TWI226298B - Method for positioning a substrate and inspecting apparatus using same - Google Patents
Method for positioning a substrate and inspecting apparatus using same Download PDFInfo
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- TWI226298B TWI226298B TW092132587A TW92132587A TWI226298B TW I226298 B TWI226298 B TW I226298B TW 092132587 A TW092132587 A TW 092132587A TW 92132587 A TW92132587 A TW 92132587A TW I226298 B TWI226298 B TW I226298B
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims description 116
- 238000001179 sorption measurement Methods 0.000 claims description 76
- 238000007689 inspection Methods 0.000 claims description 47
- 238000012546 transfer Methods 0.000 claims description 22
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
1226298 玖、發明說明： L 明所屬 销 j 技術領域 本發明係有關於基板定位方法及使用此方法之檢查裝 5置，特別是有關於自動線寬測量裝置等檢查裝置中之高精 度基板定位方法及使用此方法之檢查襄置。 L先前技術3 背景技術 以下說明習知基板定位方法。 10 根據第3圖來說明習知基板定位方法。 LCD(Liquid Crystal Display :液晶顯示器）基板或 PDP(Plasma Display Panel)等 FPD(Flat Panel Display)及半 導體晶圓等各種基板以及該等基板之微影成像步驟所使用 之掩模基板等係利用蒸鍵·姓刻等膜製造技術來製作。但， I5關於猎此形成於基板上之電極圖案或配線圖案，在製造途 中以及製造的最後步驟中必須判定品質的優良與否，這是 為了不使不良品流到後面步驟所需的步驟。因此，必須測 量所形成之圖案的尺寸或形成位置是否在預定範圍内。第3 圖係顯示用以測量上述基板之線寬的習知線寬測量裝置之 2〇 構造例的方塊圖。 LCD基板等檢查對象物1利用基板夾持台2來吸附其裡 面，藉此加以固定。另，基板失持台2成為利用未圖示之真 空泵等來吸附檢查對象物1的裡面之所謂真空# ^ 的構 造。基板夾持台2係設於配置於除震台5上之γ輛移二 夕勒平台4 與X軸移動平台3上。檢查對象物i藉由使χ軸移動平台3盘丫 車由移動平台4分別朝X輪方向、γ軸方向移動 ，可在X、γ平 面内移動’且可用光學顯微鏡8來觀察檢查對象物1内之預 &位置°所w預/Ui置係例如用以測量配線圖案所形成之 預定位置的線寬’且列定製品或半製品的優良與否而預先 訂定的位置。 X軸私動平σ 3與γ轴移動平台4分別藉由測量控制部 16來手動或自純操作，且㈣成使預定位置可進入光學 顯微鏡8的視野内。當檢查裝置為自動線寬測量裝置時，檢 查對象物1之檢查項目為測量形成於該等基板上之電極圖 案或配線®1㈣線寬朗隔，及料電極圖案或配線圖案 間之偏移量等。 照明光源6利用光線引導構件9將光導入光學顯微鏡 8，且所導人的光錢過檢錢㈣透鏡11投射在檢查對象 物1 ’而所投射的光會在檢查對象物1反射 ，且該反射光會 透過檢查對象物透鏡u、巾間透鏡Μ射人攝像機b。攝像 機15將入射光^換為電信號且將電信號輸出至測量控制部 16。另’錢為可見光、紅外線、紫外線等，而攝像機b 為可將該等光變換為電信號之CCD(Charge C—led Device) 等攝像元件。 •艾乜機構（快轉區）1〇成為可因應目的而將檢查對象物 透鏡11換成預備對準用對象物透鏡u的機構。光軸㈣)移 動平口 b為了將檢查對象物透鏡η的焦距調節至對焦位 置’因此使安財檢查縣物透鏡11之鮮賴鏡8整體朝 1226298 向和動。中間透鏡14係放大來自檢查對象物透 鏡11的影彳f，n 、1豕且將影像投影至攝像機15。攝像機15所攝取 勺&像則輪入測量控制部（檢查控制部）16内的圖像處理部 161° 光軸(Z輛）移動控制部162為一焦距控制部，該光軸移 動拴制部162為了適當地調節檢查對象物透鏡11的焦距，因 此使安叙有檢查對象物透鏡11之光學顯微鏡8整體朝光軸 (2轴）方向移動。另，焦距控制部162亦具有根據來自圖像 F 61的l號來進行自動對焦控制的功能。cpu 163具 10有用以控制測量控制部（檢查控制部）16之程式，且可使線寬 測里衣置動作。cpui63具有用以控制焦距控制部丨62、圖 像處理部161、Χγ移動控制部7之程式。XY移動控制部7内 包含有：用以使X軸移動平台3與γ軸移動平台4移動之移動 控制邛71，用以將基板丨推壓至基板夾持台2上，且利用滾 15輪2〇3、204、212將基板1推向基準滾輪2(Π、202、211，以 固定基板1之基板推壓控制部72 ;使基板丨的裡面吸附在基 板夾持台2之基板裡面吸附控制部73 ;及將基板丨從基板搬 送臂部18接收至基板夾持台2之基板接收桿上下控制部 74。CRT17為用以顯示圖像及操作開關之螢幕畫面，且操 20作者可藉由GUI(Graphical user interface)來操作滑氟 向裝置。 、曰 檢查對象物之基板1利用基板搬送臂部18搬送，且載置 於基板夾持台2上。第3圖中，基板搬送臂部18朝左右（兩铲 頭方向）移動來搬送基板1，另，其詳細說明可參照第5圖 1226298 第5圖係說明基板丨之搬送方法。第5圖中，第5(幻圖為 平面圖，第5(b)圖為側視圖。藉由基板搬送臂部18將基板i 搬送至Y軸移動平台4與X軸移動平台3之預定位置（參照第5 圖之基板1)。接著，在基板接收位置使基板接收桿191、 5 192、193、194通過基板夾持台2的4點孔穴1911、1921、 1931、1941，且朝箭頭方向上升，以抬起基板搬送臂部以 上的基板1。 在該狀態下，基板搬送臂部18在第5圖的例子中朝左側 退避。 10 接著，使基板接收桿191〜194下降，且將基板1傳送至 構成於基板夾持台2上之1〇〇個基板平面維持桿 2001〜2100(第5(a)圖中以小的〇來表示）。第5(a)圖中，由於 數量多而無法畫出全部，因此僅顯示其中一部份的基板平 面維持桿。又，第5(b)圖中則省略基板夾持台2上之基板平 15 面維持桿2001〜2100及吸附墊2201〜2212。 該等基板平面維持桿2001〜2100係安裝於基板夾持台 2 ’以保持基板1整個平面的平坦性。另，就如LCD之顯示 基板而言，其大小約為700x 700mm(板厚0.5mm)，而基板 平面維持桿的配列間距為7〇mm。 20 接著，根據第4圖說明基板夾持方法。第4圖係說明習 知基板夾持的方法。將基板1之基板基準面1〇1與1〇2(圖中 以粗線表示）推向基準滾輪201、202、211，以固定基板1。 即，朝箭頭方向利用推壓滾輪203、204、212來推壓基 板(推力為例如2kgf)，且推向基準滾輪201、202、211。基 1226298 準滾輪2(Π、202、211必須保持不能小於推壓滾輪203 Λ 204、 201的力量（例如5kgf)。於該狀態下，以設於基板夾持台2 之吸附墊2201〜2212(第5(a)圖中以黑點表示）來吸附保持第 5圖所示之基板1的裡面。 5 在吸附基板後，推壓滾輪203、204、212會因解除基板 推壓而退避至外側。基準滾輪201、202、211亦退避至外側 (曰本專利公開公報特開平9—39201號（第2〜4頁、第1圖、第 7 圖））。 而，在自動線寬測量裝置等檢查裝置中，以第4圖所示 1〇 之基板基準面101與102為基準，且事先登錄欲檢查之位置 座標121〜128，並在檢查檢查對象基板時讀取，且測量該位 置之配線圖案的線寬等，以進行檢查。 以下將說明該檢查方法。 利用對準用對象物透鏡12來觀察對準標誌111、112的 15 位置，且登錄對準標誌觀察位置的XY平台座標及對準標誌 檢測圖像。接著，利用變倍機構10，將對準用對象物透鏡 12換成檢查用對象物透鏡11，並利用檢查對象物透鏡^來 觀察基板1，且同樣登錄欲檢查之位置座標121〜128及檢查 圖像。 20 例如，利用中間透鏡3.3倍的顯微鏡將對準用對象物透 鏡12的倍率設為5倍。此時，光學倍率為5χ 3·3=16·5倍， 且當使用CCD攝像機尺寸6mmx 6mm時，CCD攝像機的視 野為6mm/16.5 = 0.36mmx 0.36mm的視野。 又，由於基板基準面至對準標誌111、112的距離公差 1226298 在—O.lmm以内，故若視野在〇 36mmx 0.36mm之範圍内， 則即使對準標誌的位置有些許偏差，對準標誌m、112仍 可進入CCD攝像機的視野内。因此，可藉由圖像處理來辨 識對準標誌Π1、112的位置。 5 在檢測出對準標誌111、112後，再次計算所檢測出之 位置座標與所登錄之位置座標的差（即，傾斜與偏移），並修 正名人彳双查之位置座標121〜128。根據上述結果來控制XY平 台，並將XY平台移動至欲檢查之正確的位置座標 121〜128。由於χγ平台之位置再現性，即，機械性誤差在 10數# m以内，且該移動誤差完全進入檢查對象物透鏡u之倍 率50倍的視野36/^mx 36//m内，故可確實地檢查。 即’若光學倍率為50χ 3.3= 165倍，且使用CCD攝像機 尺寸6mmx 6mm，則CCD攝像機的視野會成為6111111/165 = 〇.〇36mm=36//mx 36/zm。 15 而’若基板大小為例如700mmx 700mm，則基板夾持 台2之基板平面維持桿2〇〇1〜21〇〇可藉由以70mm的間隔來 配置而配置100個。 在前述基板1的裡面與100個基板平面維持桿 2001〜2100相接觸之狀態下，基板基準面1〇1與1〇2會與基準 20滾輪201、202、211接觸，且利用推壓滾輪2〇3、204、212 來推壓基板以進行定位，因此，推壓滾輪203、204、212之 推力必須為1〜2kgf。 但’ 述基板1近年來逐漸大型化，例如，ll〇〇mmx 1200mm或1500mmx 1850mm之基板逐漸實用化。該基板之 10 1226298 基板平面維持桿在前者約為300個，在後者約為6〇〇個。結 果右將板尽一樣没為0.5mm ’則基板1的裡面與基板平面 維持桿間之摩擦阻力在前者是7〇〇111111>< 700mm之基板的 2·5〜3倍，而後者是5〜6倍，如此一來，在LCD或PDP之玻璃 5基板中成為以推壓滾輪來推壓時會產生裂痕或龜裂的原 口 又’旦基板面積變大’則容易發生彎曲，故必須具 備更多基板平面維持桿，因此，基板變大，其摩擦阻力會 更大。 在用以檢查基板大小為11 〇〇mnix 1200mm之大型基板 10的衣置中，若基板夾持台之基板平面維持桿以7〇mm之間隔 配置，則必須配置269個基板平面維持桿。又，若基板大小 為1500mmx 1850mm，則必須配置566個基板平面維持桿。 由於基板的裡面與269個基板平面維持桿相接觸，故前 述基板的大小相較於基板大小為7〇〇mmx 700mm時，其摩 15擦阻力較大，再者，一旦基板變大，則利用推壓滾輪將基 板推壓至基板基準面之基準滾輪的力量必須在2 5〜6kgf以 上。若以如此大的力量來推壓基板，則會引起基板變形或 外形損傷或者内部配線圖案損傷，而使製品產率極度惡化。 本發明之目的係提供可解決上述問題，且以不會引起 20基板外形損傷或内部配線圖案損傷的力量來進行基板定位 的方法及基板之檢查裝置。 L發明内容3 發明概要 為了達成上述目的，本發明之基板定位方法係在基板 1226298 接收位置使基板接收桿從基板夾持台的4點孔穴上升，並於 從基板搬送臂部接收基板後，在基板接收桿與基板平面維 持桿接觸之前使基板接收桿停止上升，且在該狀態不進行 基板推壓定位。藉此，可僅以基板接收桿的摩擦阻力來推 5 壓基板，而減少推壓力。 即，本發明之基板定位方法係使用於檢查裝置，而兮 檢查裝置包含：搬送部，係用以搬送形成有配線圖案之基 板；載置台，係用以載置由搬送部所搬送之基板；攝像裝 置，係用以對基板之配線圖案進行攝像；及控制部，係^ Π)以控制用以處理來自攝像裝置之影像信號的信號處理裝置 及載置台的動作，又，載置台具有··夹持機構部，係用以 保持基板；基板移動機構部，係用以從搬送部接 部所搬送之基板，且將基板載置於爽持機構部；及對準^ 構，係用以使基板對準夾持機構部之預定位置，又，钱 b板定位方法係在基板移動機構部從搬送部接收基板至= 板載置於夾持機構部上為止的期間内，利用對準 板對準預定位置。 n 201226298 发明 Description of the invention: The pin to which the L belongs belongs TECHNICAL FIELD The present invention relates to a method for positioning a substrate and an inspection device using the method, and particularly to a method for positioning a high-precision substrate in an inspection device such as an automatic line width measuring device. And check using this method. L Prior Art 3 Background Art A conventional substrate positioning method will be described below. 10 The conventional substrate positioning method will be described with reference to FIG. 3. Various substrates such as LCD (Liquid Crystal Display) substrates, FPD (Flat Panel Display) such as PDP (Plasma Display Panel) and semiconductor wafers, and mask substrates used in the lithography imaging steps of these substrates are made by steam Key and surname engraving and other film manufacturing technology. However, I5 has to determine the quality of the electrode pattern or wiring pattern formed on the substrate during the manufacturing process and the final step of manufacturing. This is a step required to prevent defective products from flowing to the subsequent steps. Therefore, it is necessary to measure whether the size or formation position of the formed pattern is within a predetermined range. Fig. 3 is a block diagram showing an example of a 20 configuration of a conventional line width measuring device for measuring the line width of the above substrate. An inspection target 1 such as an LCD substrate is fixed by being held on the substrate holding stage 2 by suction. In addition, the substrate misalignment table 2 has a structure called a vacuum # ^ that sucks the inside of the inspection object 1 by a vacuum pump or the like, which is not shown. The substrate holding table 2 is provided on a gamma moving platform 4 and an X-axis moving platform 3 arranged on the shock absorbing platform 5. The inspection object i can be moved in the X and γ planes by moving the χ-axis moving platform 3 and the pan-wheeled vehicle 4 from the moving platform 4 in the X-wheel direction and the γ-axis direction, and the inspection object 1 can be observed with an optical microscope 8 The pre-set position and the pre-set position are used to measure a line width of a predetermined position formed by a wiring pattern, for example, and determine a position of a product or a semi-manufactured product. The X-axis private movement level σ 3 and the γ-axis moving stage 4 are manually or purely operated by the measurement control unit 16, respectively, and predetermined positions can be brought into the field of view of the optical microscope 8. When the inspection device is an automatic line width measuring device, the inspection item of inspection object 1 is to measure the electrode pattern or wiring formed on these substrates. 1㈣ line width separation, and the offset between the electrode pattern or wiring pattern Wait. The illuminating light source 6 introduces light into the optical microscope 8 using a light guide member 9, and the guided light is passed through the inspection lens 11 and is projected on the inspection object 1 ', and the projected light is reflected on the inspection object 1 and the The reflected light passes through the inspection object lens u and the inter-lens lens M and hits the camera b. The camera 15 converts the incident light ^ into an electric signal and outputs the electric signal to the measurement control section 16. In addition, money is visible light, infrared rays, ultraviolet rays, and the like, and the camera b is an imaging element such as a CCD (Charge C-led Device) that can convert the light into electrical signals. • The Aiji mechanism (fast-moving area) 10 is a mechanism that can change the inspection target lens 11 to a preliminary alignment target lens u according to the purpose. Optical axis ㈣) Move the flat port b. In order to adjust the focal length of the inspection object lens η to the in-focus position ', the entire lens 8 of the objective lens 11 in Ancai inspection county is moved toward 1226298. The intermediate lens 14 magnifies the images f, n and 1 from the object lens 11 to be inspected and projects an image to the camera 15. The scoop & image captured by the camera 15 is rotated into the image processing section 161 ° in the measurement control section (inspection control section) 16. The optical axis (Z vehicles) movement control section 162 is a focal length control section, and the optical axis is moved and locked. In order to appropriately adjust the focal length of the inspection target lens 11, the unit 162 moves the entire optical microscope 8 having the inspection target lens 11 in the direction of the optical axis (two axes). The focal length control section 162 also has a function of performing autofocus control based on the No. 1 from the image F61. The CPU 163 has 10 programs for controlling the measurement control section (inspection control section) 16 and can make the line width measurement lining move. The cpui63 has programs for controlling the focal length control section 62, the image processing section 161, and the Xγ movement control section 7. The XY movement control section 7 includes: a movement control 邛 71 for moving the X-axis moving platform 3 and the γ-axis moving platform 4 to push the substrate 丨 onto the substrate holding table 2 and use a roller 15 203, 204, and 212 push the substrate 1 toward the reference roller 2 (Π, 202, 211 to fix the substrate pressing control portion 72 of the substrate 1; the inside of the substrate 丨 is attracted to the inside of the substrate of the substrate holding table 2 Control section 73; and the substrate receiving lever up and down control section 74 for receiving substrates from the substrate transfer arm section 18 to the substrate holding stage 2. CRT17 is a screen for displaying images and operating switches, and 20 authors can borrow The GUI (Graphical user interface) operates the fluorine sliding device. The substrate 1 to be inspected is transferred by the substrate transfer arm portion 18, and is placed on the substrate holding table 2. In the third figure, the substrate transfer arm portion 18 moves left and right (in the direction of the two shovel heads) to transport the substrate 1. In addition, for a detailed description, refer to FIG. 5 and FIG. 1226298. FIG. 5 is a description of the substrate 丨 conveying method. Figure 5 (b) is a side view. The substrate i is transferred by the substrate transfer arm portion 18. To the predetermined positions of the Y-axis moving stage 4 and the X-axis moving stage 3 (refer to the substrate 1 in Fig. 5). Next, the substrate receiving levers 191, 5 192, 193, and 194 are passed through the substrate holding stage 2 at the substrate receiving position. The four-point holes 1911, 1921, 1931, and 1941 are raised in the direction of the arrow to lift the substrate 1 above the substrate transfer arm. In this state, the substrate transfer arm 18 is retracted to the left in the example in FIG. 5. 10 Next, the substrate receiving levers 191 to 194 are lowered, and the substrate 1 is transferred to the 100 substrate plane holding levers 2001 to 2100 formed on the substrate holding table 2 (the smaller one in FIG. 5 (a)). In Figure 5 (a), because there are too many to draw all of them, only a part of the substrate plane holding lever is shown. In Figure 5 (b), the substrate holding table 2 is omitted. The substrate 15 on the substrate plane 2001 ~ 2100 and the suction pads 2201 ~ 2212 are mounted on the substrate plane holding lever 2001 ~ 2100 to maintain the flatness of the entire plane of the substrate 1. In addition, it is like For the LCD display substrate, its size is about 700x 700mm (plate thickness 0.5mm), and the substrate is flat The alignment distance of the holding rods is 70 mm. 20 Next, the substrate holding method will be described with reference to FIG. 4. FIG. 4 illustrates a conventional substrate holding method. The substrate reference surfaces 10 and 10 of the substrate 1 will be described. (Indicated by thick lines in the figure) The reference rollers 201, 202, and 211 are pushed to fix the substrate 1. That is, the substrate is pushed by the push rollers 203, 204, and 212 in the direction of the arrow (the thrust is, for example, 2 kgf), and To the reference rollers 201, 202, and 211. Base 1226298 The quasi-roller 2 (Π, 202, 211 must keep the force (for example, 5kgf) that is not less than the pushing rollers 203 Λ 204, 201. In this state, the adsorption pads 2201 ~ 2212 (set on the substrate holding table 2) Figure 5 (a) is indicated by a black dot) to suck and hold the inside of substrate 1 shown in Figure 5. 5 After the substrate is sucked, the pushing rollers 203, 204, and 212 will retreat to the outside due to the release of substrate pressing. The reference rollers 201, 202, and 211 also recede to the outside (Japanese Patent Laid-Open Publication No. 9-39201 (pages 2 to 4, pages 1 and 7)). In addition, in automatic line width measuring devices, etc. In the inspection device, the substrate reference planes 101 and 102 shown at 10 in FIG. 4 are used as the reference, and the position coordinates 121 to 128 to be inspected are registered in advance, and read when inspecting the inspection target substrate, and the wiring at that position is measured. The line width of the pattern is checked for inspection. The inspection method will be described below. The 15 positions of the alignment marks 111 and 112 are observed using the alignment object lens 12, and the XY stage coordinates and alignment of the alignment mark observation positions are registered. Logo detection image. Next, using the zoom mechanism 10 Replace the alignment object lens 12 with the inspection object lens 11 and observe the substrate 1 using the inspection object lens ^, and also register the position coordinates 121 to 128 and the inspection image to be inspected. 20 For example, use the middle The microscope with a lens of 3.3 times sets the magnification of the alignment target lens 12 to 5. At this time, the optical magnification is 5 × 3 · 3 = 16 · 5 times, and when using a CCD camera size of 6mmx 6mm, the field of view of the CCD camera is 6mm / 16.5 = field of view of 0.36mmx 0.36mm. Also, since the distance tolerance between the reference plane of the substrate and the alignment marks 111 and 112 is 1226298 within -0.1mm, if the field of view is within the range of 036mmx 0.36mm, The position of the quasi-mark is slightly offset, and the alignment marks m and 112 can still enter the field of view of the CCD camera. Therefore, the positions of the alignment marks Π1 and 112 can be identified by image processing. 5 When the alignment mark 111 is detected After 112, calculate the difference between the detected position coordinates and the registered position coordinates (ie, tilt and offset) again, and correct the position coordinates 121 ~ 128 of the celebrity double check. Control the XY platform according to the above results, and Move the XY stage to the correct position coordinates 121 to 128 to be inspected. Due to the position reproducibility of the χγ stage, that is, the mechanical error is within 10 digits # m, and the movement error fully enters the magnification 50 of the inspection object lens u The field of view is 36 / ^ mx 36 // m, so it can be reliably checked. That is, 'if the optical magnification is 50x 3.3 = 165 times and the CCD camera size is 6mm x 6mm, the field of view of the CCD camera will be 6111111/165 = 〇36mm = 36 // mx 36 / zm. 15 And, if the substrate size is, for example, 700 mm x 700 mm, the substrate plane holding rods 2000 to 2100 of the substrate holding table 2 can be arranged by arranging 100 pieces at intervals of 70 mm. In the state where the inside of the substrate 1 is in contact with 100 substrate plane holding rods 2001 to 2100, the substrate reference planes 101 and 102 are in contact with the reference 20 rollers 201, 202, and 211, and the pressing roller 2 is used. 〇3, 204, and 212 are used to push the substrate for positioning. Therefore, the pushing force of the pushing rollers 203, 204, and 212 must be 1 to 2 kgf. However, the substrate 1 described above has gradually increased in size in recent years. For example, a substrate of 110 mm x 1200 mm or 1500 mm x 1850 mm has gradually become practical. The number of 10 1226298 substrate plane maintenance rods of the substrate is about 300 in the former and 600 in the latter. As a result, the plate is not 0.5mm on the right. The frictional resistance between the inside of the substrate 1 and the substrate plane holding rod is 2.5 · 3 to 3 times that of the 700mm substrate, and the latter is 5 ~ 6 times. In this way, in the glass 5 substrate of LCD or PDP, the original opening that will generate cracks or cracks when pushed by the pressing roller is also easy to bend when the substrate area becomes larger, so it must be provided. As more substrate planes maintain the rod, the larger the substrate, the greater its frictional resistance. In a garment for inspecting a large substrate 10 having a substrate size of 1 00mnix 1200 mm, if the substrate plane holding rods of the substrate holding table are arranged at 70 mm intervals, 269 substrate plane holding rods must be provided. If the size of the substrate is 1500 mm x 1850 mm, 566 substrate plane holding rods must be provided. Since the inner surface of the substrate is in contact with 269 substrate plane maintenance rods, the friction of the aforementioned substrate is larger than that of the substrate when it is 700 mm x 700 mm. Furthermore, once the substrate becomes larger, it is used. The force of the reference roller that presses the roller to push the substrate to the reference surface of the substrate must be more than 25 to 6 kgf. If the substrate is pressed with such a large force, it may cause deformation of the substrate, damage to the external shape, or damage to the internal wiring pattern, and the product yield may be extremely deteriorated. An object of the present invention is to provide a method and a substrate inspection device that can solve the above-mentioned problems, and perform the positioning of the substrate with a force that does not cause damage to the external shape of the substrate or damage to the internal wiring patterns. SUMMARY OF THE INVENTION 3 Summary of the Invention In order to achieve the above object, the substrate positioning method of the present invention raises the substrate receiving rod from a 4-point hole in the substrate holding table at the receiving position of the substrate 1226298, and after receiving the substrate from the substrate carrying arm, Before the substrate receiving lever is brought into contact with the substrate plane maintaining lever, the substrate receiving lever is stopped from rising, and the substrate is not pushed and positioned in this state. Thereby, the substrate can be pushed only by the frictional resistance of the substrate receiving lever, thereby reducing the pushing force. That is, the substrate positioning method of the present invention is used in an inspection device, and the inspection device includes: a conveying section for conveying a substrate on which a wiring pattern is formed; and a mounting table for placing a substrate conveyed by the conveying section; The imaging device is used for imaging the wiring pattern of the substrate; and the control section is used to control the operations of the signal processing device and the mounting table for processing the image signals from the imaging device. The mounting table has a ... The clamping mechanism section is used to hold the substrate; the substrate moving mechanism section is used to carry the substrate transferred from the transfer section and the substrate is placed in the holding mechanism section; and the alignment mechanism is used to make the substrate The substrate is aligned to a predetermined position of the clamping mechanism. The positioning method of the coin board is to use the alignment plate to align the substrate moving mechanism to receive the substrate from the transfer unit until the board is placed on the clamping mechanism. Quasi-predetermined position. n 20
—一 •，八丞板移動機構部宜 板接觸至夾持機構部之歧基板停止移動，且利 構使基板對準預定位置。 t 又，本發明之基蚊位方法之基板移動機 該吸附機構部係由平面狀之夾持機構部 有夕數犬起部之失持機構部其中_者—One • It is advisable that the octopus plate moving mechanism section stops moving when the plate contacts the clamping mechanism section, and it is advantageous to align the substrate with a predetermined position. t Also, the substrate moving machine of the base mosquito position method of the present invention, the adsorption mechanism unit is a flat clamping mechanism unit, and a misfit mechanism unit including a dog lifting unit
動機構部在對準機構使紐對準財L J 12 1226298 載置於夾持機構部上。 又，本發明之基板定位 决之基板移動機構部宜具有 多數用以吸附基板之吸附機 ^ ♦構部’又’當欲利用對準機構 使基板對準預定位置時，係係夕 、夕數吸附機構部之部分吸附 機構部的⑽力較其他，_部的吸附力弱。 又，本發明之基板定位方法之基板移動機構部宜具有 夕欠用以吸附基板之吸附機構部，又，當㈣用對準機構 使基板對準前述預定位置時 10 15 20 知使多數吸附機構部内，位 之大致中央部的吸附機構部之吸附力較位於基板之 周邊。卩的吸附機構部之吸附力弱。 又，本發明之檢查裝置係 义么 糸由下列構件所構成：搬送部， 係用以搬送形成有配線圖案 卷板，載置台，係用以載置 由搬送部所搬送之基板；攝 m ^ 象衣置，係用以對基板之配線 圖木進行攝像；及控制部，f 壯 你用以控制用以處理來自攝像 衣置之影像信號的信號處理裝置及載置台的動作，其中載 置台具有：夾持機構部，係用 用乂保持基板，基板移動機構 係心從搬送部概由搬送部職送之基板，且將基 ^载置於夾持機構部；及對準機構，係用以使基板對準夾 立機構部之預定位置’ $，用以控制載置台的動作之控制 π具有在基板移動機構部從搬送部接收基板至將基板載置 =失持機構部為止的期間内使基板停止在預定位置的功 也’又，對準機構係'可使前述已停止之基板對準預定位置。 又，本發明之基板檢查裝置之基板移動機構部宜具有 朝攝像裝置之光轴方向移動之機構，且更具有用以檢測基 13 1226298 板之光軸方向的位置之位置檢測部。 又，本發明之基板檢查裝置之夾持機構部之用以載置 基板的面宜為平面。 又，本發明之基板檢查裝置之夾持機構部宜由多數突 5 起部所構成。 又，本發明之基板檢查裝置之基板移動機構部宜具有 多數用以吸附基板之吸附機構部，及用以控制多數吸附機 構部之吸附力的吸附力控制部，又，當利用對準機構將基 板對準預定位置時，吸附力控制部係控制多數吸附機構部 10 之部分吸附機構部的吸附力較其他吸附機構部的吸附力 又，本發明之基板檢查裝置之基板移動機構部宜具有 多數用以吸附基板之吸附機構部，及用以控制多數吸附機 構部之吸附力的吸附力控制部，又，當欲利用對準機構將 15 基板對準預定位置時，係使多數吸附機構部内，位於基板 之大致中央部的吸附機構部之吸附力較位於基板之周邊部 的吸附機構部之吸附力弱。 圖式簡單說明 第1圖係說明本發明之一實施例。 20 第2(A)圖〜第2(C)圖係顯示本發明之基板接收桿之一 貫施例的概略構造。 第3圖係顯示習知測量裝置之構造的方塊圖。 第4圖係說明習知之基板夾持方法。 第5圖係說明習知之搬送方法。 1226298 第6圖係顯示本發明一實施例之線寬測量裝置的構造 之方塊圖。 第7圖係說明本發明之基板接收與固定於吸附板之一 實施例的處理流程之流程圖。 5 第8圖係說明本發明之一實施例。 I：實施方式j 實施發明之最佳形態 以下，針對本發明實施形態作說明。 本發明之基板定位方法係如第5圖所示，在基板接收位 10置使基板接收桿191、192、193、194從基板夾持台2的4點 孔穴1911、1921、1931、1941上升，且在從基板搬送臂部 18接收基板後，使基板搬送臂部18退避。然後，使基板接 收桿19卜192、193、194下降，且將基板丨傳送至基板平面 維持桿2001〜2100，但在將該基板丨傳送至基板平面維持桿 15 2〇〇1〜2100前，先進行基板推壓定位。藉此，由於可僅藉由 基板接收桿191、192、193、194的摩擦阻力來推壓基板1， 故可減少推壓基板1的力量，如此一來，可減少摩擦阻力， 而避免基板變形或外形損傷。 第6圖係顯示本發明一實施例之線寬測量裝置的構造 2〇之方塊圖。弟6圖之構造係在第3圖之習知構造的χγ移動控 制部7内加入基板接收桿吸附控制部乃，且將χγ移動控制 部設為7’。基板接收桿吸附控制部75係吸附控制從基板搬 送臂部18接收基板之基板接收桿191〜194與基板。即，本發 明在基板接收機構的構造與定位方法上下過工夫。 15 1226298 利用第1圖、第6圖及第7圖說明基板接收與吸附板上之 定位方法。第1圖係說明本發明之基板接收與吸附板（吸附 機構部）上之定位的-實施例，第7圖係說明本發明之基板 接收與吸附板上之定位的-實施例之處理流程的流程圖。 5 首先說明搬送方法。 步驟601中，在由γ軸移動平台4舆乂軸移動平台3之移 動所決定之基板接收位置上，使基板接收桿191、 192 ^ ······、198從基板夾持台（夾持機構部）2的8點孔穴（參 第1(a)圖）上升，以抬起基板搬送臂部18上的基板丨。即， 10將基板1從搬送臂部18接收至基板接收桿191、192、……、 198。然後，上側位置感測器1932(參照後述第2圖）係感測抬 起基板接收桿191、192、······、198且基板丨從搬送臂部18 抬起之事項。 步驟602中，在基板1完全抬起後（參照第1(b)圖），使基 15板接收桿19卜192、······、198之吸附溝（例如，吸附溝1983) 的壓力降低至大氣壓以下，以吸附基板。基板接收桿191、 192、......、198之吸附部係利用例如矽樹脂1982之柔軟材 料，以容易進行吸附。 步驟603中，使基板搬送臂部18退避（退避至第1圖左 20 侧）。 步驟604中，使基板接收桿19卜192、······、198下降。 步^驟605中，後述第2圖之基板夾持位置感測器1933係 感測基板1之下降，且如第1(c)圖所示，使基板1停止在較接 觸到基板平面維持桿2001〜2100之高度更上方的位置，且， 16 1226298 停止在基準滾輪2〇1、202、211及推壓滾輪203、204、212 可推壓基板1之高度。 接著’在步驟606中，基板接收桿19卜192、......、198 係停止吸附’且使桿内從低壓回到大氣壓或者減弱吸附力。 5 步驟607中’為了進一步減少摩擦阻力，係將中央之基 板接收桿194之吸附溝的壓力作為吹起基板之用，且加上大 氣壓以上(0.2〜0.3Mpa)的壓力，使基板浮起。該狀態下，由 於將基板1推壓至基板基準面1〇1，且進行定位，故基板接 收桿191、192、......、198與基板1間之摩擦阻力會變得極 10 小，而可輕易進行定位。 另，為了 一面吸附基板1，一面吹起基板1，因此需要 空氣壓縮機等，但第1圖中將其省略。 步驟608中，藉由使基板1及基板基準面1〇1、1〇2與基 準滾輪201、202、211接觸，以定位基板位置。 15 即，步驟6〇8中，用推壓滾輪203、204、212來推壓基 板(推力為例如lkgf)，且將基板1推向基準滾輪2〇1、202、 211。基準滾輪201、202、211必須保持不能小於推壓滾輪 203、204、212的力量（5kgf)。 步驟609中，係停止基板接收桿194之吸附溝中所進行 20 之吹起。 步驟610中，使基板接收桿191、192、......、198之吸 附溝的壓力從大氣壓變為低壓（真空吸盤），以吸附基板1。 步驟611中，一旦基板接收桿191、192、......、198吸 附基板1，則解除推壓滾輪203、204、212之基板推壓，並 17 1226298 使推壓滾輪203、204、212退避至外側。又，基準滾輪201、 202、211亦退避至外側。 步驟612中，使吸附墊2201〜2212從大氣壓變為低壓（大 _ 氣壓以下）以準備吸附。 5 步驟613中，使基板接收桿19卜192、……、198下降。 另，下降宜慢慢地進行。 步驟614中，吸附墊2201〜2212吸附基板1，且使基板接 收桿191、192、......、198桿内從低壓變為大氣壓，以停止 吸附基板1。 _ 10 步驟615中，基板接收桿191、192、......、198係移動 至下側’使X平台3與Y平台4可自由地移動，且如第1(d)圖 所示，在下側感測器1934(參照後述第2圖）停止。 另，於上述說明中，在將基板丨載置於基板夾持台2之 前對基板1進行定位，且在定位後，使基板接收桿191、 15 I92、……、198下降，以將基板1固定於基板夾持台2，而 由於可充分獲得機械性精度，故其移動時之誤差極小，因 此沒有問題。 · 於上述實施例中，將基板接收桿内的氣壓與大氣壓相 比較來敘述。但，當檢查裝置等置於固定氣體環境内時， 2〇可藉由相較於該氣體環境（例如氮氣氣體）之氣體環境壓力 的咼低來進行吸附或吸附之停止。 上述控制在CPU163的命令下藉由χγ移動控制部7，内 之基板接收桿上下控制部74及基板接收桿吸附控制部乃來 進行。 18 1226298 根據第2圖，說明基板接收桿191、192......、198之一 實施例的概略構造。第2圖係顯示本發明之基板接收桿 191 " 192......、198之一實施例的概略構造。第2(a)圖係說 明基板接收桿之吸附與吹起的概略圖，第2(b)圖係說明感測 5器遮蔽板1942-1與上侧位置限制器·、上側位置感測器 1932、下側位置感測器、下側位置限制器1935的關係The moving mechanism section places the alignment mechanism L J 12 1226298 on the clamping mechanism section. In addition, the substrate moving mechanism section of the substrate positioning method of the present invention should preferably have a large number of suction machines for sucking the substrate ^ ♦ When the structural section intends to use the alignment mechanism to align the substrate to a predetermined position, the number The adsorption force of the adsorption mechanism part is weaker than others, and the adsorption force of the _ part is weak. In addition, the substrate moving mechanism section of the substrate positioning method of the present invention should preferably have a suction mechanism section for sucking the substrate. When the alignment mechanism is used to align the substrate with the predetermined position, 10 15 20 is used to make the majority of the suction mechanism. The adsorption force of the adsorption mechanism portion in the substantially central portion of the portion is located at the periphery of the substrate. The adsorption force of the thorium adsorption mechanism is weak. In addition, the inspection device of the present invention is constituted by the following components: a conveying section for conveying a coil with a wiring pattern formed thereon, and a mounting table for placing a substrate conveyed by the conveying section; Elephant clothing is used to image the wiring diagram of the substrate; and the control section, f is used to control the actions of the signal processing device and the mounting platform used to process the image signals from the camera clothing, where the mounting platform has : The holding mechanism unit is used to hold the substrate with a cymbal, and the substrate moving mechanism is a substrate that is sent from the transfer unit by the transfer unit, and the substrate is placed in the holding mechanism unit; and the alignment mechanism is used to The substrate is aligned to a predetermined position of the clamping mechanism section, and the control for controlling the operation of the mounting table π has a period from the time when the substrate moving mechanism section receives the substrate from the transport section to the time when the substrate is placed = the misplacement mechanism section. The work of stopping the substrate at a predetermined position also allows the alignment mechanism to align the stopped substrate with the predetermined position. In addition, the substrate moving mechanism section of the substrate inspection device of the present invention should preferably have a mechanism that moves in the direction of the optical axis of the imaging device, and further include a position detection section for detecting a position in the direction of the optical axis of the substrate 13 1226298. The surface of the holding mechanism portion of the substrate inspection device of the present invention for placing a substrate is preferably a flat surface. In addition, it is preferable that the clamping mechanism portion of the substrate inspection apparatus of the present invention is composed of a plurality of protruding portions. In addition, the substrate moving mechanism section of the substrate inspection device of the present invention should preferably have a plurality of adsorption mechanism sections for adsorbing the substrate, and an adsorption force control section for controlling the adsorption force of the majority of the adsorption mechanism sections. When the substrate is aligned with the predetermined position, the adsorption force control unit controls the adsorption force of a part of the adsorption mechanism units of the majority of the adsorption mechanism units 10 compared to the adsorption force of other adsorption mechanism units. The substrate moving mechanism unit of the substrate inspection device of the present invention should preferably have a majority The adsorption mechanism section for adsorbing the substrate, and the adsorption force control section for controlling the adsorption force of the majority of the adsorption mechanism sections, and when the 15 substrates are to be aligned to the predetermined position by the alignment mechanism, the majority of the adsorption mechanism sections are inside, The adsorption force of the adsorption mechanism portion located at the substantially central portion of the substrate is weaker than the adsorption force of the adsorption mechanism portion located at the peripheral portion of the substrate. Brief Description of the Drawings Fig. 1 illustrates an embodiment of the present invention. 20 FIGS. 2 (A) to 2 (C) show the schematic structure of one embodiment of the substrate receiving lever of the present invention. Fig. 3 is a block diagram showing the construction of a conventional measuring device. Fig. 4 illustrates a conventional substrate holding method. Fig. 5 is a diagram explaining a conventional transfer method. 1226298 FIG. 6 is a block diagram showing a configuration of a line width measuring device according to an embodiment of the present invention. Fig. 7 is a flowchart illustrating the processing flow of one embodiment of the substrate receiving and fixing to the adsorption plate of the present invention. 5 Figure 8 illustrates an embodiment of the present invention. I: Embodiment j Best Mode for Carrying Out the Invention Embodiments of the present invention will be described below. As shown in FIG. 5, the substrate positioning method of the present invention raises the substrate receiving rods 191, 192, 193, and 194 from the four-point holes 1911, 1921, 1931, and 1941 of the substrate holding table 2 at the substrate receiving position 10. After receiving the substrate from the substrate transfer arm portion 18, the substrate transfer arm portion 18 is retracted. Then, the substrate receiving rods 19, 192, 193, and 194 are lowered, and the substrate is transferred to the substrate plane holding rod 2001 to 2100, but before the substrate is transferred to the substrate plane holding rod 15 2000 to 2100, The substrate is pushed and positioned first. Therefore, since the substrate 1 can be pushed only by the frictional resistance of the substrate receiving rods 191, 192, 193, and 194, the force for pressing the substrate 1 can be reduced. In this way, the frictional resistance can be reduced and the substrate can be prevented from being deformed Or shape damage. Fig. 6 is a block diagram showing the structure 20 of a line width measuring device according to an embodiment of the present invention. The structure of Fig. 6 is that a substrate receiving rod adsorption control section is added to the χγ movement control section 7 of the conventional structure of Fig. 3, and the χγ movement control section is set to 7 '. The substrate receiving lever suction control section 75 sucks and controls the substrate receiving levers 191 to 194 that receive the substrate from the substrate transfer arm section 18 and the substrate. That is, the present invention has worked hard on the structure and positioning method of the substrate receiving mechanism. 15 1226298 Use Figures 1, 6, and 7 to explain the positioning method of the substrate receiving and suction plate. FIG. 1 illustrates an embodiment of the substrate receiving and positioning on the adsorption plate (adsorption mechanism section) of the present invention, and FIG. 7 illustrates the processing procedure of the embodiment of the substrate receiving and positioning on the adsorption board of the present invention. flow chart. 5 First, the transport method will be described. In step 601, at the substrate receiving position determined by the movement of the y-axis moving platform 4 and the y-axis moving platform 3, the substrate receiving rods 191, 192, ^, ..., 198 are removed from the substrate holding table (clamp The 8 o'clock hole (see Fig. 1 (a)) of the holding mechanism section 2 is raised to lift the substrate on the substrate transfer arm section 18 丨. That is, 10 receives the substrate 1 from the transfer arm portion 18 to the substrate receiving levers 191, 192, ..., 198. Then, the upper position sensor 1932 (refer to FIG. 2 to be described later) senses a matter that the substrate receiving levers 191, 192, ..., 198 are lifted and the substrate 丨 is lifted from the transfer arm portion 18. In step 602, after the substrate 1 is completely lifted (refer to FIG. 1 (b)), the base 15 plate receiving rods 192, 192, ..., 198, and the adsorption grooves of the 198 (for example, the adsorption groove 1983) The pressure is reduced below atmospheric pressure to attract the substrate. The adsorption portions of the substrate receiving rods 191, 192, ..., 198 are made of a soft material such as silicone resin 1982 for easy adsorption. In step 603, the substrate transfer arm portion 18 is retracted (retracted to the left 20 side in FIG. 1). In step 604, the substrate receiving levers 192, 192, ..., 198 are lowered. In step 605, the substrate holding position sensor 1933 of FIG. 2 described later detects the falling of the substrate 1, and as shown in FIG. 1 (c), the substrate 1 is stopped at a position where it is in contact with the substrate holding lever. The height from 2001 to 2100 is higher, and 16 1226298 stops at the reference rollers 201, 202, and 211, and the pressing rollers 203, 204, and 212 can push the height of the substrate 1. Next, in step 606, the substrate receiving rods 192, 192, ..., 198 stop adsorption 'and return the inside of the rod from low pressure to atmospheric pressure or weaken the adsorption force. 5 In step 607 ', in order to further reduce the frictional resistance, the pressure of the suction groove of the central substrate receiving rod 194 is used to blow up the substrate, and the pressure above the atmospheric pressure (0.2 ~ 0.3Mpa) is added to make the substrate float. In this state, since the substrate 1 is pushed to the substrate reference plane 101 and positioned, the frictional resistance between the substrate receiving levers 191, 192, ..., 198 and the substrate 1 becomes extremely high. Small and easy to locate. In addition, an air compressor or the like is necessary to suck the substrate 1 while blowing it up, but it is omitted in the first figure. In step 608, the substrate 1 and the substrate reference planes 101, 102 are brought into contact with the reference rollers 201, 202, and 211 to position the substrate. 15 That is, in step 608, the substrate is pushed by the pushing rollers 203, 204, and 212 (the thrust is, for example, 1 kgf), and the substrate 1 is pushed toward the reference rollers 201, 202, and 211. The reference rollers 201, 202, and 211 must be kept at least 5 kgf of the force pushing the rollers 203, 204, and 212. In step 609, the blowing up of the substrate receiving rod 194 in the suction groove is stopped. In step 610, the pressure of the suction grooves of the substrate receiving rods 191, 192, ..., 198 is changed from atmospheric pressure to low pressure (vacuum chuck) to attract the substrate 1. In step 611, once the substrate receiving levers 191, 192, ..., 198 attract the substrate 1, the substrate pressing of the pressing rollers 203, 204, and 212 is released, and 17 1226298 causes the pressing rollers 203, 204, and 212 retreated to the outside. The reference rollers 201, 202, and 211 also retreat to the outside. In step 612, the adsorption pads 2201 to 2212 are changed from atmospheric pressure to low pressure (below atmospheric pressure) to prepare for adsorption. 5 In step 613, the substrate receiving levers 19, 192, ..., 198 are lowered. In addition, the decline should be carried out slowly. In step 614, the adsorption pads 2201 to 2212 adsorb the substrate 1, and change the substrate receiving rods 191, 192, ..., 198 from low pressure to atmospheric pressure to stop the adsorption of the substrate 1. _ 10 In step 615, the substrate receiving levers 191, 192, ..., 198 are moved to the lower side, so that the X platform 3 and the Y platform 4 can move freely, as shown in FIG. 1 (d). , The lower sensor 1934 (refer to FIG. 2 described later) is stopped. In addition, in the above description, the substrate 1 is positioned before the substrate 丨 is placed on the substrate holding table 2, and after the positioning, the substrate receiving levers 191, 15 I92,..., 198 are lowered to place the substrate 1. Since it is fixed to the substrate holding table 2 and sufficient mechanical accuracy can be obtained, the error during movement is extremely small, so there is no problem. In the above embodiment, the comparison is made between the atmospheric pressure in the substrate receiving lever and the atmospheric pressure. However, when the inspection device or the like is placed in a fixed gas environment, the adsorption or stopping of the adsorption can be performed by lowering the pressure of the gas environment compared to the gas environment (for example, nitrogen gas). The above-mentioned control is performed by the command of the CPU 163 by the χγ movement control section 7, the substrate receiving lever up-down control section 74 and the substrate receiving lever suction control section. 18 1226298 The schematic structure of an embodiment of one of the substrate receiving levers 191, 192, ..., 198 will be described with reference to Fig. 2. Fig. 2 shows a schematic structure of an embodiment of a substrate receiving lever 191 " 192 ..., 198 of the present invention. Fig. 2 (a) is a schematic diagram illustrating the adsorption and blowing of the substrate receiving lever, and Fig. 2 (b) is a diagram illustrating the sensor 5 shield plate 1942-1, the upper position limiter, and the upper position sensor. 1932, relationship of lower position sensor, lower position limiter 1935
之概略圖’第2(e)圖係說明基板夾持位置感測器遮蔽板 1942-2與基板夹持位置感測器丨933的關係、之概略圖。 第2(a)圖中，藉由步進馬達1941使滾珠螺桿1943旋轉。 1〇藉由該旋轉使螺帽部1944上下（箭頭方向）移動。因應該移 動用以支持基板接收桿191、192......、198之桿安裝部19 b上下私動於螺帽部1944固定有感測器遮蔽板1942-1與 基板夾持位置感測器遮蔽板1942_2，又，隨著螺帽部1944 的移動，感測器遮蔽板1942-1與基板夾持位置感測器遮蔽 15板1942_2會朝上下（垂直）方向移動。2 (e) is a schematic diagram illustrating the relationship between the substrate holding position sensor shielding plate 1942-2 and the substrate holding position sensor 933. In FIG. 2 (a), the ball screw 1943 is rotated by a stepping motor 1941. 10. The nut portion 1944 is moved up and down (in the direction of the arrow) by this rotation. The rod mounting portion 19 b supporting the substrate receiving rods 191, 192, ..., 198 should be moved correspondingly to the nut portion 1944. The sensor shielding plate 1942-1 and the substrate clamping position are fixed. The sensor shield plate 1942_2, and as the nut portion 1944 moves, the sensor shield plate 1942-1 and the substrate holding position sensor shield 15 plate 1942_2 move in the vertical (vertical) direction.
上側位置限制器1931、上側位置感測器1932、下側位 置感測器1934、下側位置限制器1935及基板失持位置感測 时1933係女衣固疋於感測器安裝板1945。感測器安裝板 1945不會隨著螺帽物44而朝上下方向移動。另，該等限 20制為、感測器為例如光感測器。 藉由螺帽部1944朝上方移動，感測器遮蔽板1942]的 開放(缺口）料朝上方義。❹，m賴板著螺帽 H944的#動而上升，使該開放部通過（即，由感測器接收 光束)上船彳6 1932的光軸，藉此，可檢測基板1已 19 1226298 完全抬起的情況，且使基板接收桿198之吸附溝腕的壓力 降低至大氣壓以下，以吸附基板，並停止旋轉滾珠㈣ 1943(參照步驟602)。上側位置限制器1931為一擋止部，其 係在感測器遮蔽板1942-1之開放部通過前述光軸時，使螺 5帽部1944不再朝上方移動，以關閉欲供給至步進馬達1941 的電源。 接著，步驟604中，螺帽部1944朝下方移動，藉此，基 板接收桿191、192.·····、198會下降。然後，與其同時下降 之基板夾持位置感測器遮蔽板1942-2的開放（缺口）部也會 ίο朝下方移動。該基板夾持位置感測器遮蔽板1942_2與感測 器遮蔽板1942-1朝上下方向平行地固定於螺帽部1944。 又，可感測基板夾持位置感測器遮蔽板1942_2下降， 且其開放部通過基板夾持位置感測器1933的光軸，並在該 高度停止使螺帽部1944朝下方移動。然後，執行步驟6〇5〜 15步驟609及步驟61〇〜步驟612。 在執行步驟612後或開始執行後，螺部部1944會下降， 伴ik於此，感測器遮蔽板1942-1也會朝下方移動。然後， 當感測器遮蔽板㈣]之開放部通過下側位置感測器額 之光軸時，則使螺帽部1944停止下降。該停止位置為基板工 20與基板平面維持桿2001〜2100之上部接觸的高度。 又，下側位置限制器1935為一擋止部，其係在感測器 遮蔽板1942-1之開放部通過前述光軸時，使螺帽部1944不 朝下方私動，以關閉欲供給至步進馬達1941的電源（參照 步驟613〜步驟615)。 20 1226298 另’第2(b)圖之左圖係說明感測器遮蔽板；1942-1與上側 位置限制器1931、上側位置感測器1932、下側位置感測器 1934、下側位置限制器1935之位置關係，右圖則顯示從左 圖之紙面右方觀看的情形。同樣地，第2(c)圖之左圖係說明 感測為遮蔽板1942-2與基板夾持位置感測器1933之位置關 係’右圖則顯示從左圖之紙面右方觀看的情形。 吸附係藉由降低基板接收桿198之吸附溝1983之空氣 流通溝的壓力來進行。又，僅中央的基板接收桿194作為降 低空氣流通溝的壓力或者吹起基板用之基板接收桿。即， 為了減少摩擦阻力，且盡量避免基板之橫向移動，故僅將 中央的基板接收桿194設為具吹起機構之基板接收桿。 第2(a)圖中，1951表示具吹起機構之基板接收桿194的 ^氣流通導管系統，而1952表示僅具吸附機構之基板接收 桿(例如，基板接收桿19卜192、193、195〜198)的空氣流通 15導管系統。 基板平面維持桿由於進行定位等而與基板相接觸，因 7容易引起多數桿中任何—個會-曲或折f等破損的情形 ^生。而且，由於桿的數量多，因此該破損無法輕易地發 2〇現，又，其平面度之修正也是極為複雜的事情。此時，在 =板的一部份會發生局部性的彎曲，而導致測量精度下 P牛。以下’照第8圖說明可克服該問題之本發明的另一實 施例。 、 第8圖係顯示本料另-實施例。於上述實施例中，已 針對在將基板定位後，當將基板固定於基板爽持台時，設 21 1226298 有多數基板平面維持桿（夾持機構部），且將基板固定於其上 之貝苑例作說明。但，如上所述，當基板為例w15〇〇mmx 1850mm之大型玻璃板時，即使將基板載置於基板平面維持 桿上，在桿之間亦容易發生彎曲變形，為了因應該問題， 必須增加用以維持平面度之基板平面維持桿的數量，但増 加是有限的。 因此想出將基板夾持台設為平面基板挾持台，以取代 上述多數基板平面維持桿。 10The upper position limiter 1931, the upper position sensor 1932, the lower position sensor 1934, the lower position limiter 1935, and the substrate misalignment position sensing. The 1933 women's clothing is fixed on the sensor mounting plate 1945. The sensor mounting plate 1945 does not move up and down with the nut 44. In addition, the limit is 20, and the sensor is, for example, a light sensor. By moving the nut portion 1944 upward, the opening (notch) of the sensor shielding plate 1942] is upwardly defined. ❹, m is raised with the movement of the nut H944 #, so that the open part passes (ie, the beam is received by the sensor) on the optical axis of the ship 彳 6 1932, whereby the substrate 1 can be detected 19 1226298 completely In the case of lifting, the pressure of the suction groove wrist of the substrate receiving lever 198 is reduced to below atmospheric pressure to attract the substrate and stop rotating the ball ㈣ 1943 (refer to step 602). The upper position limiter 1931 is a stopper. When the open portion of the sensor shielding plate 1942-1 passes the aforementioned optical axis, the screw cap portion 1944 is no longer moved upward to close the supply to the step. Power supply for motor 1941. Next, in step 604, the nut portion 1944 is moved downward, whereby the substrate receiving levers 191, 192, ..., 198 are lowered. Then, the open (notch) portion of the substrate holding position sensor shield 1942-2, which is lowered at the same time, moves downward. The substrate holding position sensor shielding plate 1942_2 and the sensor shielding plate 1942-1 are fixed to the nut portion 1944 in a vertical direction in parallel. In addition, it is possible to sense that the substrate clamping position sensor shielding plate 1942_2 is lowered, and the open portion thereof passes through the optical axis of the substrate clamping position sensor 1933, and at this height, the nut portion 1944 is stopped from moving downward. Then, steps 605 to 15 and steps 609 and 61 to 612 are performed. After step 612 is performed or after execution is performed, the screw portion 1944 will descend, and with this, the sensor shielding plate 1942-1 will also move downward. Then, when the open portion of the sensor shielding plate ㈣] passes the optical axis of the lower position sensor front, the nut portion 1944 is stopped from descending. This stop position is the height at which the substrate worker 20 is in contact with the upper portion of the substrate plane maintaining lever 2001 ~ 2100. In addition, the lower position limiter 1935 is a stopper portion, and when the opening portion of the sensor shielding plate 1942-1 passes through the aforementioned optical axis, the nut portion 1944 does not move privately downward to close the supply to Power source of stepping motor 1941 (refer to steps 613 to 615). 20 1226298 The left diagram of Figure 2 (b) illustrates the sensor shield; 1942-1 and upper position limiter 1931, upper position sensor 1932, lower position sensor 1934, lower position limit The positional relationship of the device 1935, the right figure shows the situation when viewed from the right side of the left side of the paper. Similarly, the left image of FIG. 2 (c) illustrates the positional relationship between the shielding plate 1942-2 and the substrate holding position sensor 1933, which is sensed. The right image shows the situation when viewed from the right side of the left side of the paper. Adsorption is performed by reducing the pressure of the air circulation groove of the adsorption groove 1983 of the substrate receiving rod 198. Also, only the center substrate receiving rod 194 serves as a substrate receiving rod for reducing the pressure of the air circulation groove or blowing up the substrate. That is, in order to reduce frictional resistance and avoid lateral movement of the substrate as much as possible, only the central substrate receiving lever 194 is set as the substrate receiving lever having a blowing mechanism. In FIG. 2 (a), 1951 represents a gas flow duct system for a substrate receiving rod 194 having a blowing mechanism, and 1952 represents a substrate receiving rod having only a suction mechanism (for example, substrate receiving rods 19, 192, 193, 195 ~ 198) 15 duct system for air circulation. The substrate plane maintaining rod is in contact with the substrate due to positioning or the like, and 7 is liable to cause damage to any one of the rods, such as bending, bending or f. In addition, due to the large number of rods, the damage cannot be easily found. Moreover, the flatness correction is extremely complicated. At this time, local bending will occur in a part of the plate, which results in P-negative measurement accuracy. Hereinafter, another embodiment of the present invention which can overcome this problem will be described with reference to FIG. Figure 8 shows another example of this material. In the above embodiments, after positioning the substrate, when fixing the substrate to the substrate holder, 21 1226298 is provided to have a majority of the substrate plane maintaining rods (clamping mechanism parts), and the substrate to which the substrate is fixed. Garden example for illustration. However, as described above, when the substrate is a large glass plate of w1500mm x 1850mm, even if the substrate is placed on the substrate plane maintaining rod, bending deformation is easily occurred between the rods. In order to cope with the problem, it is necessary to increase The number of substrate plane holding rods used to maintain flatness, but the increase is limited. Therefore, it is thought to set the substrate holding stage as a flat substrate holding stage to replace most of the above-mentioned substrate plane holding rods. 10
第8圖之實施例中，將基板夾持台設為面精度高之基板 挾持台2’，以取代第1圖中之基板平面維持桿2〇〇1〜21〇〇， 且在基板夾持台2,設置基板接收桿191、192、......、198(第 8圖中僅顯示基板接接收桿196、197、198)可上下移動之孔 穴。又，同樣地，在基板夾持台2,設置作為吸附墊 2201’〜2212’（第8圖中僅顯示吸附墊2207,〜2210，）之孔穴。然 15 後，當基板1隨著基板接收桿191、192、..... 而下降至基板夾持台2’時，前述吸附墊2207, 基板1。 、198之下降 2210’會吸附In the embodiment of FIG. 8, the substrate holding stage is set to a substrate holding stage 2 ′ with high surface accuracy, instead of the substrate plane holding levers 20001 to 2100 in FIG. 1, and the substrate is clamped on the substrate. The stage 2 is provided with holes for the substrate receiving rods 191, 192, ..., 198 (only the substrate receiving rods 196, 197, and 198 are shown in FIG. 8). Similarly, holes are provided in the substrate holding table 2 as suction pads 2201 'to 2212' (only the suction pads 2207, 2210, and 22 are shown in Fig. 8). Then, when the substrate 1 is lowered to the substrate holding table 2 'along with the substrate receiving rods 191, 192, ..., the aforementioned suction pad 2207, the substrate 1 are formed. , 198's drop 2210 ’will adsorb
其他則由於與弟1圖有相同的功能，故省略其說明。 如上所述，根據第8圖之實施例，將基板夾持台設為精 20度高之平面基板挾持台可減少誤差。另，如上所述，由於 即使使用平面基板夾持台，本發明亦在將基板固定於挾持 台之前完成正確的定位，故定位精度會變得極高。另，在 將基板載置於基板夾持台後，基板會與基板夾持台緊密結 合而不易移動，因而無法進行基板之定位。 22 1226298 如上所述，若根據本發明，則基板推壓力會在仏紱以 内，且在基板沒有損傷的情況下，可輕易地進行基板固定。 L圖式簡單說明】 第1圖係說明本發明之一實施例。 第2(A)圖〜第2(C)圖係顯示本發明之基板接收桿之— 實施例的概略構造。 第3圖係顯示習知測量裝置之構造的方塊圖。 第4圖係說明習知之基板夹持方法。Others have the same functions as those in Figure 1, so their descriptions are omitted. As described above, according to the embodiment of FIG. 8, setting the substrate holding table to a flat substrate holding table with a high precision of 20 degrees can reduce errors. In addition, as described above, even if a flat substrate holding stage is used, the present invention completes accurate positioning before fixing the substrate to the holding stage, so the positioning accuracy becomes extremely high. In addition, after the substrate is placed on the substrate holding table, the substrate is tightly combined with the substrate holding table and cannot be easily moved, so the positioning of the substrate cannot be performed. 22 1226298 As described above, according to the present invention, the substrate pressing force will be within 仏 绂, and the substrate can be easily fixed without damage to the substrate. Brief Description of L Drawings] Fig. 1 illustrates an embodiment of the present invention. Figures 2 (A) to 2 (C) show the schematic structure of an embodiment of a substrate receiving lever of the present invention. Fig. 3 is a block diagram showing the construction of a conventional measuring device. Fig. 4 illustrates a conventional substrate holding method.
第5圖係說明習知之搬送方法。 第6圖係顯示本發明一實施例之線寬測量裝置的構造 之方塊圖。 第7圖係說明本發明之基板接收與固定於吸附板之一 貫施例的處理流程之流程圖。 第8圖係說明本發明之一實施例。 15 【圖式之主要元件代表符號表】 1···基板、檢查對象物 2···基板夹持台 3···Χ軸移動平台 4 · · · Υ轴移動平台 5…除震台 6···照明光源 10···變倍機構 11…檢查對象物透鏡 12···蘭對準㈣象物透鏡 13···光轴移動平台 14···中間透鏡 15···攝像機Fig. 5 is a diagram explaining a conventional transfer method. Fig. 6 is a block diagram showing the construction of a line width measuring device according to an embodiment of the present invention. Fig. 7 is a flowchart illustrating a processing flow of one embodiment of the substrate receiving and fixing to the adsorption plate of the present invention. Fig. 8 illustrates an embodiment of the present invention. 15 [Representative symbols for main components of the drawing] 1 ··· substrate, inspection object 2 ··· substrate holder 3 ··· X-axis moving platform 4 ··· Z-axis moving platform 5… Vibration isolation platform 6 ····························································
7...ΧΥ移動控制部 8···光學顯微鏡7 ... χΥ Movement control section 8 ... Optical microscope
16···測量控制部 17...CRT 9··.光線弓丨導 18··.基板搬送臂部 23 1226298 19...桿安裝部 .上側位置限制器 71...移動控制部 1932... .上側位置感測器 72...基板推壓控刹邬 1933... ，基板夾持位置感測器 73…基板裡面吸附控制部 1934... ，下側位置感測器 74.··基板接收桿上下控制部 1935... .下側位置限制器 75…基板接收桿吸附控制部 1941··, •步進馬達 101、102··.基板基準面 1942-1 ···感測器遮蔽板 1H、112···對準標誌 1942-2 …基板夾持位置感測器 121〜128…位置座標 遮敝板 161…圖像處理部 1943··· •滾珠螺桿 162···光軸移動控制部 1944.., .螺帽部 163...CPU 1945.. .感測器安裝板 191〜198…基板接收桿 1982.. .石夕樹脂 2(H、202、211···基準滾輪 1983·· •吸附溝 203、204、212···滾輪 2001〜2100·.·基板平面維持桿 19H、192卜 1931、1941···孔 2201〜2212.··吸附塾 穴 ⑩ 2416 ··· Measurement control unit 17 ... CRT 9 ··· Light bow 丨 Guide 18 ··· Board transfer arm 23 1226298 19 ... Lever mounting unit. Upper position limiter 71 ... Motion control unit 1932 .... upper position sensor 72 ... substrate pressing control brake 1933 ..., substrate clamping position sensor 73 ... substrate adsorption control unit 1934 ..., lower position sensor 74 ........ Board receiving lever up and down control unit 1935 .... Lower position limiter 75 ... Board receiving lever adsorption control unit 1941 ..., • Stepper motors 101, 102 ... Base board reference plane 1942-1 ... Sensor shielding plate 1H, 112 ... Alignment mark 1942-2 ... substrate holding position sensor 121 ~ 128 ... position coordinate masking plate 161 ... image processing unit 1943 ... ball screw 162 ... Optical axis movement control section 1944 .., nut section 163 ... CPU 1945 .. sensor mounting plates 191 to 198 ... substrate receiving lever 1982 .. stone resin 2 (H, 202, 211 ... Reference rollers 1983 ... Suction grooves 203, 204, 212 ... Rollers 2001 to 2100 ... Substrate plane maintenance rods 19H, 192, 1931, 1941 ... Holes 2201 to 2212 ... Hole cymbals 24
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002337504 | 2002-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP4642610B2 (en) * | 2005-09-05 | 2011-03-02 | 東京エレクトロン株式会社 | Substrate alignment device and substrate accommodation unit |
| KR100807254B1 (en) * | 2007-02-28 | 2008-02-28 | 삼성전자주식회사 | Defect inspecting apparatus |
| JP2012151418A (en) * | 2011-01-21 | 2012-08-09 | Topcon Corp | Suction stage |
| CN108962794B (en) * | 2018-07-20 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Needle lifting method and thimble lifting device applying same |
| CN113330273B (en) * | 2019-01-24 | 2023-11-21 | 株式会社高迎科技 | Transfer mechanism for inspection device, and object inspection method using same |
| KR102304578B1 (en) * | 2019-12-20 | 2021-09-27 | 주식회사 탑 엔지니어링 | Scribing appatus |
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2003
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| TW200424093A (en) | 2004-11-16 |
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