TWI232567B - Image sensor package with a FPC surrounding a window - Google Patents

Image sensor package with a FPC surrounding a window Download PDF

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Publication number
TWI232567B
TWI232567B TW093115528A TW93115528A TWI232567B TW I232567 B TWI232567 B TW I232567B TW 093115528 A TW093115528 A TW 093115528A TW 93115528 A TW93115528 A TW 93115528A TW I232567 B TWI232567 B TW I232567B
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TW
Taiwan
Prior art keywords
window
bumps
image sensing
flexible
window glass
Prior art date
Application number
TW093115528A
Other languages
Chinese (zh)
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TW200539400A (en
Inventor
Ruen-Bpo Tsai
Jin-Lung Fang
Peil Liu
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Chipmos Technologies Inc
Chipmos Technologies Bermuda
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Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW093115528A priority Critical patent/TWI232567B/en
Application granted granted Critical
Publication of TWI232567B publication Critical patent/TWI232567B/en
Publication of TW200539400A publication Critical patent/TW200539400A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

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  • Solid State Image Pick-Up Elements (AREA)

Abstract

An image sensor package with a FPC surrounding a window mainly includes an image sensor chip and a flexible printed circuit (FPC). A window glass and a plurality of bump are disposed on the active surface of the image sensor chip. The window glass covers the sensor region of the active surface with light transmission and exposes the periphery of the active surface. The bumps are disposed on the periphery of the active surface. The FPC has an opening slightly larger than the window glass. When the bumps are bonded to the FPC, the window glass is aligned with the opening for improving the orientation of connecting the FPC and the image sensor chip. The sensor region will not be contaminated with a filling compound sealing the bumps during FPC packaging process.

Description

1232567 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關於一種影像感測器封裝構造，特別係有 關於一種軟板對位窗之影像感測器封裝構造。 【先前技術】 愈來愈多的個人化手攜式電子產品都會使用到影像感 測器（image sensor)，例如數位相機（DSC)、數位攝影 機、手機及個人數位助理（PDA)等，習知之一種影像感測 器構造’如中華民國專利公告第564561號「影像感測器之 封裝方法及其結構」所揭示者，其係包含一薄膜覆晶封裝 (C0F)之薄膜、一透光鏡片及一光感測晶片，該c〇f薄膜係 包含有一電絕緣軟膜本體及複數個金屬線路，該電絕緣軚 膜本體係具有一上表面、一下表面及至少一 ,每一金 屬線路具有一覆晶接合端，該些覆晶接合端係設於該開口 之周邊且貼附於該上表面，該壤光薇一片係對應於該開口且 固設於該C0F薄膜之下表面，該光感測晶片係覆晶接合於 该C0F溥膜之上表面，其中該光感測晶片係具有一感光 面’翻轉e亥光感測晶片，使該感光面係往下朝向該透光鏡 片且該感光面之周邊係形成有覆晶凸塊，該些覆晶凸塊係 導接至違些覆晶接合端，當該C0F薄膜與該光感測晶片接 合之後’該光感測晶片之感光面仍為顯露，最後再將該逸 光鏡片結合在該C0F薄膜之另一表面，在覆晶接合之捲帶 輸送過程，塵埃不可避免地沾污至該光感測晶片之感光 面’且該C0F薄膜與該光感測晶片對位性不佳，此外，用 以密封該些凸塊之填充膠（密封膠體）亦會污染至該光感測1232567 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an image sensor package structure, and particularly relates to an image sensor package structure of a flexible board registration window. [Previous technology] More and more personal hand-held electronic products are using image sensors, such as digital cameras (DSC), digital cameras, mobile phones, and personal digital assistants (PDAs). An image sensor structure, such as disclosed in Republic of China Patent Publication No. 564561 "Packaging method and structure of image sensor", which comprises a thin film chip-on-package (C0F) film, a light-transmitting lens, and A photo-sensing wafer. The cof film includes an electrically insulating soft film body and a plurality of metal circuits. The electrical insulating film has an upper surface, a lower surface and at least one, and each metal circuit has a flip chip. Bonding ends, the flip-chip bonding ends are arranged around the opening and attached to the upper surface, and one piece of the phobia is corresponding to the opening and fixed on the lower surface of the COF film, and the light sensing chip The flip chip is bonded to the upper surface of the COF film, wherein the light sensing chip has a photosensitive surface 'flip ehai light sensing chip, so that the photosensitive surface faces downward to the light transmitting lens and the photosensitive surface. Surrounding A flip-chip bump is formed, and the flip-chip bumps are connected to the flip-chip bonding ends. When the COF film is bonded to the photo-sensing wafer, the photosensitive surface of the photo-sensing wafer is still exposed, and finally Then the light-emitting lens is combined on the other surface of the COF film. During the tape conveying process of the flip-chip bonding, dust is inevitably contaminated onto the photosensitive surface of the light-sensing chip, and the COF film and the light-sensing The alignment of the test chip is not good. In addition, the filling glue (sealing gel) used to seal the bumps will also pollute the light sensor.

1232567 五、發明說明（2) 晶片之感光面，進而影響影像感測品質。 【發明内容】 本發明之主要目的係在於提供一種軟板對位窗之影像 感測器封裝構造，利用一軟性電路板係具有一略大於一窗 口玻璃之開口，該窗口玻璃係設於一影像感測晶片之主動 面而透光性遮蓋該影像感測晶片之感測區，且複數個凸塊 係設於該影像感測晶片之主動面周邊區，當該些凸塊導接 於該軟性電路板，該窗口玻璃係對準於該開口，以利該軟 性電路板與該影像感測晶片之對位結合，並可防止一密封 該些凸塊之填充膠污染該感測區以及在軟板封裝過程中 染該感測區。 、本發明之次一目的係在於提供一種軟板對位窗之影像 感測器封裝構造，該設有窗口玻璃與凸塊之影像感測晶片 係結合於該具有開口之軟性電路板，一填充膠係形成於該 軟性電路板與該影像感測晶片之間並密封該些凸塊，而不 會污染至該影像感測晶片之感測區，該填充膠係接觸至該 窗口玻璃，以增進該軟性電路板與該窗口玻璃之結合。X 、本發明之再一目的係在於提供一種軟板對位窗之影 感測器封裝構造，該窗口玻璃之上表面係高於該些凸塊且 位在該軟性電路板之開口内，以達到良好之該軟性電路板 與影像感測晶片之對位結合以及增進該些凸塊之保護。 依本發明之軟板對位窗之影像感測器封裝構造，其係 包含一影像感測晶片、一窗口玻璃、複數個凸塊及一軟性 電路板，該影像感測晶片係具有一主動面及一背面，該主 1232567 五、發明說明（3) 動面係包含有一感測區及一周邊區，該窗口玻璃係設於該 影像感測晶片之主動面，以透光性遮蓋該感測區且顯露部 份之該周邊區，該些凸塊係設於該影像感測晶片之周邊 區，該軟性電路板係包含有一介電膜及一導電線路層，該 介電膜係具有一開口以及一排線區，該開口之尺寸係略大 於該窗口玻璃，當該些凸塊導接於該導電線路層，該窗口 玻璃係對準於該開口。 【實施方式】 參閱所附圖式，本發明將列舉以下之實施例說明。 依本發明之第一具體實施例，請參閱第1圖，一種軟 板對位窗之影像感測器封裝構造i 00係主要包含一影像感 測晶片110、一窗口玻璃120、複數個凸塊130及一軟性電 路板1 4 0 ’該影像感測晶片1 1 〇係具有一主動面1 11及一背 面112，其中在結合該軟性電路板ho之前，請參閱第1及2 圖，該窗口玻璃120與該些凸塊130係設於該影像感測晶片 110之主動面111，其係可為一種CM〇s(Complementary Metal Oxide Semiconductor，互補性氧化金屬半導體）或 是CCD (Charge - Coupled Device，電荷藕合元件感測器） b曰片’该影像感測晶片1 1 〇之主動面Η 1係包含有一感測區 113及一周邊區114，該感測區113係形成有複數個影像感 測元件（圖未繪出）。該窗口玻璃1 2 〇係為一種光學玻璃， 其係設於該影像感測晶片1 1 〇之主動面丨丨1 ,可利用如ϋν膠 類之光固化膠123將該窗口玻璃120之下表面122黏著於該 主動面111，該窗口玻璃120之尺寸係小於該主動面“I而1232567 V. Description of the invention (2) Photosensitive surface of the chip, which further affects the image sensing quality. [Summary of the Invention] The main purpose of the present invention is to provide an image sensor package structure of a flexible board alignment window. A flexible circuit board is used to have an opening slightly larger than a window glass, which is arranged on an image. The active surface of the sensing chip covers the sensing area of the image sensing chip with transparency, and a plurality of bumps are provided in the peripheral area of the active surface of the image sensing chip. When the bumps are connected to the softness Circuit board, the window glass is aligned with the opening to facilitate the alignment of the flexible circuit board and the image sensing chip, and to prevent a filling glue sealing the bumps from contaminating the sensing area and the The sensing area is dyed during board packaging. A second object of the present invention is to provide an image sensor package structure of a flexible board alignment window. The image sensing chip provided with window glass and a bump is combined with the flexible circuit board with an opening, and a filling A glue system is formed between the flexible circuit board and the image sensing chip and seals the bumps without contaminating the sensing area of the image sensing chip. The filling glue system contacts the window glass to improve The combination of the flexible circuit board and the window glass. X. Yet another object of the present invention is to provide a shadow sensor package structure for a flexible board alignment window. The upper surface of the window glass is higher than the bumps and is located in the opening of the flexible circuit board. A good alignment of the flexible circuit board and the image sensing chip is achieved, and the protection of the bumps is improved. The image sensor package structure of a flexible board alignment window according to the present invention includes an image sensing chip, a window glass, a plurality of bumps, and a flexible circuit board. The image sensing chip has an active surface. And a back side, the main 1232567 V. Description of the invention (3) The moving surface includes a sensing area and a peripheral area, and the window glass is arranged on the active surface of the image sensing chip, and the sensing area is covered with light transmission. And in the peripheral area of the exposed part, the bumps are disposed in the peripheral area of the image sensing chip. The flexible circuit board includes a dielectric film and a conductive circuit layer. The dielectric film has an opening and In a line area, the size of the opening is slightly larger than the window glass. When the bumps are connected to the conductive circuit layer, the window glass is aligned with the opening. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments. According to a first specific embodiment of the present invention, please refer to FIG. 1. An image sensor package structure i 00 of a flexible board alignment window mainly includes an image sensing chip 110, a window glass 120, and a plurality of bumps. 130 and a flexible circuit board 1 4 0 'The image sensing chip 1 1 0 has an active surface 1 11 and a back surface 112. Before combining the flexible circuit board ho, please refer to FIGS. 1 and 2 and the window The glass 120 and the bumps 130 are disposed on the active surface 111 of the image sensing chip 110, which can be a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge-Coupled Device). , Charge-coupled element sensor) b. The active surface of the image sensing chip 1 1 0 includes a sensing area 113 and a peripheral area 114. The sensing area 113 is formed with a plurality of image sensors. Test element (not shown). The window glass 12 is a kind of optical glass, which is set on the active surface of the image sensing chip 1 10. The light-curing adhesive 123 such as ϋν glue can be used to lower the surface of the window glass 120. 122 is adhered to the active surface 111, and the size of the window glass 120 is smaller than that of the active surface "I and

1232567 五、發明說明（4) 稍大於該感測區11 3，以透光性遮蓋該感測區11 3立顯露部 份之該周邊區11 4。該些凸塊1 30係設於該影像感測晶片 110之周邊區114，該些凸塊130係選自於錫錯凸塊、金凸 塊、結線凸塊（stud bump)之其中之一，在本發明係不局 限該些凸塊130之型態，利用該窗口玻璃丨2〇係具有防止在 形成該些凸塊1 3 0過程使用到的銲料、助銲劑、電鍍液或 塵粒污染該影像感測晶片1 1 〇之感測區1 1 3之功效，較佳 地，該窗口玻璃120之上表面121係高於該些凸塊丨30，以 增進對該些凸塊1 3 0之保護。1232567 V. Description of the invention (4) The sensing area 11 3 is slightly larger than the sensing area 11 3, and the surrounding area 11 4 of the sensing area 11 3 is exposed with light transmission. The bumps 1 30 are disposed in the peripheral region 114 of the image sensing chip 110, and the bumps 130 are selected from one of tin bumps, gold bumps, and stud bumps. In the present invention, the type of the bumps 130 is not limited, and the use of the window glass 20 has the ability to prevent the solder, flux, plating solution or dust particles used in the process of forming the bumps 130 from contaminating the bumps. The efficacy of the sensing area 1 1 3 of the image sensing chip 1 1 0, preferably, the upper surface 121 of the window glass 120 is higher than the bumps 30, in order to enhance the bumps 1 3 0 protection.

该軟性電路板1 4 0係包含有一介電膜1 41及一導電線路 層1 4 2 ’請參閱第3圖，在影像感測器之捲帶封裝過程，複 數個軟性電路板14 〇係取自於一電路捲帶，為單排排列或 雙（多）排排列在一捲帶，請再參閱辦丨及3圖，該介電膜 141係具有一開口 1 43以及一排線區1 44，該開口 143之尺寸 係略大於該窗口玻璃丨20，該導電線路層142係具有複數個 内接端142a與複數個外接端142b，可形成於該介1電膜141The flexible circuit board 140 includes a dielectric film 141 and a conductive circuit layer 142. Please refer to FIG. 3, during the tape and reel packaging process of the image sensor, a plurality of flexible circuit boards 14 are obtained. Since a circuit tape is a single-row arrangement or a double (multi) -row arrangement on a reel, please refer to FIG. 3 and FIG. 3 again. The dielectric film 141 has an opening 1 43 and a row of wire regions 1 44 The size of the opening 143 is slightly larger than the window glass 20, and the conductive circuit layer 142 has a plurality of internal terminals 142a and a plurality of external terminals 142b, which can be formed on the dielectric film 141.

之下表面或上表面，該些内接端142a係排列於該開口丨43 之四側邊或其中兩對應側邊，在本實施例中，該些内接端 142a係排列於該開口143之四側邊，較佳地，該軟性電路 板140係包含有一保護層145，如防銲漆（s〇lder mask)或 ^蓋膜（cover layer)，以覆蓋部分之該導電線路層142。 請再參閱第1圖，當該些凸塊13〇導接於該導電線路層14Q 之内接端142a，其接合方式係可為覆晶接合（flip —chip bonding)、内引腳接合（Inner ―幻、AcpOn the lower surface or the upper surface, the inscribed ends 142a are arranged on the four sides of the opening or two of the corresponding sides. In this embodiment, the inscribed ends 142a are arranged on the opening 143. On four sides, preferably, the flexible circuit board 140 includes a protective layer 145, such as a solder mask or a cover layer, to cover a part of the conductive circuit layer 142. Please refer to FIG. 1 again. When the bumps 130 are connected to the inner terminal 142a of the conductive circuit layer 14Q, the bonding method can be flip-chip bonding, inner pin bonding ―Magic, Acp

1232567 五、發明說明（5) (anisotropic conductive paste, 異方 1生導電膠）接合或 NCP(non - conduct i ve paste, 非導電膠）接合等等,使得 該影像感測晶片11 0與該軟性電路板1 4 0連接，在本實施例 中’其係對該影像感測晶片11 0施以一低溫（小於攝氏兩百 度）超音波震動，使得該些凸塊130低溫連接於該軟性電路 板140之内接端142a。此時，該窗口玻璃丨2〇係對準於該軟 性電路板1 40之開口 1 43，以利該軟性電路板1 4〇與該影像 感測晶片11 0之對位結合’在本實施例中，該窗口玻璃1 2 〇 之上表面1 21係位在該軟性電路板1 4 〇之開口丨43内，較佳 地，一填充膠150係形成於該軟性電路板丨4〇與該影像感測 晶片11 0之間並密封該些凸塊1 3〇，在本發明中，該填充膠 150係可以是異方性導電膠（anisotr〇pic conductive paste, ACP)、非導電膠（non —conductive paste， NCP)、具有助銲劑之非流動性固化膠（n〇n —f 1〇w compound)或底部填充膠（underfilling materia)等等， 在本實施例中’該填充膠1 5 〇係為液態塗佈且接觸至該窗 口玻璃120之側邊，以增進該軟性電路板14〇與該窗口玻璃 120之結合。因此，依據本發明之軟板對位窗之影像感測 器封裝構造1 00，在軟板封裝過程中，例如該填充膠’15〇或 該些凸塊1 30之製作步驟甚至該影像感測晶片丨丨〇與該軟性 電路板140之接合步驟中，利用該適當尺寸之窗口玻璃12〇 0又在该影像感測晶片1 1 〇之主動面1 1 1且其尺寸不大於該軟 性電路板140之開口 143使得該影像感測晶片丨丨〇之感測"區 113不會受到任何污染。1232567 V. Description of the invention (5) (anisotropic conductive paste) bonding or NCP (non-conductive paste) bonding, etc., making the image sensing chip 110 and the softness The circuit board 140 is connected. In this embodiment, it is a low temperature (less than two degrees Celsius) ultrasonic vibration applied to the image sensing chip 110, so that the bumps 130 are connected to the flexible circuit board at low temperature. 140 内 接 端 142a. At this time, the window glass 20 is aligned with the opening 1 43 of the flexible circuit board 1 40 to facilitate the alignment of the flexible circuit board 1 40 and the image sensing chip 110 in the embodiment. In the middle, the upper surface 1 21 of the window glass 12 is located in the opening 丨 43 of the flexible circuit board 141. Preferably, a filler 150 is formed on the flexible circuit board 410 and the image. The bumps 130 are sealed between the sensing wafers 110. In the present invention, the filler 150 may be an anisotropic conductive paste (ACP) or a non-conductive paste (non-conductive paste). conductive paste (NCP), non-flowable curing adhesive (nON-f 1〇w compound) or underfilling materia with flux, etc. In this embodiment, 'the filling adhesive 1 5 0 series It is liquid coated and touches the side of the window glass 120 to improve the combination of the flexible circuit board 14 and the window glass 120. Therefore, the image sensor package structure of the flexible board alignment window according to the present invention is 100. In the flexible board packaging process, for example, the manufacturing steps of the filling glue '15 or the bumps 1 30 or even the image sensing In the joining step of the chip 丨 丨 〇 and the flexible circuit board 140, the window glass 1200 of the appropriate size is used on the active surface 1 1 1 of the image sensing chip 1 1 〇 and its size is not larger than the flexible circuit board The opening 143 of 140 makes the sensing region 113 of the image sensing chip 丨 丨 〇 not be polluted.

1232567 五、發明說明（6) 依據本發明之第二具體實施例中，請參閱第4圖，另 一種軟板對位窗之影像感測器封裝構造2〇〇係包含一影像 感測晶片210、一窗口玻璃220、複數個凸塊230及一軟性 電路板2 4 0 ’該影像感測晶片21 〇係具有一主動面21 1及一 背面2 1 2，該主動面2 11係包含有一感測區2 1 3及一周邊區 214 ,該窗口玻璃220係以一固化黏膠221黏設於該影像感 測晶片21 0之主動面211，以透光性遮蓋該感測區21 3且顯 露部份之該周邊區214，該些凸塊230係設於該影像感測晶 片210之周邊區214，在本實施例中，該些凸塊23〇係為結 線凸塊或是銅質或任何材質之柱狀凸塊，該軟性電路板 240係包含有一介電膜241及一導電線路層242 ,該介電膜 241係具有一開口 243，該開口 243之尺寸係略大於該窗口 玻璃220 ’該導電線路層242係形成於該介電膜241之上表 面並以一保護層244遮蓋之，該導電線路層242係具有複數 個排列於該開口 243周邊之内接端242a以及複數個外接端 242b，當該些凸塊230導接於該導電線路層242之内接端 242a上之電鍍層245，該窗口玻璃220係對準於該軟性電路 板έ40之開口 243，此外，一如ACP或ACF(異方性導電膜）之 填充膠250係形成於該軟性電路板240與該影像感測晶片 210之間並密封該些凸塊230，該填充膠2 5 0丨係可以接觸咬 者是不接觸至該窗口玻璃220，均不會污染至該影像感測 晶片210之感測區213。 …、 本發明之保護範圍當視後附之申請專利範圍所界定者 為準，任何熟知此項技藝者，在不脫離本發明之精神和^1232567 V. Description of the invention (6) According to the second embodiment of the present invention, please refer to FIG. 4. Another image sensor package structure of the alignment window of a flexible board. The 200 series includes an image sensing chip 210. A window glass 220, a plurality of bumps 230, and a flexible circuit board 2 4 0 'The image sensing chip 21 0 has an active surface 21 1 and a back surface 2 1 2, and the active surface 2 11 includes a sensor The measurement area 2 1 3 and a peripheral area 214. The window glass 220 is adhered to the active surface 211 of the image sensing chip 21 0 with a cured adhesive 221, and covers the sensing area 21 3 with light transmission and the exposed portion. As for the peripheral region 214, the bumps 230 are provided in the peripheral region 214 of the image sensing chip 210. In this embodiment, the bumps 23 are wire bumps or copper or any material Columnar bumps, the flexible circuit board 240 includes a dielectric film 241 and a conductive circuit layer 242. The dielectric film 241 has an opening 243, and the size of the opening 243 is slightly larger than the window glass 220. The conductive circuit layer 242 is formed on the upper surface of the dielectric film 241 and is covered by a protective layer 244. In other words, the conductive circuit layer 242 has a plurality of internal terminals 242a and a plurality of external terminals 242b arranged around the opening 243. When the bumps 230 are connected to the internal terminals 242a of the conductive circuit layer 242 The plating layer 245, the window glass 220 is aligned with the opening 243 of the flexible circuit board 40. In addition, a filler 250 such as ACP or ACF (Anisotropic Conductive Film) is formed on the flexible circuit board 240 and the image. The bumps 230 are sealed between the sensing wafers 210. The filling glue 2 5 0 丨 can contact the bite without touching the window glass 220, and will not contaminate the sensing area of the image sensing wafer 210. 213. …. The scope of protection of the present invention shall be determined by the scope of the appended patent application. Anyone who is familiar with this technology will not depart from the spirit and scope of the present invention.

5Ί7ΐ " - —— 1232567__ 五、發明說明（7) 圍内所作之任何變化與修改，均屬於本發明之保護範圍。 1232567 圖式簡單説明 【圖式簡單說明】 第1圓·依據太1 之影像感測器封具體實施例’一種軟板對位窗 該影像感測器封 第2国：依據本Ϊ構造：截面示意圖； e t Γ發明之第一具體實施例 =構:影像感測晶片正面示意圖； 第3圖•依據本發 θ «Λ 裝構造之軟性雷Ϊ月之第一具體實施例，該影像感測器封 笫4 SI :价祕路板在捲帶型態之下表面示意圖；及 窗之为傻本發明之第二具體實施例，另一種軟板對位 曲之衫像感測器封裝構造之截面示意圖。 元件符號簡單說明： 100影像感測器封裝構造 110 影像感測晶片 111 113 感測區 114 120 窗口玻璃 121 123 光固化膠 130 140 軟性電路板 141 142 導電線路層 142a 143 開口 144 150 2〇〇 填充膠 影像感測器封裝構造 21〇 影像感測晶片 211 213 感測區 214 220 窗口玻璃 221 主動面 周邊區 112 背面 上表面 凸塊 介電膜 122 下表面 内接端 142b 外接端 排線區 145 保護層 主動面 周邊區 212 背面 固化黏膠 230 凸塊5Ί7ΐ "-—— 1232567__ V. Any changes and modifications made within the scope of the invention description (7) belong to the protection scope of the present invention. 1232567 Simple illustration of the drawing [Simplified illustration of the drawing] The first circle · Specific embodiment of the image sensor seal according to the first one 'A kind of registration window of the flexible board The image sensor seal Country 2: Structure according to this book: Section Schematic diagram; the first specific embodiment of et Γ invention = structure: a schematic diagram of the front side of an image sensing wafer; Figure 3 • The first specific embodiment of a soft thunder moon with a structure of θ «Λ according to the present invention, the image sensor Seal 4 SI: Schematic diagram of the surface of the price secret circuit board under the reeling mode; and the window is a second embodiment of the present invention, and another cross section of a flexible board alignment shirt-like sensor package structure schematic diagram. Brief description of component symbols: 100 image sensor package structure 110 image sensor chip 111 113 sensing area 114 120 window glass 121 123 light curing adhesive 130 140 flexible circuit board 141 142 conductive circuit layer 142a 143 opening 144 150 2〇〇fill Adhesive image sensor package structure 21 image sensor chip 211 213 sensing area 214 220 window glass 221 active surface peripheral area 112 back surface upper surface bump dielectric film 122 lower surface inner end 142b external end wiring area 145 protection Layer active surface peripheral area 212 backside curing adhesive 230 bumps

第15頁 1232567 圖式簡單說明 240 軟性電路板 24 2 導電線路層 243 開口 250 填充膠 241 介電膜 242a内接端 244 保護層 242b 外接端 245 電鍍層Page 15 1232567 Simple illustration of the diagram 240 Flexible circuit board 24 2 Conductive circuit layer 243 Opening 250 Filler 241 Dielectric film 242a Internal terminal 244 Protective layer 242b External terminal 245 Plating layer

第16頁Page 16

Claims (1)

1232567 六、申請專利範圍 【申請專利範圍】 1、一種軟板對位窗之影像感測器封裝構造，其係包含： 一影像感測晶片，其係具有一主動面及一背面，該主 動面係包含有一感測區及一周邊區； 一窗口玻璃’其係設於該影像感測晶片之主動面，以 透光性遮蓋該感測區且顯露部份之該周邊區； 複數個凸塊，其係設於該影像感測晶片之周邊區；及 一軟性電路板，該軟性電路板係包含有一介電膜及一 導電線路層，該介電膜係具有一開口以及一排線區，該開 口之尺寸係略大於該窗口玻璃，當該些凸塊導接於該導電 線路層，該窗口玻璃係對準於該開口。 ^如申明專利範圍第1項所述之軟板對位窗之影像感測 器封裝構造，其另包含有一填充膠，其係形成於該軟性電 路板蜱該影像感測晶片之間並密封該些凸塊。 3、：：請專利範圍第2項所述之軟板對位窗之影像感測 =裝構造中該填充膠係為液態塗佈^接觸至該窗口 心封Ϊ:!專：範圍第1項所述之軟板對位窗之影像感測 番窗口玻璃之上表面係高於該也凸塊且 位在该軟性電路板之開口内。 一 ^ 器5封之軟板對位窗之影像感測 像感測晶片之主動‘。冑係以-光固化膠黏著於該影 6、如申請專利範圍第1項所述之軟板對位窗之影像感測 $ 17頁 1232567 —------ 六、申請專利範圍 器封裝構造，其中該些凸塊係選自於錫鉛凸塊、金凸塊、 、’·。線凸塊（stud bump)之其中之一。 J、如申請專利範圍第1項所述之軟板對位窗之影像感剛 ^封裝構造，其中該軟性電路板係包含有一保護層，以 蓋部分之該導電線路層。 ^、如申請專利範圍第1項所述之軟板對位窗之影像感剛 裔封裝構造，其中該導電線路層係形成於該介電膜之下表 器9封專利範圍第1項所述之軟板對位窗之影像感測 =封裝構造，其中該導電線路層係形成於該介電膜之上表 器封專ϊΐΐ:1雷1所述之軟板對位窗之影像感測 俾排列於該開口之四侧邊或其中兩對應侧邊。^其1232567 VI. Scope of patent application [Scope of patent application] 1. An image sensor package structure of a soft board registration window, which includes: An image sensing chip having an active surface and a back surface, the active surface It includes a sensing area and a peripheral area; a window glass is provided on the active surface of the image sensing chip, covers the sensing area with light transmission and exposes the peripheral area; a plurality of bumps, It is located in the peripheral area of the image sensing chip; and a flexible circuit board, the flexible circuit board includes a dielectric film and a conductive circuit layer, the dielectric film has an opening and a line area, the The size of the opening is slightly larger than the window glass. When the bumps are connected to the conductive circuit layer, the window glass is aligned with the opening. ^ The package structure of the image sensor of the flexible board alignment window described in item 1 of the declared patent scope, further comprising a filler, which is formed between the flexible circuit board and the image sensing chip and seals the Some bumps. 3 :: Please request the image sensing of the soft board registration window described in item 2 of the patent scope = the filling glue is liquid coating in the installation structure ^ contact with the window heart seal:! The upper surface of the image sensing window glass of the soft board alignment window is higher than the bump and is located in the opening of the soft circuit board. ^ Image sensing of a flexible board registration window with 5 seals Active of the image sensing chip.胄 The light-curing adhesive is attached to the shadow. 6. The image sensing of the registration window of the soft board as described in item 1 of the scope of patent application. $ 17, page 1232567 ------- 6. Package of patent scope Structure, wherein the bumps are selected from tin-lead bumps, gold bumps, and '. One of the stud bumps. J. The imaging sense of the flexible board alignment window as described in item 1 of the scope of the patent application. The package structure, wherein the flexible circuit board includes a protective layer to cover a part of the conductive circuit layer. ^ The image-sensing rigid package structure of the flexible board alignment window as described in item 1 of the scope of patent application, wherein the conductive circuit layer is formed under the dielectric film as described in item 9 of the patent scope Image sensing of the flexible plate alignment window = package structure, wherein the conductive circuit layer is formed on the dielectric film. Surface seal: ϊΐΐ Image sensing of the flexible plate alignment window described in 1 Thunder 1 Arranged on four sides or two corresponding sides of the opening. ^ Its 第18頁Page 18
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7965366B2 (en) 2007-04-13 2011-06-21 Chimel Innolux Corporation Flexible printed circuit board with alignment marks in particular positions
CN110416241A (en) * 2019-08-29 2019-11-05 苏州多感科技有限公司 Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal

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US8890274B2 (en) 2012-07-11 2014-11-18 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for CIS flip-chip bonding and methods for forming the same
CN113745202A (en) * 2021-06-04 2021-12-03 荣耀终端有限公司 Packaging module, manufacturing method thereof and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7965366B2 (en) 2007-04-13 2011-06-21 Chimel Innolux Corporation Flexible printed circuit board with alignment marks in particular positions
CN110416241A (en) * 2019-08-29 2019-11-05 苏州多感科技有限公司 Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal

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