1237320 玫、發明說明： 【發明所屬技術領域】 發明領域 本發明係有關於用以切斷已密封基板之基板之切斷方 5 法及基板之切斷裝置。 另，本說明書中，所謂已密封基板意指已藉由樹脂來 密封安裝有1C(積體電路，Integrated Circuit)等電子零件的 電路基板之基板。又，電子零件為未進行樹脂密封之裸晶， 即，用以形成元件之導電層及絕緣層積層於半導體基板上 10 之晶片。再者，電路基板為印刷配線基板等設有與裸晶電 連接之電路的基板。 相關技術的說明 迄今係使用在已密封基板安裝於切斷機台之狀態下， 15利用切斷刀（刀片），沿著描繪在已密封基板上之切斷部位 (切斷線)切斷已密封基板之基板之切斷方法。根據該基板之 切斷方法，1個已密封基板可分割為多個封裝體（製品）。另， 與多個封裝體相對應之多個電子零件在丨個電路基板上藉 由樹脂一同密封。 20 於前述基板之切斷方法中，首先，進行辨識設於已密 封基板之主表面中未安裝電子零件之面的切斷部位之對準 步驟’該對準步驟，即，切斷部位辨識步驟係在切斷機台 上進行。此時’已密封基板之主表面中安裝有電子零件的 面朝向下方。又’於切斷機台設有用以吸附已密封基板之 l23732〇 10 。因此’已密封基板係由 接著，根據前述切斷部位辨識步 真空吸盤來吸附 ^ 驟中切斷部位的辨識 艮’進行沿著靖部位(切斷❹讀已㈣:板:r斷步驟亦在前述切斷機台上進行。即，前：: 刀斷方法中，切斷步驟及切斷部位辨識步 在切斷機台上進行。 結果， 驟兩者皆 方設有二習知基板之切斷方法中，在切斷機台. 叫片）會落至網藍等。因此，必須定期丢棄落至網藍^ 正下 碎屑 得到===成t，希望增加從1個_基板所 型化及封裝體 5得更長。如此-來，在切斷部位之部位變 辨識所有切斷部位所需之時間變得报長。讀裝置 切㈣齡驟朗，無料靖機台上進行 時間會變長因此’切斷部位辨識步驟及切斷步驟所需的總 某板也㈣〜電路基板大魏且封制_化，則已密封 =::<情形’在已密封基㈣曲時為 20 1237320 又，在切斷機台上之切斷步驟中，會大量產生非常細 小的4屑。因此，為了廢棄處理碎屑，作業者必須定期檢 查設於基板切斷裝置内部之網籃，且以手動作業將積存在 網籃等的碎屑拿出裳置外部。在進行該作業時，為了確保 5作業者的安全，必須停止基板切斷裝置的運作。因此，必 須中斷切斷步驟。結果，切斷已密封基板所需的時間變得 更長。 【發明内容】 發明概要 1〇 本發明有鑑於上述問題，其目的在於減少切斷已密封 基板所需的時間。 於本發明之其中一基板切斷方法中，首先，準備具有 Θ斷部位與標諸之已密封基板。接著，將前述已密封基板 移适至切斷部位辨識機台。然後，在前述切斷部位辨識機 台上辨識前述切斷部位與前述標誌之位置關係。接著，將 月·J迷已密封基板從前述切斷部位辨識機台移送至切斷機 〇 °然後’檢測載置於前述切斷機台之前述已密封基板之 月·J述標諸的位置。接著，根據前述標誌之位置的檢測結果 及別述切斷部位與標誌之位置關係來特定載置於前述切斷 2〇 機 A ^ β σ之前述已密封基板之前述切斷部位的位置。最後，沿 著所特定之前述切斷部位的位置，切斷前述已密封基板。 根據該方法，當在切斷機台上進行已密封基板之切斷 時’在切斷部位辨識機台上可辨識切斷部位與標誌之位置 關係。又，切斷機台上所進行之標誌、的檢測可在極短的時 1237320 間内完成。因此’可縮短切斷已密封基板所需的總和時間。 本發明之其中一基板切斷裝置包含··切斷部位辨識機 台’係具有切斷部位與標誌之已密封基板移送至該切斷部 位辨識機台；辨識機構，係用以在前述切斷部位辨識機台 5 上辨識前述切斷部位與前述標誌之位置關係；切斷機台， 係前述切斷部位辨識機台上的前述已密封基板移送至該切 斷機台；檢測機構，係檢測載置於前述切斷機台之前述已 密封基板之前述標諸的位置；特定機構，係根據前述標誌、 之位置的檢測結果及前述切斷部位與標誌之位置關係來特 10 定載置於前述切斷機台之前述已密封基板之前述切斷部位 的位置；及切斷刀，係沿著所特定之前述切斷部位的位置， 切斷前述已密封基板。 根據前述其中一裝置，可執行前述其中一方法，故可 縮短切斷已密封基板所需的總和時間。 15 於本發明之另一基板切斷方法中，首先，將已密封基 板載置於切斷機台。接著，利用切斷刀切斷裁 斷機台之前述已密封基板。然後，藉由移送機構移:利用 前述切斷刀切斷前述已密封基板時所產生之碎屑。接著， 使由前述移送機賴移送之前述制落至碎⑽納盒 ^據上述方法，由於碎屬藉由移送機構自__於 肩收納盒，故無彡胁止由所進行之已 刀靳動作來取出移送機構上的碎屑。 、土板， 密封基板所需之總和時間。 因此’可縮短切斷已 本發明之另一基板切斷裝置包含：切斷機台，係用以 20 1237320 載置已密封基板；切斷刀，係用以切斷#晋 辦戰罝於別述切斷機 台之前述已密封基板；移送機構，係用以移送利用前述切 斷刀切斷前述已密封基板時所產生之碎4 ;及碎 盒，係用以收納由前述移送機構所移送之前述碎屑。 5 切斷已密封基板所需之總和時間。 圖式簡單說明 根據上述另-裝置，可執行前述另一方法故可縮短 第1圖係實施形態之基板切斷裝置的平面圖。 第2圖係藉由第1圖之基板切斷裝置所切斷之已密封基 1〇 板的透視圖。 第3圖係實施形態之基板切斷裝置之碎屑移送機構的 透視圖。 L實施方式】 較佳實施形態之說明 15 (實施形態1) 以下’根據圖式說明實施形態之基板切斷方法及基板 切斷裝置。 如第1圖所示，實施形態之基板切斷裝置具有用以將已 密封基板1(成形品）移送至裝置本體50内之移送機台A。於 20 移送機台A沿著箭頭Η所示之方向設有用以推出已密封基 板1之推進機7。因此，移送機台Α可將已密封基板1移送至 切斷部位辨識機台B。已密封基板1藉由推進機7從移送機台 A推出，且設置於切斷部位辨識機台B上之預定位置。於該 切斷部位辨識機台B上進行已密封基板1之切斷部位的圖案 1237320 辨識。 又，已密封基板1藉由未圖示之移送機構從切斷部位辨 識機台B移送至切斷機台C。於切斷機台C上進行已密封基 板1之切斷。藉此，1個已密封基板1可分割為多數封裝體5。 5 又，移送機台A、切斷部位辨識機台B及切斷機台C係 如第1圖所示，大致朝一直線並排設置。因此，可極力縮短 移送機台A至切斷部位辨識機台B之移送時間及切斷部位 辨識機台B至切斷機台C之移送時間，同時可減少切斷部位 辨識機台B及切斷機台C的設置空間。另，移送機台A、切 10 斷部位辨識機台B及切斷機台C之配置並不限於第1圖所示 之配置。 又，本實施形態之基板切斷裝置中，用以將已密封基 板1從移送機台A移送至切斷部位辨識機台B之第1移送機 構與用以將已密封基板1從切斷部位辨識機台B移送至切斷 15 機台C之第2移送機構為不同的移送機構。然而，亦可使用 第1移送機構與第2移送機構為相同的移送機構之基板切斷 裝置。 又，於本實施形態之切斷方法中，在切斷機台C所分割 之多數封裝體5係在收容於未圖示之夾具(後述巢構件）的狀 20 態下移送。然後，多數封裝體5進行洗淨、乾燥及檢查。然 後，多數封裝體5以載置於未圖示之最終製品托盤上的狀態 保管。 又，已密封基板1係如第2圖所示，由電路基板2及樹脂 成形體3所構成。於電路基板2之其中一主表面，多個電子 10 1237320 零件一同藉由樹脂密封。又，於已密封基板1之另一主表面 並未搭載電子零件，而描綠有切斷部位4。切斷部位4呈格 子狀。因此，已密封基板1之主表面藉由切斷部位4劃分為 以1對1與多個電子零件相對應之多數領域。即，於該格子 5 狀之切斷部位4所劃分之多數長方形領域中分別設置1個電 子零件。已密封基板1藉由沿著前述切斷部位4切斷而分割 為多數封裝體5。 又，如第2圖所示，於已密封基板1之另一主表面，在 切斷部位4上設有標誌6a及6b。另，該等標誌6a及6b亦可分 10 別設於切斷部位4上以外的位置。又，雖然本實施形態中， 標誌6a及6b分別以黑點來表示，但若為可辨識各標誌6a及 6b與切斷部位4間之位置關係的機構，則亦可為黑點以外的 其他記號。 上述本實施形態之基板切斷裝置可以資料來記憶與標 15 誌6a及6b的位置相對應之切斷部位4的位置。即，該基板切 斷裝置可辨識標誌6a及6b與切斷部位4所構成之切斷部位 圖案。 更具體而言，係如下所述。藉由圖像處理裝置來讀取 標言惠6a及6b與切斷部位4作為圖像資料。根據該圖像資料， 20 算出以標誌6a及6b的位置為基準時之切斷部位4的位置， 即，各標誌6a及6b至各多數切斷部位4之距離資料等。結 果，由於本實施形態之基板切斷裝置可記憶前述距離資料 等，故在切斷步驟中，僅藉由圖像處理裝置讀取載置於切 斷機台C上之已密封基板1的標誌6a及6b的位置，則可算出 1237320 載置於切斷機台C上之已密封基板1之各多數切斷部位4的 位置。 又，切斷部位圖案的辨識在將已洽、封基板1安裝於切斷 機台C上之前，先於切斷部位辨識機台B上進行。因此，根 5據本實施形態之基板切斷方法，基板切斷骏置在切斷步驟 中僅檢測標誌如及6b的位置，則可特定已密封基板丨之切斷 部位4的位置。因此，本實施形態之基板切斷裝置在切斷步 驟中可以極短的時間特定已密封基板1之切斷部位4的位 置。結果，過去的切斷方法中辨識切斷機台上之切斷部位 10所需的時間與辨識切斷部位辨識機台B上之切斷部位圖案 所需的時間和檢測切斷機台C上之標誌&及讣所需的時間 之總和時間幾乎相同。 15 20 又，於切斷部位辨識機係如第丨圖所示，設有可朝 箭頭I之方向在切斷部位辨識機台B内往返之往返部8。往返 部8係在從移送機台A供給已密封基⑻之供給位置9與將已 結束用以辨朗斷部位4之㈣的已密封基板丨移送至切斷 機口 C内之固疋位置15的前段位置之移載位置⑺之間往 返σ亥往返利之往返動作係藉由未圖示之往返移動機構來 進行。又，雖未圖示，但於往返部S設有用以固定已密封基 板1之—固疋機構。因此，根據本實施形態之基板切斷方法， 已:封基板1利用固定機構之吸附作用固定於固定機構 /返°卩8在供給位置9與移載位置10之間往返。 “返崢8係如第1圖所示，設有用以載置由推進 機7所推出之已密封基板1之魅台则式中以圓形表 12 1237320 示）。又’載置台11無法自轉。因此，已密封基板1以搭載 於移送機台A時之姿勢沿著箭頭κ所示之方向移送至載置 台11上。 又，本實施形態之基板切斷裝置設有用以辨識搭載於 5載置台11上之已密封基板1的切斷部位4及標誌6a及6b的位 置之CCD(Charge Coupled device)攝像機等攝影機構12。 又，本實施形態之切斷裝置可藉由在切斷部位辨識機台B 與切斷機台C之間往返之往返移動機構（未圖示）使攝影機 構12朝箭頭J所示之方向移動。 10 於利用前述切斷裝置之切斷方法中，首先進行在切斷 部位辨識機台B上對已密封基板丨辨識標誌以及讣與切斷部 位4之位置關係的切斷部位辨識步驟。 於切斷部位辨識步驟中，首先，已密封基板丨從移送機 台A藉由推進機7朝切斷部位辨識機台b推出。然後，已密 15封基板1藉由固定機構以樹脂成形體3朝下之狀態固定於載 置台Π。接著’藉由攝影機構12攝影標諸6a及6b以及切斷 部位4。藉此，切斷裝置可正確地辨識包含攝影標誌以及讣 與切斷部位4之切斷部位圖案。 另’於切斷部位辨識步驟中，藉由往返部8在供給位置 20 9與移載位置10之間的往返運動及切斷部位辨識機台6内之 攝影機構12的往返運動’可實現無論已密封基板丨之切斷部 位4為何種圖案皆可辨識切斷部位圖案。 又，於切斷部位辨識機台B係如第1圖所示設有基板保 持部13。因此，當在切斷機台c進行切斷步驟時，可將已結 13 1237320 5 10 15 20 束用以辨識切斷部位4 於切斷部__^^ 已密封基板1先保持 多個已果，在切斷步驟中可預先準備 此，可避免〜 斷部位4之步驟的已密封基板1。因 板攻有“須之步驟的已密封基 高切斷步驟的效率。 不良情況發生。因此，可提 向往==台C係如第1圖所示設有可_，之方 台Β 錢部14係在接收從切斷部位辨識機 1口之切_°之已密封基板1的固定位置15與切斷已密封基板 mr6之間往返。另，藉由未圖示之往返移動機構 厂、，^右4進㈣返運動。又，於往返部14係如第1圖所 :’二用以固定已密封基板1或封裝體5之固定機構17。 圭㈤貫^態之固定機構17藉由吸附已密封基板1使已密 二反1固疋於固定機構17。然而，[密封基板1的固定方 地固等來固定已密封基板1的方法、機械性山寺基板1的方法及其他任何方法。 * 於住返部14係'如第1圖所示設有在藉由蚊機構17 定已密封基板1之狀態下’以朝與第1圖之紙面垂直的 2延伸之轴為旋轉轴，使已密封基板1旋轉之圓形的旋轉 卜台18°又’於切斷位置16設有具有用以切斷已密封基板^ 之切斷刀的切斷部19。 2用上述切斷裝置，在切斷部位辨識步驟後，進行切 斷已密封基板1之切斷步驟。在切斷步驟中，首先，已密封 基板1從移載位置1G供給至固定位置15。伴隨於此攝影機 〇 14 12373201237320 Description of the invention: [Technical field of the invention] Field of the invention The present invention relates to a cutting method and a cutting device for cutting a substrate of a sealed substrate. In this specification, the term "sealed substrate" means a substrate on which a circuit substrate on which electronic components such as 1C (Integrated Circuit) are mounted is sealed with a resin. In addition, the electronic component is a bare crystal without resin sealing, that is, a wafer on which a conductive layer and an insulating layer for forming an element are laminated on a semiconductor substrate. The circuit board is a substrate provided with a circuit electrically connected to a bare crystal, such as a printed wiring board. The description of the related art has hitherto been used in a state in which the sealed substrate is mounted on a cutting machine. 15 A cutting knife (blade) is used to cut the substrate along a cutting portion (cut line) drawn on the sealed substrate. Cutting method for sealing substrate. According to the cutting method of the substrate, one sealed substrate can be divided into a plurality of packages (products). In addition, a plurality of electronic parts corresponding to a plurality of packages are sealed together on a circuit board by a resin. 20 In the aforementioned method for cutting a substrate, first, an alignment step of identifying a cutting portion provided on a surface of a main substrate of a sealed substrate where no electronic component is mounted, is performed. The alignment step, that is, the cutting portion identification step It is performed on the cutting machine. At this time, the surface on which the electronic components are mounted on the main surface of the sealed substrate faces downward. Also, a cutting machine is provided with a suction plate for sealing the sealed substrate. Therefore, the "sealed substrate is adsorbed by the vacuum sucker according to the aforementioned cutting part identification step, and the identification of the cutting part in the step is performed." The aforementioned cutting machine is performed. That is, in the front :: knife cutting method, the cutting step and the cutting part identification step are performed on the cutting machine. As a result, both of the steps are provided with two conventional substrate cutting. In the cutting method, the machine will be cut off when the machine is cut off. Therefore, it is necessary to regularly discard the debris falling directly below the net blue ^ to obtain === into t, hoping to increase the size of the substrate and the package 5 to be longer. In this way, the time required to identify all the cut parts becomes longer at the cut parts. The reading device cuts out suddenly, and the time on the machine will be longer. Therefore, the cutting board identification step and the total board required for the cutting step are also ~ the circuit board is large and sealed. Sealing = :: < Case 'is 20 1237320 when the sealed base is warped. In the cutting step on the cutting machine, a lot of very small 4 chips are generated. Therefore, in order to dispose of the debris, the operator must periodically inspect the net basket provided inside the substrate cutting device, and manually remove the debris accumulated in the net basket and the like out of the skirt. During this operation, in order to ensure the safety of the operator, the operation of the substrate cutting device must be stopped. Therefore, the cut-off step must be interrupted. As a result, the time required to cut the sealed substrate becomes longer. SUMMARY OF THE INVENTION In view of the above problems, the present invention aims to reduce the time required to cut a sealed substrate. In one of the substrate cutting methods of the present invention, first, a sealed substrate having a Θ cut portion and a mark is prepared. Next, the sealed substrate is moved to a cutting position recognition machine. Then, the positional relationship between the cutting part and the mark is identified on the cutting part recognition machine. Next, the sealed substrate of the month J is transferred from the cutting site identification machine to the cutting machine 0 °, and then the position of the month of the sealed substrate placed on the cutting machine is detected. . Next, the position of the cutting portion of the sealed substrate placed on the cutting machine A ^ β σ is specified based on the detection result of the position of the mark and the positional relationship between the cutting portion and the mark. Finally, the sealed substrate is cut along the specified position of the cut portion. According to this method, when the sealed substrate is cut on the cutting machine, the positional relationship between the cutting site and the mark can be recognized on the cutting site recognition machine. In addition, the detection of signs and inspections on the cutting machine can be completed in an extremely short time of 1237320. Therefore, 'the total time required for cutting the sealed substrate can be shortened. One of the substrate cutting devices of the present invention includes a cutting part identification machine, which is a sealed substrate with a cutting part and a mark, and is transferred to the cutting part identification machine; an identification mechanism is used for cutting The position recognition machine 5 recognizes the positional relationship between the cutting part and the mark; the cutting machine is the sealed substrate on the cutting part recognition machine and is transferred to the cutting machine; and the detection mechanism is for detecting The position of the aforementioned marks on the aforementioned sealed substrate placed on the aforementioned cutting machine; the specific mechanism is specifically placed on the basis of the detection results of the aforementioned signs, the position, and the positional relationship between the aforementioned cutting parts and the signs. A position of the cutting portion of the sealed substrate of the cutting machine; and a cutting blade cutting the sealed substrate along the specified position of the cutting portion. According to one of the aforementioned devices, one of the aforementioned methods can be performed, so that the total time required to cut the sealed substrate can be shortened. 15 In another substrate cutting method of the present invention, first, the sealed substrate is placed on a cutting machine. Next, the aforementioned sealed substrate of the cutting machine is cut by a cutter. Then, it is moved by the transfer mechanism: the chips generated when the sealed substrate is cut by the cutter. Then, the above-mentioned system transferred by the aforementioned transfer machine is dropped to the crushing box ^ According to the above-mentioned method, since the crushing belongs to the shoulder storage box by the transfer mechanism, there is no threat to the knife that has been carried out. Action to remove debris from the transfer mechanism. , Soil plate, the total time required to seal the substrate. Therefore, another substrate cutting device according to the present invention that can shorten cutting can include: a cutting machine for placing a sealed substrate on 20 1237320; and a cutting knife for cutting off # 晋 办 战 罝 于 别The aforementioned sealed substrate of the cutting machine; a transfer mechanism for transferring the broken pieces 4 generated when the aforementioned sealed substrate is cut by the aforementioned cutting knife; and a crush box for storing the transfer by the aforementioned transferring mechanism The aforementioned debris. 5 The total time required to cut the sealed substrate. Brief Description of the Drawings According to the above-mentioned another device, the above-mentioned another method can be performed, so that the plan view of the substrate cutting device of the first embodiment can be shortened. Fig. 2 is a perspective view of the sealed substrate 10 cut by the substrate cutting device of Fig. 1. Fig. 3 is a perspective view of a chip transfer mechanism of the substrate cutting device of the embodiment. [Embodiment L] Description of a preferred embodiment 15 (Embodiment 1) Hereinafter, a substrate cutting method and a substrate cutting device according to the embodiment will be described with reference to the drawings. As shown in Fig. 1, the substrate cutting device of the embodiment includes a transfer machine A for transferring the sealed substrate 1 (molded product) into the apparatus body 50. A propelling machine 7 for pushing out the sealed substrate 1 is provided at 20 transfer machine A in the direction shown by arrow 20. Therefore, the transfer machine A can transfer the sealed substrate 1 to the cutting site recognition machine B. The sealed substrate 1 is pushed out from the transfer machine A by the pusher 7 and is set at a predetermined position on the cutting site recognition machine B. The pattern 1237320 of the cut portion of the sealed substrate 1 is identified on the cut portion recognition machine B. In addition, the sealed substrate 1 is transferred from the cutting site recognition machine B to the cutting machine C by a transfer mechanism (not shown). The sealed substrate 1 is cut on a cutting machine C. Thereby, one sealed substrate 1 can be divided into a plurality of packages 5. 5 Moreover, as shown in Fig. 1, the transfer machine A, the cutting part recognition machine B, and the cutting machine C are arranged side by side substantially in a straight line. Therefore, it is possible to shorten the transfer time from the transfer machine A to the cutting part recognition machine B and the transfer time from the cutting part recognition machine B to the cutting machine C, and at the same time, it is possible to reduce the cutting part recognition machine B and Installation space of the machine C. In addition, the configurations of the transfer machine A, the cutting part recognition machine B, and the cutting machine C are not limited to those shown in FIG. 1. Further, in the substrate cutting device of this embodiment, a first transfer mechanism for transferring the sealed substrate 1 from the transfer machine A to the cutting location recognition machine B and a first transfer mechanism for transferring the sealed substrate 1 from the cutting location The second transfer mechanism that recognizes that the machine B is transferred to the cut 15 machine C is a different transfer mechanism. However, a substrate cutting device in which the first transfer mechanism is the same as the second transfer mechanism may be used. In the cutting method of this embodiment, a plurality of packages 5 divided by the cutting machine C are transferred in a state of being accommodated in a not-shown jig (nest member described later). Then, many packages 5 are cleaned, dried, and inspected. Then, most packages 5 are stored in a state where they are placed on a final product tray (not shown). The sealed substrate 1 is composed of a circuit substrate 2 and a resin molded body 3 as shown in Fig. 2. On one of the main surfaces of the circuit substrate 2, a plurality of electronic 10 1237320 parts are sealed together by resin. In addition, the electronic device is not mounted on the other main surface of the sealed substrate 1, and the cutting portion 4 is shown in green. The cut site 4 is grid-shaped. Therefore, the main surface of the sealed substrate 1 is divided into a plurality of areas corresponding to a plurality of electronic components in a one-to-one manner by the cutting portion 4. That is, one electronic component is provided in each of a plurality of rectangular areas divided by the grid-like cutting portion 4. The sealed substrate 1 is divided into a plurality of packages 5 by cutting along the cutting portion 4. Further, as shown in Fig. 2, on the other main surface of the sealed substrate 1, marks 6a and 6b are provided on the cutting portion 4. In addition, these marks 6a and 6b may be separately provided on positions other than the cutting part 4. In addition, in this embodiment, the marks 6a and 6b are indicated by black dots, respectively. However, if it is a mechanism that can recognize the positional relationship between the marks 6a and 6b and the cutting site 4, it may be other than black dot mark. The substrate cutting device of the present embodiment described above can use data to memorize the position of the cutting site 4 corresponding to the positions of the marks 6a and 6b. In other words, the substrate cutting device can recognize the cutting site pattern formed by the marks 6a and 6b and the cutting site 4. More specifically, it is as follows. The image processing device reads the logos 6a and 6b and the cutting site 4 as image data. Based on this image data, 20 calculates the position of the cutting site 4 based on the positions of the marks 6a and 6b, that is, the distance data of each of the signs 6a and 6b to each of the plurality of cutting sites 4 and the like. As a result, since the substrate cutting device of this embodiment can store the aforementioned distance data and the like, in the cutting step, the image of the sealed substrate 1 placed on the cutting machine C is read only by the image processing device. The positions of 6a and 6b can be used to calculate the positions of the plurality of cutting parts 4 of the sealed substrate 1 placed on the cutting machine C 1237320. In addition, the cutting portion pattern recognition is performed on the cutting portion recognition device B before mounting the sealed substrate 1 on the cutting device C. Therefore, according to the substrate cutting method of this embodiment, the substrate cutting unit is placed at the position of only the detection mark 6b in the cutting step, and the position of the cutting portion 4 of the sealed substrate 丨 can be specified. Therefore, the substrate cutting device of this embodiment can specify the position of the cutting portion 4 of the sealed substrate 1 in a very short time during the cutting step. As a result, in the conventional cutting method, the time required to identify the cutting site 10 on the cutting machine and the time required to identify the cutting site pattern on the cutting machine B and the detection on the cutting machine C The sum of the time required for the signs & and 讣 is almost the same. 15 20 Furthermore, as shown in Fig. 丨, the cutting position recognition machine is provided with a reciprocating portion 8 which can move back and forth in the cutting position recognition machine B in the direction of arrow I. The reciprocating section 8 is at the supply position 9 where the sealed base is supplied from the transfer machine A and the sealed substrate 丨 which has been used to discriminate the breakage part 4 is transferred to the fixed position 15 in the cutting machine port C. The back-and-forth position of the transfer position 往返 and the back-and-forth movement between σ and 利 is based on a round-trip movement mechanism (not shown). Although not shown, a fixing mechanism for fixing the sealed substrate 1 is provided in the reciprocating portion S. Therefore, according to the substrate cutting method of the present embodiment, the sealing substrate 1 has been fixed to the fixing mechanism by the adsorption action of the fixing mechanism / returning 卩 8 between the supply position 9 and the transfer position 10. "Return 8 is shown in Figure 1. A charm table for placing the sealed substrate 1 introduced by the propeller 7 is shown in a circular table 12 1237320.) Also, 'the mounting table 11 cannot rotate. Therefore, the sealed substrate 1 is transferred to the mounting table 11 in the direction shown by the arrow κ when it is mounted on the transfer table A. In addition, the substrate cutting device of this embodiment is provided to identify the mounted substrate 5 A photographing mechanism 12 such as a CCD (Charge Coupled Device) camera on which the cutting portion 4 of the sealed substrate 1 and the positions of the marks 6a and 6b are placed on the table 11. The cutting device of this embodiment can be identified by the cutting portion. The reciprocating mechanism (not shown) between the machine B and the cutting machine C moves the photographing mechanism 12 in the direction shown by the arrow J. 10 In the cutting method using the cutting device, first, The cutting part identification step on the cutting part recognition machine B for the sealed substrate 丨 identification mark and the positional relationship between 讣 and the cutting part 4. In the cutting part identification step, first, the sealed substrate 丨 is transferred from the transfer machine A is moved toward the cutting part by the propeller 7 The machine identification table b is pushed out. Then, the 15 sealed substrates 1 are fixed to the mounting table Π by the fixing mechanism with the resin molded body 3 facing downward. Then, the 6a and 6b and the cutting part are photographed by the photography mechanism 12. 4. In this way, the cutting device can correctly recognize the cutting part pattern including the photographic mark and the cutting part 4. In addition, in the cutting part identification step, the reciprocating part 8 is used at the supply position 20 9 and shifted. The reciprocating movement between the loading position 10 and the reciprocating movement of the photographing mechanism 12 in the cutting unit 6 can realize the pattern of the cutting site regardless of the pattern of the cutting site 4 of the sealed substrate 丨. At the cutting position, the machine B is provided with a substrate holding portion 13 as shown in Fig. 1. Therefore, when the cutting step is performed at the cutting machine c, the completed 13 1237320 5 10 15 20 bundles can be used Identify the cutting part 4 In the cutting part __ ^^ The sealed substrate 1 first keeps a number of fruits, which can be prepared in advance in the cutting step, which can avoid the sealed substrate 1 in the step of ~ cutting part 4. The efficiency of the cutting step of the sealed base with the "necessary step"Bad things happen. Therefore, it can be desired that == Taiwan C is provided with a _, as shown in the first figure. The square Taiwan B and the money section 14 are used to receive the fixing of the sealed substrate 1 from the cutting part identification machine 1 mouth. Between the position 15 and the cutting of the sealed substrate mr6. In addition, a reciprocating movement mechanism factory (not shown) is used to perform the return motion. In addition, the reciprocating portion 14 is a fixing mechanism 17 for fixing the sealed substrate 1 or the package 5 as shown in FIG. 1. The fixed mechanism 17 is fixed to the fixed mechanism 17 by attaching the sealed substrate 1 to the sealed substrate 1. However, [a method of fixing the sealing substrate 1 to a fixed place, etc. to fix the sealed substrate 1, a method of mechanically mounting the temple substrate 1, and any other method. * In the living and returning section 14, 'as shown in FIG. 1, a state in which the substrate 1 is sealed by the mosquito mechanism 17 is provided.' An axis extending toward 2 perpendicular to the paper surface of FIG. A circular rotary table 18 which rotates the sealed substrate 1 is provided at a cutting position 16 with a cutting portion 19 having a cutting blade for cutting the sealed substrate ^. 2 With the cutting device described above, after the cutting portion identification step, a cutting step of cutting the sealed substrate 1 is performed. In the cutting step, first, the sealed substrate 1 is supplied from the transfer position 1G to the fixed position 15. Accompany this camera 〇 14 1237320
構12亦從移載位置10移動至固定位置15。接著，由攝影機 構12檢測已密封基板1之標誌6a及6b。藉此，切斷裝置可辨 識切斷部位4相對於旋轉機台18之相對性的位置關係。然 後，載置於往返部14之旋轉機台18朝箭頭L所示之方向旋 5 轉。Structure 12 also moves from transfer position 10 to fixed position 15. Next, the camera 6 detects the marks 6a and 6b of the sealed substrate 1. Thereby, the cutting device can recognize the relative positional relationship of the cutting portion 4 with respect to the rotary table 18. Then, the rotary table 18 placed on the reciprocating section 14 is rotated 5 times in the direction indicated by the arrow L.
接著，已密封基板1以樹脂成形體3朝下之狀態固定於 固定機構17。然後，攝影機構12返回切斷部位辨識機台B 内，且進行從移送機台A移送至切斷部位辨識機台B之已密 封基板1的切斷部位圖案之辨識。 10 接著，固定有已密封基板1之往返部14係移動至切斷位 置16。然後，在已密封基板1固定於固定機構17之狀態下， 利用切斷部19沿著切斷部位4切斷已密封基板1。結果，1個 已密封基板1會分割為多數封裝體5。此時，為了及時掌握 由切斷部19所進行之切斷的狀況，在切斷機台C内設有其他 15 攝影機構。 〇 另，當在切斷機台C内進行切斷步驟時，如上所述，宜 併用設有未圖示之格子狀製品收容部之巢構件等夾具。 即，此時會產生下述優點，藉由分別將在切斷步驟中個別 分割之多數封裝體5個別地收容於該等巢構件之製品收容 20 部内，可確實地保護所分割之多數封裝體5。再者，也有可 在將多數封裝體5分別收容於該等巢構件等之狀態下維持 原狀搬送至下一步驟等優點。 又，亦可在切斷裝置16中利用攝影機構來檢測標誌6a 及6b，以特定切斷部位4的位置。藉此，可避免將已密封基 15 I237320 板1從固定位置15移送至切斷位置丨6時，因已密封基板1相 對於旋轉機台18的位置產生偏移，而在切斷裝置所辨識之 切斷部位4的位置與實際上切斷部位4的位置之間產生誤 差。 另，於本實施形態之基板切斷方法中，可個別對多片 已密封基板1分別進行切斷部位圖案的辨識，亦可同時辨識 多片已密封基板1之切斷部位圖案。又，可一次一片個別地 切斷多片已密封基板1,亦可一次多片來切斷多片已密封基 板1。又，於1台切斷裝置上亦可各設置多數切斷部位辨識 10機台B及切斷機台C。 接著，利用第3圖，說明本實施形態之切斷裝置所產生 之碎屑的處理方法。 π弟《3圖所示之基板切斷裝置中，在切斷已密封基; 15 20Next, the sealed substrate 1 is fixed to the fixing mechanism 17 with the resin molded body 3 facing downward. Then, the photographing mechanism 12 returns to the cutting site recognition machine B, and recognizes the cutting site pattern of the sealed substrate 1 transferred from the transfer machine A to the cutting site recognition machine B. 10 Next, the reciprocating portion 14 to which the sealed substrate 1 is fixed is moved to the cutting position 16. Then, in a state where the sealed substrate 1 is fixed to the fixing mechanism 17, the sealed substrate 1 is cut along the cutting portion 4 by the cutting portion 19. As a result, one sealed substrate 1 is divided into a plurality of packages 5. At this time, in order to keep abreast of the state of the cutting by the cutting unit 19, another 15 photographing mechanism is provided in the cutting machine C. 〇 When the cutting step is performed in the cutting machine C, as described above, it is preferable to use a jig such as a nest member provided with a grid-like product storage section (not shown). That is, at this time, there is an advantage that the plurality of packages 5 that are individually divided in the cutting step are individually accommodated in the product storage 20 of these nest members, and the divided packages can be reliably protected. 5. Furthermore, there is also an advantage that a large number of packages 5 can be transported to the next step while being kept in their original state while being housed in such nest members. In addition, the cutting device 16 may detect the marks 6a and 6b using an imaging mechanism to specify the position of the cutting site 4. In this way, when the sealed base 15 I237320 plate 1 is transferred from the fixed position 15 to the cutting position, the position of the sealed substrate 1 relative to the rotary table 18 may be prevented from being recognized by the cutting device. An error occurs between the position of the cutting site 4 and the position of the actual cutting site 4. In addition, in the substrate cutting method of this embodiment, it is possible to individually identify the cutting site patterns of a plurality of sealed substrates 1, or to simultaneously identify the cutting site patterns of a plurality of sealed substrates 1. Moreover, a plurality of sealed substrates 1 may be individually cut one at a time, or a plurality of sealed substrates 1 may be cut at a time. In addition, a plurality of cutting positions can be set on each of the cutting devices, namely, the machine B and the machine C. Next, referring to Fig. 3, a method for processing chips generated by the cutting device of this embodiment will be described. In the substrate cutting device shown in Fig. 3, the sealed substrate is cut off; 15 20
(成形品）1之切斷步驟中會產生樹脂渣等碎屑21(碎片）。1 碎屬21藉由第3圖所*之碎屬接收部25接收。然後，碎屑: 從碎屑接收部25朝帶场送機26落下。帶式輸送機2⑴ 碎屑21沿著箭頭Q所示之方向從裝置内卿移送至裝置如 然後，剌21從帶錢送機26落至剌I納盒洲 ^貫施形態之輯裝置巾，藉㈣錢顿26及碎屬收i 益27構成碎屑廢棄處理機台e。 A又，碎屑接收部25_轉機㈣大，絲置於旋· 口18的大致正下部。又，— 本貫施形態之切斷裝置為了使名 轉機台18上所產生之非资 非常小的碎屑21不要飛散，而設有石 屑接收板28(例如，輥軸篩繁 中寺）。再者，本實施形態之切斷| 16 1237320 置設有用以使所架設之碎4接收板28振動之振動機構（未 圖示）。 在藉由碎屑接收部25接收碎屑之步驟中，首先，使因 切斷已密封基板1所產生之碎屬21落至碎屬接收板獻。接 5著，藉由振動機構使碎屑接收板28振動。藉此，碎屑㈣ 沿著箭頭m示之方向移動，並落至帶式輸送機26上。二 後，碎屑21會落至碎屑收納盒27内。 的迷地從碎屑接收部25移動至名 屑廢棄處理機台E，故使碎屑·接收物傾斜。又，於基㈣ 15In the cutting step of (molded product) 1, chips 21 (chips) such as resin residue are generated. 1 The broken genus 21 is received by the broken genus receiving unit 25 shown in FIG. 3. Then, the crumbs fall from the crumb receiving unit 25 toward the belt conveyor 26. Belt conveyor 2⑴ Debris 21 is transferred from the inside of the device to the device in the direction shown by the arrow Q. Then, 剌 21 falls from the belt conveyor 26 to 剌 I Na He Zhou ^ The device device of the configuration, The waste disposal machine e is constituted by borrowing money 26 and the waste income 27. A, the chip receiving section 25_ is large in size, and the wire is placed at the lower part of the mouth 18. In addition, — The cutting device of the present embodiment is provided with a stone chip receiving plate 28 (for example, a roller sieve in the temple) so that the non-essentially small chips 21 generated on the rotary table 18 are not scattered. . In addition, the cutting device of this embodiment | 16 1237320 is provided with a vibration mechanism (not shown) for vibrating the installed broken 4 receiving plate 28. In the step of receiving debris by the debris receiving section 25, first, the debris 21 generated by cutting the sealed substrate 1 is dropped to the debris receiving board. Then, the chip receiving plate 28 is vibrated by the vibration mechanism. As a result, the debris ㈣ moves in the direction indicated by the arrow m and falls on the belt conveyor 26. After that, the debris 21 will fall into the debris storage box 27. The moving land is moved from the chip receiving unit 25 to the chip waste disposal processing machine E, so the chip and the receiving object are tilted. Also, Yu Jiyu 15
’為了移送碎屑2卜亦可在碎屑接收板28上側言 :二!噴嘴。又’於基板切斷裝置亦可設置用… 式輸㈣等來取柄屑接收抑。再者，方 亦可設置用以在碎屬21從碎屑接收部2职 至碎屬廢錢理機台E時防止碎屑21飛散之機構。 機26搬出::1: ^之切斷裝置設有用以收納由帶_ 機26搬出之碎屑21之碎屑 〇 高效率地移送碎屑21，且，為;27°又，帶讀送機斯 碎屑接收勒的大致正下方^碎屑21飛散而配置方 外部G側。 °』時，其一部份突出於裝3 20 了使作業員;安:地:::: 因此，本實施形態之切斷裝置構^帶式輸送機抑 停止時，亦可先相21载置4:使在纖 為了使作業員1論在驅動〜 式輸送機Μ上。， —在駆動帶式輪送機26之狀態及停' 17 1237320 輸送機26之狀態任一狀態下皆可安全地進行廢棄處理作 業’宜在切斷裝置設置用以覆蓋帶式輸送機26在裝置外部G 突出的部分之安全蓋。’In order to transfer the debris 2b, you can also say on the debris receiving plate 28: Two! Nozzles. In addition, the substrate cutting device may be provided with a ... type input and the like to receive the handle scraps. Furthermore, a mechanism may also be provided to prevent the debris 21 from flying away from the time when the debris 21 is from the 2nd position of the debris receiving department to the waste money disposal machine E. The cutting device of the machine 26 :: 1: ^ is provided with a cutting device for storing the chips 21 of the chips 21 removed by the belt 26. The chip 21 is efficiently transferred, and is 27 °. Debris receivers are placed directly below the ^ debris 21 and scattered on the G side. ° ”, a part of it is more prominent than the installation of 3 20 so that the operator; Ann: Earth ::::: Therefore, the cutting device structure of this embodiment ^ when the belt conveyor stops, it can also be 21 Set 4: Use the fiber to drive the operator 1 on the drive-type conveyor M. — In the state of stopping the belt conveyor 26 and stopping it '17 1237320 The state of the conveyor 26 can be safely discarded in any state' It is advisable to install a cutting device to cover the belt conveyor 26 in Safety cover for the protruding part of the outside G of the device.
根據本貫施形態之基板切斷裝置，作業者不必如過去 5 以手動作業取出從裝置内部F移送至裝置外部G之碎屑21。According to the substrate cutting device of the present embodiment, the operator does not have to manually remove the debris 21 transferred from the inside F of the device to the outside G of the device as in the past 5.
又’由於可檢查碎屑收納盒27内碎屑21的量，故不必經常 中斷切斷步驟，而可丟棄碎屑21。又，由於碎屑收納盒27 的收容量愈大，則可減少廢棄處理的次數，因此，維修作 業變得更有效率，同時，可減少中斷切斷步驟的時間。 10 又’切斷裝置可藉由具有1個切斷刀之切斷部19切斷1 片已密封基板1，同時，亦可藉由具有多個切斷刀之切斷部 19切斷1片已密封基板丨，再者，亦可藉由具有多個切斷刀 之切斷部19切斷多片已密封基板1。 又，於前述本實施形態之基板切斷方法，亦可在樹脂 15 成形體3朝上之狀態下，將已密封基板1供給至切斷裝置内。 Ο 又，前述基板切斷方法可適用於BGA(Ball Grid Array)、QFN(Quad Flat pack Nonleaded Package)、CSP(Chip Size Package)及分離式元件中任何一個已密封基板之切斷 方法。 2〇 又，前述基板切斷方法可適用於有機基板、銅基板、 薄膜基板、鎳·鐵合金基板、塑膠製電路基板2及其他電路 基板2之切斷方法。 再者，電路基板2的形狀不限於四角形，亦可為圓形、 多角形及其他形狀。例如，藉由前述基板切斷方法，亦可 18 1237320 切斷晶圓級封裝體。 又，於本實施形態中，說明在電路基板2之其中一主表 面安裝多個電子零件，且設有用樹脂一同密封多個電子零 件之一個樹脂成形體3之一片已密封基板1的切斷方法。然 5 而，在一片基板上設有以多個電子零件為一組之多組樹脂 成形體之已密封基板的切斷方法可適用前述切斷方法。 雖然已詳細說明本發明，但該等說明只是例子，並不 限於上述說明，發明之精神與範圍中僅由所附之申請專利 範圍所限定的内容應可清楚理解。 10 【圖式簡單說明】 第1圖係實施形態之基板切斷裝置的平面圖。 第2圖係藉由第1圖之基板切斷裝置所切斷之已密封基 板的透視圖。 第3圖係實施形態之基板切斷裝置之碎屑移送機構的 15 透視圖。 【圖式之^主要>70件表符號1表】 1...已密封基板 9...供給位置 2...電路基板 10…移載位置 3...樹脂成形體 11...載置台 4...切斷部位 12...攝影機構 5...封裝體 13...基板保持部 6a、6b…標諸 14...往返部 7...推進機 15...固定位置 8...往返部 16…切斷位置 19 1237320 17…固定機構 50...裝置本體 18...旋轉機台 A...移送機台 19·.·切斷部 B...切斷部位辨識機台 21…碎屑 C...切斷機台 25...碎屑接收部 F...裝置内部 26...帶式輸送機 G...裝置外部 27...碎屑收納盒 E...碎屑廢棄處理機台 28...碎屑接收板 20Also, since the amount of the chips 21 in the chip storage box 27 can be checked, it is not necessary to interrupt the cutting step often, and the chips 21 can be discarded. In addition, the larger the capacity of the debris storage box 27, the fewer the number of disposal processes. Therefore, the maintenance operation becomes more efficient, and the time for interrupting the cutting step can be reduced. 10 'The cutting device can cut one piece of the sealed substrate 1 by the cutting portion 19 having one cutting blade, and can also cut one piece by the cutting portion 19 having a plurality of cutting blades. The sealed substrate 丨, and a plurality of sealed substrates 1 may be cut by a cutting section 19 having a plurality of cutting blades. Further, in the substrate cutting method of the present embodiment described above, the sealed substrate 1 may be supplied into the cutting apparatus with the resin 15 molded body 3 facing upward. 〇 The aforementioned substrate cutting method can be applied to any of the sealed substrates of BGA (Ball Grid Array), Quad Flat Pack Nonleaded Package (QFN), Chip Size Package (CSP), and discrete components. 20. The aforementioned substrate cutting method can be applied to cutting methods of an organic substrate, a copper substrate, a thin film substrate, a nickel-iron alloy substrate, a plastic circuit substrate 2 and other circuit substrates 2. In addition, the shape of the circuit board 2 is not limited to a quadrangular shape, and may be a circular shape, a polygonal shape, or other shapes. For example, the wafer-level package can also be cut by the aforementioned substrate cutting method. In the present embodiment, a cutting method for mounting a plurality of electronic components on one of the main surfaces of the circuit board 2 and providing a sealed molded substrate 1 of a resin molded body 3 that seals a plurality of electronic components together with resin will be described. . However, the aforementioned cutting method can be applied to a method for cutting a sealed substrate provided with a plurality of sets of resin molded bodies including a plurality of electronic components on a single substrate. Although the present invention has been described in detail, these descriptions are merely examples and are not limited to the above description. The spirit and scope of the invention should be clearly understood only by the scope of the attached patent application. 10 [Brief description of the drawings] FIG. 1 is a plan view of a substrate cutting device according to an embodiment. Fig. 2 is a perspective view of the sealed substrate cut by the substrate cutting device of Fig. 1. Fig. 3 is a 15 perspective view of the chip transfer mechanism of the substrate cutting device of the embodiment. [Schematic ^ Main> 70 pieces of table symbol 1 table] 1 ... sealed substrate 9 ... supply position 2 ... circuit board 10 ... transfer position 3 ... resin molded body 11 ... Mounting table 4 ... cutting section 12 ... photographic mechanism 5 ... package 13 ... substrate holding sections 6a, 6b ... marked 14 ... reciprocating section 7 ... propeller 15 ... Fixed position 8 ... Reciprocating part 16 ... Cut position 19 1237320 17 ... Fixing mechanism 50 ... Equipment body 18 ... Rotary table A ... Transfer table 19 ... Cut section B ... Cutting part identification machine 21 ... Debris C ... Cutting machine 25 ... Debris receiving unit F ... Device inside 26 ... Belt conveyor G ... Device outside 27 ... Debris storage box E ... Debris disposal machine 28 ... Debris receiving plate 20