光有機絕緣層。在汲極電極丨2丨,上之保護層 23具有孔洞。沒極電極121,透過孔洞連接在保護層23形成 之圖素電極[27。此圖素電極127由底部“〇冒層27丨與頂部 AINd層272組成。 現在說明根據本發明之一種製造TFT LCD裝置的方法。 圖5到圖8為示意圖,列出形成圖4中TFT LCD裝置圖素部分 之處理步驟。 首先芩考圖5,一非晶矽層在基板1〇形成。然後,藉由執 仃雷射退火處理,將非晶矽層轉換為多晶矽層。一般而言 ,在非晶矽層形成之前,一厚度數百至1〇〇〇八氧化矽層形成 -9 -
1240839 五、發明説明( 阻擋層[1。然後對多晶矽圖形定義,以形成具有許多線型 或條型部分之主動區域圖形13。在主動區域圖形13上沉積 一閘極絕缘層15。此閘極絕緣層15是藉由化學氣相沉積 (CVD)方法,沉積一百至數百A厚度之氧化矽層或氮化矽而 形成。在閘極絕緣層15形成閘極線17。儲存線53也與閘極 線1 7 —起形成。閘極線1 7包含單一含μ金屬層,或多層金 屬包括含Α1金屬層以及MoW層或〇層。值得注意的是,在 一圖素中,每一閘極線17包含一閘極電極與閘極墊。 以閘極電極當作離子植人遮罩’在主動區域圖形Η處執 行離子植入。因此,主動區域圖形13線型部分分成源極與 汲極區域。由於多晶矽LCD裝置中’一般n型電晶體與p型 電晶體放置在週邊部分,因此進行兩次離子植“型與p型 雜質。每一次離子植入處理中,要形成一離子植入遮罩。 參考圖6,以CVD方法在閘極線17上沉積氮化矽或氧化矽 ,來形成絕緣中間層19。在源極與汲極區域上,移除絕緣 中間層19與閘極絕緣層15,形成接觸孔22 ’並且曝露部= 主動區域圖形13。然後,一具有底部M〇w層丨22,中間 八圓層123以及頂部Mow層124之三層金屬層結構,以_ 方法在整個基板表面上形成。之後,使用光阻圖形當作= 刻遮罩’對此三層金屬層圖形定義,來形成源極與:極電 極121,121’與資料線(未在圖5中列出)。 ^ 上述本發明之實施例列出一具有由多晶矽所形成主動區 域之低溫多晶碎TFT LCD裝置,但本發明亦可應用至具有 由非晶矽所形成主動區域之非晶矽TFT LCD裝置,其^非 本紙張尺度適财國S家標準(CNS) M祕( x挪公#) -10- 1240839 A7 _______ B7 _ 五、發明説明(8 ) 成之後並不執彳亍雷射退火。同樣地’本發明可以 應用至底閘極型式TFT LCD裝置與上閘極型式丁FT LCD裝 置。 參考圖7 ’由有機感光絕緣層組成之保護層23在整個基板 1 0表面形成。因為可不需個別蝕刻處理而可圖形定義,此 感光保護層便於與其他絕緣層比較。然後藉由光學曝光與 頌衫處理,形成通孔以曝露每一部分汲極電極12 1,。此時 ’顯影劑強力的氧化特性,透過通孔接觸汲極電極121,。 然而,汲極電極121,的上層124由MoW組成,可強力抗氧化 ,而不形成絕緣氧化物。同樣地,藉由控制光學曝光,可 在保護層23上表面形成粗糙的投影。此粗糙的投影型成微 型透鏡,來提昇稍後型反射板或圖素電極127的集中效率。 參考圖8,底層MoW與上層AINd層271,272以濺鍍處理 連續形成圖素電極127底層與上層。然後,底層m〇w與上層 AINd層27 1,272以光阻圖形為触刻遮罩進行姓刻,來形成 雙層式反射板’亦即是,雙層式圖素電極127。MoW層可便 於與Cr層比較,因為其可與A1Nd層連續蝕刻。其他導電材 料也可能***MoW層與AINd層之間。例如,圖素電極127 底層與上層金屬層271,272之間的大陰電性形成反射板, 可因材料差異而增加電池效應,其考慮在底層與上層金屬 層271,272之中間準位***陰電性之緩衝金屬層。 上述本發明之貫施例列出使用反射層為圖素電極之反射 式TFT LCD裝置,但本發明不限於此實施例。本發明也可 應用至半穿透式TFT LCD裝置與反射式TFT [CD裝置。例 -11 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1240839 五、發明説明( 如’當曝露每—部分汲極電極的保護層形成之後,在圖素 區域形成圖素電極圖形。此圖素電極圖形由透明電極組成 。然後心與八!層連續在基板上透明電極所在表面形成,並 =圖形定a,來形成部分圖素區域裡具有窗孔之反射層圖 ’、電極圖形。此汲極電極由底層M〇w層,中間…層與上層 …層等一層材料組成。此範例中,汲極電極底層與圖素 電極上層並非相同材料’而使得圖素電極底層A1層與淡極 電極上層直接接觸引起的問題可以相當減輕。 如月J面况明所明瞭,值得注意的是,本發明提供一種 TFT LCD裝置,其可預防電化學效應如電池效應在製造處 理上不良的影響’因此防止反射電極的破壞,以及增加反 射率而獲得更高清晰度。 附圖與陳述中,已經揭示本發明之典型較佳實施例,雖 然引用明確項目,募只是使用一般描述,而無限制之用, 本發明之領域在以下申請專利範圍中公佈。 -12- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)
Claims (1)
1240839
1.種薄膜電晶體液晶顯示(TFT LCD)裝置,包含 一基板; 並且具有—源極電極 在该基板上形成一薄膜電晶體 與一沒極電極; 在該基板整個表面上該薄膜電晶體所在之處形成_絕 緣層,並具有一接觸孔曝露部分汲極電極;以及 一對應薄膜電晶體之圖素電極,在該絕緣層上形成, 並透過接觸孔連接到汲極電極, 其中該圖素電極由多層導電層組成。 2.如申請專利範圍第!項之TFT⑽裝置,其中沒極電極為 多層次’並且多層次之最上層由Cr層與MoW層選出。 3·如申請專利範圍第2項之TFTLCD裝置,其中多層導電層 為兩層結構’其中具有與多層次結構最上層相;之底; 材料,以及上層為含八丨金屬。 曰 4·如申請專利範圍第2項之TFT LCD裝置,其中多層導電層 由三層結構組成,纟有與多層次結構最上層#同之底^ 材料,上層為含A1㈣,以及具有陰電性之中間層材^ 位於底層與上層之間的中間準位。 5·如申請專利範圍f 2項之TFT LCD裝置,其中多層結構由 三層式層次組成,包含底部M〇w層與中間含A1金屬層。 6·如申請專利範圍第i項之TFT LCD裝置,其中該薄膜電晶 體為一上閘極型式多晶矽薄膜電晶體。 7.如中請專利範圍第L項之TFT LCD裝置,其中該絕緣層由 感光有基絕緣層組成。 -13- 1240839 A8 B8 C8 D8 六、申請專利範圍 中小型投影工 8.如申請專利範圍第2項之TFT LCD裝置, 作為在該絕緣層上表面形成的微型透鏡。 -14 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)
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TW090127318A TWI240839B (en) | 2001-02-12 | 2001-11-02 | TFT LCD device having multi-layered pixel electrodes |
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JP (1) | JP4707263B2 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN106773418A (zh) * | 2012-05-09 | 2017-05-31 | 株式会社日本显示器 | 显示装置 |
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JP2002258325A (ja) | 2002-09-11 |
US6836299B2 (en) | 2004-12-28 |
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USRE41927E1 (en) | 2010-11-16 |
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