1223577 經濟部智慧財產局員工消費合作社印製 A7 __B7___ 五、發明說明（/ ) [技術領域] 本發明係關於藉加熱加壓成形裝置所製造之積層板的 製造方法。尤其是關於在電子電氣機器等所使用之軟性積 層板之製造方法。 [背景技術] 於電子電氣機器用印刷電路基板所使用的積層板，有 將金屬箔以熱硬化性樹脂等之熱硬化型接著劑來貼附之積 層板（以下稱爲熱硬化型之積層板）、以及藉熱可塑性樹脂 等之熱熔接型接著劑來貼附之積層板(以下稱爲熱熔接型之 積層板）。 熱硬化型之積層板的製造方法以往以來多有硏究，在 實施上，有以下幾個方法：將樹脂含浸紙、樹脂含浸玻璃 布等與金屬箔以多段壓機或真空壓機來壓合，之後，以高 溫進行數小時熱硬化來得到硬性積層板之方法；將輥子狀 之材料夾於一對之加熱輥子進行積層，之後，取代加熱輥 子、改用雙帶式壓機裝置進行熱積層之方法等。其間，爲 達成解決以下問題的目的，有時會於裝置之加壓面與被積 層材料之間挾持保護材料來進行加熱加壓成形。亦即，在 金屬箔表面出現刮傷或打痕(特開昭60-109835)或在熱積層 後之硬化爐發生積層板的板彎(特開平4-89254)、或因爲有 樹脂積留之欠缺平滑性的樹脂含浸紙、樹脂含浸玻璃布等 阻礙到平順的積層加工等問題發生時，有時要用到保護材 料。 在製造該等熱硬化型之積層板的情形下，加熱加壓成 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 蓼：1223577 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 __B7___ V. Description of Invention (/) [Technical Field] The present invention relates to a method for manufacturing a laminated board manufactured by a heating and pressure forming device. In particular, it relates to a method for manufacturing a flexible laminated board used in electrical and electronic equipment. [Background Art] A laminated board used for a printed circuit board for electronic and electrical equipment includes a laminated board (hereinafter referred to as a thermosetting laminated board) in which metal foil is attached with a thermosetting adhesive such as a thermosetting resin. ), And a heat-sealing type laminated board (hereinafter referred to as a heat-sealed type laminated board) affixed by a heat-welding type adhesive such as a thermoplastic resin. The manufacturing methods of heat-curable laminated boards have been studied in the past. In practice, there are several methods: pressing resin-impregnated paper, resin-impregnated glass cloth, and metal foil with a multi-stage press or a vacuum press. Then, a method of obtaining a hard laminated board by heat curing at high temperature for several hours; sandwiching a roller-like material between a pair of heated rollers for lamination, and then replacing the heated rollers with a double-belt press device for thermal lamination Methods, etc. Meanwhile, in order to achieve the purpose of solving the following problems, a protective material may be held between the pressurizing surface of the device and the material to be laminated, and then heated and press-molded. That is, there are scratches or scratches on the surface of the metal foil (Japanese Patent Application Laid-Open No. 60-109835), or bending of the laminated board occurs in the hardening furnace after thermal lamination (Japanese Patent Application No. 4-89254), or because of resin accumulation Protective materials are sometimes used when problems such as resin-impregnated paper and resin-impregnated glass cloths that lack smoothness prevent smooth lamination. In the case of manufacturing such thermosetting laminates, it is heated and pressurized to 4 paper sizes to apply Chinese National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling this page ) 蓼:
If· 線· 1223577 A7 _____B7_ 五、發明說明（2 ) (請先閱讀背面之注意事項再填寫本頁) 形溫度幾乎都是低於200°C。此種程度的加熱溫度對於被 積層材料所施之熱應力小，不至於發生熱積層時之皺摺等 之外觀不佳。惟，在製造熱熔接型之積層板的情況下，進 行加熱加壓的溫度必須超過構成接著層之熱可塑性樹脂之 玻璃移轉溫度(Tg)，否則無法進行熱熔接。另一方面，電 子電氣機器用積層板，由於在元件組裝的過程中會遇高溫 高壓，所以構成接著層之熱可塑性樹脂至少要有170°C的 Tg。從而，爲進行其熱熔接，必須使用到至少200°C的熱 積層溫度。在此種高溫下的積層，被積層材料之熱膨脹· 熱收縮的變化會變大，受積層加工之積層體會出現皺摺等 之外觀不佳的情形，此爲問題所在。 另一方面，在上述熱硬化型之積層板的接著材料上， 一般係使用環氧系、丙烯酸系等之接著劑。惟，最近在基 板特性方面，係要求作爲載置系統用之基板在高溫下此種 惡劣的環境下使用時應具之耐熱性、較以往之焊料在熔點 上高出數十°C之無鉛焊料應具之焊料回焊耐性等，故以往 之環氧系、丙烯酸系之接著劑在耐熱性上乃相對的不充分 〇 經濟部智慧財產局員工消費合作社印製 是以，乃對使用到兼具耐熱性之聚醯亞胺系之接著劑 的基板進行硏究。 例如，在聚醯亞胺金屬箔積層板之製造方法上，已知 於金屬箔上進行聚醯亞胺前驅物一聚醯亞胺淸漆以及/或是 聚醯胺酸淸漆的直接塗佈•乾燥•硬化之方法。由於此種 方法係直接將溶液狀之淸漆塗佈於金屬箔上，也正由於是 5 紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1223577 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（$ ) 溶液狀之故可輕易地浸透到金屬箔之表面的凹凸（側面）， 於金屬箔與聚醯亞胺層之間不會出現小的間隙（微孔洞）， 即使切出線寬爲10〜50//m的電路圖案也沒有問題。惟此 種方法，於進行直接塗佈•乾燥•硬化之時，因爲溶劑乾 燥以及硬化的熱收縮，於聚醯亞胺金屬箔積層體會發生皺 摺、波紋、板彎等，並不敷電路基板材料之所需。是以， 乃提出有關不會出現皺摺、波紋、板彎等之聚醯亞胺金屬 箔積層體之製造方法。 例如，在特開平7-193349號公報中，揭示一種聚醯亞 胺金屬箔積層體之製造方法，係於非熱可塑性聚醯亞胺基 材上，進行熱可塑性聚醯亞胺淸漆以及/或是熱可塑性聚醯 亞胺之前驅物一聚醯胺酸淸漆之直接塗佈•乾燥•硬化， 來形成熱可塑性聚醯亞胺層，其次，於熱可塑性聚醯亞胺 層之表面熱壓接金屬箔。以該方法所得之聚醯亞胺金屬箔 積層體，並無皺摺、波紋、板彎等之缺點，金屬箔與聚醯 亞胺層之間的剝離強度亦相當足夠，爲一種可作爲優異之 電路基板材料的聚醯亞胺金屬箔積層體。惟，在金屬箔與 熱可塑性聚醯亞胺層之間存在著直徑10〜50/zm左右的微 孔洞’作爲形成微細電路圖案之高密度電路基板材料未能 說是相當足夠。 另一方面，伴隨近年來之電子製品之輕量化、小型化 '高密度化，印刷電路基板之需求亦提昇，尤其，於絕緣 性薄膜上形成銅箔電路之軟性印刷基板的需求也增加。作 爲此種軟性印刷基板之製造方法，一般有：在被連續供給 6 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) - .- 丨線- 1223577 A7 __^_B7__ 五、發明說明（* ) 之聚醯亞胺薄膜等之絕緣性薄膜上將連續供給之銅箔以熱 硬化性接著劑在加熱狀態下連續地貼合，藉蝕刻等之方式 於該銅箔上形成電路之製造方法；以及，將事先於上下面 形成有連續供給之耐熱性熱可塑性接著劑的聚醯亞胺薄膜 等之接著薄膜、連續供給之銅箔在加熱狀態下貼合，藉蝕 刻等之方式於該銅箔上形成電路之製造方法等。 由於上述軟性印刷基板係會組裝用於行動電話、攜帶 型電腦之高密度組裝元件等，故尤爲要求其尺寸安定性。 如特開平2-134241或特開平10-126035所記載般，已 知此尺寸安定性係受到製造軟性積層板之際之加工條件相 當程度的影響。例如，於特開平10-126035中，記載著「 若此軟性印刷基板採用上述製造方法，則受到張力的影響 ，於貼合製程之前，絕緣性薄膜會延伸，由於在此狀態下 與銅箔（銅箔幾乎未延伸）貼合，故進行蝕刻處理形成電路 作爲軟性印刷基板時，於蝕刻處理之際，銅箔之一部分的 溶解析出會造成絕緣性薄膜之延伸變形的開放而收縮，從 而軟性印刷基板會收縮，此爲問題所在。又，在加熱狀態 下將聚醯亞胺薄膜與銅箔貼合之際，由於聚醯亞胺薄膜之 線膨脹係數較銅箔之線膨脹係數爲大，相較於銅箔，聚醯 亞胺薄膜是在延伸的狀態下進行貼合。因此，進行蝕刻處 ( -- 理形成電路作爲軟性印刷基板時，同樣於蝕刻處理之際銅 箔之一部分的溶解析出會造成聚醯亞胺薄膜之延伸變形的 開放而收縮，從而軟性印刷基板會收縮，此爲問題所在。 」° .. 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） " (請先閱讀背面之注意事項再填寫本頁) m -線· 1223577 A7 B7 五、發明說明（r) 惟，在特開平2-134241中，係施行有等離子體處理， 且積層係在60〜120°C之低溫下進行，其中，等離子體處理 有牽涉到製品之成本提高的問題，而等離子體處理不在線 上進行，以高於120°C的溫度來積層時有無法發揮效果等 之問題。 又，特開平10-126035係在50〜120°C之低溫進行貼合 ，有以高於120°C之溫度進行積層時無法發揮效果等的問 題。 另一方面，關於藉由熱積層來獲得積層板的方法，如 上所述，係採用熱輥積層機來進行、或使用多段壓機或真 空壓機進行壓合來得到積層板之方法、或是使用雙帶式壓 機裝置進行熱積層之方法等。 惟，由於多段壓機或真空壓機係以單動的方式進行壓 合，將無法採行輥子對輥子之連續積層。雙帶式壓機裝置 雖可連續地積層，惟初期成本與維修費用等較單動壓合裝 置來得高。又，由於雙帶式壓機裝置之帶子’係將長長的 鋼帶的兩端熔接、硏磨所做成之無端(endless)化之物，以 挾持著壓輥子的方式配置於上下，所以將積層材料加以積 層時，帶子之接合部所出現的痕跡會轉印，由於該轉印部 分在貼合上不均一，故無法作爲製品來使用。再者，由於 壓輥子的壓力是透過帶子傳遞到積層材料上，故若以在寬 方向上厚度差異大的帶子來進行積層時’有積層材料之接 著不均一的問題存在。如上所述，就雙帶式壓機裝置之方 式而言，關於帶子表面之均一性必須充分地考慮。 8 (請先閱讀背面之注咅心事項再填寫本頁) 訂---------線！ 經濟部智慧財產局員工消費合作社印製If · Line · 1223577 A7 _____B7_ 5. Description of the Invention (2) (Please read the precautions on the back before filling this page) The forming temperature is almost below 200 ° C. This degree of heating temperature has a small thermal stress on the material to be laminated, and does not cause the appearance of wrinkles and the like when the heat is laminated. However, in the case of manufacturing a heat-welded laminated board, the temperature for heating and pressing must exceed the glass transition temperature (Tg) of the thermoplastic resin constituting the adhesive layer, or heat-welding cannot be performed. On the other hand, laminates for electronic and electrical equipment are subject to high temperatures and pressures during the assembly of components. Therefore, the thermoplastic resin constituting the adhesive layer must have a Tg of at least 170 ° C. Therefore, in order to perform its thermal welding, a heat build-up temperature of at least 200 ° C must be used. Lamination at such a high temperature causes a large change in the thermal expansion and thermal contraction of the laminated material, and the laminated body subjected to the lamination process may have a poor appearance such as wrinkles. This is a problem. On the other hand, an adhesive such as an epoxy-based or acrylic-based adhesive is generally used as a bonding material for the above-mentioned thermosetting type laminate. However, recently, in terms of substrate characteristics, it is a lead-free solder that requires heat resistance when used as a substrate for a mounting system in such a harsh environment at high temperatures, and has a melting point that is tens of degrees Celsius higher than conventional solders. Due to the solder reflow resistance, the conventional epoxy and acrylic adhesives are relatively inadequate in heat resistance. It is printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The substrate of the heat-resistant polyimide-based adhesive is investigated. For example, in the manufacturing method of polyimide metal foil laminated board, it is known to directly coat polyimide precursor-polyimide lacquer and / or polyimide lacquer on metal foil. • Drying and hardening methods. Because this method is to directly apply the solution-like lacquer to metal foil, it is also because the paper size is 5 national standards (CNS) A4 (210 X 297 mm) 1223577 Employees of the Intellectual Property Bureau of the Ministry of Economy Cooperative printed A7 B7_ 5. Description of the invention ($) The solution can easily penetrate the unevenness (side) of the surface of the metal foil, and there will be no small gap between the metal foil and the polyimide layer (micro (Holes), even if a circuit pattern with a line width of 10 to 50 // m is cut. However, when this method is used for direct coating, drying, and hardening, due to solvent drying and heat shrinkage of the hardening, wrinkles, corrugations, board bends, etc. may occur in the polyimide metal foil laminate, and no circuit board is applied. Materials needed. Therefore, a method for manufacturing a polyimide metal foil laminate which does not exhibit wrinkles, corrugations, plate bends, or the like is proposed. For example, in Japanese Patent Application Laid-Open No. 7-193349, a method for manufacturing a polyimide metal foil laminate is disclosed, which is performed on a non-thermoplastic polyimide base material to perform a thermoplastic polyimide lacquer and / Or the direct coating, drying, and hardening of the thermoplastic polyimide precursor-polyamic acid lacquer to form a thermoplastic polyimide layer. Second, the surface heat of the thermoplastic polyimide layer is Crimp metal foil. The polyimide metal foil laminate obtained by this method does not have the disadvantages of wrinkles, corrugations, plate bends, etc., and the peel strength between the metal foil and the polyimide layer is also quite sufficient, which is an excellent Polyimide metal foil laminate of circuit board material. However, the existence of micro holes with a diameter of about 10 to 50 / zm between the metal foil and the thermoplastic polyimide layer is not sufficient as a high-density circuit substrate material for forming a fine circuit pattern. On the other hand, with the reduction in weight and miniaturization of electronic products in recent years, the demand for printed circuit boards has also increased. In particular, the demand for flexible printed circuit boards that form copper foil circuits on insulating films has also increased. As a method for manufacturing such flexible printed substrates, generally there are 6 paper sizes that are continuously supplied in accordance with Chinese National Standards (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling this page) -.- 丨 Line-1223577 A7 __ ^ _ B7__ V. Insulating film such as polyimide film (*) of the invention will be continuously supplied with copper foil with thermosetting adhesive under heating , A method for forming a circuit on the copper foil by etching, etc .; and a continuous supply of a polyimide film such as a polyimide film having a continuously supplied heat-resistant thermoplastic adhesive on the top and bottom, and continuously supplied copper A method for manufacturing a circuit by laminating foils in a heated state and forming a circuit on the copper foil by etching or the like. Since the above-mentioned flexible printed circuit boards are assembled with high-density assembly components used in mobile phones and portable computers, their dimensional stability is particularly required. As described in Japanese Patent Application Laid-Open No. 2-134241 or Japanese Patent Application Laid-Open No. 10-126035, it is known that this dimensional stability is affected by the relative degree of processing conditions at the time of manufacturing a flexible laminated board. For example, in Japanese Patent Application Laid-Open No. 10-126035, "If this flexible printed circuit board adopts the above-mentioned manufacturing method, it will be affected by tension. Before the bonding process, the insulating film will stretch. (The copper foil is hardly stretched), so when etching is performed to form a circuit as a flexible printed circuit board, during the etching process, the dissolution of a part of the copper foil will cause the insulating film to expand and deform to open and shrink, resulting in soft printing. The substrate will shrink, which is the problem. In addition, when the polyimide film is bonded to the copper foil under heating, the linear expansion coefficient of the polyimide film is larger than that of the copper foil. Compared with copper foil, polyimide film is bonded in an extended state. Therefore, when an etching process is performed (-when a circuit is formed as a flexible printed circuit board), a part of the copper foil is dissolved out during the etching process. It will cause the polyimide film to be stretched and deformed to open and shrink, so that the flexible printed substrate will shrink. This is the problem. ”° .. 7 The paper size is suitable China National Standard (CNS) A4 Specification (210 X 297 mm) " (Please read the precautions on the back before filling this page) m-line · 1223577 A7 B7 V. Description of the invention (r) However, in JP 2 In -134241, the plasma treatment is performed, and the lamination is performed at a low temperature of 60 ~ 120 ° C. Among them, the plasma treatment has a problem of increasing the cost of the product, and the plasma treatment is not performed online, so When laminating at 120 ° C, there is a problem that the effect cannot be exhibited. JP 10-126035 is bonded at a low temperature of 50 to 120 ° C, and it cannot be laminated at a temperature higher than 120 ° C. On the other hand, as for the method of obtaining a laminated board by thermal lamination, as described above, it is carried out by using a hot roll laminator or by using a multi-stage press or a vacuum press to obtain a laminated layer. Plate method, or thermal lamination method using a double-belt press device, etc. However, since multi-stage presses or vacuum presses are laminated in a single-action manner, continuous roll-to-roll lamination cannot be adopted. .Double belt Although the press device can be continuously laminated, the initial cost and maintenance cost are higher than those of the single-acting press device. In addition, because the strap of the double-belt press device is a fusion of two ends of a long steel belt, The endless material made by the mill is arranged on the upper and lower sides by holding the pressure roller. Therefore, when the laminated material is laminated, the traces appearing at the joint portion of the belt will be transferred. The bonding is uneven, so it cannot be used as a product. In addition, since the pressure of the pressing roller is transmitted to the laminated material through the tape, if laminating is performed with a tape with a large thickness difference in the width direction, there is a laminated material Then there is the problem of non-uniformity. As described above, in terms of the method of the double-belt press device, the uniformity of the surface of the tape must be fully considered. 8 (Please read the note on the back before filling this page) Order --------- line! Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
r^i H ϋ ϋ ϋ H ϋ n i_i I ϋ ϋ ϋ ϋ ^1 H ϋ I ϋ n -I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 1223577 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（6 ) 就熱輥積層機而言，由於適用於積層溫度在loot：左 右之較爲低溫之熱硬化型樹脂上，通常乃具有橡膠一金屬 輥子或是橡膠一橡膠輥子的構成。此構成可藉由橡膠的彈 性在寬方向上施加無壓力差異的加壓，可進行均一的積層 。惟，在使用具有耐熱性之熱熔接性之被積層材料時，由 於積層加工需要超過250°C的高溫，故使用橡膠輥子的熱 輥積層機會受熱造成橡膨變形，因而無法使用在此種目的 之積層加工上。 本發明之目的在於提供一種耐熱性軟性積層板之製造 方法與製造裝置’其不會因爲高溫之熱積層產生皴摺•彎 曲等之外觀不佳的情形，表面爲均一，又層間受到良好的 接著。 [發明之揭示] 賴明之積職之製造方法，係將含雜熔接性之被 積層材料的複數之被積層材料以加熱加壓成形裝置進行加 熱加壓、貼合來製造積層板；其要旨在於，於該加熱加壓 成形裝置之加壓職該複數之被積層材料之間配置保護材 料’以2〇oc以上之溫度將該複數之被積層材料加熱加壓 、貼合，讓該保’料㈣合後之該複數之被積層材料密 接，在貼σ後之5亥複數之被積層材料冷卻後，自該貼合後 之該複數之被積層材料剝離掉該保護材料。 又，於本發明之積層板之製造方法中，能以連續的方 式貼合前述複數之被積層材料。 又，於本發明之積層板之製造方法中，前述加熱加壓 9 本紙張尺度適用中國國家標準（CNS)A4 2犯公爱）--^-- (請先閱讀背面之注意事項再填寫本頁) • ϋ -1·— mmaMm ϋ n ϋ n J \ 0 I ί I t .線！ p— I I I I----I I I I — — — — — — — I . 1223577 經濟部智慧財產局員工消費合作社印製 五 發明說明（ 成形裝置可具備1對或複數對之金屬輥子。 又，於本發明之積層板之製造方法中，前魂加熱加麻 成形裝置可爲具備1對之無端鋼帶的雙帶式壓機。~ ^ 於本發明之積層板之製造方法中，前述金鵬_子之直 徑可爲200mm以上。 於本發明之積層板之製造方法中，前述金_輕子之正 圓度可爲〇.〇5mm以下，且圓筒度可爲0,05mm以下，表面 粗糙度可爲0.01mm以下。 於本發明之積層板之製造方法中，前述金屬輕子面在 軸方向之溫差可爲土 10°C以下。 於本發明之積層板之製造方法中，前述金屬輕子之表 面硬度可爲Hs50以上。 又，於本發明之積層板之製造方法中，前述保護材料 之厚度可爲50/zm以上。 於本發明之積層板之製造方法中，前述保護材料可爲 聚醯亞胺薄膜。 於本發明之積層板之製造方法中，前述聚醯亞胺薄膜 可爲非熱可塑性之物。 於本發明之積層板之製造方法中，前述保護材料，在 貼合溫度時的拉伸彈性率可爲490N/mm2以上、且自200。(： 〜300°C之線膨脹係數可爲100ppm/°C以下。 於本發明之積層板之製造方法中，前述保護材料可呈 捲爲輥狀的長條片狀形狀。 於本發明之積層板之製造方法中，可在以前述加熱加 請 先 閱 背 意 事 項 訂 線 太紙張尺度適用_國國家標準（CNS)A4規格（210 X 297公釐） 1223577 A7 B7 五、發明說明（友 經濟部智慧財產局員工消費合作社印製 壓成形裝置來加壓加熱前述複數之被積層材料之前，將前 述保護材料預熱。 於本發明之積層板之製造方法中，前述預熱之溫度可 爲進行加熱加壓之溫度以上的溫度。 於本發明之積層板之製造方法中，前述保護材料能以 被覆前述無端鋼帶之一部分的形式配置而受到預熱。 於本發明之積層板之製造方法中，可反覆使用前述保 護材料。 於本發明之積層板之製造方法中，一對之前述保護材 料可配置成挾持著前述複數之被積層材料，以貼合之該複 數之被積層材料爲對稱面，讓該一對之保護材料彼此以對 稱的角度進行剝離。 於本發明之積層板之製造方法中，藉前述加熱加壓成 形裝置貼合之前，作用於前述熱熔接性之被積層材料的張 力’必須調整爲可讓該熱熔接性之被積層材料安定前進之 最低限度，而可將前述金屬材料之張力設定爲該熱熔接性 之被積層材料之張力的3倍以上。 於本發明之積層板之製造方法中，前述熱熔接性之被 積層材料的張力可爲 0·1 〜3.0 N/mm2 0 於本發明之積層板之製造方法中，前述複數之被積層 材料當中的至少一被積層材料可呈捲爲輥狀的長條片狀形 狀。 於本發明之積層板之製造方法中，前述熱熔接性之被 積層材料的接著成分係含有熱可塑性聚醯亞胺50重量°/。以 請 先 閱 讀 背r ^ i H ϋ ϋ ϋ H ϋ n i_i I ϋ ϋ ϋ ϋ ^ 1 H ϋ I ϋ n -I This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) 1223577 A7 B7 Ministry of Economy Wisdom Printed by the Consumers' Cooperative of the Property Bureau V. Description of the invention (6) As for the hot roll laminator, it is suitable for thermosetting resins with a lamination temperature of about 30 ° C, which usually has rubber-metal rolls or It is a rubber-rubber roller. With this structure, the elasticity of the rubber can be applied in a wide direction without pressure difference, and uniform lamination can be performed. However, when using laminated materials with heat-resistant heat-welding properties, because the lamination process requires a high temperature of more than 250 ° C, the heat-rolled laminates using rubber rollers may be heated and cause rubber deformation, which makes them unusable for this purpose. On the lamination process. The object of the present invention is to provide a method and device for manufacturing a heat-resistant flexible laminated board, which does not cause poor appearance such as folding or bending due to high-temperature heat laminated layers, the surface is uniform, and the layers are well adhered. . [Disclosure of the invention] Lai Mingzhi's manufacturing method is to manufacture a laminated board by heating, pressing, and laminating a plurality of laminated materials containing laminated materials with hetero-weldability with a heating and pressing molding device; , A protective material is arranged between the plurality of laminated materials of the heating and pressing forming device to heat, press and paste the plurality of laminated materials at a temperature of more than 20 oc, so that the materials can be protected. After the bonding, the plurality of laminated materials are in close contact. After the slag of the plurality of laminated materials is cooled, the protective material is peeled off from the plurality of laminated materials after the lamination. Furthermore, in the method for manufacturing a laminated board according to the present invention, the plurality of laminated materials described above can be bonded in a continuous manner. Also, in the manufacturing method of the laminated board of the present invention, the aforementioned heating and pressing 9 paper sizes are applicable to the Chinese National Standard (CNS) A4 2 guilty of public love)-^-(Please read the precautions on the back before filling in this Page) • ϋ -1 · — mmaMm ϋ n ϋ n J \ 0 I ί I t. Line! p— III I ---- IIII — — — — — — — — I. 1223577 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed five invention notes (the forming device can be equipped with one or plural pairs of metal rollers. In the manufacturing method of the laminated board of the invention, the front soul heating and hemp forming device may be a double-belt press having one pair of endless steel strips. ~ ^ In the manufacturing method of the laminated board of the present invention, the aforementioned Jinpeng_Zizhi The diameter may be 200 mm or more. In the manufacturing method of the laminated board of the present invention, the circularity of the aforementioned gold-light lepton may be 0.05 mm or less, and the circularity may be 0,05 mm or less, and the surface roughness may be 0.01mm or less. In the manufacturing method of the laminated board of the present invention, the temperature difference of the aforementioned metal lepton surface in the axial direction may be less than 10 ° C. In the manufacturing method of the laminated board of the present invention, the surface of the aforementioned metal lepton. The hardness may be Hs50 or more. Also, in the method for manufacturing a laminated board of the present invention, the thickness of the aforementioned protective material may be 50 / zm or more. In the method for manufacturing the laminated board of the present invention, the aforementioned protective material may be polyurethane. Amine film. In the manufacturing method of the laminated board of the invention, the aforementioned polyimide film may be a non-thermoplastic material. In the manufacturing method of the laminated board of the present invention, the tensile elastic modulus of the protective material at the bonding temperature may be 490N / mm2 or more, and from 200. (: The linear expansion coefficient of ~ 300 ° C can be 100ppm / ° C or less. In the manufacturing method of the laminated board of the present invention, the aforementioned protective material can be rolled into a roll-shaped strip Sheet-like shape. In the manufacturing method of the laminated board of the present invention, the above-mentioned heating plus please read the precautions before setting the line too. Paper size is applicable _ National Standard (CNS) A4 (210 X 297 mm) 1223577 A7 B7 V. Description of the invention (Before the consumer cooperative of the Intellectual Property Bureau of the Ministry of Friends of the Economy prints a press-forming device to preheat and heat the plurality of laminated materials, the aforementioned protective materials are preheated. In the manufacturing method of the laminated plate of the present invention The pre-heating temperature may be a temperature higher than the temperature for heating and pressing. In the manufacturing method of the laminated board of the present invention, the protective material can cover a part of the endless steel strip. In the manufacturing method of the laminated board of the present invention, the aforementioned protective material can be used repeatedly. In the manufacturing method of the laminated board of the present invention, a pair of the aforementioned protective materials can be configured to hold a plurality of the aforementioned plural ones. In the laminated material, the plurality of laminated materials to be bonded are used as symmetry planes, and the pair of protective materials are peeled off at a symmetrical angle to each other. In the manufacturing method of the laminated plate of the present invention, it is formed by the aforementioned heating and pressing. Before the device is bonded, the tension of the laminated material that acts on the heat-weldable material must be adjusted to the minimum that allows the laminated material to be stably advanced, and the tension of the metal material can be set as the heat-welded material. More than three times the tension of the laminated material. In the method for manufacturing a laminated board according to the present invention, the tension of the aforementioned heat-sealable laminated material may be 0.1 to 3.0 N / mm2. In the method for manufacturing the laminated board according to the present invention, among the plurality of laminated materials described above, At least one of the laminated materials may be in the shape of a long sheet rolled into a roll. In the method for manufacturing a laminated board according to the present invention, the above-mentioned heat-sealable laminated material includes a thermoplastic polyimide containing 50% by weight. So please read it first
I 再I again
頁 訂 線 泰 11 1223577 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（’） 上之樹脂。 於本發明之積層板之製造方法中，前述熱熔接性之被 積層材料可爲由含有熱可塑性聚醯亞胺50重量％以上之樹 脂所擒成之單層薄膜。 於本發明之積層板之製造方法中，前述熱熔接性之被 胃®材料，可爲於非熱可塑性聚醯亞胺薄膜之單面或雙面 具有樹脂層(含有熱可塑性聚醯亞胺50重量％以上)之複數 層之薄膜。 &本發明之積層板之製造方法中，前述熱熔接性之被 胃胃#料，可爲於纖維片基材含浸樹脂(含有熱可塑性聚醯 亞胺5〇重量％以上)所得之片。 &本發明之積層板之製造方法中，前述熱熔接性之被 胃層材料可爲玻璃移轉溫度170°C以上之耐熱性接著材料 〇 於本發明之積層板之製造方法中，前述複數之被積層 材料可含有金屬材料。 於本發明之積層板之製造方法中，前述金屬材料可爲 厚度5〇Vm以下之金屬箔。 於本發明之積層板之製造方法中，前述金屬箔可爲擇 自銅、鎳、鋁、不鏽鋼以及該等之合金所構成群之中至少 一種之金屬箔。 於本發明之積層板之製造方法中，前述金屬箔可爲銅 箱。 於本發明之積層板之製造方法中，對於由前述熱熔接 12 本’”氏張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） -------^---------^ (請先閱讀背面之注意事項再填寫本頁) 1223577 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（π ) 性之被積層材料與前述金屬材料貼合所成的積層板，自貼 合有該熱熔接性之被積層材料與前述金屬材料之積層板去 除該金屬材料後，在150°C加熱30分鐘，接著回到室溫後 之積層板之尺寸變化率的絕對値，在MD方向與TD方向 皆可達0.10%以下。 於本發明之積層板之製造方法中，前述金屬箱的表面 粗糙度的最大高度(Rmax)可爲i5//m以下、十點平均粗糙 度(Rz)可爲10/zm以下、且中心線平均粗糙度(Ra)可爲2// m以下。 本發明之加熱加壓成形裝置，係將含有熱熔接性之被 積層材料的複數之被積層材料加壓加熱來貼合以形成積層 板；其要旨在於，係具備1對或複數對之金屬輥子，該金 屬輥子係以200°c以上之溫度來加熱加壓該複數之被積層 材料進行貼合。 本發明之加熱加壓成形裝置，係針對含有熱熔接性之 被積層材料的複數之被積層材料，於該加熱加壓成形裝置 之加壓面與該複數之被積層材料之間，配置保護材料(在該 複數之被積層材料貼合後可自該複數之被積層材料移除）， 進行加熱加壓來貼合得到積層板；其要旨在於，具備··輸 送機構’係用以輸送該保護材料；引導機構，其在剝離該 保護材料的位置’近接於δ亥保護材料(係密接於貼合之該複 數之被積層材料），弓丨導該保護材料；以及拉出機構，係用 以將該保護材料拉出。 於本發明之加熱加壓成形裝置中，前述金屬輥子之直 13 (請先閱讀背面之注意事項再填寫本頁) #. -線 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） 1223577 五、發明說明（u ) 徑可爲200mm以上。 於本發明之加熱加壓成形裝置中，前述金鞫輥子之正 圓度可爲〇·〇5匪以下，且圓筒度可爲〇 〇5顏以下，表面 粗糙度可爲0.01mm以下。 方々本發明之加熱加壓成形裝置中，前述金屬輕子面在 軸方向之溫差可爲士 10 °C以下。 於本發明之加熱加壓成形裝置中，前述金屬輕子之表 面硬度可爲Hs50以上。 [圖式之簡單說明] 圖l(a)，(b)係用以說明本發明之積層板之製造方法所顯 示之，於本發明所使用之加熱加壓成形裝置的側視示意圖 〇 圖2係用以說明本發明之積層板之製造方法所顯示之 ，於本發明所使用之另一加熱加壓成形裝置的側視示意圖 〇 圖3(a)，(b)係用以說明於本發明之積層板之製造方法中 ，加熱加壓成形裝置之金屬輥子與保護材料的接觸狀態的 側視示意圖。 經濟部智慧財產局員工消費合作社印制衣 第4圖係用以說明有關本發明之使用到複數對之金屬 輥子的積層板之加熱加壓成形裝置的側視示意圖。 第5圖係用以說明有關本發明之使用到金屬_子的積 層板之加熱加壓成形裝置的側視示意圖。 [用以實施發明之最佳形態] 本發明者發現，將含有熱熔接性之被積層材料的複數 14 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1223577 A7 經濟部智慧財產局員工消費合作社印製 發明說明（) 之被積層材料（例如熱可塑性聚醯亞胺與銅箔）以加熱加壓 成开置在闻於200 C之溫度進行貼合之積層板之製造方 法中右匕貼合時在被積層材料之外側配合保護材料而進 行貼合時，即使貼合後之熱可塑性聚醯亞胺有收縮的傾向 ，但由於銅箱外側具有保護材料，可抑制面方向的移動， 從而熱可塑性聚醯亞胺的動作受限，於貼合後之積層板上 不會出現皺摺，乃完成了以下所述之發明。 再者’將含有具耐熱性之熱熔接性之被積層材料的複 數之被積層材料(例如熱可塑性聚醯亞胺與銅箔)以加熱加 壓成形裝置貼合所得之積層板之製造方法中，需要超過橡 膠輥子之耐熱溫度的高加熱溫度之使用以往之橡膠輥子的 積層法，因受熱造成橡膠輥子之變質，而無法進行均一的 接著，有鑑於此，乃硏究使用一對或複數對之金屬輥子之 耐熱性積層板之製造方法及製造裝置。 首先，詳細地說明皺摺等之外觀不佳的原因。例如， 以熱輥積層機來貼合銅箔與熱可塑性聚醯亞胺之時，銅箔 與熱可塑性聚醯亞胺雖藉由通過熱輥積層機之加壓輥子間 受到加熱加壓而貼合，惟於熱積層之時，各被積層材料係 處於受熱膨脹的狀態下，由於一般熱可塑性聚醯亞胺之線 膨脹係數大於銅箔之線膨脹係數，所以熱可塑性聚醯亞胺 會在較銅箔於面方向延伸甚多的狀態下與銅箔熱積層，相 反的，於冷卻時熱可塑性聚醯亞胺會在較銅箔於面方向縮 減甚多。是以，製得之積層板在面方向會出現皺摺。又， 一般認爲，即使於結束加熱加壓後就立即開放壓力’但由 15 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公爱） 閱 讀 背 意 事 項Page Order Thai 11 1223577 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Resin on the description of invention (’). In the method for manufacturing a laminated board according to the present invention, the aforementioned heat-sealable laminated material may be a single-layer film obtained from a resin containing 50% by weight or more of thermoplastic polyimide. In the method for manufacturing the laminated sheet of the present invention, the aforementioned heat-sealable stomach® material may have a resin layer on one or both sides of a non-thermoplastic polyimide film (containing a thermoplastic polyimide 50) Weight% or more). & In the method for manufacturing a laminated board according to the present invention, the aforementioned heat-sealable stomach and stomach material may be a sheet obtained by impregnating a fiber sheet base material with a resin (containing 50% by weight or more of thermoplastic polyfluorene imine). & In the method for manufacturing a laminated board according to the present invention, the heat-sealable stomach layer material may be a heat-resistant adhesive material having a glass transition temperature of 170 ° C or higher. In the method for manufacturing the laminated board according to the present invention, the foregoing plural The laminated material may contain a metallic material. In the method for manufacturing a laminated board of the present invention, the aforementioned metal material may be a metal foil having a thickness of 50 Vm or less. In the method for manufacturing a laminated board of the present invention, the aforementioned metal foil may be a metal foil selected from at least one of the group consisting of copper, nickel, aluminum, stainless steel, and alloys thereof. In the method for manufacturing a laminated board of the present invention, the aforementioned metal foil may be a copper box. In the manufacturing method of the laminated board of the present invention, the Chinese National Standard (CNS) A4 specification (210 X 297 public love) is applicable to the 12 '"Zhang's sheet scales welded by the aforementioned thermal welding ------- ^ --- ------ ^ (Please read the notes on the back before filling this page) 1223577 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention (π) The laminated material is attached to the aforementioned metal material The laminated board thus formed is obtained by removing the metal material from the laminated board to which the heat-sealable laminated material and the aforementioned metal material are bonded, heating at 150 ° C for 30 minutes, and then returning to the room temperature of the laminated board. The absolute value of the dimensional change rate can be less than 0.10% in both the MD direction and the TD direction. In the manufacturing method of the laminated board of the present invention, the maximum height (Rmax) of the surface roughness of the aforementioned metal box can be i5 // m Below, the ten-point average roughness (Rz) may be 10 / zm or less, and the centerline average roughness (Ra) may be 2 // m or less. The heating and press-forming apparatus of the present invention includes a heat-sealable material. A plurality of laminated materials are laminated under pressure and heated to form laminated layers. It is intended that the metal rollers are provided with one or a plurality of metal rollers, and the metal rollers are laminated by heating and pressing the plurality of laminated materials at a temperature of 200 ° C or more. The heating and pressure forming device of the present invention, A protective material is disposed between a plurality of laminated materials including a heat-sealable laminated material and a pressing surface of the heating and press forming device and the plurality of laminated materials. It can be removed from the plurality of laminated materials after being combined), and heated and pressurized to be laminated to obtain a laminated board; its purpose is to have a conveying mechanism 'for conveying the protective material; a guide mechanism which is peeling off the The position of the protective material is close to the delta protective material (the plurality of laminated materials that are closely adhered to each other), and guides the protective material; and a pull-out mechanism is used to pull the protective material out. In the invention of the heating and pressure forming device, the aforementioned metal roller straight 13 (Please read the precautions on the back before filling this page) #. -The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 χ 297 mm) 1223577 V. Description of the invention (u) The diameter can be 200 mm or more. In the heating and press forming device of the present invention, the roundness of the aforementioned metal roller can be less than or equal to 0.05 mm, and Cylindrical degree can be 0.05 or less, and surface roughness can be 0.01 mm or less. In the heating and press forming apparatus of the present invention, the temperature difference of the aforementioned metal lepton surface in the axial direction can be ± 10 ° C or less. In the heating and press forming device of the present invention, the surface hardness of the aforementioned metal lepton may be Hs50 or more. [Simplified description of the drawings] Figures 1 (a) and (b) are used to explain the manufacturing method of the laminated board of the present invention What is shown is a schematic side view of the heating and press forming device used in the present invention. FIG. 2 is a diagram illustrating the manufacturing method of the laminated board of the present invention, and another heating and press forming used in the present invention. Schematic side view of the device. Figures 3 (a) and (b) are schematic side views illustrating the contact state between the metal roller of the heating and press forming device and the protective material in the method for manufacturing a laminated board of the present invention. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 4 is a schematic side view of a heating and pressure forming device for a laminated plate using a plurality of pairs of metal rollers according to the present invention. Fig. 5 is a schematic side view for explaining a heating and press-forming apparatus for a laminated plate using metal particles according to the present invention. [The best form for implementing the invention] The present inventor has found that a plurality of 14 laminated paper materials containing heat-sealability are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1223577 A7 Ministry of Economic Affairs Manufacturing of laminated materials (such as thermoplastic polyimide and copper foil) printed by the Intellectual Property Bureau's Consumer Cooperatives for manufacturing laminated sheets that are heated and pressed to open at a temperature of 200 C In the method, when the right dagger is bonded, a protective material is added to the outer side of the laminated material to perform the bonding. Even if the thermoplastic polyimide after the bonding has a tendency to shrink, the protective material on the outer side of the copper box can suppress the surface. The movement in the direction restricts the action of the thermoplastic polyimide, and wrinkles do not appear on the laminated board after lamination. The invention described below has been completed. Furthermore, in a method for manufacturing a laminated board obtained by laminating a plurality of laminated materials (for example, thermoplastic polyimide and copper foil) containing a heat-sealable laminated material having heat resistance, such as a thermoplastic polyimide and a copper foil, in a method for manufacturing a laminated board In the past, the laminating method using a conventional rubber roller was required to use a high heating temperature exceeding the heat-resistant temperature of the rubber roller. Due to the deterioration of the rubber roller due to heat, uniform bonding cannot be performed. In view of this, it is necessary to use one or plural pairs. Method and device for manufacturing heat-resistant laminated board of metal roller. First, the cause of poor appearance such as wrinkles will be explained in detail. For example, when a copper foil and a thermoplastic polyimide are bonded by a hot roll laminator, the copper foil and the thermoplastic polyimide are affixed by being heated and pressed between the pressure rollers of the hot roll laminator. However, at the time of thermal lamination, the materials of each layer are under thermal expansion. Because the linear expansion coefficient of general thermoplastic polyimide is greater than the linear expansion coefficient of copper foil, the thermoplastic polyimide will In the state where the copper foil extends much in the plane direction, it is thermally laminated with the copper foil. On the contrary, the thermoplastic polyimide will shrink much more in the plane direction than the copper foil during cooling. Therefore, the produced laminated board will wrinkle in the face direction. In addition, it is generally considered that even if the pressure is released immediately after the end of heating and pressurization, ”15 paper sizes are subject to the Chinese National Standard (CNS) A4 specification (210 x 297 public love).
頁 I 訂 線 馨 1223577 A7 B7 五、發明說明（) 於經加熱加壓之材料尙保持於熱狀態下，而該溫度較熱可 塑性聚醯亞胺之Tg來得高，所以可塑性聚醯亞胺處於流 動狀態，乃無法抑制皺摺的發生，此亦爲原因之一。 爲解決這方面的問題，於本發明之態樣中，將含有熱 熔接性之被積層材料的複數之被積層材料以加熱裝釐貼合 來製造積層板時，係於加熱加壓成形裝置之加壓面與複數 之被積層材料之間配置保護材料，進行加熱加壓，讓受加 熱加壓而貼合之被積層材料與略爲密接其上之保護材料冷 卻後，自該貼合之被積層材料上剝離保護材料。此處所說 的被積層材料，意指在最後會與積層板一體化之薄膜般的 片狀或板狀之材料，所謂的熱熔接性之被積層材料，意指 具有藉受熱熔融來接者被積層材料彼此之機能的被積層材 料。又，保護材料並非構成積層板的材料。 藉此，於製造具有耐熱性之積層板的過程中，即使熱 熔接性之被積層材料的熔點高，需要20(TC以上的加熱加 壓，仍可製造出不具皺摺或板彎的積層板。 圖l(a)，(b)中顯示依據本發明之積層板之製造中所採之 加熱加壓成形裝置的一例與加工的態樣。於圖l(a)，(b)中， 加熱加壓成形裝置10具有加熱加壓輥子之一對之金屬輥子 4。對金屬輥子4，係供給被積層材料之接著薄膜2、以及 自兩側挾持該接著薄膜2之同爲被積層材料的銅箔1。被 積層材料以及保護薄膜3係受到金屬輥子4加熱加壓，接 著薄膜2與銅箔1在貼合接著之後，乃將保護薄膜3剝離 ，製造出接著薄膜2與銅箔1貼合所成之積層板6，然後 16 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) #· 訂· 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（/f ) 捲成捲繞體7。 又，於金屬輥子4之下游設有剝離輔助輥子（引導機構 )8，藉加熱加壓所貼合之被積層材料與略爲密接其上之保 護薄膜3在通過此金屬輥子4與剝離輔助輥子(引導機構)8 之間的時候，會自然冷卻或受到強制冷卻，而自接近保護 薄膜3之用以引導保護薄膜3的剝離輔助輥子(引導機構)8 排出之時，保護薄膜3會被剝離。強制冷卻可藉由吹附冷 風或是與低溫的物體接觸等之手段來進行。 剝離輔助輥子8係用以於定位將保護薄膜3般保護材 料剝離之一引導機構，亦可爲一旦與保護材料接觸便動作 的被動輥子。亦可爲積極旋轉之輥子。亦可爲已固定之輥 子。只要可引導保護材料，亦可配置截面呈非圓形之棒狀 或板狀的構件作爲引導機構。 本發明之另一態樣，係使用具有一對之無端鋼帶的雙 帶式壓機。雙帶式壓機例如可爲圖2所示之構成。於圖2 中，雙帶式壓機20具備一對之無端鋼帶22。對於無端鋼 帶22，是供給被積層材料之接著薄膜2、以及自兩側挾持 該接著薄膜2之同爲被積層材料的銅箱1。被積層材料以 及保護薄膜3係由無端鋼帶所加熱加壓，於接著薄膜2與 銅箔1貼合接著之後，保護薄膜3會被剝離，製造出接著 薄膜2與銅箔1貼合在一起所得之積層板6，然後捲成捲 繞體7。於個別之無端鋼帶22上，設置有用以加熱、引導 無端鋼帶22的加熱引導件26。於加熱引導件26的下游設 有用以冷卻、引導無端鋼帶22的冷卻引導件28。加熱引 17 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ^ (請先閱讀背面之注意事項再填寫本頁) 訂· 丨線· 1223577 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（A ) 保護材料進行加熱加壓成形之方法。惟，任一者皆是用以 製造熱硬化性型之積層板，且加熱加壓成形溫度幾乎都在 200°C以下此種低溫的情形，本來就不容易發生皺摺等之外 觀不佳的情形，其目的並非達成本發明之效果一防止皺瘤 發生，而是在於防止金屬箔表面出現刮傷或打痕、或是防 止熱積層後之硬化爐發生積層板的板彎。或是在因爲有樹 脂積留之欠缺平滑性的樹脂含浸紙、樹脂含浸玻璃布等阻 礙到平順的積層加工等問題發生時，有時要用到保護材料 :此與本發明之目的大異其趣。 從而，於本發明中，若保護材料在加熱時未保持在一 定程度之硬度，將無法扮演作爲保護材料的功用，是以在 貼合時之溫度的拉伸彈性率保持在490N/mm2以上乃爲所 希望的。 若此拉伸彈性率未滿490N/mm2，受到加熱加壓之壓 力的影響’有時於保護材料會發生皺摺。又，保護材料之 線膨脹係數以100PPm/°C以下爲佳。若線膨脹係數超過 100ppm/°C，受到積層加工時之加熱一冷卻的循環之影響， 由於保護材料之尺寸的變化較被積層材料爲大，所以會導 致於積層加工後在被積層材料之表面出現皺摺之不良情況 〇 保護材料，只要可滿足限制積層時之被積層物的收縮 行爲、防止製品之皺摺等之外觀不佳的發生這些目的即可 ’可爲任何材料。其中，保護材料必須能承受加工時之溫 度，例如’在250°C加工之時，以具有250°C以上之耐熱性 19 本紙張尺度適用中國國冢標準（CNS)A4規格（210 X 297公釐) 請先閱讀背面之注意事項再填寫本頁) #· 丨線· ·! 1^3577 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（㈧） 的聚醯亞胺薄膜爲佳，在300艽加工之時，以具有3〇(TC以 上之耐熱性的聚醯亞胺薄膜爲佳。又，雖可嘗試使用例如 聚苯碾來作爲保護材料，在加熱加壓之溫度爲300。(:時， 保護材料會延伸’無法加工。又，使用一般市售之聚醯亞 胺薄膜作爲保護材料時，爲抑制積層加工後之積層板的皺 摺形成’保護材料之厚度以50/izm以上爲佳。若保護材料 之厚度達75#m以上，則皺摺的形成可幾乎完全被抑制， 此乃更佳之情形。 加熱加壓被積層材料之際，由於保護材料在配置完成 之狀態時必須達到既定之溫度，故在加熱加壓被積層材料 之則，先將保護材料預加熱乃爲所希望的。爲減輕出現於 保護材料上之因加熱所造成的膨脹皺摺，故將保護材料之 預加熱溫度設定成筒於加熱加壓時之溫度較佳。又，保護 材料之加熱，例如若使用以加熱輥子或帶子爲構成要素之 一的加熱加壓成形裝置、具體上使用熱輥積層機以及雙帶 壓機之時，藉由讓保護材料以覆蓋於前述加熱輥子或帶子 之一部分的形式來接觸，可進行預熱的動作。此時，保護 材料接觸於前述熱輥或帶子的時間，以1秒爲佳、1〇秒以 上更佳、15秒以上最佳。配合此接觸時間，選擇適宜的輥 子直徑，例如，藉由將保護材料纏繞在加熱輥子之一部分 、1M周以±、I/2周以上的距||，可進行保護材料之^^熱 。藉此，在貼合被積層材料之前的時點，保護材料已具既 定之溫度，而可在保護材料沒有膨脹皴摺的狀態下貼雜 積層材料彼此’ ί/fc而可製作出沒有敏摺的積層板。圖3⑷ 20 (請先閱讀背面之注意事項再填寫本頁) #- 訂： •線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） 1^3577 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（) 顯不保護材料(保護薄膜3)纏繞在加熱加壓輥子4之IQ周 上的態樣。圖3(b)顯示保護材料(保護薄膜3)纏繞在加熱加 壓聿比子之金屬輥子4之1/4周上的態樣。加熱加壓剛結束 後’保護材料與藉由加熱加壓貼合之被積層材料(也就是積 層板)會略爲密接在一起。將該積層板與上下保護材料剝離 之k ’右使得被剝離之保護材料前進之側通路爲上下不對 稱的情況’則上下保護材料之一會先被剝離，在剝離剩餘 的保護材料與積層板之時，由於保護材料與積層板輕微地 密接著’於是積層板會一邊被拉向保護材料之側一邊進行 剝離’結果積層板會捲起來。爲防止此情形，於剝離上下 保護材料之際，以積層板爲對稱面，讓上下保護材料的剝 離角度相等乃爲所希望的。 圖1中上下保護材料之剝離角度分別以來表示 。剝離角度係保護材料之保護薄膜3與積層板6所成的角 度。圖1(a)所示係α1，α2皆爲銳角的情形，圖1(b)所示係 α1，α2皆爲直角的情形。雖上述情況皆可進行安定的加工 ’惟上下之剝離角度的差在|αΐ 一 爲3〇度以內較佳， 又以1〇度以內爲更佳。 於剝離保護材料之際，若被加工物的溫度過高，將難 以剝離保護材料，若以過大的力量來剝離則積層板有捲起 之情事，故剝離保護材料之際的積層板溫度，在將熱可塑 性樹脂當作被積層材料或被積層材料之構成要素之一來使 用之時，以該熱可塑性樹脂之TG以下的溫度爲佳。較佳 係較Tg低超過5〇°C、更佳係較Tg低超過1〇〇。(：。最佳的 21 (請先閱讀背面之注意事項再填寫本頁) #· · -丨線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 1223577 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（i?) 情形是在冷卻到室溫的時刻再將保護材料自積層板剝離。 是以，如前述圖1之態樣之加熱加壓成形裝置10所示 般，於金屬輥子4之下游設置剝離輔助輥子8，在金屬輥 子4與剝離輔助輥子8之間冷卻被加工物乃爲所希望的。 2本發明中，可重複使用前述保護材料。於熱輥積層 機之則後原本就設有被積層材料之輸送•捲繞裝置，藉由 倂設保護材料用之輸送•捲繞裝置，則以捲繞裝置來捲繞 使用過X之保護材料，再度設置於輸送側，藉此，可再 利用保護材料。於捲繞之際，設置端部位置檢測裝置與捲 繞裝置修正裝置，來高精度地對齊保護材料的端部進行捲 繞亦無妨。 另一方面，對於以加熱加壓成形裝置貼合之前之熱熔 接性之被積層材料所作用之張力，較佳係可讓該熱熔接性 之被積層材料能安定地前進。具體而言，例如，使用一於 非熱可塑性聚醯亞胺薄膜之兩面具有玻璃移轉溫度19〇〇c 之熱可塑丨生聚醯亞胺樹脂成分之厚度25^m的3層構造之 接著薄膜（鐘淵化學工業股份有限公司製造ριχΕ〇 Bp)作 爲熱熔接性之被積層材料，利用與圖i(a)所示之裝置爲同 樣的加熱加壓成形裝置，在溫度3〇〇°c、線壓490N/cm、 加工速度2m/min的條件下，讓厚度18//m之軋製銅箔以 及位於該軋製銅箔兩側之作爲保護材料的聚醯亞胺薄膜(鐘 淵化學工業股份有限公司製造何皮卡爾125AH)成形於被 積層材料之兩側，製作出耐熱性軟性積層板，若當時熱熔 接性之被積層材料的薄膜張力爲〇.5N/mm2、銅箔的張力爲 22 本紙張尺度適用中國國豕標準（CNS)A4規格（21〇 X 297公爱） --------------------訂----------線--AVI (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1^23577 A7 五、發明說明（/ ) 10 N/mm的情形下，尺寸變化率將非常地小㈠.G37%(_ 、0·〇34% (TD))。此處之尺寸變化率係相對於貼合有該熱 熔接性之浦腿’賴材料時，軸_等自該積層 板的前面鎌顏材簡丨啊纏3G賴，接著回到室 溫後之積層板的尺寸變化率。 在同樣的條件下，將熱溶接性之被積層材料的張力定 爲〇.麵腿2、銅箱的張力定爲5 N/mm2 _形下，將無 法製作出雖狀的難，崎㈣了歪曲狀的薄膜，是以 考慮到除了行駭定祕，妓將尺寸變神翻很低， 故將熱熔接性之被積層材料_力調整爲N/mm2 的範圍爲佳H屬材料的張力職熱熔難之被積層 材料的張力的3倍以上爲佳。 藉由將熱熔接丨生之被積層材料的張力、金屬材料之張 力的條件設定如上，可得歌寸變化率小_層板。亦即 ，對於由该熱熔接性之被積層材料與金屬材料貼合所成的 積層板，以前述蝕刻等來去除金屬材料、在l5(rc加熱3〇 分鐘後之積層板之，尺寸變化率的絕對値在MD方向與TD 方向皆可達0.1%以下。 〃 本發明之熱熔接性之被積層材料係作爲接著薄膜來使 用。作爲本發明之熱熔接性之被積層材料，可舉出具熱溶 接性之樹脂所構成的單層薄膜、在不具熱熔接性之層 之兩側形成具有熱熔接性之樹脂層所得之複數層薄^、於 紙，玻璃.布等之基材中含浸具有熱熔接性之樹脂所:得之片體 等，不過由於使用玻璃布等之剛性高的基材會造成彎曲性 23 ϋ HI n —ϋ .^1 I ϋ n n ·ϋ l_i ϋ I ϋ ϋ 1 H 11 1^— ·_ϋ 一口，· n n ·ϋ ϋ ϋ —ft ·ϋ I 1 *1 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 1223577 A7 B7 五、發明說明（>1 ) 變差，所以使用具熱熔接性之樹脂所構成的單層薄膜、在 不具熱熔接性之核心層之兩側形成具有熱熔接性之樹脂層 所得之複數層薄膜來作爲軟性積層板用之物爲佳。作爲具 熱熔接性之樹脂所構成的單層薄膜、在不具熱熔接性之核 心層之兩側形成具有熱熔接性之樹脂層所得之複數層薄膜 ，以具有耐熱性爲佳，可適宜地使用例如接著成分爲熱可 塑性聚醯胺醯亞胺、熱可塑性聚醚醯亞胺、熱可塑性聚酯 醯亞胺等來得到。在接著成分中含有50%以上該等耐熱性 之熱可塑性樹脂所得之熱熔接性之被積層材料亦適於作爲 本發明之接著薄膜。尤其，使用配合有環氧樹脂或丙烯酸 樹脂般之熱硬化性樹脂等之接著薄膜也爲所希望的。爲提 昇各種特性，於接著薄膜中配合各種之添加劑亦無妨。 在接著薄膜的構成上，只要是在外側具有耐熱性之接 著層之物即可，即使僅由熱熔接性之接著成分所得之單層 構成亦無妨，不過從尺寸安定性的觀點來看，在不具熱熔 接性之核心層之兩側以密接狀態配置熱熔接性之接著層之 構成的3層構造薄膜較佳。 在接著薄膜的製造方法上並無特別的限定，若爲由接 著劑層單層所形成時，可藉由帶鑄法、擠製法等來製膜。 又，若接著薄膜之構成爲接著層/不具熱熔接性之核心層/ 接著層此種3層所形成的情況，則有：於耐熱性薄膜之兩 面，將接著劑以一次一面或兩面同時的方式塗佈其上來製 作3層之接著薄膜的方法；以及於耐熱性薄膜的兩面，配 置由接著成分所構成之單層的接著薄膜進行貼合來製作3 24 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） (請先閱讀背面之注意事項再填寫本頁) 言，· Γ 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（θ) {請先閱讀背面之注意事項再填寫本頁} 層之接著薄膜的方法。關於塗佈接著劑來製作3層之接著 薄膜的方法’尤其是使用到聚醯亞胺系之接著劑時，有： 在聚醯胺酸的狀態下塗佈，接著一邊乾燥一邊進行醯亞胺 化的方法；以及直接塗佈可溶性聚醯亞胺樹脂使其乾燥的 方法’有關接著劑層之形成方法並無特別的限定。其他， 也有將接著層/不具熱熔接性之核心層/接著層之分別的樹 脂共擠壓，以一次的方式來製作耐熱性接著薄膜的方法。 再者，就本發明所使用之熱熔接性之被積層材料而言 ’若考慮到於基板上組裝1C、電阻器、電容器等零件，到 達熔焊製程時，不會因熱造成基板的剝離，則玻璃移轉溫 度在170°C以上之耐熱性接著材料會更好。 作爲本發明之複數的被積層材料中之一，可使用形成 導電層之金屬材料、其中又以使用金屬箔爲佳。 丨線 關於金屬箔，可舉出銅及銅合金、不鏽鋼及其合金、 鎳及鎳合金(包含42合金）、銘及銘合金等。較佳爲銅及銅 合金’若考慮到耐熱性軟性基板的彎曲性，則以厚度5〇Y m以下的銅箔爲佳。在銅箔的種類上有軋製銅箔、電解銅 范、THE銅箔等，並無特別的限制，於該等銅箱之表面形 經濟部智慧財產局員工消費合作社印製 成接著劑、防鏽層，耐熱層(例如鉻、鋅、鎳等之鍍敷處理) 等亦無妨。 尤其，相較於厚度達35//m以上的銅箔，35/Zm以下 的銅箔沒有kosi，於熱積層之際不會出現皺摺，是以35# m以下的銅箔在本發明中可發揮顯著的效果。 熱熔接性之被積層材料與接合面之金屬材料^ 25 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1223577 經濟部智慧財產局員工消費合作社印制衣 A7 B7 五、發明說明（β) 糙度影響積層板之性能甚巨。在本發明中，係選用熱溶接 性之被積層材料與接合側之金屬材料的表面粗糙度的最大 高度(Rmax)爲l5/zm以下、十點平均粗糙度(叫爲 以下、且中心線平均粗糙度(Ra)爲以下之金屬材料。 於本說明書中，Rmax ' Rz、Ra係依據JIS b〇6〇1所測定之 値。若表面粗糙度大，則有在熱熔接性之被積層材料與金 屬材料之層間容易生成空洞的傾向。 關方< 加熱加壓成形裝置’只要可對被積層材料加熱、 施加壓力之加熱加壓裝置即可，並無特別的限定，可舉出 例如單動壓機裝置、多段壓機裝置、真空壓機裝置、多段 真空壓機裝置、熱壓機裝置、熱輥積層機、雙帶式壓機等 ，當中’熱輥積層機、雙帶式壓機因可高效率地連續生產 ’又可得到安定品質的積層板，故尤爲適宜使用。若將作 爲被積層材料、保護材料之捲爲輥狀的長條片狀物與上述 裝置組合使用’將可更有效率地連續製造積層板，這關係 到生產性的提昇。尤其，若熱輥積層機、或是雙帶式壓機 與捲爲輥狀的長條片狀物組合使用，最能有效率地連續製 造積層板。 $ 關於加熱方法，只要可在既定的溫度下進行加熱即可 ，並無特別的限定，可舉出熱媒循環方式、熱風加熱方式 、感應加熱方式等。加熱溫度以200°C以上爲佳，若係供 給於進行電子零件組裝而通過環境氣氛溫度溶焊 爐的用途時，爲使用具有相對應之Tg之熱熔接片，進行 24〇°C以上之加熱爲佳。加壓方式只要可施加既定之焊力即 26 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂----------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（vf ) 可並無特別的限定，可舉出油壓方式、空氣壓方式、間隙 間壓力方式等。 又，於本發明中，使用一對或複數對之金屬輥的態樣 ，以雙帶式壓機加工時並不會因爲帶子之接合部而產生加 壓不均，又，裝置成本、維修成本亦較雙帶式壓機來得少 Ο 若不使用成對之金屬輥子，改用金屬一橡膠輥子，則 如前述般，有橡膠之耐熱性不足的問題。例如，即使嘗試 對於在非熱可塑性聚醯亞胺薄膜之兩面配置著玻璃移轉溫 度190°C之熱可塑性聚醯亞胺所得的耐熱性接著薄膜與軋 製銅箔，使用由金屬一橡膠輥子（金屬輥子：輥子直徑 300mm，正圓度0.002，圓筒度0.002mm，表面粗糙度 0.001mm，300°C之溫度分布精度±2°C)所構成之加熱加壓 成形裝置，在溫度300 °C、線壓490N/Cm、加工速度 2m/min的條件下進行積層加工，但由於橡膠輥子會受熱變 質，乃無法進行積層的動作。 以下就使用金屬輥子之態樣詳細地說明。於本發明之 使用金屬輥子的態樣中，係使用圖l(a)，(b)所示之加熱加壓 成形裝置10。藉由此加熱加壓成形裝置10，包含熱熔接性 之被積層材料（具耐熱性）的複數之被積層材料，進行例如 熱可塑性聚醯亞胺與銅箔的貼合。於圖1中，加熱加壓成 形裝置10具備用以加熱加壓的一對之金屬輥子4，該一對 之金屬輥子4係被供給耐熱性之接著薄膜般的接著薄膜2 、以及挾持著該接著薄膜2的銅范1。接著薄膜2跑銅箱i 27 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------I ------1 ^--------——^wi (請先閱讀背面之注意事項再填寫本頁) 1223577 A7 ___ B7___ 五、發明說明（) 受加熱加壓而積層成爲積層板6，然後被捲繞。 (請先閱讀背面之注意事項再填寫本頁) 加熱加壓成形裝置亦可爲圖4所示之態樣。圖4之加 熱加壓成形裝置l〇a具備複數對之金屬輥子4a，這些成對 的金屬輥子係串聯配置於薄膜的行進方向上，接著薄膜 2與挾持著該接著薄膜2的銅箔1係通過依序排列之成對 的金屬輥子4a，受到加熱加壓成形加工。於圖4中，成對 之金屬輥子4a當中之至少一對，例如位於圖式中最左邊之 金屬輥子對係定爲加熱加壓輥子。 金屬輥子之輥子直徑以200mm以上爲佳，若直徑小於 200mm，由於加熱加壓時壓力係急驟地施加到被積層材料 上，會造成積層後之外觀不佳。 經濟部智慧財產局員工消費合作社印製 使用圖4(或圖1)中所示之金屬輥子之加熱加壓成形裝 置中，爲對被加工物施加寬方向上均一的壓力，故金屬輥 子的外觀尺寸方面，正圓度在〇.〇5mm以下、圓筒度在 0.05mm以下、表面粗糙度在0·〇1ιηιη以下乃爲所希望的。 若上下兩個金屬輥子有超過上述規定之尺寸誤差，則於輥 子間會出現上下合計0.1mm的間隙，當被積層材料的厚度 在0.1mm以下時，會存在受到加壓的部分與未受到加壓的 部分，而有難以均一地加壓樣品的傾向。又，若表面粗糙 度大於0.01mm，則輥子表面會出現凹凸，從而有難以均一 地加壓的傾向。 再者，爲了對於寬方向施加均一的壓力、且施加均一 的溫度，金屬輥子面在軸方向之溫差在±l〇°C以下爲佳。 當金屬輥子之中央部與端部間出現1〇。(：以上的溫差，則樣 28 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（以） 品之寬方向在加壓時會出現溫度不均’且因爲溫差造成金 屬輥子之膨脹率的不同將使得中央部與端部的輥子直徑不 同，也就是會出現所謂的溫度突起(crown)。由於此溫度突 起每1°C會伴隨產生約3//m的輥子之熱變形，若達1(rC的 溫差則爲30/zm，上下合計就成爲60//m左右的間隙。從 而，若於金屬輥子面之軸方向出現l〇°C以上之溫差，有無 法對樣品施加均一壓力的傾向。 金屬輥子表面之肯氏表面硬度Hs必須在50以上。若 硬度低於50，由於加壓輥子上下皆爲金屬輥子之故，或於 加壓中金屬屑等成爲輥子表面之附著物，或被積層材料之 彎曲造成急驟的高度差，皆會造成輥子表面的損傷。是以 ，基於達成對金屬輥子賦予耐磨損性、非黏著性、非熱性 等特性的目的，對金屬素材施以鍍鉻乃爲所希望的。藉由 施行此工業用鍍鉻，金屬素材的硬度Hs可由20〜30提升 到50以上。鍍敷的厚度若少於〇.〇5mm，則長時間在高溫 下使用，會在表面之鍍敷中出現龜裂，是以厚度以0.05mm 以上爲佳。 再者，於加熱加壓之際在金屬輥子之軸方向所發生之 間隙的差異，會成爲軸方向之加壓力的差異，惟本發明之 加熱加壓成形裝置中，因利用保護材料挾持被積層材料來 加熱加壓之故，所以在金屬輥子之軸方向所發生之間隙的 差異會藉由保護材料之變形所吸收，可對被積層材料施以 均一地加壓。若保護材料的厚度超過50/zm，被積層材料 即可受到均一地加熱加壓，而受到均一地接著。是以，本 29 本紙張尺度適用中國國家標準（CNS)A4規袼（210 X 297公爱) I an n i-ϋ an I i emmi Bn 1 n I n n n 1 n n 1 、4 flu ϋ ϋ n n ip— ϋ-1 I I _ 1 ^ Mmn (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1223577 A7 -----— __一 —_ 五、發明說明（>Ί ) 發明之加熱加壓成形裝置以圖5所示之讎爲佳。於圖$ 中，加熱加壓成形裝® 10b係具備··將保護材半斗 熱加壓用錢輥子4之輸麵構η、在既定的位置將保笔 24、將剝離之麵簡3拉出之拉出讎26。被積層材料 5係由接著薄膜2與雜丨所構成。此處輸送機構22雖爲 裝設於保護材料3之捲繞體33之中心部的旋轉輕子23， 但只要具有送出保護材料3之機能，並不侷限於圖式中所 舉之物。又，拉出機構26雖爲將剝離之保護材料3拉出以 捲繞體34的形式捲繞於旋轉輥27之物，但只要具有拉出 保護材料3之機能，亦不侷限於圖式中所舉之物。引導機 構24係由剝離輔助輥子8所構成。剝離輔助輥子8係用以 在既定位置將保護材料3等之保護材料剝離之一種引導用 的引導機構’其亦可爲隨著與保護材料相接觸而動作之被 動輥子。也可爲積極旋轉輥子。也可爲已固定之輥子。只 要可引導保護材料，引導機構24亦可爲截面呈非圓形之棒 狀或板狀的構件。 又，於加熱加壓用之金屬輥子4上纏繞或塗佈與保護 材料爲相同材料之樹脂使其接著其上的態樣，在加壓之均 一化上也同樣有效，不過在使用的途中接著會脫落，有不 堪長期使用的問題。又，所纏繞之保護材料會反覆地在同 一個地方受到高溫加熱、且受到加壓之故，有材質惡化加 速的問題。於本發明中，由於使用長條之保護材料，即使 在使用過該長條之保護材料之後再次使用，同一部份受到 30 --------------------訂---------線—AWI (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） 1223577 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（β) 加熱加壓的次數，相較於在上述之金屬輥子中纏繞著與保 護材料爲相同材料的樹脂來進行接著的態樣，有顯著地減 少，乃可進行持續地生產。 由本發明所得之積層板，係將含有熱熔接性之被積層 材料的複數之積層材料貼合所得者，主要是作爲電子•電 氣用積層板所使用之耐熱性軟性基板。 實施例 以下’藉實施例來具體地說明本發明，惟該等實施例 僅係用以說明本發明，本發明並不因而受限於此。 於實施例中所提到的玻璃移轉溫度(Tg)係藉由島津製 作所DSC CELL SCC-41(差示掃描熱量計），在氮氣氣留下 ，以升溫速度l〇°C/分鐘，測定自室溫到400°C的溫度範圍 〇 (實施例1) 於Tgl90°C之25/zm的熱可塑性聚醯亞胺薄膜(鐘淵化 學工業股份有限公司製造ΡΙΧΕΟ TP-T)之兩側配置厚度18 之電解銅箔作爲被積層材料，進一步於該被積層材料 之兩側配置125//m之聚醯亞胺薄膜(鐘淵化學工業股份有 限公司製造阿皮卡爾125AH)作爲保護薄膜，藉圖3(b)所 示之加熱加壓成形裝置1〇(溫度260°C、加工速度〇.5m/min 、線壓980N/cm)加熱加壓，接著讓加熱加壓所貼合之被積 層材料與略爲密接其上之保護薄膜冷卻至室溫後，剝離保 護薄膜，製作出軟性積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性 31 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐） ~ -------------Φ-------tr---------f 舞 (請先閱讀背面之注意事項再填寫本頁) 1223577 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（J) 積層板。 (實施例2) 除了取代實施例1之電解銅箔，改爲配置較易發生皺 摺等之厚度l8/zm的軋製銅箔以外，其餘與實施例1同樣 的條件來製作軟性積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性 積層板。 (實施例3) 除了取代實施例1所使用之加熱加壓成形裝置，改用 雙帶式壓機（溫度30(TC、加工速度0.5m/min、線壓 980N/Cm)以外，其餘以與實施例丨同樣的條件來製作軟性 積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性 積層板。 (實施例4) 於與實施例1同樣的熱可塑性聚醯亞胺薄膜的兩側配 置與實施例2同樣的軋製銅箔，進一步於其兩側配置與實 施例1同樣的聚醯亞胺薄膜作爲保護薄膜，以雙帶式壓機( 溫度300°C、加工速度0.5m/min、線壓980N/cm)製作軟性 積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性 積層板。 (實施例5) 準備一於非熱可塑性聚醯亞胺薄膜之兩面具有玻璃移 32 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂---------線—AWI (請先閱讀背面之注意事項再填寫本頁) 1223577 A7 B7 五、發明說明（）。） (請先閱讀背面之注意事項再填寫本頁) 轉溫度190°C之熱可塑性聚醯亞胺樹脂成分所構成之厚度 25//m的3層構造之接著薄膜(鐘淵化學工業股份有限公司 製造ΡΙΧΕΟ BP)，於其兩側配置厚度之電解銅箔、 進一步於該電解銅箔之兩側配置125#m之聚醯亞胺薄膜( 鐘淵化學工業股份有限公司製造阿皮卡爾125AH)作爲保 護薄膜，藉熱輥積層機，在溫度260°C、線壓980N/cm、 加工速度〇.5m/min的條件下製作出軟性積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性 積層板。 (實施例6) 除了取代實施例5之電解銅箔，改用較該電解銅箔容 易發生皺摺之厚度18/zm的軋製銅箔以外，其餘與實施例 5同樣來製作軟性積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性 積層板。 (實施例7) 經濟部智慧財產局員工消費合作社印製 除了將熱輥積層機之溫度定爲300 °C、加工速度 2.0m/min以外，其餘與實施例5同樣來製作軟性積層板。 其結果，可得到在外觀上無鈹摺等之不佳情況的軟性積層 板。 (實施例8) 除了將熱輥積層機之溫度定爲300 °C、加工速度 2.0m/min以外，其餘與實施例6同樣來製作軟性積層板。 其結果，可得到在外觀上無皺摺等之不佳情況的軟性積層 33 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（《丨） 板。 (比較例1) 除了不使用保護薄膜，將藉由加熱加壓所貼合之被積 層材料冷卻到室溫以外，其餘與實施例1同樣來獲得軟性 積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皺摺。 (比較例2) 除了不使用保護薄膜，將藉由加熱加壓所貼合之被積 層材料冷卻到室溫以外，其餘與實施例2同樣來獲得軟性 積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皺摺。 (比較例3) 除了不使用保護薄膜，將藉由加熱加壓所貼合之被積 層材料冷卻到室溫以外，其餘與實施例5同樣來獲得軟性 積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皴摺。 (比較例4) 除了不使用保護薄膜，將藉由加熱加壓所貼合之被積 層材料冷卻到室溫以外，其餘與實施例6同樣來獲得軟性 積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 34 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） n H·· ·ϋ m ·ϋ ϋ ϋ ^^1 >1 _1 I ·_ϋ n ϋ·· tmmm i_l 1 mMM§ 1 Ν I ·ϋ MmmMe tmMmm in an n I— I al_l« 4 (請先閱讀背面之注意事項再填寫本頁) 1223577 A7 B7 五、發明說明（β) 皴摺。 (比較例5) 除了不使用保護薄膜，將藉由加熱加壓所貼合之被積 層材料冷卻到室溫以外，其餘與實施例7同樣來獲得軟性 積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皴摺。 (比較例6) 除了不使用保護薄膜，將藉由加熱加壓所貼合之被積 層材料冷卻到室溫以外，其餘與實施例8同樣來獲得軟性 積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皴摺。 (實施例9) 使用與實施例2所使用者爲同樣的熱可塑性聚醯亞胺 薄膜作爲接著薄膜，於其兩側配置厚度18^m之軋製銅箔 、進一步於軋製銅箔之兩側配置與實施例2所使用者爲同 樣的保護薄膜，使用與實施例1同樣的加熱加壓成形裝置 ，在溫度300。(：、線壓490N/cm、加工速度2m/min的條件 來加熱加壓。此時，其餘的條件係採表1所示者，製作出 耐熱性軟性積層板。其結果，可得到在外觀上無皺摺等之 不佳情況的軟性積層板。拉伸彈性率係依據JIS K713，使 用島津製作所(股份有限公司）製造：熱壓機S-100-C以橫 頭(cross head)速度(拉伸速度)200mm/min來測定。又，於 35 -------------裝--- (請先閱讀背面之注意事項再填頁) · •線· 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1223577 A7 B7 五、發明說明（y) 本說明書中，線膨脹速度係依據JIS K197，使用理學電機( 股份有限公司）製造：熱分析裝置TMA8140以升溫速度10 〇C/min來測定。 (實施例10) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)以外 ，其餘與實施例9同樣來製作軟性積層板。其結果，可得 到在外觀上無皺摺等之不佳情況的軟性積層板。 (比較例7) 除了採用在表1所示之有關比較例7之條件以外，其 餘與實施例9同樣來製作軟性積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皺摺。 (比較例8) 除了使用與實施例10所使用者爲同樣的接著薄膜以外 ，其餘與比較例7同樣來製作軟性積層板。 其結果，發生於積層加工之行進方向壓入了縱條紋之 皺摺。 --------------------訂---------^ I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1223577 A7 B7 經濟部智慧財產局員工消費合作杜印製 五、發明說明（"） [表1] 實施例--- 比較例7,8 保護材S 一~~' 聚醯亞胺薄膣 Μ j \w 初期拉伸彈性率 (N/mm2)(300〇C 下） ΤΪ76~^-- --------— 線膨脹係數(ppwt )(200〜300°C 下） 40 - 一 厚度(mm) 75 ^- — 再利用 iti~^— — 外觀 摺 ------ 有皺摺 (實施例11) 使用與實施例1 2所使用者爲同樣的熱可塑性聚醯亞胺 薄膜作爲接著薄膜，於其兩側配置厚度18//m之軋製銅箔 、進一步於軋製銅箱之兩側配置與實施例2所使用者爲同 樣的保護薄膜’使用圖1(a)所示態樣之加熱加壓成形裝置 ，在溫度300°C、線壓49〇N/cm、加工速度2m/min的條件 來加熱加壓，製作出耐熱性軟性積層板6。其結果，可得 到在外觀上無皴摺·板彎等之不佳情況的軟性積層板。 (實施例12) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)以外 ，其餘與實施例11同樣來製作耐熱性軟性積層板。 其結果，可得到在外觀上無皺摺•板彎等之不佳情況 的軟性積層板。 (實施例13) 除了使用圖1(b)所示之加熱加壓成形裝置10以外，其 餘與實施例11同樣來製作耐熱性軟性積層板。 37 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------^---------線-- (請先閱讀背面之注意事項再填寫本頁) 1223577 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（β) 其結果，可得到在外觀上無皺摺•板彎等之不佳情況 的軟性積層板。 (實施例14) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造PIXE〇 BP)以外 ，其餘與實施例13同樣來製作耐熱性軟性積層板。 其結果，可得到在外觀上無皴摺•板彎等之不佳情況 的軟性積層板。 (實施例15) 使用圖3(a)所示之加熱加壓成形裝置10，於Tgl9(TC 之厚度25//m的熱可塑性聚醯亞胺薄膜2(鐘淵化學工業股 份有限公司製造PIXEOBP)之兩側配置厚度18/zm之電解 銅箔1、進一步於該電解銅箔1之兩側配置聚醯亞胺薄膜( 鐘淵化學工業股份有限公司製造阿皮卡爾125AH)作爲保 護薄膜1，在溫度300 °C、線壓490N/cm、加工速度 2m/min的條件下製作出耐熱性軟性積層板6。此時之保護 材料之1保護薄膜1與加熱輥子4之接觸時間爲15秒。其 結果，可得到在外觀上無皺摺等之不佳情況的軟性積層板 〇 (實施例16) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)作爲 接著薄膜以外，其餘與實施例15同樣來製作耐熱性軟性積 層板。 38 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂---------*5^ — (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（八） 其結果，可得到在外觀上無皺摺•板彎等之不佳情況 的軟性積層板。 (實施例17) 除了使用圖3(b)所示之加熱加壓成形裝置10，讓保護 薄膜1與加熱輥子4之接觸時間爲7.5秒以外，其餘與實 施例15同樣來製作耐熱性軟性積層板6。 其結果，可得到在外觀上無皴摺•板彎等之不佳情況 的軟性積層板。 (實施例18) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)以外 ，其餘與實施例17同樣來製作軟性積層板。 其結果，可得到在外觀上無皺摺•板彎等之不佳情況 的軟性積層板。 於以下之實施例19〜21所表示之銅箔之表面粗糙度的 最大高度(Rmax)、十點平均粗糙度(Rz)、中心線平均粗糙 度(Ra)係依據JIS B0601之定義，自目錄値中擇選。又，微 空洞面積比例，係將100mm四方之試料的積層板之銅箔以 氯化亞鐵溶液進行全面的蝕刻後，以光學顯微鏡(NIKON( 股份有限公司）製造OPTIPHOTO ; 100倍)來觀察，求出未 接著部分與所觀察到的部分的面積，以面積比例所表示之 値。 (實施例19〜21) 使用Tgl90°C之25/zm的熱可塑性聚醯亞胺薄膜(鐘淵 39 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂---------線—ΜνΊ (請先閱讀背面之注意事項再填寫本頁) 1223577 A7 五、發明說明（）7 ) 化學工業股份有限公司製造ΡΙΧΕΟ TP-T)作爲接著薄膜， 於其兩側配置厚度18^m之銅箔，進一步於該銅箔之兩側 配置聚醯亞胺薄膜(鐘淵化學工業股份有限公司製造阿皮 卡爾)作爲保護薄膜，使用圖3(b)所示之加熱加壓成形裝置 1〇，以溫度300°C、線壓490N/cm、加工速度2m/min的條 件積層，製作出積層板。詳細條件如表2所示。其結果， 並未觀察到10〜50//m左右之空洞，微空洞率爲〇%，又並 未觀察到因焊料耐熱試驗造成銅箔表面的膨脹。又，焊料 耐熱試驗係以下面的方式來進行。亦即，將依據JIS C6471Page I Thread 1223577 A7 B7 V. Description of the invention () The material under heat and pressure is kept in a hot state, and the temperature is higher than the Tg of the thermoplastic polyimide, so the plastic polyimide is in The flow state cannot suppress the occurrence of wrinkles, which is one of the reasons. In order to solve this problem, in the aspect of the present invention, when a plurality of laminated materials containing a heat-sealable laminated material are laminated by heating and laminating, the laminated plate is heated and press-molded. A protective material is arranged between the pressing surface and the plurality of laminated materials, and heating and pressing are performed to cool the laminated material and the protective material which are closely adhered to each other after cooling and pressing. The protective material is peeled off from the laminated material. The laminated material referred to here means a sheet-like or sheet-like material that will be integrated with the laminated board at the end. The so-called heat-bondable laminated material means that it has a thermally fused material. Laminated materials that function as layers. The protective material is not a material constituting the laminated board. With this, in the process of manufacturing a heat-resistant laminated board, even if the heat-sealable laminated material has a high melting point, heating and pressure of 20 ° C or more is required to produce a laminated board without wrinkles or plate bends. Figs. 1 (a) and (b) show an example of the heating and press forming device used in the manufacture of the laminated board according to the present invention and the processing state. In Figs. 1 (a) and (b), the heating The press forming apparatus 10 includes a pair of metal rollers 4 which are one of the heating and pressing rollers. The metal roller 4 is provided with an adhesive film 2 of the laminated material, and copper, which is the laminated material, holds the adhesive film 2 from both sides. Foil 1. The laminated material and the protective film 3 are heated and pressurized by the metal roller 4. After the film 2 and the copper foil 1 are bonded together, the protective film 3 is peeled off, and the adhesive film 2 and the copper foil 1 are laminated. The resulting laminated board 6 and then 16 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) # · Order · Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Employee Consumer Cooperative 1223577 A7 B7 Printed by the employee's consumer cooperative of the Property Bureau V. Description of the invention (/ f) Rolled into a wound body 7. In addition, a peeling auxiliary roller (guide mechanism) 8 is provided downstream of the metal roller 4, and the quilt attached by heating and pressing When the laminated material and the protective film 3 which is slightly close to it pass between the metal roller 4 and the peeling auxiliary roller (guide mechanism) 8, they will be naturally cooled or forcedly cooled, and they will approach the protective film 3 to guide them. When the peeling auxiliary roller (guide mechanism) 8 of the protective film 3 is discharged, the protective film 3 is peeled off. Forced cooling can be performed by blowing cold air or contacting a low-temperature object. The peeling auxiliary roller 8 is used for A guide mechanism for positioning to peel off the protective material like the protective film 3. It can also be a passive roller that moves once it comes into contact with the protective material. It can also be a actively rotating roller. It can also be a fixed roller. As long as it can guide the protection As a guide mechanism, a non-circular rod-shaped or plate-shaped member may be arranged as a material. In another aspect of the present invention, a double-belt press having a pair of endless steel strips is used. The double-belt press may be configured as shown in Fig. 2. In Fig. 2, the double-belt press 20 is provided with a pair of endless steel strips 22. The endless steel strip 22 is an adhesive film 2 for supplying a laminated material. And the copper box 1 which is the laminated material holding the adhesive film 2 from both sides. The laminated material and the protective film 3 are heated and pressurized by an endless steel strip, and then the film 2 and the copper foil 1 are bonded together. The protective film 3 will be peeled off to produce a laminated board 6 obtained by bonding the film 2 and the copper foil 1 together, and then rolled into a wound body 7. On the individual endless steel strip 22, a heating and guiding device is provided. The heating guide 26 of the endless steel belt 22. A cooling guide 28 for cooling and guiding the endless steel belt 22 is provided downstream of the heating guide 26. Heating lead 17 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) ^ (Please read the precautions on the back before filling out this page) Order · 丨 Line · 1223577 A7 B7 Employees of the Intellectual Property Bureau, Ministry of Economic Affairs Printed by Consumer Cooperatives 5. Description of the Invention (A) A method of heating and pressing forming a protective material. However, any of them is used to produce a thermosetting laminated board, and the temperature of the heating and press forming is almost 200 ° C or lower. The appearance of wrinkles and the like is not easy to occur. In this case, the purpose is not to achieve the effect of the present invention-to prevent the occurrence of wrinkles, but to prevent scratches or scratches on the surface of the metal foil, or to prevent bending of the laminated board in the hardening furnace after thermal lamination. Or, when problems such as resin-impregnated paper and resin-impregnated glass cloth, which lacks smoothness due to resin accumulation, prevent smooth lamination processing, sometimes a protective material is used: this is very different from the purpose of the present invention interest. Therefore, in the present invention, if the protective material does not maintain a certain degree of hardness during heating, it will not function as a protective material, and the tensile elastic modulus at the time of bonding is maintained at 490N / mm2 or more. As expected. If the tensile elastic modulus is less than 490 N / mm2, it may be affected by the pressure of heating and pressing ', and the protective material may wrinkle. The linear expansion coefficient of the protective material is preferably 100 PPm / ° C or lower. If the linear expansion coefficient exceeds 100 ppm / ° C, it will be affected by the heating-cooling cycle during the lamination process. Because the size of the protective material changes more than the lamination material, it will cause the surface of the lamination material after lamination processing. The occurrence of wrinkles. The protective material can be any material as long as it can meet the purposes of limiting the shrinkage behavior of the layered material when laminating, preventing the appearance of wrinkles of the product, and the like. Among them, the protective material must be able to withstand the temperature during processing, for example, 'at 250 ° C, it must have a heat resistance of more than 250 ° C. 19 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Li) Please read the notes on the back before filling this page) # · 丨 Line · ·! 1 ^ 3577 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The polyimide film of the invention description (㈧) is It is better to use a polyimide film having a heat resistance of 30 ° C or more when processing at 300 ° C. It is also possible to use, for example, a polystyrene mill as a protective material. 300. (:, the protective material will extend 'cannot be processed. In addition, when a commercially available polyimide film is used as a protective material, in order to suppress the wrinkle formation of the laminated board after the lamination process, the thickness of the protective material is 50%. / izm or more is preferred. If the thickness of the protective material reaches 75 # m or more, the formation of wrinkles can be almost completely suppressed, which is a better situation. When the laminated material is heated and pressurized, the protective material is in the finished configuration. Must reach Given the predetermined temperature, it is desirable to pre-heat the protective material before heating and pressing the laminated material. In order to reduce the expansion and wrinkles caused by the heating that occurs on the protective material, the protective material is pre-heated. The heating temperature is set such that the temperature of the cylinder is better when heating and pressing. In addition, the heating of the protective material, for example, if a heating and pressure forming device using a heating roller or a belt as a constituent element, specifically using a hot roller laminator and In the case of a double-belt press, the protective material can be contacted to cover a part of the heating roller or the belt to perform a preheating operation. At this time, the time when the protective material contacts the thermal roller or the belt is to 1 second is better, 10 seconds or more is better, 15 seconds or more is best. In accordance with this contact time, choose a suitable roller diameter, for example, by winding a protective material around a part of the heating roller, 1M cycles with ±, I / When the distance is more than 2 weeks, the protective material can be heated. This allows the protective material to have a predetermined temperature before the laminated material is bonded. In the swelled and folded state, the laminated materials can be laminated with each other 'ί / fc to produce laminated boards without sensitive folding. Figure 3⑷ 20 (Please read the precautions on the back before filling out this page) #-Order: • Line · This Paper size applies Chinese National Standard (CNS) A4 specification (210 x 297 mm) 1 ^ 3577 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Material that is not protective (protective film 3) is wrapped around The state on the IQ periphery of the heating and pressing roller 4. Fig. 3 (b) shows the state where the protective material (protective film 3) is wound around the 1/4 of the metal roller 4 on the heating and pressing roller. After the pressing is completed, the 'protective material' and the laminated material (that is, the laminated board) bonded by heating and pressing will be slightly tightly connected together. When the laminated board is peeled off from the upper and lower protective materials, "the case where the path of the stripped protective material forward is asymmetrical up and down", one of the upper and lower protective materials will be peeled first, and the remaining protective material and the laminated board are peeled off At this time, since the protective material and the laminated board are slightly adhered to each other, 'the laminated board will be peeled while being pulled toward the protective material side', so that the laminated board will be rolled up. To prevent this, when peeling the upper and lower protective materials, it is desirable to make the peeling angles of the upper and lower protective materials equal to each other with the laminated board as a plane of symmetry. The peeling angles of the upper and lower protective materials are shown in FIG. 1 respectively. The peeling angle is the angle formed by the protective film 3 and the laminated sheet 6 of the protective material. In the case where the systems α1 and α2 shown in FIG. 1 (a) are both acute angles, and in the case where the systems α1 and α2 shown in FIG. 1 (b) are right angles. Although stable processing can be performed in the above cases, the difference between the upper and lower peeling angles is preferably within 30 °, and more preferably within 10 °. When the protective material is peeled off, if the temperature of the workpiece is too high, it will be difficult to peel off the protective material. If it is peeled off with excessive force, the laminated board may be rolled up. Therefore, the temperature of the laminated board when peeling the protective material is between When a thermoplastic resin is used as one of the constituents of the laminated material or the laminated material, the temperature of the thermoplastic resin is preferably TG or lower. The preferred is more than 50 ° C lower than Tg, and the more preferred is more than 100 ° lower than Tg. (：. The best 21 (Please read the precautions on the back before filling this page) # · ·-丨 Line · This paper size is applicable to China National Standard (CNS) A4 (210 X 297 public love) 1223577 Ministry of Economic Affairs Wisdom Printed by the Consumer Cooperative of the Property Bureau A7 B7 V. Description of the Invention (i?) The situation is that the protective material is peeled from the laminated board when it is cooled to room temperature. Therefore, it is heated and pressed as shown in Figure 1 above. As shown in the apparatus 10, it is desirable to provide a peeling auxiliary roller 8 downstream of the metal roller 4, and it is desirable to cool the workpiece between the metal roller 4 and the peeling auxiliary roller 8. 2 In the present invention, the aforementioned protective material can be reused .After the hot-roller laminator, there is originally a conveying and winding device for the laminated material. By setting a conveying and winding device for the protective material, the winding device is used to wind the protection of the used X. The material is placed on the conveying side again, so that the protective material can be reused. When winding, an end position detection device and a winding device correction device are installed to align the ends of the protective material with high precision and wind up. Anyway. On the other hand, it is preferable that the tension applied by the heat-bondable laminated material before bonding by the heating and press forming device allows the heat-bondable laminated material to stably advance. Specifically, for example, A non-thermoplastic polyimide film with a two-layer structure of a thickness of 25 ^ m and a thermoplastic film having a glass transition temperature of 1900c on both sides of the non-plastic polyimide film (Zhongyuan Chemical Co., Ltd.) Industrial Co., Ltd. (ριχΕ〇Bp) is used as a heat-sealable laminated material, using the same heating and pressure forming device as the device shown in Figure i (a), at a temperature of 300 ° C and a line pressure of 490N / Under the conditions of cm and processing speed of 2m / min, a rolled copper foil with a thickness of 18 // m and a polyimide film as a protective material on both sides of the rolled copper foil (made by Zhongyuan Chemical Industry Co., Ltd.) Hepicar 125AH) is formed on both sides of the laminated material to produce a heat-resistant soft laminated board. If the film tension of the heat-bondable laminated material at that time is 0.5 N / mm2, the tension of the copper foil is 22 paper standards Applicable Chinese national standard CNS) A4 specification (21〇X 297 public love) -------------------- Order ---------- line--AVI (please first Read the notes on the back and fill out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 ^ 23577 A7 V. Description of the invention (/) In the case of 10 N / mm, the dimensional change rate will be very small. G37% (_, 0. 〇34% (TD)). The dimensional change rate here is relative to that when the Pu leg 'relied on the material with which the thermal fusion is attached, the shaft _ etc. from the front of the laminated board丨 Wrapping 3G Lai, and then returning to room temperature, the dimensional change rate of the laminate. Under the same conditions, the tension of the heat-soluble laminated material is set to 0. The surface leg 2 and the copper box tension are set to 5 N / mm2 _ Under the shape, it will not be possible to make a difficult, rugged, distorted film. In consideration of the fact that in addition to hacking, the prostitute will change the size very low, so the heat fusion properties will be reduced. Laminated material_The range of force adjustment to N / mm2 is better than 3 times the tension of the laminated material, which is difficult to melt. By setting the conditions of the tension of the laminated material and the tensile force of the metal material generated by thermal welding as described above, it is possible to obtain a laminate with a small change rate. That is, for a laminated board formed by laminating the heat-bondable laminated material and a metal material, the metal material is removed by the aforementioned etching or the like, and the dimensional change rate of the laminated board after heating at 15 ° C for 30 minutes The absolute 値 can reach 0.1% or less in both the MD direction and the TD direction. 被 The laminated material of the heat-sealable property of the present invention is used as an adhesive film. Examples of the laminated material of the heat-sealable property of the present invention include heat. A single-layer film composed of a soluble resin, a plurality of layers obtained by forming a heat-sealable resin layer on both sides of a layer having no heat-sealability, and impregnated in a substrate such as paper, glass, or cloth with heat Weldable resin: Obtained sheets, etc., but the use of glass cloth and other rigid substrates will cause flexibility 23 ϋ HI n —ϋ. ^ 1 I ϋ nn · ϋ l_i ϋ I ϋ H 1 H 11 1 ^ — · _ϋ One sip, · nn · ϋ ϋ ϋ —ft · ϋ I 1 * 1 (Please read the precautions on the back before filling this page) This paper size applies Chinese National Standard (CNS) A4 (210 X 297) Public love) 1223577 A7 B7 V. Description of the invention (> 1) Therefore, it is preferable to use a single-layer film composed of a resin having heat-weldability, and a plurality of layers of films obtained by forming a resin layer having heat-weldability on both sides of a core layer having no heat-weldability as a soft laminated board. As a single-layer film made of a resin having thermal fusion properties, a plurality of layers obtained by forming a resin layer having thermal fusion properties on both sides of a core layer having no thermal fusion properties, preferably having heat resistance, can be suitably used. For example, the following components are obtained from thermoplastic polyfluorene amine imine, thermoplastic polyether amine imine, thermoplastic polyester amine imine, etc. It is obtained by containing 50% or more of these heat-resistant thermoplastic resins in the connection component. The heat-sealing laminated material is also suitable as the adhesive film of the present invention. In particular, it is desirable to use an adhesive film mixed with a thermosetting resin such as epoxy resin or acrylic resin. In order to improve various characteristics, It is also possible to mix various additives in the adhesive film. As for the composition of the adhesive film, any material having a heat-resistant adhesive layer on the outside may be used, even if only The single-layer structure obtained by the heat-weldable joining component is not a problem, but from the viewpoint of dimensional stability, the three layers of the heat-weldable adhesive layer are arranged in close contact on both sides of the core layer without heat-weldability. The structure film is preferred. There is no particular limitation on the method for manufacturing the adhesive film. If it is formed of a single layer of the adhesive layer, the film can be formed by a tape casting method, an extrusion method, or the like. In the case of a three-layer structure consisting of an adhesive layer, a core layer without heat fusion, and an adhesive layer, the adhesive is applied on both sides of the heat-resistant film at one time or on both sides at the same time to make it. 3 layer adhesive film method; and a single layer adhesive film composed of adhesive components is laminated on both sides of the heat-resistant film to make 3 24 This paper is in accordance with Chinese National Standard (CNS) A4 specification (210 x 297 mm) (Please read the precautions on the back before filling out this page), · Γ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 1223577 A7 B7 V. Description of the invention (θ) {Please read the back Notes on the page and then fill method} Next film layers. Regarding the method of applying an adhesive to make a three-layer adhesive film, especially when a polyimide-based adhesive is used, there are: application in a polyamic acid state, and then performing imine while drying The method of forming the resin; and the method of directly coating the soluble polyfluorene imide resin and drying it. The method of forming the adhesive layer is not particularly limited. In addition, there is also a method of co-extruding the respective resins of the adhesive layer / core layer without thermal fusion / adhesive layer to produce a heat-resistant adhesive film in a single process. In addition, as for the heat-sealable laminated material used in the present invention, if components such as 1C, resistors, and capacitors are assembled on the substrate, the substrate will not peel off due to heat when it reaches the fusion welding process. The heat-resistant adhesive material with a glass transition temperature of 170 ° C or more will be better. As one of the plural laminated materials of the present invention, a metal material for forming a conductive layer can be used, and a metal foil is more preferable.丨 Wire Metal foils include copper and copper alloys, stainless steel and its alloys, nickel and nickel alloys (including 42 alloys), and Ming and Ming alloys. Preferably, copper and copper alloys' are copper foils having a thickness of 50 μm or less in consideration of the flexibility of the heat-resistant flexible substrate. There are no special restrictions on the types of copper foils, such as rolled copper foils, electrolytic copper foils, and the copper foils. The surface of these copper boxes is printed with adhesives and anti-corrosion agents on the surface of these copper boxes. A rust layer, a heat-resistant layer (for example, a plating treatment of chromium, zinc, nickel, etc.) are also acceptable. In particular, compared with copper foils with a thickness of 35 // m or more, copper foils with a thickness of 35 / Zm or less do not have kosi, and do not wrinkle during heat build-up. Copper foils with a height of 35 # m or less are used in the present invention Can achieve significant results. Thermally weldable laminated material and metal material of the joint surface ^ 25 This paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) 1223577 Printed clothing A7 B7 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs DESCRIPTION OF THE INVENTION (β) Roughness greatly affects the performance of laminated boards. In the present invention, the maximum height (Rmax) of the surface roughness of the heat-sealable laminated material and the metal material on the joint side is selected to be 15 / zm or less, and the ten-point average roughness (called the following, and the center line average) Roughness (Ra) is the following metal materials. In this specification, Rmax 'Rz and Ra are measured in accordance with JIS b0601. If the surface roughness is large, there is a laminated material that is heat-sealable. There is a tendency for voids to be easily formed between layers of metallic materials. < Heating and pressure forming device 'is not limited as long as it is a heating and pressing device capable of heating and applying pressure to the laminated material, and examples thereof include a single-acting press device, a multi-stage press device, and a vacuum press. Equipment, multi-stage vacuum press device, hot press device, hot roll laminator, double-belt press, etc. Among them, the “hot roll laminator, double-belt press can be continuously and efficiently produced” and can obtain stable quality Laminated board, so it is particularly suitable for use. If a long sheet rolled as a laminated material and a protective material is rolled in combination with the above-mentioned device, the laminated board can be continuously and efficiently manufactured, which is related to the improvement of productivity. In particular, if a hot roll laminator or a double-belt press is used in combination with a long sheet rolled into a roll shape, the laminated board can be produced most efficiently and continuously. The heating method is not particularly limited as long as it can be heated at a predetermined temperature, and examples thereof include a heat medium circulation method, a hot air heating method, and an induction heating method. The heating temperature is preferably 200 ° C or higher. If it is used for the assembly of electronic components and passed through the ambient atmosphere temperature melting furnace, the heat welding piece with the corresponding Tg is used for heating at 24 ° C or higher. Better. As long as the pressurization method can apply the predetermined welding force, that is, this paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------------- -Order ----------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 B7 V. Description of Invention (vf) No special Examples of the limitation include an oil pressure method, an air pressure method, and a gap pressure method. In addition, in the present invention, when a pair of metal rollers are used, processing with a double-belt press does not cause uneven pressure due to the joint portion of the belt, and the cost of equipment and maintenance It is also less than a double belt press. If a pair of metal rollers is not used and a metal-rubber roller is used instead, as mentioned above, there is a problem of insufficient heat resistance of rubber. For example, even if a heat-resistant adhesive film and a rolled copper foil are obtained by disposing a thermoplastic polyimide having a glass transition temperature of 190 ° C on both sides of a non-thermoplastic polyimide film, a metal-rubber roller is used. (Metal roller: roller diameter of 300mm, roundness of 0.002, cylindricalness of 0.002mm, surface roughness of 0.001mm, temperature distribution accuracy of 300 ° C ± 2 ° C). C. Lamination is performed under the conditions of linear pressure of 490 N / Cm and processing speed of 2 m / min, but the lamination operation cannot be performed because the rubber roller will be heated and deteriorated. Hereinafter, the aspect using a metal roller will be described in detail. In the aspect using the metal roller of the present invention, the heating and press forming apparatus 10 shown in Figs. 1 (a) and (b) is used. By heating and pressing the molding device 10 in this way, a plurality of laminated materials including a heat-sealable laminated material (having heat resistance) are bonded to the thermoplastic polyimide and the copper foil, for example. In FIG. 1, the heating and press forming apparatus 10 includes a pair of metal rollers 4 for heating and pressing, and the pair of metal rollers 4 are provided with a heat-resistant adhesive film 2 and a holding film 2. Copper film 1 followed by film 2. Then the film 2 runs the copper box i 27. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- I ------ 1 ^- -------—— ^ wi (Please read the precautions on the back before filling this page) 1223577 A7 ___ B7___ V. Description of the invention () Laminated into laminated board 6 by heating and pressure, and then wound. (Please read the precautions on the back before filling in this page) The heating and pressure forming device can also be as shown in Figure 4. The heating and pressure forming apparatus 10a of FIG. 4 includes a plurality of pairs of metal rollers 4a. These paired metal rollers are arranged in series in the direction of travel of the film, and then the film 2 and the copper foil 1 system holding the adhesive film 2 The paired metal rollers 4a which are sequentially arranged are subjected to a heating and press forming process. In FIG. 4, at least one of the pair of metal rollers 4a, for example, the leftmost metal roller pair in the drawing is set as a heating and pressing roller. The diameter of the metal roller is preferably more than 200mm. If the diameter is less than 200mm, the pressure is rapidly applied to the laminated material during heating and pressing, which will cause poor appearance after lamination. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs using a metal roller shown in FIG. 4 (or FIG. 1) in a heating and press forming apparatus, in order to apply a uniform pressure to the workpiece in a wide direction, so the appearance of the metal roller In terms of size, it is desirable to have a roundness of 0.05 mm or less, a circularity of 0.05 mm or less, and a surface roughness of 0.01 mm or less. If the upper and lower metal rollers have a dimensional error exceeding the above specifications, a total gap of 0.1mm will appear between the rollers. When the thickness of the laminated material is less than 0.1mm, there will be a part that is pressurized and an unstressed part. It is difficult to pressurize the sample uniformly. Further, if the surface roughness is greater than 0.01 mm, unevenness may occur on the surface of the roller, and it may be difficult to apply uniform pressure. Furthermore, in order to apply a uniform pressure to a wide direction and a uniform temperature, it is preferable that the temperature difference of the metal roller surface in the axial direction is ± 10 ° C or less. When the center of the metal roller and the end appears 10. (: The above temperature difference, then sample 28 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm)) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 B7 V. Description of the invention (in) In the wide direction, temperature unevenness occurs when pressing, and the difference in the expansion rate of the metal roller due to the temperature difference will cause the diameter of the roller at the center and the end to be different, that is, the so-called temperature crown. Because of this temperature, Each 1 ° C of the protrusions is accompanied by thermal deformation of the rollers of about 3 // m. If the temperature difference reaches 1 (rC, the temperature difference is 30 / zm, and the total up and down will become a gap of about 60 // m. Therefore, if the metal rollers There is a temperature difference of 10 ° C or more in the axial direction of the surface, which makes it impossible to apply uniform pressure to the sample. The Kensington surface hardness Hs of the surface of the metal roller must be 50 or more. If the hardness is less than 50, the upper and lower sides of the pressure roller are both The reason for the metal roller, or the metal scraps and the like on the surface of the roller during pressurization, or the sudden height difference caused by the bending of the laminated material, will cause damage to the surface of the roller. Therefore, based on the gold For the purpose of imparting abrasion resistance, non-adhesiveness, non-heat resistance, etc., it is desirable to apply chrome plating to metallic materials. By implementing this industrial chrome plating, the hardness Hs of metallic materials can be increased from 20 to 30 to 50 Above. If the thickness of the plating is less than 0.05mm, it will be used at high temperature for a long time, and cracks will appear in the plating on the surface. The thickness is preferably 0.05mm or more. Furthermore, it is heated and pressurized. The difference in the gap that occurs in the axial direction of the metal roller during this time will be the difference in the pressing force in the axial direction. However, in the heating and press forming device of the present invention, the protective material is used to hold the laminated material to heat and press. Therefore, the gap difference in the axial direction of the metal roller will be absorbed by the deformation of the protective material, and the laminated material can be uniformly pressed. If the thickness of the protective material exceeds 50 / zm, the laminated material is Can be uniformly heated and pressurized, and can be uniformly followed. Therefore, this 29 paper size applies Chinese National Standard (CNS) A4 Regulation (210 X 297 public love) I an n i-ϋ an I i emmi Bn 1 n I nnn 1 nn 1, 4 flu ϋ ϋ nn ip— ϋ-1 II _ 1 ^ Mmn (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 -----— __ 一 —_ 5. Description of the invention (>) The invention of the heating and pressure forming device is best shown in Figure 5. In the figure, the heating and pressure forming device 10b series is equipped with a protective material. The half-bucket hot-pressing money roller 4 has a conveyance surface η, a holding pen 24 at a predetermined position, and a pull-out 雠 26 which pulls out the peeled surface 3. The laminated material 5 is composed of an adhesive film 2 and an impurity. Although the conveying mechanism 22 here is a rotary lepton 23 installed at the center of the wound body 33 of the protective material 3, as long as it has the function of sending out the protective material 3, it is not limited to what is shown in the drawing. In addition, although the pull-out mechanism 26 is a material that pulls out the peeled protective material 3 and winds it on the rotating roller 27 in the form of a winding body 34, it is not limited to the drawing as long as it has the function of pulling out the protective material 3. Lifting things. The guide mechanism 24 is constituted by a peeling auxiliary roller 8. The peeling auxiliary roller 8 is a guide mechanism for guiding the peeling of the protective material such as the protective material 3 at a predetermined position. It may also be a driven roller that moves in contact with the protective material. It can also be an actively rotating roller. It can also be a fixed roller. As long as the protective material can be guided, the guide mechanism 24 may be a rod-shaped or plate-shaped member having a non-circular cross section. In addition, winding or coating the metal roller 4 for heating and pressing with a resin of the same material as the protective material and adhering it thereon is also effective for uniformizing the pressure, but it is continued during use. It will fall off and have problems with unacceptable long-term use. In addition, the wound protective material is repeatedly heated in the same place at high temperatures and subjected to pressure, which causes the problem of accelerated material deterioration. In the present invention, due to the use of a strip of protective material, even if the strip of protective material is used again, the same part is subject to 30 ------------------ --Order --------- Line—AWI (Please read the notes on the back before filling in this page) This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) 1223577 Ministry of Economic Affairs Printed by the Consumer Property Cooperative of Intellectual Property Bureau A7 B7 V. Description of the Invention (β) The number of times of heating and pressing is compared with the case where the resin of the same material as the protective material is wound around the above metal roller to perform the following. Significantly reduced for continuous production. The laminated board obtained by the present invention is obtained by laminating a plurality of laminated materials containing a heat-sealable laminated material, and is mainly used as a heat-resistant flexible substrate for an electronic / electric laminated board. EXAMPLES The present invention will be specifically described by the following examples, but these examples are only used to illustrate the present invention, and the present invention is not limited thereto. The glass transition temperature (Tg) mentioned in the examples was measured by Shimadzu Corporation DSC CELL SCC-41 (differential scanning calorimeter) under nitrogen gas, and the temperature was raised at 10 ° C / min to measure Temperature range from room temperature to 400 ° C. (Example 1) Thickness is provided on both sides of a thermoplastic polyimide film of 25 / zm Tgl90 ° C (PIXEO TP-T manufactured by Zhongyuan Chemical Industry Co., Ltd.). The electrolytic copper foil of 18 is used as a laminated material, and a 125 // m polyimide film (Apicar 125AH manufactured by Zhongyuan Chemical Industry Co., Ltd.) is further arranged on both sides of the laminated material as a protective film. The heating and press forming apparatus 10 shown in 3 (b) (temperature 260 ° C, processing speed 0.5 m / min, linear pressure 980 N / cm) is heated and pressed, and then the laminated material to be bonded is heated and pressed. After cooling to a room temperature with the protective film which is slightly in contact therewith, the protective film is peeled off to produce a soft laminated board. As a result, the softness without the appearance of wrinkles, etc. can be obtained. 31 The paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) ~ ----------- --Φ ------- tr --------- f Dance (Please read the notes on the back before filling this page) 1223577 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (J) Laminated board. (Example 2) A flexible laminated board was produced under the same conditions as in Example 1 except that instead of the electrolytic copper foil of Example 1, a rolled copper foil having a thickness of 18 / zm, which is prone to wrinkles, was disposed. As a result, a soft laminated board having no defects such as wrinkles in appearance can be obtained. (Example 3) Except replacing the heating and pressure forming device used in Example 1, and using a double belt press (temperature 30 (TC, processing speed 0.5m / min, linear pressure 980N / Cm), Example 丨 A soft laminated board was produced under the same conditions. As a result, a soft laminated board having no appearance, such as wrinkles, was obtained. (Example 4) The same thermoplastic polyurethane as in Example 1 was obtained. The two sides of the amine film were provided with the same rolled copper foil as in Example 2. Further, the same polyimide film as in Example 1 was placed on both sides of the amine film as a protective film. A double-belt press (temperature 300 ° C, Processing speed is 0.5 m / min, linear pressure is 980 N / cm). As a result, a flexible laminated board is obtained. As a result, a flexible laminated board having no appearance such as wrinkles is obtained. (Example 5) Preparation of non-thermoplasticity Polyimide film with glass shift on both sides 32 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -------------------- Order --------- Line-AWI (Please read the notes on the back before filling this page) 1223577 A7 B7 V. Description of the invention (). (Please read the precautions on the back before filling in this page) Adhesive film with a thickness of 25 // m and a 3-layer structure made of thermoplastic polyimide resin with a temperature of 190 ° C (Zhongyuan Chemical Industry Co., Ltd. Manufacture of PIXEOO BP), with electrolytic copper foils of thickness on both sides, and 125 # m polyimide film on both sides of the electrolytic copper foil (Apikar 125AH manufactured by Zhongyuan Chemical Industry Co., Ltd.) as The protective film was produced by a hot roll laminator under conditions of a temperature of 260 ° C, a linear pressure of 980 N / cm, and a processing speed of 0.5 m / min. As a result, a soft laminated board having no defects such as wrinkles in appearance can be obtained. (Example 6) A flexible laminated board was produced in the same manner as in Example 5 except that the electrolytic copper foil of Example 5 was replaced with a rolled copper foil having a thickness of 18 / zm which is more likely to be wrinkled than the electrolytic copper foil. As a result, a soft laminated board having no defects such as wrinkles in appearance can be obtained. (Example 7) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The soft laminated board was produced in the same manner as in Example 5 except that the temperature of the hot roll laminator was set to 300 ° C and the processing speed was 2.0 m / min. As a result, it is possible to obtain a flexible laminated board which is free from defects such as beryllium in appearance. (Example 8) A soft laminated board was produced in the same manner as in Example 6 except that the temperature of the hot roll laminator was set to 300 ° C and the processing speed was 2.0 m / min. As a result, a soft laminate with no appearance such as wrinkles can be obtained. 33 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 B7 V. Invention Description ("丨") board. (Comparative Example 1) A soft laminated board was obtained in the same manner as in Example 1 except that the laminated material bonded by heating and pressing was cooled to room temperature without using a protective film. As a result, wrinkles in which longitudinal stripes are pressed in the traveling direction of the lamination process occur. (Comparative Example 2) A soft laminated sheet was obtained in the same manner as in Example 2 except that the laminated material bonded by heating and pressing was cooled to room temperature without using a protective film. As a result, wrinkles in which longitudinal stripes are pressed in the traveling direction of the lamination process occur. (Comparative Example 3) A soft laminated sheet was obtained in the same manner as in Example 5 except that the laminated material bonded by heating and pressing was cooled to room temperature without using a protective film. As a result, the occurrence of the collapse of the longitudinal stripes was caused by the lamination process. (Comparative Example 4) A soft laminated sheet was obtained in the same manner as in Example 6 except that the laminated material to be bonded by heating and pressing was cooled to room temperature without using a protective film. As a result, 34 sheets of longitudinal stripes were pressed in the direction of lamination processing. The paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm). N H ··· ϋ m · ϋ ϋ ϋ ^^ 1 > 1 _1 I · _ϋ n ϋ ·· tmmm i_l 1 mMM§ 1 Ν I · ϋ MmmMe tmMmm in an n I— I al_l «4 (Please read the notes on the back before filling this page) 1223577 A7 B7 V. DESCRIPTION OF THE INVENTION (β) Failure. (Comparative Example 5) A soft laminated sheet was obtained in the same manner as in Example 7 except that the laminated material bonded by heating and pressing was cooled to room temperature without using a protective film. As a result, the occurrence of the collapse of the longitudinal stripes was caused by the lamination process. (Comparative Example 6) A soft laminated sheet was obtained in the same manner as in Example 8 except that the laminated material bonded by heating and pressing was cooled to room temperature without using a protective film. As a result, the occurrence of the collapse of the longitudinal stripes was caused by the lamination process. (Example 9) A thermoplastic polyimide film similar to that used in Example 2 was used as an adhesive film, and a rolled copper foil having a thickness of 18 ^ m was placed on both sides thereof, and two further rolled copper foils were used. The side was provided with the same protective film as that of the user of Example 2, and the same heating and pressure forming apparatus as in Example 1 was used, and the temperature was 300. (:, Line pressure 490N / cm, processing speed 2m / min for heating and pressing. At this time, the remaining conditions are as shown in Table 1 to produce a heat-resistant soft laminated board. As a result, the appearance can be obtained. Soft laminated board without wrinkles, etc. The tensile modulus of elasticity is based on JIS K713, using Shimadzu Manufacturing Co., Ltd .: hot press S-100-C at a cross head speed ( Tensile speed) 200mm / min to measure. Also, install at 35 --------------(Please read the precautions on the back before filling in the page) · • Line · Ministry of Economy Wisdom Printed on the paper by the Consumers' Cooperative of the Property Bureau. The paper size is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 1223577 A7 B7. 5. Description of the invention (y) In this manual, the linear expansion speed is based on JIS K197, using science Manufactured by Denki Electric Co., Ltd .: The thermal analysis device TMA8140 was measured at a heating rate of 100 ° C / min. (Example 10) A three-layer adhesive film having the same structure as that used in Example 5 was used (Zhongyuan Chemical Co., Ltd.) Industrial Co., Ltd. except PIXEO (BP), the rest are the same as in Example 9. As a result, a soft laminated board was produced. As a result, a soft laminated board having no appearance such as wrinkles was obtained. (Comparative Example 7) Except for the conditions of Comparative Example 7 shown in Table 1, the rest A flexible laminated board was produced in the same manner as in Example 9. As a result, wrinkles in which longitudinal stripes were pressed in the advancing direction of the lamination process. (Comparative Example 8) Except that the same adhesive film as that used in Example 10 was used by the user. The rest was made in the same manner as in Comparative Example 7. As a result, wrinkles in which longitudinal stripes were pressed in the direction of lamination processing occurred. ------------------ --Order --------- ^ I (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with China National Standard (CNS) A4 specifications ( (210 X 297 mm) 1223577 A7 B7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs on the consumer cooperation of the company. 5. Description of the invention [Table 1] Examples --- Comparative Examples 7, 8 Protective material S ~~ '醯 Imine thin 膣 Μ j \ w Initial tensile elastic modulus (N / mm2) (at 300 ° C) ΤΪ76 ~ ^----------- Coefficient of linear expansion (ppwt) (at 200 ~ 300 ° C) 40-One thickness (mm) 75 ^--Reuse iti ~ ^--Appearance fold ------ wrinkled (Example 11) Use and Example 12 The same thermoplastic polyimide film was used as the adhesive film. The rolled copper foil with a thickness of 18 // m was arranged on both sides, and the rolled copper box was arranged on both sides. 2 The same protective film is used by the users' using the heating and pressure forming apparatus shown in FIG. 1 (a), and heating was performed at a temperature of 300 ° C, a line pressure of 49 ° N / cm, and a processing speed of 2m / min. Pressure was applied to produce a heat-resistant flexible laminated board 6. As a result, it is possible to obtain a flexible laminated board which is free from defects such as buckling and bending. (Example 12) A heat-resistant flexible laminated board was produced in the same manner as in Example 11 except that a three-layer structure adhesive film (PIXEO 0 BP manufactured by Zhongyuan Chemical Industry Co., Ltd.) was used as the user of Example 5. . As a result, it is possible to obtain a flexible laminated board which is free from defects such as wrinkles and plate bends in appearance. (Example 13) A heat-resistant flexible laminated board was produced in the same manner as in Example 11 except that the heating and press forming apparatus 10 shown in Fig. 1 (b) was used. 37 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -------------------- ^ --------- Line-(Please read the precautions on the back before filling this page) 1223577 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (β) As a result, no wrinkles or plate bends can be obtained in appearance Waiting for a soft laminate. (Example 14) A heat-resistant soft laminate was produced in the same manner as in Example 13 except that a three-layer adhesive film (PIXE0BP manufactured by Zhongyuan Chemical Industry Co., Ltd.) was used, which was the same as that used in Example 5. board. As a result, it is possible to obtain a flexible laminated board which is free from defects such as buckling and bending. (Example 15) A thermoplastic polyimide film 2 (PIXEOBP, manufactured by Zhongyuan Chemical Industry Co., Ltd.) was used at Tgl9 (TC thickness 25 // m) using a heating and pressure forming apparatus 10 shown in FIG. 3 (a). ) On both sides of the electrolytic copper foil with a thickness of 18 / zm1, and further on both sides of the electrolytic copper foil 1 with a polyimide film (Apicar 125AH manufactured by Zhongyuan Chemical Industry Co., Ltd.) as the protective film 1, A heat-resistant flexible laminated board 6 was produced under the conditions of a temperature of 300 ° C, a linear pressure of 490 N / cm, and a processing speed of 2 m / min. At this time, the contact time between the protective film 1 of the protective material 1 and the heating roller 4 was 15 seconds. As a result, a soft laminated board having no appearance such as wrinkles was obtained. (Example 16) A bonding film having the same three-layer structure as that of the user of Example 5 was used (Zhongyuan Chemical Industry Co., Ltd.) Co., Ltd. manufactured PIXEOO BP) as the adhesive film, and the rest was made in the same way as in Example 15. 38 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----- --------------- Order --------- * 5 ^ — (Please Read the notes on the back and fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 B7 V. Description of the invention (8) As a result, there can be no appearance of wrinkles or plate bending. (Laminated board.) (Example 17) The same procedure as in Example 15 was carried out except that the contact time between the protective film 1 and the heating roller 4 was 7.5 seconds using the heating-pressing molding device 10 shown in Fig. 3 (b). Heat-resistant flexible laminated board 6. As a result, a flexible laminated board having no appearance, such as folds, bending, etc., can be obtained. (Example 18) The same three layers as those used in Example 5 were used except that the user of Example 5 was used. Except for the structure of the adhesive film (PIXEOO BP manufactured by Zhong Yuan Chemical Industry Co., Ltd.), a soft laminated board was produced in the same manner as in Example 17. As a result, the appearance of wrinkles and plate bending was not obtained. Flexible laminates. The maximum height (Rmax), ten-point average roughness (Rz), and centerline average roughness (Ra) of the surface roughness of the copper foil shown in Examples 19 to 21 below are based on JIS B0601. set The content of the micro-cavity area is 100% of the copper foil of the laminated board with a square sample of 100mm is etched with a ferrous chloride solution, and then the optical microscope (NIKON (Co., Ltd.) is used. (Manufactured OPTIPHOTO; 100 times) to observe, to find the area of the unadhered part and the observed part, and express it in terms of area ratio. (Examples 19 to 21) Tgl90 ° C 25 / zm thermoplastic polymer醯 Imine film (Zhong Yuan 39 This paper size applies to Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------------------- Order- ------- Line—ΜνΊ (Please read the precautions on the back before filling in this page) 1223577 A7 V. Description of the invention () 7) PIXEO (TP-T) manufactured by Chemical Industry Co., Ltd. A copper foil with a thickness of 18 ^ m is arranged on both sides, and a polyimide film (Apicar manufactured by Zhongyuan Chemical Industry Co., Ltd.) is further arranged on both sides of the copper foil as a protective film, as shown in FIG. 3 (b). The heating and press forming device 10 is laminated under the conditions of a temperature of 300 ° C, a linear pressure of 490 N / cm, and a processing speed of 2 m / min. To produce a laminate. The detailed conditions are shown in Table 2. As a result, no cavities of about 10 to 50 // m were observed, and the microcavity ratio was 0%, and no swelling of the copper foil surface due to the solder heat resistance test was observed. The solder heat resistance test was performed in the following manner. That is, according to JIS C6471
所製作之樣品。以15(TC X 30分鐘來乾燥後，在20°C /60RH%之恆溫室調製24小時，然後在300°C之焊浴中浸 漬1分鐘。觀察於該樣品之銅箔單面部、雙面部是否有膨 脹。又，吸濕條件係將以同樣條件所製作之樣品藉4〇t /90RH%之環境試驗機調製96小時，觀察於26(TC之焊浴 中浸漬10秒之樣品的銅箔單面部、雙面部是否有膨脹。 [表2] (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 實施例19,22 實施例20,23 實施例21，24 加熱加壓成形裝置 熱輥積層機 熱輥積層機 雙帶式壓^ 銅箔種類 軋製 電解 MM ' 銅箔型號 BHY(日本能源） JTC旧本能源） BHY(日本能源） 銅箔表面 Rmax 1.1 7 1.1 Rz 0.9 6 0.9 Ra 0.1 1.0 0.1 微空洞比例 0 0 0 焊料耐熱(C-96/40/90) 無膨脹 無膨脹 40 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公爱） 1223577 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（β) (實施例22) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)以外 ，其餘與實施例19同樣來製作軟性積層板。其結果，並未 觀察到10〜50“m左右之空洞，微空洞率爲0%，又並未觀 察到因焊料耐熱試驗造成銅箔表面的膨脹。 (實施例23) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)以外 ，其餘與實施例20同樣來製作軟性積層板。其結果，並未 觀察到10〜50/zm左右之空洞，微空洞率爲〇%，又並未觀 察到因焊料耐熱試驗造成銅箔表面的膨脹。 (實施例24) 除了使用與實施例5所使用者爲同樣的3層構造之接 著薄膜（鐘淵化學工業股份有限公司製造ΡΙΧΕΟ BP)以外 ，其餘與實施例21同樣來製作軟性積層板。其結果，並未 觀察到10〜50/zm左右之空洞，微空洞率爲0%，又並未觀 察到因焊料耐熱試驗造成銅箔表面的膨脹。 (實施例25) 除了使用 Rmax 16 // m、Rz 11 // m、Ra 2.2 // m 之銅箱 以外，其餘以與實施例19同樣的加工條件來製作積層板。 其結果，雖得到在外觀上無皺摺·板彎的軟性積層板，但 微空洞率在20%以上，觀察到因焊料耐熱試驗所造成之銅 箔表面的膨脹。 41 本紙張尺度適用中國國家標準（cns)a4規格（210 χ 297公爱） -------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（？？） (實施例26〜3 1) 準備一於非熱可塑性聚醯亞胺薄膜之兩面具有玻璃移 轉溫度190°C之熱可塑性聚醯亞胺樹脂成分所構成之厚度 25//m的3層構造之接著薄膜(鐘淵化學工業股份有限公司 製造ΡΙΧΕΟ BP)，於其兩側配置厚度18/zm之軋製銅箔、 進一步於該軋製銅箔之兩側配置聚醯亞胺薄膜(鐘淵化學工 業股份有限公司製造阿皮卡爾125AH)作爲保護薄膜，使 用與實施例1同樣的加熱加壓成形裝置，在溫度300°C、 線壓490N/cm、加工速度2m/min的條件下製作出軟性積層 板。此時之薄膜、銅箔的張力與尺寸變化率係示於表3。 尺寸變化率係相對於所得之耐熱性軟性積層板之，自該積 層板去除銅箔後於150°C加熱30分鐘，接著回到室溫後之 積層板的尺寸變化率。可製作出尺寸變化率在絕對値 0.10%以內之耐熱性軟性積層板。 又，尺寸變化率係依據JIS C6471(6.11尺寸安定性)所 測定者。 [表3] 熱可塑性聚醯亞胺 薄膜張力N/mm2 銅箔張力 N/mm2 尺寸變化率(％) MD TD 實施例26 0.5 10 -0.037 +0.034 實施例27 1.0 10 -0.058 +0.052 實施例28 1.0 25 -0.043 +0.039 實施例29 3.0 25 -0.087 +0.084 實施例3〇1 1.0 1.0 -0.152 +0.146 實施例31] 5.0 25 -0.308 +0.291 42 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 0------ -訂---------線丨 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1223577 A7 B7 五、發明說明（Μ) (實施例32) 以圖1(a)所示之態樣，作爲接著薄膜2，係使用〜於 之非熱可塑性聚醯亞胺薄膜之兩面具有玻璃移轉溫度爲 190°C之熱可塑性聚醯亞胺樹脂成分所構成之厚度25/^m 的3層構造之接著薄膜（鐘淵化學工業股份有限公司製造 ΡΙΧΕΟ BP)，利用加熱加壓成形裝置1〇，與厚度18/zm之 軋製銅箔，以溫度300 °C、線壓49〇N/cm、加工速度 2m/min的條件進行積層加工。其結果，得到無皺摺與接著 不均之良好的樣品。詳細條件如表4所示。 又，於本說明書中，金屬輥子之正圓度係依據JIS B0607、圓筒度係依據jis B0608、表面粗糙度係依據JIS B0601、肖氏硬度係依據jis Z2246這些分別的方法來測定 。詳細的條件示於表4。 (實施例33) 除了使用一金屬輥子之輥子直徑爲150mm的加熱加壓 成形裝置.，採表4所示之條件以外，其餘與實施例32同樣 ’進行積層加工。其結果，雖可進行積層，但於實施例32 所未見到的皺摺在本實施例之樣品表面幾處出現。除此之 外可說是良好的樣品。 (實施例34) 除了使用正圓度爲0.07mm、圓筒度爲0.08mm、表面 粗糙度爲0.01mm之物作爲加熱加壓成形裝置的金屬輥子 ’並採表4所示之條件以外，其餘與實施例32同樣，進行 積層加工。其結果，由於輥子之壓力不均，出現了幾處未 43 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---------------I I I I I ^--------- (請先閱讀背面之注意事項再填寫本頁) 1223577 A7 ______B7___ 五、發明說明（叫） 接著到的地方，除此之外可說是良好的樣品。 (實施例35) 除了使用在300°C之溫度分布精度爲±13°C之物作爲 加熱加壓成形裝置之金屬輥子以外，其餘與實施例32同樣 ，進行積層加工。其結果，中央部雖接著著，惟由於金屬 輥子受到溫度突起影響導致所製作之金屬輥子間出現間隙 ’樣品之端部乃處於無法加壓之狀態，故於樣品之端部發 生了於實施例32所未見到的未接著部分，除此之外可說是 良好的樣品。 (實施例36) 除了使用表面硬度(肖氏硬度)Hs20之熱輥子作爲加熱 加壓成形裝置之金屬輥子，並採表4所示之條件以外，其 餘與實施例32同樣，進行積層加工。其結果，受到金屬屑 等之附著、樣品之彎曲所出現之高度差的影響，延續50小 時運轉之後’於輥子表面出現了輕微的損傷。而損傷部會 成爲未加壓部分，於樣品中產生一部分在實施例32所未見 到的接著不均，除此之外可說是良好的樣品。 ^1· -ϋ —ϋ ϋ II ϋ— i^i —ϋ ^^1 ·1 n I -Bn -m I ϋ «1 n an·-、 I Hi atmm MmKae I 1 Mmmem I -V-口 矣 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 44 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1223577 ! A7 I ---；-21 五、發明說明（） [表4] 實施例32 實施例33 實施例34 實施例35 實施例36 輥子構成 金屬一金屬 圣屬一金屬 金屬一金屬 金屬一金屬 金屬一金屬 輥子直徑(mm) 300 150 300 300 300 輥 正圓度(mm) 0.002 0.001 0.07 0.002 0.002 子 圓筒度(mm) 0.002 0.001 0.08 0.002 0.002 表面粗糙度(mm) 0.001 0.001 0.001 0.001 0.001 於300°C之溫度分 ±2 土 2 ±2 ±2 土2 布精度(。C) 肖氏硬度 Hs70 Hs70 Hs70 Hs70 Hs20 結果 得到無不均 於樣品表面 因壓力不均 於樣品之端 經50小時 、接著不均 的一部分出 所造成之接 部存在著未 運轉後，輥 之良好的樣 現皺摺 著不均出現 接著之部分 子表面出現 品 在幾處 部分損傷 [產業上之利用領域] 近年來，伴隨電子製品之輕量化、小型化、高密度化 ，印刷基板之需求亦提昇，尤其，於絕緣性薄膜上形成銅 箔電路所得之軟性印刷基板的需求也增加。依據本發明， 即使於積層加工時使用容易出現皴摺之軋製銅箔，仍可得 到無板彎之外觀良好的耐熱性之積層板。使用本發明此種 軟性積層板之軟性印刷基板，可廣泛地應用在行動電話、 攜帶型電腦此種組裝著高密度組裝元件的電子機器上。 代表元件符號 丄 祖 2 接著薄膜 45 本紙ϋ度適用中國國家標準（CNS)A4規格(if 297公爱) --- II----· I--.---l· ^ · I----— II (請先閱讀背面之注意事項再填寫本頁) 1^23577 A7 j _B7 i 五、發明說明（） 1 保護薄膜 4.4a 金屬輥子 6 積餍板 1 捲繞體 8.8a 剝離輔助輥子（引導機構） 10J0a/10b 加熱加壓成形裝置 m 雙帶式懕機 22 無端鋼帶 21 旋轉輥子 24 引導機構 26 加熱引導件(拉出機構） 21 旋轉輥 28 冷卻引導件 33.34 捲繞體 a L a 2 上、下保護材料之剝離角度 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）The samples made. After drying at 15 ° C for 30 minutes, it was prepared in a constant temperature room at 20 ° C / 60RH% for 24 hours, and then immersed in a soldering bath at 300 ° C for 1 minute. Observe the copper foil single side, double side of the sample Whether there is swelling on the face. The hygroscopic condition is that the sample made under the same conditions is adjusted by a 40t / 90RH% environmental testing machine for 96 hours, and the sample immersed in a solder bath of 26 ° C for 10 seconds is observed. Are there any swellings on one or both sides of the copper foil? [Table 2] (Please read the precautions on the back before filling out this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Example 19, 22 Example 20, 23 Example 21, 24 Heating and pressure forming device Hot roll laminating machine Hot roll laminating machine Double belt press ^ Copper foil type Rolling electrolytic MM 'Copper foil type BHY (Japan Energy) JTC old energy) BHY (Japan Energy) Copper Foil surface Rmax 1.1 7 1.1 Rz 0.9 6 0.9 Ra 0.1 1.0 0.1 Micro-cavity ratio 0 0 0 Solder heat resistance (C-96 / 40/90) Non-expansion and non-expansion 40 This paper applies Chinese National Standard (CNS) A4 specification (210 x 297 Public Love) 1223577 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B 7. V. Description of the Invention (β) (Example 22) Except for using the same three-layer adhesive film (PIXEO 0 BP manufactured by Zhongyuan Chemical Industry Co., Ltd.) as the user of Example 5, the rest is the same as in Example 19 A soft laminated board was also produced in the same manner. As a result, no cavities of about 10 to 50 "m were observed, and the microcavity ratio was 0%. No swelling of the copper foil surface due to the solder heat resistance test was observed. (Example 23 ) A soft laminated board was produced in the same manner as in Example 20 except that a three-layer adhesive film (PIXEO 0 BP manufactured by Zhongyuan Chemical Industry Co., Ltd.) was used, which was the same as that used in Example 5. A void of about 10 to 50 / zm was observed, and the micro-void ratio was 0%, and no swelling of the copper foil surface caused by the solder heat resistance test was observed. (Example 24) Except for the use, it was the same as the user of Example 5 A flexible laminated board was produced in the same manner as in Example 21 except for a three-layer structure of a bonding film (PIXEOO BP manufactured by Zhongyuan Chemical Industry Co., Ltd.). As a result, 10 to 50 / zm was not observed. The porosity is 0%, and the swelling of the copper foil surface due to solder heat resistance test is not observed. (Example 25) Except using Rmax 16 // m, Rz 11 // m, Ra 2.2 // m Except for the copper box, the rest was produced under the same processing conditions as in Example 19. As a result, although a flexible laminate having no wrinkles and plate bends in appearance was obtained, the micro-void ratio was 20% or more. Swelling of copper foil surface caused by solder heat resistance test. 41 This paper size applies to China National Standard (cns) a4 (210 χ 297 public love) ------- Order --------- (Please read the precautions on the back before filling this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 B7 V. Description of the Invention (?) (Examples 26 ~ 3 1) Prepare a non-thermoplastic polyimide film with glass transition temperature of 190 ° C on both sides A thermoplastic film with a thickness of 25 // m and a three-layer structure (three layers of adhesive film made by Zhongyuan Chemical Industry Co., Ltd.) made of thermoplastic polyfluorene imide resin, and rolled copper with a thickness of 18 / zm on both sides Polyimide films (Apicar 125AH manufactured by Zhongyuan Chemical Industry Co., Ltd.) were placed on both sides of the rolled copper foil as protective films, and the same heating and pressure forming apparatus as in Example 1 was used. A soft laminated board was produced under the conditions of a temperature of 300 ° C, a linear pressure of 490 N / cm, and a processing speed of 2 m / min. The tension and dimensional change rate of the film and the copper foil at this time are shown in Table 3. The dimensional change rate refers to the dimensional change rate of the obtained heat-resistant flexible laminated board. The copper foil was removed from the laminated board and heated at 150 ° C for 30 minutes, and then returned to room temperature. Can produce heat-resistant soft laminated board with dimensional change within absolute 値 0.10%. The dimensional change rate is measured in accordance with JIS C6471 (6.11 dimensional stability). [Table 3] Thermoplastic polyimide film tension N / mm2 Copper foil tension N / mm2 Dimensional change rate (%) MD TD Example 26 0.5 10 -0.037 +0.034 Example 27 1.0 10 -0.058 +0.052 Example 28 1.0 25 -0.043 +0.039 Example 29 3.0 25 -0.087 +0.084 Example 3〇1 1.0 1.0 -0.152 +0.146 Example 31] 5.0 25 -0.308 +0.291 42 This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 public love) 0 ------ -Order --------- line 丨 (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1223577 A7 B7 V. Description of the invention (M) (Example 32) In the state shown in FIG. 1 (a), as the adhesive film 2, a non-thermoplastic polyimide film having a glass transition on both sides is used. A thermosetting polyimide resin component with a thickness of 25 / ^ m and a three-layer structure adhesive film (PIXEO 0 BP manufactured by Zhongyuan Chemical Industry Co., Ltd.) composed of a thermoplastic polyimide resin component at a temperature of 190 ° C, is heated and press-molded 1 And rolled copper foil with a thickness of 18 / zm, strips at a temperature of 300 ° C, a linear pressure of 49 ° N / cm, and a processing speed of 2m / min Pieces are laminated. As a result, a sample having no wrinkles and uneven adhesion was obtained. The detailed conditions are shown in Table 4. In this specification, the roundness of a metal roller is measured in accordance with JIS B0607, the degree of cylindricality is in accordance with jis B0608, the surface roughness is determined in accordance with JIS B0601, and the Shore hardness is measured in accordance with jis Z2246. The detailed conditions are shown in Table 4. (Example 33) A lamination process was carried out in the same manner as in Example 32 except that a heating and pressure forming apparatus with a roller diameter of 150 mm was used, and the conditions shown in Table 4 were used. As a result, although lamination was possible, wrinkles not seen in Example 32 appeared at several places on the surface of the sample of this example. In addition, it can be said to be a good sample. (Example 34) Except the conditions shown in Table 4 were used except that a roundness of 0.07 mm, a circularity of 0.08 mm, and a surface roughness of 0.01 mm were used as the metal rollers of the heating and press forming apparatus, and the conditions shown in Table 4 were used. As in Example 32, lamination was performed. As a result, due to the uneven pressure of the rollers, there were several places where the paper size was not applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) --------------- IIIII ^ --------- (Please read the precautions on the back before filling out this page) 1223577 A7 ______B7___ V. Description of the Invention (called) Next, it can be said to be a good sample. (Example 35) A lamination process was carried out in the same manner as in Example 32 except that a material having a temperature distribution accuracy of 300 ° C and a temperature of 13 ° C was used as the metal roller of the heating and press forming apparatus. As a result, although the central portion continued, the gap between the produced metal rollers appeared due to the temperature protrusion of the metal rollers. 'The end portion of the sample cannot be pressurized. Therefore, the end portion of the sample occurred in the example. In addition to the unseen parts that are not seen in 32, it can be said to be a good sample. (Example 36) Except that a hot roller having a surface hardness (Shore hardness) of Hs20 was used as the metal roller of the heating and press forming apparatus and the conditions shown in Table 4 were used, lamination processing was performed in the same manner as in Example 32. As a result, the surface of the roller was slightly damaged due to the influence of the height difference caused by the adhesion of metal scraps and the bending of the sample. On the other hand, the damaged portion became an unpressurized portion, and a part of the sample produced uneven bonding which was not seen in Example 32. In addition, it was a good sample. ^ 1 · -ϋ —ϋ ϋ II ϋ— i ^ i —ϋ ^^ 1 · 1 n I -Bn -m I ϋ «1 n an ·-, I Hi atmm MmKae I 1 Mmmem I -V- 口 矣 ( Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 44 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 1223577! A7 I ---; -21 V. Description of the invention (Table 4) Example 32 Example 33 Example 34 Example 35 Example 36 Roller structure metal-metal saint-metal metal-metal metal-metal metal-metal roller diameter (mm) 300 150 300 300 300 Roller roundness (mm) 0.002 0.001 0.07 0.002 0.002 Sub-cylindricity (mm) 0.002 0.001 0.08 0.002 0.002 Surface roughness (mm) 0.001 0.001 0.001 0.001 0.001 at ± 300 ° C 2 ± 2 ± 2 Soil 2 Cloth accuracy (.C) Shore hardness Hs70 Hs70 Hs70 Hs70 Hs20 The result is that there is no unevenness on the sample surface due to pressure unevenness at the end of the sample for 50 hours, followed by a part of the unevenness. After the part is not running, the good appearance of the roller is wrinkled. Unevenness followed by partial subsurface damage at several locations [Industrial applications] In recent years, with the weight reduction, miniaturization, and high density of electronic products, the demand for printed substrates has also increased, especially for insulation. The demand for flexible printed circuit boards obtained by forming copper foil circuits on flexible films has also increased. According to the present invention, even if a rolled copper foil that is prone to buckling is used in the lamination process, a laminated plate having excellent appearance and heat resistance without bending can be obtained. The flexible printed circuit board using the flexible laminated board of the present invention can be widely applied to electronic devices such as mobile phones and portable computers that are assembled with high-density assembly elements. Representative component symbol 丄 祖 2 followed by film 45 This paper is suitable for China National Standard (CNS) A4 specifications (if 297 public love) --- II ---- · I --.--- l · ^ · I-- --- II (Please read the precautions on the back before filling this page) 1 ^ 23577 A7 j _B7 i V. Description of the invention () 1 Protective film 4.4a Metal roller 6 Stacking plate 1 Rolling body 8.8a Peeling auxiliary roller (Guiding mechanism) 10J0a / 10b Heating and pressure forming device m Double-belt honing machine 22 Endless steel belt 21 Rotating roller 24 Guide mechanism 26 Heating guide (pulling mechanism) 21 Rotating roller 28 Cooling guide 33.34 Rolled body a L a 2 Peeling angle of the upper and lower protective materials (please read the precautions on the back before filling in this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)